CN110750025A - Heat dissipation device and projection equipment - Google Patents

Abstract

The embodiment of the invention provides a heat dissipation device and projection equipment. The heat dissipation device is used for dissipating heat of an electronic device and comprises a shell, a first heat dissipation part, at least one heat pipe, a refrigeration part and a second heat dissipation part, wherein the electronic device and the first heat dissipation part are installed in the shell, the first heat dissipation part and the electronic device are arranged at intervals, one end of the heat pipe extends to the electronic device in a fit mode, the other end of the heat pipe extends to the first heat dissipation part, the refrigeration part is installed outside the shell, the refrigeration part is adjacent to the first heat dissipation part, the second heat dissipation part is located on one side, away from the shell, of the refrigeration part, and heat generated by the electronic device can pass through the heat pipe, the first heat dissipation part, the refrigeration part and the second heat dissipation part and is conducted to the outside of the shell. The heat dissipation device provided by the embodiment of the application can achieve a good heat dissipation effect on an electronic device.

Description

Heat dissipation device and projection equipment

Technical Field

The invention relates to the technical field of projection, in particular to a heat dissipation device and projection equipment.

Background

The projector generally includes a projection imaging system and an optical amplification system, and the projection signal is converted into an image signal by processing of the imaging technology of the projector, and then the image signal is projected and displayed on a screen by amplification of the optical system. In the projection process of the projector, if a high-quality and high-definition projected image is to be obtained, high-brightness output is to be ensured, the projector adopts a high-power and high-brightness light source, and after the high-power light source works for a long time, a large amount of heat is inevitably accumulated in the projector. If the heat cannot be discharged from the projector quickly in time, the working efficiency of the projector can be greatly influenced by the high temperature caused by the heat, and the service life of the projector can be greatly shortened by working at the high temperature for a long time.

Disclosure of Invention

The embodiment of the invention provides a heat dissipation device and projection equipment, which can achieve a good heat dissipation effect on electronic devices in the heat dissipation device.

The embodiment of the invention provides a heat dissipation device, which is used for dissipating heat of an electronic device and comprises a shell, a first heat dissipation part, at least one heat conduction pipe, a refrigeration part and a second heat dissipation part, wherein the electronic device and the first heat dissipation part are arranged in the shell, the first heat dissipation part and the electronic device are arranged at intervals, one end of the heat conduction pipe extends to be attached to the electronic device, the other end of the heat conduction pipe extends to the first heat dissipation part, the refrigeration part is arranged outside the shell, the refrigeration part is arranged close to the first heat dissipation part, the second heat dissipation part is arranged on one side of the refrigeration part far away from the shell, and heat generated by the electronic device can be conducted from the inside of the shell to the outside of the shell through the heat conduction pipe, the first heat dissipation part, the refrigeration part and the second heat dissipation part.

According to the heat dissipation device provided by the embodiment of the invention, the heat near the electronic device is conducted to the first heat dissipation part through the heat conduction pipe, and then the heat is conducted to the outside of the shell from the inside of the shell through the first heat dissipation part, the refrigerating part and the second heat dissipation part, so that the effect of dissipating heat of the electronic device is achieved.

An embodiment of the present invention further provides a projection apparatus, including an optical assembly and the heat dissipation device as provided in any of the above embodiments, wherein the optical assembly is electrically connected to the electronic device, and projects an optical image toward the outside of the housing under the control of the electronic device.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on the drawings without creative efforts.

Fig. 1 is a first schematic structural diagram of a heat dissipation device according to an embodiment of the present invention.

Fig. 2 is a schematic structural diagram of a heat dissipation device according to an embodiment of the present invention.

Fig. 3 is a schematic structural diagram of a heat dissipation device according to an embodiment of the present invention.

Fig. 4 is a first schematic diagram illustrating an exploded structure of a heat dissipation device according to an embodiment of the present invention.

Fig. 5 is a schematic diagram of an exploded structure of a heat dissipation device according to an embodiment of the present invention.

Fig. 6 is a schematic structural diagram of a cooling portion of the heat dissipation device according to the embodiment of the present invention.

Fig. 7 is a schematic diagram of an exploded structure of a heat dissipation device according to an embodiment of the present invention.

Fig. 8 is a fourth schematic structural diagram of the heat dissipation device according to the embodiment of the present invention.

Fig. 9 is a schematic view of a partially enlarged view of a region M of the heat sink provided in fig. 8.

Fig. 10 is a first partial schematic structural diagram of a heat dissipation device according to an embodiment of the present invention.

Fig. 11 is a schematic partial structural diagram of a heat dissipation device according to an embodiment of the present invention.

Fig. 12 is a schematic partial structural diagram of a heat dissipation device according to an embodiment of the present invention.

Fig. 13 is a schematic structural diagram of a heat pipe of the heat dissipation device according to the embodiment of the present invention.

Fig. 14 is a schematic structural diagram of a heat dissipation device according to an embodiment of the present invention.

Fig. 15 is a schematic structural diagram of a projection apparatus according to an embodiment of the present invention.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without inventive effort based on the embodiments of the present invention, are within the scope of the present invention.

The description of illustrative embodiments in accordance with the principles of the invention is intended to be read in connection with the accompanying drawings, which are to be considered part of the entire written description. In describing the embodiments of the invention disclosed, reference to any direction or orientation is intended merely to facilitate explanation and is not intended to limit the scope of the invention in any way. Relative terms (such as "front," "back," "upper," "lower," "side," "outer," "inner," "middle," "inner," "outer," "lower," "upper," "horizontal," "vertical," "above," "below," "up," "down," "top" and "bottom") and derivatives thereof (e.g., "horizontally," "downwardly," "upwardly," etc.) should be construed to refer to the orientation as then described or as shown in the drawing under discussion. These relative terms are for convenience of description only and do not require that the apparatus be constructed or operated in a particular orientation unless otherwise specifically stated. Thus, the invention should not be limited to the exemplary embodiments which illustrate some possible non-limiting combinations of features which may be present alone or in other feature combinations; the scope of protection of the invention is defined by the appended claims.

As presently contemplated, this disclosure describes the best mode or mode of practice of the invention. The present invention is not intended to be understood from the limiting layer, but rather is to be provided as an illustrative example only, in connection with the accompanying drawings, so as to inform those skilled in the art of the advantages and construction of the invention. Like reference characters designate like or similar parts throughout the various views of the drawings.

Referring to fig. 1, 2, 3 and 4, a heat dissipation apparatus 10 provided in an embodiment of the present application is used for dissipating heat of an electronic device 200, and includes a housing 100, a first heat dissipation portion 300, at least one heat pipe 400, a cooling portion 500 and a second heat dissipation portion 600, where the electronic device 200 and the first heat dissipation portion 300 are installed in the housing 100, the first heat dissipation portion 300 and the electronic device 200 are disposed at an interval, one end of the heat pipe 400 extends to be attached to the electronic device 200, the other end of the heat pipe 400 extends to the first heat dissipation portion 300, the cooling portion 500 is installed outside the housing 100, the cooling portion 500 is disposed adjacent to the first heat dissipation portion 300, the second heat dissipation portion 600 is disposed at a side of the cooling portion 500 away from the housing 100, and heat generated by the electronic device 200 can be dissipated through the heat pipe 400, the first heat dissipation portion 300, and the heat pipe 400, The cooling part 500 and the second heat radiating part 600 are conducted from the inside of the case 100 to the outside of the case 100.

Wherein the case 100 may be an aluminum alloy case 100. The electronic device 200 may be a control component of the heat dissipation device 10, including a circuit board of the heat dissipation device 10. The first and second heat sink members 300 and 600 may be heat sinks. The electronic device 200 is located in the housing 100 and mounted at the bottom of the housing 100, the first heat sink 300 is also located in the housing 100, the first heat sink 300 is fixed to the inner side wall of the housing 100, the first heat sink 300 and the electronic device 200 are spaced apart from each other, one end of the heat pipe 400 extends to the attached electronic device 200, and the other end of the heat pipe 400 extends to the first heat sink 300, so that heat generated during the operation of the electronic device 200 can be conducted to the first heat sink 300 through the heat pipe 400. Further, refrigeration portion 500 and second heat sink portion 600 are located outside casing 100, refrigeration portion 500 is close to first heat sink portion 300 and sets up, second heat sink portion 600 is located the one side that refrigeration portion 500 keeps away from first heat sink portion 300, the heat of first heat sink portion 300 can transmit to refrigeration portion 500, then transmit to second heat sink portion 600, thereby realized the heat conduction with electronic device 200 production in casing 100 outside casing 100, the heat of avoiding arouses the problem that the temperature is too high to burn out electronic device 200 in the heat of casing 100 gathers.

Wherein, refrigeration portion 500 can be the semiconductor refrigeration spare, has good refrigeration effect, can form the temperature difference more than 30 degrees centigrade in one side of neighbouring casing 100 and one side of neighbouring second radiating part 600, and the in-process that the heat of casing 100 one side conducts to second radiating part 600 via refrigeration portion 500 promptly, thermal temperature can descend at least 30 degrees centigrade to can play rapid cooling's effect.

In one embodiment, the heat conducting pipe 400 is disposed adjacent to the bottom of the housing 100 relative to the first heat sink 300, that is, the first heat sink 300 is disposed adjacent to the opening of the housing 100 relative to the heat conducting pipe 400, so that heat conducted from the heat conducting pipe 400 can be conveniently conducted to the outside of the housing 100 through the first heat sink 300, thereby helping to accelerate the heat transmission.

The heat dissipating device 10 according to an embodiment of the present invention includes a housing 100, an electronic device 200, a first heat dissipating part 300, at least one heat pipe 400, a cooling part 500, and a second heat dissipating part 600, the electronic device 200 and the first heat sink member 300 are mounted in the housing 100, the first heat sink 300 and the electronic device 200 are spaced apart from each other, one end of the heat pipe 400 extends to be attached to the electronic device 200, the other end of the heat conductive pipe 400 extends to the first heat sink 300, the cooling part 500 is installed outside the housing 100, the refrigeration part 500 is disposed adjacent to the first heat sink part 300, the second heat sink part 600 is disposed at a side of the refrigeration part 500 away from the housing 100, the heat generated from the electronic device 200 may be conducted from the inside of the housing 100 to the outside of the housing 100 through the heat conductive pipe 400, the first heat sink member 300, the cooling member 500, and the second heat sink member 600. The heat near the electronic device 200 is conducted to the first heat sink 300 through the heat pipe 400, and then the heat is conducted from the inside of the housing 100 to the outside of the housing 100 through the first heat sink 300, the cooling portion 500, and the second heat sink 600, thereby achieving an effect of dissipating the heat of the electronic device 200.

Referring to fig. 5, the refrigeration part 500 includes a plurality of refrigeration members 510, the plurality of refrigeration members 510 are arranged outside the housing 100 in an array, the plurality of refrigeration members 500 cover the area where the first heat dissipation part 300 is located, and the second heat dissipation part 600 is attached to the plurality of refrigeration members 500.

Wherein, several means at least two, i.e. two or more. The refrigeration pieces 510 may be fixed to the outside of the housing 100 through a glue, or may be fixed to the outside of the housing 100 through fixing members such as screws and rivets, and the plurality of refrigeration pieces 510 are arranged in an array on the outside of the housing 100 so as to uniformly transfer heat to the housing 100. And the plurality of cooling members 510 cover an area corresponding to the first heat sink member 300, so that heat at the first heat sink member 300 can be conducted to the outside of the housing 100. The second heat dissipation part 600 is located the one side that the refrigeration part 500 deviates from the casing 100, and a plurality of refrigeration piece 510 is laminated in the second heat dissipation part 600 to in with the even conduction of heat to the second heat dissipation part 600 on the first heat dissipation part 300, be about to the inside heat conduction of casing 100 to the casing 100 outside, play and carry out radiating effect to electronic device 200.

In one embodiment, all the cooling members 510 are uniform in size, so that heat inside the casing 100 can be uniformly conducted to the outside of the casing 100, thereby achieving a uniform heat dissipation effect on the electronic device 200.

Referring to fig. 6, in another embodiment, the volume of the refrigeration element 510 located at the middle portion a is larger than the volume of the refrigeration element 510 located at the edge portion B, and since the distance between the middle portion a corresponding to the sidewall of the casing 100 and the electronic device 200 is shorter, the temperature in the area is higher, the volume of the refrigeration element 510 located at the middle portion a of the sidewall of the casing 100 is larger, and the volume of the refrigeration element 510 located at the edge portion B of the sidewall of the casing 100 is smaller, so that the middle portion a of the sidewall of the casing 100 can be rapidly cooled, and the deformation of the casing 100 caused by the over-high local temperature of the middle portion a of the sidewall of the casing 100 is avoided, thereby affecting the normal use function of the electronic device 200.

With reference to fig. 7, the first heat dissipating portion 300 includes a first connecting plate 310 and a plurality of first heat dissipating fins 320, the plurality of first heat dissipating fins 320 are spaced apart from each other on the first connecting plate 310, the first connecting plate 310 is detachably connected to the housing 100, the plurality of first heat dissipating fins 320 are disposed adjacent to the electronic device 200 with respect to the first connecting plate 310, the second heat dissipating portion 600 includes a second connecting plate 610 and a plurality of second heat dissipating fins 620, the plurality of second heat dissipating fins 620 are spaced apart from each other on the second connecting plate 610, the second connecting plate 610 is detachably connected to the housing 100, and the plurality of second heat dissipating fins 620 are away from the housing 100 with respect to the second connecting plate 610.

Specifically, a plurality of first fins 320 are arranged on first connecting plate 310 in an array, first connecting plate 310 is detachably connected to the inside wall of casing 100, a plurality of second fins 620 is arranged on second connecting plate 610 in an array, second connecting plate 610 is detachably connected to the outside wall of casing 100, and the position of first connecting plate 310 corresponding to casing 100 overlaps at least partially with the position of second connecting plate 610 corresponding to casing 100, can be convenient for transmit the heat in casing 100 to second heat sink 600 through first heat sink 300, so as to carry out rapid cooling to electronic device 200 in casing 100.

Further, the first heat sink 320 is disposed adjacent to the electronic device 200 relative to the first connecting plate 310, the second heat sink 620 is disposed away from the housing 100 relative to the second connecting plate 610, and the first heat sink 320 faces one side of the electronic device 200, so that a contact area between the first heat sink 320 and heat generated by the electronic device 200 can be increased, and heat conduction is accelerated, thereby facilitating rapid cooling of the electronic device 200. The second heat sink 620 is disposed far from the housing 100 relative to the second connection plate 610, which facilitates rapid heat conduction from the second heat sink 620 to the air, thereby achieving rapid heat dissipation.

In one embodiment, the plurality of first heat dissipation fins 320 are integrally formed with the first connection plate 310, that is, the first heat dissipation fins 320 and the first connection plate 310 are formed together in the same process, so that the structural strength of the first heat dissipation part 300 can be enhanced.

In another embodiment, the first heat sink 320 and the first connection plate 310 are separately formed and then connected together by a fixing member, so that the position of the first heat sink 320 on the first connection plate 310 can be flexibly adjusted, the flexibility of the first heat sink 300 is improved, and the heat dissipation effect of the first heat sink 300 is improved.

In yet another embodiment, the volume of each of the first heat dissipation fins 320 is consistent; the volume of the second heat sink 620 located at the middle portion of the second connection plate 610 is larger than the volume of the second heat sink 620 located at the edge portion of the second connection plate 610 in the thickness direction of the heat sink 10.

Specifically, the sizes of all the first heat dissipation fins 320 are kept consistent, and the first heat dissipation fins 320 are uniformly distributed on the first connection plate 310, because the casing 100 is a closed space, the heat conduction function for the electronic device 200 in the casing 100 can be uniform, and the problem that the casing 100 is deformed due to local temperature mutation in the casing 100 is avoided. Since the second heat sink 600 is located in the air and in the circulating space, the volume of the second heat sink 620 located in the middle of the second connecting plate 610 is larger than the volume of the second heat sink 620 located in the edge of the second connecting plate 610 along the thickness direction of the heat sink 10, so that the contact area between the second heat sink 620 and the air can be increased, and the heat dissipation can be accelerated.

With continued reference to fig. 8 and 9, in one embodiment, the distance between two adjacent first heat dissipation fins 320 is greater than the distance between two adjacent second heat dissipation fins 620. The distance between the adjacent first heat dissipation fins 320 is relatively large, so that a relatively large heat dissipation space can be provided for heat generated by the electronic device 200, and the heat is further conducted to the second heat dissipation part 600 through the first heat dissipation part 300, the housing 100 and the cooling part 500, so that the electronic device 200 can be rapidly cooled. And the distance between the adjacent second heat dissipation fins 620 is set to be smaller, so that the contact area between the second heat dissipation fins 620 and the air can be increased, and the heat dissipation effect of the heat dissipation device 10 can be further improved.

Still referring to fig. 10, the heat conducting pipe 400 includes a first portion 410 and a second portion 420 connected by bending, the first portion 410 is attached to the first side 200a of the electronic device 200, the second portion 420 extends to a region adjacent to the first heat sink 300, and an included angle formed between the first portion 410 and the second portion 420 ranges from 85 ° to 95 °.

Specifically, the electronic device 200 has a first side 200a, the first portion 410 of the heat pipe 400 is attached to the first side 200a, and the second portion 420 of the heat pipe 400 extends to the area of the first heat sink 300, so that heat generated by the electronic device 200 can be conducted to the first heat sink 300 by bending the first portion 410 and the second portion 420 connected to each other.

Further, the angle between the extending direction of the first portion 410 and the extending direction of the second portion 420 ranges from 85 ° to 95 °. In one embodiment, the first portion 410 and the second portion 420 are orthogonal to each other, which can facilitate heat generated by the electronic device 200 to be conducted to the first heat sink 300 through the heat conductive pipe 400.

With reference to fig. 11, further, a cooling medium 401 is disposed in the heat conducting pipe 400, the cooling medium 401 may be a solid medium or a flowable liquid medium, and the cooling medium 401 in the heat conducting pipe 400 can accelerate heat conduction and accelerate cooling of the heat, which is helpful for rapidly conducting heat from one side of the electronic device 200 to the first heat sink 300. The cooling medium 401 may be water, oil, liquid nitrogen, or the like.

With reference to fig. 12, the heat conducting pipe 400 includes a third portion 430, a bent portion 440, and a fourth portion 450 connected by bending, the third portion 430 is attached to the second side 200b of the electronic device 200, the fourth portion 450 extends to a region adjacent to the first heat sink 300, and the third portion 430 and the fourth portion 450 are parallel to each other.

In an embodiment, the bending portion 440 is connected between the third portion 430 and the fourth portion 450, the third portion 430 extends into the electronic device 200, and the third portion 430 extends in a ring shape to fit the electronic device 200, so that a heat dissipation path of the third portion 430 in the electronic device 200 can be extended, and an effect of rapidly cooling the electronic device 200 can be achieved. The fourth portion 450 extends to a region adjacent to the first heat sink member 300, and the fourth portion 450 extends in a ring shape to extend a heat dissipation path of the fourth portion 450. In addition, the fourth portion 450 is adjacent to the area where the second heat sink 600 is located, so that the area of the housing 100 corresponding to the first heat sink 300 can be better thermally conductive, and the problem that the temperature on the electronic device 200 is accumulated on the first heat sink 300 and cannot be quickly conducted out is avoided.

Referring to fig. 13, in another embodiment, a cooling member 440a is disposed outside the bent portion 440, the cooling member 440a includes a first cooling jacket 441, a second cooling jacket 442, and a third cooling jacket 443, the first cooling jacket 441, the second cooling jacket 442, and the third cooling jacket 443 are sequentially arranged at intervals in the extending direction of the bent portion 440, the first cooling jacket 441 is disposed adjacent to the electronic device 200 relative to the third cooling jacket 443, the length of the first cooling jacket 441 is greater than that of the second cooling jacket 442, and the length of the second cooling jacket 442 is greater than that of the third cooling jacket 443.

Specifically, in order to facilitate rapid heat conduction from the heat pipe 400, a cooling member 440a is disposed at an outer side of the bent portion 440, the cooling member 440a includes a first cooling jacket 441, a second cooling jacket 442, and a third cooling jacket 443, the first cooling jacket 441, the second cooling jacket 442, and the third cooling jacket 443 are spaced apart from a side adjacent to the electronic device 200 toward a side adjacent to the first heat sink portion 300 on the bent portion 440, a cooling effect of the cooling member 440a is better than that of the bent portion 440, and heat conduction of the bent portion 440 can be accelerated. The length of the first cooling sleeve 441 is set to be greater than that of the second cooling sleeve 442, and the length of the second cooling sleeve 442 is set to be greater than that of the third cooling sleeve 443, so that the first cooling sleeve 441 is disposed adjacent to the electronic device 200, and the third cooling sleeve 443 is disposed adjacent to the first heat sink 300, because the temperature gradually decreases as heat is transferred from the electronic device 200 to the first heat sink 300, therefore, the length of the first cooling sleeve 441 disposed near the electronic device 200 is the largest, and the length of the third cooling sleeve 443 disposed near the first heat sink 300 is the shortest, and thus, by optimizing the lengths of the cooling sleeves and the arrangement positions of the cooling sleeves on the bending portions 440, the cooling speed of the bending portions 440 can be increased, and heat is prevented from being accumulated at the positions of the electronic device 200.

Further, the distance between the first cooling sleeve 441 and the second cooling sleeve 442 is equal to the distance between the second cooling sleeve 442 and the third cooling sleeve 443, so that the heat can be transmitted more uniformly at the position of the bent portion 440, the heat conduction pipe 400 is prevented from being damaged by sudden change of the heat, and the service life of the heat conduction pipe 400 is prolonged.

With reference to fig. 14, the heat dissipation device 10 further includes a fan 700, the fan 700 is located in a central region of the second heat dissipation portion 600, and the fan 700 is used for dissipating heat conducted by the second heat dissipation portion 600.

Specifically, the fan 700 is located at a side of the second heat dissipation portion 600 away from the refrigeration portion 500, the fan 700 is fixed to the second heat dissipation portion 600 through a fixing member, and the fan 700 corresponds to a central area of the second heat dissipation portion 600, so that heat generated by the second heat dissipation portion 600 is rapidly conducted out, and a rapid heat dissipation effect is achieved.

With continued reference to fig. 15, an embodiment of the present application further provides a projection apparatus 1, where the projection apparatus 1 includes an optical assembly 20 and the heat dissipation device 10 provided in any of the above embodiments, the optical assembly 20 is electrically connected to the electronic device 200, and the optical assembly 20 projects an optical image toward the outside of the housing 100 under the control of the electronic device 200.

The projection apparatus 1 may be a projector, the electronic device 200 may be a circuit board, the optical assembly 20 has a light source 21 and a projection portion 22, the light source 21 is disposed opposite to the projection portion 22, the light source 21 is electrically connected to the electronic device 200, the light source 21 may generate an optical image under the control of the electronic device 200, and the optical image is projected from the projection portion 22 and displayed on a curtain for a user to watch. Projection device 1 may also include other functional components that are compatible with heat sink 10.

The above embodiments of the present invention are described in detail, and the principle and the implementation of the present invention are explained by applying specific embodiments, and the above description of the embodiments is only used to help understanding the method of the present invention and the core idea thereof; meanwhile, for a person skilled in the art, according to the idea of the present invention, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present invention.

Claims (10)

1. The utility model provides a heat abstractor for electronic device heat dissipation, its characterized in that, heat abstractor includes casing, first radiating part, at least one heat pipe, refrigeration portion and second radiating part, electronic device with first radiating part install in the casing, first radiating part with the electronic device interval sets up, the one end of heat pipe extends to the laminating electronic device, the other end of heat pipe extends to first radiating part, refrigeration portion install in outside the casing, just refrigeration portion is close to first radiating part sets up, the second radiating part is located refrigeration portion keeps away from one side of casing, the heat accessible that electronic device produced the heat pipe, first radiating part, refrigeration portion with the second radiating part is followed the casing internal conduction is to outside the casing.

2. The heat dissipation device as claimed in claim 1, wherein the refrigeration portion includes a plurality of refrigeration members, the plurality of refrigeration members are arranged in an array outside the housing, the plurality of refrigeration members cover an area where the first heat dissipation portion is located, and the second heat dissipation portion is attached to the plurality of refrigeration members.

3. The heat dissipating device of claim 1, wherein said first heat dissipating portion comprises a first connecting plate and a plurality of first heat dissipating fins spaced apart from said first connecting plate, said first connecting plate being removably attached to said housing, said plurality of first heat dissipating fins being positioned adjacent to said electronic component relative to said first connecting plate, said second heat dissipating portion comprises a second connecting plate and a plurality of second heat dissipating fins spaced apart from said second connecting plate, said second connecting plate being removably attached to said housing, said plurality of second heat dissipating fins being spaced apart from said second connecting plate relative to said housing.

4. The heat dissipating device of claim 3, wherein a spacing between two adjacent first fins is greater than a spacing between two adjacent second fins.

5. The heat dissipating device of claim 3, wherein a plurality of said first fins are all of uniform volumetric size; the volume of the second radiating fin positioned at the middle part of the second connecting plate is larger than that of the second radiating fin positioned at the edge part of the second connecting plate along the thickness direction of the radiating device.

6. The heat dissipation device of claim 1, wherein the heat pipes comprise a first portion and a second portion connected by a bend, the first portion is attached to a first side of the electronic device, the second portion extends to an area adjacent to the first heat dissipation portion, and an included angle between the first portion and the second portion ranges from 85 ° to 95 °.

7. The heat dissipation device as claimed in claim 1, wherein the heat pipe comprises a third portion, a bent portion and a fourth portion connected by bending, the third portion is attached to the second side of the electronic device, the fourth portion extends to a region adjacent to the first heat dissipation portion, and the third portion and the fourth portion are parallel to each other.

8. The heat sink of claim 6 or 7, wherein the heat pipe is disposed proximate the bottom of the housing relative to the first heat sink piece.

9. The heat sink of any one of claims 1-8, further comprising a fan located in a central region of the second heat sink portion, the fan configured to dissipate heat conducted by the second heat sink portion.

10. A projection apparatus comprising an optical assembly and the heat sink of any of claims 1-9, the optical assembly being electrically connected to the electronics, the optical assembly projecting an optical image toward the exterior of the housing under control of the electronics.

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