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CN110633781A - 一体模塑的usb设备 - Google Patents

一体模塑的usb设备 Download PDF

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Publication number
CN110633781A
CN110633781A CN201910173979.5A CN201910173979A CN110633781A CN 110633781 A CN110633781 A CN 110633781A CN 201910173979 A CN201910173979 A CN 201910173979A CN 110633781 A CN110633781 A CN 110633781A
Authority
CN
China
Prior art keywords
housing
usb device
semiconductor device
usb
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201910173979.5A
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English (en)
Inventor
T.K.关
P.K.拉伊
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SanDisk Technologies LLC
Original Assignee
Western Digital Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Western Digital Technologies Inc filed Critical Western Digital Technologies Inc
Publication of CN110633781A publication Critical patent/CN110633781A/zh
Pending legal-status Critical Current

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    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
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    • H01R13/46—Bases; Cases
    • H01R13/502—Bases; Cases composed of different pieces
    • H01R13/504—Bases; Cases composed of different pieces different pieces being moulded, cemented, welded, e.g. ultrasonic, or swaged together
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    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/561—Batch processing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07732—Physical layout of the record carrier the record carrier having a housing or construction similar to well-known portable memory devices, such as SD cards, USB or memory sticks
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Abstract

本发明题为“一体模塑的USB设备”。本发明公开了USB设备以及其形成方法。所述USB设备包括诸如SIP模块的半导体设备以及注射模塑在所述半导体设备周围的外壳。

Description

一体模塑的USB设备
背景技术
便携式消费电子器件需求的强劲增长推动了对高容量存储设备的需求。非易失性半导体存储器设备(诸如闪存存储卡)越来越广泛地用于满足对数字信息存储和交换的日益增长的需求。它们的便携性、多功能性和坚固耐用的设计以及它们的高可靠性和大存储容量，使得此类存储器设备非常适合用于多种电子设备中，包括例如数字相机、数字音乐播放器、视频游戏控制台、PDA和蜂窝电话。
同样普遍存在的是用于在设备(诸如上述的那些设备)与其他部件(诸如例如台式计算机等)之间传输信号的通用串行总线(USB)接口。典型的USB存储设备包括耦接到USB连接器的存储器设备(诸如系统级封装(SIP))，该USB连接器能够配合在主机设备的USB插槽内。SIP模块通常包括印刷电路板，其上安装了一个或多个闪存存储器芯片、控制器、无源部件以及有时安装了用于指示何时存取存储器的LED。
常规上，通过将每个SIP模块或其他存储器设备手动地插入到外壳中来制造USB存储设备。该外壳通常可包括覆盖存储器设备的后端的内部塑料外壳以及覆盖存储器设备的前端的金属外壳。这些手动组装步骤降低吞吐量并且增加操作成本。
附图说明
图1是根据本技术的实施方案的用于USB设备的制造工艺的流程图。
图2是根据本发明的实施方案的半导体设备的制造工艺的流程图。
图3是根据本技术的实施方案的在制造期间的半导体设备的顶视图。
图4是根据本技术的实施方案的半导体设备的底视图。
图5是根据本技术的实施方案的半导体设备的边视图。
图6是根据本技术的实施方案的半导体设备的透视图。
图7是根据本技术的实施方案的包括封闭在外壳内的半导体设备的USB设备的透视图。
图8是根据本技术的实施方案的包括以虚线示出的封闭在外壳内的半导体设备的USB设备的透视图。
图9是根据本技术的实施方案的包括封闭在外壳内的半导体设备的USB设备的横截面边视图。
图10是根据本技术的一个实施方案的用于封闭半导体设备的模具的分解边视图。
图11是包括封闭的半导体裸芯和坯件的USB设备的透视图。
图12是在面板上制造的多个USB设备的透视图。
图13是本技术的另外一个实施方案的分解透视图，其中SIP模块根据SD卡标准封闭在模塑顶盖和底盖中以形成半导体设备。
具体实施方式
现在将参考涉及一体模塑USB设备的附图来描述实施方案。USB设备可包括模塑到保护外壳中的存储器设备，诸如SIP模块。可将多个存储器设备一起模塑在面板中，然后单切以实现规模经济。可以理解，本技术可体现为许多不同形式并且不应解释为限于本文所阐述的实施方案。相反，提供了这些实施方案，使得本公开将是彻底的和完整的，并且将充分地将本发明传达给本领域的技术人员。实际上，本发明旨在覆盖这些实施方案的另选方案、修改和等同物，这些均包括在由所附权利要求书所限定的本发明的范围和实质内。此外，在本发明的以下详细描述中，给出了许多具体细节，以便提供对本发明的彻底理解。然而，对本领域的普通技术人员将显而易见的是，本发明可在没有这些具体细节的情况下被实施。
本文所用的术语“顶部”和“底部”、“上”和“下”以及“垂直”和“水平”及其形式，如可仅以举例方式和出于示例性目的用于本文，并且不旨在限制技术的描述，因为所引用的项目可在位置和取向上交换。另外，如本文所用，术语“基本上”和/或“约”是指指定的尺寸或参数可在给定应用的可接受的制造公差内变化。在一个实施方案中，可接受的制造公差为给定尺寸的±0.25％。
现在将参见图1和图2的流程图以及图3至图12的视图解释本技术的实施方案。首先参见图1的流程图，可在步骤200中形成存储器设备，诸如SIP模块。步骤200的更多细节在图2的流程图以及图3和图4的顶视图和底视图(这两个视图示出SIP模块100)中示出。可对SIP模块100连同衬底面板上的多个其他模块100一起进行批量处理以实现规模经济。衬底面板上的模块100的行和列的数量可有所差别。
衬底面板以多个衬底102开始(同样，一个此类衬底在图3和图4中示出)。衬底102可为多种不同芯片承载介质，包括印刷电路板(PCB)、引线框或卷带式自动接合(TAB)带。在衬底102是PCB的情况下，衬底可由具有顶部导电层和底部导电层的核心形成。该核心可由各种介电材料诸如例如聚酰亚胺层压板、环氧树脂(包括FR4和FR5)、双马来酰亚胺三嗪(BT)等形成。围绕该核心的导电层可由铜或铜合金、镀覆铜或镀覆铜合金、镀铜的钢或已知用于衬底面板上的其他金属和材料形成。
在步骤220中，在衬底102中并且穿过该衬底形成通孔、引线和焊盘的导电图案。可对衬底102进行钻孔以限定穿孔式通孔104，随后用导电金属镀覆和/或填充这些通孔。然后可形成电迹线106和接触焊盘108的导电图案。所示的通孔104、迹线106和接触焊盘108仅作为示例，并且衬底102可包括比图中所示更多的通孔、迹线和/或接触焊盘，且它们可处于与图中所示不同的位置。可通过多种已知的工艺(包括例如各种光刻工艺)来形成衬底102的顶表面和/或底表面上的导电图案。
SIP模块100还包括USB连接器，在实施方案中，该USB连接器可形成在衬底102的下表面上。因此，在实施方案中，导电图案可还限定连接器引脚110，如图4的底视图所示。另选地，应当理解，连接器引脚110可独立于衬底102形成，并且随后安装在衬底102上。包括SIP模块100的USB设备可被配置为根据多种USB标准中的任何一种来操作，这些USB标准可规定引脚110的数量和位置。在另外的实施方案中，引脚110可设置在衬底102的两个表面上。
再次参见图2，接下来可在步骤224中检查衬底102。该步骤可包括自动光学检查(AOI)。一旦经过检查，就可在步骤226中向衬底施加焊接掩模。在施加焊接掩模之后，可在步骤238中例如用Ni/Au、合金42等以已知的电镀或薄膜沉积工艺来镀覆接触焊盘以及任何其他待焊接在导电图案上的区域。然后衬底102可在步骤230中经受操作测试。在步骤232中，可对衬底进行目视检查(包括例如自动外观检查(AVI)和最终外观检查(FVI))以检查污染、划痕和变色。这些步骤中的一者或多者可省略或以不同次序执行。
假定衬底102通过检查，则接下来可在步骤234中将无源部件120附连到衬底102的顶表面，如图3所示。可利用已知的表面安装和回流工艺，通过到接触焊盘(未示出)的连接将所述一个或多个无源部件120安装在衬底102上并且电偶接到导电图案。无源部件120可包括例如一个或多个电容器、电阻器和/或电感器，尽管也设想了其他部件。可也在回流工艺期间将LED安装到衬底上并且永久附连。该LED可在USB闪存存储器设备的使用期间存取下述闪存存储器时激活。
参见图3的顶视图，接下来可在步骤240中将一个或多个半导体裸芯附连到衬底102的顶表面。图3的实施方案包括闪存存储器裸芯130和控制器裸芯136。存储器裸芯130可为例如闪存存储器芯片，诸如2D NOR或NAND半导体裸芯或3D BiCS(位成本可扩展)半导体裸芯，尽管也设想了其他类型的存储器裸芯。控制器裸芯136可例如为ASIC。图3示出了安装在衬底102上的一对存储器裸芯130和控制器裸芯。然而，存储器裸芯的数量和控制器裸芯的位置在另外的实施方案中可有所差别。
在已将裸芯130、136安装在衬底上之后，可在步骤244中例如经由引线接合138将裸芯电偶接到衬底。应当理解，可通过其他电互连(包括例如穿硅通孔)将裸芯130和/或裸芯136安装到衬底。
在实施方案中，在裸芯130、136耦接到衬底102之后，可在步骤250中将衬底和裸芯包封在模塑料140(图5)中以形成成品SIP模块100。尽管对本发明并不关键，但模塑料140可为环氧树脂，诸如例如可购自住友商事株式会社(Sumito Corp.)或日东电工株式会社(Nitto Denko Corp.)，这两家公司的总部都位于日本。也设想了来自其他制造商的其他模塑料。可根据各种工艺(包括FFT(无压流薄)模塑、传递模塑或注射模塑技术)施加模塑料。在实施方案中，包封的SIP模块100可具有小于1mm的厚度。
连接器引脚110可保持未覆盖且暴露，以使得它们可与主机设备中的端子配合。另外，从图6中可以看出，可在模塑料140中形成凹口144。该凹口用于将SIP模块锁定在模塑外壳内，如下所解释。虽然以上描述涉及SIP模块的形成，但应当理解，在本技术的另外实施方案中，除SIP模块之外的半导体设备和数据存储设备可封闭在外壳内。
正如所指出的，可在含有若干SIP模块100的面板上制造SIP模块100以实现规模经济。在已在步骤250中包封面板上的SIP模块100之后，可在步骤252中从面板单切相应设备以便形成图5和图6的边视图和透视图所示的成品SIP模块100。可通过多种切割方法(包括锯切、水射流切割、激光切割、水导激光切割、干介质切割和金刚石线锯切割)中的任何一种来单切每个模块100。虽然直线切割将限定大致矩形或正方形的模块100，但应当理解，在本发明的另外实施方案中，模块100可具有除矩形和正方形之外的形状。
再次参见图1，在步骤200中形成SIP模块100之后，可在步骤202中将SIP模块100封闭在外壳中以形成成品USB设备。图7、图8和图9分别示出了成品USB设备150的透视图、虚线透视图和横截面视图，该成品USB设备包括封闭在外壳152内的SIP模块。如图所示，模塑外壳152在多个点处接合SIP模块以便将SIP模块100固定在外壳152内。例如，当作为液体注射时，模塑料将流入凹口144中并且填充该凹口。当模塑料固化时，该接合将SIP模块100与外壳150固定在一起。另外，例如可以从图8和图9中看出，外壳152包括从前到后夹住SIP模块100的前唇缘158和后壁160，以及从上到下夹住SIP模块100的基部162和顶部接合表面164。
除了将SIP模块100锁定在外壳内之外，后壁160还提供方便的手指抓握部，从而使USB设备150能够轻松插入到主机设备USB插槽中以及从主机设备USB插槽移除。前唇缘158可还在USB设备150插入到主机设备USB插槽中时保护SIP模块100免于损坏。至少一些USB标准限定USB设备的上表面和/或下表面中形成的一对凹槽。可在形成外壳152时，按照适用的USB标准在外壳152中形成此类凹槽166。
在实施方案中，可将外壳152注射模塑在SIP模块100周围。如图10中示意性地示出，可将SIP模块100安置在包括上模具板170和下模具板172的模具内，在密封该模具时该上模具板和该下模具板在SIP模块周围靠拢。模具板170、172可一起限定模具腔体，该模具腔体包括成品外壳152的形状的轮廓和特征。各种热塑性树脂或热固性聚合物中的任何一种可用于外壳152，诸如例如聚碳酸酯、或聚碳酸酯-丙烯腈丁二烯苯乙烯聚合物(PC-ABS)共混物。在另外的实施方案中，可使用其他材料。
可在压力下将模塑料以液体形式注射到包括SIP模块的模具中，以使得模塑料填充模具内的SIP模块100周围的所有空间。模塑料随后硬化成外壳152，并且可将其从模具移除。虽然这些附图中示出了外壳152的特定构型，但应当理解，在另外的实施方案中，外壳152可具有其他外观，同时保持本文所述的功能和特征。
USB设备包括连接器引脚上方的空间以便与主机设备USB插槽中的引脚块配合。为了在USB设备150中提供该空间，可也在模具内的SIP模块100的表面上提供坯件176，如图10和图11所示。可能的是，SIP模块100上的引脚110可凹进到SIP模块100的表面中。为了确保在注射模塑工艺期间没有液体模塑料迁移到引脚110上，该坯件可包括与USB引脚110的图案和形状匹配的块引脚178的图案。在模塑工艺期间，块引脚178向下安置在USB引脚110的顶部上以保持它们没有模塑料。一旦模塑料硬化，就可移除坯件176以限定SIP模块100上方的中空空间，并且从模具移除USB设备。在另外的实施方案中，坯件176可为模具的一部分。
再次参见图1，一旦形成包括模塑外壳152的USB设备150，就可在步骤208中在外壳152上印刷徽标、版画或其他图形。在一些实施方案中，可能希望在外壳152的至少部分上具有外部电连接器，例如以便接地和静电放电。在此类实施方案中，可在USB设备150的部分上方施加金属或其他电导体。可通过薄膜沉积技术(诸如物理气相沉积)施加这种电导体。如果施加这种电导体，则其可在印刷外壳的步骤208之前或之后施加。
在实施方案中，可单独地制造USB设备150。此类实施方案通过减少处理步骤的数量并且提高处理速度和吞吐量来提供对常规USB制造工艺的改进。在本技术的另外实施方案中，可在多个USB设备150的面板上制造USB设备150。除了减少处理步骤之外，该实施方案还通过提供规模经济来提供对常规USB制造工艺的甚至更大改进。
图12中示出了在面板198上制造多个USB设备150的实施方案。包括板170和172的模具可包括用于多个USB设备150的腔体。可将多个SIP模块100放置在其相应的腔体中，然后将所有这些SIP模块与外壳152注射模塑在一起。一旦从模具移除，单独的USB设备150就可从面板180切割或以其他方式分开。
在上述实施方案中，SIP模块100封闭在根据USB标准配置的外壳内。应当理解，SIP模块100可封闭在根据其他标准配置的外壳内。例如，图13是示出SIP模块100的分解透视图，该SIP模块可放置在包括上模具板260和下模具板262的模具中。可将这些模具板闭合在一起，然后可将各种热塑性树脂或热固性聚合物(诸如上述的那些)中的任何一种注射到模具中。所注射的材料可随后硬化以形成上盖264和下盖266。在该实施方案中，上盖264和下盖266共同符合SD卡标准。在该实施方案中，可以以一定形状形成SIP 100，并且接触焊盘符合SD卡中所用的SIP。应当理解，可通过在其他SIP模块周围的模塑外壳而类似地形成符合其他标准的半导体设备。
概括地说，本技术的实施方案涉及USB设备，其包括：半导体设备；外壳，该外壳模塑在半导体设备周围，使得半导体设备封闭在外壳内，该外壳包括半导体设备上方的空间，该空间被配置为允许USB设备插入到USB设备主机插槽中。
在另一个示例中，本技术涉及USB设备，其包括：半导体设备，该半导体设备包括多个连接器引脚；外壳，该外壳注射模塑在半导体设备周围，该外壳在多个点处接合半导体设备，使得半导体设备固定在该外壳内，该外壳包括所述多个连接器引脚上方的空间，该空间被配置为允许USB设备插入到USB设备主机插槽中。
在另外一个示例中，本技术涉及制造USB设备的方法，其包括：(a)将多个半导体设备放置在模具中；(b)将所述多个半导体设备封闭在模塑料中，该模塑料包括所述多个半导体设备中的每一者上方的空间；以及(c)将封闭的多个半导体设备分成单独的USB设备。
在另一个示例中，本技术涉及USB设备，其包括：半导体设备装置，该半导体设备装置用于存储数据；外壳装置，该外壳装置用于封闭半导体设备，使得半导体设备封闭在外壳内，该外壳装置包括半导体设备上方的空间，该空间被配置为允许USB设备插入到USB设备主机插槽中。
已出于例证和描述的目的提出本发明的上述详细描述。它并非旨在是穷尽的或将本发明限制为所公开的精确形式。根据以上教导内容，很多修改形式和变型形式都是可能的。选择所述实施方案是为了最佳地阐明本发明的原理以及其实际应用，以便由此使得本领域的其他技术人员能够最佳地使用具有适合于所构想的特定用途的各种修改的本发明以及各种实施方案。本发明的范围旨在由所附权利要求书限定。

Claims (20)

1.一种USB设备，包括：
半导体设备；
外壳，所述外壳模塑在所述半导体设备周围，使得所述半导体设备封闭在所述外壳内，所述外壳包括所述半导体设备上方的空间，所述空间被配置为允许所述USB设备插入到USB设备主机插槽中。
2.根据权利要求1所述的USB设备，其中所述外壳包括用于沿第一方向约束所述半导体设备的唇缘和后壁。
3.根据权利要求2所述的USB设备，其中所述外壳包括用于沿与所述第一方向正交的第二方向约束所述半导体设备的基部和支撑表面。
4.根据权利要求2所述的USB设备，其中所述后壁还被配置为被抓握以便将所述USB设备插入到所述USB设备主机插槽中以及从所述USB设备主机插槽移除所述USB设备。
5.根据权利要求1所述的USB设备，其中所述半导体设备包括凹口，并且其中所述外壳接合在所述凹口内以便将所述半导体设备约束在所述外壳内。
6.根据权利要求1所述的USB设备，其中所述外壳由塑料形成。
7.根据权利要求1所述的USB设备，其中所述外壳由聚碳酸酯-丙烯腈丁二烯苯乙烯聚合物共混物形成。
8.根据权利要求1所述的USB设备，还包括向所述外壳的外表面施加的电导体。
9.一种USB设备，包括：
半导体设备，所述半导体设备包括多个连接器引脚；
外壳，所述外壳注射模塑在所述半导体设备周围，所述外壳在多个点处接合所述半导体设备，使得所述半导体设备固定在所述外壳内，所述外壳包括所述多个连接器引脚上方的空间，所述空间被配置为允许所述USB设备插入到USB设备主机插槽中。
10.根据权利要求9所述的USB设备，其中所述多个点包括用于接合所述半导体设备以及沿第一方向约束所述半导体设备的唇缘和后壁。
11.根据权利要求10所述的USB设备，其中所述多个点包括用于接合所述半导体设备以及沿与所述第一方向正交的第二方向约束所述半导体设备的基部和支撑表面。
12.根据权利要求10所述的USB设备，其中所述后壁还被配置为被抓握以便将所述USB设备插入到所述USB设备主机插槽中以及从所述USB设备主机插槽移除所述USB设备。
13.根据权利要求9所述的USB设备，其中所述半导体设备包括凹口，并且其中所述多个点包括填充所述凹口的所述外壳的部分以将所述半导体设备约束在所述外壳内。
14.根据权利要求9所述的USB设备，其中所述半导体设备包括系统级封装。
15.根据权利要求9所述的USB设备，其中所述半导体设备包括多个存储器裸芯。
16.一种制造USB设备的方法，包括：
(a)将多个半导体设备放置在模具中；
(b)将所述多个半导体设备封闭在模塑料中，所述模塑料包括所述多个半导体设备中的每一者上方的空间；以及
(c)将所述封闭的多个半导体设备分成单独的USB设备。
17.根据权利要求16所述的方法，还包括向所述模塑料的外表面施加电导体以便使所述USB设备电接地的步骤。
18.根据权利要求16所述的方法，其中将所述多个半导体设备封闭在模塑料中的所述步骤(b)包括将所述模塑料注射到所述模具中的、在所述多个半导体设备周围的步骤。
19.根据权利要求16所述的方法，其中将所述多个半导体设备封闭在模塑料中的所述步骤(b)包括在多个点处接合所述半导体设备使得所述半导体设备固定在所述外壳内的步骤。
20.一种USB设备，包括：
半导体设备装置，所述半导体设备装置用于存储数据；
外壳装置，所述外壳装置用于封闭所述半导体设备，使得所述半导体设备封闭在所述外壳内，所述外壳装置包括所述半导体设备上方的空间，所述空间被配置为允许所述USB设备插入到USB设备主机插槽中。
CN201910173979.5A 2018-06-22 2019-03-08 一体模塑的usb设备 Pending CN110633781A (zh)

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