CN110248001B - Electronic product glass rear cover and preparation method thereof and electronic product - Google Patents
Electronic product glass rear cover and preparation method thereof and electronic product Download PDFInfo
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- CN110248001B CN110248001B CN201810194672.9A CN201810194672A CN110248001B CN 110248001 B CN110248001 B CN 110248001B CN 201810194672 A CN201810194672 A CN 201810194672A CN 110248001 B CN110248001 B CN 110248001B
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- 239000011521 glass Substances 0.000 title claims abstract description 91
- 238000002360 preparation method Methods 0.000 title abstract description 5
- 238000000034 method Methods 0.000 claims abstract description 43
- 238000004519 manufacturing process Methods 0.000 claims abstract description 6
- 239000010410 layer Substances 0.000 claims description 48
- 239000000758 substrate Substances 0.000 claims description 43
- 239000003292 glue Substances 0.000 claims description 24
- 238000007639 printing Methods 0.000 claims description 17
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 14
- 238000010438 heat treatment Methods 0.000 claims description 13
- 239000012790 adhesive layer Substances 0.000 claims description 12
- 239000011230 binding agent Substances 0.000 claims description 12
- 238000010030 laminating Methods 0.000 claims description 12
- 239000012939 laminating adhesive Substances 0.000 claims description 12
- 239000002105 nanoparticle Substances 0.000 claims description 12
- 239000011347 resin Substances 0.000 claims description 12
- 229920005989 resin Polymers 0.000 claims description 12
- 238000007650 screen-printing Methods 0.000 claims description 11
- 239000000463 material Substances 0.000 claims description 9
- 238000005034 decoration Methods 0.000 claims description 4
- 230000003287 optical effect Effects 0.000 abstract description 14
- 239000004568 cement Substances 0.000 abstract description 13
- 238000002834 transmittance Methods 0.000 description 19
- 239000000853 adhesive Substances 0.000 description 13
- 230000001070 adhesive effect Effects 0.000 description 13
- 238000012360 testing method Methods 0.000 description 11
- 230000001681 protective effect Effects 0.000 description 9
- 230000000052 comparative effect Effects 0.000 description 8
- 230000001413 cellular effect Effects 0.000 description 6
- 239000002313 adhesive film Substances 0.000 description 5
- 229920002799 BoPET Polymers 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000002002 slurry Substances 0.000 description 2
- 239000005341 toughened glass Substances 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
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Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
- H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
- H01Q1/242—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0277—Details of the structure or mounting of specific components for a printed circuit board assembly
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- Engineering & Computer Science (AREA)
- Signal Processing (AREA)
- Computer Networks & Wireless Communication (AREA)
- Laminated Bodies (AREA)
Abstract
The invention relates to the field of electronic product manufacturing, and discloses an electronic product glass rear cover, a preparation method thereof and an electronic product. The method can prevent the optical cement attached in the decorative grain film from being damaged, so that the performance of the optical cement is not influenced.
Description
Technical Field
The invention relates to the field of electronic product manufacturing, in particular to a glass rear cover of an electronic product, a preparation method of the glass rear cover and the electronic product.
Background
CN107248618A (application No. 201710283861.9) discloses a decorative film attached to a transparent member (glass layer), the decorative film includes an adhesive layer, a substrate (equivalent to a PET film layer) and a conductive layer (equivalent to an antenna layer), the substrate includes a first side and a second side which are oppositely disposed, the adhesive layer is located on the first side and used for attaching the decorative film to the surface of the transparent member, and the conductive layer is located on the second side and is an antenna. The disadvantages of this technique are: the antenna is formed by directly printing conductive ink on a decorative film and then baking and drying.
CN106785389A (application No. 201611135535.5) discloses a method for manufacturing an antenna on a glass rear cover and a glass rear cover with an antenna. Photosensitive conductive paste is sprayed on the protective ink layer of the glass rear cover to form a conductive paste layer, the conductive paste layer is carved into an antenna loop, and the antenna loop is covered by an insulating coating; and baking the rear cover coated with the conductive paste at the temperature of 100-150 ℃ for 10-30min to draw the antenna loop.
CN205355245U (application No. 201521040020.8) discloses a printed antenna for a rear cover of a glass of a mobile phone, which includes a printed antenna circuit formed by printing conductive silver paste on the inner side of the rear cover of the glass, and the end contact of the printed antenna circuit is connected with the internal circuit contact of the mobile phone to form a mobile phone antenna with functions of transmitting and receiving signals. In addition, the mobile phone antenna with the functions of transmitting and receiving signals is formed by printing a printed antenna circuit on a black ink blocking layer on the inner side of a glass rear cover by conductive silver paste, covering a finish paint layer on the printed antenna circuit, leaving a broken contact of the printed antenna circuit exposed outside, and connecting an end contact with a circuit contact inside the mobile phone.
In the prior art, a conductive circuit is directly printed on a glass rear cover with protective ink or an antenna loop is carved by coating conductive slurry, and the defects that (1) printing or carving is carried out on a 3D curved surface, the difficulty is high, and the size is not accurate are overcome; (2) the printing conductive circuit or the printing conductive slurry can be dried only by baking the whole glass rear cover at the temperature of 100-150 ℃, so that the OCA of the PET film which is adhered with decorative lines and protective ink is damaged, and the performance of the OCA adhesive is influenced.
Therefore, how to prepare a circuit with accurate size and make the mobile phone glass rear cover printed with the circuit, which is adhered with decorative lines and protects the OCA in the PET film of the printing ink from being damaged, need to be further developed.
Disclosure of Invention
The invention aims to overcome the problems in the prior art and provides an electronic product glass rear cover, a preparation method thereof and an electronic product, wherein the method can prevent the optical cement OCA attached in the film with decorative lines from being damaged, so that the performance of the optical cement OCA, such as the attaching force and the light transmittance, is not influenced.
In order to achieve the above object, a first aspect of the present invention provides an electronic product glass rear cover, where the electronic product glass rear cover includes a glass substrate, and a film with decorative lines and a circuit film sequentially attached to the glass substrate from inside to outside, where a circuit is printed on an outer surface of the film with circuit.
The invention provides a method for manufacturing a glass rear cover of an electronic product, which comprises the following steps:
(1) providing a film with decorative grains, and attaching the film with the decorative grains on the surface of the glass substrate;
(2) providing a laminating adhesive film, printing a circuit on the surface of the laminating adhesive film, then carrying out heat treatment to obtain a circuit film, and then attaching the circuit film on the surface of the film with the decorative lines.
The invention provides a glass rear cover of an electronic product prepared by the method.
The invention provides an electronic product, wherein the electronic product comprises the electronic product glass rear cover or the electronic product glass rear cover prepared by the method.
According to the technical scheme, the circuit is not manufactured on the film with the decorative lines, but is manufactured on the other film with the adhesive, namely, the printed circuit film is processed at the temperature of 100-plus-150 ℃, so that the OCA adhesive in the film with the decorative lines can be prevented from being damaged by high temperature, and the performance of the optical adhesive OCA adhesive, such as adhesive force and light transmittance, is not influenced. On the contrary, if the circuit is manufactured on the film with the decorative lines, no matter the circuit is firstly manufactured on the film with the decorative lines, and then the circuit is attached to the glass substrate; the film with decorative lines is adhered to the glass substrate to form a whole, then the circuit is manufactured on the film with decorative lines, the circuit can be solidified only after being processed at the temperature of 100-150 ℃, and the adhering force and the light transmittance of the OCA glue can be influenced after the OCA glue on the film with decorative lines is processed (baked) at the temperature of 100-150 ℃.
In addition, the electronic product glass rear cover printed with the circuit prepared by the method has a double-layer film structure, namely, the electronic product glass rear cover printed with the circuit prepared by the method comprises a decorative line film and a circuit film which are superposed together; the electronic product glass rear cover with the double-layer film structure can prevent the OCA in the film with decorative lines from being damaged, so that the performance of the optical cement OCA glue, such as adhesion force and light transmittance, is not affected.
In addition, the invention prints the circuit by a screen printing mode, the method is simple and easy to operate, and the circuit manufactured by the method has accurate size.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention and not to limit the invention. In the drawings:
FIG. 1 is a schematic structural view of a laminating adhesive film;
FIG. 2 is a schematic structural diagram of a wiring film;
FIG. 3 is a schematic structural view of a film with decorative texture;
FIG. 4 is a schematic structural view of the glass substrate after the release film with decorative lines is removed;
FIG. 5 is a schematic structural view of the circuit film with the release film removed and the decorative texture film with the release film removed;
fig. 6 is a schematic view of a glass rear cover of an electronic product.
Description of the reference numerals
1. Glass substrate
2. Film with decorative lines
20. Second substrate 21, protective ink layer
22. Decorative grain layer 23 and OCA glue layer
24. Release film
3. Circuit film
30. First substrate 31, circuit
32. Adhesive layer 33 and release film
Detailed Description
The endpoints of the ranges and any values disclosed herein are not limited to the precise range or value, and such ranges or values should be understood to encompass values close to those ranges or values. For ranges of values, between the endpoints of each of the ranges and the individual points, and between the individual points may be combined with each other to give one or more new ranges of values, and these ranges of values should be considered as specifically disclosed herein.
In order to achieve the above object, a first aspect of the present invention provides an electronic product glass rear cover, as shown in fig. 1 to 6, which includes a glass substrate 1, and a film 2 with decorative lines and a circuit film 3 sequentially attached to the glass substrate 1 from inside to outside, wherein a circuit 31 is printed on an outer surface of the circuit film 3.
In the glass rear cover of an electronic product according to the present invention, the wiring 31 is a part of the wiring film 3 and is located on the outer surface of the wiring film 3.
In the present invention, the inventors of the present invention have unexpectedly found that: the circuit is not manufactured on the film 2 with decorative lines, but the circuit is manufactured on the other film with the laminating adhesive, and then the printed circuit film 3 is subjected to heat treatment, so that the optical cement OCA in the film 2 laminated with the decorative lines and the protective ink is prevented from being damaged, the performance of the optical cement OCA such as laminating force and light transmittance is not influenced, and the effect is good.
According to the present invention, the adhesive film is not particularly limited, and for example, as shown in fig. 1, the adhesive film may include a first substrate 30, an adhesive layer 32 formed on one surface of the first substrate 30, and a release film 33 attached to the adhesive layer 32. Wherein, the adhesive layer 32 has high temperature resistance.
According to the present invention, the wiring film 3 may be formed on the laminating adhesive film, for example, as shown in fig. 2, the wiring film 3 may include a first substrate 30, a wiring 31 formed on one surface of the first substrate 30, and a laminating adhesive layer 32 formed on the other surface of the first substrate 30, and the wiring film 3 is laminated to the decorative pattern film 2 through the laminating adhesive layer 32. The laminating glue film 32 has high temperature resistance, and the line 31 is printed on the laminating glue film with the laminating glue 32, and then is subjected to heat treatment, so that the OCA optical cement in the decorative line film 2 is prevented from being damaged by heat treatment, and the performance of the OCA optical cement is not influenced by the laminating force and the light transmittance.
Preferably, an ink layer is further disposed between the first substrate 30 and the wiring 31. The ink layer can play a role in protection and shading. The ink layer may be black in color.
In the present invention, the first base material may be any one of a PET material and a PI material.
According to the present invention, the wiring 31 may be formed by screen printing with a conductive paste, followed by heat treatment. In the invention, the circuit is printed by a screen printing mode, the method is simple and easy to operate, and the circuit manufactured by the method is accurate in size. The screen printing method is a conventional technique in the prior art, and is not described herein again.
According to the present invention, the conductive paste may be a mixture of the nanoparticle silver powder with a resin and a binder; in order to make the size of the manufactured circuit more accurate and more effective, it is preferable that the content of the nano-particle silver powder is 70 to 85 parts by weight, the content of the resin is 15 to 30 parts by weight, and the content of the binder is 3 to 4 parts by weight, based on 100 parts by weight of the conductive paste; more preferably, the nano-particle silver powder is contained in an amount of 75 to 85 parts by weight, the resin is contained in an amount of 15 to 25 parts by weight, and the binder is contained in an amount of 3.5 to 4 parts by weight, based on 100 parts by weight of the conductive paste.
According to the present invention, the resistivity of the conductive paste may be 8.0 × 10-8-10×10-8Omega m; preferably 8.0X 10-8-9.0×10-8Omega m; in the present invention, the signal transmission loss can be reduced by limiting the resistivity of the conductive paste to the above range.
According to the invention, the viscosity of the conductive paste can be 300-400cps, preferably 300-350cps, and in the invention, the viscosity of the conductive paste is limited within the range, so that the printing effect is better, and the resistivity is more stable.
According to the present invention, the film 2 with decorative texture is not particularly limited as long as the film 2 with decorative texture can be attached to the glass substrate 1, for example, as shown in fig. 3, the film 2 with decorative texture may include a protective ink layer 21, a decorative texture layer 22, a second substrate 20 and an OCA adhesive layer 23 which are sequentially stacked from outside to inside, and the film 2 with decorative texture is attached to the glass substrate 1 through the OCA adhesive layer 23; preferably, the second substrate is made of any one of a PET material and a PI material; in the invention, the texture protection ink can be black so as to better protect decorative textures and shade; in the invention, the decorative grain layer is subjected to vacuum color plating after UV transfer printing grains, so that the glass rear cover is more attractive, gorgeous and fashionable.
According to the present invention, the line 31 is preferably an antenna line. Under this condition, lid behind electronic product glass includes glass substrate 1 and from inside to outside laminating in proper order has decoration line film 2 and has antenna line film on the glass substrate 1, wherein, it has the antenna line to print on the surface of antenna line film.
In the invention, the electronic product may be various electronic products such as a mobile phone, an ipad, a watch, and the like, and is preferably a mobile phone.
The invention provides a method for manufacturing a glass rear cover of an electronic product, which comprises the following steps:
(1) providing a decorative grain film 2, and attaching the decorative grain film 2 on the surface of the glass substrate 1;
(2) providing a laminating adhesive film, printing a circuit 31 on the surface of the laminating adhesive film, then carrying out heat treatment to obtain a circuit film 3, and then attaching the circuit film 3 on the surface of the film 2 with decorative grains.
According to the method of the present invention, in step (1), the decorative grain film 2 may include a protective ink layer 21, a decorative grain layer 22, a second substrate 20 and an OCA glue layer 23, which are sequentially stacked from outside to inside.
According to the method of the invention, in the step (1), before the attaching, a release film 24 is adhered on the OCA glue layer 23 of the film 2 with decorative lines; in the process of attaching, the release film 24 needs to be torn off, and then the OCA glue layer 23 of the film 2 with decorative lines is attached to the surface of the glass substrate 1. In the invention, the release film can play a role in protecting the laminating adhesive and the OCA adhesive. Fig. 4 shows a schematic structural diagram of the glass substrate 1 after the release film of the decorative grain film 2 is removed.
According to the method of the present invention, the material of the glass substrate 1 may be tempered glass.
According to the method of the present invention, in the step (2), the wiring film 3 may include a first substrate 30, a wiring 31 formed on one surface of the first substrate 30, and a make-up adhesive layer 32 formed on the other surface of the first substrate 30. Preferably, an ink layer is further formed between the first substrate 30 and the wiring 31. The ink layer can play a role in protection and shading. The ink layer may be black in color.
According to the method of the invention, in the step (2), before the attaching, a release film is adhered on the attaching glue layer 32 of the circuit film 3; in the process of attaching, the release film needs to be torn off, and then the adhesive layer 32 of the circuit film 3 is attached to the film 2 with decorative texture, for example, as shown in fig. 5.
According to the method of the present invention, in step (1), the printed wiring 31 may include: and printing the conductive paste on the surface with the adhesive film, and then carrying out heat treatment. The printing mode can be conventional in the field, and preferably, the conductive paste is printed on the surface with the adhesive film by means of screen printing.
According to the method of the invention, the resistivity of the conductive paste is 8 x 10-8-10×10-8Ωm；
Preferably, the conductive paste is a mixed paste containing the nanoparticle silver powder, the resin and the binder;
preferably, in the conductive paste, the nano particle silver powder is used in an amount of 70 to 85 parts by weight, the resin is used in an amount of 15 to 30 parts by weight, and the binder is used in an amount of 3 to 4 parts by weight, based on 100 parts by weight of the conductive paste; more preferably, the nano-particle silver powder is used in an amount of 75 to 85 parts by weight, the resin is contained in an amount of 15 to 25 parts by weight, and the binder is contained in an amount of 3.5 to 4 parts by weight, based on 100 parts by weight of the conductive paste.
According to the method of the present invention, in the step (1), the heat treatment may be performed under conditions including: the temperature is 100-150 ℃, and the time is 30-50 min; in order to make the dimension of the circuit more precise, the temperature is preferably 100 ℃ to 135 ℃ for 40-50 min.
According to the method of the present invention, preferably, the method further includes attaching the attaching glue layer 32 of the circuit film 3 to the decorative grain film 2, and attaching the OCA glue layer 23 of the decorative grain film 2 to the surface of the glass substrate 1, and performing a defoaming treatment, for example, defoaming may be performed by means of pressing so as to attach the attaching glue layer 32 of the circuit film 3 to the decorative grain film 2, and attach the OCA glue layer 23 of the decorative grain film 2 to the surface of the glass substrate 1 more tightly and with higher light transmittance, so as to form a whole, as shown in fig. 6.
According to the method of the present invention, preferably, in step (2), an antenna circuit is printed on the surface of the adhesive film, and then heat treatment is performed to obtain an antenna circuit film, and then the antenna circuit film is attached to the surface of the decorative pattern film 2; i.e. the line is an antenna line.
The invention provides a glass rear cover of an electronic product prepared by the method.
The fourth aspect of the invention provides an electronic product, wherein the electronic product comprises the electronic product glass rear cover. In the invention, the electronic product may be various electronic products such as a mobile phone, an ipad, a watch, and the like, and is preferably a mobile phone.
In the method of the present invention, the inventors of the present invention unexpectedly found that: the printed circuit film 3 is processed at the temperature of 100-150 ℃, so that the optical cement OCA in the film 2 attached with the decorative lines and the protective printing ink can be skillfully prevented from being damaged, and the performance of the optical cement OCA such as the attaching force and the light transmittance is not influenced. On the contrary, if the circuit is manufactured on the film 2 with decorative lines, no matter the circuit is firstly manufactured on the film 2 with decorative lines, and then the circuit is attached to the glass substrate 1; or after the film 2 with decorative lines is adhered to the glass substrate 1 to form a whole, then the circuit is manufactured on the film 2 with decorative lines, the circuit can be solidified only after being processed at the temperature of 100-150 ℃, and the adhering force and the light transmittance of the OCA glue can be influenced after the OCA glue on the film 2 with decorative lines is processed (baked) at the temperature of 100-150 ℃.
The present invention will be described in detail below by way of examples.
Example 1
(1) Mixing 70 parts by weight of nano-particle silver powder, 26 parts by weight of resin, and 4 parts by weight of binder to obtain conductive paste, wherein the conductive paste has a resistivity of 10 x 10-8Omega m, the viscosity of the conductive paste is 375cps on average;
(2) as shown in fig. 2, the conductive paste was printed on the film with the adhesive by screen printing, and the resulting film 3 printed with the antenna line 31 was processed at a temperature of 135 ℃ for 40 min;
(3) as shown in fig. 4, a film 2 with decorative lines is attached to a back cover 1 of the tempered glass of the mobile phone;
(4) as shown in fig. 5, the film 3 printed with the antenna circuit 31 obtained in step (2) is bonded to the film 2 with decorative pattern obtained in step (3).
The result is a cellular phone glass rear cover S1 printed with the antenna line 31, as shown in fig. 6; the mobile phone glass rear cover S1 has a double-layer film structure formed by laminating a film printed with an antenna circuit and a film with decorative lines.
Example 2
An antenna line 31 was printed on a glass rear cover of a cellular phone in the same manner as in example 1, except that 75 weight portions were usedMixing parts of nano-particle silver powder, 21.5 parts of resin and 3.5 parts of binder to obtain conductive paste, wherein the resistivity of the conductive paste is 9 x 10-8Omega m, the viscosity of the conductive paste is 325cps on average.
As a result, the mobile phone glass rear cover S2 printed with the antenna line 31 is obtained; the mobile phone glass rear cover S2 has a double-layer film structure formed by laminating a film printed with an antenna circuit and a film with decorative lines.
Example 3
An antenna wiring was printed on a rear cover of a glass of a cellular phone in the same manner as in example 1, except that 81 parts by weight of the nano-particle silver powder, 15 parts by weight of the resin, and 4 parts by weight of the binder were mixed to obtain a conductive paste having a resistivity of 8 x 10-8Omega m, the viscosity of the conductive paste is 325cps on average.
As a result, the mobile phone glass rear cover S3 printed with the antenna line 31 is obtained; the mobile phone glass rear cover S3 has a double-layer film structure formed by laminating a film printed with an antenna circuit and a film with decorative lines.
Example 4
The antenna wiring 31 was printed on the rear cover of the glass of the cellular phone in the same manner as in example 1 except that the treatment was performed at a temperature of 100 c for 50 min.
As a result, the mobile phone glass rear cover S4 printed with the antenna line 31 is obtained; the mobile phone glass rear cover S4 has a double-layer film structure formed by laminating a film printed with an antenna circuit and a film with decorative lines.
Example 5
This example illustrates the method of printing antenna lines on a glass back cover of a mobile phone according to the present invention and the glass back cover of a mobile phone printed with antenna lines obtained by the method.
The antenna wiring 31 was printed on the rear cover of the glass of the mobile phone in the same manner as in example 1 except that the treatment was carried out at a temperature of 150 c for 30 min.
As a result, the mobile phone glass rear cover S5 printed with the antenna line 31 is obtained; the mobile phone glass rear cover S5 has a double-layer film structure formed by laminating a film printed with an antenna circuit and a film with decorative lines.
Comparative example 1
The antenna wiring 31 was printed on the rear cover of the glass of the mobile phone in the same manner as in example 1, except that the conductive paste was printed on the film with the decorative pattern 2 by screen printing instead of printing the conductive paste on the film with the adhesive by screen printing.
The result is a cellular phone glass rear cover D1 printed with the antenna line 31.
Comparative example 2
An antenna line 31 was printed on a rear cover of a glass of a cellular phone in the same manner as in example 1, except that 65 parts by weight of nano-particle silver powder, 32 parts by weight of resin, and 3 parts by weight of binder were mixed to obtain a conductive paste having a resistivity of 12 x 10-8Omega m, and the viscosity of the conductive paste is 400-450 cps.
The result is a handset glass rear cover D2 printed with an antenna circuit.
Test example 1
The cell phone glass rear covers S1-S5 and D1-D2 prepared in examples 1-5 and comparative examples 1-2 were subjected to adhesion tests.
The method for testing the adhesive force comprises the following steps: the test film width was 25mm, the peeling direction was 180 ° parallel to the glass and the film was peeled off using a steady pulling force, the test speed was 300 mm/min.
The results of the adhesion test are shown in table 1.
Test example 2
The cell phone glass rear covers S1-S5 and D1-D2 prepared in examples 1-5 and comparative examples 1-2 were subjected to a light transmittance test.
The light transmittance test method comprises the following steps: and peeling off the OCA glue on the film with the decorative lines, placing the film on a transmittance tester, and adjusting the light wavelength to 550nm to test the light transmittance of the film.
The results of the light transmittance test are shown in table 1.
TABLE 1
| Adhesion (Unit, MPa) | Light transmittance (unit,%) | |
| Example 1 | 30.848 | 94.75 |
| Example 2 | 29.715 | 94.97 |
| Example 3 | 30.641 | 94.56 |
| Example 4 | 29.512 | 94.25 |
| Example 5 | 30.796 | 94.80 |
| Comparative example 1 | 23.473 | 88.94 |
| Comparative example 2 | 23.844 | 89.02 |
In examples 1 to 5, films with decorative patterns were directly tested for adhesion and light transmittance without baking.
In comparative examples 1 to 2, the adhesion and light transmittance of the OCA adhesive were measured after the film with decorative patterns was baked in a 135 ℃ oven for 30 min.
As can be seen from the test data in table 1: after the film with decorative lines is baked in an oven at 135 ℃ for 30min, the adhesive force and the light transmittance of the OCA glue are obviously reduced.
In addition, as can be seen from examples 1 to 5 and comparative examples 1 to 2, the present invention prints a wiring by a screen printing method, and, instead of making the wiring 31 on the film 2 with decorative lines, the wiring 31 is made on another film with adhesive, and then the printed wiring film 3 is subjected to a heat treatment, so that the optical cement OCA in the film 2 with decorative lines and protective ink is adhered to be protected from damage, so that the properties of the optical cement OCA such as adhesion force and light transmittance are not affected, and prints a wiring by a screen printing method, which is simple and easy to operate, and the size of the wiring made by the method is accurate; in addition, the electronic product glass rear cover printed with the circuit prepared by the method has a double-layer film structure.
The preferred embodiments of the present invention have been described above in detail, but the present invention is not limited thereto. Within the scope of the technical idea of the invention, many simple modifications can be made to the technical solution of the invention, including combinations of various technical features in any other suitable way, and these simple modifications and combinations should also be regarded as the disclosure of the invention, and all fall within the scope of the invention.
Claims (13)
1. The electronic product glass rear cover is characterized by comprising a glass substrate (1), and a decorative grain film (2) and a circuit film (3) which are sequentially attached to the glass substrate (1) from inside to outside, wherein a circuit (31) is printed on the outer surface of the circuit film (3);
the circuit film (3) comprises a first base material (30), a circuit (31) formed on one surface of the first base material (30) and an adhesive layer (32) formed on the other surface of the first base material (30), and the circuit film (3) is attached to the film (2) with the decorative grains through the adhesive layer (32);
wherein, there are decoration line film (2) including from outside to inside protection printing ink layer (21), decoration line layer (22), second substrate (20) and OCA glue film (23) that stack gradually, there are decoration line film (2) to pass through OCA glue film (23) with glass base member (1) laminating.
2. The electronic product glass rear cover according to claim 1, wherein an ink layer is further provided between the first substrate (30) and the wiring (31).
3. The electronic product glass rear cover according to claim 1 or 2, wherein the wiring (31) is formed by screen printing with a conductive paste, followed by heat treatment.
4. The electronic product glass rear cover of claim 3, wherein the resistivity of the conductive paste is 8 x 10-8-10×10-8Ωm。
5. The electronic product glass rear cover according to claim 3 or 4, wherein the conductive paste is a mixed paste containing nano-particle silver powder, resin and binder.
6. The electronic product glass rear cover according to claim 5, wherein the content of the nano-particle silver powder is 70 to 85 parts by weight, the content of the resin is 15 to 30 parts by weight, and the content of the binder is 3 to 4 parts by weight, based on 100 parts by weight of the conductive paste, in the conductive paste.
7. An electronic product glass rear cover according to claim 1, wherein the wiring (31) is an antenna wiring.
8. A method for manufacturing a glass rear cover of an electronic product according to any one of claims 1 to 7, comprising the steps of:
(1) providing a decorative grain film (2), and attaching the decorative grain film (2) on the surface of the glass substrate (1);
(2) providing a laminating adhesive film, printing a circuit (31) on the surface of the laminating adhesive film, then carrying out heat treatment to obtain a circuit film (3), and then attaching the circuit film (3) on the surface of the film (2) with decorative grains.
9. The method according to claim 8, wherein in the step (1), before the attaching, a release film (24) is adhered on the OCA glue layer (23) of the decorative grain film (2); in the process of attaching, the release film (24) needs to be torn off.
10. The method according to claim 8, wherein in the step (2), before the attaching, a release film is adhered on the attaching glue layer (32) of the wiring film (3); in the implementation process of attaching, the release film needs to be torn off firstly, and then the attaching glue layer (32) of the circuit film (3) is attached to the film (2) with the decorative grains.
11. The method of claim 8, wherein the heat treatment is performed under conditions comprising: the temperature is 100 ℃ and 150 ℃, and the time is 30-50 min.
12. An electronic product, characterized in that the electronic product comprises the electronic product glass rear cover of any one of claims 1-7.
13. The electronic product of claim 12, wherein the electronic product is a cell phone.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201810194672.9A CN110248001B (en) | 2018-03-09 | 2018-03-09 | Electronic product glass rear cover and preparation method thereof and electronic product |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201810194672.9A CN110248001B (en) | 2018-03-09 | 2018-03-09 | Electronic product glass rear cover and preparation method thereof and electronic product |
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| CN110248001A CN110248001A (en) | 2019-09-17 |
| CN110248001B true CN110248001B (en) | 2021-08-10 |
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| CN103813663A (en) * | 2012-11-05 | 2014-05-21 | 仁宝电脑工业股份有限公司 | Assembling method of shell of electronic device and combination of shell |
| CN106785389A (en) * | 2016-12-09 | 2017-05-31 | 蓝思科技（长沙）有限公司 | The method and the glass back cover with antenna of antenna are made in glass back cover |
| CN206789693U (en) * | 2017-05-10 | 2017-12-22 | 上海德门电子科技有限公司 | A kind of film type antenna |
| CN206911687U (en) * | 2017-05-02 | 2018-01-23 | 比亚迪股份有限公司 | Glass decoration film, ambetti and electronic product |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09307329A (en) * | 1996-05-14 | 1997-11-28 | Casio Comput Co Ltd | Antenna, manufacturing method thereof, and electronic device or electronic timepiece equipped with the antenna |
| CN205355245U (en) * | 2015-12-14 | 2016-06-29 | 东莞华清光学科技有限公司 | A mobile phone glass back cover printed antenna |
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103813663A (en) * | 2012-11-05 | 2014-05-21 | 仁宝电脑工业股份有限公司 | Assembling method of shell of electronic device and combination of shell |
| CN106785389A (en) * | 2016-12-09 | 2017-05-31 | 蓝思科技（长沙）有限公司 | The method and the glass back cover with antenna of antenna are made in glass back cover |
| CN206911687U (en) * | 2017-05-02 | 2018-01-23 | 比亚迪股份有限公司 | Glass decoration film, ambetti and electronic product |
| CN206789693U (en) * | 2017-05-10 | 2017-12-22 | 上海德门电子科技有限公司 | A kind of film type antenna |
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