CN110662403A - Jet cooling device for array turbulence column - Google Patents

Abstract

The invention discloses an array turbulence column jet cooling device, and belongs to the technical field of radiators. The cooling device is provided with a shell, a cooling working medium inlet, a cooling working medium outlet and a turbulence column array. The front half section of the cooling device is provided with a plurality of rows of rectangular channels, the intervals of the channels are the same, and the rear half section is provided with a turbulence column array which is arranged along the central symmetry. By using the jet flow impact cooling technology, gas or liquid is directly sprayed onto a cooled or heated surface through a rectangular nozzle (inlet) under the action of pressure difference, the flow path is short, and a flow boundary layer on the impacted surface is thin, so that a region directly impacted generates a strong heat exchange effect. The rear half section of the cooling device is provided with the turbulence column array, so that the heat exchange area between the device and fluid is increased, a flow boundary layer formed in a flow channel is damaged, and the disturbance in the flow is increased, thereby further achieving the effect of strengthening heat exchange and greatly improving the temperature equalization effect of the cooling device.

Description

An array spoiler column jet cooling device

technical field

The invention belongs to the field of heat dissipation devices, and relates to a jet impact cooling device.

Background technique

With the advancement of microelectronics technology, the development of miniaturization and miniaturization of electronic devices has been promoted. The reduction of the size of electronic devices has also greatly increased the heat flux density of electronic devices, which puts forward more stringent requirements for the heat dissipation of microelectronic devices. Therefore, effectively solving the heat dissipation problem of high heat flux density has become a key technology that must be solved in the development of electronic equipment.

Traditional air natural convection is gradually replaced by forced air convection and liquid convection cooling technology, but it still cannot fully meet the heat dissipation requirements of large-scale integrated circuits. As a typical means of enhancing heat exchange, jet impingement is widely used in various engineering applications. Jet impingement refers to the impingement flow of the jet on the solid wall or liquid surface, that is, the gas or liquid is sprayed vertically (or at a certain angle) through a circular or slit-shaped nozzle to the cooled or heated surface under the action of the pressure difference. . Because the fluid directly impacts the surface to be cooled or heated, the flow is short and the flow boundary layer on the impacted surface is thin, so that the directly impacted area has a strong heat transfer effect, which is an extremely effective heat transfer enhancement. method.

One of the effective measures to cool microelectronics is to set the spoiler column in the heat dissipation device. When the cooling medium flows through the turbulent column group, the cooling medium will separate the boundary layer, destroy the formed fluid boundary layer, and then make the laminar bottom layer thinner. The thermal resistance of the laminar bottom layer has a great influence on heat transfer. The thinner the laminar bottom layer is, the smaller the thermal resistance between the fluid and the wall is, and the heat transfer between the fluid and the spoiler column and the upper and lower walls of the cooling channel is enhanced. The vortex generated by the interaction between the spoiler column and the fluid in the cooling channel interacts with the vortex in the flow layer, which will change the structure and strength of the vortex in the flow field, thereby affecting the fluid flow state. The eddy kinetic energy generated by the turbulent column further enhances the disturbance in the flow, which is conducive to the turbulence of the laminar boundary layer of the fluid and the thinning of the laminar bottom layer. Using the jet impingement cooling technology combined with the spoiler column can greatly improve the overall heat exchange effect of the heat sink and improve the temperature uniformity of electronic equipment.

SUMMARY OF THE INVENTION

In order to solve the technical problems in the above background, the present invention provides an array spoiler column jet cooling device, which is provided with a casing, a cooling medium inlet, an outlet and an array of spoiler columns, and the first half of the cooling device is a multi-column rectangular channel. , the channel spacing is the same, and the second half is an array of spoiler columns, which are arranged symmetrically along the center.

Further, the material of the housing is aluminum materials such as 6063 and 6061 aluminum alloys or copper materials.

Further, the only inlet is arranged in the middle of the upper end, and the shape is rectangular.

Further, the two outlets are arranged on both sides of the device, are symmetrically arranged, and have a rectangular shape.

Further, the first half of the cooling device is a multi-column rectangular channel with the same channel spacing, and the second half is an array of spoiler columns, which are symmetrically arranged along the center. times.

Further, the cooling medium enters the heat dissipation device through the inlet, performs shock cooling in the first half of the device, and then reaches the spoiler column array in the second half of the device, and reaches the two ends of the device after fully contacting the spoiler column for heat exchange. Export.

The present invention adopts the above-mentioned technical scheme, and the technical effects that can be achieved are:

The invention provides an array spoiler column jet cooling device, which uses the jet impingement cooling technology, and the cooling medium is sprayed vertically (or at a certain inclination) onto the surface to be cooled through a rectangular nozzle under the action of a pressure difference. Since the fluid directly impacts the surface to be cooled or heated, the flow is short and the flow boundary layer on the impacted surface is thin, resulting in a strong heat transfer effect in the directly impacted area.

The invention provides an array spoiler column jet cooling device, wherein the main body of the flow channel is arranged in a T-shape. The first half of the cooling device is a multi-column rectangular channel, and the second half is an array of spoiler columns. When the fluid passes through the second half of the cooling device, due to the arrangement of the spoiler column array in the second half of the cooling device, the flow boundary layer formed in the flow channel is destroyed, and the disturbance in the flow is increased, thereby further enhancing the effect of heat exchange. The spoiler column array also increases the heat exchange area between the device and the fluid, prolongs the residence time of the fluid in the device, makes full use of the fluid for heat exchange, increases the heat dissipation, and has a better heat dissipation effect.

The advantage of the invention is that it combines the advantages of the jet impingement cooling technology and the spoiler column enhanced heat exchange technology, makes full use of the cooling medium and the device for heat exchange, greatly improves the heat exchange capacity of the cooling device, and improves the uniformity of the cooling device. Warm effect.

Description of drawings

The specific embodiments of the present invention will be described in further detail below with reference to the accompanying drawings.

Figure 1 shows the internal structure of the array spoiler column jet cooling device.

Figure 2 shows a top cross-sectional view of the array spoiler column jet cooling device.

FIG. 3 shows a schematic perspective view of the array spoiler column jet cooling device.

Detailed ways

In order to illustrate the present invention more clearly, the present invention will be further described below with reference to the preferred embodiments and accompanying drawings. Similar parts in the figures are denoted by the same reference numerals. Those skilled in the art should understand that the content specifically described below is illustrative rather than restrictive, and should not limit the protection scope of the present invention.

The present invention provides an array spoiler column jet cooling device, as shown in Figures 1 to 3, comprising: a casing 1, a cooling medium inlet 2 at the upper end of the casing 1, symmetrically arranged in the casing along the center For the two outlets 3 at both ends of the body 1, the multi-row rectangular channels 4 are symmetrically arranged in the first half of both sides of the inlet 2 with the same channel spacing, and the spoiler column arrays 5 are arranged in the second half, symmetrically arranged along the center.

In the present invention, when the heat exchange process is performed, the heat source end is in contact with the lower surface of the device, and the casing 1 acts as a heat conduction medium to transfer heat to the fluid. The fluid is sprayed into the multi-column rectangular channels 4 through the inlet 2, conducts shock cooling and heat exchange in the first half of the device, and then reaches the spoiler column array 5 in the second half of the device, and reaches both ends of the device after fully contacting the spoiler column for heat exchange. The outlet 3.

In a preferred embodiment of the present invention, the device as a whole is a cuboid, the first half of the device is the multi-column rectangular channel 4, the second half is the spoiler column array 5, and the casing 1 has good corrosion resistance and oxidation resistance. sex. Since the spoiler column array 5 is arranged in the second half of the cooling device, the heat exchange area between the device and the fluid increases, the disturbance in the flow increases, and the heat exchange is increased, so that the device has better heat exchange performance. The T-shaped flow channel arrangement is adopted, the fluid enters from the middle jet at the upper end of the device, and the fluid turns to both sides to form two streams of fluid flowing along the multiple rows of rectangular channels 4 on both sides respectively, and then fully contacts with the spoiler column for heat exchange, shortening the flow distance. Greatly improve the temperature uniformity effect of the heat sink.

In a specific embodiment of the present invention, the materials of the casing 1, the multi-column rectangular channels 4 and the spoiler column array 5 are aluminum materials such as 6063 and 6061 aluminum alloys or copper materials, which greatly reduces the heat sink. the quality of.

In a specific embodiment of the present invention, the number of the multi-column rectangular channels 4 and the length of the spoiler column array 5 in the second half of the device can be appropriately adjusted to meet the heat exchange size and heat exchange requirements of a specific heat dissipation object.

The present invention is mainly used for cooling and heat dissipation, but is also suitable for increasing temperature and keeping warm.

Obviously, the above-mentioned embodiments of the present invention are only examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention. Changes or changes in other different forms cannot be exhausted here, and all obvious changes or changes derived from the technical solutions of the present invention are still within the protection scope of the present invention.

Claims (7)

1. An array spoiler column jet cooling device, characterized in that: a housing, a cooling medium inlet, two outlets and two spoiler column arrays are provided, the inlet is located in the middle of the upper end of the device, and the outlet is located in the device At both ends of the cooling device, the first half of the cooling device is a multi-column rectangular channel with the same channel spacing, and the second half is an array of spoiler columns, which are symmetrically arranged along the center. 2 . An array spoiler column jet cooling device according to claim 1 , wherein the material of the casing is aluminum materials such as 6063 and 6061 aluminum alloys or copper materials. 3 . 3. An array spoiler column jet cooling device according to claim 1, wherein the cooling medium is gas or liquid, including air, water, water and ethylene glycol mixture, organic Cooling working fluid nanofluids, etc. 4 . An array spoiler column jet cooling device according to claim 1 , wherein the unique cooling medium inlet is arranged in the middle of the upper end and has a rectangular shape. 5 . 5 . The array spoiler column jet cooling device according to claim 1 , wherein the two cooling medium outlets are arranged at both ends, symmetrically arranged, and rectangular in shape. 6 . 6 . An array spoiler column jet cooling device according to claim 1 , wherein the first half of the cooling device is a multi-column rectangular channel with the same channel spacing, and the second half is a spoiler column array along the center. 7 . Symmetrically arranged, the spoiler column is cylindrical, and the horizontal and vertical spacing of the spoiler column is twice the diameter of the spoiler column. 7. An array spoiler column jet cooling device according to claim 1-6, characterized in that: the main flow channel is arranged in a T-shape, the cooling medium enters the heat dissipation device through the inlet, and the impact cooling is performed in the first half of the device , then reach the spoiler column array in the second half of the device, enhance heat exchange by enhancing flow disturbance, and reach the outlet at both ends of the device after fully contacting the spoiler column for heat exchange.

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