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CN111114032A - 一种新型泡沫板材表面封孔结构及其封孔方法 - Google Patents

一种新型泡沫板材表面封孔结构及其封孔方法 Download PDF

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CN111114032A
CN111114032A CN202010195048.8A CN202010195048A CN111114032A CN 111114032 A CN111114032 A CN 111114032A CN 202010195048 A CN202010195048 A CN 202010195048A CN 111114032 A CN111114032 A CN 111114032A
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黄华亮
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Abstract

本发明公开了一种新型泡沫板材表面封孔结构及其封孔方法，本发明以喷涂低熔点喷涂层粘附在高熔点的泡沫板材表面，通过容易分离撕开的分离薄膜层贴合于低熔点喷涂层外侧，使得加热板与低熔点喷涂层进行了隔离加热，通过加热板使低熔点喷涂层融化，并在压力下使得低熔点喷涂层液体进入黏接于泡沫板材的孔隙内，从而达到泡沫表面封孔的效果，由于低熔点喷涂层和高熔点的泡沫板材的材料相似如此可以实现较好的封孔效果，同时低熔点喷涂层的加热温度没有高熔点的泡沫板材的高，所以本发明降低了能耗，有利用大规模的生产，提高了作业效率，降低泡沫板材表面封孔的质量风险，改善工人劳动环境。

Description

一种新型泡沫板材表面封孔结构及其封孔方法
技术领域
本发明涉及一种新型泡沫板材表面封孔结构及其封孔方法。
背景技术
目前，泡沫板材表面封孔的方式，是采用高温加热板直接贴合于泡沫板材的两侧面上，在短时间内使泡沫板材表面一层融化，然后换一冷平板对泡沫板材的两侧面施加一定的压力，使泡沫板材表面的泡沫孔洞收缩或合并，从而达到表面封孔的效果，但是，上述方法容易导致泡沫板材黏附在高温热板，而且需要达到一定的高温加热，如此使得生产能耗成本较高，而且该方法表面封孔稳定性较差、质量风险较大等缺点。
发明内容
针对上述现有技术的不足之处，本发明解决的问题为：提供一种分离效果好、能耗成本低、泡沫板材表面封孔的稳定性好、质量可靠的新型泡沫板材表面封孔结构及其封孔方法。
为解决上述问题，本发明采取的技术方案如下：
一种新型泡沫板材表面封孔结构，包括泡沫板材、低熔点喷涂层、分离薄膜层、加热板；所述泡沫板材的两侧分别贴合连接低熔点喷涂层；所述低熔点喷涂层的外侧分别贴合连接分离薄膜层；所述分离薄膜层的外侧分别贴合连接加热板。
进一步，所述泡沫板材为半硬质泡沫板体或者硬质泡沫板材；所述半硬质泡沫板体和硬质泡沫板材为PET或者PVC材料。
进一步，所述低熔点喷涂层包括半硬质泡沫薄膜或者硬质泡沫薄膜；所述半硬质泡沫薄膜和硬质泡沫薄膜为PET或者PVC材料。
进一步，所述泡沫板材为高分子量的泡沫材体；所述低熔点喷涂层为低分子量的泡沫薄膜层。
进一步，所述低熔点喷涂层的熔点低于泡沫板材的熔点。
进一步，所述分离薄膜层为聚四氟乙烯薄膜。
进一步，所述分离薄膜层熔点高于低熔点喷涂层的熔点。
一种新型泡沫板材表面封孔方法，步骤如下：
S1、喷涂：在泡沫板材的两侧表面喷涂糊状的低熔点喷涂层；
S2、贴膜：在低熔点喷涂层的外侧分别贴合粘接一个分离薄膜层，挤压分离薄膜层，使得分离薄膜层和低熔点喷涂层之间没有空气间隙；
S3、加热封孔：在分离薄膜层的外侧分别通过电加热板进行热压贴合，使得低熔点喷涂层软化成流动液体或液滴流入泡沫板材的表面孔洞或吸附在表面孔洞内，低熔点喷涂层进入表面孔洞，与泡沫板材表面孔洞黏合在一起，从而达到表面封孔，然后撕下分离薄膜层，完成。
进一步，所述步骤S1中喷涂糊状的低熔点喷涂层的厚度为100至300微米。
进一步，所述步骤S3中热压时间为5至10秒。
本发明的有益效果
本发明改变了传统的泡沫板材的封孔结构和方法，本发明以喷涂低熔点喷涂层粘附在高熔点的泡沫板材表面，通过容易分离撕开的分离薄膜层贴合于低熔点喷涂层外侧，使得加热板与低熔点喷涂层进行了隔离加热，通过加热板使低熔点喷涂层融化，并在压力下使得低熔点喷涂层液体进入黏接于泡沫板材的孔隙内，从而达到泡沫表面封孔的效果，由于低熔点喷涂层和高熔点的泡沫板材的材料相似如此可以实现较好的封孔效果，同时低熔点喷涂层的加热温度没有高熔点的泡沫板材的高，所以本发明降低了能耗，有利用大规模的生产，提高了作业效率，降低泡沫板材表面封孔的质量风险，改善工人劳动环境。
附图说明
图1为本发明的拆分结构示意图。
图2为本发明贴合结构示意图。
具体实施方式
下面结合附图对本发明内容作进一步详细说明。
如图1和2所示，一种新型泡沫板材表面封孔结构，包括泡沫板材1、低熔点喷涂层2、分离薄膜层3、加热板4；所述泡沫板材1的两侧分别贴合连接低熔点喷涂层2；所述低熔点喷涂层2的外侧分别贴合连接分离薄膜层3；所述分离薄膜层3的外侧分别贴合连接加热板4。进一步优选，所述泡沫板材1为半硬质泡沫板体或者硬质泡沫板材；所述半硬质泡沫板体和硬质泡沫板材为PET或者PVC材料。进一步优选，所述低熔点喷涂层2包括半硬质泡沫薄膜或者硬质泡沫薄膜；所述半硬质泡沫薄膜和硬质泡沫薄膜为PET或者PVC材料。进一步，所述泡沫板材1为高分子量的泡沫材体；所述低熔点喷涂层2为低分子量的泡沫薄膜层，分子量越大熔点越高，当然低熔点喷涂层2也可以选择其他相似的材料，比如申请号为2009102115422，名称为一种低熔点共聚酯及其合成方法这篇专利中制备的共聚酯。进一步，所述低熔点喷涂层的熔点低于泡沫板材的熔点。进一步，所述分离薄膜层为聚四氟乙烯薄膜。进一步，所述分离薄膜层熔点高于低熔点喷涂层的熔点。一般泡沫板材1的熔点为240℃左右，如此可选取低熔点喷涂层2熔点为190℃左右，而分离薄膜层3可选择熔点为300℃以上的聚四氟乙烯薄膜，如此使得本发明的加热板只要进行200℃左右的温度就可以将低熔点喷涂层2进行瞬间熔化，作业高效。
一种新型泡沫板材表面封孔方法，步骤如下：
S1、喷涂：在泡沫板材1的两侧表面喷涂糊状的低熔点喷涂层2；低熔点喷涂层2的厚度为100至300微米。
S2、贴膜：在低熔点喷涂层2的外侧分别贴合粘接一个分离薄膜层3，挤压分离薄膜层3，使得分离薄膜层3和低熔点喷涂层2之间没有空气间隙。
S3、加热封孔：在分离薄膜层3的外侧分别通过电加热板4进行热压贴合，使得低熔点喷涂层2软化成流动液体或液滴流入泡沫板材1的表面孔洞或吸附在表面孔洞内，低熔点喷涂层进入表面孔洞，与泡沫板材表面孔洞黏合在一起，从而达到表面封孔，然后撕下分离薄膜层，完成。热压时间为5至10秒。
本发明改变了传统的泡沫板材1的封孔结构和方法，本发明以喷涂低熔点喷涂层2粘附在高熔点的泡沫板材1表面，通过容易分离撕开的分离薄膜层3贴合于低熔点喷涂层2外侧，使得加热板4与低熔点喷涂层2进行了隔离加热，通过加热板4使低熔点喷涂层融化，并在压力下使得低熔点喷涂层2液体进入黏接于泡沫板材1的孔隙内，从而达到泡沫表面封孔的效果，由于低熔点喷涂层2和高熔点的泡沫板材1的材料相似如此可以实现较好的封孔效果，同时低熔点喷涂层2的加热温度没有高熔点的泡沫板材的高，所以本发明降低了能耗，有利用大规模的生产，提高了作业效率，降低泡沫板材表面封孔的质量风险，改善工人劳动环境。
以上所述仅为本发明的较佳实施例而已，并不用以限制本发明，凡在本发明的精神和原则之内，所作的任何修改、等同替换、改进等，均应包含在本发明的保护范围之内。

Claims (10)

1.一种新型泡沫板材表面封孔结构，其特征在于，包括泡沫板材、低熔点喷涂层、分离薄膜层、加热板；所述泡沫板材的两侧分别贴合连接低熔点喷涂层；所述低熔点喷涂层的外侧分别贴合连接分离薄膜层；所述分离薄膜层的外侧分别贴合连接加热板。
2.根据权利要求1所述的新型泡沫板材表面封孔结构，其特征在于，所述泡沫板材为半硬质泡沫板体或者硬质泡沫板材；所述半硬质泡沫板体和硬质泡沫板材为PET或者PVC材料。
3.根据权利要求1所述的新型泡沫板材表面封孔结构，其特征在于，所述低熔点喷涂层包括半硬质泡沫薄膜或者硬质泡沫薄膜；所述半硬质泡沫薄膜和硬质泡沫薄膜为PET或者PVC材料。
4.根据权利要求1所述的新型泡沫板材表面封孔结构，其特征在于，所述泡沫板材为高分子量的泡沫材体；所述低熔点喷涂层为低分子量的泡沫薄膜层。
5.根据权利要求1所述的新型泡沫板材表面封孔结构，其特征在于，所述低熔点喷涂层的熔点低于泡沫板材的熔点。
6.根据权利要求1所述的新型泡沫板材表面封孔结构，其特征在于，所述分离薄膜层为聚四氟乙烯薄膜。
7.根据权利要求1所述的新型泡沫板材表面封孔结构，其特征在于，所述分离薄膜层熔点高于低熔点喷涂层的熔点。
8.一种新型泡沫板材表面封孔方法，其特征在于，步骤如下：
S1、喷涂：在泡沫板材的两侧表面喷涂糊状的低熔点喷涂层；
S2、贴膜：在低熔点喷涂层的外侧分别贴合粘接一个分离薄膜层，挤压分离薄膜层，使得分离薄膜层和低熔点喷涂层之间没有空气间隙；
S3、加热封孔：在分离薄膜层的外侧分别通过电加热板进行热压贴合，使得低熔点喷涂层软化成流动液体或液滴流入泡沫板材的表面孔洞或吸附在表面孔洞内，低熔点喷涂层进入表面孔洞，与泡沫板材表面孔洞黏合在一起，从而达到表面封孔，然后撕下分离薄膜层，完成。
9.根据权利要求8所述的新型泡沫板材表面封孔方法，其特征在于，所述步骤S1中喷涂糊状的低熔点喷涂层的厚度为100至300微米。
10.根据权利要求8所述的新型泡沫板材表面封孔方法，其特征在于，所述步骤S3中热压时间为5至10秒。
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