CN110635232A - A dual-polarized microstrip antenna unit with wide-angle wide-band scanning capability - Google Patents
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Abstract
本发明公开了一种适用于宽角、宽带扫描的双极化微带天线单元,属于天线工程技术领域。该天线由叠层贴片层、双极化馈电层和金属底板构成;其中叠层贴片层包含两层PCB板,并使用金属壁作为支撑;馈电层包含水平极化的微带馈线、地面上的十字形耦合槽、垂直极化的非对称带状线馈电,分别设置于三层PCB板上。通过金属壁和金属底板,增大了天线的机械强度和稳定性;金属壁支撑的空气腔体增大了天线带宽,避免了低介电常数PCB板的使用,减少了PCB板层数,从而减小了拼装过程的对齐误差并降低了成本;馈电层避免了盲孔,减小了加工难度、降低了加工成本。仿真和实验结果表明,该天线单元用于相控阵中,可以实现15%的相对带宽,带宽内扫描±45度不出现栅瓣、高副瓣,有源驻波低于2.5,交叉极化低于‑20dB,隔离度在23dB以上。
The invention discloses a dual-polarized microstrip antenna unit suitable for wide-angle and wide-band scanning, and belongs to the technical field of antenna engineering. The antenna consists of a laminated patch layer, a dual-polarized feed layer, and a metal base plate; the laminated patch layer contains two layers of PCB boards, and uses a metal wall as a support; the feed layer contains a horizontally polarized microstrip feeder , the cross-shaped coupling slot on the ground, and the vertically polarized asymmetrical stripline feed are respectively arranged on the three-layer PCB. Through the metal wall and the metal bottom plate, the mechanical strength and stability of the antenna are increased; the air cavity supported by the metal wall increases the bandwidth of the antenna, avoids the use of low dielectric constant PCB boards, and reduces the number of PCB board layers, thereby The alignment error in the assembly process is reduced and the cost is reduced; the feeding layer avoids blind holes, which reduces processing difficulty and processing cost. The simulation and experimental results show that this antenna unit can achieve a relative bandwidth of 15% when used in a phased array, and no grating lobes and high side lobes will appear when scanning ±45 degrees within the bandwidth, the active standing wave is lower than 2.5, and the cross-polarization Below ‑20dB, the isolation is above 23dB.
Description
技术领域technical field
本发明属于天线工程技术领域,涉及一种可以实现宽角、宽带扫描的双极化微带天线单元。The invention belongs to the technical field of antenna engineering, and relates to a dual-polarized microstrip antenna unit capable of realizing wide-angle and wide-band scanning.
背景技术Background technique
双极化天线可以加倍频谱利用率,广泛应用于通信系统,在雷达探测及成像领域,不同极化也可以得到目标的不同成像信息;微带天线具有低剖面、结构简单、加工成本低等优点,然而普通的微带天线带宽仅2%~5%,限制了其应用。在文献“Wide-Bandmicrostrip antenna with an H-shaped coupling aperture”中,使用叠层贴片增大了微带天线带宽;在文献“Dual polarized wide-band aperture stacked patch antennas”中,使用十字形耦合槽和Y字形馈线激励叠层贴片,实现了宽带双极化微带天线。然而,文献中的天线为单天线,尺寸偏大,且没有考察在阵列环境中的扫描特性,不适合作为相控阵天线单元。Dual-polarized antennas can double the spectrum utilization rate and are widely used in communication systems. In the field of radar detection and imaging, different polarizations can also obtain different imaging information of targets; microstrip antennas have the advantages of low profile, simple structure, and low processing cost. , However, the common microstrip antenna bandwidth is only 2% to 5%, which limits its application. In the document "Wide-Bandmicrostrip antenna with an H-shaped coupling aperture", the use of stacked patches increases the bandwidth of the microstrip antenna; in the document "Dual polarized wide-band aperture stacked patch antennas", the use of cross-shaped coupling slots And the Y-shaped feeder excites the laminated patch to realize the broadband dual-polarized microstrip antenna. However, the antenna in the literature is a single antenna, the size is too large, and the scanning characteristics in the array environment are not considered, so it is not suitable as a phased array antenna unit.
在此基础上,文献“A cross-stacked radiating antenna with enhancedscanning performance for digital beamforming multifunction phased-arrayradars”进一步设计了适用于宽角、宽带扫描的相控阵叠层微带天线单元。然而,该天线单元使用了8层介质,且大量使用盲孔。首先增大了加工和拼装误差;其次大量的盲孔和介质层压结构增大了加工的难度和成本,天线层采取了低介电常数的RT/duroid 5880LZ材料,也增大了成本;再次,天线缺少金属骨架,介质材料的机械强度不够。最后,文中并未给出不同扫描角下天线单元的有源驻波随频率变化曲线。On this basis, the document "A cross-stacked radiating antenna with enhancedscanning performance for digital beamforming multifunction phased-arrayradars" further designed a phased array stacked microstrip antenna unit suitable for wide-angle and broadband scanning. However, this antenna unit uses 8 layers of dielectric, and a large number of blind holes are used. Firstly, the processing and assembly errors are increased; secondly, a large number of blind holes and dielectric laminated structures increase the difficulty and cost of processing, and the antenna layer adopts RT/duroid 5880LZ material with low dielectric constant, which also increases the cost; again , the antenna lacks a metal skeleton, and the mechanical strength of the dielectric material is not enough. Finally, the paper does not give the active standing wave versus frequency curve of the antenna unit under different scan angles.
发明内容Contents of the invention
本发明在背景技术的基础上,提出一种机械强度高、加工难度和成本低的双极化微带天线单元,具有宽角、宽带扫描能力。On the basis of the background technology, the present invention proposes a dual-polarized microstrip antenna unit with high mechanical strength, difficult processing and low cost, which has wide-angle and wide-band scanning capabilities.
本发明采用的技术方案为:一种具有宽角宽带扫描能力的双极化微带天线单元,该天线单元包括:从上到下依次层叠的叠层贴片层、双极化馈电层、金属底板;The technical solution adopted by the present invention is: a dual-polarized microstrip antenna unit with wide-angle wide-band scanning capability, the antenna unit includes: a stacked patch layer, a dual-polarized feeding layer, metal floor;
所述叠层贴片层包括:第一叠层贴片、第一PCB板层、第二叠层贴片、第二PCB板层、金属框;所述第一叠层贴片设置于第一PCB板层的上表面,且面积小于第一PCB板层的上表面;所述第二叠层贴片设置于第二PCB板层的上表面,且面积小于第二PCB板层的上表面;所述第二PCB板层镶嵌在金属框内部,第一PCB板层被金属框支撑,使第一PCB板层与第二PCB板层间形成空气腔体层;The laminated patch layer includes: a first laminated patch, a first PCB layer, a second laminated patch, a second PCB layer, and a metal frame; the first laminated patch is arranged on the first The upper surface of the PCB layer, and the area is smaller than the upper surface of the first PCB layer; the second laminate patch is arranged on the upper surface of the second PCB layer, and the area is smaller than the upper surface of the second PCB layer; The second PCB layer is embedded in the metal frame, and the first PCB layer is supported by the metal frame, so that an air cavity layer is formed between the first PCB layer and the second PCB layer;
所述双极化馈电层包括:上到下依次层叠的在第三、第四、第五PCB板层,所述第三PCB板层上表面设置水平极化馈线,所述第四PCB板层内设置十字形耦合槽,所述第五PCB板层上表面设置垂直极化馈线;The dual-polarization feed layer includes: the third, fourth, and fifth PCB layers stacked sequentially from top to bottom, the upper surface of the third PCB layer is provided with a horizontally polarized feeder line, and the fourth PCB layer A cross-shaped coupling groove is arranged in the layer, and a vertically polarized feeder is arranged on the upper surface of the fifth PCB board layer;
所述金属底板上设置有垂直极化馈电探针和水平极化馈电探针,所述垂直极化馈电探针从金属底板出发依次穿过第五PCB板层、第四PCB板层到达第三PCB板层下表面,垂直极化馈电探针穿过第五PCB板层时与设置于第五PCB板层上表面的垂直极化馈线输入端连接;所述水平极化馈电探针从金属底板出发依次穿过第五PCB板层、第四PCB板层、第三PCB板层到达第二PCB板层下表面,水平极化馈电探针穿过第三PCB板层时与设置于第三PCB板层上表面的水平极化馈线输入端连接;A vertically polarized feeding probe and a horizontally polarized feeding probe are arranged on the metal base plate, and the vertically polarized feeding probe starts from the metal base plate and passes through the fifth PCB layer and the fourth PCB layer in sequence. Reaching the lower surface of the third PCB board layer, the vertically polarized feeding probe is connected to the vertically polarized feeder input end arranged on the upper surface of the fifth PCB board layer when passing through the fifth PCB board layer; the horizontally polarized feeding The probe starts from the metal base plate and passes through the fifth PCB layer, the fourth PCB layer, and the third PCB layer to reach the lower surface of the second PCB layer. When the horizontally polarized feed probe passes through the third PCB layer connected to the input end of the horizontally polarized feeder arranged on the upper surface of the third PCB layer;
所述双极化馈电层中设置有一圈金属化过孔,用于包围住水平极化馈线、垂直极化馈线、垂直极化馈电探针、水平极化馈电探针。A ring of metallized via holes is provided in the dual-polarized feeding layer, which is used to surround the horizontally polarized feeding line, the vertically polarized feeding line, the vertically polarized feeding probe, and the horizontally polarized feeding probe.
进一步的,所述水平极化馈线为沿y方向的Y字形微带线,垂直极化馈线为沿x方向的Y字形带状线。Further, the horizontally polarized feeder is a Y-shaped microstrip line along the y direction, and the vertically polarized feeder is a Y-shaped stripline along the x-direction.
进一步的,所述十字形耦合槽的每一个枝节末端都设置有一个宽度大于十字形耦合槽并与之联通的矩形槽;所述十字形耦合槽深度矩形槽相同,且等于第四PCB板层的厚度。Further, each branch end of the cross-shaped coupling groove is provided with a rectangular groove whose width is larger than that of the cross-shaped coupling groove and communicates with it; the depth of the cross-shaped coupling groove is the same as that of the rectangular groove and is equal to that of the fourth PCB layer thickness of.
进一步的,所述金属底板内设置有两个通孔,分别连接水平极化馈电探针、垂直极化馈电探针。Further, two through holes are provided in the metal bottom plate, which are respectively connected to the horizontally polarized feeding probe and the vertically polarized feeding probe.
进一步的,所述第二叠层贴片形状与双极化馈电层中设置的一圈金属化过孔围成的形状大小相同,所述第一叠层贴片位于第二叠层贴片正上方,且面积大于第二叠层贴片。Further, the shape of the second stacked patch is the same size as the shape surrounded by a circle of metallized vias set in the dual-polarization feeding layer, and the first stacked patch is located on the second stacked patch Directly above, and the area is larger than that of the second laminated patch.
进一步的,所述水平极化馈线的包括两部分:“U”型微带线部分和“1”型微带线部分,所述“1”型微带线部分的顶点连接“U”型微带线部分的下底边中点,“1”型微带线部分的底点为输入点。Further, the horizontally polarized feeder line includes two parts: a "U" type microstrip line part and a "1" type microstrip line part, and the apex of the "1" type microstrip line part is connected to the "U" type microstrip line part. The middle point of the bottom edge of the stripline part, and the bottom point of the "1" type microstrip line part is the input point.
本发明采用金属壁和金属底板作为天线骨架,增大了天线的机械强度和稳定性;金属壁支撑起空气腔体,增大天线带宽,避免了低介电常数PCB板的使用,减少了PCB板层数,从而减小了拼装过程的对齐误差并降低了成本;馈电层避免了盲孔,减小了加工难度、降低了加工成本。The invention adopts the metal wall and the metal bottom plate as the antenna skeleton, which increases the mechanical strength and stability of the antenna; the metal wall supports the air cavity, increases the bandwidth of the antenna, avoids the use of low dielectric constant PCB boards, and reduces PCB The number of board layers reduces the alignment error in the assembly process and reduces the cost; the feed layer avoids blind holes, reduces processing difficulty and reduces processing costs.
附图说明Description of drawings
图1为本发明的3D结构示意图。Fig. 1 is a schematic diagram of the 3D structure of the present invention.
图2为无限阵列环境下周期性单元仿真的有源驻波(Active VSWR)随频率变化曲线,其中(a)、(b)图分别为垂直、水平极化的性能。Figure 2 is the active standing wave (Active VSWR) versus frequency curve of the periodic unit simulation in the infinite array environment, where (a) and (b) are the performance of vertical and horizontal polarization respectively.
图3为5×5阵列示意图,图中单元四周的圆柱为拼装过程中的螺钉位置。Figure 3 is a schematic diagram of a 5×5 array, and the cylinders around the unit in the figure are the screw positions during the assembly process.
图4为5×5阵列中心单元水平极化有源驻波随频率变化曲线,其中(a)、(b)、(c)图分别为H面、D面、E面的仿真和测试结果。Figure 4 is the curve of the horizontally polarized active standing wave of the central unit of the 5×5 array as a function of frequency, where (a), (b), and (c) are the simulation and test results of the H plane, D plane, and E plane, respectively.
图5为5×5阵列中心单元双极化端口间传输系数曲线。Fig. 5 is a transmission coefficient curve between dual-polarized ports of the central unit of a 5×5 array.
图6为5×5阵列在4.2GHz的仿真与实测增益方向图,其中(a)、(b)、(c)图依次为中心单元方向图、E面扫描方向图、H面扫描方向图。Figure 6 is the simulated and measured gain pattern of the 5×5 array at 4.2GHz, where (a), (b), and (c) are the central unit pattern, the E-plane scanning pattern, and the H-plane scanning pattern in sequence.
图7为图1的主视图。Fig. 7 is a front view of Fig. 1 .
图8为图1各层结构的平面图。FIG. 8 is a plan view of each layer structure in FIG. 1 .
具体实施方式Detailed ways
本实施例中天线单元结构见图1,天线整体分六层,分别为五层PCB板层10、20、30、40、50和一层金属底板62,厚度依次为0.5mm、1.5mm、0.5mm、0.5mm、3mm、3mm,PCB板介电常数均为2.2;其中10、20层以及金属框22构成叠层贴片层,金属框厚度为5mm,30、40、50层构成馈电层;单元尺寸为40×40mm2。The structure of the antenna unit in this embodiment is shown in Figure 1. The antenna is divided into six layers as a whole, which are five layers of
叠层贴片11、21分别为边长25.5mm、19mm的方形贴片,金属框内壁宽度为38mm。The laminated
水平极化Y字形馈线31主干线和分支线线宽分别为1.59mm、0.45mm,分支线间距6mm,分支线终端距离单元中心6mm;十字形骨状耦合槽41内部细槽长宽分别为8.5mm、0.5mm,y方向槽的终端矩形槽长宽分别为5mm、2.5mm,x方向槽的终端矩形槽长宽分别为5mm、2mm;垂直极化Y字形馈线51主干线和分支线线宽分别为1.59mm、0.45mm,分支线间距7mm,分支线终端距离单元中心6.5mm。Horizontally polarized Y-
金属化过孔43直径为0.8mm,其中一部分环绕带状线馈线围成21×18mm2的矩形区域,相邻间距为1.5mm,另一部分围绕垂直极化馈电探针64、水平极化馈电探针65,距离探针2mm。The metallized via
金属底板内两个通孔66分别在x和y方向中心线上,距离单元边沿5mm,直径2.9mm;馈电采用标准SMA接头,其内芯64、65直径均为1.27mm。The two through-
由图2可知,天线单元在E、H、D面两个极化从0到45度扫描,在3.6~4.2GHz驻波均低于2.5,带宽15%;有限阵列环境下仿真与实测结果也验证了该结论,见图4。It can be seen from Figure 2 that the antenna unit scans from 0 to 45 degrees in the two polarizations of E, H, and D planes, and the standing waves in 3.6-4.2 GHz are all lower than 2.5, and the bandwidth is 15%. This conclusion is verified, see Figure 4.
由图5可知,实测的双极化端口隔离度在23dB以上。It can be seen from Fig. 5 that the measured dual-polarization port isolation is above 23dB.
由图6(a)可知,天线单元最高增益在5dB以上,由此可以计算口径效率在80%以上,交叉极化在-20dB以下,前后比12dB以上;由图6(b)、(c)可知,阵列从0扫描到45度,副瓣电平在-10dB以下,未出现栅瓣。It can be seen from Figure 6(a) that the maximum gain of the antenna unit is above 5dB, from which it can be calculated that the aperture efficiency is above 80%, the cross polarization is below -20dB, and the front-to-back ratio is above 12dB; from Figure 6(b), (c) It can be seen that the array scans from 0 to 45 degrees, the sidelobe level is below -10dB, and no grating lobe appears.
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CN112072294A (en) * | 2020-08-28 | 2020-12-11 | 电子科技大学 | A Broadband, Low Profile, and High Isolation Dual Circularly Polarized Two-Dimensional Wide-Angle Scanning Sparse Array |
CN112117533A (en) * | 2020-08-18 | 2020-12-22 | 北京邮电大学 | Dual-frequency dual-linear polarization phased array antenna and antenna unit |
CN112134013A (en) * | 2020-11-23 | 2020-12-25 | 电子科技大学 | A Broadband Dual-Polarized Phased Array Antenna Based on Dielectric Integrated Cavity |
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