CN110351981B - A high heat flux density spray cooling device and system - Google Patents
A high heat flux density spray cooling device and system Download PDFInfo
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- CN110351981B CN110351981B CN201910553075.5A CN201910553075A CN110351981B CN 110351981 B CN110351981 B CN 110351981B CN 201910553075 A CN201910553075 A CN 201910553075A CN 110351981 B CN110351981 B CN 110351981B
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- 239000007921 spray Substances 0.000 title claims abstract description 94
- 238000001816 cooling Methods 0.000 title claims abstract description 36
- 230000004907 flux Effects 0.000 title claims abstract description 24
- 239000007788 liquid Substances 0.000 claims abstract description 73
- 239000002131 composite material Substances 0.000 claims abstract description 20
- 239000002250 absorbent Substances 0.000 claims abstract 16
- 230000002745 absorbent Effects 0.000 claims abstract 6
- 239000002245 particle Substances 0.000 claims description 21
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 17
- 238000010521 absorption reaction Methods 0.000 claims description 17
- 239000010410 layer Substances 0.000 claims description 15
- 230000001105 regulatory effect Effects 0.000 claims description 12
- 238000005245 sintering Methods 0.000 claims description 10
- 239000002356 single layer Substances 0.000 claims description 9
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- 238000012546 transfer Methods 0.000 abstract description 7
- 230000008859 change Effects 0.000 abstract description 3
- 230000006911 nucleation Effects 0.000 abstract description 3
- 238000010899 nucleation Methods 0.000 abstract description 3
- 239000012530 fluid Substances 0.000 abstract 1
- 230000008016 vaporization Effects 0.000 abstract 1
- 238000009834 vaporization Methods 0.000 abstract 1
- 238000005507 spraying Methods 0.000 description 23
- 230000017525 heat dissipation Effects 0.000 description 10
- 238000005516 engineering process Methods 0.000 description 9
- 230000008901 benefit Effects 0.000 description 3
- 238000005213 imbibition Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 238000009835 boiling Methods 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 230000035699 permeability Effects 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 238000000576 coating method Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20345—Sprayers; Atomizers
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
本发明公开了一种高热流密度喷雾冷却装置及系统，所述装置包括喷雾腔体、喷雾腔进液管、喷雾腔出液管和位于喷雾腔体内的喷孔板、阵列喷嘴和复合微结构，喷孔板将喷雾腔体分隔为缓冲室和喷雾室，喷雾腔进液管与缓冲室连通，喷雾腔出液管与喷雾室连通，阵列喷嘴设置在喷孔板位于喷雾室的一侧上，喷孔板上设置有多个连通缓冲室与阵列喷嘴的通孔，复合微结构设置在喷雾室上与阵列喷嘴相对的壁面上，复合微结构包括设置于与阵列喷嘴相对的壁面上的底层吸液芯以及设置在底层吸液芯上的多个肋状吸液芯。复合微结构能够提供更多汽化成核位置数量，提高工质相变换热能力，又可以增强了液膜的延展能力，具有高效的换热能力。
The invention discloses a high heat flux density spray cooling device and system. The device comprises a spray chamber, a spray chamber liquid inlet pipe, a spray chamber liquid outlet pipe, an orifice plate, an array nozzle and a composite microstructure located in the spray chamber. , the orifice plate divides the spray chamber into a buffer chamber and a spray chamber, the liquid inlet pipe of the spray chamber is connected with the buffer chamber, the liquid outlet pipe of the spray chamber is connected with the spray chamber, and the array nozzle is arranged on the side of the orifice plate which is located in the spray chamber The orifice plate is provided with a plurality of through holes connecting the buffer chamber and the array nozzle, the composite microstructure is arranged on the wall surface opposite to the array nozzle on the spray chamber, and the composite microstructure includes a bottom layer arranged on the wall opposite to the array nozzle An absorbent core and a plurality of rib-shaped absorbent cores disposed on the bottom absorbent core. The composite microstructure can provide more vaporization and nucleation sites, improve the heat capacity of the working fluid phase change, and enhance the ductility of the liquid film, and has efficient heat transfer capacity.
Description
Technical Field
The invention belongs to the technical field of spray cooling, and particularly relates to a high-heat-flux spray cooling device and system.
Background
With the continuous development of high-power laser technology, high integration and miniaturization of electronic components and other technologies, the power consumption in unit volume is increased continuously, so that the heat generation of the electronic components is increased continuously, and particularly the heat flow density of airborne equipment can reach 100-1000W/cm2Directly affecting the lifetime of the electronic device. Therefore, efficient and reliable cooling technology is urgently needed to meet the heat dissipation requirement of electronic components with high heat flow density. Currently, there are three main effective cooling techniques that hopefully address the heat dissipation requirements of high power heat flux density electronic components. Namely microchannel cooling, jet cooling and spray cooling techniques. However, the micro-through cooling technology has large pressure drop, uneven temperature and poor stability; the jet cooling flow is large, and the temperature gradient of the cooling surface is large, so that the temperature sensitive electronic device can be failed. Compared with microchannel and jet impact cooling, spray cooling is used as an efficient two-phase heat dissipation technology, has the advantages of incomparable high heat exchange capacity, good temperature uniformity, small working medium demand and the like of the traditional heat dissipation technology, and is considered to be the most effective heat dissipation technology for solving the problem of high heat flux density electronic devices of small platform airborne equipment in the future.
Spray cooling is a heat dissipation technology in which a working medium passes through a nozzle under pressure to form micron-sized liquid particles, the liquid particles continuously impact a spray heat exchange surface, and a large amount of heat is taken away on the spray heat exchange surface through a liquid film evaporation, convection and phase change heat exchange mode. And because the liquid has higher speed and smaller particle size and uniformly impacts on the heat exchange surface, the temperature of the cooled heat exchange surface is more uniform, and the heat dissipation requirement on the electronic element is met. However, in the spray heat exchange process, the spray wall surface is easily dried due to an excessively high heat flow density heat source, so that the critical heat flow density is low, and the critical heat flow density represents the maximum heat exchange capacity of the spray cooling system and is an important index of the heat exchange performance. Therefore, researchers at home and abroad have conducted extensive research on the improvement of heat transfer performance by adopting enhanced heat transfer technologies such as surface pin ribs, grooves and porous coatings. Utility model patent CN 201467614U proposes a heat exchanger combining spray cooling and micro-groove group phase-change heat. The utility model discloses a though increased heat transfer area through the microgroove crowd, improved the heat transfer volume to a certain extent. However, such a micro-groove group has low liquid film spreading ability, and it is difficult to satisfy the heat dissipation requirement of high heat flux density.
Disclosure of Invention
The invention aims to provide a high heat flux density spray cooling device and a high heat flux density spray cooling system to improve the phase-change heat exchange capacity of a working medium, enhance the extension capacity of a liquid film and improve the critical heat flux density.
The technical solution for realizing the purpose of the invention is as follows: the utility model provides a high heat flux density spray cooling device, includes spraying cavity, spraying cavity feed liquor pipe, spraying cavity drain pipe and is located spout board, array nozzle and composite microstructure in the spraying cavity, the spout board will the spraying cavity is separated for surge chamber and spraying chamber, spraying cavity feed liquor pipe with the surge chamber intercommunication, spraying cavity drain pipe and spraying chamber intercommunication, the array nozzle sets up and is located at the spout board on one side of the spraying chamber, be provided with a plurality of intercommunications on the spout board the surge chamber with the through-hole of array nozzle, composite microstructure sets up on the spraying chamber with on the wall that the array nozzle is relative, composite microstructure including set up in with bottom imbibition core and setting on the wall that the array nozzle is relative are in a plurality of rib imbibition cores on the bottom imbibition core.
Further, the bottom layer liquid absorbing core and the rib-shaped liquid absorbing core are respectively formed by sintering copper powder particles.
Further, the bottom-layer liquid absorption cores are of single-layer structures and are formed by sintering copper powder particles with the particle size of 0.050-0.1 mm, the rib-shaped liquid absorption cores extend outwards perpendicularly on the surface of the bottom-layer liquid absorption cores, and the rib-shaped liquid absorption cores are formed by sintering copper powder particles with the particle size of 0.13-0.18 mm.
Further, the length of each rib-shaped wick in the direction perpendicular to the surface of the bottom layer wick is 0.7mm, the length of each rib-shaped wick in the direction parallel to the surface of the bottom layer wick is 0.7mm, and the distance between each rib-shaped wick is 0.7 mm.
Further, the length of each rib-shaped wick in the direction perpendicular to the surface of the bottom layer wick is 0.7mm, the length of each rib-shaped wick in the direction parallel to the surface of the bottom layer wick is 0.7mm, the rib-shaped wicks are arranged in parallel at the middle position and arranged in a divergent manner at the two end positions, and thus the plurality of rib-shaped wicks form a rectangle as a whole.
Further, the material of the spray cavity is copper or aluminum.
Further, the array nozzle comprises a plurality of nozzles, the diameter of an outlet of each nozzle is 0.2-2 mm, the outlet pressure is in the range of 0.2-2 MPa, and the distance between each nozzle and a wall surface of the spray chamber opposite to the nozzle is in the range of 4-100 mm.
The utility model provides a high heat flux density spray cooling system, includes electronic component, cooler, liquid storage pot, pump, heater, flowmeter and according to the aforesaid high heat flux density spray cooling device, electronic component is located to be provided with compound microstructure the outside of the wall of spray chamber, spray chamber drain pipe and the access connection of cooler, the export of cooler is connected with the liquid storage pot, the export of liquid storage pot and the access connection of heater, the export of heater with the access connection of flowmeter, the export of flowmeter with spray chamber feed liquor union coupling.
Furthermore, the system also comprises a bypass pipeline and a first regulating valve, wherein the first regulating valve is arranged between the pump and the heater, the outlet of the bypass pipeline is connected with the liquid storage tank, the inlet of the bypass pipeline is positioned between the pump and the first regulating valve, and the bypass pipeline is provided with a second regulating valve.
Further, the system also comprises a power supply and a temperature sensor, wherein the power supply and the temperature sensor are respectively connected with the electronic element.
Compared with the prior art, the invention has the remarkable advantages that:
(1) the sintered ribs have high permeability, can convey the liquid working medium on the surface of the spray to a middle high heat flow density area under the action of capillary force, and are provided with steam flow channels to reduce the flow resistance of steam; and the sintered particles provide a larger wetting area, thereby increasing the number of nucleation sites for boiling to occur and improving the heat exchange performance;
(2) the spraying surface single-layer liquid absorption core can improve the extension capability of a liquid film and prevent local drying, and meanwhile, the small-particle-size copper powder particles have smaller thermal resistance;
(3) the single-layer liquid absorbing core on the spraying surface is combined with the sintering type ribs, the liquid working medium is conveyed to a high heat flow density area along the sintering type ribs under the action of capillary force, and meanwhile, the single-layer liquid absorbing core spreads out a liquid film, so that the critical heat flow density of the spraying surface is further improved;
(4) the multi-nozzle array spraying has good high efficiency, temperature equalization and stability, and can meet the heat dissipation requirements of high power and large area.
Drawings
Fig. 1 is a cross-sectional view of a high heat flux density spray cooling device.
Fig. 2 is a system connection diagram of a high heat flux density spray cooling system.
Fig. 3 is a side view of a composite microstructure.
Fig. 4 is a schematic cross-sectional view of a composite microstructure.
Detailed Description
The present invention is described in further detail below with reference to the attached drawing figures.
Referring to fig. 1, a high heat flux density spray cooling device includes a spray cavity 10, a spray cavity liquid inlet pipe 16, a spray cavity liquid outlet pipe 17, and a spray orifice plate 14, an array nozzle 11 and a composite microstructure 13 located in the spray cavity 10, where the spray orifice plate 14 divides the spray cavity 10 into a buffer chamber 15 and a spray chamber 18, the spray orifice plate 14 and the spray cavity 10 are integrally processed without hidden troubles of welding leakage, the spray cavity liquid inlet pipe 16 is communicated with the buffer chamber 15, the buffer chamber 15 is used to provide uniform liquid inlet pressure for the array nozzle 11, the spray cavity liquid outlet pipe 17 is communicated with the spray chamber 18, the spray cavity 10, the spray cavity liquid inlet pipe 16 and the spray cavity liquid outlet pipe 17 are integrally processed without hidden troubles of welding leakage, the array nozzle 11 is disposed on one side of the spray orifice plate 14, the spray orifice plate 14 is provided with a plurality of through holes communicating the buffer chamber 15 and the array nozzle 11, the composite microstructure 13 is arranged on the wall surface of the spray chamber 18 opposite to the array nozzles 11, the composite microstructure 13 comprises a bottom layer liquid absorbing core 13-1 arranged on the wall surface opposite to the array nozzles 11 and a plurality of rib-shaped liquid absorbing cores 13-2 arranged on the bottom layer liquid absorbing core 13-1, and the array nozzles 11 generate fine liquid drops to spray towards the composite microstructure 13 under pressure.
Further, red copper is selected for use to spray cavity 10's material, and red copper has good heat conductivity and structural strength, and spray cavity 10 is long 65mm, and wide 30mm, high 45mm, and the wall thickness is 0.5mm, 16 internal diameters of spray cavity feed liquor pipe are 6mm, and spray cavity drain pipe 17 internal diameter is 8mm, and the equal 1mm of wall thickness of tube
Further, referring to FIGS. 3-4, both the bottom layer wick 13-1 and the ribbed wick 13-2 are sintered from copper powder particles. The spraying device is characterized in that the bottom layer liquid absorption core 13-1 is formed by sintering and paving a single layer of copper powder with small particle size and 0.05-0.1 mm in diameter on the whole spraying surface, the rib-shaped liquid absorption cores 13-2 vertically extend outwards on the surface of the bottom layer liquid absorption core 13-1, the rib-shaped liquid absorption cores 13-2 are formed by sintering copper powder particles with large particle size and 0.13-0.18 mm in diameter on the single layer liquid absorption core, the length of each rib-shaped liquid absorption core 13-2 in the direction perpendicular to the surface of the bottom layer liquid absorption core 13-1 is 0.2-3 mm, preferably 0.7mm, the length of each rib-shaped liquid absorption core 13-2 in the direction parallel to the surface of the bottom layer liquid absorption core 13-1 is 0.2-3 mm, preferably 0.7mm, and the distance between each rib-shaped liquid absorption core 13-2 is 0.2-. The groove formed by sintering the copper powder with large particle size can provide large permeability, and the liquid working medium permeates into the high heat flow density area; the single-layer small-particle size sintered and paved on the heat exchange surface has smaller thermal resistance. Preferably, with reference to fig. 3, said rib-shaped wicks 13-2 are arranged in parallel at the middle position and in diverging form at the two end positions so that the plurality of rib-shaped wicks 13-2 form a rectangle as a whole.
Further, the material of the spray chamber 10 is copper or aluminum, which has high thermal conductivity and structural strength.
Further, the array nozzle 11 comprises a plurality of nozzles, the diameter of an outlet of each nozzle is 0.2-2 mm, the outlet pressure is in the range of 0.2-2 MPa, the distance between each nozzle and a wall surface of the spray chamber 18 opposite to the nozzle is in the range of 4-100 mm, and the spray angle is in the range of 30-130 degrees.
Referring to fig. 2, a high heat flux density spray cooling system comprises an electronic component 12, a cooler 2, a liquid storage tank 3, a pump 4, a heater 7, a flow meter 8 and a high heat flux density spray cooling device according to the above, the electronic component 12 is located outside the wall of the spray chamber 18 provided with the composite microstructure 13, the liquid outlet pipe 17 of the spray cavity is connected with the inlet of the cooler 2, the outlet of the cooler 2 is connected with the liquid storage tank 3, the outlet of the liquid storage tank 3 is connected with the inlet of a heater 7, the outlet of the heater 7 is connected with the inlet of a flowmeter 8, the outlet of the flow meter 8 is connected with the liquid inlet pipe 16 of the spraying cavity, the cooler 2 is used for adjusting the temperature of the working medium flowing out of the spraying cavity 10, the pump 4 is used for providing power for the system, the liquid storage tank 3 is used for storing the working medium of the system, and the working medium adopted by the spraying system is R245 fa.
Further, the system also comprises a bypass pipeline and a first regulating valve 6, the first regulating valve 6 is arranged between the pump 4 and the heater 7, the outlet of the bypass pipeline is connected with the liquid storage tank 3, the inlet of the bypass pipeline is positioned between the pump 4 and the first regulating valve 6, and the bypass pipeline is provided with a second regulating valve 5.
Further, the system also comprises a power supply 1 and a temperature sensor 9, wherein the power supply 1 and the temperature sensor 9 are respectively connected with the electronic component 12.
The single-layer liquid absorption core structure and the sintered rib composite microstructure manufactured on the spraying surface of the steam cavity 10 can provide capillary force, enable liquid to be conveyed to a high heat flow density area which is easy to dry, improve the extension capability of a liquid film, provide more bubble nucleation positions and enhance the two-phase heat exchange capability. The sintering of the small-particle-size copper powder on the spray surface has smaller thermal resistance, high-intensity evaporation and nucleate boiling heat exchange exist in a liquid film area near a three-phase contact line, and the heat exchange performance can be improved. In addition, the nozzles are arranged in a multi-nozzle array, so that the high-power and large-area heat dissipation requirements can be met. The cooling working medium is atomized into countless fine droplets with high speed in the array nozzle, the droplets continuously impact the spraying surface, and a great amount of heat is taken away by convective heat transfer and phase change heat transfer on the spraying surface composite microstructure.
The foregoing illustrates and describes the principles, general features, and advantages of the present invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the invention as claimed. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (6)
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910553075.5A CN110351981B (en) | 2019-06-25 | 2019-06-25 | A high heat flux density spray cooling device and system |
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| CN201910553075.5A CN110351981B (en) | 2019-06-25 | 2019-06-25 | A high heat flux density spray cooling device and system |
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| CN110351981B true CN110351981B (en) | 2021-03-26 |
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| CN115460882B (en) * | 2022-09-20 | 2024-05-28 | 常州大学 | Compact multi-nozzle cooling device |
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