CN110352632A - Method for manufacturing electric component - Google Patents
Method for manufacturing electric component Download PDFInfo
- Publication number
- CN110352632A CN110352632A CN201880014675.8A CN201880014675A CN110352632A CN 110352632 A CN110352632 A CN 110352632A CN 201880014675 A CN201880014675 A CN 201880014675A CN 110352632 A CN110352632 A CN 110352632A
- Authority
- CN
- China
- Prior art keywords
- printed circuit
- circuit board
- light emitting
- emitting semiconductor
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 41
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 12
- 238000001816 cooling Methods 0.000 claims abstract description 61
- 239000004065 semiconductor Substances 0.000 claims abstract description 49
- 238000003466 welding Methods 0.000 claims abstract description 13
- 230000008569 process Effects 0.000 claims abstract description 12
- 239000004020 conductor Substances 0.000 claims description 23
- 229910000679 solder Inorganic materials 0.000 claims description 7
- 238000010586 diagram Methods 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- 230000006872 improvement Effects 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 230000004913 activation Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3415—Surface mounted components on both sides of the substrate or combined with lead-in-hole components
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S43/00—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights
- F21S43/10—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by the light source
- F21S43/13—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by the light source characterised by the type of light source
- F21S43/14—Light emitting diodes [LED]
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
- F21S45/40—Cooling of lighting devices
- F21S45/47—Passive cooling, e.g. using fins, thermal conductive elements or openings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
- H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/066—Heatsink mounted on the surface of the printed circuit board [PCB]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10507—Involving several components
- H05K2201/10545—Related components mounted on both sides of the PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Manufacturing & Machinery (AREA)
- Led Device Packages (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The present invention relates to a kind of methods for manufacturing electric component (1), at least one light emitting semiconductor device (11) that the electric component has printed circuit board (10) and is arranged on the printed circuit board (10), wherein, equipped at least one cooling device, the heat generated in light emitting semiconductor device (11) operation can be exported by means of the cooling device.According to the present invention, the method at least has following step: at least one light emitting semiconductor device (11) for printed circuit board (10) and is used to form at least one cooling body (12) of cooling device, and at least one described light emitting semiconductor device (11) and at least one described cooling body (12) are welded in a common welding process with printed circuit board (10).The invention further relates to a kind of electric component (1), the electric component is made according to such method.
Description
Technical field
The method and such electric component that the present invention relates to a kind of for manufacturing electric component, the electric component tool
There is at least one light emitting semiconductor device of printed circuit board and setting on the printed circuit board, wherein be equipped at least one
A cooling device can export the heat generated in light emitting semiconductor device operation by means of the cooling device.
Background technique
A kind of electric component with LED light emitting device known from 20 2,008 016 023 U1 of DE.In order to make partly to lead
Body luminescent device radiates and is equipped with the passage of heat for penetrating printed circuit board, the passage of heat and light emitting semiconductor device phase
Match, wherein passage of heat and welding surface match, cooling body can be arranged on the welding surface for heat transmitting.Therefore it mentions
Out, by printed circuit board, there are the downsides of welding surface and metal plate to squeeze, bond or tighten, and goes out to optimize thermal conductivity.It is unfavorable
, the cooling device provided independently of printed circuit board is needed, the cooling device must be with the hot exporter of electric component
Part connection.
A kind of electric component known from 2 500 956 A2 of EP, the electric component have printed circuit board, wherein
It is provided with light emitting semiconductor device on a printed circuit.It is equipped with VIA thermal contact portion in order to make light emitting semiconductor device radiate,
The VIA thermal contact portion will be connected with each other in the ribbon conductor on the front and back of printed circuit board, to realize from partly leading
The improved thermal conductivity of body luminescent device goes out.Scheme of the cooling body with setting printed circuit board sheet is not proposed.
Finally, 1 243 843 B1 of EP discloses a kind of electric component with printed circuit board and VIA thermal contact portion,
Wherein, light emitting semiconductor device is equipped on the front of printed circuit board.There are cooling body, institutes on the back side of printed circuit board
Cooling body is stated to contact via electrical insulating film with printed circuit board in a manner of being not described in detail.This electric component is also required to consume
The manufacturing method taken, especially because must also be arranged other than by light emitting semiconductor device welding on a printed circuit cold
But body.
Summary of the invention
The purpose of the present invention is simplify the method for manufacturing the electric component with printed circuit board, wherein described
It is provided at least one light emitting semiconductor device on printed circuit board, and cooling device should be equipped with, the cooling device is used for
Light emitting semiconductor device is set to radiate.Especially, it is an object of the present invention to provide it is a kind of can be electrical group of simple structure and manufacture
Part.
The purpose is based on method as described in the preamble according to claim 1 and based on according to claim 7
The electric component of feature with corresponding characteristic is realized.It provides in the dependent claims of the invention advantageous into one
Walk improvement project.
At least following step is proposed according to the method for the present invention: at least one photogenerator for printed circuit board
Part and at least one cooling body for being used to form cooling device, and will at least one described light emitting semiconductor device and it is described extremely
A few cooling body and printed circuit board weld in a common welding process.
Core of the invention thought is, will be partly in a common welding process, especially in solder reflow process
The welding of at least one surface of conductor luminescent device and cooling body and printed circuit board.The core idea is based especially on, and is being filled
At least one described light emitting semiconductor device and at least one described cooling body are had been equipped with printed circuit board in the process, is made
It obtains the cooling body at some extent as electronic component processing.By for manufacturing the according to the present invention of electric component
Method obtains the order of the simplification of manufacturing step, especially because no longer individually cooling body must be arranged onto electric component
Or it is mounted on the surface of printed circuit board.Cooling body can be as electric member together with such as conductor luminescent device
Reason, wherein cooling body forms individual component in the sense of the present invention, and is also formed individually there are also light emitting semiconductor device
Component.
Therefore, cooling body is used as discrete cooling unit (stand alone is independent) and is not arranged in semiconductor hair
It is directly contacted on optical device, below light emitting semiconductor device or with light emitting semiconductor device.The heat of design according to the present invention passes
Lead in order to make light emitting semiconductor device radiate and at least partially by printed circuit board carry out on the surface thereof, particularly by
It carries out in electric conductor band, and/or is carried out on the thickness direction of printed circuit board, particularly by VIA contact portion.
An advantageous aspect according to the present invention, printed circuit board have electric conductor band, wherein by photogenerator
Part and cooling body are similarly welded on electric conductor band.Therefore, electric conductor band had both been used to carry out with such as light emitting semiconductor device
Electrical contact, and it is used for heat transfer.Here, the conductor band being electrically connected with cooling body is also fully able to be used for and light emitting semiconductor device
Or other electron component is in electrical contact.
It is further advantageous that printed circuit board has front and back, wherein at least cooling body can be welded on front and back
On face.Obviously, cooling body also can only be welded on front or only weld on the back side.
According to another aspect of the present invention, printed circuit board has VIA thermal contact portion, wherein connects cooling body with VIA heat
Contact portion is thermally contacted.For example, cooling body is arranged on the piercing site of VIA thermal contact portion, enable heat directly from VIA
Thermal contact portion is transferred in cooling body, the heat transfer element without electric conductor band to be used as to intermediate access.
For example, only one light emitting semiconductor device in order to radiate and on the front and/or the back side of printed circuit board
Multiple cooling bodies match.Therefore, it radiates, to be used to export heat from light emitting semiconductor device, thus it enables that partly leading
Body luminescent device particularly effectively radiates.
The invention further relates to a kind of according to electric component made according to the method for the present invention.Here, the electric component
With the electric conductor band for being in electrical contact with light emitting semiconductor device, and electric conductor band is structured to heat simultaneously
It is transmitted in cooling body from light emitting semiconductor device.Therefore so that electric conductor band is met dual function, i.e., with partly lead
Body luminescent device is in electrical contact and is thermally contacted.
It is further advantageous that the printed circuit board has VIA thermal contact portion, wherein cooling body is in VIA thermal contact portion
Thermo-contact.
It finally provides, lighting device and/or light emitting semiconductor device of the electric component for vehicle are formed for generating vehicle
The light emitting diode or laser light source of illumination functions.
Detailed description of the invention
It is illustrated in detail the improvement present invention together with the explanation to a preferred embodiment of the present invention by attached drawing below
Other measures.Herein:
Fig. 1 shows the schematic diagram of electric component, and the electric component has printed circuit board, on the printed circuit board
It is welded with a light emitting semiconductor device and multiple cooling bodies, and
Fig. 2 shows the order schematically shown for executing method and step according to the method for the present invention.
Specific embodiment
Fig. 1 shows the schematic diagram of the electric component 1 with printed circuit board 10.Printed circuit board 10 has printed circuit
Plate core 15, wherein the printed circuit plate core 15 is respectively equipped with electric conductor band 13 on the front and back.VIA thermal contact portion 14
Extend across printed circuit plate core 15, the VIA thermal contact portion is thermally contacted with electric conductor band 13.
The example shows the cooling body 12 on the front and back that printed circuit board 10 is arranged in.Each cooling body 12 is by weldering
Contact 16 is fixed on electric conductor band 13.There are light emitting semiconductor devices 11 between cooling body 12 on downside, wherein described
Light emitting semiconductor device 11 is connect via pad 17 with electric conductor band 13.
It is only shown in a manner of schematically showing and electric conductor band 13 is continuously shown.Electric conductor band 13 to each other can be with
With multiple electric insulation parts, the electric insulation part is not illustrated in detail in the diagram.Below light emitting semiconductor device 11
The electric discontinuities only once shown illustratively indicate electric discontinuities.Such electricity discontinuities can also be not to be shown in further detail
Mode is repeatedly present in printed circuit board 10 on the front and back.
In order to manufacture electric component 1, firstly, the front and back of printed circuit board 10 is equipped with light emitting semiconductor device 11
With multiple cooling bodies 12.Then, component on printed circuit board 10, i.e. at least light emitting semiconductor device 11 and cooling body are applied to
12 weld in solder reflow process, so that manufacture pad 16 and 17.In the solder reflow process, front and back difference
It is contacted with corresponding heat source, so that the solder deposits of activation preparation, to correspondingly form pad 16 and 17.Therefore, root
According to the present invention, light emitting semiconductor device 11 and cooling body 12 can in a common solder reflow process with printed circuit board
10 materials are connected cohesively together.As a result, obtaining the electronics group with the cooling pattern for making light emitting semiconductor device 11 radiate
Part 1, wherein component 1 has multiple cooling bodies 12.VIA contact portion 14 is additionally used for herein in the two sides of printed circuit board 10
Between thermal compensation.Especially, heat source, i.e. light emitting semiconductor device 11 can radiate via VIA contact portion 14.Meanwhile, it is capable to
Occur from 11 side of light emitting semiconductor device to the heat dissipation to adjacent cooling body 12, wherein heat transfer therefore can not only be via
It VIA contact portion 14 but also can be carried out via electric conductor band 13.
Fig. 2 shows the method with following step with schematical order: providing 100 printed circuit boards 10, semiconductor hair
Optical device 11 and multiple cooling bodies 12.Then, 101 light emitting semiconductor devices 11 and cooling body 12 are assembled to printed circuit board 10.
Finally, the method and step for realizing the welding 102 in solder reflow process, to be finally capable of providing by method and step 103
Manufactured electric component 1.
The order of this method shows the reduction procedure based on basic thought of the invention.Cooling body 12 is sent out with semiconductor together
Optical device 11 is welded and is connect with printed circuit board 10, without for being arranged and connecting cooling body 12 and printed circuit board
10 individual process steps.
Embodiment of the present invention is not limited to above-mentioned preferred embodiment.More specifically, it is contemplated that a large amount of modification
Scheme, these variant schemes are also used in the embodiment of substantially different type by shown solution.From right
It is required that, all features and/or advantages obtained in specification or attached drawing, including details, space layout and the method step in structure
Suddenly, the present invention can be important individually and with different combinations.
Reference signs list:
1 electric component
10 printed circuit boards
11 light emitting semiconductor devices
12 cooling bodies
13 electric conductor bands
14 VIA thermal contact portions
15 printed circuit plate cores
16 pads
17 pads
100 provide
101 assembly
102 welding
103 provide
Claims (10)
1. method of the one kind for manufacturing electric component (1), the electric component has printed circuit board (10) and is arranged in institute
State at least one light emitting semiconductor device (11) on printed circuit board (10), wherein it is equipped at least one cooling device, by
The heat generated in light emitting semiconductor device (11) operation can be exported in the cooling device, wherein the method is at least
With following step:
At least one light emitting semiconductor device (11) is equipped with for printed circuit board (10) and is used to form at least the one of cooling device
A cooling body (12), and
It will at least one described light emitting semiconductor device (11) and at least one described cooling body (12) and printed circuit board (10)
It is welded in a common welding process.
2. the method according to claim 1, wherein the welding process is designed as solder reflow process.
3. method according to claim 1 or 2, which is characterized in that the printed circuit board (10) has electric conductor band
(13), wherein light emitting semiconductor device (11) and cooling body (12) are welded on electric conductor band (13).
4. method according to claim 1 to 3, which is characterized in that the printed circuit board (10) have front and
The back side, wherein at least on the front and back by cooling body (12) welding.
5. method according to one of the above claims, which is characterized in that there is the printed circuit board (10) VIA heat to connect
Contact portion (14), wherein thermally contact the cooling body (12) with VIA thermal contact portion (14).
6. method according to one of the above claims, which is characterized in that a light emitting semiconductor device (11) is in order to scattered
Heat and on the front and/or the back side of printed circuit board (10) multiple cooling bodies (12) match.
7. a kind of electric component (1), the electric component are manufactured by method according to claim 1 to 6.
8. electric component (1) according to claim 7, which is characterized in that electric conductor band (13) is structured to and partly leads
Body luminescent device (11) is in electrical contact, and at the same time being structured to for heat being transmitted to from light emitting semiconductor device (11) cold
But in body (12).
9. electric component (1) according to claim 7 or 8, which is characterized in that the printed circuit board (10) has VIA
Thermal contact portion (14), wherein cooling body (12) is in the VIA thermal contact portion (14) and thermally contacts.
10. the electric component according to one of claim 7 to 9 (1), which is characterized in that the electric component (1) is configured to
Lighting device and/or the light emitting semiconductor device (11) for vehicle are formed for generating shining for car lighting function
Diode or laser light source.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102017104386.1 | 2017-03-02 | ||
| DE102017104386.1A DE102017104386A1 (en) | 2017-03-02 | 2017-03-02 | Method for producing an electrical assembly |
| PCT/EP2018/053167 WO2018158061A1 (en) | 2017-03-02 | 2018-02-08 | Method for producing an electrical assembly |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110352632A true CN110352632A (en) | 2019-10-18 |
Family
ID=61192924
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201880014675.8A Pending CN110352632A (en) | 2017-03-02 | 2018-02-08 | Method for manufacturing electric component |
Country Status (3)
| Country | Link |
|---|---|
| CN (1) | CN110352632A (en) |
| DE (1) | DE102017104386A1 (en) |
| WO (1) | WO2018158061A1 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102018129405A1 (en) * | 2018-11-22 | 2020-05-28 | Semikron Elektronik Gmbh & Co. Kg | Arrangement with a printed circuit board and a power semiconductor component to be cooled above it |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07142855A (en) * | 1993-11-15 | 1995-06-02 | Nec Corp | Vertical reflow soldering device |
| EP0920055A2 (en) * | 1997-11-28 | 1999-06-02 | Robert Bosch Gmbh | Cooling device for a heat generating componant on a printed board |
| DE19910500A1 (en) * | 1999-03-10 | 2000-10-05 | Bosch Gmbh Robert | Electrical device such as control device with printed circuit board having heat generating components, has heat sink elements located for easy soldering to printed circuit board |
| US20030184970A1 (en) * | 2002-03-30 | 2003-10-02 | Volker Bosch | Cooling arrangement and electrical apparatus with cooling arrangement |
| US20090294165A1 (en) * | 2008-05-30 | 2009-12-03 | Delphi Technologies, Inc. | Method of manufacturing a printed circuit board |
| CN101769513A (en) * | 2008-12-17 | 2010-07-07 | 美铝公司 | LED lighting laminate with integrated cooling |
| CN101827501A (en) * | 2010-03-31 | 2010-09-08 | 伟创力电子科技（上海）有限公司 | Through-hole backflow welding technology and relevant template and jig |
| CN201827857U (en) * | 2010-09-28 | 2011-05-11 | 南京汉德森科技股份有限公司 | Heat conducting structure of LED light source |
| CN104202920A (en) * | 2014-09-04 | 2014-12-10 | 浪潮电子信息产业股份有限公司 | Double-side Printed Circuit Board Assembly (PCBA) based one-time reflow soldering method |
| CN104956784A (en) * | 2012-12-19 | 2015-09-30 | 法雷奥热系统公司 | Cooling device for a printed circuit board |
| DE102014106342A1 (en) * | 2014-05-07 | 2015-11-12 | Hella Kgaa Hueck & Co. | Light module for a headlight of a vehicle |
| CN106270885A (en) * | 2016-09-21 | 2017-01-04 | 郑州云海信息技术有限公司 | A kind of first procedure of two-sided PIP welding |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10102353B4 (en) | 2001-01-19 | 2007-11-15 | Siemens Ag | LED signal module |
| US7284882B2 (en) | 2005-02-17 | 2007-10-23 | Federal-Mogul World Wide, Inc. | LED light module assembly |
| DE202008016023U1 (en) | 2008-12-04 | 2010-04-15 | Schweitzer, Rolf, Dipl.-Ing. | Daylight LED clusters |
| KR101847938B1 (en) | 2011-03-14 | 2018-04-13 | 삼성전자주식회사 | Light emitting device package and manufacturing method thereof |
| DE202013009386U1 (en) | 2013-10-22 | 2013-11-05 | Osram Gmbh | Semiconductor lighting device |
-
2017
- 2017-03-02 DE DE102017104386.1A patent/DE102017104386A1/en not_active Withdrawn
-
2018
- 2018-02-08 CN CN201880014675.8A patent/CN110352632A/en active Pending
- 2018-02-08 WO PCT/EP2018/053167 patent/WO2018158061A1/en active Application Filing
Patent Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07142855A (en) * | 1993-11-15 | 1995-06-02 | Nec Corp | Vertical reflow soldering device |
| EP0920055A2 (en) * | 1997-11-28 | 1999-06-02 | Robert Bosch Gmbh | Cooling device for a heat generating componant on a printed board |
| DE19910500A1 (en) * | 1999-03-10 | 2000-10-05 | Bosch Gmbh Robert | Electrical device such as control device with printed circuit board having heat generating components, has heat sink elements located for easy soldering to printed circuit board |
| US20030184970A1 (en) * | 2002-03-30 | 2003-10-02 | Volker Bosch | Cooling arrangement and electrical apparatus with cooling arrangement |
| US20090294165A1 (en) * | 2008-05-30 | 2009-12-03 | Delphi Technologies, Inc. | Method of manufacturing a printed circuit board |
| CN101769513A (en) * | 2008-12-17 | 2010-07-07 | 美铝公司 | LED lighting laminate with integrated cooling |
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| DE102017104386A1 (en) | 2018-09-06 |
| WO2018158061A1 (en) | 2018-09-07 |
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