CN110544655B

CN110544655B - Binding device and binding method

Info

Publication number: CN110544655B
Application number: CN201910836324.1A
Authority: CN
Inventors: 王善鹤; 张琪; 杨硕; 古春笑; 朱朝月; 张迪
Original assignee: Yungu Guan Technology Co Ltd
Current assignee: Yungu Guan Technology Co Ltd
Priority date: 2019-09-03
Filing date: 2019-09-03
Publication date: 2021-09-14
Anticipated expiration: 2039-09-03
Also published as: CN110544655A

Abstract

The invention relates to a binding device and a binding method. The binding platform is used for placing a first binding piece; at least part of the binding pressure head is used for obtaining a second binding piece and has a pre-pressing connection state for pre-pressing the first binding piece and the second binding piece, and at least part of the binding pressure head has a pressing connection state for pressing the first binding piece and the second binding piece; the binding driving mechanism is in transmission connection with the binding pressure heads and is used for independently providing pre-pressing relay for each binding pressure head in a pre-pressing connection state and providing pressing force for each binding pressure head in a pressing connection state; and the warping monitoring mechanism is used for monitoring the warping rate of the first binding piece and the second binding piece in a pre-pressing state and determining warping positions, and the binding driving mechanism is also used for adjusting a pre-pressing relay positive pressure driving mechanism provided by the binding pressure heads corresponding to the warping positions. Thus, the binding yield is improved.

Description

Binding device and binding method

Technical Field

The present invention relates to the field of display, and in particular, to a binding apparatus and a binding method.

Background

In the display field, a common bonding technology is to bond (COG, Chip on Glass) an IC screen body on a hard screen or without peeling a flexible substrate from a Glass substrate, but as the process route is improved, the device technology is improved, and the requirements for future flexibility, narrow-frame display and the like increase, the flexible bonding technology comes along.

At present, flexible binding mainly comprises two COF (Chip on Flim/Flex) binding processes and a COP (Chip Pi/Plastic) binding process. In the flexible binding process, the screen body to be bound is a stripped flexible screen, the flexible screen and the FPC which are stripped from the glass substrate have certain flexibility, even if the binding platform adopts vacuum adsorption with higher cost, such as a porous ceramic adsorption platform, the flexible substrate or the area to be bound of the flexible substrate still has micro warpage in the binding process, and the binding yield is easily reduced to a certain extent; meanwhile, the conventional binding device adopts a rigid integral binding and crimping mode, so that the problems that a binding area is worn or the whole material is scrapped due to poor crimping binding and the binding cost is increased are easily caused.

Disclosure of Invention

In view of the above, there is a need for a binding apparatus and a binding method that improve the above-mentioned problems.

In one aspect of the present invention, there is provided a binding apparatus, including:

the binding platform is used for placing a first binding piece;

the binding pressure heads are used for acquiring a second binding piece, and have a pre-pressing connection state for pre-pressing the first binding piece and the second binding piece, and at least part of the binding pressure heads have a pressing connection state for pressing the first binding piece and the second binding piece;

the binding driving mechanism is in transmission connection with the binding pressure heads and is used for independently providing pre-pressing relay for each binding pressure head in a pre-pressing connection state and providing pressing force for each binding pressure head in a pressing connection state; and

and the warping monitoring mechanism is used for monitoring the warping rate of the first binding piece and the second binding piece in a pre-pressing state and determining warping positions, and the binding driving mechanism is also used for adjusting a pre-pressing relay positive pressure driving mechanism provided by the binding pressure head corresponding to the warping positions.

In one embodiment, the binding driving mechanism comprises a pre-pressing connection driving mechanism and a positive pressure driving mechanism, and the pre-pressing connection driving mechanism is in transmission connection with at least part of the binding pressure head and is used for pre-pressing connection of the first binding piece and the second binding piece;

the positive pressure driving mechanism is in transmission connection with at least part of the binding pressure head and is used for pressing the first binding piece and the second binding piece.

In one embodiment, each binding pressure head has the pre-press-fit state and the press-fit state;

the pre-crimping driving mechanism and the positive pressure driving mechanism are in transmission connection with the binding pressure heads so as to be used for driving the binding pressure heads to move towards the binding platform.

In one embodiment, each binding pressure head comprises a pressure head body and a pressure holding portion movably connected to the pressure head body, and the pressure holding portion can move relative to the pressure head body in a direction for pre-pressing the first binding member and the second binding member.

In one embodiment, the number of the pressing parts connected with the same pressing head body is one or more; preferably, each pressure head body is connected with an odd number of the pressure holding parts; more preferably, the number of the pressing parts connected with each pressing head body is the same;

or all the pressure head bodies binding the pressure head are connected through the connecting part to form an integrated pressure head body.

In one embodiment, the pre-crimping drive mechanism includes a plurality of pre-crimping drive units for driving the respective binding rams;

each pre-crimping driving unit comprises a first magnetic component, a second magnetic component and a first magnetic attraction and repulsion force control component, wherein the second magnetic component and the first magnetic component can generate magnetic attraction and repulsion force;

the first magnetic assembly is arranged on the pressure head body, the second magnetic assembly is arranged on the pressing portion, and the first magnetic assembly and the second magnetic assembly are arranged oppositely.

In one embodiment, the binding apparatus further comprises a leveling mechanism for leveling the first binding, the leveling mechanism comprising a first magnetic leveling member and a second magnetic leveling member, the first magnetic leveling member and the second magnetic leveling member being capable of generating a magnetic attraction therebetween to level the first binding between the first magnetic leveling member and the second magnetic leveling member.

In one embodiment, the first magnetic leveling element is used for being arranged on a surface of the first binding element far away from the binding platform, and the second magnetic leveling element is arranged inside the binding platform;

preferably, the second magnetic leveling piece is arranged corresponding to a binding region of the first binding piece, wherein the first binding piece is provided with a first pin; the first magnetic flattening piece is used for being arranged corresponding to the non-binding area of the first binding piece; the second magnetic flattening overlaps the first magnetic flattening in projection in a direction perpendicular to the binding platform.

In one embodiment, the leveling mechanism further comprises a third magnetic leveling member, the third magnetic leveling member is used for being arranged corresponding to the binding area of the first binding member and is arranged on one side of the first binding member away from the binding pressure head, and magnetic attraction can be generated between the third magnetic leveling member and the second magnetic leveling member so as to level the binding area of the first binding member;

preferably, the projections of the third magnetic flattening and the first magnetic flattening overlap in a direction perpendicular to the binding platform;

preferably, the second magnetic leveling members are plural and are arranged in one-to-one correspondence with the first pins of the first binding member.

In one embodiment, the leveling mechanism further comprises a second magnetic attraction and repulsion force control assembly, and the second magnetic attraction and repulsion force control assembly is used for controlling the generation of magnetic attraction and repulsion force between the first magnetic leveling member and the second magnetic leveling member and adjusting the magnitude of the magnetic attraction and repulsion force; and/or

The second magnetic attraction and repulsion force control assembly is also used for controlling the third magnetic leveling part and the second magnetic leveling part to generate magnetic attraction and repulsion force and adjusting the magnitude of the magnetic attraction and repulsion force;

preferably, the warpage monitoring mechanism is further configured to monitor a warpage rate of the first binding member before pre-compression, and the second magnetic attraction and repulsion force control assembly is further configured to adjust a magnitude of a magnetic attraction force between the first magnetic leveling member and the second magnetic leveling member and/or between the third magnetic leveling member and the second magnetic leveling member according to the monitored warpage rate.

In another aspect of the present invention, a binding method is provided, which includes the following steps:

placing a first binding on a binding platform;

at least part of the binding pressure heads of the plurality of binding pressure heads acquire a second binding piece and pre-press and connect the first binding piece and the second binding piece to form a pre-press connection state, wherein the binding driving mechanism independently provides pre-press relay for each binding pressure head in the pre-press connection state;

the warpage monitoring mechanism monitors warpage rates of the first binding and the second binding in a pre-crimping state and determines warpage positions;

the binding driving mechanism adjusts pre-pressing relay provided by the binding pressure head corresponding to the warping position until the warping rates of the first binding piece and the second binding piece are within a preset range;

and at least part of the binding pressure heads press the first binding piece and the second binding piece to form a pressing state, wherein the binding driving mechanism provides pressing force for each binding pressure head in the pressing state.

Before positive pressure, at least part of the binding pressure heads of the plurality of binding pressure heads acquire a second binding piece and pre-press and connect the first binding piece and the second binding piece to form a pre-press connection state, and the binding driving mechanism independently provides pre-press relay for each binding pressure head in the pre-press connection state; and then the binding driving mechanism adjusts the pre-pressing relay provided by the binding pressure heads corresponding to the warping positions until the warping rates of the first binding piece and the second binding piece are within a preset range, then at least part of the binding pressure heads press the first binding piece and the second binding piece for positive pressure, and the binding driving mechanism provides pressing force for each binding pressure head in a pressing state. Therefore, the prepressing relay provided by each binding pressure head is independently controlled, the prepressing relay at the warping position can be accurately controlled, the flatness of the binding piece before pressing is quickly and effectively adjusted within a controllable range, the problem that the binding yield rate is reduced due to the fact that the binding piece is warped and uneven during integral pressing is solved, and the binding yield rate is improved.

Specifically, before the positive pressure driving mechanism presses the first binding piece and the second binding piece, the pre-pressing driving mechanism is adopted to drive the plurality of binding pressure heads to pre-press the first binding piece and the second binding piece with the plurality of second pins, and pre-pressing relay provided by each binding pressure head is controlled. For example, before and/or after the first pre-crimping, the warping monitoring mechanism monitors the warping rate of the first binding piece and the second binding piece in the pre-crimping state and determines the warping position, then the pre-pressing relay provided by the binding pressure head corresponding to the warping position is adjusted through the pre-crimping driving mechanism, at the moment, the pre-crimping is equivalent to the second pre-crimping, until the warping rate of the first binding piece and the second binding piece is within the preset range, namely, the flatness of the first binding piece and the second binding piece is controlled within the controllable range, the problem that the binding yield is reduced due to the fact that the binding pieces are warped and uneven during the integral crimping is solved, and the binding yield is improved.

In addition, the binding device and the binding method can adjust the warping rate of each warping position repeatedly through the matching of the pre-crimping driving mechanism and the warping monitoring mechanism until the warping rates of the first binding piece and the second binding piece are within a preset range, and then the positive pressure driving mechanism is used for positive pressure, so that the problem that the whole material is scrapped due to poor single or edge binding crimping can be reduced, the material waste is reduced, and the binding cost is reduced.

Drawings

FIG. 1 is a block diagram illustrating a state of a binding apparatus according to an embodiment;

FIG. 2 is a schematic diagram of a further state of the binding apparatus shown in FIG. 1;

FIG. 3 is a schematic view of a binding head of the binding apparatus shown in FIG. 1;

FIG. 4 is a schematic diagram of a first magnetic assembly of the binding apparatus shown in FIG. 1;

FIG. 5 is a schematic view of the binding ram and first binding member shown in FIG. 3;

FIG. 6 is a schematic diagram of a binding ram of another example of the binding apparatus shown in FIG. 1;

FIG. 7 is a top view of the first binding of FIG. 1;

FIG. 8 is a left side view of the binding apparatus shown in FIG. 1 without the binding ram;

fig. 9 is a schematic structural diagram of still another state of the binding apparatus shown in fig. 1.

Detailed Description

To facilitate an understanding of the invention, the invention will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

As mentioned in the background, the bonding (COG, Chip onGlass) of IC panels is often required in the display field. Currently, two COF (Chip on Flim/Flex) binding processes and a COP (Chip on Pi/Plastic) binding process are commonly adopted for flexible binding. Wherein the IC is an external gate drive IC.

Taking the COF binding manner as an example, the external gate driver IC is attached to a Flexible Printed Circuit (FPC), and then the flexible printed Circuit with the external gate driver IC attached thereto is bound to the substrate of the display panel.

Taking the COP binding method as an example, the external gate driving IC is directly bound on the binding region of the substrate of the display panel, and then connected to a Circuit board (FPC).

In the above two modes, the current external gate driver IC generally adopts a full pin design, that is, the output channel of the external gate driver IC and the gate lines are in one-to-one connection design, so that the output channel of the gate driver circuit provides a gate driving signal for each gate line.

The bonding electrical connection between the external gate driver IC and the substrate of the display panel is generally achieved by using a film-shaped Anisotropic Conductive Film (ACF) through a crimping process of a bonding device. It is understood that in some embodiments, a heating process is also incorporated into the crimping process.

In the two binding processes, when the substrate of the display panel is a Flexible substrate, the Flexible substrate and the external gate driver IC are preferably bound in a cof (chip on film) manner, that is, the external gate driver IC is firstly attached to a Flexible Printed Circuit (FPC), and then the Flexible Circuit board attached with the external gate driver IC is bound to the substrate of the display panel. This is because the COF formed by attaching the external gate driver IC to the Flexible Printed Circuit (FPC) is a Flexible material, so as to reduce the risk of breaking the lines in the Flexible substrate when the COF is bonded to the Flexible substrate under pressure.

However, on one hand, the FPC and the flexible substrate made of soft materials are easily warped, and even if a binding platform is provided in the binding process, the FPC and the flexible substrate are still easily warped, so that the binding yield is easily reduced to a certain extent. On the other hand, although the COF binding process is to bind the flexible printed circuit board (FPC) made of a soft material and the flexible substrate, the components acted by the binding device still adopt an integral rigid binding mode, which easily causes the abrasion of a binding area or the rejection of the whole set of materials due to poor compression bonding, and increases the binding cost of the screen body. For example, when the single or edge binding pressure is poor, the material cannot be adjusted in time, so that the whole material is scrapped, and the binding cost is increased.

Accordingly, to solve the above problems, the present invention provides a binding apparatus and a binding method, which can preferably improve the above problems.

For the purpose of illustration, the drawings show only the structures associated with embodiments of the invention. The binding apparatus will be described in detail with reference to the binding method.

Referring to fig. 1, an embodiment of the present invention provides a binding apparatus 10, which includes a binding platform 100, a plurality of binding heads 200, a binding driving mechanism, and a warpage monitoring mechanism.

The binding platform 100 is used to place a first binding 101. It is understood that the first binding 101 has a plurality of first pins 1011.

It is understood that the binding ram 200 herein can be divided into two rams for pre-crimping and for positive pressure. That is, at least a part of the plurality of binding rams 200 is used to obtain the second binding member 102 and pre-press-bond the second binding member 102 to the first binding member 101, so that the plurality of first pins 1011 and the plurality of second pins 1021 are arranged in a one-to-one matching manner, i.e., the at least a part of the plurality of binding rams 200 has a pre-press-bonded state in which the second binding member 102 is pre-pressed to the first binding member 101.

At least a part of the binding rams 200 of the plurality of binding rams 200 is used to press the second binding member 102 onto the first binding member 101, so that the plurality of first pins 1011 and the plurality of second pins 1021 are matched one by one, i.e. the at least a part of the binding rams 200 has a press-fit connection state in which the second binding member 102 is pressed onto the first binding member 101.

It is understood that the same binding ram 200 may be used for both pre-crimping and stitching; it is of course also possible to use a binding ram 200 only for pre-crimping or only for pressing.

The binding driving mechanism is in transmission connection with the binding pressure heads 200 and is used for independently providing pre-pressing relay force for each binding pressure head 200 in a pre-pressing state and providing pressing force for each binding pressure head 200 in a pressing state.

The warping monitoring mechanism is used for monitoring warping rates of the first binding piece 101 and the second binding piece 102 in a pre-pressing state and determining warping positions, and the binding driving mechanism is further used for adjusting pre-pressing relay provided by the binding pressure heads 200 corresponding to the warping positions.

The binding apparatus 10 may operate by the following steps S10 to S50.

Step S10, placing the first binding 101 on the binding platform 100.

Step S20, at least a part of the binding indenters 200 obtain the second binding member 102 and pre-press-bond the first binding member 101 and the second binding member 102 to form a pre-press-bond state, wherein the binding driving mechanism independently provides pre-press-bond force to each binding indenter 200 in the pre-press-bond state.

In step S30, the warp monitoring mechanism monitors the warp rate of the first and second binding 101, 102 in the pre-crimped state and determines the warp position.

Step S40, the binding driving mechanism adjusts the pre-pressing force provided by the binding indenter 200 corresponding to the warping position until the warping rates of the first binding member 101 and the second binding member 102 are within the preset range.

Step S50, the at least partial binding ram 200 presses the first binding member 101 and the second binding member 102 together to form a pressed state, wherein the binding driving mechanism provides a pressing force to each binding ram 200 in the pressed state.

Before positive pressure, at least part of the binding pressure heads 200 of the plurality of binding pressure heads 200 acquire the second binding piece 102 and pre-press and connect the first binding piece 101 and the second binding piece 102 to form a pre-press connection state, and the binding driving mechanism independently provides pre-press relay for each binding pressure head 200 in the pre-press connection state; and then the binding driving mechanism adjusts the pre-pressing relay provided by the binding pressure heads 200 corresponding to the warping positions until the warping rates of the first binding member 101 and the second binding member 102 are within a preset range, at least part of the binding pressure heads 200 press the first binding member 101 and the second binding member 102 for positive pressure, and the binding driving mechanism provides pressing force to each binding pressure head 200 in a pressing state. Therefore, the prepressing relay provided by each binding pressure head 200 is independently controlled, the prepressing relay at the warping position can be accurately controlled, the flatness of the binding piece before pressing is quickly and effectively adjusted within a controllable range, the problem of reduction of the binding yield caused by the fact that the binding piece is warped and uneven during integral pressing is avoided, and the binding yield is improved. It is understood that the binding ram 200 may be directly connected to a binding drive mechanism that drives the binding ram 200 for both pre-crimping and stitching, or the binding ram 200 may be driven for only pre-crimping or only stitching.

In one embodiment, the binding driving mechanism comprises a pre-compression driving mechanism and a positive pressure driving mechanism. The pre-compression driving mechanism is in transmission connection with at least part of the binding pressure head 200 and is used for pre-compressing the first binding piece 101 and the second binding piece 102 and independently providing pre-compression relay; the positive pressure driving mechanism is in transmission connection with at least part of the binding pressure head 200 and is used for pressing the first binding member 101 and the second binding member 102, so that the plurality of first pins 1011 and the plurality of second pins are matched and bound one by one. Thus, the two driving mechanisms respectively realize the driving of the pre-crimping and the positive pressure, and the operability of the pre-crimping and the positive pressure steps can be improved. Further, in this particular example, each binding ram 200 has a pre-press-fit state and the press-fit state. The pre-crimping driving mechanism and the positive pressure driving mechanism are in transmission connection with each binding pressure head 200 and are used for driving the binding pressure heads 200 to move towards the binding platform 100.

The binding device 10 now operates as follows: before the positive pressure driving mechanism presses the first binding member 101 and the second binding member 102 together, the pre-pressing driving mechanism is used to drive the plurality of binding pressing heads 200 to pre-press the first binding member 101 and the second binding member 102 with the plurality of second pins (as shown in fig. 2), and the pre-pressing force provided by each binding pressing head 200 is independently controlled. For example, before and/or after the first pre-crimping, the warping rate of the first binding member 101 and the second binding member 102 in the pre-crimping state is monitored by a warping monitoring mechanism, the warping position is determined, and then the pre-pressing force provided by the binding ram 200 corresponding to the warping position is adjusted by a pre-crimping driving mechanism, which is equivalent to the second pre-crimping until the warping rate of the first binding member 101 and the second binding member 102 is within the preset range, namely, the flatness of the first binding member 101 and the second binding member 102 is controlled within a controllable range. Therefore, the prepressing relay provided by each binding pressure head 200 is independently controlled, the prepressing relay at the warping position can be accurately controlled, the flatness of the binding piece before pressing is quickly and effectively adjusted within a controllable range, the problem of reduction of the binding yield caused by the fact that the binding piece is warped and uneven during integral pressing is avoided, and the binding yield is improved.

In addition, the binding device 10 and the binding method can adjust the warping rate of each warping position repeatedly through the matching of the pre-crimping driving mechanism and the warping monitoring mechanism until the warping rates of the first binding member 101 and the second binding member 102 are within the preset range, and then the positive pressure driving mechanism is used for positive pressure, so that the problem that the whole material is scrapped due to poor single or edge binding crimping can be solved, the material waste is reduced, and the binding cost is reduced.

By adopting the binding device 10 and the method for binding the flexible substrate and the IC in the display panel, the binding yield of the display panel can be effectively improved.

In some embodiments, the binding platform 100 may be a porous ceramic adsorption platform, or may be another adsorption platform with lower cost. The binding platform 100 may be vacuum suction-fixed with the binding placed thereon.

Referring to fig. 3, in some embodiments, each binding indenter 200 includes an indenter body 210 and a pressing portion 220 movably connected to the indenter body 210, and the pressing portion 220 can move relative to the indenter body 210 in a direction for pre-pressing the first binding member 101 and the second binding member 201 under an external force to provide a pre-pressing force. Thus, the pressing portion 220 moves relative to the indenter body 210 in a direction away from the indenter body 210 to provide a pre-pressing force, and further pushes the second binding member 102 to press and hold the first binding member 101.

In a specific example, the pressing head body 210 is provided with an accommodating cavity, the pressing portion 220 is movably coupled in the accommodating cavity, and the pressing portion 220 can move in a direction away from the pressing head body 210, so as to be at least partially exposed out of the accommodating cavity, so that the pressing portion 220 acts on the binding member.

More specifically, the binding ram 200 further includes a sliding assembly disposed between the ram body 210 and the pressure holding portion 220 for enabling sliding between the pressure holding portion 220 and the ram body 210.

More specifically, the binding ram 200 further includes a guide rod 230, and the guide rod 230 is assembled between the ram body 210 and the pressure holding portion 220 and extends lengthwise along a sliding path of the pressure holding portion 220 with respect to the ram body 210. The sliding between the pressing part 220 and the pressing head body 210 is used for guiding, and the pressing part 220 is prevented from being stressed and deviated. In this embodiment, a first end of the guide rod 230 is connected to the bottom of the accommodating cavity of the ram body 210, and a second end opposite to the first end extends lengthwise from the bottom of the accommodating cavity along the sliding path of the pressing portion 220 relative to the ram body 210. The pressure holding portion 220 is penetratingly disposed on the guide rods 230 to be movable in a direction approaching or departing from the binding member along the guide rods 230 by an external force to achieve binding of the first binding member 101 and the second binding member 102.

It is understood that in other embodiments, the guide rod 230 may also be disposed between the sidewall of the accommodating cavity and the sidewall of the pressing portion 220. In addition, the guiding structure for guiding the pressing portion 220 may also be other structures besides the guide rod 230, for example, one of the pressing portion 220 and the side wall of the accommodating cavity is provided with a sliding slot extending lengthwise along the sliding path of the pressing portion 220 relative to the pressing head body 210, and the other is provided with a sliding rail embedded in the sliding slot, which only needs to realize a guiding basis for the stable movement of the pressing portion 220 toward or away from the binding piece, and is not limited herein.

Further, the pressing portion 220 is further provided with a suction hole for communicating vacuum to suck and obtain the second binding member 102 (as shown in fig. 1), for example, when the first binding member 101 is a flexible substrate, the second binding member 102 is a chip (external gate driver IC) or a circuit board with a chip (FPC).

Further, the pre-crimping driving mechanism includes a plurality of pre-crimping driving units for driving the respective binding rams 200. Thus, each binding ram 200 can be independently driven by a plurality of pre-compression driving units.

Referring to fig. 4, each pre-press driving unit includes a first magnetic component 310, a second magnetic component capable of generating a magnetic attraction and repulsion force with the first magnetic component 310, and a first magnetic attraction and repulsion force control component for controlling the generation of the magnetic attraction and repulsion force between the first magnetic component 310 and the second magnetic component and adjusting the magnitude of the magnetic attraction and repulsion force.

It is possible to control whether the magnetic attraction force or the magnetic repulsion force is generated between the first magnetic assembly 310 and the second magnetic assembly through the first magnetic attraction and repulsion force control assembly as needed, and adjust the magnitude of the magnetic attraction force or the magnetic repulsion force as needed.

The first magnetic element 310 is disposed on the pressure head body 210, the second magnetic element is disposed on the pressing portion 220, and the first magnetic element 310 and the second magnetic element are disposed opposite to each other, so that the pressing portion 220 moves in a direction away from the pressure head body 210 under the action of a magnetic repulsive force between the first magnetic element 310 and the second magnetic element. During pre-pressing, the first magnetic attraction and repulsion force control assembly controls the first magnetic assembly 310 and the second magnetic assembly to generate magnetic repulsion force, and the magnetic repulsion force drives the pressing portion 220 to move in a direction away from the pressing head body 210, thereby providing pre-pressing force.

The pre-crimping step is thus a magnetic pre-crimping. In some embodiments, the pre-crimp pressure ranges from 1MPa to 3 MPa. Compared with the positive pressure (3 MPa-90 MPa, generally more than 3MPa), the pre-compression joint has small pressure, and the main function is to provide a better flatness for the positive pressure and facilitate the positive pressure step.

Referring to fig. 4, specifically, each of the magnetic assemblies herein, including the first magnetic assembly 310 and the second magnetic assembly, may include a magnetic control block 311 and a control coil 312 for controlling the magnetic control block 311, and by adjusting the direction of the current in the control coil 312, whether a magnetic attraction force or a magnetic repulsion force is generated between the first magnetic assembly 310 and the second magnetic assembly can be adjusted. By adjusting the current in the control coil 312, the magnetic attraction or repulsion between the first magnetic element 310 and the second magnetic element can be adjusted.

Further, the second magnetic component is disposed inside the pressing portion 220. The first magnetic assembly 310 is disposed inside the indenter body 210.

It is understood that in other examples, as long as one of the first magnetic assembly 310 and the second magnetic assembly includes the magnetic control block 311 and the control coil 312 for controlling the magnetic control block 311, the other is a magnetic member. For example, the first magnetic component 310 includes a magnetic control block 311 and a control coil 312 for controlling the magnetic control block 311, and the second magnetic component is a magnetic member. Thus, by changing the current direction of the control coil 311 in the first magnetic assembly 310, the magnetic attraction or repulsion force applied to the second magnetic assembly can be changed; the magnitude of the magnetic attraction or repulsion force applied to the second magnetic assembly can be changed by changing the magnitude of the current of the control coil 311 in the first magnetic assembly 310.

It can be understood that, in general, the positive pressure may be achieved by moving the pressing plate close to the binding platform 100 under the driving of the positive pressure driving mechanism, so as to press the binding member between the pressing plate and the binding platform 100. For example, the positive pressure driving mechanism may be a driving mechanism that can perform linear motion, such as an air cylinder.

Further, in the present invention, the pressing plate in the positive pressure driving mechanism can be replaced by the binding pressure head 200, that is, the binding pressure head 200 is used for both positive pressure and pre-pressure welding.

Specifically, a positive pressure drive mechanism is coupled to the ram body 210 for controlling the binding ram 200 to move toward the binding platform 100, e.g., to effect a depressing action. That is, when positive pressure is needed, all the binding rams 200 press the first binding member 101 and the second binding member 102 under the driving of the positive pressure driving mechanism, so that the plurality of first pins 1011 and the plurality of second pins are matched and bound one by one.

It can be understood that the binding positive pressure is performed after the pre-compression of all the pins is completed, and the binding is completed finally. After the binding is completed, the above-mentioned magnetic repulsion may be removed in order to facilitate the removal of the bound product. In order to facilitate the resetting of the pressing portion 220, the magnetic repulsion may be converted into a magnetic attraction force, so that the pressing portion 220 is reset under the action of the magnetic attraction force.

Each pressing portion 220 is independently movable in a direction away from the ram body 210 with respect to the ram body 210 by each pre-pressing driving unit. Further, each ram body 210 of each binding ram 200 is also independent of each other. The crimping portion 220 may operate independently in the pre-crimping step. In other words, the binding rams 200 are independent of each other, and the binding rams 200 may function independently during the positive pressure step, or may work simultaneously. At this time, the positive pressure driving mechanisms are plural, and are connected with the pressure head bodies 210 of the binding pressure heads 200 in a one-to-one correspondence manner, and are used for driving the binding pressure heads 200 to press the first binding member 101 and the second binding member 102, so that the first pins 1011 and the second pins are matched and bound one by one.

Referring to fig. 5, in the present embodiment, the number of the pressing portions 220 connected to the same ram body 210 is one, that is, one pressing portion 220 is connected to each ram body 210. More specifically, to better control the binding of each pin, a plurality of binding rams 200 are provided in one-to-one correspondence with a plurality of second pins and/or a plurality of first pins 1011. That is, each binding ram 200 is used to press-fit each second leg of the second binding 102 to the matching first leg 1011 of the first binding 101 in a one-to-one correspondence.

Referring to fig. 6, it can be understood that, in other examples, the number of the pressing portions 220 connected to the same pressing head body 210 is two or more; and the number of the pressing portions 220 connected to each of the pressing head bodies 210 may be the same or different.

When the number of the pressing portions 220 connected to the same indenter body 210 is plural, it is preferable that each indenter body 210 is connected to an odd number of the pressing portions 220. This is because if the indenter body 210 is connected with an even number of pressure holding portions 220, when the stress point is concentrated in the middle, the pressure holding portion 220 located in the middle is not pressed well, and the pressure holding portion is easily stressed unevenly and extends to both sides, which causes a larger bad pressure effect. The pressure head body 210 is connected with an odd number of pressure holding parts 220, the pressure holding parts 220 at both sides of the pressure holding part 220 at the middle part are symmetrically distributed, and when the stress points are concentrated at the middle part, the pressure connection of the pressure holding part 220 at the middle part is poor but is not easy to extend to both sides because the stress is relatively uniform. Therefore, the preferable setting can better ensure the binding and crimping yield.

It can be understood that the pressing portion 220 connected to the same ram body 210 still operates independently, but the pressing portions 220 on the same ram body 210 operate simultaneously in the positive pressure step.

In yet another example, each ram body 210 of all binding rams 200 is connected by a connecting portion to form a unitary ram body 210.

The number of the positive pressure driving mechanisms corresponds to the number of the ram bodies 210 all the time, and each positive pressure driving mechanism is connected with the ram body 210 in a one-to-one correspondence manner to drive the ram body 210.

It is understood that the side of the second binding member 102 facing away from the second pin may be provided with a magnetic member 1021, such that the magnetic member 1021 in the second binding member 102 is opposite to the magnetic property of the second magnetic component, generating a magnetic repulsion force acting on the first binding member 101, assisting the pre-crimping and pressing process.

With continued reference to fig. 1 and 2, in some embodiments, the binding apparatus 10 further includes a flattening mechanism for flattening the first binding 101. The leveling mechanism includes a first magnetic leveling member 510 and a second magnetic leveling member 520, and a magnetic attraction can be generated between the first magnetic leveling member 510 and the second magnetic leveling member 520 to level the first binding 101 between the first magnetic leveling member 510 and the second magnetic leveling member 520.

Further, since the first binding 101 is placed on the binding platform 100 during the binding process, the first magnetic flat 510 may be placed on a surface of the first binding 101 remote from the binding platform 100; the second magnetic leveling member 520 is disposed inside the binding platform 100 to prevent the second magnetic leveling member 520 from being disposed on the binding platform 100 near the upper surface of the first binding member 101 and further affecting the flatness of the first binding member 101.

Specifically, and in order to avoid affecting the pins of the binding regions, the first magnetic flat 510 is arranged to correspond to the non-binding region of the first binding 101, but close to the binding region of the first binding 101, and the distance between the first magnetic flat 510 and the binding region of the first binding 101 should be as close as possible. The unbound area of the first binding 101 is thus fixed and flattened for better binding of the bound area.

Specifically, the second magnetic leveling member 520 is disposed inside the binding platform 100, so that it can be disposed corresponding to the binding region of the first binding member 101, so that the generated magnetic attraction acts on the binding region, thereby making the binding region more even. And in order for the second magnetic leveling member 520 to function better with the first magnetic leveling member 510, the projection of the second magnetic leveling member 520 and the first magnetic leveling member 510 partially overlap in a direction perpendicular to the binding platform 100.

More specifically, the number of the second magnetic leveling members 520 is plural, so that the first pins 1011 of the first binding member 101 are disposed in one-to-one correspondence with the second magnetic leveling members 520. Since the pins are typically arranged in an array spacing, for example as shown in figure 7, the first pins 1011 of the first binding 101 are arranged in an array spacing. Accordingly, a plurality of second magnetic flats 520 are also provided in an array spaced apart.

Further, the leveling mechanism further comprises a third magnetic leveling member 530, and the third magnetic leveling member 530 is arranged corresponding to the binding area of the first binding member 101 and is disposed on a side of the first binding member 101 away from the binding ram 200. A magnetic attraction can be generated between the third magnetic flattening member 530 and the second magnetic flattening member 520 to flatten the binding region of the first binding 101.

Further, the third magnetic leveling member 530 partially overlaps the projection of the first magnetic leveling member 510 in a direction perpendicular to the binding platform 100. And preferably for first magnetic flattening 510, the portion of first magnetic flattening 510 that overlaps is equal to or greater than half the area of first magnetic flattening 510.

Specifically, in one example, the first binding member 101 is a flexible substrate, and one side of the flexible substrate is further provided with a transfer film 103, particularly a large-sized flexible substrate. When the flexible substrate is placed on the binding stage 100, the transfer film 103 of the flexible substrate and the binding stage 100 are in contact with each other. In this specific example, the third magnetic leveling member 530 may be disposed on the surface or inside of the transfer film 103 by coating or the like, so as to ensure the surface of the transfer film 103 is flat.

The surface of the transfer film 103 may contain a weakly adhesive material or an adsorption micro-disk to facilitate the subsequent peeling of the transfer film 103.

Further, the leveling mechanism further includes a second magnetic attraction and repulsion force control assembly for controlling the generation of the magnetic attraction and repulsion force between the first magnetic leveling member 510 and the second magnetic leveling member 520 and adjusting the magnitude of the magnetic attraction and repulsion force.

The second magnetic attraction and repulsion force control assembly is further used for controlling the generation of the magnetic attraction and repulsion force between the third magnetic leveling member 530 and the second magnetic leveling member 520 and adjusting the magnitude of the magnetic attraction and repulsion force.

The second magnetic repulsion force control component thus controls the magnitude of the magnetic attraction between the first or third magnetic

flat member

510, 530 and the second magnetic flat member 520 to adjust the flatness of the first binding member 101.

Above-mentioned leveling mechanism, through the magnetic action of magnetism leveling layer, avoids adopting the damage that hard direct contact's mode brought for the flexible substrate, levels first binding pieces 101 such as flexible substrate in advance simultaneously.

Specifically, the warp monitoring mechanism is also used to monitor the warp rate of the first binding 101 before pre-compression; the second magnetic attraction force control assembly is also used to adjust the magnitude of the magnetic attraction force between the first magnetic leveling member 510 or the third magnetic leveling member 530 and the second magnetic leveling member 520 based on the monitored warp rate if the warp rate of the first binding member 101 monitored by the warp monitoring mechanism is not acceptable.

Further, when the second magnetic leveling members 520 are multiple and are arranged in one-to-one correspondence with the first pins 1011 of the first binding member 101, the warpage monitoring mechanism is further configured to monitor the warpage rate of the first binding member 101 before pre-compression bonding and determine a warpage position; then, the magnitude of the magnetic attraction between the second magnetic leveling member 520 and the first magnetic leveling member 510 corresponding to the warping position is adjusted by the second magnetic repulsion control assembly until the warping rate of the first binding member 101 is within the preset range, and then the subsequent pre-compression step is performed.

In other words, the warp monitoring mechanism is further configured to monitor the warp rate of the first binding 101 before and after each leveling of the first binding 101 by the leveling mechanism, and the second magnetic repulsion force control assembly is further configured to adjust the magnitude of the magnetic attraction between the first magnetic leveling member 510 and the second magnetic leveling member 520 based on the monitored warp rate.

It is understood that whether the magnetic attraction force or the magnetic repulsion force is generated between the first magnetic flat member 510 or the third magnetic flat member 530 and the second magnetic flat member 520 can be controlled by the second magnetic attraction force control assembly as needed, and the magnitude of the magnetic attraction force or the magnetic repulsion force can be adjusted as needed.

It is understood that after the stitching step, i.e. after the binding is completed, the magnetic attraction force generated between the first magnetic leveling member 510 or the third magnetic leveling member 530 and the second magnetic leveling member 520 can be controlled to be removed by the second magnetic attraction and repulsion force control component. In order to take out the bound product better, the magnetic attraction can be converted into magnetic repulsion, and the bound first binding members 101 such as the flexible substrate can be blanked conveniently by means of the magnetic repulsion between the controllable magnetic leveling layers. Meanwhile, the transfer film 103 can be used as a subsequent process, and can be peeled off before blanking.

It is understood that, in an example, each of the magnetic leveling members may include a magnetic control block and a control coil for controlling the magnetic control block, and whether a magnetic attraction force or a magnetic repulsion force is generated between the two magnetic leveling members can be adjusted by adjusting a current direction in the control coil. The magnetic attraction force or the magnetic repulsion force between the two magnetic leveling pieces can be adjusted by adjusting the current in the control coil.

It is understood that in another example, the second magnetic leveling member 520 may be provided with a magnetic control block and a control coil for controlling the magnetic control block, and the first magnetic leveling member 510 and the second magnetic leveling member 520 may be magnetic leveling members. Thus, by changing the current direction of the control coil in the second magnetic leveling member 520, the force-receiving directions of the first magnetic leveling member 510 and the third magnetic leveling member 530 can be changed, i.e., whether the magnetic attraction force or the magnetic repulsion force is generated between the second magnetic leveling member 520 and the first magnetic leveling member 510, and between the second magnetic leveling member 520 and the third magnetic leveling member 530 is changed. Accordingly, the magnitude of the magnetic attraction or repulsion force to which the first and third magnetic leveling

members

510 and 530 are subjected can be varied by varying the magnitude of the current to the control coils in the second magnetic leveling member 520.

That is, the second magnetic repulsion force control component only needs to be connected with the second magnetic leveling member 520 and can control the second magnetic leveling member 520.

In addition, when the second magnetic leveling members 520 are multiple and are arranged corresponding to the first pins 1011 of the first binding member 101, the second magnetic attraction and repulsion force control assembly is used for adjusting the magnitude of the magnetic field generated by the second magnetic leveling members 520, the number of the starting operations of the second magnetic leveling members 520 and the sequence of the starting operations until the flatness of the flexible screen body is determined to be within the controllable range. The second magnetic flat 520 initiates a sequence of operations, such as from left to right or from the middle to both sides, which can expel the gas during crimping.

Therefore, through the independent pressing part 220 and the second magnetic flat pieces 520 distributed in an array mode, the prepressing relay and the magnetic attraction force of each pin position can be independently adjusted, the problem that one or more pins are poor in binding and pressing is solved, the binding efficiency of positive pressure is improved, and material waste is reduced.

In some embodiments, the warpage monitoring mechanism includes a warpage monitoring camera 400, and the shooting angle of the warpage monitoring camera 400 can be adjusted, and the field of view can cover the bonding area, so that images of all pins in the bonding area can be shot. Specifically, a plurality of warpage monitoring cameras 400 may also be provided, the plurality of warpage monitoring cameras 400 are provided on the front or the side of the binding platform 100, for example, three warpage monitoring cameras 400 are provided on the front or two sides of the binding platform 100, respectively, as shown in fig. 8.

The warpage monitoring mechanism can measure the overall warpage rate of the binding piece and can also measure the warpage rate of the binding piece corresponding to each pin. It is understood that the warp monitoring mechanism further comprises a data processing module. Specifically, the warpage detection camera acquires position images of pins in a binding area of the binding piece, and the position images are processed by a data processing module in the warpage monitoring mechanism to correspondingly obtain a warpage position.

Referring to fig. 9, in some embodiments, a pin cleaning mechanism 600 is further included for cleaning the first pin 1011 of the first binding 101 prior to pre-compression.

The binding device 10 is particularly suitable for use in the case of flexible substrates and flexible circuit boards.

Specifically, the example shown in fig. 1 adopts a COF bonding process, and further, the first bonding member 101 is a flexible substrate, and the second bonding member 102 is a circuit board. In some examples, the circuit board is a flexible circuit board or a chip on film.

That is, the external gate driver IC may be integrated on the flexible circuit board to form the chip on film, and then the flexible circuit board in the chip on film is bound with the substrate by using the binding device 10 or the binding method, so as to bind the chip on film with the substrate.

Further, the substrate is a flexible substrate. After the step of forming the flip chip on film and before the step of bonding, the method further comprises the steps of: the flexible circuit board in the COF is bent to the back side of the screen (the surface of the substrate opposite to the surface of the display area). After the flexible printed circuit board is bent, the flexible printed circuit board is bound with the substrate by the binding device 10 or the binding method, so that the binding of the chip on film and the substrate is realized.

Specifically, the flexible circuit board may be made of polyimide or polyester film.

It is understood that the above-described binding method is not limited to the COF binding process, but is also applicable to the COP binding process. That is, it is applicable not only to the binding between the substrate and the circuit board but also to the binding between the substrate and the external gate driver IC (i.e., chip). That is, the first binding 101 is a substrate and the second binding 102 is a chip.

Similarly, the external gate driver IC (i.e., the chip) also has a plurality of second pins, which are matched with the plurality of first pins 1011 of the substrate in a one-to-one correspondence. It is understood that the first binding 101 and the second binding 102 are not limited thereto, and may be applied to all similar structures requiring binding.

When the binding method is applied to a COP binding process, the difference from the COF binding process is that an external gate driver IC is directly bound with a substrate by using the binding device 10 or the binding method; and then the circuit board is connected.

Further, the substrate is a flexible substrate. After the step of binding, before the circuit board is connected, the method further comprises the steps of: and bending the substrate integrated with the external grid drive IC to the back surface of the screen (the surface of the substrate opposite to the surface of the display area), so that the substrate integrated with the external grid drive IC is connected with the circuit board on the back surface of the screen.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims

1. A binding apparatus, comprising:

the binding platform is used for placing a first binding piece;

and the warping monitoring mechanism is used for monitoring the warping rate of the first binding piece and the second binding piece in a pre-pressing state and determining a warping position, and the binding driving mechanism is also used for adjusting the pre-pressing relay provided by the binding pressure head corresponding to the warping position.

2. The binding apparatus according to claim 1, wherein the binding driving mechanism comprises a pre-pressing and connecting driving mechanism and a positive pressure driving mechanism, the pre-pressing and connecting driving mechanism is in transmission connection with at least a part of the binding pressure head, and is used for pre-pressing and connecting the first binding member and the second binding member;

3. The binding apparatus of claim 2, wherein each binding ram has the pre-press-fit state and the press-fit state;

4. The binding apparatus according to claim 2, wherein each binding indenter comprises an indenter body and a pressing portion movably connected to the indenter body, and the pressing portion is capable of moving relative to the indenter body in a direction for pre-pressing the first binding member and the second binding member.

5. The binding apparatus according to claim 4, wherein the number of the pressure holding portions connected to the same pressure head body is one or more;

6. The binding apparatus according to claim 5, wherein an odd number of said pressure holding portions are connected to each of said pressure head bodies.

7. The binding apparatus of claim 5, wherein the number of pressure holding portions connected to each pressure head body is the same.

8. The binding apparatus according to claim 4, wherein the pre-crimping drive mechanism includes a plurality of pre-crimping drive units for driving the respective binding rams;

9. The binding apparatus according to any one of claims 1 to 8, further comprising a flattening mechanism for flattening the first binding member, the flattening mechanism comprising a first magnetic flattening member and a second magnetic flattening member, the first magnetic flattening member and the second magnetic flattening member being capable of generating a magnetic attractive force therebetween to flatten the first binding member between the first magnetic flattening member and the second magnetic flattening member.

10. The binding apparatus according to claim 9, wherein the first magnetic leveling member is configured to be disposed on a surface of the first binding member remote from the binding platform, and the second magnetic leveling member is disposed inside the binding platform.

11. The binding apparatus according to claim 10, wherein the second magnetic leveling member is disposed corresponding to a binding region of the first binding member having a first pin; the first magnetic flattening piece is used for being arranged corresponding to the non-binding area of the first binding piece; the second magnetic flattening overlaps the first magnetic flattening in projection in a direction perpendicular to the binding platform.

12. The binding apparatus according to claim 10, wherein the leveling mechanism further comprises a third magnetic leveling member disposed corresponding to the binding region of the first binding member and on a side of the first binding member away from the binding head, wherein a magnetic attraction force can be generated between the third magnetic leveling member and the second magnetic leveling member to level the binding region of the first binding member.

13. The binding apparatus of claim 12, wherein the projections of the third magnetic flattening and the first magnetic flattening partially overlap in a direction perpendicular to the binding platform.

14. The binding apparatus according to claim 11, wherein the second magnetic flat member is plural and is configured to be disposed in one-to-one correspondence with the first pin of the first binding member.

15. The binding apparatus according to claim 12, wherein the leveling mechanism further comprises a second magnetic attraction/repulsion force control component, the second magnetic attraction/repulsion force control component is configured to control generation of magnetic attraction/repulsion force between the first magnetic leveling member and the second magnetic leveling member and adjust magnitude of the magnetic attraction/repulsion force; and/or

The second magnetic attraction and repulsion force control assembly is also used for controlling the third magnetic leveling part and the second magnetic leveling part to generate magnetic attraction and repulsion force and adjusting the size of the magnetic attraction and repulsion force.

16. The binding apparatus of claim 15, wherein the warpage monitoring mechanism is further configured to monitor a warpage rate of the first binding member prior to pre-compression, and the second magnetic attraction/repulsion control assembly is further configured to adjust a magnitude of a magnetic attraction force between the first and second magnetic leveling members and/or between the third and second magnetic leveling members based on the monitored warpage rate.

17. A method of binding, comprising the steps of:

placing a first binding on a binding platform;