CN110859021A - Circuit board assembly and semi-finished product of circuit board assembly, manufacturing method thereof, floodlight with circuit board assembly and application thereof - Google Patents
Circuit board assembly and semi-finished product of circuit board assembly, manufacturing method thereof, floodlight with circuit board assembly and application thereof Download PDFInfo
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- CN110859021A CN110859021A CN201810972689.2A CN201810972689A CN110859021A CN 110859021 A CN110859021 A CN 110859021A CN 201810972689 A CN201810972689 A CN 201810972689A CN 110859021 A CN110859021 A CN 110859021A
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- circuit board
- conductive portion
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- board assembly
- insulating
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-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0264—Details of the structure or mounting of specific components for a camera module assembly
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0277—Details of the structure or mounting of specific components for a printed circuit board assembly
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- Engineering & Computer Science (AREA)
- Signal Processing (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Studio Devices (AREA)
Abstract
The invention provides a circuit board assembly, a circuit board assembly semi-finished product, a manufacturing method of the circuit board assembly semi-finished product, a floodlight with the circuit board assembly and an application of the floodlight, and provides the circuit board assembly, a TOF camera module with the circuit board assembly and the application of the TOF camera module.
Description
Technical Field
The invention relates to the field of circuit boards, in particular to a circuit board assembly, a circuit board assembly semi-finished product, a manufacturing method of the circuit board assembly semi-finished product, a floodlight with the circuit board assembly and application of the floodlight.
Background
The circuit board is an important component in electronic equipment, and can support electronic components and communicate electrical signals. The circuit board is various in types, and most commonly, the printed circuit board mainly comprises two parts, namely an insulation part and a conduction part. When an electronic component supported by a printed circuit board starts after power is applied, the electronic component can generate heat due to its own power consumption, especially in the optical field. Once the heat generated by the electronic components cannot be dissipated, the temperature of the electronic components rises, which is not favorable for the normal operation of the electronic components.
The printed circuit board material widely used at present is a copper-clad/epoxy glass cloth substrate or a phenolic resin glass cloth substrate, the substrates have excellent electrical performance and processability, but the heat dissipation performance is poor, and for electronic components, along with the miniaturization of the current electronic equipment, the electronic devices are designed to be smaller and smaller, so that the heat dissipation through the smaller surfaces of the electronic components is far from insufficient.
Further, in the process of mounting electronic components on the surface of the printed circuit board, it is generally necessary to fixedly connect other electronic components through the bonding pad, and this operation is completed at a high temperature, and the thermal expansion coefficients of the insulating portion and the conducting portion of the printed circuit board are different, and the size of the bonding pad itself is small, which may make alignment between the electronic components and the printed circuit board difficult, especially for the electronic components with high accuracy requirement, such as an optoelectronic module.
The ceramic substrate is a circuit board with excellent performance, and the electrical insulation performance, the heat conduction performance and the mechanical strength of the ceramic substrate are all excellent, but the ceramic substrate is difficult to be applied to various electronic equipment in a large scale at present. Because the basic manufacturing process of the ceramic is complex, the productivity is low and the price is high.
The heat dissipation problem of electronic components is partially alleviated by adding heat dissipation blocks on the printed circuit board, but the heat dissipation problem is contrary to the current trend of miniaturization and light weight of electronic equipment.
Disclosure of Invention
The invention aims to provide a circuit board assembly, a circuit board assembly semi-finished product, a manufacturing method of the circuit board assembly semi-finished product, a floodlight with the circuit board assembly and application of the floodlight, wherein the circuit board has better heat dissipation performance.
Another object of the present invention is to provide a circuit board assembly and a semi-finished product of a circuit board assembly, a method for manufacturing the same, a floodlight with the circuit board assembly and applications thereof, wherein the circuit board is manufactured at a low cost.
Another object of the present invention is to provide a circuit board assembly and a semi-finished product of the circuit board assembly, a method for manufacturing the same, a floodlight with the circuit board assembly and an application thereof, wherein the circuit board is manufactured in a simple manner and is convenient for large-scale application.
Another object of the present invention is to provide a circuit board assembly and a semi-finished product of a circuit board assembly, a method for manufacturing the same, a floodlight with the circuit board assembly and an application thereof, wherein the circuit board comprises an insulating portion and at least one conductive portion, wherein the conductive portion provides a larger area for an electronic component to dissipate heat.
Another object of the present invention is to provide a circuit board assembly and a semi-finished product of a circuit board assembly, a method for manufacturing the same, a floodlight with the circuit board assembly and an application thereof, wherein the conductive part has a larger upper surface to facilitate accurate mounting of the electronic component on the conductive part.
Another object of the invention is to provide a circuit board assembly and a semi-finished product of a circuit board assembly, a method for manufacturing the same, a floodlight with the circuit board assembly and an application thereof, wherein the circuit board has a better conductive property.
Another object of the present invention is to provide a circuit board assembly and a semi-finished product of a circuit board assembly, a method for manufacturing the same, a floodlight with the circuit board assembly and an application thereof, wherein the insulating portion of the circuit board is integrally formed with the conductive portion.
Another object of the invention is to provide a circuit board assembly and a semi-finished product of a circuit board assembly, a method for manufacturing the same, a floodlight with the circuit board assembly and applications thereof, wherein the circuit board has high mechanical strength.
Another object of the present invention is to provide a circuit board assembly and a semi-finished product of the circuit board assembly, a method for manufacturing the same, a floodlight with the circuit board assembly and applications thereof, wherein the circuit board is capable of having a good heat dissipation performance while maintaining a small size.
Another object of the present invention is to provide a circuit board assembly and a semi-finished product of a circuit board assembly, a method of manufacturing the same, and a floodlight with the circuit board assembly and applications thereof, wherein the circuit board can be mass-produced by the manufacturing method, thereby reducing the production cost.
Another object of the present invention is to provide a circuit board assembly and a semi-finished product of a circuit board assembly, a method for manufacturing the same, a floodlight with the circuit board assembly and an application thereof, wherein at least a part of the insulating portion can be integrally formed around the conductive portion to prevent short circuit.
Another object of the present invention is to provide a circuit board assembly and a semi-finished product of the circuit board assembly, a method for manufacturing the same, a floodlight with the circuit board assembly, and applications thereof, wherein the TOF camera module with the circuit board assembly can have a better heat dissipation performance while maintaining a smaller size.
Another object of the present invention is to provide a circuit board assembly and a semi-finished product of the circuit board assembly, a manufacturing method thereof, a floodlight with the circuit board assembly and an application thereof, wherein the TOF camera module with the circuit board comprises a base, and the base can be integrally formed on the circuit board.
According to one aspect of the present invention, there is provided a circuit board assembly for supporting an electronic component, comprising:
a conductive portion; and
an insulating portion, wherein the insulating portion is integrally bonded to the conductive portion, wherein the conductive portion comprises a first conductive portion and a second conductive portion, wherein the electronic component is supported by the first conductive portion, the first conductive portion penetrates through the insulating portion, and the first conductive portion and the second conductive portion are separated by at least a portion of the insulating portion, wherein the first conductive portion has an upper surface, wherein the second conductive portion has an upper surface, and wherein the upper surface of the first conductive portion is larger than the upper surface of the second conductive portion.
According to some embodiments of the invention, the first conductive part has a side face, wherein the side face is arranged to be inclined.
According to some embodiments of the invention, the side faces are arranged to be inclined inwardly.
According to some embodiments of the invention, the side is provided step-like.
According to some embodiments of the invention, the first conductive portion has an upper surface and a lower surface, wherein the upper surface and the lower surface are oppositely disposed, wherein the upper surface is larger than the lower surface.
According to some embodiments of the present invention, the circuit board assembly further comprises a connector, wherein the connector has two ends, one end of the connector is connected to the conductive portion, the other end of the connector is exposed, and the insulating portion is integrally formed with the connector.
According to some embodiments of the invention, the conductive portion has a side surface, and at least a part of the insulating portion is integrally bonded to the side surface of the conductive portion.
According to some embodiments of the invention, the side faces of the conductive part are all covered by the insulating part.
According to some embodiments of the invention, the circuit board assembly further comprises a bracket, wherein the bracket forms an optical window, and the bracket is connected to the circuit board, wherein the optical window provides an optical path for the electronic component.
According to some embodiments of the invention, the bracket is connected to the circuit board by a connection medium.
According to some embodiments of the invention, the bracket is integrally bonded to the conductive portion; or the bracket is integrally combined with the insulating part; or the holder is integrally bonded to the conductive portion and the insulating portion.
According to some embodiments of the present invention, the conductive portion comprises a third conductive portion and a fourth conductive portion, wherein the insulating portion is integrally formed on the third conductive portion and the fourth conductive portion, and the first conductive portion, the second conductive portion, the third conductive portion and the fourth conductive portion are separated by the insulating portion respectively.
According to another aspect of the present invention, there is provided a circuit board assembly semi-finished product comprising:
a plurality of conductive portions and a plurality of insulating portions, wherein the conductive portions include a first conductive portion and a second conductive portion, wherein the insulating portions are integrally formed with the first and second conductive portions and the first and second conductive portions are separated by at least a portion of the insulating portions, wherein adjacent conductive portions are connected to each other.
According to some embodiments of the invention, the first conductive portion of one of the conductive portions is connected to the first conductive portion of an adjacent conductive portion.
According to some embodiments of the invention, the second conductive portion of one conductive portion is connected to the second conductive portion of an adjacent conductive portion.
According to some embodiments of the invention, the second conductive portion of one conductive portion is connected to the second conductive portion of an adjacent conductive portion.
According to some embodiments of the invention, the first conductive portion of one conductive portion is connected to the second conductive portion of an adjacent conductive portion.
According to some embodiments of the invention, the first conductive portion has an upper surface, wherein the second conductive portion has an upper surface, wherein the upper surface of the first conductive portion is larger than the upper surface of the second conductive portion.
According to some embodiments of the invention, the first conductive portion has an upper surface and a lower surface, wherein the upper surface and the lower surface are oppositely disposed, wherein the upper surface of the first conductive portion is larger than the lower surface of the first conductive portion.
According to some embodiments of the invention, the first conductive part has a side face, wherein the side face is arranged to be inclined.
According to some embodiments of the invention, the first conductive part has a side face, wherein the side face is provided step-like.
According to some embodiments of the invention, the conductive portion comprises a third conductive portion, wherein at least a portion of the insulating portion separates the first conductive portion and the third conductive portion, and at least a portion of the insulating portion separates the second conductive portion and the third conductive portion.
According to some embodiments of the invention, the circuit board assembly further comprises a plurality of brackets surrounding the light window, wherein the brackets are integrally formed with the conductive portion; or the bracket is integrally formed on the insulating part.
According to another aspect of the present invention, there is provided a circuit board, which is obtained by dividing a circuit board assembly semi-finished product as described above.
According to another aspect of the present invention, there is provided a luminaire comprising:
a light emitting element;
a circuit board assembly, wherein the circuit board assembly is formed by dividing according to the circuit board assembly semi-finished product; and
a support, wherein the support forms an optical window, the light emitting element is supported on a first conductive portion of the circuit board assembly, and the support is connected to the circuit board assembly.
According to some embodiments of the invention, the bracket is integrally formed with the circuit board assembly.
According to some embodiments of the invention, the bracket is bonded to the circuit board assembly.
According to another aspect of the present invention, there is provided a TOF camera module comprising:
the floodlight is used for emitting light to a shot object; and
and the receiving unit is used for receiving a reflected light ray reflected by the shot object and obtaining the depth information of the shot object based on the information of the transmitted light ray and the reflected light ray.
According to another aspect of the present invention, there is provided a TOF camera module, comprising:
a floodlight according to the above; and
a receiving unit with a flexible circuit board, wherein the receiving unit comprises a lens assembly, a light sensing element, a circuit board and a flexible circuit board, wherein the lens assembly provides an optical through hole to allow light to reach the light sensing element for photoelectric conversion, wherein the light sensing element is conductively connected to the circuit board, wherein the circuit board is conductively connected to the flexible circuit board, and wherein the floodlight is conductively connected to the flexible circuit board.
According to another aspect of the present invention, there is provided a luminaire comprising:
a light emitting element;
a circuit board assembly, wherein the circuit board assembly is divided by a circuit board assembly semi-finished product according to any one of claims 13 to 22;
a support, wherein the support forms an optical window, the light emitting element is supported on a first conductive portion of the circuit board assembly, and the support is connected to the circuit board assembly; and
a flexible wiring board, wherein the flexible wiring board is conductively connected to the conductive portion of the circuit board assembly.
According to another aspect of the present invention, there is provided a TOF camera module, comprising:
a floodlight according to the above; and
a receiving unit, wherein the receiving unit comprises a lens component, a photosensitive element and a circuit board, wherein the lens component provides an optical path for light to reach the photosensitive element for photoelectric conversion, the photosensitive element is conductively connected to the circuit board, and the flexible circuit board of the floodlight is conductively connected to the circuit board of the receiving unit.
According to another aspect of the present invention, there is provided an electronic device, comprising:
a floodlight according to the above;
an electronic device body; and
a main circuit board, wherein the main circuit board is disposed on the electronic device body, wherein when the floodlight is mounted on the main circuit board, the flexible circuit board of the floodlight is conductively connected to the main circuit board.
According to some embodiments of the invention, the electronic device comprises a camera module, a receiving unit and an assembly body, wherein the camera module is assembled into a whole by the assembly body, and the floodlight and the camera module are jointly mounted on the electronic device body.
According to another aspect of the present invention, there is provided a TOF camera module, comprising:
the floodlight is used for emitting light to a shot object; and
and the receiving unit is used for receiving a reflected light ray reflected by the shot object and obtaining the depth information of the shot object based on the information of the transmitted light ray and the reflected light ray, wherein the floodlight comprises a TOF light-emitting element and a circuit board component formed by dividing a circuit board component semi-finished product according to the above, and the TOF light-emitting element is supported on the conducting part of the circuit board component.
According to another aspect of the present invention, there is provided an electronic device, comprising:
the TOF camera module is arranged on the electronic equipment body.
According to some embodiments of the invention, the electronic device comprises a camera module, a receiving unit and an assembly body, wherein the camera module is assembled into a whole by the assembly body, and the floodlight and the camera module are jointly mounted on the electronic device body.
According to another aspect of the present invention, there is provided a method of manufacturing a circuit board assembly for supporting at least one electronic component, comprising the steps of:
(a) placing at least one conductive part into a forming mold;
(b) performing film combination on the molding module to form a molding space between an upper mold and a lower mold of the molding module and the conductive part;
(c) adding a fluid material having insulating properties to the molding space such that the fluid material fills the molding space and solidifies within the molding space; and
(d) and after a die drawing process is carried out on the forming die, an insulating part which is integrally combined with the conductive part is formed on the conductive part to obtain the circuit board assembly.
According to an embodiment of the present invention, in the above method, the conductive portion includes a first conductive portion and a second conductive portion, wherein the insulating portion is formed between the first conductive portion and the second conductive portion to separate the first conductive portion and the second conductive portion.
According to an embodiment of the present invention, in the above method, the insulating portion and a bracket integrally bonded to the conductive portion are formed at the conductive portion.
According to an embodiment of the present invention, the bracket is integrally combined with the conductive portion; or the bracket is integrally combined with the insulating part positioned on one side surface of the conductive part; or the holder is integrally bonded to the conductive portion and the insulating portion.
According to an embodiment of the present invention, in the method, the method further includes the following steps:
drawing the forming die to form a circuit board assembly semi-finished product, wherein the circuit board assembly semi-finished product comprises a plurality of conductive parts and the insulating parts which are integrally combined with the conductive parts; and
and cutting the circuit board assembly semi-finished product to obtain the circuit board assembly.
According to an embodiment of the present invention, in the above method, at least a part of the insulating portion integrally bonded to one side surface of the conductive portion is formed in the conductive portion.
According to an embodiment of the present invention, in the method, at least a part of the insulating portion is integrally bonded to an upper surface of the conductive portion; or at least a part of the insulating portion is formed on the conductive portion and integrally bonded to a lower surface of the conductive portion.
According to an embodiment of the present invention, in the above method, at least a part of the insulating portion is integrally bonded to a lower surface of the conductive portion, the method further includes a step of: reducing the thickness of the insulating portion until the lower surface of the conductive portion is exposed.
According to an embodiment of the present invention, in the method, each of the conductive portions is independent from each other.
According to an embodiment of the present invention, in the method, one of the conductive portions is connected to an adjacent one of the conductive portions.
According to another aspect of the present invention, there is provided a method of dissipating heat from a circuit board assembly, comprising the steps of:
guiding heat generated by an electronic element to be transferred from a back surface of the electronic element to an upper surface of a first conductive part;
thermally conducting heat to a lower surface of the first conductive portion; and
dissipating heat outwards.
According to an embodiment of the present invention, in the above method, the electronic element is a light emitting element.
According to an embodiment of the present invention, in the above method, a front surface of the electronic component is conductively connected to a second conductive portion.
Drawings
Fig. 1A is a schematic diagram of a circuit board assembly according to a preferred embodiment of the present invention.
FIG. 1B is a schematic diagram of a TOF camera module with the circuit board assembly according to a preferred embodiment of the present invention.
Fig. 1C is a schematic diagram of an electronic device according to a preferred embodiment of the invention.
Fig. 2A is a schematic manufacturing flow chart of a circuit board assembly according to a preferred embodiment of the invention.
Fig. 2B is a schematic flow chart illustrating a manufacturing process of a circuit board assembly according to a preferred embodiment of the invention.
Fig. 3 is a schematic diagram of a circuit board assembly semi-finished product according to a preferred embodiment of the invention.
Fig. 4 is a schematic diagram of a circuit board assembly according to a preferred embodiment of the present invention.
Fig. 5A is a schematic diagram of a circuit board assembly according to a preferred embodiment of the invention.
Fig. 5B is a schematic diagram of a circuit board assembly according to a preferred embodiment of the invention.
Fig. 5C is a schematic diagram of a circuit board assembly according to a preferred embodiment of the invention.
Fig. 5D is a schematic diagram of a circuit board assembly according to a preferred embodiment of the invention.
Fig. 6 is a schematic diagram of a circuit board assembly according to a preferred embodiment of the present invention.
FIG. 7 is a schematic diagram of a TOF camera module with the circuit board assembly according to a preferred embodiment of the present invention.
Fig. 8A is a schematic flow chart illustrating a manufacturing process of a circuit board assembly according to a preferred embodiment of the invention.
Fig. 8B is a schematic flow chart illustrating a manufacturing process of a circuit board assembly according to a preferred embodiment of the invention.
FIG. 9 is a schematic diagram of a TOF camera module with the circuit board assembly according to a preferred embodiment of the present invention.
Fig. 10A is a schematic view of a floodlight according to a preferred embodiment of the invention.
Fig. 10B is a schematic view of a floodlight according to a preferred embodiment of the invention.
Detailed Description
The following description is presented to disclose the invention so as to enable any person skilled in the art to practice the invention. The preferred embodiments in the following description are given by way of example only, and other obvious variations will occur to those skilled in the art. The basic principles of the invention, as defined in the following description, may be applied to other embodiments, variations, modifications, equivalents, and other technical solutions without departing from the spirit and scope of the invention.
It will be understood by those skilled in the art that in the present disclosure, the terms "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in an orientation or positional relationship indicated in the drawings for ease of description and simplicity of description, and do not indicate or imply that the referenced devices or components must be in a particular orientation, constructed and operated in a particular orientation, and thus the above terms are not to be construed as limiting the present invention.
It is understood that the terms "a" and "an" should be interpreted as meaning that a number of one element or element is one in one embodiment, while a number of other elements is one in another embodiment, and the terms "a" and "an" should not be interpreted as limiting the number.
Referring to fig. 1A to 1C, a circuit board assembly 1 and a preferred embodiment of the application of the circuit board assembly 1 according to the present invention are shown.
The circuit board assembly 1 is used for supporting an electronic component and helping the electronic component to dissipate heat in an operating state so as to keep the electronic component in a good operating state.
Specifically, the circuit board assembly 1 includes a circuit board 10, the circuit board 10 includes a conductive portion 11 and an insulating portion 12, wherein the insulating portion 12 is integrally bonded to the conductive portion 11, and the conductive portion 11 extends from the insulating portion 12, for example, penetrates the insulating portion 12 along the height direction. That is, at least a portion of both ends of the conductive part 11 are exposed to allow both ends of the conductive part 11 to be electrically connected, respectively. The conductive part 11 can perform a conductive function on one hand and can help the electronic component to dissipate heat on the other hand.
The electronic component is supported by the conductive portion 11 and is communicably connected to the conductive portion 11. More specifically, the conductive portion 11 includes a first conductive portion 111 and a second conductive portion 112, wherein the first conductive portion 111 is used for supporting the electronic component, and the second conductive portion 112 and the first conductive portion 111 are separated by the insulating portion 12, so that the first conductive portion 111 and the second conductive portion 112 do not directly contact each other, thereby avoiding a short circuit during use.
The first conductive portion 111 has an upper surface, a lower surface, and a side surface, wherein the side surface extends to the peripheral position of the upper surface and the lower surface, and the upper surface and the lower surface are disposed opposite to each other. The electronic component is supported on the upper surface of the first conductive portion 111.
The second conductive part 112 has an upper surface and the lower surface, and a side surface extending along the periphery of the upper surface and the lower surface, and the upper surface and the lower surface are disposed opposite to each other.
The electronic component has an upper surface and a lower surface, wherein the lower surface of the electronic component is connected to the upper surface of the first conductive portion 111. Further, the pads on the upper surface of the electronic component are connected to the second conductive portion 112 by a gold wire bonding process, and the lower surface of the electronic component is directly connected to the upper surface of the first conductive portion 111. That is, the lower surface of the electronic component is implemented as an electrode, and the other electrode is provided on the upper surface and is electrically connected to the electronic component through a pad.
Further, the first conductive portion 111 is designed to be a larger area to facilitate heat dissipation of the electronic component. Preferably, the first conductive portion 111 is designed as a larger area, and the second conductive portion 112 is designed as a smaller area. Since the first conductive portion 111 has a heat dissipation function in addition to the conduction function, and the second conductive portion 112 mainly has a conduction function, in order to further ensure the miniaturization of the circuit board 10 and better heat dissipation performance, it is preferable that the overall size of the first conductive portion 111 is larger than that of the second conductive portion 112.
It should be noted that the insulating portion 12 is bonded to the conductive portion 11 through an integral molding process, so that the circuit board assembly 1 of the circuit board 10 is simpler in manufacturing process on one hand, and the insulating portion 12 and the conductive portion 11 have a certain bonding strength on the other hand. The conductive portions 11 are designed to have a size such that the circuit board assembly 1 of the circuit board 10 has good heat dissipation performance.
Further, the upper surface of the first conductive portion 111 is provided with a larger size to facilitate heat dissipation of the electronic component. The upper surface of the first conductive portion 111 is larger than the upper surface of the second conductive portion 112, which is advantageous for saving area. Preferably, the upper surface of the first conductive part 111 is designed to have a larger size while the lower surface of the first conductive part 111 is designed to have a smaller size, so that the side surface of the first conductive part 111 is disposed to be inclined to facilitate the bonding strength of the first conductive part 111 and the insulating part 12 of the surrounding part. Further, when the lower surface of the first conductive portion 111 is designed to be a small size, it can be effectively prevented that the lower surface is too large to affect normal conduction, such as causing a short circuit, when the circuit board 1 needs to be conducted. It is noted that the upper surface of the first conductive portion 111 should be designed according to the requirement, i.e. according to the electronic component size.
In other embodiments of the present invention, the upper surface of the first conductive portion 111 is smaller than the lower surface of the first conductive portion 111. In other embodiments of the present invention, the upper surface of the first conductive portion 111 is disposed equal to the lower surface of the first conductive portion 111.
The conductive part 11 may be a single metal or an alloy or even other conductive material with thermal conductivity, such as copper, nickel, aluminum or other material with excellent thermal and electrical conductivity. It is understood that the first conductive portion 111 and the second conductive portion 112 may be made of the same material or different materials.
The conductive part 11 has a certain shape, in this embodiment, the conductive part 11 is configured as a rectangular structure, and the upper surface of the first conductive part 111 and the upper surface of the second conductive part 112 are both rectangular. The shapes of the upper surface of the first conductive part 111 and the upper surface of the second conductive part 112 may be triangular, polygonal, or circular. The shape of the upper surface of the first conductive portion 111 may be similar to the shape of the upper surface of the second conductive portion 112, or may be different, such as one being circular or one being rectangular. It is understood that the above examples do not limit the first conductive portion 111 and the second conductive portion 112.
Further, in this example, the first conductive portion 111 has a boss structure in a three-dimensional space, and the second conductive portion 112 has a rectangular parallelepiped structure in the three-dimensional space. The first conductive portion 111 may be a rectangular parallelepiped, and the second conductive portion 112 may be a bump structure. Alternatively, the first conductive portion 111 and the second conductive portion 112 are both of a bump structure. Alternatively, the first conductive portion 111 and the second conductive portion 112 are both rectangular solids. It is understood that the above examples do not limit the first conductive portion 111 and the second conductive portion 112.
The conductive part 11 may be formed by a stamping process or a chemical etching process, and then the insulating part 12 is formed on the conductive part 11 by an integral molding process.
Further, the insulating part 12 includes an insulating body 121 and an insulating frame 122, wherein the insulating frame 122 is integrally formed on the insulating body 121, and the insulating frame 122 is located around the insulating body 121. The insulating body 121 is formed between the first conductive portion 111 and the first conductive portion 111 of the conductive portion 11. The insulating body 121 separates the first conductive part 111 and the second conductive part 112, so that the first conductive part 111 and the second conductive part 112 cannot be directly contacted, and the first conductive part 111 and the second conductive part 112 are prevented from being directly contacted and conducted to cause short circuit.
The conductive part 11 has an upper surface and a lower surface which are oppositely disposed, and a side surface which extends to the peripheral positions of the upper surface and the lower surface. The upper surface of the conductive portion 11 includes the upper surface of the first conductive portion 111 and the upper surface of the second conductive portion 112. The lower surface of the conductive portion 11 includes the lower surface of the first conductive portion 111 and the lower surface of the second conductive portion 112. The side surface of the conductive portion 11 includes a part of the side surface of the first conductive portion 111 and a part of the side surface of the second conductive portion 112.
The insulating frame 122 is formed on the side surface of the conductive part 11. In this example, the insulating frame 122 is completely integrated with the side surface of the conductive part 11, so as to protect the conductive part 11, and prevent the side surface of the conductive part 11 from being exposed, thereby causing an abnormality such as a short circuit.
Referring to fig. 1B, a preferred embodiment of a TOF camera module 100 is shown, which is an application of the circuit board assembly 1 according to the present invention.
TOF, which refers to Time of Flight, measures the three-dimensional structure or three-dimensional profile of an object to be measured or a region to be measured by measuring the Time interval t between transmission and reception of an emitted pulse signal or the phase generated by laser light traveling back and forth once to the object to be measured (phase difference ranging method). The device manufactured by using the TOF principle can obtain a gray image and a distance image and is widely applied to a plurality of fields of somatosensory control, behavior analysis, monitoring, automatic driving, artificial intelligence and the like.
The TOF camera module 100 includes a floodlight 110 and a receiving unit 120, wherein the floodlight 110 is configured to generate a light to a subject, the light is reflected by the subject, and the receiving unit 120 receives the reflected light and obtains depth information of the subject according to information of the transmitted light and the reflected light.
The receiving unit 120 includes a lens assembly 1201 and a photosensitive circuit 1202, wherein the lens assembly 1201 is used for receiving light, and the photosensitive circuit 1202 receives light and converts an optical signal into an electrical signal based on the photoelectric conversion principle. The lens assembly 1201 further includes an optical lens 1201 and a base 1202, and the photosensitive circuit 1202 includes a photosensitive element 12021 and a circuit board 12022, wherein the optical lens 1201 and the floodlight 110 are respectively supported by the base 1202, the photosensitive element 12021 is conductively connected to the circuit board 12022, and in this example, the base 1202 is integrally formed on the circuit board 12022. The floodlight 110 is conductively connected to the base 1202.
In the present embodiment, the electronic component is implemented as a light emitting component 2, and the floodlight 110 includes the light emitting component 2 and the circuit board assembly 1, wherein the light emitting component 2 is supported by the circuit board assembly 1 and communicably connected to the circuit board assembly 1. The light emitting element 2 can be activated to emit light outward when it is energized.
The light emitting element 2 has a front surface and a back surface, wherein the front surface of the light emitting element 2 is connected to the second conductive portion 112 of the conductive portion 11 through a conductive wire, and the back surface of the light emitting element 2 is directly supported by the conductive portion 11 and is connected to the conductive portion 11.
The circuit board assembly 1 includes the circuit board 10 and a bracket 20, wherein the bracket 20 is disposed on the circuit board assembly 1, for example, the bracket 20 is integrally formed on the circuit board assembly 1. The circuit board assembly 1 includes the conductive part 11 and the insulating part 12. The conductive portion 11 comprises the first conductive portion 111 and the second conductive portion 112, wherein the first conductive portion 111 and the second conductive portion 112 are separated by the insulating portion 12 to avoid direct contact between the first conductive portion 111 and the second conductive portion 112. It is understood that the bracket 20 may be attached to the circuit board 10 after the circuit board 10 is molded, for example, by being adhered to the circuit board 10 by a connecting medium glue.
The luminaire 110 further comprises an optical accessory 3, wherein the holder 20 supports the optical accessory 3 on the circuit board 10 and the optical accessory 3 is held in an optical path of the light-emitting element 2. The optical auxiliary element 3 is used to modify or improve the light emitted by the light-emitting element 2, for example, by refracting, diffracting or filtering the light emitted by the light-emitting element 2. The optical auxiliary element 3 may be a refractive lens or a diffractive lens. It will be appreciated by the person skilled in the art that the above examples do not limit the type of optical auxiliary element 3. The bracket 20 has an optical window 21, and the light emitting element 2 cooperates with the bracket 20 to form the optical window 21, so that light can be emitted outwards through the optical window 21.
Further, in some examples of the invention, the light emitting element 2 may be implemented as a Vertical Cavity Surface Emitter (VCSEL). Upon energization, the VCSEL can be excited to emit laser light.
It is worth mentioning that the vcsel needs to be maintained within a specific temperature range to be able to operate normally, that is, the heat dissipation performance of the circuit board assembly 1 is very important to the operating status of the vcsel. Since the first conductive part 111 of the circuit board assembly 1 provides a larger heat dissipation area, the vertical cavity surface emitter can work normally when supported by the first conductive part 111.
Further, a back surface of the vertical cavity surface emitter is a cathode, and a front surface of the vertical cavity surface emitter is an anode, when the vertical cavity surface emitter is respectively communicated with the first conductive part 111 and the second conductive part 112, the first conductive part 111 is a cathode, and the second conductive part 112 is an anode.
The luminaire 110 further comprises at least one electronic component 4, wherein the electronic component 4 is conductively connected to the circuit board assembly 1, in this example, at least a part of the electronic component 4 is disposed on the circuit board 12022 of the receiving unit 120 and is wrapped on the base 12021. The electronic component 4 is conductively connected to the circuit board assembly 1. In particular, the electronic component 4 is conductively connected to the circuit board assembly 1 of the luminaire 110 via the circuit board 12022 of the receiving unit 120.
Referring to fig. 1C, in a preferred embodiment of an electronic device 1000 according to the present invention, the electronic device 1000 includes the TOF camera module 100 and an electronic device body 200, wherein the TOF camera module 100 is disposed on the electronic device body 200 to obtain depth image information.
Referring to fig. 2A and 2B, a preferred embodiment of a method of manufacturing a circuit board assembly 1 according to the present invention is illustrated, wherein the circuit board assembly 1 is used for supporting an electronic component and helping the electronic component dissipate heat in an operating state to keep the electronic component in a good operating state.
At the stage shown in fig. 2A, at least one conductive part 11 is fixed into a molding die 300 to perform a molding process by the molding die.
Specifically, the molding die 300 includes an upper die 301 and a lower die 302, wherein at least one of the upper die 301 and the lower die 302 can be operated so that the molding die 300 can be subjected to a film-combining and drawing operation. For example, in an embodiment of the present invention, after the conductive part 11 is placed in the lower mold 302 and the upper mold 301 is subjected to a mold clamping operation, a molding space 303 is formed between the upper mold 301 and the lower mold 302. That is, the lower mold 302 and the upper mold 301 communicate with each other after the mold closing operation is performed. The upper mold 301, the lower mold 302, and the conductive part 11 define the molding space 303. A fluid material can fill the molding space 303 to form the insulating part 12 integrally bonded to the conductive part 11.
With continued reference to fig. 2A, the upper mold 301 further includes an upper molding portion 3011 and an upper pressing portion 3012, wherein the upper pressing portion 3012 is disposed at the periphery of the upper molding portion 3011, so that the upper pressing portion 3012 of the upper mold 301 can press an upper surface of the upper mold 301 after the mold clamping process is performed on the molding mold 300.
The upper molding portion 3011 has a lower surface, when the molding die 300 is subjected to a mold clamping process, a part of the lower surface of the upper molding portion 3011 is pressed against the conductive portion 11, and the lower surface of the upper molding portion 3011 and a corresponding upper surface of the lower die 302 form the molding space 303 for the fluid material to pass through.
In this example, the upper and lower surfaces of the circuit board 10 of the circuit board assembly 1 are both a plane, so the lower surface corresponding to the upper molding portion 3011 and the upper surface of the lower mold 302 are both a plane, and the entire molding mold 300 has a simple structure and low manufacturing difficulty and cost.
Further, the upper molding portion 3011 includes at least one conductive portion pressing portion 30111 and at least one insulation position molding portion 30112, where the conductive portion pressing portion 30111 further includes a first conductive portion pressing portion 301111 and a second conductive portion pressing portion 301112, where one insulation position molding portion 30112 is located between the first conductive portion pressing portions 301111 and between an adjacent first conductive portion pressing portion 301111, and one insulation position molding portion 30112 is located between the first conductive portion pressing portion 301111 and an adjacent second conductive portion pressing portion 301112.
According to some embodiments of the present invention, an insulation position molding part 30112 is located between the second conductive part pressing part 301112 and the adjacent second conductive part pressing part 301112.
The lower mold 302 includes a lower molding portion 3021 and a lower pressing portion 3022, and the lower pressing portion 3022 is disposed at a peripheral position of the lower molding portion 3021 so that the lower pressing portion 3022 of the lower mold 302 can be supported on the upper pressing portion 3012 of the upper mold 301 when the molding mold 300 is subjected to a mold clamping process.
The lower molding part 3021 includes at least one support part 30211 and at least one lower molding guide 30212, wherein the support part 30211 and the lower molding guide 30212 are disposed at intervals. The support portion 30211 corresponds to the lower surface of the conductive portion 11, the lower molding guide 30212 corresponds to the insulation position molding portion 30112, and the molding space 303 is formed between the lower molding guide 30212 and the insulation position molding portion 30112 to integrally bond the insulating portion 12 to the conductive portion 11 in a subsequent step.
Further, the supporting portion 30211 includes a first conductive portion supporting portion 302111 and a second conductive portion supporting portion 302112. Alternatively, when the number of the conductive portions 11 is plural, at least one of the lower shaped guides 30212 is located between the first conductive portion support 302111 and the adjacent second conductive portion support 302112, at least one of the lower shaped guides 30212 is located between the first conductive portion support 302111 and the adjacent first conductive portion support 302111, and at least one of the lower shaped guides 30212 is located between the second conductive portion support 302112 and the adjacent second conductive portion support 302112.
When the mold clamping operation is performed on the molding die 300, the distance between the conductive portion pressing section 30111 of the upper molding section 3011 of the upper die 301 and the supporting section 30211 of the lower molding section 3021 of the lower die 302 is set to just accommodate the conductive portion 11, so as to avoid the fluid material from contaminating the upper surface of the conductive portion 11.
In this example, the insulating portion 12 integrally formed with the conductive portion 11 may not only separate the first conductive portion 111 and the second conductive portion 112, but also cover the side surface of the conductive portion 11. In other embodiments of the present invention, the insulating portion 12 integrally formed on the conductive portion 11 separates the first conductive portion 111 and the second conductive portion 112, and covers part of the side surface of the conductive portion 11. In another embodiment of the present invention, the insulating portion 12 integrally formed with the conductive portion 11 is formed only on the first conductive portion 111 and the second conductive portion 112 of the conductive portion 11.
Further, the forming mold 300 may further include at least one film 304, for example, in this specific example of the present invention, the number of the film 304 may be implemented as two, wherein a single film 304 is disposed on the lower surface of the upper mold 301 and the film 304 and the lower surface overlap each other, and another film 304 is disposed on the inner surface of the lower mold 302 and the film 304 and the upper surface of the lower mold 302 overlap each other. The film layer 304 may be attached to the lower surface of the upper mold 301 in such a manner that the film layer 304 and the inner surface of the upper mold 301 are overlapped to be connected to each other, and the film layer 304 may be attached to the upper surface of the lower mold 302 in such a manner that the film layer 304 and the upper surface of the lower mold 302 are overlapped to be connected to each other.
The film 304 can act as a buffer to reduce damage, such as scratching, to the conductive part 11 during the manufacturing process.
When the molding die 300 is subjected to a die-closing operation, the film layer 304 is held between the conductive portion 11 and the conductive portion pressing portion 30111 of the upper molding portion 3011 of the upper die 301, and between the conductive part 11 and the support part 30211 of the lower molding part 3021 of the lower mold 302, so that the film 304 prevents a gap from being generated between the upper and lower molds 302 and the conductive part 11 by being deformed when being pressed, so that, in a subsequent molding process, the fluid material is prevented from entering the upper surface and the lower surface of the conductive part 11, so that the upper and lower sides of the finally molded circuit board assembly 1 can be directly conducted through the conductive parts 11, thereby preventing the conductive part 11, especially the upper surface of the conductive part 11, from being contaminated, and ensuring the product yield of the circuit board assembly 1.
After the molding die 300 performs the mold clamping operation, the upper pressing portion 3012 of the upper die 301 and the lower pressing portion 3022 of the lower die 302 are directly pressed together, and the molding space 303 is formed between the conductive portion 11 and the upper and lower dies 302.
In this example, the adjacent conductive parts 11 are independent of each other, and each conductive part 11 is independently placed at a predetermined position of the lower mold 302 and then injected with a fluid material after the mold is closed.
In other examples of the present invention, the upper surface of the conductive portion 11 is not a flat surface, and has a recess, wherein the electronic component can be accommodated in the recess to reduce the overall height of the assembled electronic component and the circuit board assembly 1. Accordingly, the structure and shape of the forming mold 300 may be adjusted accordingly.
In other embodiments of the present invention, adjacent conductive portions 11 are connected to each other to facilitate the conductive portions 11 to be placed in the molding die 300.
With continued reference to fig. 2A, the fluid material is added to at least one of the forming spaces 303, and the fluid material fills all of the forming spaces 303 to form the insulating portion 12 through a transfer molding process or a press molding process, so that the insulating portion 12 and the conductive portion 11 are integrally formed.
The fluid material may be a liquid, a solid, a mixture of solids and liquids, or the like, so that the fluid material may be in fluid communication. The fluid material may be a thermosetting material, although those skilled in the art will appreciate that the material of the fluid material is not limited thereto.
With continued reference to fig. 2A, the forming mold 300 is subjected to a mold-drawing operation, such that the upper mold 301 is drawn out first, as shown in fig. 2A.
With continued reference to fig. 2B, after the mold-drawing operation is performed on the molding die 300, the circuit board assembly semi-finished product is obtained. The circuit board assembly semi-finished product is cut to obtain the single circuit board assembly 1.
In other embodiments of the present invention, the connection between adjacent conductive portions 11 is a complete metal region, that is, the second conductive portion 112 of one conductive portion 11 and the second conductive portion 112 of another conductive portion 11 are directly contacted, and in a subsequent cutting process, a metal block formed by two second conductive portions 112 needs to be divided.
More specifically, in some examples of the present invention, the insulating portion 12 of the circuit board assembly 1 can be observed only between the first conductive portion 111 and the second conductive portion 112 at one end of the upper surface of the circuit board assembly 1, and during the manufacturing process, the adjacent first conductive portion 111 is a complete metal plate, the adjacent second conductive portion 112 is a complete metal plate, and even in some variant embodiments, a first conductive portion 111 of one conductive portion 11 and a second conductive portion 112 of another conductive portion 11 are complete metal plates. By subsequent dicing, the individual conductive parts 11 and the circuit board assembly 1 with the individual conductive parts 11 are obtained.
Further, in the present example, in the lateral direction, the second conductive portions 112 of the adjacent conductive portions 11 are adjacently disposed, and the first conductive portions 111 of the adjacent conductive portions 11 are adjacently disposed. In the cutting process, a single circuit board assembly 1 can be obtained, and a plurality of circuit board assemblies 1 can also be obtained, so that the requirements of array type electronic equipment can be met.
In other examples of the present invention, the first conductive portions 111 and the second conductive portions 112 of adjacent conductive portions 11 are arranged to be spaced apart in the lateral direction, that is, the first conductive portion 111 of one conductive portion 11 is adjacent to the second conductive portion 112 of another conductive portion 11.
According to another aspect of the present invention, the present invention further provides a method of manufacturing a circuit board assembly 1, wherein the circuit board assembly 1 is used for supporting an electronic component, wherein the manufacturing method comprises the steps of:
(a) placing at least one conductive part 11 into a molding die 300;
(b) performing a mold clamping process on the molding die 300 to form a molding space 303 between an upper die 301 and a lower die 302 of the molding die 300 and the conductive portion 11;
(c) adding a fluid material into the molding space 303 so that the fluid material fills the molding space 303 and is solidified in the molding space 303; and
(d) after the mold drawing process is performed on the molding die 300, at least one insulation portion 12 integrally bonded to the circuit board assembly 1 is formed on the circuit board assembly 1.
According to an embodiment of the present invention, wherein the step (d) further comprises the steps of:
drawing the forming mold 300 to form a semi-finished circuit board assembly, wherein the semi-finished circuit board assembly comprises a plurality of conductive parts 11 and the insulating parts 12 integrally combined with the conductive parts 11; and
and cutting the semi-finished product of the circuit board assembly to obtain the circuit board assembly 1.
According to an embodiment of the present invention, in the above method, at least a portion of the insulating portion 12 is located between the first conductive portion 111 and the second conductive portion 112, and separates the first conductive portion 111 and the second conductive portion 112.
According to an embodiment of the present invention, in the above method, at least a part of the insulation portion 12 is formed on at least a part of the side surface of the conductive portion 11.
According to an embodiment of the present invention, wherein the step (d) is implemented as: after a mold-drawing process is performed on the molding die, the insulating part 12 integrally coupled to the conductive part 11 and a bracket 20 integrally coupled to the insulating part 12 are formed on the conductive part 11.
According to an embodiment of the present invention, in the above method, the insulating portion 12 integrally bonded to one side surface of the conductive portion 11 is formed on the conductive portion 11.
According to an embodiment of the present invention, in the step (d), the insulating portion 12 integrally combined with a side surface and an upper surface of the conductive portion 11 is formed on the conductive portion 11, wherein the upper surface is used for supporting the electronic component.
According to an embodiment of the present invention, in the step (d), the insulating portion 12 integrally bonded to one side surface and a lower surface of the conductive portion 11 is formed on the conductive portion 11.
According to an embodiment of the present invention, the method further comprises a step of: reducing the thickness of the insulating part 12 until the lower surface of the conductive part 11 is exposed.
According to an embodiment of the present invention, the method further comprises a step of: reducing the thickness of the insulating part 12 until the upper surface of the conductive part 11 is exposed.
According to an embodiment of the present invention, the method further comprises a step of: reducing the thickness of the insulating part 12 until the side surface of the conductive part 11 is exposed.
According to an embodiment of the present invention, in the above method, the conductive portion 11 includes a first conductive portion 111 and a second conductive portion 112, wherein at least a portion of the insulating layer 12 separates the first conductive portion 111 and the second conductive portion 112.
According to an embodiment of the present invention, in the above method, each of the conductive portions 11 is independent from each other.
According to an embodiment of the present invention, in the above method, one of the conductive parts 11 is connected to an adjacent one of the conductive parts 11.
Further, it is understood that, in the present embodiment, the upper mold 301 corresponds to the upper surface of the conductive part 11, and the lower mold 302 corresponds to the lower surface of the conductive part 11. That is, the conductive part 11 is flip-chip mounted in the lower mold 302. In other examples of the present invention, the conductive part 11 may be being loaded into the lower mold 302, that is, the upper mold 301 corresponds to the lower surface of the conductive part 11, and the lower mold 302 corresponds to the upper surface of the conductive part 11.
Referring to fig. 3, another embodiment of the semi-finished circuit board assembly according to the present invention is shown, while referring to fig. 2A and 2B.
In this example, the circuit board assembly semi-finished product includes a plurality of the conductive portions 11 and the insulating portions 12 integrally bonded to the conductive portions 11.
It is worth mentioning that in the present example, the conductive parts 11 are connected to each other to facilitate the rapid placement of the conductive parts 11 in the lower mold 302. When a plurality of conductive parts 11 are connected to each other to form a frame, the placement of the plurality of conductive parts 11 can be completed in one operation when the conductive parts 11 need to be placed in the lower mold 302 for operation, thereby saving the operation time and improving the work efficiency.
The semi-finished circuit board assembly further comprises a connecting member 13, wherein the connecting member 13 connects adjacent ones of the conductive portions 11. The connecting member 13 may be divided into a first connecting member connected to the first conductive portion 111 of the adjacent conductive portion 11 and a second connecting member connected to the second conductive portion 112 of the adjacent conductive portion 11 according to the connecting position.
Specifically, the first conductive part 111 of one conductive part 11 is connected to the first conductive part 111 of another adjacent conductive part 11 through a first connection, and the second conductive part 112 of one conductive part 11 is connected to the second conductive part 112 of another conductive part 11 through a second connection. There is no direct contact between the first conductive part 111 and the second conductive part 112 of the same conductive part 11.
Preferably, in this example, the first conductive portion 111 and the second conductive portion 112 have the same height, so that the circuit board assembly 1 has a flat surface.
The height of the first connector is set to be lower than the height of the first conductive portion 111, and the height of the second connector is set to be lower than the height of the second conductive portion 112.
The forming space 303 comprises at least one transverse guide groove and at least one longitudinal guide groove, which are perpendicular to each other and communicate with each other, for the fluid material to flow through to fill the whole forming die 300. The first and second connectors span the first transverse and longitudinal guide slots, respectively. When the heights of the first connecting piece and the second connecting piece are lower than the heights of the surrounding first conducting portion 111 and second conducting portion 112, respectively, the fluid material can directly pass through the forming mold 300 and the gap between the first connecting piece and the second connecting piece, so that the single transverse guide groove or the single longitudinal guide groove can be completely penetrated for the whole forming mold 300, and the fluid material can be injected at one side of the forming mold 300, so that the whole process of injecting the fluid material can be completed.
In some examples of the present invention, the height of the first connector and the second connector is equal to the height of the conductive part 11, the lateral guide groove and the longitudinal guide groove cannot be penetrated, so that the molding space 303 is divided into a single independent space, and injection of the fluid material may be performed in the up-down direction of the molding die 300 with respect to the single independent space so that the fluid material finally fills the entire molding space 303.
Referring to fig. 4, there is shown another embodiment of the circuit board assembly 1 according to the present invention.
The circuit board assembly 1 comprises a circuit board 10, wherein the circuit board 10 comprises a conductive portion 11 and an insulating portion 12, wherein the insulating portion 12 is integrally combined with the conductive portion 11, wherein the conductive portion 11 comprises a first conductive portion 111 and a second conductive portion 112, wherein the first conductive portion 111 is separated from the second conductive portion 112 by at least a portion of the insulating portion 12.
The first conductive portion 111 has an inverted trapezoidal shape in longitudinal section. The first conductive portion 111 has an upper surface and a lower surface, and a side surface, wherein the area of the upper surface is larger than the area of the lower surface, and the side surface is disposed to be inclined inward.
The side surfaces that are inclined enable the first conductive part 111 to be better supported to the insulating part 12 to facilitate the bonding strength between the first conductive part 111 and the insulating part 12.
The circuit board 10 further comprises at least a portion of the connectors 13, wherein the circuit board assembly 1 is cut from the circuit board assembly semi-finished product, so that a portion of the connectors 13 remains in a single circuit board assembly 1, and the connectors 13 are connected to the first conductive portion 111 and the second conductive portion 112, respectively.
Further, in other examples of the present invention, the second conductive portion 112 may also be designed to have a specific shape to facilitate the bonding strength between the second conductive portion 112 and the insulating portion 12. The second conductive portion 112 can be formed in a stepped structure on the side surface, or the second conductive portion 112 is designed in an inverted trapezoidal shape in longitudinal section.
Referring to fig. 5A, and to fig. 3, another embodiment of the circuit board assembly 1 according to the present invention is shown.
The circuit board assembly 1 includes a circuit board 10, wherein the circuit board 10 includes a conductive portion 11 and an insulating portion 12, the insulating portion 12 is integrally formed on the conductive portion 11, and the conductive portion 11 penetrates through the insulating portion 12. The conductive portion 11 includes a first conductive portion 111 and a second conductive portion 112, and at least a portion of the insulating portion 12 is located between the first conductive portion 111 and the second conductive portion 112 and isolates the first conductive portion 111 and the second conductive portion 112.
Part of the insulating portion 12 is supported by part of the lower surface of the first conductive portion 111. In other words, the insulating portion 12 that is not located between the first conductive portion 111 and the second conductive portion 112 does not contribute to an increase in the area size of the entire circuit board assembly 1.
The height of the conductive part 11 is the same as that of the insulating part 12, and the conductive part 11, the insulating part 12 and the circuit board assembly 1 are all in a cubic structure. It is understood that the first conductive portion 111 and the second conductive portion 112 of the conductive portion 11 can be circular, triangular or polygonal, and the above description of the shape is not intended to limit the present invention.
It is noted that in this example, the circuit board assembly semi-finished product may be cut along the peripheries of the first conductive portion 111 and the second conductive portion 112 during the cutting process so that the connector 13 does not appear on the last circuit board assembly 1.
Referring to fig. 5B, and to fig. 3, another embodiment of the circuit board assembly 1 according to the present invention is shown.
The circuit board assembly 1 includes a circuit board 10, wherein the circuit board 10 includes a conductive portion 11 and an insulating portion 12, wherein the insulating portion 12 is integrally formed on the conductive portion 11, and the conductive portion 11 penetrates through the insulating portion 12.
The insulating part 12 includes an insulating main body 121 and an insulating frame 122, wherein the insulating frame 122 is formed outside the conductive part 11 and contributes to an increase in the size of the circuit board assembly 1 in the horizontal direction, the insulating frame 122 and the insulating main body 121 are integrally formed, and the vertical direction of the insulating main body 121 contributes to an increase in the size of the circuit board assembly 1.
The insulating frame 122 is formed on one side surface of the conductive part 11, or the side surface of the conductive part 11 is completely covered by an insulating material.
The conductive portion 11 includes a first conductive portion 111 and a second conductive portion 112, and a portion of the insulating portion 12 is located between the first conductive portion 111 and the second conductive portion 112 and isolates the first conductive portion 111 and the second conductive portion 112. Part of the insulating portion 12 is supported by the first conductive portion 111.
An upper surface of the second conductive portion 111 is larger than a lower surface of the second conductive portion 111, so as to reduce a contact area between the upper surface of the second conductive portion 111 and other circuit boards.
The circuit board assembly 1 further includes at least a part of the connecting members 13, wherein the connecting members 13 are connected to the side surfaces of the first conductive portion 111 and the second conductive portion 112, respectively.
In other embodiments of the present invention, a portion of the insulating body 121 is supported by the second conductive portion 112.
Referring to fig. 5C, and to fig. 3, there is shown another embodiment of the semi-finished product of a circuit board assembly according to the present invention.
Here illustrated as a single said circuit board assembly 1, in practice said circuit board assembly semi-finished product may comprise a plurality of said circuit board assemblies 1.
The circuit board assembly 1 includes a circuit board 10, wherein the circuit board 10 includes a conductive portion 11 and an insulating portion 12, and the insulating portion 12 is integrally formed on the conductive portion 11. The conductive part 11 includes an upper surface, a lower surface and a side surface, wherein the upper and lower surfaces are disposed opposite to each other, and the side surface is connected to and formed between the upper and lower surfaces, respectively.
In this example, part of the insulating portion 12 is wrapped around the upper surface of the conductive portion 11, so that the conductive portion 11 cannot penetrate through the insulating portion 12.
The circuit board assembly 1 further includes at least a part of the connecting members 13, wherein the connecting members 13 are connected to the side surfaces of the first conductive portion 111 and the second conductive portion 112, respectively.
Further, the manufacturing process of the semi-finished product of the circuit board assembly comprises the following steps:
the upper surface of the conductive part 11 is exposed so that an electronic component can be connected to the upper surface of the conductive part 11.
The insulating portion 12 on the upper surface of the conductive portion 11 may be removed by grinding or cutting.
It is understood that the semi-finished circuit board assembly may be cut into individual or multiple circuit board assemblies 1, and then the upper surface of the conductive portion 11 is exposed by grinding or cutting. It is also possible to expose the upper surface of the conductive part 11 by grinding or cutting and then divide it into individual or a plurality of the circuit board assemblies 1. It is understood that the insulating portion 12 may be entirely removed from its upper surface, so that the height is reduced to expose the upper surface of the conductive portion 11; or removing the corresponding position of the conductive part 11 to form a groove for exposing the upper surface of the conductive part 11, wherein the groove can be used for preventing glue overflow when an electronic component is installed.
Referring to fig. 5D, and to fig. 3, there is shown another embodiment of the semi-finished product of a circuit board assembly according to the present invention.
Here illustrated as a single said circuit board assembly 1, in practice said circuit board assembly semi-finished product may comprise a plurality of said circuit board assemblies 1.
The circuit board assembly 1 includes a circuit board 10, wherein the circuit board 10 includes a conductive portion 11 and an insulating portion 12, and the insulating portion 12 is integrally formed on the conductive portion 11. The conductive part 11 includes an upper surface, a lower surface and a side surface, wherein the upper and lower surfaces are disposed opposite to each other, and the side surface is connected to and formed between the upper and lower surfaces, respectively.
In this example, part of the insulating portion 12 is wrapped around the lower surface of the conductive portion 11, so that the conductive portion 11 cannot penetrate through the insulating portion 12.
The circuit board assembly 1 further includes at least a part of the connecting members 13, wherein the connecting members 13 are connected to the side surfaces of the first conductive portion 111 and the second conductive portion 112, respectively.
Further, the manufacturing process of the semi-finished product of the circuit board assembly comprises the following steps:
the lower surface of the conductive part 11 is exposed so that an electronic component can be connected to the upper surface of the conductive part 11.
The insulating portion 12 on the lower surface of the conductive portion 11 may be removed by grinding or cutting.
It is understood that the semi-finished circuit board assembly may be cut into individual or multiple circuit board assemblies 1, and then the lower surfaces of the conductive portions 11 are exposed by grinding or cutting. It is also possible to expose the lower surface of the conductive part 11 by grinding or cutting and then divide it into individual or a plurality of the circuit board assemblies 1.
It is understood that in some examples of the present invention, a portion of the insulating portion 12 is wrapped around the side surface of the conductive portion 11, and the side surface of the conductive portion 11 may be exposed to the outside by cutting or grinding.
Fig. 6 shows a preferred embodiment of a circuit board assembly 1 according to the invention.
The circuit board assembly 1 comprises a circuit board 10 and a bracket 20, wherein the bracket 20 is integrally combined with the circuit board assembly 1 and the bracket 20 surrounds to form an optical window 21. The circuit board assembly 1 includes a conductive portion 11 and an insulating portion 12, wherein the insulating portion 12 is integrally bonded to the conductive portion 11.
The conductive portion 11 includes a first conductive portion 111 and a second conductive portion 112, wherein the first conductive portion 111 and the second conductive portion 112 are separated by a portion of the insulating portion 12. The holder 20 is integrally formed on one side surface of the conductive part 11.
In this example, the insulating portion 12 and the bracket 20 are integrally combined with the conductive portion 11, the insulating portion 12 and the bracket 20 are made of the same material, and the bracket 20 located outside can protect an electronic component located on the upper surface of the conductive portion 11 from dust and the like and also prevent a fault such as a short circuit from occurring at a side of the circuit board assembly 1.
In other examples of the present invention, the bracket 20 is connected to the conductive part 11 of the circuit board assembly 1; or the bracket 20 is connected to the insulating portion 12 of the circuit board assembly 1; or the holder 20 is connected to the conductive part 11 and the insulating part 12 of the circuit board assembly 1. The bracket 20 may be connected by a connecting medium such as glue.
Referring to fig. 7, a TOF camera module 100 is shown, which is an application of the circuit board assembly 1 according to the present invention.
The TOF camera module 100 includes a floodlight 110 and a receiving unit 120, wherein the floodlight 110 is configured to generate a light to a subject, the light is reflected by the subject, and the receiving unit 120 receives the reflected light and obtains depth information of the subject according to information of the transmitted light and the reflected light.
The receiving unit 120 includes a lens assembly 1201 and a photosensitive circuit 1202, wherein the lens assembly 1201 is used for receiving light, and the photosensitive circuit 1202 receives light and converts an optical signal into an electrical signal based on the photoelectric conversion principle.
The lens assembly 1201 further includes an optical lens 1201 and a base 1202, and the photosensitive circuit 1202 includes a photosensitive element 12021 and a circuit board 12022, wherein the optical lens 1201 and the floodlight 110 are respectively supported by the base 1202, the photosensitive element 12021 is conductively connected to the circuit board 12022, and in this example, the base 1202 is integrally formed on the circuit board 12022. The floodlight 110 is conductively connected to the base 1202.
In the present embodiment, the electronic component is implemented as a light emitting component 2, and the floodlight 110 comprises the light emitting component 2 and the circuit board assembly 1, wherein the light emitting component 2 is supported by the circuit board assembly 1 and is communicably connected to the circuit board assembly 1. The circuit board assembly 1 provides a light path through which the light emitting element 2 can be excited to emit light outwardly when energized.
The circuit board assembly 1 includes a circuit board 10 and a support 20, wherein the support 20 is supported on the circuit board 10, the support 20 has an optical window 21, and the light emitting device 2 cooperates with the support 20 and the light emitting device 2 to form the optical window 21, so that light can be emitted through the optical window 21.
The light emitting element 2 has a front surface and a back surface, wherein the front surface of the light emitting element 2 is connected to the second conductive portion 112 of the conductive portion 11 through a conductive wire, and the back surface of the light emitting element 2 is directly supported by the second conductive portion 112 of the conductive portion 11 and is connected to the conductive portion 11.
The luminaire 110 further comprises an optical accessory 3, wherein the holder 20 supports the optical accessory 3 on the circuit board assembly 1 and the optical accessory 3 is held in an optical path of the light emitting element 2. The optical auxiliary element 3 is used to modify or improve the light emitted by the light-emitting element 2, for example, by refracting, diffracting or filtering the light emitted by the light-emitting element 2. The optical auxiliary element 3 may be a refractive lens or a diffractive lens. It will be appreciated by the person skilled in the art that the above examples do not limit the type of optical auxiliary element 3.
The luminaire 110 further comprises at least one electronic component 4, wherein the electronic component 4 is conductively connected to the circuit board assembly 1, in this example, at least a part of the electronic component 4 is disposed on the circuit board 12022 of the receiving unit 120 and is wrapped on the base 12021. The electronic component 4 is conductively connected to the circuit board assembly 1. In particular, the electronic component 4 is conductively connected to the circuit board assembly 1 of the luminaire 110 via the circuit board 12022 of the receiving unit 120.
Further, in some examples of the invention, the light emitting element 2 may be implemented as a Vertical Cavity Surface Emitter (VCSEL). Upon energization, the VCSEL can be excited to emit laser light.
It is worth mentioning that the vcsel needs to be maintained within a specific temperature range to be able to operate normally, that is, the heat dissipation performance of the circuit board assembly 1 is very important to the operating status of the vcsel. Since the first conductive part 111 of the circuit board assembly 1 provides a larger heat dissipation area, the vertical cavity surface emitter can work normally when supported by the first conductive part 111.
Further, a back surface of the vertical cavity surface emitter is a cathode, and a front surface of the vertical cavity surface emitter is an anode, when the vertical cavity surface emitter is respectively communicated with the first conductive part 111 and the second conductive part 112, the first conductive part 111 is a cathode, and the second conductive part 112 is an anode.
Fig. 8A and 8B show a manufacturing process of the circuit board assembly 1 according to the present invention.
At the stage shown in fig. 8A, at least one conductive part 11 is attached to a molding die 300 to perform a molding process by the molding die.
Specifically, the molding die 300 includes an upper die 301 and a lower die 302, wherein at least one of the upper die 301 and the lower die 302 can be operated so that the molding die 300 can be subjected to a film-combining and drawing operation. For example, in an embodiment of the present invention, after the conductive part 11 is placed in the lower mold 302 and the upper mold 301 is subjected to a mold clamping operation, a molding space 303 is formed between the upper mold 301 and the lower mold 302. That is, the lower mold 302 and the upper mold 301 communicate with each other after the mold closing operation is performed. The upper mold 301, the lower mold 302, and the conductive part 11 define the molding space 303. A fluid material can fill the molding space 303 to form the insulating part 12 integrally bonded to the conductive part 11.
With continued reference to fig. 8A, the upper mold 301 further includes an upper molding portion 3011 and an upper pressing portion 3012, wherein the upper pressing portion 3012 is disposed at the periphery of the upper molding portion 3011, so that the upper pressing portion 3012 of the upper mold 301 can press an upper surface of the upper mold 301 after the mold clamping process is performed on the molding mold 300.
The upper molding portion 3011 has a lower surface, when the molding die 300 is subjected to a mold clamping process, a part of the lower surface of the upper molding portion 3011 is pressed against the conductive portion 11, and the lower surface of the upper molding portion 3011 and a corresponding upper surface of the lower die 302 form the molding space 303 for the fluid material to pass through.
In this example, the upper and lower surfaces of the circuit board assembly 1 are both a plane, so the lower surface corresponding to the upper molding part 3011 and the upper surface corresponding to the lower molding part 3021 are both a plane, and the entire molding die 300 has a simple structure and low manufacturing difficulty and cost.
Further, the upper molding portion 3011 includes at least one conductive portion pressing portion 30111 and at least one insulation position molding portion 30112, the conductive portion pressing portion 30111 integrally extends to the insulation position molding portion 30112, wherein the conductive portion pressing portion 30111 further includes a first conductive portion pressing portion 301111 and a second conductive portion pressing portion 301112, wherein one insulation position molding portion 30112 is located between the first conductive portion pressing portions 301111 and between an adjacent first conductive portion pressing portion 301111, one insulation position molding portion 30112 is located between the first conductive portion pressing portion 301111 and an adjacent second conductive portion pressing portion 301112, and one insulation position molding portion 30112 is located between the second conductive portion pressing portion 301112 and an adjacent second conductive portion pressing portion 301112.
The lower mold 302 includes a lower molding portion 3021 and a lower pressing portion 3022, and the lower pressing portion 3022 is disposed at a peripheral position of the lower molding portion 3021 so that the lower pressing portion 3022 of the lower mold 302 can be supported on the upper pressing portion 3012 of the upper mold 301 when the molding mold 300 is subjected to a mold clamping process.
The lower die 302 further includes a lower molding guide groove 3023, wherein the lower molding guide groove 3023 is formed between the lower pressing portion 3022 and the lower molding portion 3021 or between the adjacent lower molding portion 3021 and the lower molding portion.
The lower molding part 3021 includes at least one support part 30211 and at least one lower molding guide 30212, wherein the support part 30211 and the lower molding guide 30212 are disposed at intervals. The support portion 30211 corresponds to the lower surface of the conductive portion 11, the lower molded guide portion 30212 corresponds to the insulation position molding portion 30112 and the lower molded guide groove 3023, and the molding space 303 is formed between the lower molded guide portion 30212 and the insulation position molding portion 30112 and the lower molded guide groove 3023 to integrally form the insulation portion 12 and the holder 20 in the conductive portion 11 in a subsequent step.
Further, the supporting portion 30211 includes a first conductive portion supporting portion 302111 and a second conductive portion supporting portion 302112. Alternatively, when the number of the conductive portions 11 is plural, at least one of the lower shaped guides 30212 is located between the first conductive portion support 302111 and the adjacent second conductive portion support 302112, at least one of the lower shaped guides 30212 is located between the first conductive portion support 302111 and the adjacent first conductive portion support 302111, and at least one of the lower shaped guides 30212 is located between the second conductive portion support 302112 and the adjacent second conductive portion support 302112.
When the mold clamping operation is performed on the molding die 300, the distance between the conductive portion pressing section 30111 of the upper molding section 3011 of the upper die 301 and the supporting section 30211 of the lower molding section 3021 of the lower die 302 is set to just accommodate the conductive portion 11, so as to avoid the fluid material from contaminating the upper surface of the conductive portion 11.
In this example, the insulating portion 12 integrally formed with the conductive portion 11 may not only separate the first conductive portion 111 and the second conductive portion 112, but also cover the side surface of the conductive portion 11. In other embodiments of the present invention, the insulating portion 12 integrally formed on the conductive portion 11 separates the first conductive portion 111 and the second conductive portion 112, and covers part of the side surface of the conductive portion 11. In another embodiment of the present invention, the insulating portion 12 integrally formed with the conductive portion 11 is formed only on the first conductive portion 111 and the second conductive portion 112 of the conductive portion 11.
Further, the forming mold 300 may further include at least one film 304, for example, in this specific example of the present invention, the number of the film 304 may be implemented as two, wherein a single film 304 is disposed on the lower surface of the upper mold 301 and the film 304 and the lower surface overlap each other, and another film 304 is disposed on the inner surface of the lower mold 302 and the film 304 and the upper surface of the lower mold 302 overlap each other. The film layer 304 may be attached to the lower surface of the upper mold 301 in such a manner that the film layer 304 and the inner surface of the upper mold 301 are overlapped to be connected to each other, and the film layer 304 may be attached to the upper surface of the lower mold 302 in such a manner that the film layer 304 and the upper surface of the lower mold 302 are overlapped to be connected to each other.
The film 304 can act as a buffer to reduce damage, such as scratching, to the conductive part 11 during the manufacturing process.
When the molding die 300 is subjected to a die-closing operation, the film layer 304 is held between the conductive portion 11 and the conductive portion pressing portion 30111 of the upper molding portion 3011 of the upper die 301, and between the conductive part 11 and the support part 30211 of the lower molding part 3021 of the lower mold 302, so that the film 304 prevents a gap from being generated between the upper and lower molds 302 and the conductive part 11 by being deformed when being pressed, so that, in a subsequent molding process, the fluid material is prevented from entering the upper surface and the lower surface of the conductive part 11, so that the upper and lower sides of the finally molded circuit board assembly 1 can be directly conducted through the conductive parts 11, thereby preventing the conductive part 11, especially the upper surface of the conductive part 11, from being contaminated, and ensuring the product yield of the circuit board assembly 1.
After the molding die 300 performs the mold clamping operation, the upper pressing portion 3012 of the upper die 301 and the lower pressing portion 3022 of the lower die 302 are directly pressed together, and the molding space 303 is formed between the conductive portion 11 and the upper and lower dies 302.
Preferably, in this example, the first conductive portion 111 and the second conductive portion 112 have the same height, so that the circuit board assembly 1 has a flat surface.
The forming space 303 comprises at least one transverse guide groove and at least one longitudinal guide groove, which are perpendicular to each other and communicate with each other, for the fluid material to flow through to fill the whole forming die 300. For the whole molding die 300, the single transverse guide groove or the single longitudinal guide groove can be completely penetrated, so that the fluid material can be injected at one side of the molding die 300 to complete the whole process of injecting the fluid material.
With continued reference to fig. 8A, the fluid material is added to at least one of the forming spaces 303, and the fluid material fills all of the forming spaces 303 to form the insulating portion 12 through a transfer molding process or a press molding process, so that the insulating portion 12 and the conductive portion 11 are integrally formed.
The fluid material may be a liquid, a solid, a mixture of solids and liquids, or the like, so that the fluid material may be in fluid communication. The fluid material may be a thermosetting material, although those skilled in the art will appreciate that the material of the fluid material is not limited thereto.
With continued reference to fig. 8A, the forming mold 300 is subjected to a mold-drawing operation, such that the upper mold 301 is drawn out first, as shown in fig. 8A.
Referring to fig. 8B, after the mold drawing operation is performed on the molding die 300, the circuit board assembly semi-finished product is obtained. The circuit board assembly semi-finished product is cut to obtain the single circuit board assembly 1.
Further, in the present example, in the lateral direction, the second conductive portions 112 of the adjacent conductive portions 11 are adjacently disposed, and the first conductive portions 111 of the adjacent conductive portions 11 are adjacently disposed. In the cutting process, a single circuit board assembly 1 can be obtained, and a plurality of circuit board assemblies 1 can also be obtained, so that the requirements of array type electronic equipment can be met.
In other examples of the present invention, the first conductive portions 111 and the second conductive portions 112 of adjacent conductive portions 11 are arranged to be spaced apart in the lateral direction, that is, the first conductive portion 111 of one conductive portion 11 is adjacent to the second conductive portion 112 of another conductive portion 11.
It will be appreciated that the lower molding guide 3023 of the lower mold 302 forms the upper end of the support frame 20 at a corresponding position. The shape of the lower molding guide groove 3023 determines the shape of the holder 20.
The bracket 20 has a high end and a low end, wherein the low end is connected to the circuit board assembly 1, the high end can be used for supporting an optical auxiliary element 3, and the high end of the bracket 20 can be an inclined structure to facilitate stable support of the optical auxiliary element 3. The optical auxiliary element 3 has a side face, wherein the side face is arranged to be inclined inwards from top to bottom.
According to another aspect of the present invention, there is provided a method of manufacturing a circuit board assembly 1, wherein the method of manufacturing includes the steps of:
(a) placing at least one conductive part 11 into a molding die 300;
(b) performing a mold clamping process on the molding die 300 to form a molding space 303 between an upper die 301 and a lower die 302 of the molding die 300 and the conductive portion 11;
(c) adding a fluid material into the molding space 303 so that the fluid material fills the molding space 303 and is solidified in the molding space 303; and
(d) after the mold drawing process is performed on the molding mold 300, at least one insulating portion 12 and at least one bracket 20 integrally combined with the circuit board assembly 1 are formed on the circuit board assembly 1 to form the circuit board assembly 1.
According to an embodiment of the present invention, the conductive portion 11 is formed by an etching process, and a side surface of the conductive portion 11 is disposed to be inclined inward.
According to an embodiment of the present invention, wherein the step (d) further comprises the steps of:
drawing the forming mold 300 to form a semi-finished circuit board assembly, wherein the semi-finished circuit board assembly comprises a plurality of conductive parts 11, and the insulating part 12 and the bracket 20 which are integrally combined with the conductive parts 11; and
and cutting the semi-finished product of the circuit board assembly to obtain the circuit board assembly 1.
According to an embodiment of the present invention, the bracket 20 is integrally combined with a side surface of the conductive portion 11.
According to an embodiment of the present invention, the bracket 20 is integrally combined with one side of the insulating portion 12.
According to an embodiment of the present invention, in the above method, at least a portion of the insulating portion 12 is located between the first conductive portion 111 and the second conductive portion 112, and separates the first conductive portion 111 and the second conductive portion 112.
According to an embodiment of the present invention, in the above method, at least a part of the insulation portion 12 is formed on at least a part of the side surface of the conductive portion 11.
According to an embodiment of the present invention, wherein the step (d) is implemented as: after a mold drawing process is performed on the molding die 300, the insulating part 12 integrally coupled to the conductive part 11 and a bracket 20 integrally coupled to the insulating part 12 are formed on the conductive part 11.
According to an embodiment of the present invention, in the above method, the insulating portion 12 integrally bonded to one side surface of the conductive portion 11 is formed on the conductive portion 11.
According to an embodiment of the present invention, in the step (d), the insulating portion 12 integrally combined with a side surface and an upper surface of the conductive portion 11 is formed on the conductive portion 11, wherein the upper surface is used for supporting the electronic component.
According to an embodiment of the present invention, in the step (d), the insulating portion 12 integrally bonded to one side surface and a lower surface of the conductive portion 11 is formed on the conductive portion 11.
According to an embodiment of the present invention, the method further comprises a step of: reducing the thickness of the insulating part 12 until the lower surface of the conductive part 11 is exposed.
According to an embodiment of the present invention, the method further comprises a step of: reducing the thickness of the insulating part 12 until the upper surface of the conductive part 11 is exposed.
According to an embodiment of the present invention, the method further comprises a step of: reducing the thickness of the insulating part 12 until the side surface of the conductive part 11 is exposed.
According to an embodiment of the present invention, in the above method, the conductive portion 11 includes a first conductive portion 111 and a second conductive portion 112, wherein at least a portion of the insulating layer separates the first conductive portion 111 and the second conductive portion 112.
According to an embodiment of the present invention, in the above method, each of the conductive portions 11 is independent from each other.
According to an embodiment of the present invention, in the above method, one of the conductive parts 11 is connected to an adjacent one of the conductive parts 11.
According to another aspect of the present invention, there is provided a method of manufacturing a semi-finished product of a circuit board assembly, wherein the manufacturing method comprises the steps of:
(a) placing a plurality of conductive parts 11 in a molding die 300;
(b) performing mold clamping on the molding die 300 to form a molding space 303 between an upper die 301 and a lower die 302 of the molding die set 300 and the conductive part 11;
(c) adding a fluid material having insulating properties to the molding space 303 so that the fluid material fills the molding space 303 and solidifies within the molding space 303; and
(d) after a mold drawing process is performed on the molding mold 300, an insulating portion 12 integrally connected to the conductive portion 11 is formed on each conductive portion 11 to obtain a semi-finished product of the circuit board assembly.
It is understood that a plurality of the conductive portions 11 may be a conductive imposition, and in this way, the placement of the conductive portions 11 may be completed in one molding die 300 at a time, so as to save the process and provide the work efficiency.
According to some embodiments of the present invention, in the method, each conductive part 11 is connected to an adjacent conductive part 11.
According to some embodiments of the present invention, in the above method, wherein the conductive portion 11 comprises a first conductive portion 111 and a second conductive portion 112, wherein the insulating portion 12 is integrally formed with the first conductive portion 111 and the second conductive portion 112 and the first conductive portion 111 and the second conductive portion 112 are separated by at least a portion of the insulating portion 12.
According to some embodiments of the present invention, the first conductive portion 111 of one conductive portion 11 is connected to the first conductive portion 111 of an adjacent conductive portion 11.
According to some embodiments of the present invention, the second conductive portion 112 of one conductive portion 11 is connected to the second conductive portion 112 of an adjacent conductive portion 11.
According to some embodiments of the invention, the first conductive portion 111 of one conductive portion 11 is connected to the second conductive portion 112 of an adjacent conductive portion 11.
According to some embodiments of the invention, in the above method, further comprising a step of:
a copper plate is etched to form a plurality of the conductive parts 11.
Referring to fig. 9, there is shown another embodiment of the TOF camera module 100 according to the invention.
The TOF camera module 100 comprises the floodlight 110 and the receiving unit 120, wherein the floodlight 110 is used for generating a light to a photographed object, the light is reflected by the photographed object, and the receiving unit 120 receives the reflected light and obtains the depth information of the photographed object according to the information of the transmitted light and the reflected light.
The receiving unit 120 includes the lens assembly 1201 and the photosensitive circuit 1202, wherein the lens assembly 1201 is used for receiving light, and the photosensitive circuit 1202 receives light and converts an optical signal into an electrical signal based on the photoelectric conversion principle. The lens assembly 1201 further includes the optical lens 1201 and the base 1202, and the photosensitive circuit 1202 includes the photosensitive element 12021 and the circuit board 12022, wherein the optical lens 1201 and the floodlight 110 are respectively supported by the base 1202, the photosensitive element 12021 is conductively connected to the circuit board 12022, and in this example, the base 1202 is integrally formed on the circuit board 12022. The floodlight 110 is conductively connected to the base 1202.
The circuit board assembly 1 includes the conductive part 11 and the insulating part 12. The conductive portion 11 comprises the first conductive portion 111 and the second conductive portion 112, wherein the first conductive portion 111 and the second conductive portion 112 are separated by the insulating portion 12 to avoid direct contact between the first conductive portion 111 and the second conductive portion 112.
The conductive part 11 further comprises a third conductive part 113 and a fourth conductive part 114, wherein the third conductive part 113 is surrounded by the insulating part 12 to be separated from the other conductive parts 11, and the fourth conductive part 114 is surrounded by the insulating part 12 to be separated from the other conductive parts 11. Further, the third conductive portion 113 extends in the insulating portion 12, for example, penetrates the insulating portion 12; other electronic components may be placed on the third conductive portion 113 to be electrically connected through the third conductive portion 113.
The electronic component can be placed on the first conductive portion 111, in this embodiment, the electronic component is implemented as a light emitting component 2, and the floodlight 110 includes the light emitting component 2 and the circuit board assembly 1, wherein the light emitting component 2 is supported by the circuit board assembly 1 and is communicably connected to the circuit board assembly 1. The circuit board assembly 1 provides a light path through which the light emitting element 2 can be excited to emit light outwardly when energized.
The light emitting element 2 has a front surface and a back surface, wherein the front surface of the light emitting element 2 is connected to the second conductive portion 112 of the conductive portion 11 through a conductive wire, and the back surface of the light emitting element 2 is directly supported by the conductive portion 11 and is connected to the conductive portion 11.
The luminaire 110 further comprises at least one electronic component 4, wherein the electronic component 4 is conductively connected to the circuit board assembly 1, in this example, at least a part of the electronic component 4 is disposed on the circuit board 12022 of the receiving unit 120 and is wrapped on the base 12021. The electronic component 4 is conductively connected to the circuit board assembly 1. In particular, the electronic component 4 is conductively connected to the circuit board assembly 1 of the luminaire 110 via the circuit board 12022 of the receiving unit 120.
In some examples of the invention, the light emitting element 2 may be implemented as a Vertical Cavity Surface Emitter (VCSEL). Upon energization, the VCSEL can be excited to emit laser light.
It is worth mentioning that the vcsel needs to be maintained within a specific temperature range to be able to operate normally, that is, the heat dissipation performance of the circuit board assembly 1 is very important to the operating status of the vcsel. Since the first conductive part 111 of the circuit board assembly 1 provides a larger heat dissipation area, the vertical cavity surface emitter can work normally when supported by the first conductive part 111.
Further, a back surface of the vertical cavity surface emitter is a cathode, and a front surface of the vertical cavity surface emitter is an anode, when the vertical cavity surface emitter is respectively communicated with the first conductive part 111 and the second conductive part 112, the first conductive part 111 is a cathode, and the second conductive part 112 is an anode.
According to another aspect of the present invention, a method of dissipating heat from a circuit board assembly 1 includes the steps of:
guiding heat generated by the electronic component to be transferred from the back surface of the electronic component to the upper surface of the first conductive portion 111;
thermally conducting heat to the lower surface of the first conductive portion 111; and
dissipating heat outwards.
According to some embodiments of the invention, wherein the electronic component is a light emitting element 2.
According to some embodiments of the present invention, the front surface of the electronic component is conductively connected to the second conductive part 112.
According to another aspect of the present invention, the present invention provides an electronic device 1000, wherein the electronic device 1000 comprises an electronic device body 200 and a main circuit board, wherein the main circuit board is disposed on the electronic device body 200 and is conductively connected to the electronic device body 200.
The electronic device 1000 further comprises a floodlight 110 with a flexible circuit board, wherein the floodlight 110 can be conductively mounted to the main circuit board of the electronic device.
In other examples of the present invention, the electronic device 1000 further comprises a floodlight 110, wherein the floodlight 110 is conductively mounted to the main circuit board of the electronic device 1000. Specifically, the circuit board assembly of the floodlight 110 can be conductively connected to the main circuit board of the electronic device 1000.
It is understood that the floodlight 110, the receiving unit 120 and a camera module can be simultaneously mounted on an electronic device body 200, wherein the floodlight 110, the receiving unit 120 and the camera module can be integrated into a whole by an assembly.
Fig. 10A shows an embodiment of a luminaire 110A according to the invention. Specifically, according to another aspect of the invention, there is provided a floodlight 110A with a flexible circuit board 5A, wherein the floodlight 110A can be mounted to a receiving unit 120A to form a TOF camera module 100A.
The floodlight 110A comprises the circuit board assembly 1A manufactured according to the above-mentioned manufacturing method, a light emitting element 2A, a support 20A, at least one electronic component 4A and a flexible circuit board 5A, wherein the support 20A forms a light window 21A, the light emitting element 2A is supported on the circuit board assembly 1A so as to be conductive to the circuit board assembly 1A, the flexible circuit board 5A is conductively connected to the circuit board assembly 1A, and wherein the electronic component 4A is conductively connected to the circuit board assembly 1A and the light emitting element 2A. The floodlight 110A can further comprise an optical auxiliary element 3A, wherein the optical auxiliary element 3A is supported by the bracket 20A, and the light emitted by the light emitting element 2A is emitted outwards under the action of the optical auxiliary element 3A. The flexible printed circuit 5A may be conductively connected to the circuit board assembly 1A by means of conductive paste, or may be conductively connected to the circuit board assembly 1A by means of a card slot.
The circuit board assembly 1A includes a circuit board 10A and the bracket 20A, wherein the bracket 20A is connected to the circuit 10A, wherein the circuit board 10A includes a conductive portion 11A and an insulating portion 12A, wherein the insulating portion 12A is integrally formed with the conductive portion 11A, wherein the conductive portion 11A includes a first conductive portion 111A and a second conductive portion 112A, wherein the first conductive portion 111A and the second conductive portion 112A are separated by the insulating portion 12A, and the light emitting element 2A is conductively supported by the first conductive portion 111A.
The receiving unit 120A includes a lens assembly 1201A and a photosensitive circuit 1202A, wherein the photosensitive circuit 1202A includes a photosensitive element 12021A and a first circuit board 12022A, the lens assembly 1201A provides a light path for light to reach the photosensitive element 12021A for photoelectric conversion, and the photosensitive element 1221A is conductively connected to the first circuit board 12022A. In this example, at least part of the electronic components 4A of the floodlight 110A are arranged on the first circuit board 12022A of the receiving unit 120A to facilitate downsizing of the floodlight 110A.
The floodlight 110A with the flexible wiring board 5A can be mounted to the receiving unit 120A through the flexible wiring board 5A, wherein the first circuit board 12022A of the receiving unit 120A is conductively connected to the flexible wiring board 5A.
Referring to fig. 10B, according to another aspect of the present invention, there is provided a floodlight 110B, wherein the floodlight 110B can be mounted to a receiving unit 120B with a flexible circuit board to constitute a TOF camera module 100B.
The floodlight 110B comprises the circuit board assembly 1B manufactured according to the above-described manufacturing method, a light emitting element 2B, a holder 20B, at least one electronic component 4B and a flexible wiring board 5B, wherein the holder 20B forms a light window 21B, the light emitting element 2B is conductively connected to the circuit board assembly 1B and is supported on the circuit board assembly 1B, and wherein the electronic component 4B is conductively connected to the circuit board assembly 1B and the light emitting element 2B. The floodlight 110B can further comprise an optical auxiliary element 3B, wherein the optical auxiliary element 3B is supported by the bracket 20B, and the light emitted by the light emitting element 2B is emitted outwards under the action of the optical auxiliary element 3B.
The circuit board assembly 1B includes a circuit board 10B and the holder 20B, wherein the holder 20B is connected to the circuit 10B, wherein the circuit board 10B includes a conductive portion 11B and an insulating portion 12B, wherein the insulating portion 12B is integrally formed with the conductive portion 11B, wherein the conductive portion 11B includes a first conductive portion 111B and a second conductive portion 112B, wherein the first conductive portion 111B and the second conductive portion 112B are separated by the insulating portion 12B, and the light emitting element 2B is conductively supported by the first conductive portion 111B.
The receiving unit 120B includes a lens assembly 1201B and a photosensitive assembly 1202B, wherein the photosensitive assembly 1202B further includes a photosensitive element 12021B and a first circuit board 12022B, wherein the lens assembly 1201B provides an optical path for light to reach the photosensitive element 12021B for photoelectric conversion, and wherein the photosensitive element 12021B is conductively connected to the first circuit board 12022B. The flexible wiring board 5B is conductively connected to the first circuit board 12022B. It is understood that the flexible printed circuit 5B may be connected to the first circuit board 12022B of the receiving unit 120B through a conductive adhesive, and the flexible printed circuit 5B may also be connected to the first circuit board 12022B of the receiving unit 120B through a card slot. In this example, at least a part of the electronic components 4B of the floodlight 110B are arranged on the first circuit board 12022B of the receiving unit 120B to facilitate downsizing of the floodlight 110B.
The floodlight 110B is assembled to the receiving unit 120B in such a manner as to be communicably connected to the flexible wiring board 5B of the receiving unit to form the TOF camera module 100B.
It will be appreciated by persons skilled in the art that the embodiments of the invention described above and shown in the drawings are given by way of example only and are not limiting of the invention. The objects of the invention have been fully and effectively accomplished. The functional and structural principles of the present invention have been shown and described in the examples, and any variations or modifications of the embodiments of the present invention may be made without departing from the principles.
Claims (47)
1. A circuit board assembly for supporting an electronic component, comprising:
a conductive portion; and
an insulating portion, wherein the insulating portion is integrally bonded to the conductive portion, wherein the conductive portion comprises a first conductive portion and a second conductive portion, wherein the electronic component is supported by the first conductive portion, the first conductive portion penetrates through the insulating portion, and the first conductive portion and the second conductive portion are separated by at least a portion of the insulating portion, wherein the first conductive portion has an upper surface, wherein the second conductive portion has an upper surface, and wherein the upper surface of the first conductive portion is larger than the upper surface of the second conductive portion.
2. The circuit board assembly of claim 1, wherein the first conductive portion has a side surface, wherein the side surface is disposed to be inclined.
3. A circuit board assembly according to claim 2, wherein the side faces are arranged to be inclined inwardly.
4. A circuit board assembly according to claim 1, wherein the side faces are stepped.
5. The circuit board assembly of claim 1, wherein the first conductive portion has an upper surface and a lower surface, wherein the upper surface and the lower surface are oppositely disposed, wherein the upper surface is larger than the lower surface.
6. The circuit board assembly of claim 1, wherein the circuit board assembly further comprises a connector, wherein the connector has two ends, one end of the connector is connected to the conductive portion, the other end of the connector is exposed, and the insulating portion is integrally formed with the connector.
7. The circuit board assembly according to any one of claims 1 to 6, wherein the conductive portion has a side surface, and at least a part of the insulating portion is integrally bonded to the side surface of the conductive portion.
8. A circuit board assembly according to any of claims 1 to 6, wherein the side faces of the conductive portions are all covered by the insulating portion.
9. The circuit board assembly of any of claims 1-6, wherein the circuit board assembly further comprises a bracket, wherein the bracket defines an optical window, and the bracket is coupled to the circuit board, wherein the optical window provides an optical path for the electronic component.
10. The circuit board assembly of claim 9, wherein the bracket is connected to the circuit board by a connecting medium.
11. The circuit board assembly of claim 9, wherein the bracket is integrally bonded to the conductive portion; or the bracket is integrally combined with the insulating part; or the holder is integrally bonded to the conductive portion and the insulating portion.
12. A circuit board assembly according to any of claims 1 to 4, wherein the conductive parts comprise a third conductive part and a fourth conductive part, wherein the insulating part is integrally formed with the third conductive part and the fourth conductive part, the first conductive part, the second conductive part, the third conductive part and the fourth conductive part being separated by the insulating part respectively.
13. A circuit board assembly blank, comprising:
a plurality of conductive portions and a plurality of insulating portions, wherein the conductive portions include a first conductive portion and a second conductive portion, wherein the insulating portions are integrally formed with the first and second conductive portions and the first and second conductive portions are separated by at least a portion of the insulating portions, wherein adjacent conductive portions are connected to each other.
14. The circuit board assembly semi-finished product of claim 13, wherein said first conductive portion of one of said conductive portions is connected to said first conductive portion of an adjacent said conductive portion.
15. The semi-finished circuit board assembly of claim 13, wherein said second one of said conductive portions is connected to said second one of adjacent ones of said conductive portions.
16. The semi-finished circuit board assembly of claim 14, wherein said second conductive portion of one said conductive portion is connected to said second conductive portion of an adjacent said conductive portion.
17. The semi-finished circuit board assembly of claim 13, wherein said first conductive portion of one said conductive portion is connected to said second conductive portion of an adjacent said conductive portion.
18. The circuit board assembly blank of any of claims 13 to 17, wherein said first conductive portion has an upper surface, wherein said second conductive portion has an upper surface, wherein said upper surface of said first conductive portion is larger than said upper surface of said second conductive portion.
19. The circuit board assembly blank according to any of claims 13 to 17, wherein said first conductive portion has an upper surface and a lower surface, wherein said upper surface and said lower surface are oppositely disposed, wherein said upper surface of said first conductive portion is larger than said lower surface of said first conductive portion.
20. The circuit assembly blank according to any of claims 13 to 17, wherein the first conductive part has a side face, wherein the side face is arranged to be inclined.
21. The circuit board assembly semi-finished product of any one of claims 13 to 17, wherein the first conductive portion has a side face, wherein the side face is provided step-like.
22. The semi-finished circuit board assembly of any of claims 13 to 17, wherein said conductive portion includes a third conductive portion, wherein at least a portion of said insulating portion separates said first conductive portion from said third conductive portion, and wherein at least a portion of said insulating portion separates said second conductive portion from said third conductive portion.
23. The semi-finished circuit board assembly according to any of claims 13 to 17, wherein the circuit board assembly further comprises a plurality of brackets surrounding the light window, wherein the brackets are integrally formed with the conductive portion; or the bracket is integrally formed on the insulating part.
24. A circuit board obtained by dividing a circuit board assembly blank according to any one of claims 13 to 23.
25. A luminaire comprising:
a light emitting element;
a circuit board assembly, wherein the circuit board assembly is divided by a circuit board assembly semi-finished product according to any one of claims 13 to 22; and
a support, wherein the support forms an optical window, the light emitting element is supported on a first conductive portion of the circuit board assembly, and the support is connected to the circuit board assembly.
26. The floodlight of claim 25, wherein the bracket is integrally formed with the circuit board assembly.
27. The floodlight of claim 25, wherein the bracket is adhered to the circuit board assembly.
28. A TOF module of making a video recording, its characterized in that includes:
a floodlight according to any one of claims 25 to 27, wherein the floodlight is adapted to emit a light to a subject; and
and the receiving unit is used for receiving a reflected light ray reflected by the shot object and obtaining the depth information of the shot object based on the information of the transmitted light ray and the reflected light ray.
29. A TOF module of making a video recording, its characterized in that includes:
a floodlight according to any of claims 25 to 27; and
a receiving unit with a flexible circuit board, wherein the receiving unit comprises a lens assembly, a light sensing element, a circuit board and a flexible circuit board, wherein the lens assembly provides an optical through hole to allow light to reach the light sensing element for photoelectric conversion, wherein the light sensing element is conductively connected to the circuit board, wherein the circuit board is conductively connected to the flexible circuit board, and wherein the floodlight is conductively connected to the flexible circuit board.
30. A luminaire comprising:
a light emitting element;
a circuit board assembly, wherein the circuit board assembly is divided by a circuit board assembly semi-finished product according to any one of claims 13 to 22;
a support, wherein the support forms an optical window, the light emitting element is supported on a first conductive portion of the circuit board assembly, and the support is connected to the circuit board assembly; and
a flexible wiring board, wherein the flexible wiring board is conductively connected to the conductive portion of the circuit board assembly.
31. A TOF module of making a video recording, its characterized in that includes:
a floodlight according to claim 30; and
a receiving unit, wherein the receiving unit comprises a lens component, a photosensitive element and a circuit board, wherein the lens component provides an optical path for light to reach the photosensitive element for photoelectric conversion, the photosensitive element is conductively connected to the circuit board, and the flexible circuit board of the floodlight is conductively connected to the circuit board of the receiving unit.
32. An electronic device, comprising:
a floodlight according to claim 30;
an electronic device body; and
a main circuit board, wherein the main circuit board is disposed on the electronic device body, wherein when the floodlight is mounted on the main circuit board, the flexible circuit board of the floodlight is conductively connected to the main circuit board.
33. The electronic device of claim 32, wherein the electronic device comprises a camera module, a receiving unit and an assembly, wherein the camera module is assembled into a whole by the assembly, and the floodlight and the camera module are mounted together on the electronic device body.
34. A TOF module of making a video recording, its characterized in that includes:
the floodlight is used for emitting light to a shot object; and
a receiving unit, wherein the receiving unit is used for receiving a reflected light ray reflected by the photographed object, and obtaining the depth information of the photographed object based on the information of the transmitted light ray and the reflected light ray, wherein the floodlight comprises a TOF light-emitting element and a circuit board assembly segmented by a circuit board assembly semi-finished product according to any one of claims 13 to 22, wherein the TOF light-emitting element is supported on the conductive part of the circuit board assembly.
35. An electronic device, comprising:
an electronic device body and a TOF camera module according to claim 31 wherein the TOF camera module is provided with the electronic device body.
36. The electronic device of claim 35, wherein the electronic device comprises a camera module, a receiving unit and an assembly, wherein the camera module is assembled as a whole by the assembly, and the floodlight and the camera module are mounted together on the electronic device body.
37. A method of manufacturing a semi-finished product for a circuit board assembly for supporting at least one electronic component, comprising the steps of:
(a) placing a plurality of conductive parts into a forming die;
(b) closing the forming mold to form a forming space between an upper mold and a lower mold of the forming module and the conductive part;
(c) adding a fluid material having insulating properties to the molding space such that the fluid material fills the molding space and solidifies within the molding space; and
(d) and after a die drawing process is carried out on the forming die, an insulating part which is integrally combined with the conductive parts is formed on each conductive part, so that a semi-finished product of the circuit board assembly is obtained.
38. The method of claim 37, wherein in the method, each of the conductive portions is connected to an adjacent one of the conductive portions.
39. The method of manufacturing according to claim 37 or 38, wherein in the method, wherein the conductive portion comprises a first conductive portion and a second conductive portion, wherein the insulating portion is integrally formed with the first conductive portion and the second conductive portion and the first conductive portion and the second conductive portion are separated by at least part of the insulating portion.
40. The manufacturing method according to claim 39, wherein the first conductive portion of one of the conductive portions is connected to the first conductive portion of an adjacent conductive portion.
41. The manufacturing method according to claim 39, wherein the second conductive portion of one of the conductive portions is connected to the second conductive portion of an adjacent conductive portion.
42. The manufacturing method according to claim 39, wherein the first conductive portion of one of the conductive portions is connected to the second conductive portion of an adjacent conductive portion.
43. The manufacturing method according to claim 37 or 38, wherein in the above method, further comprising a step of:
etching a copper plate to form a plurality of conductive portions.
44. The manufacturing method according to claim 37 or 38, wherein in the above method, the insulating portion and a holder which are integrally bonded to the conductive portion are formed at the conductive portion.
45. The manufacturing method according to claim 44, wherein the holder is integrally bonded to the conductive portion; or the bracket is integrally combined with the insulating part positioned on one side surface of the conductive part; or the holder is integrally bonded to the conductive portion and the insulating portion.
46. The manufacturing method according to claim 37 or 38, further comprising the steps of:
connecting a bracket to the conductive portion of each circuit board assembly; or, connecting a bracket to the insulating part of each circuit board assembly; or, a support is connected to the conductive part and the insulating part of each circuit board assembly.
47. A method of manufacturing a circuit board assembly, comprising:
the manufacturing method according to any one of claims 37 to 46; and
and cutting the circuit board assembly semi-finished product to obtain the circuit board assembly.
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810972689.2A CN110859021A (en) | 2018-08-24 | 2018-08-24 | Circuit board assembly and semi-finished product of circuit board assembly, manufacturing method thereof, floodlight with circuit board assembly and application thereof |
| EP19851709.6A EP3840546A4 (en) | 2018-08-24 | 2019-07-25 | Circuit board assembly and semi-finished product thereof, flood light, photographing module and application thereof |
| PCT/CN2019/097757 WO2020038179A1 (en) | 2018-08-24 | 2019-07-25 | Circuit board assembly and semi-finished product thereof, flood light, photographing module and application thereof |
| JP2021509985A JP7185020B2 (en) | 2018-08-24 | 2019-07-25 | Circuit board assemblies and semi-finished products thereof, floodlights, imaging modules and uses thereof |
| US17/182,353 US12101877B2 (en) | 2018-08-24 | 2021-02-23 | Circuit board assembly and semi-finished product thereof, floodlight, camera module and application thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810972689.2A CN110859021A (en) | 2018-08-24 | 2018-08-24 | Circuit board assembly and semi-finished product of circuit board assembly, manufacturing method thereof, floodlight with circuit board assembly and application thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110859021A true CN110859021A (en) | 2020-03-03 |
Family
ID=69636216
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810972689.2A Pending CN110859021A (en) | 2018-08-24 | 2018-08-24 | Circuit board assembly and semi-finished product of circuit board assembly, manufacturing method thereof, floodlight with circuit board assembly and application thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110859021A (en) |
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| US11604256B2 (en) | 2019-04-04 | 2023-03-14 | Samsung Electronics Co., Ltd. | Electronic device with heat-radiant structure |
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