TWI762517B - Electrochromic coated glass articles and methods for laser processing the same - Google Patents
Electrochromic coated glass articles and methods for laser processing the same Download PDFInfo
- Publication number
- TWI762517B TWI762517B TW106134567A TW106134567A TWI762517B TW I762517 B TWI762517 B TW I762517B TW 106134567 A TW106134567 A TW 106134567A TW 106134567 A TW106134567 A TW 106134567A TW I762517 B TWI762517 B TW I762517B
- Authority
- TW
- Taiwan
- Prior art keywords
- laser
- glass
- electrochromic
- glass article
- substrate
- Prior art date
Links
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/22—Surface treatment of glass, not in the form of fibres or filaments, by coating with other inorganic material
- C03C17/23—Oxides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
- B23K26/359—Working by laser beam, e.g. welding, cutting or boring for surface treatment by providing a line or line pattern, e.g. a dotted break initiation line
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/0222—Scoring using a focussed radiation beam, e.g. laser
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/04—Cutting or splitting in curves, especially for making spectacle lenses
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/34—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions
- C03C17/36—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal
- C03C17/3602—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal the metal being present as a layer
- C03C17/3668—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal the metal being present as a layer the multilayer coating having electrical properties
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C23/00—Other surface treatment of glass not in the form of fibres or filaments
- C03C23/0005—Other surface treatment of glass not in the form of fibres or filaments by irradiation
- C03C23/0025—Other surface treatment of glass not in the form of fibres or filaments by irradiation by a laser beam
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2217/00—Coatings on glass
- C03C2217/20—Materials for coating a single layer on glass
- C03C2217/21—Oxides
- C03C2217/219—CrOx, MoOx, WOx
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2218/00—Methods for coating glass
- C03C2218/30—Aspects of methods for coating glass not covered above
- C03C2218/32—After-treatment
- C03C2218/328—Partly or completely removing a coating
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Laser Beam Processing (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Electrochromic Elements, Electrophoresis, Or Variable Reflection Or Absorption Elements (AREA)
- Surface Treatment Of Glass (AREA)
- Joining Of Glass To Other Materials (AREA)
Abstract
Description
本申請案主張申請日2016年10月7日的美國申請案第15/288,071號之優先權,上述文獻以其全體引用方式併入於此。This application claims priority to US Application Serial No. 15/288,071, filed on October 7, 2016, which is incorporated herein by reference in its entirety.
本揭示案一般係關於電致變色塗佈玻璃物件,且更特定而言,關於用於雷射處理該等物件的方法。本揭示案亦關於包括使用電致變色層塗佈的玻璃基板之絕緣玻璃單元。The present disclosure relates generally to electrochromic coated glass objects, and more particularly, to methods for laser processing such objects. The present disclosure also relates to insulating glass units including glass substrates coated with electrochromic layers.
在多種應用中,使用電致變色薄膜塗佈的玻璃基板為有用的,包含建築及汽車應用。例如,可使用電致變色薄膜以變化房間或汽車中的光強度及/或光吸收度。絕緣玻璃單元(IGU)可包括帶有周邊密封的兩片玻璃而形成玻璃片之間的空穴,可使用絕緣氣體(例如,氬)來填充該空穴以改良IGU的能級。在某些應用中,可使用電致變色層來塗佈IGU中的玻璃片之其中一者。該等塗佈的IGU可額外地包含一或更多個部件以用於應用電壓至電致變色層(例如,匯流排),因而提供著色效應,而可降低IGU對多種波長及/或熱的傳輸。Glass substrates coated with electrochromic films are useful in a variety of applications, including architectural and automotive applications. For example, electrochromic films can be used to vary the light intensity and/or light absorption in a room or car. An insulating glass unit (IGU) may include two pieces of glass with a perimeter seal to form a cavity between the glass sheets, which may be filled with an insulating gas (eg, argon) to modify the energy level of the IGU. In certain applications, an electrochromic layer may be used to coat one of the glass flakes in the IGU. The coated IGUs may additionally contain one or more components for applying a voltage to the electrochromic layer (eg, busbars), thus providing a coloring effect, which may reduce the IGU's sensitivity to various wavelengths and/or heat transmission.
在IGU或包括電致變色層的任何其他玻璃物件的製造期間,可在切割及研磨步驟之後應用電致變色層至玻璃(導因於該等薄膜對濕度及在該等步驟期間所產生的顆粒的敏感度)。例如,曝露電致變色薄膜於研磨製程期間所使用的水冷卻劑可導致薄膜起泡及/或分解,因而抑制薄膜的功能性及/或美觀品質。因此,針對傳統IGU生產,通常先切割玻璃片至所需IGU形狀及尺寸,接著使用電致變色薄膜來塗佈(「切割及塗佈」),而非使用電致變色薄膜來塗佈大的玻璃基板,接著根據尺寸切割塗佈的基板(「塗佈及切割」)。During the manufacture of an IGU or any other glass article that includes an electrochromic layer, the electrochromic layer can be applied to the glass after the cutting and grinding steps (due to the humidity of the films and the particles generated during these steps) sensitivity). For example, exposing electrochromic films to water coolants used during the polishing process can cause the films to blister and/or decompose, thereby inhibiting the functional and/or aesthetic qualities of the films. Therefore, for traditional IGU production, glass sheets are usually cut to the desired IGU shape and size, and then coated with an electrochromic film ("cut and coated"), rather than using an electrochromic film to coat large Glass substrates, then the coated substrates are diced according to size ("coating and dicing").
然而,由於夾具,「切割及塗佈」製程可導致玻璃基板具有未塗佈或未受電致變色層均勻塗佈的顯著面積。例如,用於在塗佈設備中放置及固定玻璃基板到位的部件可干擾從邊緣至邊緣塗佈玻璃基板的能力。此外,「塗佈及切割」製程可具有減低的製造撓性,因為夾具必須特定於每一玻璃基板形狀及/或尺寸且必須調整以容納不同玻璃形狀及/或尺寸。相對比下,「塗佈及切割」製程可針對大的玻璃基板實行單一標準夾具,且玻璃基板可接著被根據尺寸切割(「塗佈及切割」)。However, due to the jig, the "dicing and coating" process can result in glass substrates with significant areas uncoated or uniformly coated by the electrochromic layer. For example, the components used to place and hold the glass substrate in place in the coating equipment can interfere with the ability to coat the glass substrate from edge to edge. In addition, the "coat and cut" process may have reduced manufacturing flexibility because the fixtures must be specific to each glass substrate shape and/or size and must be adjusted to accommodate different glass shapes and/or sizes. In contrast, a "coat and cut" process can implement a single standard fixture for a large glass substrate, and the glass substrate can then be cut to size ("coat and cut").
據此,提供用於使用電致變色薄膜塗佈產生玻璃基板的方法是有優勢的,該方法不會實質損壞電致變色薄膜及/或不會導致玻璃基板包括未塗佈或非均勻塗佈區域。此外,提供用於製造該等電致變色塗佈玻璃物件的方法為優勢的,該方法可展示增加的製造彈性及/或減低的製造成本,例如,可使用以塗佈具有一般形狀及/或尺寸的玻璃基板及接著切割該玻璃成特定形狀及/或尺寸以用於所需應用的方法。Accordingly, it would be advantageous to provide a method for producing glass substrates using electrochromic film coating that does not substantially damage the electrochromic film and/or does not result in glass substrates including uncoated or non-uniform coatings area. Furthermore, it would be advantageous to provide a method for manufacturing such electrochromic coated glass articles, which method may exhibit increased manufacturing flexibility and/or reduced manufacturing cost, eg, may be used to coat coatings having general shapes and/or A sized glass substrate and then a method of cutting the glass into a specific shape and/or size for a desired application.
在多種實施例中,本揭示案相關於玻璃物件,包括一第一表面,一相對第二表面,及設置於該第二表面的至少一部分上的一電致變色塗佈,其中在應用電壓至該玻璃物件之後,玻璃基板的塗佈部分的第一區域具有一第一可見光傳輸,該第一可見光傳輸小於塗佈部分的第二區域的一第二可見光傳輸。根據一些實施例,可將第一區域著色且在應用電壓之後第二區域可不被著色。在多種實施例中,第一及第二區域可被包括複數個缺陷點或線的輪廓分開,在一些實施例中,當正交地查看第一或第二表面時,缺陷線可為線性或彎曲。根據額外的實施例,當正交地查看第一或第二表面時,第一及/或第二區域可包括玻璃物件上的圖案。In various embodiments, the present disclosure relates to glass articles including a first surface, an opposing second surface, and an electrochromic coating disposed on at least a portion of the second surface, wherein a voltage is applied to After the glass object, the first region of the coated portion of the glass substrate has a first visible light transmission that is less than a second visible light transmission of the second region of the coated portion. According to some embodiments, the first region may be colored and the second region may not be colored after the voltage is applied. In various embodiments, the first and second regions may be separated by a contour comprising a plurality of defect points or lines, and in some embodiments, the defect lines may be linear or linear when viewing the first or second surface orthogonally. bending. According to additional embodiments, the first and/or second regions may comprise patterns on the glass article when viewed orthogonally to the first or second surface.
進一步於此揭露玻璃物件包括一第一表面,一相對第二表面,及設置於實質上全部的第二表面上的電致變色塗佈,其中電致變色塗佈包括接近玻璃物件的至少一個邊緣的雷射損壞周邊區域,該雷射損壞周邊區域具有小於約10 mm、1 mm、或0.1 mm的寬度。進一步於此揭露包括該等玻璃物件的絕緣玻璃單元。It is further disclosed herein that the glass article includes a first surface, an opposing second surface, and an electrochromic coating disposed on substantially all of the second surface, wherein the electrochromic coating includes proximate at least one edge of the glass article of laser-damaged perimeter regions having a width of less than about 10 mm, 1 mm, or 0.1 mm. Insulating glass units comprising such glass objects are further disclosed herein.
在態樣(1)中,本揭示案提供一種電致變色玻璃物件,包括:一玻璃基板,包括一第一表面,一相對第二表面,及一或更多個邊緣,其中該一或更多個邊緣的其中至少一者或更多者包括一雷射修改邊緣;一電致變色塗佈,設置於該第二表面的至少一部分上,及包括至少兩個電性非連續區域,每一電性非連續區域具有一輪廓;及其中該兩個電性非連續區域被一雷射修改非連續線分開,該雷射修改非連續線具有自約0.1μm至約25μm的一寬度。在態樣(2)中,本揭示案提供態樣(1)的電致變色玻璃物件,其中該電致變色塗佈包括氧化鎢。在態樣(3)中,本揭示案提供態樣(1)或(2)的電致變色玻璃物件,其中該等電性非連續區域實質上不受雷射損壞。在態樣(4)中,本揭示案提供態樣(1)至(3)之任一者的電致變色玻璃物件,其中接近該雷射修改非連續線的該玻璃基板的該第二表面實質上不受雷射損壞。在態樣(5)中,本揭示案提供態樣(4)的電致變色玻璃物件,其中該至少兩個電性非連續區域的其中至少一者的該輪廓為非線性。在態樣(6)中,本揭示案提供態樣(1)至(5)之任一者的電致變色玻璃物件,其中該雷射切割非連續為藉由一雷射所形成的一連續線,該雷射具有FWHM下自10-10 至10-15 秒的一脈衝寬度。在態樣(7)中,本揭示案提供態樣(1)至(6)之任一者的電致變色玻璃物件,其中該第二區域包括該第一區域中的一圖案或該第一區域包括該第二區域中的一圖案。在態樣(8)中,本揭示案提供態樣(1)至(7)之任一者的電致變色玻璃物件,其中該玻璃物件包括一玻璃片,該玻璃片具有範圍自約0.1 mm至約10 mm的一厚度。在態樣(9)中,本揭示案提供態樣(1)至(8)之任一者的電致變色玻璃物件,其中該至少兩個電性非連續區域的其中一者包括接近該玻璃基板的該一或更多個邊緣的該第二表面的一區域。在態樣(10)中,本揭示案提供態樣(9)的電致變色玻璃物件,其中接近該玻璃基板的該一或更多個邊緣的該電性非連續區域具有小於約0.1 mm的一寬度。在態樣(11)中,本揭示案提供態樣(9)的電致變色玻璃物件,其中接近該玻璃基板的該一或更多個邊緣的該電性非連續區域包括約5%或更低的該玻璃物件的該塗佈部分。In aspect (1), the present disclosure provides an electrochromic glass object, comprising: a glass substrate including a first surface, an opposite second surface, and one or more edges, wherein the one or more edges At least one or more of the plurality of edges includes a laser modified edge; an electrochromic coating disposed on at least a portion of the second surface and including at least two electrically discontinuous regions, each The electrically discontinuous region has an outline; and wherein the two electrically discontinuous regions are separated by a laser-modified discontinuous line having a width from about 0.1 μm to about 25 μm. In aspect (2), the present disclosure provides the electrochromic glass article of aspect (1), wherein the electrochromic coating comprises tungsten oxide. In aspect (3), the present disclosure provides the electrochromic glass article of aspect (1) or (2), wherein the electrically discontinuous regions are not substantially damaged by the laser. In aspect (4), the present disclosure provides the electrochromic glass article of any one of aspects (1) to (3), wherein the second surface of the glass substrate proximate the laser-modified discontinuous line Virtually impervious to laser damage. In aspect (5), the present disclosure provides the electrochromic glass article of aspect (4), wherein the profile of at least one of the at least two electrically discontinuous regions is non-linear. In aspect (6), the present disclosure provides the electrochromic glass article of any one of aspects (1) to (5), wherein the laser cut discontinuity is a continuous formed by a laser line, the laser has a pulse width from 10-10 to 10-15 seconds at FWHM. In aspect (7), the present disclosure provides the electrochromic glass article of any one of aspects (1) to (6), wherein the second region includes a pattern in the first region or the first region The area includes a pattern in the second area. In aspect (8), the present disclosure provides the electrochromic glass article of any one of aspects (1) to (7), wherein the glass article comprises a glass sheet having a range from about 0.1 mm to a thickness of about 10 mm. In aspect (9), the present disclosure provides the electrochromic glass article of any one of aspects (1) to (8), wherein one of the at least two electrically discontinuous regions includes proximity to the glass an area of the second surface of the one or more edges of the substrate. In aspect (10), the present disclosure provides the electrochromic glass article of aspect (9), wherein the electrically discontinuous region proximate the one or more edges of the glass substrate has a diameter of less than about 0.1 mm a width. In aspect (11), the present disclosure provides the electrochromic glass article of aspect (9), wherein the electrically discontinuous area proximate the one or more edges of the glass substrate comprises about 5% or more lower the coated portion of the glass object.
在態樣(12)中,本揭示案提供一種玻璃物件,包括一第一表面、一相對第二表面、及一電致變色塗佈,該電致變色塗佈設置於實質上全部的該第二表面上,其中該電致變色塗佈包括一雷射損壞周邊區域接近該玻璃物件的至少一個邊緣,該雷射損壞周邊區域具有小於約0.1 mm的一寬度。在態樣(13)中,本揭示案提供態樣(12)的玻璃物件,其中該雷射損壞周邊區域包括約5%或更低的該玻璃物件的該第二表面。在態樣(14)中,本揭示案提供態樣(12)或(13)的玻璃物件,其中該至少一個邊緣具有一線性或彎曲輪廓。在態樣(15)中,本揭示案提供態樣(12)至(14)之任一者的玻璃物件,其中該玻璃物件包括一玻璃片,該玻璃片具有範圍自約0.1 mm至約10 mm的一厚度。在態樣(16)中,本揭示案提供態樣(12)至(15)之任一者的玻璃物件,其中該第二表面的一塗佈部分包括一第一區域及一第二區域,且其中在應用電壓至該玻璃物件之後,該第一區域具有一第一可見光傳輸,該第一可見光傳輸小於該第二區域的一第二可見光傳輸。在態樣(17)中,本揭示案提供態樣(16)的玻璃物件,其中該第一及該第二區域被一非連續線分開,該非連續線包括一或更多個雷射線。在態樣(18)中,本揭示案提供態樣(17)的玻璃物件,其中該輪廓為線性或彎曲。In aspect (12), the present disclosure provides a glass object including a first surface, an opposite second surface, and an electrochromic coating disposed on substantially all of the first surface On both surfaces, wherein the electrochromic coating includes a laser-damaged peripheral region proximate to at least one edge of the glass object, the laser-damaged peripheral region having a width of less than about 0.1 mm. In aspect (13), the present disclosure provides the glass article of aspect (12), wherein the laser damaged perimeter area includes about 5% or less of the second surface of the glass article. In aspect (14), the present disclosure provides the glass article of aspect (12) or (13), wherein the at least one edge has a linear or curved profile. In aspect (15), the present disclosure provides the glass article of any one of aspects (12) to (14), wherein the glass article comprises a glass sheet having a range from about 0.1 mm to about 10 A thickness of mm. In aspect (16), the present disclosure provides the glass article of any one of aspects (12) to (15), wherein a coated portion of the second surface includes a first region and a second region, And wherein after the voltage is applied to the glass object, the first region has a first visible light transmission, and the first visible light transmission is smaller than a second visible light transmission of the second region. In aspect (17), the present disclosure provides the glass article of aspect (16), wherein the first and second regions are separated by a discontinuous line comprising one or more laser lines. In aspect (18), the present disclosure provides the glass article of aspect (17), wherein the profile is linear or curved.
在態樣(19)中,本揭示案提供包括態樣(1)至(11)之任一者的電致變色玻璃物件的絕緣玻璃單元。In aspect (19), the present disclosure provides an insulating glass unit comprising the electrochromic glass article of any one of aspects (1) to (11).
在態樣(20)中,本揭示案提供包括態樣(12)至(18)之任一者的玻璃物件的絕緣玻璃單元。In aspect (20), the present disclosure provides an insulating glass unit comprising the glass article of any of aspects (12)-(18).
將在以下細節描述中提出本揭示案的額外特徵及優點,且部分對發明所屬領域具有通常知識者而言由說明書或藉由實現如此處所描述之方法來理解為顯而易見的,包含以下的詳細描述、申請專利範圍、以及所附圖式。Additional features and advantages of the present disclosure will be set forth in the following detailed description, and in part apparent to those of ordinary skill in the art to which the invention pertains, from the specification or by implementing the methods as described herein, including the following detailed description , the scope of the patent application, and the accompanying drawings.
應理解前述一般描述及以下詳細描述皆呈現本揭示案的多種實施例,且意圖提供用於理解申請專利範圍的本質及特色的概觀或框架。包含所附圖式以提供對本揭示案進一步的理解,且併入及組成本說明書的一部分。圖式圖示了本揭示案的多種實施例,且與描述一同幫助說明本揭示案的原則及操作。It is to be understood that both the foregoing general description and the following detailed description present various embodiments of the disclosure and are intended to provide an overview or framework for understanding the nature and character of the claimed scope. The accompanying drawings are included to provide a further understanding of the present disclosure, and are incorporated in and constitute a part of this specification. The drawings illustrate various embodiments of the disclosure, and together with the description help explain the principles and operation of the disclosure.
可使用一或更多個方法來製造於此揭露的玻璃物件,該等方法為了對材料鑽孔、切割、分開、穿孔、或其他處理的目的而用於在玻璃中產生小的(例如,100、10、或1微米或更小)「孔洞」,可選地,與感應塗佈於玻璃上的電致變色層中的缺陷或非連續性的一或更多個方法組合。在某些實施例中,可將超短(亦即,自10-10 至10-15 秒FWHM的脈衝寬度,例如,奈秒至飛秒)脈衝雷射束(例如,操作於波長如1064、532、355或266 nm)聚焦至高於臨界值的能量密度,使缺陷可產生於玻璃表面處或玻璃內的焦點的區域中。藉由重複該處理,可產生沿著預先決定路徑或輪廓對齊的一系列的雷射感應缺陷。在一些實施例中,雷射感應缺陷線可相距足夠靠近在一起,使得可產生及可選地使用玻璃內的機械弱點的控制區域,以沿著界定的輪廓折斷或分開(機械地或熱性地)材料。例如,在與超短脈衝雷射接觸之後,材料可與第二雷射束(例如,紅外光雷射如二氧化碳(CO2 )雷射,或其他熱應力來源)接觸,以分開玻璃成一或更多個部分。The glass articles disclosed herein may be fabricated using one or more methods for producing small (eg, 100 Å) in glass for the purpose of drilling, cutting, dividing, perforating, or otherwise manipulating the material. , 10, or 1 micron or less) "voids", optionally in combination with one or more methods of sensing defects or discontinuities in the electrochromic layer coated on glass. In certain embodiments, ultrashort (ie, pulse widths from 10-10 to 10-15 seconds FWHM, eg, nanoseconds to femtoseconds) pulsed laser beams (eg, operating at wavelengths such as 1064, 532, 355 or 266 nm) to energy densities above a critical value such that defects can arise at the surface of the glass or in the region of the focal point within the glass. By repeating this process, a series of laser-induced defects can be created that are aligned along a predetermined path or profile. In some embodiments, the laser-induced defect lines can be spaced close enough together that a controlled area of mechanical weakness within the glass can be created and optionally used to break or separate (mechanically or thermally) along a defined contour )Material. For example, after contact with the ultrashort pulse laser, the material can be contacted with a second laser beam (eg, an infrared light laser such as a carbon dioxide ( CO2 ) laser, or other source of thermal stress) to separate the glass into one or more multiple parts.
根據多種實施例,可在玻璃基板中產生一或更多個垂直缺點或缺陷點、一系列的點或線,而可勾畫出最低電阻的輪廓或路徑,可將基板沿著該輪廓或路徑分開以界定所需形狀,其中該輪廓包括複數個缺陷線或區域自第一表面延伸至玻璃基板的相對第二表面。可使用超短脈衝雷射束(例如,脈衝寬度<100 psec;波長≤1064 nm)來照射欲處理基板,該超短脈衝雷射束可聚光成高的長寬比的焦線而穿透全部的或部分的基板厚度。According to various embodiments, one or more vertical defects or defect points, a series of points or lines may be created in the glass substrate, and a contour or path of lowest resistance may be delineated along which the substrate may be separated to define a desired shape, wherein the contour includes a plurality of defect lines or regions extending from the first surface to the opposite second surface of the glass substrate. The substrate to be treated can be irradiated with an ultra-short pulsed laser beam (eg, pulse width < 100 psec; wavelength ≤ 1064 nm) that can be focused into a high aspect ratio focal line to penetrate All or part of the substrate thickness.
在此高能量密度容積內,可經由非線性效應修改基板,該等非線性效應可由高的光強度來觸發。低於此強度臨界值,基板對雷射輻射可為透明,且可不修改基板以產生缺陷線。如此處所使用,當基板吸收度在雷射波長處低於基板深度每毫米約10%(例如,低於約5%或低於約1%)時,基板對雷射波長「實質上透明」。藉由在所需輪廓或路徑上掃描雷射,可在基板中產生一或更多個窄的缺陷線,且輪廓可界定一周邊或形狀及/或塗佈基板的著色或未著色區域,可沿著該周邊或形狀分開玻璃基板。Within this high energy density volume, the substrate can be modified via nonlinear effects that can be triggered by high light intensities. Below this intensity threshold, the substrate may be transparent to laser radiation, and the substrate may not be modified to create defect lines. As used herein, a substrate is "substantially transparent" to a laser wavelength when the substrate absorbance at the laser wavelength is less than about 10% per millimeter of substrate depth (eg, less than about 5% or less than about 1%). By scanning the laser over a desired contour or path, one or more narrow defect lines can be created in the substrate, and the contour can define a perimeter or shape and/or coat colored or uncolored areas of the substrate, which can be The glass substrates are separated along the perimeter or shape.
超短脈衝雷射可在實質上透明的材料中(例如,玻璃)產生多光子吸收度(MPA)。MPA為相同或不同頻率的兩個或更多個光子的同時吸收度,以便將分子自一個狀態(通常為基態)激發至較高能量電子狀態。所涉及的分子的較低及較高狀態之間的能量差異等於該兩個光子能量的總和。MPA(亦稱為感應吸收度)可為第二或第三階處理,例如,較線性吸收度弱幾個數量級。MPA與線性吸收度的差異在於例如感應吸收度的強度可對光強度的平方成比例,因此MPA為非線性光處理。Ultrashort pulse lasers can produce multiphoton absorption (MPA) in substantially transparent materials (eg, glass). MPA is the simultaneous absorption of two or more photons of the same or different frequencies in order to excite a molecule from one state (usually the ground state) to a higher energy electronic state. The energy difference between the lower and upper states of the molecule involved is equal to the sum of the energies of the two photons. MPA (also known as induced absorbance) can be a second or third order process, eg, orders of magnitude weaker than linear absorbance. The difference between MPA and linear absorbance is that, for example, the intensity of induced absorbance can be proportional to the square of the light intensity, so MPA is a nonlinear light processing.
脈衝雷射束可具有一波長,該波長選自基板實質上為透明的例如小於或等於約1064 nm的波長,例如532、355、或266奈米,包含其間所有範圍及子範圍。在一些實施例中,用於脈衝雷射的示範的功率層級範圍可自約25 W至約125 W,或自約50 W至約100 W,包含其間所有範圍及子範圍。根據多種實施例,脈衝雷射束可具有小於10奈秒的脈衝週期,例如約100皮秒。在一些實施例中,脈衝雷射束具有自大於約1皮秒至小於約100皮秒的脈衝週期,例如範圍自約5皮秒至約50皮秒、自約10皮秒至約30皮秒、或自約15皮秒至約20皮秒,包含其間所有範圍及子範圍。在額外的實施例中,脈衝雷射束的脈衝重複率範圍可自約1 kHz至約4 MHz,例如自約10 kHz至約650 MHz、自約50 kHz至約500 MHz、自約100 kHz至約400 MHz、或自約200 kHz至約300 MHz,包含其間所有範圍及子範圍。The pulsed laser beam may have a wavelength selected from wavelengths where the substrate is substantially transparent, eg, less than or equal to about 1064 nm, such as 532, 355, or 266 nm, including all ranges and subranges therebetween. In some embodiments, exemplary power levels for pulsed lasers may range from about 25 W to about 125 W, or from about 50 W to about 100 W, including all ranges and subranges therebetween. According to various embodiments, the pulsed laser beam may have a pulse period of less than 10 nanoseconds, eg, about 100 picoseconds. In some embodiments, the pulsed laser beam has a pulse period from greater than about 1 picosecond to less than about 100 picoseconds, eg, ranging from about 5 picoseconds to about 50 picoseconds, from about 10 picoseconds to about 30 picoseconds , or from about 15 picoseconds to about 20 picoseconds, including all ranges and subranges therebetween. In additional embodiments, the pulse repetition rate of the pulsed laser beam may range from about 1 kHz to about 4 MHz, such as from about 10 kHz to about 650 MHz, from about 50 kHz to about 500 MHz, from about 100 kHz to About 400 MHz, or from about 200 kHz to about 300 MHz, including all ranges and subranges therebetween.
在一些實施例中,脈衝雷射束可操作在單一脈衝模式,或在其他實施例中,可操作在叢發(burst)模式。在後者的實施例中,脈衝叢發可包括兩個或更多個脈衝,如,例如每一叢發3、4、5、10、15、20、25、或更多個脈衝,包含其間所有範圍及子範圍。脈衝叢發中的個別脈衝之間的週期範圍例如可自約1奈秒至約50奈秒,例如自約10奈秒至約30奈秒、或自約20奈秒至約40奈秒,包含其間所有範圍及子範圍。在某些實施例中,脈衝叢發之間的週期範圍可自約1微秒至約20微秒,例如自約5微秒至約10微秒,包含其間所有範圍及子範圍。據此,脈衝雷射束的叢發重複頻率範圍可自約1 kHz至約200 kHz,例如自約20 kHz至約150 kHz、或自約50 kHz至約100 kHz,包含其間所有範圍及子範圍。In some embodiments, the pulsed laser beam may operate in a single pulse mode, or in other embodiments, in a burst mode. In the latter embodiment, a burst of pulses may include two or more pulses, such as, for example, 3, 4, 5, 10, 15, 20, 25, or more pulses per burst, including all in between Ranges and subranges. Periods between individual pulses in a burst of pulses may range, for example, from about 1 nanosecond to about 50 nanoseconds, such as from about 10 nanoseconds to about 30 nanoseconds, or from about 20 nanoseconds to about 40 nanoseconds, including All scopes and subscopes in between. In certain embodiments, the period between bursts of pulses may range from about 1 microsecond to about 20 microseconds, such as from about 5 microseconds to about 10 microseconds, including all ranges and subranges therebetween. Accordingly, the burst repetition frequency of the pulsed laser beam can range from about 1 kHz to about 200 kHz, such as from about 20 kHz to about 150 kHz, or from about 50 kHz to about 100 kHz, including all ranges and subranges therebetween .
在叢發模式中,每一叢發的平均雷射功率範圍可自約每一叢發50μJ至約每一叢發1000μJ,例如自約每一叢發100μJ至約每一叢發750μJ、自約每一叢發200μJ至約每一叢發500μJ、或自約每一叢發250μJ至約每一叢發400μJ,包含其間所有範圍及子範圍。根據額外的實施例,應用至給定材料的平均雷射功率可量測為每mm的材料每一叢發的μJ數,且可例如大於每單元厚度(mm)的給定材料(例如,玻璃)約每一叢發40μJ,例如範圍自約每mm每一叢發40μJ至約每mm每一叢發2500μJ、自約每mm每一叢發100μJ至約每mm每一叢發2000μJ、自約每mm每一叢發250μJ至約每mm每一叢發1500μJ、或自約每mm每一叢發500μJ至約每mm每一叢發1000μJ,包含其間所有範圍及子範圍。例如,可使用每一叢發200μJ的脈衝雷射來處理0.1至0.2 mm厚的Corning Eagle XG® 玻璃基板以給予示範的每mm每一叢發1000至2000μJ的雷射功率。在另一非限定範例中,可使用每一叢發400至700μJ的脈衝雷射來處理0.5至0.7 mm厚的Corning Eagle XG® 玻璃基板以給予示範的每mm每一叢發570至1400μJ的雷射功率。In burst mode, the average laser power per burst may range from about 50 μJ per burst to about 1000 μJ per burst, eg, from about 100 μJ per burst to about 750 μJ per burst, from about 200 μJ per burst to about 500 μJ per burst, or from about 250 μJ per burst to about 400 μJ per burst, including all ranges and subranges therebetween. According to additional embodiments, the average laser power applied to a given material may be measured as μJ per burst of material per mm of material, and may be, for example, greater than the thickness (mm) of a given material (eg, glass) per cell ) about 40 μJ per burst, for example ranging from about 40 μJ per burst per mm to about 2500 μJ per burst per mm, from about 100 μJ per burst per mm to about 2000 μJ per burst per mm, from about 250 μJ per burst per mm to about 1500 μJ per burst per mm, or from about 500 μJ per burst per mm to about 1000 μJ per burst per mm, including all ranges and subranges therebetween. For example, a 0.1 to 0.2 mm thick Corning Eagle XG® glass substrate can be processed using a pulsed laser of 200 μJ per burst to give an exemplary laser power of 1000 to 2000 μJ per burst per mm. In another non-limiting example, a 0.5 to 0.7 mm thick Corning Eagle XG® glass substrate may be processed using a pulsed laser of 400 to 700 μJ per burst to give an exemplary laser of 570 to 1400 μJ per burst per mm radiation power.
根據非限定的實施例中,玻璃基板及脈衝雷射束可相對彼此平移,例如,玻璃基板可相對於脈衝雷射束平移及/或脈衝雷射束可相對於玻璃基板平移,以產生一輪廓。在一個特定實施例中,平移玻璃基板且應用脈衝雷射至該玻璃基板,同時脈衝雷射自身平移。例如,在捲對捲處理中,玻璃基板可非常長(例如幾十米長或更長)且在雷射處理期間實質上連續地平移。雷射以合適速度且沿著合適向量平移以在玻璃基板中產生一或更多個輪廓。基板或雷射之任一者可在該處理期間改變其速度。According to non-limiting embodiments, the glass substrate and the pulsed laser beam can be translated relative to each other, eg, the glass substrate can be translated relative to the pulsed laser beam and/or the pulsed laser beam can be translated relative to the glass substrate to generate a profile . In one particular embodiment, a glass substrate is translated and a pulsed laser is applied to the glass substrate while the pulsed laser itself is translated. For example, in roll-to-roll processing, glass substrates can be very long (eg, tens of meters long or longer) and translated substantially continuously during laser processing. The laser is translated at a suitable speed and along a suitable vector to create one or more contours in the glass substrate. Either the substrate or the laser can change its speed during the process.
輪廓可包括複數個缺陷線,該等缺陷線可追蹤或界定欲產生的形狀之周邊,無論藉由後續的分開或藉由後續的電壓應用(例如,著色)。平移或掃描速度可取決於多種雷射處理參數,包含例如雷射功率及/或重複率。示範的平移或掃描速度範圍可例如自約每秒1 mm至約每秒5000 mm,例如自約每秒100 mm至約每秒4000 mm、自約每秒200 mm至約每秒3000 mm、自約每秒300 mm至約每秒2500 mm、自約每秒400 mm至約每秒2000 mm、或自約每秒500 mm至約每秒1000 mm,包含其間所有範圍及子範圍。The contour can include defect lines that can trace or define the perimeter of the shape to be produced, either by subsequent separation or by subsequent voltage application (eg, coloring). The translation or scan speed may depend on various laser processing parameters including, for example, laser power and/or repetition rate. Exemplary translation or scan speeds can range, for example, from about 1 mm per second to about 5000 mm per second, such as from about 100 mm per second to about 4000 mm per second, from about 200 mm per second to about 3000 mm per second, from about 200 mm per second to about 3000 mm per second. From about 300 mm per second to about 2500 mm per second, from about 400 mm per second to about 2000 mm per second, or from about 500 mm per second to about 1000 mm per second, including all ranges and subranges therebetween.
可變化脈衝雷射束的重複率及/或掃描速度以產生所需的缺陷線之間的週期性(或節距)。在一些實施例中,缺陷線可相距約0.5μm至約25μm,例如自約1μm至約20μm、自約2μm至約15μm、自約3μm至約12μm、自約4μm至約10μm、或自約5μm至約8μm,包含其間所有範圍及子範圍。例如,針對速度每秒300 mm的線性切割(或掃描),缺陷線之間3μm的週期性對應至具有至少100 kHz的叢發重複率的脈衝雷射。相似地,針對每秒600 mm的掃描速度,缺陷線之間3μm的週期性對應至具有至少200 kHz的叢發重複率的脈衝雷射。The repetition rate and/or scan speed of the pulsed laser beam can be varied to produce the desired periodicity (or pitch) between defect lines. In some embodiments, the defect lines may be separated by about 0.5 μm to about 25 μm, such as from about 1 μm to about 20 μm, from about 2 μm to about 15 μm, from about 3 μm to about 12 μm, from about 4 μm to about 10 μm, or from about 5 μm to about 8 μm, including all ranges and subranges therebetween. For example, for a linear cut (or scan) at a speed of 300 mm per second, a periodicity of 3 μm between defect lines corresponds to a pulsed laser with a burst repetition rate of at least 100 kHz. Similarly, for a scan speed of 600 mm per second, a periodicity of 3 μm between defect lines corresponds to a pulsed laser with a burst repetition rate of at least 200 kHz.
此外,缺陷線的尺度可受例如雷射聚焦參數的影響,例如雷射束焦線的長度及/或雷射束焦線的平均點直徑。例如,可使用脈衝雷射以產生具有相對高的長寬比(長度:直徑)的一或更多個缺陷線,使得在一些實施例中,可產生非常薄的、長的缺陷線自第一表面延伸至基板的相對第二表面。原則上,該等缺陷線可藉由單一脈衝雷射來產生,或可使用額外脈衝以增加受影響面積(例如,增加的缺陷線長度及/或寬度)。In addition, the dimensions of the defect lines can be affected by, for example, laser focusing parameters, such as the length of the laser beam focal line and/or the average spot diameter of the laser beam focal line. For example, a pulsed laser can be used to create one or more defect lines with a relatively high aspect ratio (length:diameter), so that in some embodiments, very thin, long defect lines can be created from the first The surface extends to an opposite second surface of the substrate. In principle, the defect lines can be generated by a single pulsed laser, or additional pulses can be used to increase the affected area (eg, increased defect line length and/or width).
如第1A至1B圖中所一般圖示,用於切割包括電致變色層150的玻璃基板130的方法可包括使用脈衝雷射140來產生輪廓或缺點線110,包括欲處理基板中的複數個缺陷線120。例如,缺陷線120可延伸穿過玻璃基板的厚度,例如,大約正交於玻璃片的主要(平坦)表面a、b。儘管可藉由在一個維度中平移玻璃基板130及/或脈衝雷射140來產生線性輪廓(例如圖示於第1A圖中的輪廓110),亦可藉由在兩個維度中平移玻璃基板及/或脈衝雷射來產生彎曲或非線性的輪廓。如第1B圖中所展示,玻璃基板130可接著沿著輪廓110分開,以產生兩個分開部分130a及130b,其中分開的邊緣或表面由輪廓110界定,每一部分包括電致變色層150。As generally illustrated in Figures 1A-1B, a method for cutting a
參考第2A至2B圖,用於雷射處理基板的方法可包含聚焦脈衝雷射束2成沿著束傳播方向定向的雷射束焦線2b。一雷射(未示出)可發射脈衝雷射束2,脈衝雷射束2可具有入射至光學組件6的部分2a。光學組件6可將雷射束的入射部分2a沿著束方向轉換成雷射束焦線2b,雷射束焦線2b可具有長度L及直徑D。基板1可放置於束路徑中以至少部分地與雷射束焦線2b重疊,雷射束焦線2b可因此被引導進入基板1。可放置第一表面1a以面對光學組件6,而可放置相對第二表面1b以背對光學組件6,反之亦然。基板的厚度d可在表面1a及1b之間垂直延伸。Referring to Figures 2A-2B, a method for laser processing a substrate may include focusing a
如第2A圖中所描繪,可對齊基板1以垂直於雷射束及由光學組件6所產生的焦線2b的縱軸。在多種實施例中(如所描繪),焦線2b可在基板1的表面1a之前起始且可不會延伸超過表面1b。當然可使用其他焦線定向,使得焦線2b在表面1a之後起始及/或延伸超過表面1b(未示出)。假設沿著雷射束焦線2b有足夠雷射強度,可藉由非線性多光子或雷射能量的感應吸收來修改雷射束焦線及基板重疊處的面積,強度可藉由聚焦雷射束2於長度l的區段上而產生,亦即,長度l的線焦點。As depicted in FIG. 2A , the
感應吸收可沿著區段2c在基板材料中產生缺陷線形成。在一些實施例中,缺陷線可為微觀系列(例如,100 nm<直徑<10μm)的「孔洞」(亦稱為穿孔或缺陷線)。根據多種實施例,可以幾百kHz的速率產生個別穿孔(每秒幾百千穿孔)。藉由相對彼此平移基板及脈衝雷射,可產生以所需空間分開的相鄰於彼此的該等穿孔(亦稱為週期性或節距)。可視需要選擇缺陷線的週期性以便於基板的分開及/或產生所需著色效應。缺陷線之間示範的週期性範圍可例如自約0.5μm至約25μm,例如自約1μm至約20μm、自約2μm至約15μm、自約3μm至約12μm、自約4μm至約10μm、或自約5μm至約8μm,包含其間所有範圍及子範圍。Inductive absorption may create defect lines in the substrate material along section 2c. In some embodiments, the defect line may be a microscopic series (eg, 100 nm < diameter < 10 μm) “holes” (also known as perforations or defect lines). According to various embodiments, individual perforations may be produced at a rate of several hundred kHz (hundreds of thousands per second). By translating the substrate and the pulsed laser relative to each other, these vias (also called periodicity or pitch) adjacent to each other separated by the desired space can be created. The periodicity of the defect lines can be selected as desired to facilitate separation of the substrates and/or to produce the desired coloring effect. Exemplary periodic ranges between defect lines can be, for example, from about 0.5 μm to about 25 μm, such as from about 1 μm to about 20 μm, from about 2 μm to about 15 μm, from about 3 μm to about 12 μm, from about 4 μm to about 10 μm, or from From about 5 μm to about 8 μm, including all ranges and subranges therebetween.
在某些非限定實施例中,缺陷線可為自第一表面1a延伸至相對第二表面1b的「通孔」或開口通道,例如,延伸跨過基板1的整體厚度d。缺陷線形成亦可延伸跨過基板厚度的一部分,如第2A圖中具有長度L的區段2c所指示。區段2c的長度L因此對應至雷射束焦線2b及基板1之間的重疊長度及最終缺陷線的長度。區段2c的平均直徑D可對應更多或更少於雷射束焦線2b的平均直徑。參考第2B圖,基板1曝露於第2A圖中的雷射束2最終將因雷射能量的感應吸收而膨脹,使得材料中對應的感應張力可導致微裂痕形成。根據多種實施例,感應張力在表面1a處可為最大。In some non-limiting embodiments, the defect line may be a "through hole" or open channel extending from the
如此處所界定,缺陷線的寬度對應至開口通道的內部寬度或玻璃基板中產生的空氣孔洞之直徑。例如,在一些實施例中,缺陷線的寬度範圍可自約0.1μm至約5μm,例如自約0.25μm至約4μm、自約0.5μm至約3.5μm、自約1μm至約3μm、或自約1.5μm至約2μm,包含其間所有範圍及子範圍。在一些實施例中,缺陷線的寬度可與雷射束焦線的平均點直徑一樣大,例如,雷射束焦線的平均點直徑範圍亦可自約0.1μm至約5μm,例如自約0.25μm至約4μm、自約0.5μm至約3.5μm、自約1μm至約3μm、或自約1.5μm至約2μm,包含其間所有範圍及子範圍。在沿著包括複數個缺陷線的輪廓分開玻璃基板的實施例中,可潛在地沿著分開部分的切割邊緣查看缺陷線,且該等區域可具有可與缺陷線的寬度比較的寬度,例如,自約0.1μm至約5μm。As defined herein, the width of the defect line corresponds to the inner width of the open channel or the diameter of the air voids created in the glass substrate. For example, in some embodiments, the width of the defect line may range from about 0.1 μm to about 5 μm, such as from about 0.25 μm to about 4 μm, from about 0.5 μm to about 3.5 μm, from about 1 μm to about 3 μm, or from about 1.5 μm to about 2 μm, including all ranges and subranges therebetween. In some embodiments, the width of the defect line may be as large as the average spot diameter of the laser beam focal line, eg, the average spot diameter of the laser beam focal line may also range from about 0.1 μm to about 5 μm, such as from about 0.25 μm μm to about 4 μm, from about 0.5 μm to about 3.5 μm, from about 1 μm to about 3 μm, or from about 1.5 μm to about 2 μm, including all ranges and subranges therebetween. In embodiments where the glass substrate is divided along a contour that includes a plurality of defect lines, the defect lines can potentially be viewed along the cut edges of the divided portions, and the regions can have a width comparable to the width of the defect lines, eg, From about 0.1 μm to about 5 μm.
可將脈衝雷射束聚焦成具有任何所需長度l的雷射束焦線,可例如取決於選擇的光組件配置而變化該長度。在一些實施例中,雷射束焦線長度範圍例如可自約0.01 mm至約100 mm,例如自約0.1 mm至約50 mm、自約0.5 mm至約20 mm、自約1 mm至約10 mm、自約2 mm至約8 mm、或自約3 mm至約5 mm,包含其間所有範圍及子範圍。在多種實施例中,雷射束焦線長度l可對應於基板的厚度d,可小於厚度d,或可大於基板的厚度d。因此,在一些實施例中,可使用於此揭露的方法以處理或切割多於一個基板,例如兩個或更多個基板的堆疊。根據非限定的實施例,脈衝雷射束可使用單一雷射通過而將玻璃基板的堆疊穿孔上至總厚度約100 mm或更大,例如,自20μm至約200 mm(即使在多個位置中基板之間存在一或更多個空氣空隙的範例中)。例如,可藉由雷射的單一通過來將200個基板的堆疊之每一基板(每一基板為0.5 mm厚)穿孔。例如,每一基板具有電致變色薄膜大約1微米(0.001 mm)厚將使200個該等基板的堆疊為100.2 mm厚(100 mm的玻璃及0.2 mm的電致變色薄膜)。此外,一些實施例可進一步包括光學清晰且允許多層穿孔的玻璃基板之間的額外塗佈及/或保護性材料。該等塗佈包含但不限於SiO2 、Al2 O3 、及有機及無機聚合物,例如矽氧烷。The pulsed laser beam can be focused to a laser beam focal line of any desired length /, which length can vary, eg, depending on the selected optical component configuration. In some embodiments, the laser beam focal length may range, for example, from about 0.01 mm to about 100 mm, such as from about 0.1 mm to about 50 mm, from about 0.5 mm to about 20 mm, from about 1 mm to about 10 mm mm, from about 2 mm to about 8 mm, or from about 3 mm to about 5 mm, including all ranges and subranges therebetween. In various embodiments, the laser beam focal length l may correspond to the thickness d of the substrate, may be less than the thickness d, or may be greater than the thickness d of the substrate. Thus, in some embodiments, the methods disclosed herein may be used to process or cut more than one substrate, such as a stack of two or more substrates. According to non-limiting examples, a pulsed laser beam can perforate stacks of glass substrates up to a total thickness of about 100 mm or more, eg, from 20 μm to about 200 mm (even in multiple locations, using a single laser pass) example in which there are one or more air voids between the substrates). For example, each substrate of a stack of 200 substrates (each substrate 0.5 mm thick) can be perforated by a single pass of the laser. For example, each substrate having an electrochromic film about 1 micron (0.001 mm) thick would make a stack of 200 of these substrates 100.2 mm thick (100 mm glass and 0.2 mm electrochromic film). Additionally, some embodiments may further include additional coating and/or protective materials between the glass substrates that are optically clear and allow for multiple perforations. Such coatings include, but are not limited to, SiO2 , Al2O3 , and organic and inorganic polymers such as siloxanes.
可使用多種方法產生缺陷線或複數個缺陷線。例如,可使用多種裝置以聚焦雷射束以產生雷射束焦線。可例如藉由傳輸Gaussian雷射束進入錐鏡透鏡以產生Gauss-Bessel雷射束剖面來產生雷射束焦線。Gauss-Bessel束可較Gaussian束更慢繞射(例如,相對於幾十微米或更小,可維持範圍上百微米或毫米的單一微米點尺寸)。用於Gauss-Bessel束的聚焦強度的深度或長度可因而遠較Gauss束大。亦可使用或使用光學元件產生其他慢的繞射或非繞射束,例如Airy及Bessel束。美國專利申請案第14/529,520及14/530,457號中提供了用於產生雷射束焦線的示範的光學組件,上述文獻以其全體參考併入於此。可例如使用任何種類的甜甜圈形狀雷射束、球體透鏡、錐鏡透鏡、繞射元件、或任何其他合適的方法或設備來實現聚焦,以形成高強度的線性區域。亦可變化脈衝雷射的類型(例如,皮秒、飛秒等)及/或其波長(例如,IR、UV、綠光等),只要因非線性光學效應產生足夠的強度以產生基板材料的分解。A defective line or a plurality of defective lines can be created using a variety of methods. For example, various devices can be used to focus the laser beam to create the laser beam focal lines. Laser beam focal lines can be generated, for example, by transmitting a Gaussian laser beam into an axicon lens to generate a Gauss-Bessel laser beam profile. Gauss-Bessel beams can diffract more slowly than Gaussian beams (eg, single micron spot sizes in the range of hundreds of microns or millimeters can be maintained as opposed to tens of microns or less). The depth or length of focused intensity for Gauss-Bessel beams may thus be much greater than for Gauss beams. Other slow diffracting or non-diffracting beams, such as Airy and Bessel beams, can also be generated using or using optical elements. Exemplary optical assemblies for generating laser beam focal lines are provided in US Patent Application Nos. 14/529,520 and 14/530,457, which are incorporated herein by reference in their entirety. Focusing can be achieved, for example, using any kind of donut shaped laser beam, spherical lenses, axicon lenses, diffractive elements, or any other suitable method or device to form a linear region of high intensity. The type of pulsed laser (eg, picosecond, femtosecond, etc.) and/or its wavelength (eg, IR, UV, green, etc.) can also be varied, as long as sufficient intensity is generated due to nonlinear optical effects to create a break down.
第3圖圖示一個示範的光學組件6,可使用光學組件6以將脈衝雷射束2聚焦成具有長度l的雷射束焦線2b,且被引導進入具有電致變色層7的玻璃基板1。光學組件6可包含例如錐鏡透鏡3、準直透鏡4、及聚焦透鏡5。可變化光學組件中每一透鏡的聚焦長度以產生具有所需直徑及/或長度的雷射束焦線。例如,聚焦透鏡5可具有一聚焦長度,範圍自約10 mm至約50 mm,例如自約20 mm至約40 mm、或自約25 mm至約30 mm,包含其間所有範圍及子範圍。準直透鏡4可相似地具有聚焦長度,範圍自約50 mm至約200 mm,例如自約75 mm至約150 mm、或自約100 mm至約125 mm,包含其間所有範圍及子範圍。FIG. 3 illustrates an exemplary
在多種非限定實施例中,可使用超短Bessel束(皮秒或飛秒週期)將錐鏡透鏡3併入光學透鏡組件6以產生高的長寬比的高強度區域,例如,無錐度雷射微通道。錐鏡是錐狀切割透鏡,能夠在沿著光軸的線上形成點來源(例如,將雷射束轉換成一環)。錐鏡及其配置對發明所屬領域具有通常知識者為已知,且可例如具有錐角,範圍自約5度至約20度,例如自約10度至約15度,包含其間所有範圍及子範圍。In various non-limiting embodiments, an
錐鏡透鏡3可將具有原始直徑D1(例如,約1至5 mm,例如約2至3 mm)的雷射束聚光成實質上圓柱形狀的高強度區域及高的長寬比(例如,長的長度及小的直徑),具有較小直徑對應至例如第2A圖中所圖示的焦線直徑D。聚光雷射束內所產生的高強度可導致雷射的電磁場及基板的非線性互動,使得雷射能量被傳輸至基板以影響缺陷線的形成。然而,在雷射強度不夠高的基板面積中(例如,環繞中央收斂線的面積),基板可對雷射為透明的,使得不存有用於自雷射傳輸能量至基板材料的機制。因此,在玻璃基板曝露於雷射強度低於非線性臨界值的面積中可以沒有損壞或改變。
在使用脈衝雷射束產生包括複數個缺陷線或穿孔的輪廓之後,可選地,可使用第二雷射束將玻璃基板分開成兩個或更多個部分。可將第二雷射束使用為熱來源以產生繞著輪廓的熱應力區,可將缺陷線置於張力中因而感應分開。第二雷射束可發射玻璃基板非為透明的任何波長,例如紅外光波長,例如,大於約1064 nm。在一些實施例中,第二雷射束可發射大於約5μm的波長,例如大於約10μm的波長。合適的紅外光雷射可包含例如可為經調變或未經調變的CO2 雷射等等。第二雷射束的非限定範例包含但不限於操作於大於約10μm的波長的經調變的CO2 雷射,例如約10.2μm至約10.7μm,或自約10.4μm至約10.6μm,包含其間所有範圍及子範圍。After a pulsed laser beam is used to create a profile including a plurality of defect lines or perforations, a second laser beam can optionally be used to separate the glass substrate into two or more sections. A second laser beam can be used as a heat source to create thermally stressed regions around the profile, the defect lines can be placed in tension and thus induced to separate. The second laser beam may emit any wavelengths where the glass substrate is not transparent, such as infrared wavelengths, eg, greater than about 1064 nm. In some embodiments, the second laser beam may emit wavelengths greater than about 5 μm, such as wavelengths greater than about 10 μm. Suitable infrared lasers may include, for example, CO2 lasers, which may be modulated or unmodulated, and the like. Non-limiting examples of the second laser beam include, but are not limited to, modulated CO2 lasers operating at wavelengths greater than about 10 μm, such as about 10.2 μm to about 10.7 μm, or from about 10.4 μm to about 10.6 μm, including All scopes and subscopes in between.
參考第1A至1B圖,第二雷射束(未示出)可與玻璃基板130的第一表面a接觸且沿著輪廓110平移以將玻璃基板分開成兩個或更多個部分130a、130b。第二表面b可包括背離表面a的電致變色層150,表面a與第二雷射束接觸。第二雷射束可在輪廓110上及周圍產生熱應力的區域,因而感應玻璃基板130沿著輪廓110的分開以產生分開部分130a、130b。Referring to Figures 1A-1B, a second laser beam (not shown) may contact the first surface a of the
在一些實施例中,用於第二雷射束的示範功率層級範圍可自約50 W至約500 W,例如自約100 W至約400 W、自約150 W至約300 W,或自約200 W至約250 W,包含其間所有範圍及子範圍。當以連續(例如,未經調變)模式操作時,第二雷射束可具有較經調變模式操作時更低的功率。例如,連續的第二雷射束可具有功率層級範圍自約50 W至約300 W,而經調變的第二雷射束可具有功率層級範圍自約200 W至約500 W,儘管,個別雷射功率可變化且不限於給定的示範範圍。在額外的實施例中,第二雷射束的平均點直徑範圍可自約1 mm至約10 mm,例如自約2 mm至約9 mm、自約3 mm至約8 mm、自約4 mm至約7 mm,或自約5 mm至約6 mm,包含其間所有範圍及子範圍。第二雷射束所產生的熱可導致輪廓上及/或周圍的熱應力區域,此區域具有微米等級的直徑,例如,小於約20μm,例如範圍自約1μm至約20μm、自約2μm至約15μm、自約3μm至約10μm、自約4μm至約8μm,或自約5μm至約6μm,包含其間所有範圍及子範圍。In some embodiments, exemplary power levels for the second laser beam may range from about 50 W to about 500 W, such as from about 100 W to about 400 W, from about 150 W to about 300 W, or from about 200 W to about 250 W, including all ranges and subranges therebetween. When operating in the continuous (eg, unmodulated) mode, the second laser beam may have a lower power than when operating in the modulated mode. For example, a continuous second laser beam can have power levels ranging from about 50 W to about 300 W, and a modulated second laser beam can have power levels ranging from about 200 W to about 500 W, although individual The laser power can vary and is not limited to the exemplary range given. In additional embodiments, the average spot diameter of the second laser beam may range from about 1 mm to about 10 mm, eg, from about 2 mm to about 9 mm, from about 3 mm to about 8 mm, from about 4 mm to about 7 mm, or from about 5 mm to about 6 mm, including all ranges and subranges therebetween. The heat generated by the second laser beam can result in regions of thermal stress on and/or around the profile having diameters on the order of microns, eg, less than about 20 μm, eg, ranging from about 1 μm to about 20 μm, from about 2 μm to about 2 μm 15 μm, from about 3 μm to about 10 μm, from about 4 μm to about 8 μm, or from about 5 μm to about 6 μm, including all ranges and subranges therebetween.
根據多種實施例,第二雷射束可經調變且可具有小於約200微秒的脈衝週期,例如大於約1微秒至小於約200微秒,例如,範圍自約5微秒至約150微秒、自約10微秒至約100微秒、自約20微秒至約80微秒、自約30微秒至約60微秒、或自約40微秒至約50微秒、,包含其間所有範圍及子範圍。根據多種實施例,經調變的第二雷射束的上升時間可小於約150微秒,例如範圍自約10微秒至約150微秒、自約20微秒至約100微秒、自約30微秒至約80微秒、自約40微秒至約70微秒、或自約50微秒至約60微秒,包含其間所有範圍及子範圍。According to various embodiments, the second laser beam may be modulated and may have a pulse period of less than about 200 microseconds, eg, greater than about 1 microsecond to less than about 200 microseconds, eg, ranging from about 5 microseconds to about 150 microseconds microseconds, from about 10 microseconds to about 100 microseconds, from about 20 microseconds to about 80 microseconds, from about 30 microseconds to about 60 microseconds, or from about 40 microseconds to about 50 microseconds, including All scopes and subscopes in between. According to various embodiments, the rise time of the modulated second laser beam may be less than about 150 microseconds, eg, ranging from about 10 microseconds to about 150 microseconds, from about 20 microseconds to about 100 microseconds, about 30 microseconds to about 80 microseconds, from about 40 microseconds to about 70 microseconds, or from about 50 microseconds to about 60 microseconds, including all ranges and subranges therebetween.
在額外的實施例中,經調變的第二雷射束的脈衝重複率(或調變速度)範圍可自約1 kHz至約100 kHz,例如自約5 kHz至約80 kHz、自約10 kHz至約60 kHz、自約20 kHz至約50 kHz、或自約30 kHz至約40 kHz,包含其間所有範圍及子範圍。根據非限定實施例,第二雷射束脈衝之間的節距或週期性範圍可自約1μm至約100μm,例如自約5μm至約90μm、自約10μm至約80μm、自約20μm至約70μm、自約30μm至約60μm,或自約40μm至約50μm,包含其間所有範圍及子範圍。In additional embodiments, the pulse repetition rate (or modulation speed) of the modulated second laser beam may range from about 1 kHz to about 100 kHz, such as from about 5 kHz to about 80 kHz, from about 10 kHz to about 60 kHz, from about 20 kHz to about 50 kHz, or from about 30 kHz to about 40 kHz, including all ranges and subranges therebetween. According to non-limiting embodiments, the pitch or periodic range between the second laser beam pulses may be from about 1 μm to about 100 μm, such as from about 5 μm to about 90 μm, from about 10 μm to about 80 μm, from about 20 μm to about 70 μm , from about 30 μm to about 60 μm, or from about 40 μm to about 50 μm, including all ranges and subranges therebetween.
在某些實施例中,玻璃基板的第一表面可在單一通過與第二雷射束接觸,或在其他實施例中,可進行多次通過。例如,第二雷射束可使用無論何處自1至10次通過而相對於玻璃基板平移(反之亦然),例如2至9次通過、3至8次通過、4至7次通過、或5至6次通過,包含其間所有範圍及子範圍。平移速度範圍可自約每秒100 mm至約每秒1000 mm,例如自約每秒150 mm至約每秒900 mm、自約每秒200 mm至約每秒800 mm、自約每秒250 mm至約每秒700 mm、自約每秒300 mm至約每秒600 mm,或自約每秒400 mm至約每秒500 mm,包含其間所有範圍及子範圍。In some embodiments, the first surface of the glass substrate can be contacted with the second laser beam in a single pass, or in other embodiments, multiple passes can be made. For example, the second laser beam can be translated relative to the glass substrate using anywhere from 1 to 10 passes (or vice versa), such as 2 to 9 passes, 3 to 8 passes, 4 to 7 passes, or 5 to 6 passes, including all ranges and subranges in between. The translation velocity can range from about 100 mm per second to about 1000 mm per second, for example from about 150 mm per second to about 900 mm per second, from about 200 mm per second to about 800 mm per second, from about 250 mm per second to about 700 mm per second, from about 300 mm per second to about 600 mm per second, or from about 400 mm per second to about 500 mm per second, including all ranges and subranges therebetween.
另一態樣包括使用任何上述處理以在基板上的電致變色層中產生孔洞、空洞、空隙、或其他非連續性,同時未損壞或限制對下方基板的損壞。在該等實施例中,可使用電致變色層150以修改雷射吸收或侵入深度。在一些實施例中,放置電致變色層150於有色的或黑暗的狀態以增加雷射光的吸收,且在該等實施例中,可調諧雷射至靠近電致變色層150的光吸收波長的波長。在該等實施例中,電致變色層的吸收可幫助電致變色層的修改,可影響雷射侵入深度,或可增加或減少修改玻璃或電致變色層所需的整體雷射脈衝功率。Another aspect includes using any of the above treatments to create holes, voids, voids, or other discontinuities in the electrochromic layer on the substrate, while not damaging or limiting damage to the underlying substrate. In such embodiments,
在產生電致變色層中的非連續性時,一般情況的目標為產生兩個或更多個電性分開區域。因此,典型地需要非連續線(界定為明確形成以電性絕緣基板上電致變色層的兩個或更多個區域的雷射形成線)為連續的,意指完全地彼此斷開電致變色層的兩個區域,且可需要電致變色薄膜的至少一個層的切除。在電致變色層中產生非連續性所需的雷射功率或能量層級典型地遠小於在玻璃基板中產生損壞所需。可使用脈衝或連續雷射。使用脈衝雷射可為優勢的,其中可切除電致變色材料而不加熱電致變色或基板,避免損壞相鄰的、保持的電致變色材料或玻璃基板的韌度。進一步地,雷射的波長可優勢地針對電致變色薄膜的吸收,無論處於發光或黑暗狀態。進一步地,可經由基板或相對基板聚焦束(取決於需求)。When creating discontinuities in an electrochromic layer, the general goal is to create two or more electrically separate regions. Thus, discontinuous lines (defined as laser-formed lines that are specifically formed with two or more regions of an electrochromic layer on an electrically insulating substrate) are typically required to be continuous, meaning completely electrically disconnected from each other Two regions of the color-changing layer, and may require ablation of at least one layer of the electrochromic film. The laser power or energy levels required to create discontinuities in the electrochromic layer are typically much smaller than those required to create damage in the glass substrate. Pulsed or continuous lasers can be used. It may be advantageous to use a pulsed laser where the electrochromic material can be ablated without heating the electrochromic material or the substrate, avoiding damage to the toughness of the adjacent, retained electrochromic material or glass substrate. Further, the wavelength of the laser can advantageously target the absorption of the electrochromic film, whether in the luminous or dark state. Further, the beam can be focused via the substrate or against the substrate (depending on requirements).
在一些實施例中,若為脈衝,示範的雷射功率範圍可自約0.25 W至約150 W,例如自約0.25 W至約50 W,或自約1 W至約100 W,包含其間所有範圍及子範圍。根據多種實施例,脈衝雷射束可具有自100奈秒至10飛秒的脈衝週期,例如約100皮秒。在一些實施例中,脈衝雷射束具有自大於約1皮秒至小於約100皮秒的脈衝週期,例如範圍自約5皮秒至約50皮秒、自約10皮秒至約30皮秒,或自約15皮秒至約20皮秒,包含其間所有範圍及子範圍。在額外的實施例中,脈衝雷射束的脈衝重複率範圍可自約1 kHz至約4 MHz,例如自約10 kHz至約650 kHz、自約50 kHz至約500 kHz、自約100 kHz至約400 kHz、或自約200 kHz至約300 kHz,包含其間所有範圍及子範圍。In some embodiments, if pulsed, an exemplary laser power range may be from about 0.25 W to about 150 W, such as from about 0.25 W to about 50 W, or from about 1 W to about 100 W, including all ranges therebetween and sub-ranges. According to various embodiments, the pulsed laser beam may have a pulse period of from 100 nanoseconds to 10 femtoseconds, eg, about 100 picoseconds. In some embodiments, the pulsed laser beam has a pulse period from greater than about 1 picosecond to less than about 100 picoseconds, eg, ranging from about 5 picoseconds to about 50 picoseconds, from about 10 picoseconds to about 30 picoseconds , or from about 15 picoseconds to about 20 picoseconds, including all ranges and subranges therebetween. In additional embodiments, the pulse repetition rate of the pulsed laser beam may range from about 1 kHz to about 4 MHz, such as from about 10 kHz to about 650 kHz, from about 50 kHz to about 500 kHz, from about 100 kHz to About 400 kHz, or from about 200 kHz to about 300 kHz, including all ranges and subranges therebetween.
由於用於電致變色中非連續性產生的功率層級遠遠較小,亦可使用連續雷射來源。用於連續雷射的功率層級為自約0.25 W至約150 W,例如自約0.25 W至約50 W,或自約1 W至約100 W,包含其間所有範圍及子範圍,主要取決於波長、焦點、及束瞄準特定區域的時間。Since the power levels used for discontinuity generation in electrochromic are much smaller, continuous laser sources can also be used. Power levels for continuous lasers are from about 0.25 W to about 150 W, such as from about 0.25 W to about 50 W, or from about 1 W to about 100 W, including all ranges and subranges therebetween, depending primarily on wavelength , focus, and the time the beam is aimed at a specific area.
非連續線可為使用以製造該非連續線的雷射的大約相同寬度。非連續線的寬度範圍可自約0.1μm至約5μm,例如自約0.25μm至約4μm、自約0.5μm至約3.5μm、自約1μm至約3μm,或自約1.5μm至約2μm,包含其間所有範圍及子範圍。在一些實施例中,非連續線的寬度可與雷射束焦線的平均點直徑一樣大,例如,雷射束焦線的平均點直徑範圍亦可自約0.1μm至約5μm,例如自約0.25μm至約4μm、自約0.5μm至約3.5μm、自約1μm至約3μm,或自約1.5μm至約2μm,包含其間所有範圍及子範圍。玻璃物件 The discontinuous line may be about the same width as the laser used to make the discontinuous line. The width of the discontinuous lines can range from about 0.1 μm to about 5 μm, such as from about 0.25 μm to about 4 μm, from about 0.5 μm to about 3.5 μm, from about 1 μm to about 3 μm, or from about 1.5 μm to about 2 μm, including All scopes and subscopes in between. In some embodiments, the width of the discontinuous line may be as large as the average spot diameter of the laser beam focal line. For example, the average spot diameter of the laser beam focal line may also range from about 0.1 μm to about 5 μm, such as from 0.25 μm to about 4 μm, from about 0.5 μm to about 3.5 μm, from about 1 μm to about 3 μm, or from about 1.5 μm to about 2 μm, including all ranges and subranges therebetween. glass object
於此揭露玻璃物件,包括第一表面、相對第二表面、及設置於第二表面的至少一部分上的電致變色塗佈,其中在應用電壓至該玻璃物件之後,玻璃基板的塗佈部分的第一區域具有第一可見光傳輸,該第一可見光傳輸小於該塗佈部分的第二區域的第二可見光傳輸。參考第4A圖,圖示了玻璃物件的第二表面,包括表面的部分E(陰影部分)及未塗佈部分U(非陰影)上的電致變色層,由線Z分開。根據多種實施例,可使用於此揭露的方法以雷射處理第4A圖的玻璃物件以產生第4B至4C圖的玻璃物件,以及任何需要的變化。Disclosed herein is a glass object comprising a first surface, an opposite second surface, and an electrochromic coating disposed on at least a portion of the second surface, wherein after applying a voltage to the glass object, the coating portion of the glass substrate is The first region has a first visible light transmission that is less than the second visible light transmission of the second region of the coated portion. Referring to Figure 4A, a second surface of the glass article is illustrated, including the electrochromic layer on portions E (shaded) and uncoated portions U (unshaded) of the surface, separated by lines Z. According to various embodiments, the glass object of Fig. 4A can be laser processed using the methods disclosed herein to produce the glass object of Figs. 4B-4C, with any desired variations.
在一些實施例中,電致變色層包括一或更多個無機材料。在一些實施例中,電致變色層包括一或更多個氧化鎢。In some embodiments, the electrochromic layer includes one or more inorganic materials. In some embodiments, the electrochromic layer includes one or more tungsten oxides.
例如,可使用第一脈衝雷射以產生輪廓A1(虛線),此處亦稱為雷射「劃線」或「穿孔」。可沿著輪廓B1(雙線)追蹤第一脈衝雷射及第二雷射以將玻璃分開成兩個部分,以產生第4B圖中所描繪的玻璃物件以及未塗佈剩餘(未示出)。在應用電壓至C1之後,塗佈部分E的C1可被「著色」及/或可具有相較於塗佈部分E的第二區域C2減低的傳輸(例如,針對可見光波長400至700 nm),第二區域C2可保持非活化及未改變(或未著色)。選擇地,若電壓應用至C2且未至C1,可相似於上述C1來執行。當劃線電性相互斷開層時,現在C1及C2皆能夠獨立於彼此著色。For example, a first pulsed laser may be used to generate contour A1 (dotted line), also referred to herein as a laser "scribing" or "piercing." The first pulsed laser and the second laser can be traced along contour B1 (double line) to separate the glass into two parts to produce the glass object depicted in Figure 4B and the uncoated remainder (not shown) . After applying a voltage to C1, C1 of coated portion E may be "colored" and/or may have reduced transmission compared to second region C2 of coated portion E (eg, for visible wavelengths 400 to 700 nm), The second region C2 may remain inactive and unaltered (or uncolored). Alternatively, if the voltage is applied to C2 and not to C1, it can be performed similarly to C1 above. Now both C1 and C2 can be colored independently of each other when the scribe lines electrically disconnect the layers from each other.
沿著輪廓A1的雷射劃線作用以產生對C1及C2之間電致變色效應的電性屏障。因此,玻璃物件可包括未塗佈(例如,未著色)部分U及「新的」未著色(但經塗佈)區域C2,而在應用電壓至C1之後不展現出電致變色效應,即便使用電致變色層來塗佈(反之亦然)。可因而使用雷射劃線或穿孔處理以產生玻璃基板上任何所需圖案(包含線性及彎曲輪廓)以及第一及第二區域內的圖案。輪廓或雷射劃線可包括如上述的複數個非連續線且可分開個別區域以產生任何所需視覺效應,而不顯著損壞玻璃基板上的電致變色層。非連續線的寬度範圍可自約0.1μm至約25μm,例如自約0.25μm至約10μm、自約0.5μm至約5μm、自約1μm至約3μm,或自約1.5μm至約2μm,包含其間所有範圍及子範圍。The laser scribing along contour A1 acts to create an electrical barrier to the electrochromic effect between C1 and C2. Thus, glass articles can include uncoated (eg, unpigmented) portions U and "new" unpigmented (but coated) regions C2 without exhibiting electrochromic effects after applying voltage to C1, even with electrochromic layer to coat (and vice versa). Laser scribing or perforation processing can thus be used to produce any desired pattern (including linear and curved profiles) on the glass substrate and patterns within the first and second regions. The outline or laser scribe can include a plurality of non-continuous lines as described above and can separate individual areas to produce any desired visual effect without significantly damaging the electrochromic layer on the glass substrate. The width of the discontinuous lines can range from about 0.1 μm to about 25 μm, such as from about 0.25 μm to about 10 μm, from about 0.5 μm to about 5 μm, from about 1 μm to about 3 μm, or from about 1.5 μm to about 2 μm, inclusive All scopes and subscopes.
在一些實施例中,C2可不被雷射損壞或實質上可不被雷射損壞。例如,此區域中的電致變色塗佈及/或玻璃基板可不被雷射損壞,或可展現沿著輪廓的非常小的區域的雷射損壞,如下方所更詳細描述。因此,在某些實施例中,輪廓自單一母板產生兩個或更多個活化裝置。因為雷射切割為精確的且可控制功率以產生帶有對電致變色薄膜微小損壞的非常精細的線,C1及C2中的電致變色層不受損壞且耗費極少電致變色材料。In some embodiments, C2 may be undamaged or substantially undamaged by the laser. For example, the electrochromic coating and/or glass substrate in this area may not be damaged by the laser, or may exhibit laser damage in a very small area along the contour, as described in more detail below. Thus, in certain embodiments, the profile creates two or more activation devices from a single master. Because the laser cutting is precise and power controllable to produce very fine lines with minimal damage to the electrochromic film, the electrochromic layers in C1 and C2 are not damaged and consume very little electrochromic material.
在一些實施例中,可使用電致變色薄膜中的非連續的形成以消除物件的某些區域中的著色效應。用於消除塗佈基板的給定區域中的著色效應涉及移除塗佈,例如使用雷射切除以「燒」去所需面積中的塗佈。然而,該等處理可為不精確且可導致對電致變色層及下方的玻璃基板大區域的損壞。例如,為了確保電致變色層完全自所需區域移除,可使用高功率雷射進行幾個通過,可導致沿著剩餘電致變色層損壞及/或下方玻璃基板損壞的寬廣區域(或條紋)。該等雷射損壞區域可具有幾十毫米層級的寬度,例如大於約20 mm、大於約25 mm,或甚至大於約30 mm。In some embodiments, discontinuous formation in the electrochromic film may be used to eliminate tinting effects in certain areas of the article. Use to eliminate tinting effects in a given area of a coated substrate involves removing the coating, such as using laser ablation to "burn" away the coating in the desired area. However, these treatments can be imprecise and can result in damage to the electrochromic layer and large areas of the underlying glass substrate. For example, to ensure that the electrochromic layer is completely removed from the desired area, several passes can be made with a high power laser, which can result in broad areas (or streaks) of damage along the remaining electrochromic layer and/or damage to the underlying glass substrate ). Such laser damaged regions may have widths on the order of tens of millimeters, such as greater than about 20 mm, greater than about 25 mm, or even greater than about 30 mm.
進一步於此揭露玻璃物件,包括第一表面、相對第二表面、及設置於實質上所有第二表面上的電致變色塗佈,其中該電致變色塗佈包括雷射損壞周邊區域接近該玻璃物件的至少一個邊緣,雷射損壞周邊區域具有小於約10、1、或0.1 mm的寬度。再次參考第4A圖,可使用第一脈衝雷射以產生輪廓A2(虛線)。可沿著輪廓B2(雙線)追蹤第一脈衝雷射及第二雷射以將玻璃分開成兩個部分,以產生第4C圖中所描繪的玻璃物件。在應用電壓之後,塗佈部分E的第一部分C1可變為著色及/或可具有相較於塗佈部分E的第二區域C2減低的傳輸(例如,針對可見光波長400至700 nm),第二區域C2可保持未改變(或未著色)。Further disclosed herein is a glass article comprising a first surface, an opposite second surface, and an electrochromic coating disposed on substantially all of the second surface, wherein the electrochromic coating comprises laser damage to a peripheral area close to the glass At least one edge of the article, the laser damage perimeter area has a width of less than about 10, 1, or 0.1 mm. Referring again to Figure 4A, a first pulsed laser may be used to generate profile A2 (dashed line). The first pulsed laser and the second laser can be traced along contour B2 (double line) to separate the glass into two parts to produce the glass object depicted in Figure 4C. After application of the voltage, the first portion C1 of the coated portion E may become colored and/or may have reduced transmission compared to the second region C2 of the coated portion E (eg, for visible wavelengths 400 to 700 nm), the first The second region C2 may remain unchanged (or uncolored).
不像輪廓B1切割穿過未塗佈部分U,輪廓B2切割穿過塗佈部分E。不希望被理論侷限,相信於此揭露的雷射切割方法可將塗佈玻璃物件分開,帶有對電致變色層的最小損壞。於此揭露的雷射處理方法可導致一相對小的區域(輪廓的寬度),其中電致變色薄膜被雷射損壞且在應用電壓之後不展現電致變色效應。例如,雷射切割處理可產生沿著相對薄(例如,小於約0.1 mm)的切割邊緣e的雷射損壞區L。在一些實施例中,雷射損壞區L可具有小於約10 mm、1 mm、或0.1 mm的寬度,例如小於約9 mm、8 mm、5 mm、1 mm、0.5 mm、0.1 mm、0.09 mm、0.08 mm、0.07 mm、0.06 mm、0.05 mm、0.04 mm、0.03 mm、0.02 mm、0.01 mm、或更小,例如,範圍自約0.01 mm至約0.1 mm,包含其間所有範圍及子範圍。Unlike profile B1 which cuts through uncoated portion U, profile B2 cuts through coated portion E. Without wishing to be bound by theory, it is believed that the laser cutting methods disclosed herein can separate coated glass articles with minimal damage to the electrochromic layer. The laser processing methods disclosed herein can result in a relatively small area (width of the profile) in which the electrochromic film is damaged by the laser and does not exhibit electrochromic effects after application of a voltage. For example, the laser dicing process can create a laser damaged area L along a relatively thin (eg, less than about 0.1 mm) dicing edge e. In some embodiments, the laser damage zone L may have a width of less than about 10 mm, 1 mm, or 0.1 mm, eg, less than about 9 mm, 8 mm, 5 mm, 1 mm, 0.5 mm, 0.1 mm, 0.09 mm , 0.08 mm, 0.07 mm, 0.06 mm, 0.05 mm, 0.04 mm, 0.03 mm, 0.02 mm, 0.01 mm, or less, eg, in the range from about 0.01 mm to about 0.1 mm, including all ranges and subranges therebetween.
於此揭露的玻璃物件可具有相較於比較的處理所產生的未塗佈及/或損壞區域相對小的雷射損壞區域。例如,由於來自夾具的干擾,「切割及塗佈」處理可導致顯著的未塗佈面積。相似地,若塗佈玻璃接著使用傳統水邊緣研磨方法來切割玻璃,對接近切割邊緣的電致變色層的損壞(例如,起泡等)將遠遠更大。進一步地,若需要使用先前技術方法消除該等基板的任何部分上的著色效應(無論「切割及塗佈」或「塗佈及切割」),研磨處理期間所產生的雷射損壞區域將遠遠更大(例如,20 mm或更大的寬度)。The glass articles disclosed herein may have relatively small laser damaged areas compared to uncoated and/or damaged areas produced by comparative treatments. For example, a "cut and coat" process can result in significant uncoated areas due to interference from fixtures. Similarly, if the glass is coated and then cut using conventional water edge grinding methods, the damage (eg, blistering, etc.) to the electrochromic layer near the cut edge will be much greater. Further, if prior art methods were to be used to eliminate tinting effects on any part of the substrates (whether "cut and coat" or "coat and cut"), the area of laser damage created during the grinding process would be far larger (eg, 20 mm or more in width).
此處的玻璃物件可包括至少一個表面,在應用電壓之後,實質上使用功能性電致變色層來塗佈該表面,例如,邊緣至邊緣著色,而使用先前技術方法先前不可能做到。在某些實施例中,可使用電致變色層來塗佈玻璃物件的實質上所有表面,可包括沿著該物件的一或更多個邊緣的一或更多個雷射損壞區域(<0.01 mm)。例如,可使用電致變色層來塗佈玻璃基板的表面,接著可沿著單一輪廓將所塗佈基板分開以移除玻璃基板的任何未塗佈部分(例如,導因於夾具)。因此,可實質上使用電致變色層來塗佈所得到的玻璃物件且可包括靠近輪廓邊緣的周邊雷射損壞區域。在額外的實施例中,可沿著多於一個輪廓分開塗佈的玻璃基板且所得到的玻璃物件可包括多於一個雷射損壞區域。在應用電壓之後,可觀察到邊緣至邊緣著色效應,除了邊緣處的任何雷射損壞區域之外。然而,該等雷射損壞區域相較於先前技術處理所產生的未塗佈及/或損壞區域可為相對小。根據多種實施例,雷射損壞區域可包括小於約5%的玻璃表面塗佈部分,例如小於約4%、3%、2%、1%、0.5%、0.1%或0.01%,包含其間所有範圍及子範圍,儘管當玻璃物件的尺寸減小時,被雷射損壞區域佔據的表面相對比例可增加。The glass articles herein may include at least one surface that, after application of a voltage, is substantially coated with a functional electrochromic layer, eg, edge-to-edge tinting, which was not previously possible using prior art methods. In certain embodiments, an electrochromic layer may be used to coat substantially all surfaces of a glass article, which may include one or more laser damaged regions (<0.01 along one or more edges of the article mm). For example, an electrochromic layer can be used to coat the surface of a glass substrate, and then the coated substrate can be separated along a single profile to remove any uncoated portions of the glass substrate (eg, due to a clamp). Thus, the resulting glass article can be substantially coated with an electrochromic layer and can include peripheral laser damage areas near the edges of the profile. In additional embodiments, the coated glass substrate may be split along more than one contour and the resulting glass article may include more than one laser damaged area. After applying the voltage, edge-to-edge coloring effects were observed, except for any laser damaged areas at the edges. However, such laser damaged areas may be relatively small compared to uncoated and/or damaged areas produced by prior art processes. According to various embodiments, the laser damaged area may comprise less than about 5% of the glass surface coating, eg, less than about 4%, 3%, 2%, 1%, 0.5%, 0.1%, or 0.01%, including all ranges therebetween and sub-ranges, although the relative proportion of the surface occupied by the laser damaged area may increase as the size of the glass object decreases.
於此揭露的玻璃物件可包括適於汽車、建築、及其他相似應用的任何技術中已知的玻璃。示範的玻璃基板可包含但不限於:矽酸鋁、鹼金屬鋁矽酸鹽、硼矽酸鹽、鹼硼矽酸鹽、鋁硼矽酸鹽、鹼性硼鋁矽酸鹽、鈉鈣矽酸鹽,及其他合適的玻璃。在某些實施例中,基板可具有一厚度,範圍自約0.1 mm至約10 mm,例如自約0.3 mm至約5 mm、自約0.5 mm至約3 mm、或自約1 mm至約2 mm,包含其間所有範圍及子範圍。適於使用為光濾波器的商用玻璃的非限定範例包含:例如,取自康寧公司的EAGLE XG® 、IrisTM、LotusTM、Willow® 、Gorilla® 、HPFS® 、及ULE® 。合適的玻璃揭露於例如美國專利第4,483,700、5,674,790、及7,666,511號中,上述文獻以其全體參考併入於此,上述文獻以其全體參考併入於此。The glass articles disclosed herein may include any glass known in the art suitable for automotive, architectural, and other similar applications. Exemplary glass substrates may include, but are not limited to, aluminum silicates, alkali metal aluminosilicates, borosilicates, alkali borosilicates, aluminoborosilicates, alkali boroaluminosilicates, soda lime silicates salt, and other suitable glasses. In certain embodiments, the substrate can have a thickness ranging from about 0.1 mm to about 10 mm, such as from about 0.3 mm to about 5 mm, from about 0.5 mm to about 3 mm, or from about 1 mm to about 2 mm mm, including all ranges and subranges in between. Non-limiting examples of commercial glasses suitable for use as optical filters include, for example, EAGLE XG ® , Iris TM , Lotus TM , Willow ® , Gorilla ® , HPFS ® , and ULE ® available from Corning Incorporated. Suitable glasses are disclosed, for example, in US Pat. Nos. 4,483,700, 5,674,790, and 7,666,511, which are incorporated herein by reference in their entireties.
基板可包括具有第一表面及相對第二表面的玻璃片。在某些實施例中,表面可為平面或實質上平面,例如,實質上平坦及/或水平。在一些實施例中,基板亦可繞著至少一個曲率半徑而彎曲,例如,三維基板,例如凸面或凹面基板。在多種實施例中,第一及第二表面可為平行或實質上平行。基板可進一步包括至少一個邊緣,例如,至少兩個邊緣、至少三個邊緣、或至少四個邊緣。藉由非限定範例的方式,基板可包括具有四個邊緣的矩形或正方形片,儘管已預見其他形狀及配置且意圖落於本揭示案的範圍內。亦可使用於此揭露的雷射切割方法以產生多種彎曲輪廓且所得到的玻璃物件具有彎曲例如非線性邊緣。The substrate may include a glass sheet having a first surface and an opposing second surface. In certain embodiments, the surface may be planar or substantially planar, eg, substantially flat and/or horizontal. In some embodiments, the substrate may also be curved about at least one radius of curvature, eg, a three-dimensional substrate, such as a convex or concave substrate. In various embodiments, the first and second surfaces may be parallel or substantially parallel. The substrate may further include at least one edge, eg, at least two edges, at least three edges, or at least four edges. By way of non-limiting example, the substrate may comprise a rectangular or square sheet having four edges, although other shapes and configurations are envisioned and intended to fall within the scope of this disclosure. The laser cutting methods disclosed herein can also be used to create a variety of curved profiles and the resulting glass objects have curvatures such as non-linear edges.
可使用於此揭露的玻璃物件以產生多種產品,例如絕緣玻璃單元(IGU)。例如,可繞著周邊來密封玻璃物件至第二玻璃片以產生IGU,該玻璃物件包括使用電致變色層塗佈的至少一部分的表面。因為玻璃物件可在使用電致變色層塗佈之後被切割成尺寸及/或形狀,該等IGU的製造可具有改良的彈性及/或減低的成本。The glass articles disclosed herein can be used to create a variety of products, such as insulating glass units (IGUs). For example, a glass article including at least a portion of the surface coated with an electrochromic layer can be sealed around the perimeter to a second glass sheet to create an IGU. Because glass objects can be cut to size and/or shape after coating with an electrochromic layer, the manufacture of these IGUs can have improved flexibility and/or reduced cost.
應理解多種所揭露的實施例可涉及與特定實施例連接而描述的特定特徵、元件、或步驟。亦應理解:儘管相關於一個特定實施例來描述,特定特徵、元件或步驟可互換或以多種未圖示的組合或順序而與替代的實施例組合。It should be understood that various disclosed embodiments may involve specific features, elements, or steps described in connection with a particular embodiment. It is also to be understood that although described in relation to one particular embodiment, the particular features, elements or steps may be interchanged or combined with alternative embodiments in various combinations or sequences not shown.
亦應理解:此處所使用的用語「該」、「一(a)」或「一(an)」意指「至少一個」且不應限制於「僅有一個」,除非有明白地相反指示。因此,例如,參考「一雷射」包含具有兩個或更多個該等雷射的範例,除非內文清楚指示反之。相似地,「複數個」意圖指出「多於一個」。因此,「複數個缺陷線」包含兩個或更多個該等缺陷線,例如三個或更多個該等缺陷線等。It should also be understood that the terms "the", "an (a)" or "an (an)" as used herein mean "at least one" and should not be limited to "only one" unless expressly indicated to the contrary. Thus, for example, reference to "a laser" includes instances with two or more such lasers, unless the context clearly indicates otherwise. Similarly, "plurality" is intended to mean "more than one". Therefore, "a plurality of defective lines" includes two or more of such defective lines, such as three or more of such defective lines, and the like.
此處範圍可表示為自「約」一個特定值及/或至「約」另一特定值。當表示如此的範圍時,範例包含自該一個特定值及/或至該另一特定值。相似地,當表示數值為近似值時,藉由使用先行詞「約」,應理解特定值形成另一態樣。進一步應理解:每一範圍的端點相對於另一端點皆為重要的,且獨立於其他端點。Ranges can be expressed herein as from "about" one particular value and/or to "about" another particular value. When expressing such a range, examples include from the one particular value and/or to the other particular value. Similarly, when values are expressed as approximations, by use of the antecedent "about," it will be understood that the particular value forms another aspect. It is further understood that the endpoints of each range are significant relative to the other endpoint and independent of the other endpoints.
此處所使用的用語「實質」、「實質上」及其變化意圖注釋:所描述的特徵等於或大約等於一數值或描述。例如,「實質上平面」的表面意圖指出平面的或大約平面的表面。The terms "substantially," "substantially," and variations thereof as used herein are intended to indicate that the described feature is equal to or approximately equal to a value or description. For example, a "substantially planar" surface is intended to indicate a planar or approximately planar surface.
除非明白陳述,不意圖將此處任何提出的方法詮釋為需要將該等方法之步驟依特定順序來執行。據此,當方法請求項並未真實描述該方法的步驟所遵循的順序、或並未在請求項或說明書中特別陳述該等步驟限制於特定順序時,並不意圖推斷任何特定順序。Unless expressly stated, any presented method is not intended to be construed as requiring the steps of such method to be performed in a particular order. Accordingly, no particular order is intended to be inferred when a method claim does not actually describe the order followed by the steps of the method, or does not specifically state in the claim or specification that the steps are limited to a particular order.
儘管可使用過渡性片語「包括」來揭露特定實施例的多種特徵、元件、或步驟,應理解暗示了替代的實施例,包含使用過渡性片語「組成」、「主要由…組成」來描述的該等實施例。因此,例如,對包括A+B+C的物件的暗示的替代實施例包含由A+B+C組成的物件的實施例及主要由A+B+C組成的物件的實施例。Although the transitional phrase "comprising" may be used to disclose various features, elements, or steps of particular embodiments, it should be understood that alternative embodiments are implied, including use of the transitional phrase "consisting of," "consisting essentially of," the described embodiments. Thus, for example, an implied alternative embodiment to an item that includes A+B+C includes an embodiment of an item that consists of A+B+C and an embodiment of an item that consists primarily of A+B+C.
發明所屬領域具有通常知識者明顯知悉:可對本揭示案進行多種修改及變化,而不遠離本揭示案的精神及範疇。因為併入本揭示案的精神及實體的所揭露實施例的修改組合、子組合及變化可發生於發明所屬領域具有通常知識者,本揭示案應詮釋為包含所附申請專利範圍及其等效物的範疇內的一切。It will be apparent to those skilled in the art to which the invention pertains that various modifications and variations can be made in the present disclosure without departing from the spirit and scope of the present disclosure. Because modified combinations, sub-combinations, and variations of the disclosed embodiments that incorporate the spirit and substance of the present disclosure may occur to those of ordinary skill in the art to which the invention pertains, the present disclosure should be construed to include the scope of the appended claims and their equivalents everything within the realm of things.
1‧‧‧基板
1a‧‧‧第一表面
1b‧‧‧第二表面
2‧‧‧雷射束
2a‧‧‧入射部分
2b‧‧‧雷射束焦線
2c‧‧‧區段
3‧‧‧錐鏡透鏡
4‧‧‧準直透鏡
5‧‧‧聚焦透鏡
6‧‧‧光學組件
7‧‧‧電致變色層
110‧‧‧輪廓
120‧‧‧缺陷線
130‧‧‧玻璃基板
130a‧‧‧部分
130b‧‧‧部分
140‧‧‧脈衝雷射
150‧‧‧電致變色層
A1‧‧‧輪廓
A2‧‧‧輪廓
B1‧‧‧輪廓
B2‧‧‧輪廓
C1‧‧‧第一區域
C2‧‧‧第二區域
d‧‧‧厚度
D‧‧‧直徑
D1‧‧‧原始直徑
e‧‧‧切割邊緣
E‧‧‧塗佈部分
L‧‧‧長度
L‧‧‧長度
U‧‧‧未塗佈部分
Z‧‧‧線
1‧‧‧
當結合以下圖式來閱讀時,可進一步理解以下詳細描述,其中,儘可能將相似數字參照到相似部件,應理解所附圖式無須按比例繪製。The following detailed description can be further understood when read in conjunction with the following drawings wherein, wherever possible, like numerals are referred to like parts, it being understood that the drawings are not necessarily drawn to scale.
第1A至1B圖圖示具有輪廓的玻璃基板,包括複數個缺陷線;Figures 1A-1B illustrate a contoured glass substrate including a plurality of defect lines;
第2A至2B圖圖示雷射束焦線的放置,以感應玻璃基板中沿著焦線的吸收;Figures 2A-2B illustrate placement of a laser beam focal line to sense absorption along the focal line in a glass substrate;
第3圖根據本揭示案的多種實施例圖示用於聚焦雷射束成為雷射束焦線的光學組件;FIG. 3 illustrates an optical assembly for focusing a laser beam into a laser beam focal line according to various embodiments of the present disclosure;
第4A至4C圖根據本揭示案的某些實施例圖示包括電致變色塗佈及未塗佈區域的玻璃基板。Figures 4A-4C illustrate a glass substrate including electrochromic coated and uncoated regions in accordance with certain embodiments of the present disclosure.
國內寄存資訊 (請依寄存機構、日期、號碼順序註記) 無Domestic storage information (please note in the order of storage institution, date and number) None
國外寄存資訊 (請依寄存國家、機構、日期、號碼順序註記) 無Foreign deposit information (please note in the order of deposit country, institution, date and number) None
110‧‧‧輪廓 110‧‧‧Outline
120‧‧‧缺陷線 120‧‧‧Defective line
130‧‧‧玻璃基板 130‧‧‧Glass Substrate
130a‧‧‧部分
130b‧‧‧部分
140‧‧‧脈衝雷射 140‧‧‧Pulse Laser
150‧‧‧電致變色層 150‧‧‧Electrochromic layer
Claims (20)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US15/288,071 US11556039B2 (en) | 2013-12-17 | 2016-10-07 | Electrochromic coated glass articles and methods for laser processing the same |
US15/288,071 | 2016-10-07 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201823831A TW201823831A (en) | 2018-07-01 |
TWI762517B true TWI762517B (en) | 2022-05-01 |
Family
ID=60153522
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW106134567A TWI762517B (en) | 2016-10-07 | 2017-10-06 | Electrochromic coated glass articles and methods for laser processing the same |
Country Status (6)
Country | Link |
---|---|
EP (1) | EP3523260A1 (en) |
JP (1) | JP7082615B2 (en) |
KR (1) | KR102532280B1 (en) |
CN (1) | CN109982984B (en) |
TW (1) | TWI762517B (en) |
WO (1) | WO2018067928A1 (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20210409617A1 (en) * | 2020-06-24 | 2021-12-30 | Micron Technology, Inc. | Displaying a three-dimensional image of a user using an array of infrared illuminators |
KR102443796B1 (en) * | 2022-05-30 | 2022-09-16 | 주식회사 도우인시스 | Cell unit thin glass manufactured by cutting and post-processing method of glass |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20130222877A1 (en) * | 2012-02-28 | 2013-08-29 | Sage Electrochromics, Inc. | Multi-zone electrochromic devices |
TW201612615A (en) * | 2014-06-17 | 2016-04-01 | Sage Electrochromics Inc | Controlled switching for electrochromic devices |
US9341912B2 (en) * | 2012-03-13 | 2016-05-17 | View, Inc. | Multi-zone EC windows |
US20160138328A1 (en) * | 2013-04-10 | 2016-05-19 | Cardinal Ig Company | Multilayer film with electrically switchable optical properties |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4483700A (en) | 1983-08-15 | 1984-11-20 | Corning Glass Works | Chemical strengthening method |
US5674790A (en) | 1995-12-15 | 1997-10-07 | Corning Incorporated | Strengthening glass by ion exchange |
US9138913B2 (en) * | 2005-09-08 | 2015-09-22 | Imra America, Inc. | Transparent material processing with an ultrashort pulse laser |
US7666511B2 (en) | 2007-05-18 | 2010-02-23 | Corning Incorporated | Down-drawable, chemically strengthened glass for cover plate |
US8514476B2 (en) * | 2008-06-25 | 2013-08-20 | View, Inc. | Multi-pane dynamic window and method for making same |
FR2962818B1 (en) * | 2010-07-13 | 2013-03-08 | Saint Gobain | ELECTROCHEMICAL DEVICE HAVING ELECTRO - CONTROLLABLE OPTICAL AND / OR ENERGY TRANSMISSION PROPERTIES. |
US9958750B2 (en) * | 2010-11-08 | 2018-05-01 | View, Inc. | Electrochromic window fabrication methods |
US20130222878A1 (en) * | 2012-02-28 | 2013-08-29 | Sage Electrochromics, Inc. | Multi-zone electrochromic devices |
WO2014022681A1 (en) * | 2012-08-01 | 2014-02-06 | Gentex Corporation | Assembly with laser induced channel edge and method thereof |
EP2754524B1 (en) * | 2013-01-15 | 2015-11-25 | Corning Laser Technologies GmbH | Method of and apparatus for laser based processing of flat substrates being wafer or glass element using a laser beam line |
WO2014137378A1 (en) * | 2013-03-08 | 2014-09-12 | Sage Electrochromics, Inc. | Electrochromic device with multiple independently controllable zones and internal busbars |
WO2014144322A1 (en) * | 2013-03-15 | 2014-09-18 | Kinestral Technologies, Inc. | Laser cutting strengthened glass |
US10240051B2 (en) * | 2013-09-04 | 2019-03-26 | Saint-Gobain Glass France | Method for producing a pane having an electrically conductive coating with electrically insulated defects |
US8927069B1 (en) * | 2013-10-02 | 2015-01-06 | Eritek, Inc. | Method and apparatus for improving radio frequency signal transmission through low-emissivity coated glass |
EP3245166B1 (en) * | 2015-01-12 | 2020-05-27 | Corning Incorporated | Laser cutting of thermally tempered substrates using the multi photon absorption method |
-
2017
- 2017-10-06 KR KR1020197012781A patent/KR102532280B1/en active Active
- 2017-10-06 EP EP17787788.3A patent/EP3523260A1/en active Pending
- 2017-10-06 TW TW106134567A patent/TWI762517B/en active
- 2017-10-06 JP JP2019517233A patent/JP7082615B2/en active Active
- 2017-10-06 WO PCT/US2017/055533 patent/WO2018067928A1/en unknown
- 2017-10-06 CN CN201780061955.XA patent/CN109982984B/en active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20130222877A1 (en) * | 2012-02-28 | 2013-08-29 | Sage Electrochromics, Inc. | Multi-zone electrochromic devices |
US9341912B2 (en) * | 2012-03-13 | 2016-05-17 | View, Inc. | Multi-zone EC windows |
US20160138328A1 (en) * | 2013-04-10 | 2016-05-19 | Cardinal Ig Company | Multilayer film with electrically switchable optical properties |
TW201612615A (en) * | 2014-06-17 | 2016-04-01 | Sage Electrochromics Inc | Controlled switching for electrochromic devices |
Also Published As
Publication number | Publication date |
---|---|
KR20190067197A (en) | 2019-06-14 |
JP7082615B2 (en) | 2022-06-08 |
WO2018067928A1 (en) | 2018-04-12 |
KR102532280B1 (en) | 2023-05-12 |
CN109982984B (en) | 2022-10-04 |
TW201823831A (en) | 2018-07-01 |
JP2020500135A (en) | 2020-01-09 |
EP3523260A1 (en) | 2019-08-14 |
CN109982984A (en) | 2019-07-05 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US11556039B2 (en) | Electrochromic coated glass articles and methods for laser processing the same | |
US20210347673A1 (en) | Laser cutting and removal of contoured shapes from transparent substrates | |
CN106132627B (en) | For carrying out scribing and the then method and system of progress chemical etching to fragile material | |
KR102288418B1 (en) | Edge Chamfering Methods | |
US10611667B2 (en) | Method and system for forming perforations | |
TWI677394B (en) | Method of closed form release for brittle materials using burst ultrafast laser pulses | |
US10526234B2 (en) | Interface block; system for and method of cutting a substrate being transparent within a range of wavelengths using such interface block | |
US20150165563A1 (en) | Stacked transparent material cutting with ultrafast laser beam optics, disruptive layers and other layers | |
US20180105451A1 (en) | Creation of holes and slots in glass substrates | |
EP3490945A1 (en) | Apparatuses and methods for laser processing | |
TW201536463A (en) | Laser processing of slots and holes | |
TW201605569A (en) | System and method for processing transparent materials using adjustable laser beam focal lines | |
TWI762517B (en) | Electrochromic coated glass articles and methods for laser processing the same | |
JP2019120738A (en) | Method for manufacturing liquid crystal panel | |
WO2023096776A2 (en) | Laser cutting methods for multi-layered glass assemblies having an electrically conductive layer |