CN110366360A - A water-cooling heat dissipation device for a central processing chip of a blade server - Google Patents

Abstract

The invention relates to a water-cooling heat dissipation device for a central processing chip used in a blade server, and belongs to the technical field of heat dissipation of integrated circuit chips. The water cooling heat dissipation device of the blade server of the present invention comprises an evaporator, a heat pipe, a water cooler, a water pump, a heat exchanger and a water pipe. The central processing chip water-cooling device of the blade server proposed by the present invention first uses the heat pipe to transfer the heat generated by the central processing chip and other heat sources to the water cooler outside the blade server chassis, and then quickly brings the heat to the heat exchanger far away from the blade server through circulating water. The heater dissipates heat. Since the joint between the water pipe and the water cooler is located outside the blade server, even if the liquid leaks, the liquid will only drip to the bottom of the cabinet, and will not enter the blade server to cause a short circuit fault, which eliminates the safety hazard of the water cooling device and ensures This improves the reliability of the blade server.

Description

A water-cooling heat dissipation device for a central processing chip of a blade server

technical field

The invention relates to a water-cooling heat dissipation device for a central processing chip of a blade server, and belongs to the technical field of heat dissipation of integrated circuit chips.

Background technique

A blade server is a unit that inserts multiple card servers in a rack-mounted chassis of a standard height. It is a server platform that achieves high availability, high density, and low cost. It is currently widely used in large-scale cloud computing data centers and Construction of high-performance computing clusters. Due to the high-performance and high-integration design of the blade server, its advantage is that it minimizes the physical space occupied, but the disadvantage is that it greatly increases the power density and generates a lot of heat during operation. Therefore, the blade server The heat dissipation performance becomes the key factor to determine the stability of the system operation.

For blade servers with ultra-high heat density, the air-cooling heat dissipation method can no longer meet the requirements of heat dissipation efficiency, energy consumption and quietness of blade servers. Existing ultra-high heat density blade servers generally use water cooling to dissipate heat from the CPU chip by using circulating liquid, and release the heat in the liquid to the environment through a heat exchanger far away from the blade server.

The existing water-cooling heat dissipation device for the central processing chip of the blade server is shown in Figure 1. In Figure 1, 1 is the central processing chip, 2 is the water cooling plate, 3 is the blade server chassis, 4 is the water pump, and 5 is the heat exchanger , 6 is a water pipe, and the water cooling plate 2 that absorbs the heat of the central processing chip is connected with the water pipe 6 through a joint. The disadvantage is that there is a certain uncertainty in the sealing performance of the water pipe joints, and there is a risk of liquid leakage. Once the liquid leaks, it will cause damage to the blade server due to short circuit and burning.

Contents of the invention

The object of the present invention is to propose a water-cooling heat dissipation device for the central processing chip of the blade server, and improve the structure of the existing water-cooling heat dissipation device for the central processing chip of the blade server to ensure the working reliability of the blade server.

The water cooling device for the central processing chip of the blade server proposed by the present invention includes a water pump, a heat exchanger, a water pipe, and an evaporator, a heat pipe, and a water cooler; the bottom of the evaporator is bonded to the central processing chip by thermal silica On the chip; one end of the heat pipe is sealed, and the other end is welded to the evaporator. The evaporator and the heat pipe form a heat transfer system. The installation hole of the water cooler is inserted into the cavity of the water cooler, and the sealed end of the heat pipe is relatively fixed to the outer casing of the water cooler by welding. The water cooler is fixed on the chassis backplane of the blade server by screws. The water outlet of the water cooler is connected with the water inlet of the heat exchanger through the water pipe, and the water outlet of the heat exchanger is connected with the water inlet of the water pump through the water pipe.

The water-cooling heat dissipation device for the central processing chip of the blade server proposed by the present invention has the advantages of:

The central processing chip water cooling device of the blade server of the present invention transmits the heat generated by the central processing chip and other heat sources to the water cooler outside the blade server chassis through the heat pipe, and then uses the circulating water to quickly bring the heat to the heat exchanger far away from the blade server To dissipate heat. Since the joint between the water pipe and the water cooler is located outside the blade server, even if the liquid leaks, the liquid will only drip to the bottom of the cabinet, and will not enter the blade server to cause a short circuit fault, completely avoiding the safety hazard of the water cooling device. Ensure the safety and reliability of the blade server.

Description of drawings

FIG. 1 is a schematic structural diagram of an existing water cooling device for a central processing chip of a blade server.

FIG. 2 is a schematic structural diagram of a water-cooling heat dissipation device for a central processing chip of a blade server proposed by the present invention.

In Figure 1 and Figure 2, 1 is the central processing chip, 2 is the water cooling plate, 3 is the blade server chassis, 4 is the water pump, 5 is the heat exchanger, 6 is the water pipe, 7 is the water cooler, 8 is the heat pipe, and 9 is the evaporation device.

Detailed ways

The water-cooling heat dissipation device for the central processing chip of the blade server proposed by the present invention has a structure as shown in FIG. The bottom of the evaporator 9 is bonded to the central processing chip 1 through thermal conductive silica gel. One end of the heat pipe 8 is sealed, and the other end is welded to the evaporator 9. The evaporator 9 and the heat pipe 8 form a heat transfer system. 7 is inserted into the cavity of the water cooler 7, and the sealing end of the heat pipe is relatively fixed to the water cooler shell by welding. The water cooler 7 is fixed on the back plate of the blade server chassis 3 by screws. The water inlet of the water cooler 7 is connected to The water outlet of water pump 4 is connected by water pipe, the water outlet of water cooler 7 is connected with the water inlet of heat exchanger 5 by water pipe, and the water outlet of heat exchanger 5 is connected with the water inlet of water pump 4 by water pipe.

In the central processing chip water cooling device for blade servers proposed by the present invention, the evaporator 9 is used to absorb the heat generated by the CPU chip 1, and the liquid working medium inside the cavity of the evaporator 9 is rapidly vaporized into steam after being heated, and the working medium steam Enter the other end (sealed end) of heat pipe 8 under the effect of slight pressure difference, and take away a large amount of heat. The heat pipe 8 transfers the heat to the water cooler 7, and the circulating water in the water cooler 7 passes through the water pipe 6 to bring the heat to the heat exchanger 5 far away from the blade server for heat dissipation, and the cooled circulating water is pushed by the water pump 4 through the water pipe 6 to Water cooler7. After the working fluid that has lost heat in the heat pipe 8 is condensed and liquefied, it flows back into the cavity of the evaporator 9 through the heat pipe 8 under the action of the liquid-absorbing wick capillary on the inner wall of the heat pipe 8 to complete the circulation of the working fluid.

The water pump 4 in the blade server water-cooling device is used to push the circulating water to flow in the water-cooling device, and help the circulating water to perform cooling and heat exchange.

The heat exchanger 5 in the blade server water cooling device is used to quickly discharge the heat in the circulating water to the surrounding environment, and the circulating water that loses heat flows back to the water cooler 9 through the water pipe 6 .

The water pipe 6 in the blade server water cooling device is used to connect the water pump 4, the heat exchanger 5 and the water cooler 7, so that the circulating water circulates in a closed channel without leakage.

The water cooler 7 in the blade server water cooling device is used to cool the sealed end of the heat pipe 6, and the circulating fluid that has absorbed the heat of the central processing chip flows out of the water cooler 7 under the action of the water pump 4, and the new low-temperature circulating fluid Continue to flow in and continue to absorb heat from the central processing chip. The evaporator 9 in the blade server water cooling device is used to absorb the heat generated by the central processing chip 1 . The liquid working medium inside the cavity of the evaporator 9 is rapidly vaporized into steam after being heated, and the working medium steam enters the other end of the heat pipe 6 under the action of a small pressure difference, and takes away a large amount of heat.

The heat pipe 8 in the blade server water cooling device is used to transfer the working medium vapor inside the cavity of the evaporator 9 to the other end of the heat pipe 8, and return the condensed and liquefied liquid working medium to the evaporator 9 at the same time.

In one embodiment of the water-cooling heat dissipation device for blade servers proposed by the present invention, the evaporator 9 and the heat pipe 8 are both made of copper material with good thermal conductivity, the liquid-absorbing core on the inner wall of the heat pipe 8 is made of nickel fiber felt, and the evaporator and heat pipe 8 are made of nickel fiber felt. The inside of the thermal system composed of heat pipes is pumped into a vacuum state, and the working medium is water. The water cooler 7 is welded by reflow soldering process, and the box is made of copper material; the water pump 4 adopts a miniature brushless DC magnetic drive centrifugal pump; the heat exchanger 5 adopts a plate heat exchanger; the water pipe 6 uses industrial-grade rubber hose , The inner rubber material is EPDM rubber; the circulating water is deionized water.

The operating principle of the central processing chip water-cooling heat dissipation device for blade server of the present invention is:

When the central processing chip 1 in the blade server started to work, the temperature of the central processing chip 1 gradually increased, and the central processing chip 1 transferred heat to the evaporator 9; Therefore, the liquid working medium inside the cavity of the evaporator 9 has a very low boiling point, and the liquid working medium quickly vaporizes into saturated steam after being heated, and the working medium steam enters the other end of the heat pipe 8 under the action of a small pressure difference and is taken Lots of heat. The heat pipe inserted into the cavity of the water cooler 7 conducts the steam heat to the circulating water, and the circulating water is driven by the water pump 4 to bring the heat to the heat exchanger far away from the blade server for heat dissipation. The circulating water that has lost heat is returned to the water cooler 7 through the water pipe 6 under the action of the water pump 4 . After the working medium steam in the heat pipe 8 is condensed and liquefied by the water cooler 7, under the action of the liquid-absorbing wick capillary on the inner wall of the heat pipe 8, it flows back into the cavity of the evaporator 9 through the heat pipe 8 to complete the circulation of the working medium.

Claims (1)

1. A water-cooling heat dissipation device for the central processing chip of a blade server, comprising a water pump, a heat exchanger, and a water pipe, characterized in that it also includes an evaporator, a heat pipe, and a water cooler; the bottom of the evaporator is bonded by heat-conducting silica gel On the central processing chip; one end of the heat pipe is sealed, and the other end is welded to the evaporator. The evaporator and the heat pipe form a heat transfer system. The inside of the heat transfer system is evacuated and filled with liquid working fluid. The end of the heat pipe is inserted into the cavity of the water cooler through the installation hole of the water cooler, and the sealed end of the heat pipe is relatively fixed to the shell of the water cooler by welding. The water outlet of the water cooler is connected through a water pipe, the water outlet of the water cooler is connected with the water inlet of the heat exchanger through a water pipe, and the water outlet of the heat exchanger is connected with the water inlet of the water pump through a water pipe.