CN110459481A - Packaging method of semiconductor element and alignment mold thereof - Google Patents

Abstract

The present invention is for a kind of packaging method of semiconductor element and its to position mould, a plurality of semiconductor elements mainly are set on the surface of a substrate, and a mould release or a non-sticky adhesion coating are coated in a plurality of forming cavities of a mold, wherein the area of substrate is greater than the area of mold.Packaging plastic is set in the forming cavity of mold, and by the forming cavity of the semiconductor element alignment mold on substrate, so that the semiconductor element on packaging plastic cladding substrate.After glue hardened forming to be packaged, mold is separated with packaging plastic, to complete the encapsulation of semiconductor element.By the use of mould release or non-sticky adhesion coating, the molding size of packaging plastic and shape can be effectively controlled, and use the biggish substrate of active area, then can control the excessive glue of extra packaging plastic to flow to, packaging plastic is avoided to overflow to the encapsulation face of substrate.

Description

Packaging method of semiconductor element and alignment mold thereof

technical field

The invention relates to a packaging method of semiconductor elements and an alignment mold thereof, which can effectively control the size and shape of the molding of the packaging glue, and is beneficial to improve the packaging structure of the packaging quality.

Background technique

Light-emitting diodes (LEDs; Light-Emitting Diode) are widely used in indicator lights, Advertising billboards, traffic lights, car lights, display panels, communication appliances, consumer electronics and other products.

In the manufacturing process of semiconductor devices and light-emitting diodes, packaging is a relatively downstream process step. However, semiconductor components or light-emitting diodes can only be used in practice after packaging. Taking light-emitting diodes as an example, the encapsulant covering the light-emitting diode crystal grains can not only protect the light-emitting diode grains, but also improve luminous efficiency. After doping different phosphors or quantum dots (Quantum Dots) in the encapsulant, the light source emitted by the light-emitting diode crystal can produce different colors or different wavelengths after passing through the phosphors or quantum dots in the encapsulation layer projected light source.

However, if the shape of the encapsulant is not as expected, or the alignment between the encapsulant and the light-emitting diode die is not accurate, it will often cause the light source produced by the light-emitting diode die to fail to be exported through the encapsulant as expected. Or the derived light pattern or angle is different from the preset value, thereby affecting the luminous efficiency and practicability of the light emitting diode device. Therefore, light-emitting diodes have high requirements on packaging, and usually high-precision die-bonding machines and alignment equipment before packaging must be used, which will increase the installation cost of light-emitting diodes.

Contents of the invention

The object of the present invention is to provide a kind of encapsulation method of semiconductor element, mainly coating or spraying a release agent with a thinner thickness on the surface of the mould, or adding a non-stick layer at the mould, so that the encapsulation adhesive will not Sticking to the mold not only facilitates the separation of the mold and the molded encapsulant, but also increases the volume of the hardened and molded package, and facilitates the export of the light source generated by the coated light-emitting diode crystal grains through the package.

Another object of the present invention is to provide a light-emitting diode alignment mold, through the first alignment unit on the mold, the second alignment unit on the substrate, and the three alignment units of the clamping jaw device, it can Complete the alignment and positioning of the molding cavity of the mold and the semiconductor element on the substrate, so as to improve the efficiency of production and packaging.

Another object of the present invention is to provide an alignment mold for light-emitting diodes. The active area of the substrate will be larger than the active area of the mould, and the substrate is arranged on the vertical upper surface of the mould, which can control the flow direction of the overflow of the packaging glue and avoid The encapsulation glue overflows to the non-encapsulation surface of the substrate, and the encapsulation quality of the semiconductor element is improved by controlling the amount of pressing force on the substrate.

In order to achieve the above object, the present invention proposes a semiconductor element packaging method, comprising: setting a plurality of semiconductor elements on one or a plurality of substrate surfaces; preparing one or a plurality of moulds, which include a plurality of molding cavities; Apply a release agent in the cavity or add a non-stick layer on the surface of the mold; fill the molding cavity of the mold with an encapsulant; align the semiconductor element on the substrate with the molding cavity of the mold; attach the substrate to the mold , so that the encapsulation glue covers the semiconductor element disposed on the substrate; and after the encapsulation glue is hardened and formed into a package body, the mold is separated from the package body.

The present invention proposes an alignment mold for a semiconductor element, comprising: one or a plurality of moulds, including a plurality of molding cavities and a plurality of first alignment units; one or a plurality of clamping jaw devices, including a plurality of third alignment units , wherein the third alignment unit corresponds to the first alignment unit, and the clamping jaw device is used to absorb or clamp and fix one or more substrates, a plurality of semiconductor elements are arranged on one surface of the substrate, and the active area of the substrate will be Larger than the active area of the mould, the clamping jaw device can act to attach the substrate to the mould, so that the semiconductor element is placed in the corresponding molding cavity.

In an embodiment of the present invention, the mold is located below the substrate, and the active area of the substrate is larger than the active area of the mold.

In one embodiment of the present invention, the following steps are included: the mold is provided with a plurality of first alignment units, and the substrate is provided with a plurality of second alignment units corresponding to the positions of the first alignment units, and the second alignment unit of the substrate is The units will align with the first alignment unit of the mould, and interlock with each other.

In one embodiment of the present invention, the following steps are included: the substrate provided with the semiconductor element is adsorbed or clamped and fixed on a clamping device, and moves along with the clamping device, wherein the mold has a plurality of first alignment unit, the substrate has a plurality of second alignment units, and the gripper device has a plurality of third alignment units, and the first alignment unit, the second alignment unit and the third alignment unit can be inserted into each other.

In an embodiment of the present invention, the first alignment unit is a pair of alignment posts, the second alignment unit is a pair of alignment holes, and the third alignment unit is a pair of alignment holes or a pair of alignment holes.

In an embodiment of the present invention, wherein the jaw device and the mold are arranged in a chamber of a production machine, the production machine is provided with at least one chamber, and at least one jaw device and at least one mold are arranged in the chamber.

In an embodiment of the present invention, the surface of the molding cavity of the mold is coated with a release agent or provided with a non-stick layer.

In an embodiment of the present invention, a lifter that can be connected to the jaw device is provided in the chamber.

In an embodiment of the present invention, a glue supply part is arranged in the cavity, which can move to the upper surface of the mold and provide a packaging glue or a release agent to the mold.

In one embodiment of the present invention, a plastic holding tray is also included to contain the mold.

The beneficial effects of the present invention are:

The invention provides a packaging method for semiconductor elements and an alignment mold thereof. Through the use of a release agent or a non-stick layer, the size and shape of the packaging adhesive can be effectively controlled, and the use of a substrate with a larger active area will The flow direction of excess encapsulation glue can be controlled to prevent the encapsulation glue from overflowing to the non-encapsulation surface of the substrate.

Description of drawings

FIG. 1 is a side view of an embodiment of a packaging method for a semiconductor element of the present invention.

FIG. 2 is a side view of an embodiment of a packaging method for a semiconductor element of the present invention.

FIG. 3 is a side view of an embodiment of a packaging method for a semiconductor element of the present invention.

FIG. 4 is a side view of an embodiment of a packaging method for a semiconductor element of the present invention.

FIG. 5 is a side view of an embodiment of an alignment mold for a semiconductor element of the present invention.

FIG. 6 is a side view of an embodiment of an alignment mold for a semiconductor element of the present invention.

FIG. 7 is a side view of another embodiment of an alignment mold for a semiconductor element of the present invention.

FIG. 8 is a schematic perspective view of another embodiment of an alignment mold for a semiconductor device according to the present invention.

Description of main component symbols:

11: Substrate; 113: Second alignment unit; 119: Second alignment unit; 13: Semiconductor element; 131: Light-emitting diode grain; 15: Mold; 151: Molding cavity; 153: Release agent; 155 : first alignment unit; 159: mold wall; 17: packaging glue; 171: packaging body; 173: protective layer; 23: gripper device; 231: third alignment unit; 25: mold; 251: molding cavity; 253: non-stick layer; 255: first alignment unit; 30: production machine; 31: chamber; 33: lifting parts; 35: glue supply parts; Active area.

Detailed ways

Please refer to FIG. 1 to FIG. 4 , which are side views of each step in an embodiment of a packaging method of a semiconductor device according to the present invention. As shown in the figure, firstly, a plurality of semiconductor elements 13 are disposed on a surface of a substrate 11, and a mold 15 is prepared, and the mold 15 has a plurality of molding cavities 151, as shown in FIG. 1 . The substrate 11 can be a silicon (Si) substrate, an aluminum oxide (A ₂ O ₃ ) substrate, an aluminum nitride (AlN) substrate, a sapphire substrate, a silicon carbide (SiC) substrate, a gallium arsenide (GaAs) substrate, a glass substrate (Glass ), circuit board (PCB), or ceramic substrate.

Specifically, the semiconductor elements 13 disposed on the surface of the substrate 11 can be arranged in any form, for example, disposed in a matrix on a surface of the substrate 11 . The semiconductor element 13 can be a light-emitting diode crystal grain, a semiconductor chip, etc. Taking the light-emitting diode crystal grain 131 as an example, it usually includes a stack of P-type material and N-type material, and between the P-type material and the N-type material A PN interface is formed between them.

In one embodiment of the present invention, an N-type material can be formed on the substrate 11, and then a P-type material can be formed on the N-type material, and finally, the N-type material and the P-type material can be formed through semiconductor processes such as exposure, development, and etching. set, thereby forming a plurality of light-emitting diode crystal grains 131 on the substrate. The manufacturing method of the above light-emitting diode crystal grains 131 is a common technology in the field of the present invention, and no further description is given here. In addition, for those skilled in the field of the present invention, the light emitting diode crystal grain 131 can also be manufactured in different ways and steps, for example, the light emitting diode crystal grain 131 can be disposed on the surface of the substrate 11 in a flip-chip manner.

The number of molding cavities 151 on the mold 15 is in principle the same as the number of light-emitting diode crystal grains 131 on the substrate 11. During packaging, each light-emitting diode crystal grain 131 needs to be aligned with the corresponding molding cavity 151. In the embodiment of the present invention, before the mold 15 is packaged with the semiconductor body element 13, it is necessary to coat a layer of release agent 153 on the surface of the mold 15, so as to avoid the encapsulation glue 17 used later and the mold 15 and/or molding Cavity 151 sticks and is difficult to come off.

After the setting of the semiconductor element 13 and the coating or spraying of the release agent 153 are completed, the encapsulant 17 can be further filled in the molding cavity 151 of the mold 15 , as shown in FIG. 2 . The packaging glue 17 can be silica gel, epoxy resin, acrylic, transparent glue, non-transparent glue, photoresist, optical material or protective layer material.

When the encapsulant 17 is filled in the molding cavity 151 of the mold 15 , another procedure of extracting foam will be performed. Since the encapsulant 17 will cover part of the gas existing in the molding cavity 151 when the encapsulant 17 is filled in the molding cavity 151 , the foam extraction procedure must be performed in the encapsulant 17 . In one embodiment of the present invention, the procedure of extracting the foam is mainly to extract the foam in a cavity (such as element number 31 in FIG. 8 ) where the substrate 11 and the mold 15 are placed after the encapsulant 17 fills the molding cavity 151. Gas in chamber (31) to eliminate foam.

In an embodiment of the present invention, a plurality of first alignment units 155 are provided on the periphery or side of the mold 15 , such as alignment columns as shown in the figure. Corresponding to the first alignment unit 155 , a second alignment unit 113 is disposed on the periphery of the substrate 11 , for example, the second alignment unit 113 may be an alignment cavity. Then the substrate 11 is aligned with the mold 15, specifically after the semiconductor elements 13 on the substrate 11 are respectively aligned with the molding cavities 151 on the mold 15, the second alignment unit 155 of the mold 15 is inserted into the substrate 11. unit 113 , so that the substrate 11 is attached to the mold 15 , and the encapsulant 17 will cover the semiconductor element 13 disposed on the substrate 11 , as shown in FIG. 3 . After the substrate 11 is attached to the mold 15, the encapsulant 17 will fill the molding cavity 151 and cover the semiconductor element 13 and part of the surface of the substrate 11 to complete the molding of the encapsulant 17, and then the encapsulant 17 can be further molded. Heating or curing molding procedures with special light sources (such as: ultraviolet light). After the encapsulant 17 is hardened and formed into a package body 171 by heating or irradiation by a special light source, a cutting process is performed to cut off the encapsulant overflowing from the mold 15, and then the substrate 11 is raised once or repeatedly. descending action. The rising position and force are applied to release the hardened package 171 from the mold 15 . The lowering position and force are applied to release the force and prevent the substrate 11 from cracking. After the package body 171 is separated from the mold 15 , the hardened package body 171 can protect the substrate 11 and the semiconductor element 13 , as shown in FIG. 4 .

In different embodiments, a delivery channel can be set on the mold 15, and the molding cavity 151 of the mold 15 can be aligned with the semiconductor element 13 on the substrate 11 first, and the substrate 11 can be attached to the mold 15, and then pass through the delivery channel. The liquid encapsulant 17 is delivered between the mold 15 and the substrate 11 . Since the molding cavity 151 of the mold 15 and the semiconductor element 13 on the substrate 11 have been inserted and aligned by the first alignment unit 113 and the second alignment unit 155 , a space is formed between the mold 15 and the substrate 11 . Therefore, when the liquid encapsulant 17 is delivered between the mold 15 and the substrate 11 , the liquid encapsulant 17 will fill the space between the substrate 11 and the mold 15 and evenly cover the semiconductor element 13 .

Because the present invention has coated or sprayed a release agent 153 on the surface of the molding cavity 151 of the mold 15 before the packaging glue 17 is filled into the molding cavity 151 of the mold 15, so after the packaging glue 17 is hardened into the package body 171, the mold 15 can be smoothly separated from the package body 171 without damaging the hardened package body 171 during the separation process.

In addition, the release agent 153 of the present invention is coated or sprayed on the liquid or powder on the surface of the molding cavity 151 of the mold 15, so the thickness of the release agent 153 on the surface of the mold 15 is quite thin, so that the hardened package The shape and size of 171 will be very close to the shape and size of molding cavity 151 .

Also, in order to ensure the appearance and structure of the package body 171, the encapsulant 17 placed in the molding cavity 151 of the mold generally exceeds its capacity, and when the semiconductor element 13 is pressed into the molding cavity 151, the semiconductor element 13 The volume will also displace part of the encapsulant 17 . In order to control the flow direction of the excess glue 17, so as to avoid the excess glue 17 sticking to the non-encapsulation surface of the substrate 11, the substrate 11 of the present invention will be placed above the mold 15, and the surface of the substrate 11 has an active area of the molding cavity 151. A1 will also be larger than the active area A2 of the mold 15, so that the excess encapsulation glue 17 will naturally flow out along the mold wall 159 surrounding the side of the mold 15, without sticking or affecting the non-encapsulation surface of the substrate 11, improving its performance. Package quality.

The shape of the molding cavity 151 in the present invention can be a hemisphere, a square or a polygon, and the package body 171 formed on the surface of the substrate 11 also has the same shape as a hemisphere, a square or a polygon.

In one embodiment of the present invention, after the encapsulant 17 is hardened and molded, at least one package body 171 and at least one protective layer 173 will be formed on the surface of the substrate 11, wherein the package body 171 covers the semiconductor element 13, and the protective layer 173 forms On the surface of the substrate 11 , for example, it is formed on the surface of the substrate 11 where the package body 171 is not provided. The protective layer 173 can be in different geometric shapes such as hemisphere, square or polygon.

When the semiconductor element 13 is the light-emitting diode crystal grain 131, the encapsulation body 171 can be a light-transmitting hemisphere, so that the encapsulation body 171 can not only be used to protect the light-emitting diode grain 131, but also can be used to gather the light-emitting diode Die 131 produces a light source. In addition, fluorescent materials, phosphorescent materials or quantum dot materials can also be mixed in the packaging body 171 and/or the packaging glue 17, so as to generate projection light sources of different colors or different wavelengths.

Because the thickness of the release agent 153 that is coated or sprayed on the mold 15 and/or molding cavity 151 surface is very thin, so with the mold 15 of the same specification, the mold 15 that uses the release agent 153 will be able to form a larger volume Encapsulation 171 , and encapsulating the light emitting diode die 131 with a larger encapsulation 171 can increase the light emitting and concentrating effect of the light emitting diode 131 . In contrast, the conventional technology needs to additionally set a fixed-shaped release film or a release sheet between the molding cavity 151 and the encapsulant 17, and the thickness of the release film or release sheet is much larger than that of the present invention. Release agent 153, so the volume of the package produced by the conventional technology will naturally be relatively small, and its luminous and light-condensing effects are relatively unsatisfactory.

When the mold 15 was separated from the packaging body 171, part of the release agent 153 would leave the surface of the molding cavity 151 along with the detachment of the packaging body 171, and even form the partial structure of the packaging body 171 or the protective layer 173, but due to the release agent 153 The particles and thickness are quite small, and will not affect the nature or structure of the package body 171 or the protective layer 173 . Moreover, when the amount of the release agent 153 on the surface of the molding cavity 151 is less than a critical value, the release agent 153 must be applied or sprayed on the surface of the molding cavity 151 again.

Please refer to FIG. 5 and FIG. 6 , which are respectively side views of an embodiment of an alignment mold for a semiconductor element of the present invention. As shown in the figure, the alignment mold described in the embodiment of the present invention is suitable for the packaging method of the above-mentioned semiconductor element. The mold 25 includes a plurality of molding cavities 251 and a plurality of first alignment units 255, such as but not limited to a pair of alignment units. column. Wherein the surface of the molding cavity 251 of the mold 25 is provided with a non-stick layer 253, the non-stick layer 253 is a fixed structure, and its function is similar to the release agent (153) mentioned in the previous embodiment. The substrate 11 can be absorbed or clamped by a clamping device 23 , and moves with the clamping device 23 , such as moving up and down. A plurality of semiconductor elements 13 are disposed on the surface of the substrate 11 .

Corresponding to the first alignment unit 255 of the mold 25 , the substrate 11 is provided with a plurality of second alignment units 119 , such as alignment through holes in this embodiment. The jaw device 23 is provided with a plurality of third alignment units 231 corresponding to the first alignment unit 255 of the mold 25 and the second alignment unit 119 of the substrate 11, such as but not limited to a pair of alignment holes or a Counterpoint perforations.

According to the embodiment of the present invention, the first alignment unit 255 on the mold 25, the second alignment unit 119 on the substrate 11, and the third alignment unit 231 on the jaw device 23 may correspond to or match each other, specifically Said that the first alignment unit 255 on the mold 25 can be an alignment column, the second alignment unit 119 on the substrate 11 is an alignment perforation, and the third alignment unit 231 of the clamping jaw device 23 is an alignment cavity. , the first alignment unit 255 can pass through the second alignment unit 119 and be inserted into the third alignment unit 231 .

In another embodiment of the present invention, the first alignment unit 255 on the mold 25 may be an alignment cavity, while the third alignment unit 231 of the jaw device 23 is a corresponding alignment column, and the third The alignment unit 231 can be inserted into the first alignment unit 255 through the second alignment unit 119 .

After the substrate 11 is adsorbed and fixed on the jaw device 23, only the first alignment unit 255 on the mold 25, the second alignment unit 119 on the substrate 11, and the third alignment unit 23 on the jaw device 23 need to be aligned. After the units 231 are aligned and plugged together, the molding cavity 251 of the mold 25 can be aligned with the semiconductor element 13 on the substrate 11 . For this reason, through the first aligning unit 255 of the mold 25, the second aligning unit 119 on the substrate 11 and the third aligning unit 231 on the jaw device 23 according to the present invention, it will be possible to greatly simplify the process of semiconductor manufacturing. During the packaging process, it is difficult to align the molding cavity 151/251 of the mold 15/25 with the semiconductor element 13 on the substrate 11, which can improve the efficiency of production and packaging.

Similarly, in order to ensure the quality of the package and control the flow direction of the excess glue 17, so as to avoid the excess glue 17 sticking to the non-package surface of the substrate 11, the jaw device 23 and the substrate 11 of the present invention will be placed on the surface of the mold 15. above, and the action area A1 of the substrate 11 on the molding cavity 151 will be greater than the action area A2 of the mold 15, so that the excess encapsulation glue 17 will naturally flow out of the mold 25 along the mold wall 159 surrounding the side of the mold 15, and The substrate 11 will not be affected, and the quality of its packaging can be improved.

In yet another embodiment of the present invention, as shown in FIG. 7 , a plastic tray 39 may be provided on the periphery of the mold 25 to carry the mold 25 and after injection, dispensing, and pressing, the excess and flow out of the mold 25 The encapsulation glue 17 is used to facilitate the cleaning procedure of the semiconductor encapsulation procedure.

Finally, please refer to FIG. 8 , which is a schematic perspective view of another embodiment of an alignment mold for a semiconductor element of the present invention. As shown in the figure, the jaw device 23 and the mold 25 of the present invention can be placed in a production machine 30, the production machine 30 is provided with one or more chambers 31, and each chamber 31 can be set There are one or more sets of jaw devices 23 and molds 25 . The clamping device 23 is connected with a lifting member 33. With the lifting action of the lifting member 33, the substrate 11 and the light-emitting diode crystal grains 131 which are adsorbed and fixed on the clamping device 23 will also change with the mold 25 or molding. The distance between cavities 251. In the chamber 31 , the encapsulation procedures of semiconductor elements such as foam removal, curing of the encapsulant, and detachment of the encapsulation from the molding cavity can be continuously completed.

In one embodiment of the present invention, the encapsulant 17 and/or the release agent 153 can be manually sprayed or coated by the producer, or can be automatically sprayed or supplied with the encapsulant via a colloid supply part 35 disposed in the chamber 31. 17 and/or release agent 153 in the molding cavity 251. The glue supply part 35 is a movable or stretchable fluid delivery tube. When it is necessary to spray or supply the encapsulation glue 17 and/or the release agent 153, the glue supply part 35 can be moved to the vertically extending upper surface position of the molding cavity 251, And provide the encapsulant 17 and/or release agent 153 needed for each molding cavity 251 , thereby increasing the production volume of the semiconductor package components.

The above description is only a preferred embodiment of the present invention, and is not intended to limit the implementation scope of the present invention, that is, all equal changes and changes made according to the shape, structure, characteristics and spirit described in the scope of the claims of the present invention Modifications should be included within the scope of the claims of the present invention.

Claims (12)

1. a kind of packaging method of semiconductor element characterized by comprising

A plurality of semiconductor elements are set on a surface of a substrate；

Prepare a mold, which includes a plurality of forming cavities；

It is coated with a mould release in the forming cavity of the mold or is installed with a non-sticky adhesion coating；

A packaging plastic is inserted in the forming cavity of the mold；

Semiconductor element on the substrate is aligned to the forming cavity of the mold；

The substrate is bonded the mold, so that the packaging plastic coats the semiconductor element being set on the substrate；And

After the packaging plastic hardened forming is a packaging body, which is separated with the packaging body.

2. packaging method according to claim 1, which is characterized in that wherein the mold is located at the lower section of the substrate, and base The active area of plate is greater than the active area of the mold.

3. packaging method according to claim 2, which comprises the following steps: the mold has a plurality of the One bit cell, and the substrate have corresponding second bit cell, the second bit cell of substrate is aligned and plug together in First bit cell of mold.

4. packaging method according to claim 3, which comprises the following steps: clamping jaw device absorption or folder The substrate is held, and moves the substrate with the clamping jaw device, clamping jaw device has a plurality of third bit cells, the mold First bit cell is aligned and plugs together the third bit cell of the second bit cell and the clamping jaw device in the substrate.

5. packaging method according to claim 4, which is characterized in that wherein the clamping jaw device, the mold are located at a production In one chamber of board, which is equipped with an at least chamber, and the chamber is equipped with an at least clamping jaw device and an at least mould Tool.

6. a kind of semiconductor element to position mould characterized by comprising

One mold, including a plurality of forming cavities and a plurality of first bit cells；And

A plurality of semiconductor elements are arranged on one surface of the substrate to adsorb or grip a substrate in one clamping jaw device And a plurality of the second bit cells mutually to be plugged together with first bit cell, and the active area of the substrate is greater than the mould The active area of tool, clamping jaw device are bonded to actuation and by the substrate with the mold, to cause semiconductor element to be placed in In corresponding forming cavity.

7. according to claim 6 to position mould, which is characterized in that wherein the clamping jaw device is equipped with a plurality of thirds pair Bit location, third bit cell are mutually plugged together with the second bit cell of the substrate, the first bit cell of the mold.

8. according to claim 6 to position mould, which is characterized in that wherein coating one is release in the forming cavity of the mold Agent or a fixed non-sticky adhesion coating.

9. according to claim 6 to position mould, which is characterized in that still include a production board, in the production board Equipped with one or more chambers, and each chamber is equipped with one or more groups of molds and the clamping jaw device.

10. according to claim 9 to position mould, which is characterized in that be wherein equipped with colloid delivery member in the chamber, use To be moved to the mould upper surface, and on one packaging plastic of offer, a mould release to the mold.

11. according to claim 6 to position mould, which is characterized in that still include a gluing containing disk, carry the mold.

12. according to claim 6 to position mould, which is characterized in that wherein the mold periphery is equipped with a mold wall.