CN110625270A - Ultrafast laser processing method - Google Patents
Ultrafast laser processing method Download PDFInfo
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- CN110625270A CN110625270A CN201911071753.0A CN201911071753A CN110625270A CN 110625270 A CN110625270 A CN 110625270A CN 201911071753 A CN201911071753 A CN 201911071753A CN 110625270 A CN110625270 A CN 110625270A
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- frosted
- hard
- filling
- microstructure
- laser
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- 238000003672 processing method Methods 0.000 title claims abstract description 10
- 239000000463 material Substances 0.000 claims abstract description 88
- 238000000034 method Methods 0.000 claims abstract description 30
- 238000012545 processing Methods 0.000 claims abstract description 20
- 239000011521 glass Substances 0.000 claims description 14
- 229920002120 photoresistant polymer Polymers 0.000 claims description 9
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 8
- 238000003698 laser cutting Methods 0.000 claims description 8
- 238000004140 cleaning Methods 0.000 claims description 7
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 claims description 4
- 238000005520 cutting process Methods 0.000 abstract description 28
- 230000007547 defect Effects 0.000 abstract description 4
- 238000013461 design Methods 0.000 abstract description 2
- 238000007781 pre-processing Methods 0.000 abstract description 2
- 230000000694 effects Effects 0.000 description 7
- 239000005337 ground glass Substances 0.000 description 7
- 238000012986 modification Methods 0.000 description 6
- 230000004048 modification Effects 0.000 description 6
- 239000000945 filler Substances 0.000 description 5
- 241000227425 Pieris rapae crucivora Species 0.000 description 4
- 239000005338 frosted glass Substances 0.000 description 4
- 238000010521 absorption reaction Methods 0.000 description 3
- 239000005357 flat glass Substances 0.000 description 2
- 238000009776 industrial production Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000002834 transmittance Methods 0.000 description 2
- 239000012780 transparent material Substances 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 150000001768 cations Chemical class 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000009022 nonlinear effect Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- -1 oxygen ion Chemical class 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention relates to the field of laser processing, in particular to a processing method of ultrafast laser; the method comprises the following steps: filling the frosted surface of the frosted hard and brittle material with a filling material to form a smooth microstructure; ultra-fast laser is adopted to be incident from the filling material to the frosted surface of the frosted hard and brittle material for laser processing; compared with the prior art, the invention designs the ultrafast laser processing method for processing the hard and brittle materials with the frosted surfaces, realizes the cutting of the frosted hard and brittle materials by the ultrafast laser, and further ensures that the upper and lower surfaces after cutting do not have the defects of edge breakage and the like by carrying out the pre-processing of the surface of the frosted hard and brittle materials.
Description
Technical Field
The invention relates to the field of laser processing, in particular to a processing method of ultrafast laser.
Background
The rapid development of the ultra-fast laser (the pulse width is less than 10-12S) technology in recent years is considered as one of the preferable means for processing transparent materials, the ultra-fast laser can carry out internal modification cutting on the materials by virtue of extremely high peak power and nonlinear absorption effect in the action process of the ultra-fast laser on the transparent materials, and the material is not directly removed in the processing process, so that the possibility is provided for realizing efficient and high-quality cutting processing. In the prior art, the internal modification cutting of the transparent hard and brittle material based on the nonlinear absorption effect of the ultrafast laser is practically applied in industrial production by virtue of numerous advantages (such as sapphire substrate LED scribing, panel display screen cutting, high-precision processing of glass cover plates and the like); particularly, the hard and brittle materials with the thickness of several millimeters can be directly subjected to penetration cutting once based on the long focal depth and the small light spot diffraction-free light beam, the cut section roughness is small, the modified layer is uniformly distributed, and the upper surface and the lower surface of the modified layer are free from edge breakage, so that the technology becomes the mainstream application in the field of the current ultrafast laser processing.
Although the cutting of the common flat hard and brittle material can be easily realized by adopting the ultrafast laser, the traditional mechanical processing mode is still used for the cutting processing of the frosted hard and brittle material with completely consistent components; the frosted hard and brittle material is a semitransparent glass with relatively high roughness formed on the surface of a common flat material by other treatment methods, and is widely applied by virtue of the advantages of good privacy protection, high safety degree, remarkable sound insulation effect and the like; due to the existence of the frosted surface microstructure, the cutting beam of the ultrafast laser cannot be completely focused into the material to form a penetrating modified layer, most of the laser is diffusely reflected to the periphery at the interface of air and the microstructure, so that the current mainstream ultrafast laser internal modified cutting methods (such as Gaussian light stealth cutting, laser filamentation cutting, Bessel beam cutting and the like) cannot be applied to the cutting of the frosted glass, the cutting processing cannot be carried out by utilizing the nonlinear effect of the ultrafast laser when the ultrafast laser acts on the ultrafast laser, and the ultrafast laser cannot be applied to actual industrial production.
Therefore, it is very critical to the art to design an ultrafast laser processing method for processing hard and brittle materials with frosted surfaces.
Disclosure of Invention
The technical problem to be solved by the present invention is to provide an ultrafast laser processing method for processing a hard and brittle material with a frosted surface, which overcomes the defect that the existing ultrafast laser cutting method cannot be applied to materials such as frosted glass.
The technical scheme adopted by the invention for solving the technical problems is as follows: the processing method of the ultrafast laser is provided for processing hard and brittle materials with frosted surfaces, and the method preferably comprises the following steps:
filling the frosted surface of the frosted hard and brittle material with a filling material to form a smooth microstructure;
and (3) adopting ultra-fast laser to enter from the filling material to the frosted surface of the frosted hard and brittle material for laser processing.
Wherein, the preferred scheme is that the method also comprises the following steps:
after the micro-structure is filled flatly, the surface of the filled micro-structure is covered with glass.
Wherein, the preferred scheme is that the method also comprises the following steps:
and (3) carrying out early-stage cleaning treatment on the frosted surface of the frosted hard and brittle material before carrying out microstructure leveling and filling on the frosted surface of the frosted hard and brittle material.
The preferred scheme is that the filling material adopts a material with the deviation of the refractive index and the refractive index of the frosted hard and brittle material within a preset deviation range, so as to carry out the smooth filling of the microstructure.
The deviation between the refractive index of the filling material and the refractive index of the frosted hard and brittle material is preferably 0.01-0.03.
Wherein, the preferable scheme is that the microstructure flattening filling material adopts glycol solution.
Preferably, the microstructure planarization filling material is a photoresist material.
The preferred scheme is that after the photoresist material is adopted to carry out microstructure flattening filling on the frosted surface of the frosted hard and brittle material, the photoresist material is subjected to beam irradiation so as to be solidified.
The laser cutting adopts a rapid laser beam with a long focal depth, no diffraction and variable repetition frequency and pulse train output modes.
The preferred scheme is that the wavelength of the rapid laser is 532nm-1064nm, the single pulse energy is 50-200 microjoules, and the dot spacing is 1-5 microns.
Compared with the prior art, the invention has the beneficial effects that the processing method of the ultrafast laser is designed for processing the hard and brittle materials with the frosted surfaces, so that the cutting of the frosted hard and brittle materials by the ultrafast laser is realized, and further, the upper and lower surfaces of the frosted hard and brittle materials after cutting do not have the defects of edge breakage and the like by carrying out the pre-processing of the cutting on the frosted surface of the frosted hard and brittle materials.
Drawings
The invention will be further described with reference to the accompanying drawings and examples, in which:
FIG. 1 is a first schematic flow chart of a method for ultrafast laser cutting of frosted hard and brittle materials according to the present invention;
fig. 2 is a schematic flow chart of a method for ultrafast laser cutting of frosted hard and brittle materials in the present invention.
Detailed Description
The preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings.
As shown in fig. 1-2, the present invention provides a preferred embodiment of a method for ultrafast laser cutting of frosted hard and brittle materials.
A method for ultrafast laser cutting of frosted hard and brittle material, referring to fig. 1, the method comprising the steps of:
s1, adopting a filling material to carry out microstructure leveling filling on the frosted surface of the frosted hard and brittle material;
s2, covering a piece of glass on the surface of the finished microstructure after the microstructure is filled flatly;
and S3, performing laser processing by using ultrafast laser to enter from the filling material to the frosted surface of the frosted hard and brittle material.
Specifically, the method processes the interior of the frosted hard and brittle material to form a uniform modified layer based on the nonlinear absorption effect of ultrafast laser, and breaks through the limitation that the frosted hard and brittle material cannot be directly cut by the ultrafast laser internal modification after filling substances with optical properties close to those of raw materials are combined into an infrared high-light-transmission plane whole body (namely after finishing the smooth filling of a microstructure); further, in order to ensure that the filler is fully attached to and contacted with the micron-sized structure on the surface of the frosted surface and the integral flatness is ensured after the filler is filled, the flatness of the laser incident sheet and the incident beam can enter the frosted glass for modification and cutting, common plate glass with a certain thickness is covered on the surface after the microstructure is filled flatly, and finally, the frosted hard and brittle material is subjected to laser cutting.
Further, with reference to fig. 2, the method further comprises the steps of:
and S0, performing early-stage cleaning treatment on the frosted surface of the frosted hard and brittle material before the microstructure is flattened and filled on the frosted surface.
Specifically, since the filling effect has a significant effect on the cut section shape, after the microstructure is filled flatly, if the cutting is directly performed under the condition that bubbles are generated in the filler and the microstructure on the surface of the ground glass, the obtained section shape is not uniformly distributed (the distribution of the cut section modification layer is not uniform due to slight abnormal refraction generated after the incident beam passes through the filler and the microstructure on the surface of the ground glass), so that in order to prevent bubbles from being generated in the filler and the microstructure on the surface of the ground glass, the ground surface of the hard and brittle material needs to be cleaned in an early stage before the microstructure is flatly filled; furthermore, the surface of the ground glass can be subjected to preliminary treatment to obtain a defect-free flat whole, and the processed and cut section modified layer is uniformly distributed, so that the cutting effect is effectively improved.
The method comprises the following steps of cleaning the surface of the frosted hard and brittle material, wherein the pre-cleaning treatment is carried out on the surface of the frosted hard and brittle material by adopting a cation cleaning machine.
Furthermore, the filling material is a material with the deviation of the refractive index and the refractive index of the frosted hard and brittle material within a preset deviation range, so that the microstructure is smoothly filled, the deviation of the refractive index of the filling material and the refractive index of the frosted hard and brittle material is 0.01-0.03, and after the materials with similar refractive indexes are subjected to flattening filling, the cutting light beams can be ensured to enter the interior of the frosted hard and brittle material and form a modified layer after being focused in a mode of cutting common plate glass, so that the upper surface and the lower surface of the cut material are free from defects such as edge breakage and the like, and the uniform modified layer section is further obtained.
Scheme one
The microstructure flattening filling material adopts glycol solution.
Specifically, a glycol solution with a refractive index of 1.49 and high laser transmittance at a wavelength of 1064 nanometers is selected for smooth filling of a frosted surface microstructure, and in order to ensure that the solution is fully attached and contacted with a surface micron-scale structure, an oxygen ion cleaning machine is firstly adopted for carrying out pretreatment on glass; in order to ensure the flatness of the whole solution after the solution is filled, common white glass with the thickness of 0.2 mm is covered on the surface of the solution, and the white glass and the common white glass are combined into a flat structure under the action of liquid suction, so that the flatness of the laser incident sheet is ensured, and an incident beam can enter the interior of the ground glass to modify and cut the ground glass.
Scheme two
The microstructure flattening filling material is made of a photoresist material.
Specifically, the photoresist with the refractive index of 1.49 and high laser transmittance at the wavelength of 1064 nanometers is selected to perform frosted surface microstructure smooth filling, in order to ensure that the solution is fully attached and contacted with the surface micron-sized structure and the flatness of the whole solution is filled with the solution, after the photoresist is added, common white glass with the thickness of 0.2 millimeter is covered on the surface of the photoresist, the common white glass and the solution are combined into a flat structure whole under the action of liquid suction and UV light irradiation curing, the refractive index can be increased to 1.5 after the UV glue is cured, the flatness of a laser incident sheet is also ensured, and therefore incident beams can enter the interior of the frosted glass to be modified and cut.
The above two schemes are only two specific embodiments in this embodiment, and the microstructure flat filling may also be performed by using any other material which can achieve a deviation between the refractive index and the refractive index of the frosted hard and brittle material of less than or equal to 0.02.
Furthermore, through the adjustment of the prior process parameters and the experience of cutting glass materials, the cutting is carried out by using a long focal depth non-diffraction laser beam (the effective modified focal depth of the common glass material for cutting is more than 2 mm, and the modified focal depth is also more than the total thickness of the ground glass, the filling solution and the glass cover plate assembly) formed by the axicon and the lens system thereof, wherein the cutting laser is ultrafast laser with the wavelength of 532nm-1064nm, the pulse width of 10 picoseconds, the single pulse energy of 50-200 microjoules, the repetition frequency and the variable pulse train output mode, and the point distance is 1-5 microns.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the scope of the present invention, but rather as embodying the invention in a wide variety of equivalent variations and modifications within the scope of the appended claims.
Claims (10)
1. An ultrafast laser processing method for processing hard and brittle materials with frosted surfaces, which is characterized by comprising the following steps:
filling the frosted surface of the frosted hard and brittle material with a filling material to form a smooth microstructure;
and (3) adopting ultra-fast laser to enter from the filling material to the frosted surface of the frosted hard and brittle material for laser processing.
2. The method according to claim 1, characterized in that the method further comprises the steps of:
after the micro-structure is filled flatly, the surface of the filled micro-structure is covered with glass.
3. The method according to claim 1, characterized in that the method further comprises the steps of:
and (3) carrying out early-stage cleaning treatment on the frosted surface of the frosted hard and brittle material before carrying out microstructure leveling and filling on the frosted surface of the frosted hard and brittle material.
4. The method of claim 1, wherein: the filling material is a material with the deviation of the refractive index and the refractive index of the frosted hard and brittle material within a preset deviation range, so that the microstructure is smoothly filled.
5. The method of claim 4, wherein: the deviation between the refractive index of the filling material and the refractive index of the frosted hard and brittle material is 0.01-0.03.
6. The method of claim 4, wherein: the microstructure flattening filling material adopts glycol solution.
7. The method of claim 4, wherein: the microstructure flattening filling material is made of a photoresist material.
8. The method of claim 7, wherein: after the photoresist material is adopted to carry out microstructure leveling filling on the frosted surface of the frosted hard and brittle material, the frosted surface is irradiated by light beams so as to be solidified.
9. The method of claim 1, wherein: the laser cutting adopts a fast laser beam with a long focal depth, no diffraction and variable repetition frequency and pulse train output modes.
10. The method of claim 9, wherein: the wavelength of the rapid laser is 532nm-1064nm, the single pulse energy is 50-200 microjoules, and the dot spacing is 1-5 microns.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201911071753.0A CN110625270A (en) | 2019-11-05 | 2019-11-05 | Ultrafast laser processing method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911071753.0A CN110625270A (en) | 2019-11-05 | 2019-11-05 | Ultrafast laser processing method |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112620971A (en) * | 2020-12-02 | 2021-04-09 | 深圳市杰普特光电股份有限公司 | Laser processing device and laser processing method |
| CN112903622A (en) * | 2021-01-25 | 2021-06-04 | 中国科学院上海光学精密机械研究所 | Device and method for measuring local polymerization degree of multi-photon polymer |
| CN113290325A (en) * | 2021-06-03 | 2021-08-24 | 大族激光科技产业集团股份有限公司 | Laser processing method |
| CN113524473A (en) * | 2021-07-09 | 2021-10-22 | 苏州晶方半导体科技股份有限公司 | Cutting method of optical substrate |
| CN115159828A (en) * | 2022-06-13 | 2022-10-11 | 武汉华工激光工程有限责任公司 | Laser cutting method and system for ground glass |
| CN116699746A (en) * | 2023-07-31 | 2023-09-05 | 北京至格科技有限公司 | Grating cutting and splitting method with grating protection function |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101386112A (en) * | 2007-09-13 | 2009-03-18 | 张立国 | Laser cutting method based on inner carving |
| US7672719B2 (en) * | 2004-02-19 | 2010-03-02 | Vomaris Innovations, Inc. | Batteries and methods of manufacture and use |
| CN102749303A (en) * | 2012-07-14 | 2012-10-24 | 浙江师范大学 | Device and method for measuring refractive index of flat plate type transparent medium |
| CN103223557A (en) * | 2012-01-25 | 2013-07-31 | 株式会社迪思科 | Method for detecting laser beam spot shape and apparatus for detecting laser beam spot shape |
| CN108381043A (en) * | 2018-02-27 | 2018-08-10 | 苏州图森激光有限公司 | A kind of laser processing of the transparent hard brittle material of non-smooth surface |
| CN108941893A (en) * | 2018-09-10 | 2018-12-07 | 杭州银湖激光科技有限公司 | A kind of laser processing and device of non-smooth surface glass |
| CN109514099A (en) * | 2018-12-12 | 2019-03-26 | 武汉华工激光工程有限责任公司 | A kind of laser processing using Bayside light beam cutting frosted fragile material |
| CN109759727A (en) * | 2019-03-21 | 2019-05-17 | 英诺激光科技股份有限公司 | A kind of laser cutting method and system of frosted glass |
-
2019
- 2019-11-05 CN CN201911071753.0A patent/CN110625270A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7672719B2 (en) * | 2004-02-19 | 2010-03-02 | Vomaris Innovations, Inc. | Batteries and methods of manufacture and use |
| CN101386112A (en) * | 2007-09-13 | 2009-03-18 | 张立国 | Laser cutting method based on inner carving |
| CN103223557A (en) * | 2012-01-25 | 2013-07-31 | 株式会社迪思科 | Method for detecting laser beam spot shape and apparatus for detecting laser beam spot shape |
| CN102749303A (en) * | 2012-07-14 | 2012-10-24 | 浙江师范大学 | Device and method for measuring refractive index of flat plate type transparent medium |
| CN108381043A (en) * | 2018-02-27 | 2018-08-10 | 苏州图森激光有限公司 | A kind of laser processing of the transparent hard brittle material of non-smooth surface |
| CN108941893A (en) * | 2018-09-10 | 2018-12-07 | 杭州银湖激光科技有限公司 | A kind of laser processing and device of non-smooth surface glass |
| CN109514099A (en) * | 2018-12-12 | 2019-03-26 | 武汉华工激光工程有限责任公司 | A kind of laser processing using Bayside light beam cutting frosted fragile material |
| CN109759727A (en) * | 2019-03-21 | 2019-05-17 | 英诺激光科技股份有限公司 | A kind of laser cutting method and system of frosted glass |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112620971A (en) * | 2020-12-02 | 2021-04-09 | 深圳市杰普特光电股份有限公司 | Laser processing device and laser processing method |
| CN112903622A (en) * | 2021-01-25 | 2021-06-04 | 中国科学院上海光学精密机械研究所 | Device and method for measuring local polymerization degree of multi-photon polymer |
| CN113290325A (en) * | 2021-06-03 | 2021-08-24 | 大族激光科技产业集团股份有限公司 | Laser processing method |
| CN113290325B (en) * | 2021-06-03 | 2024-02-02 | 大族激光科技产业集团股份有限公司 | Laser processing method |
| CN113524473A (en) * | 2021-07-09 | 2021-10-22 | 苏州晶方半导体科技股份有限公司 | Cutting method of optical substrate |
| CN113524473B (en) * | 2021-07-09 | 2023-10-20 | 苏州晶方半导体科技股份有限公司 | Method for cutting optical substrate |
| CN115159828A (en) * | 2022-06-13 | 2022-10-11 | 武汉华工激光工程有限责任公司 | Laser cutting method and system for ground glass |
| CN115159828B (en) * | 2022-06-13 | 2023-12-15 | 武汉华工激光工程有限责任公司 | Laser cutting method and system for frosted glass |
| CN116699746A (en) * | 2023-07-31 | 2023-09-05 | 北京至格科技有限公司 | Grating cutting and splitting method with grating protection function |
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Application publication date: 20191231 |