CN110238750A - Intelligent fine grinding system and method for circuit board packaging device - Google Patents

Abstract

The invention discloses an intelligent fine grinding system and method for circuit board packaging devices, wherein the system includes: a conveying device, including a conveying belt for conveying circuit board micro slices; a grinding device for providing a grinding station, The grinding station includes a rough grinding station corresponding to the first processing station, and a fine grinding station corresponding to the second processing station, and the grinding device includes a first grinding station that provides the rough grinding station. A grinding surface and a second grinding surface providing the fine grinding station; a first reclaiming device comprising a first carrier and a first picker fixed on the first carrier; a second reclaiming device, It includes a second carrier and a second picker fixed on the second carrier; and a controller for controlling the working cooperation of each device. Utilizing the invention, the grinding efficiency of the rock grinding machine can be improved.

Description

Intelligent fine grinding system and method for circuit board packaging device

technical field

The invention relates to the technical field of circuit board micro-slicing processing, in particular to an intelligent fine grinding system and method for circuit board packaging devices.

Background technique

In the processing technology of circuit boards, it usually involves the process of finely grinding the micro-sections of circuit boards by using manual grinding technology to meet the microscopic observation requirements of circuit boards, but the labor cost is high and the grinding efficiency is not high. Realize higher demand for automatic grinding.

Contents of the invention

Aiming at the problem that the existing manual grinding process is difficult to realize high automatic grinding requirements, the invention provides an intelligent fine grinding system and method for circuit board packaging devices.

The technical scheme that the present invention proposes with respect to above-mentioned technical problem is as follows:

On the one hand, the present invention provides an intelligent fine grinding system for circuit board packaging devices, which is applied to a grinding machine, and the system includes:

The conveying device includes a conveying belt for conveying circuit board micro-slices, the conveying belt includes a conveying start end and a conveying end, and a first processing position and a second processing position are sequentially arranged between the conveying start end and the conveying end bit;

A grinding device for providing a grinding station, the grinding station includes a rough grinding station corresponding to the first processing station and a fine grinding station corresponding to the second processing station, the grinding device including a first grinding surface providing the rough grinding station and a second grinding surface providing the fine grinding station;

The first pick-up device for taking and placing the micro-sections of the circuit board at the position of the first processing station includes a first carrier and a first picker fixed on the first carrier, the first The picker is used to pick and place the circuit board micro-slice, and drives the preset slicing surface of the circuit board micro-slice to contact the surface of the first grinding surface during rough grinding; the first carrier is used to transport the first pick-up The device reciprocates between the rough grinding station and the first processing station;

The second pick-up device for taking and placing the circuit board micro-sections at the second processing position, including a second carrier and a second picker fixed on the second carrier, the second The picker is used to pick and place the circuit board micro-slice, and drives the preset slicing surface of the circuit board micro-slice to contact the surface of the second grinding surface during fine grinding; the second carrier is used to transport the second pick-up The device reciprocates between the refining station and the second processing station; and

The controller is used to control: when the circuit board micro-slice is transported to the first processing position by the conveying device, the first pick-up device transfers the circuit board micro-slice to the coarse grinding station and makes the circuit board micro-slice and the first grinding use the first grinding surface to grind the micro-slices of the circuit board for a preset duration or to grind the preset slicing surface of the micro-slices of the circuit board to a preset smoothness; control the first feeding device to grind the rough After the ground circuit board micro-slices are transferred to the first processing position, the circuit board micro-slices are transported to the second processing position by the conveying device; bringing the circuit board microsection into contact with the surface of the second grinding surface; grinding the circuit board microsection for a second predetermined duration or grinding the predetermined slice surface of the circuit board microsection to a second predetermined time using the second grinding surface Smoothness: after controlling the second pick-up device to transfer the finely ground circuit board micro-slices to the second processing station, the conveying device transports the circuit board micro-slices.

According to the above intelligent fine grinding system for circuit board packaging devices, a third processing station is also provided between the conveying start end and the conveying end, and the first processing station is located between the third processing station and the second processing station. Between processing positions;

The grinding station also includes an additional rough grinding station corresponding to the third processing station, and the grinding device also includes a third grinding surface providing the additional rough grinding station, and the additional rough grinding station It is used for rough grinding the back slice surface of the micro-section of the circuit board, and the back slice surface is opposite to the preset slice surface;

The system also includes:

The third pick-up device for taking and placing the circuit board micro-section at the third processing position, including a third carrier and a third picker fixed on the third carrier, the third picker is used When picking and placing the circuit board micro-section, and driving the back slice surface of the circuit board micro-section to contact with the surface of the third grinding surface during coarse grinding; the third carrier is used to transport the third picker on the reciprocating motion between the additional coarse grinding station and the third processing station.

According to the intelligent fine grinding system of the above-mentioned circuit board packaging device, the system also includes:

The turning device for turning over and placing the circuit board micro-slices includes a fourth picker and a turning structure that drives the fourth picker to turn over, and the fourth picker is used for rough grinding and then placed on the Pick up the circuit board micro-slice on the third processing position, and place the circuit board micro-slice on the third processing position after flipping the circuit board micro-slice under the driving action of the flipping structure.

According to the above-mentioned intelligent fine grinding system for circuit board packaged devices, the first material taking device further includes a first support frame, and the first carrier is arranged on the first support frame;

The first carrier includes a first Y-axis module and a first Z-axis module arranged on the first Y-axis module, and the first Y-axis module is used to drive the first Z-axis The module reciprocates in the width direction, the first picker is arranged on the first Z-axis module, and the first Z-axis module is used to drive the first picker to reciprocate in the height direction ;

The conveyor belt drives the micro-slices of the circuit board to move in the length direction, and the movement path of the first Y-axis module driving the first Z-axis module intersects with the projection of the conveyor belt's conveying path on the horizontal plane.

According to the above-mentioned intelligent fine grinding system for circuit board packaging devices, the first picker includes a first jaw module, and the first jaw module includes a first jaw and drives the first jaw to clamp and place Active first jaw cylinder;

The first Y-axis module includes a first lead screw, the first Z-axis module includes a first telescopic cylinder, and the first telescopic cylinder is arranged on the movable block of the first lead screw. A jaw cylinder is arranged at the movable end of the first telescopic cylinder.

According to the above intelligent fine grinding system for circuit board packaged devices, the grinding device includes a grinding driver for respectively driving the rotation of the first grinding surface, the second grinding surface and the third grinding surface.

According to the intelligent fine grinding system of the above-mentioned circuit board packaging device, the system also includes:

The feeding device includes a first conveyor belt for placing circuit board micro-sections, the conveying direction of the first conveyor belt is towards the conveying belt, and the conveying direction of the first conveying belt is perpendicular to the conveying direction of the conveying belt ;and

The feeding and transferring device for transferring the circuit board micro-slices on the first conveyor belt to the conveyor belt includes a first transfer carrier and a first transfer carrier arranged on the first transfer carrier. The material transfer jaw, the first material transfer carrier is used to drive the first material transfer jaw to reciprocate between the first conveyor belt and the conveyor belt.

According to the intelligent fine grinding system of the above-mentioned circuit board packaging device, the system also includes:

The discharge device includes a second conveyor belt for placing circuit board micro slices, the conveying direction of the second conveying belt is away from the conveying belt, and the conveying direction of the second conveying belt faces the conveying direction of the conveying belt vertical; and

A discharge and transfer device for transferring the finely ground circuit board micro-slices on the conveyor belt to the second conveyor belt, including a second transfer carrier and a second transfer carrier The second material transfer jaw on the upper part is used to drive the second material transfer jaw to reciprocate between the conveyor belt and the second conveyor belt.

According to the above-mentioned intelligent fine grinding system for circuit board packaging devices, a plurality of fixing parts are arranged on the conveyor belt, and the plurality of fixing parts are arranged at preset intervals, and the fixing parts are arranged for placing circuit board micro slices groove.

On the other hand, the present invention also provides a grinding method applied to the intelligent fine grinding system of the circuit board packaging device as described above, the method comprising:

When the circuit board micro-section is transported to the first processing position by the conveying device, the first pick-up device transfers the circuit board micro-section to the coarse grinding station and makes the circuit board micro-section contact with the surface of the first grinding surface;

Utilizing the first grinding surface to grind the micro-slice of the circuit board for a preset duration or to grind the preset slicing surface of the micro-slice of the circuit board to a preset smoothness;

After controlling the first feeding device to transfer the roughly ground circuit board micro-slices to the first processing position, the conveying device transports the circuit board micro-slices to the second processing position;

Using the second pick-up device to transfer the circuit board to the fine grinding station and make the circuit board micro-section contact with the surface of the second grinding surface;

Utilizing the second grinding surface to grind the micro-slice of the circuit board for a second predetermined duration or to grind the predetermined slicing surface of the micro-slice of the circuit board to a second predetermined smoothness;

After controlling the second picking device to transfer the finely ground circuit board micro-slices to the second processing station, the conveying device transports the circuit board micro-slices.

The beneficial effects brought by the technical solution provided by the embodiments of the present invention are:

A rough grinding station and a fine grinding station are arranged on the grinding device, and the circuit board micro-slices are transported to the first processing station and the second processing station by a conveyor belt. When the circuit board micro-slices are transported to the first processing station, the circuit board micro-slices on the first processing station are transferred to the coarse grinding station by the provided first pick-up device. After the coarse grinding process is completed, the first pick-up device transfers the circuit board micro-slices to the conveyor belt located in the first processing station area, and then transports the circuit board micro-slices to the second processing station through the conveyor belt. When the circuit board micro-slices are transported to the second processing station, the circuit board micro-slices on the second processing station are transferred to the fine grinding station by the provided second pick-up device. After the fine grinding process is completed, the second pick-up device transfers the circuit board micro-slices to the second processing station area for conveyance, and finally sent out by the conveyor belt, thereby realizing the requirement for automatic secondary grinding of the circuit board micro-slices , and involves two reclaiming structures of the first reclaiming device and the second reclaiming device, which is conducive to improving the grinding efficiency.

Description of drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings that need to be used in the description of the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present invention. For those skilled in the art, other drawings can also be obtained based on these drawings without creative effort.

FIG. 1 is a schematic diagram of a top view structure of an intelligent fine grinding system for a circuit board package device according to an embodiment of the present invention.

FIG. 2 is a flow chart of a grinding method of an intelligent fine grinding system for a circuit board package device according to an embodiment of the present invention.

FIG. 3 is a schematic diagram of an implementation structure of an embossing grinder for an intelligent fine grinding system including the aforementioned circuit board packaging device provided by the present invention.

Fig. 4 is a schematic structural view of the rocker grinder in Fig. 3 in a top view.

Fig. 5 is a schematic diagram of the three-dimensional structure of the feeding device involved in Fig. 3 .

FIG. 6 is a schematic perspective view of the three-dimensional structure of the material feeding and transferring device involved in FIG. 3 .

Fig. 7 is a schematic side view of the feeding and charging device involved in Fig. 6 .

FIG. 8 is a schematic perspective view of the delivery device involved in FIG. 3 .

FIG. 9 is a three-dimensional structural schematic diagram of the turning device involved in FIG. 3 .

FIG. 10 is a schematic plan view of the first material reclaiming device, the second material reclaiming device and the third material reclaiming device involved in FIG. 3 .

FIG. 11 is a schematic diagram of the side structure of the second reclaiming device involved in 10. FIG.

FIG. 12 is a schematic perspective view of the three-dimensional structure of the grinding device involved in FIG. 3 .

FIG. 13 is a schematic diagram of the three-dimensional structure of the discharging device involved in FIG. 3 .

Detailed ways

In order to make the object, technical solution and advantages of the present invention clearer, the implementation manner of the present invention will be further described in detail below in conjunction with the accompanying drawings.

Referring to Fig. 1, it is a schematic diagram of the top view structure of the intelligent fine grinding system of the circuit board package device provided in one embodiment of the present invention, which can be applied to the grinding machine for grinding the specified slice surface of the circuit board micro-slice, which can be specifically It is all or part of the equipment of the grinding machine.

The intelligent fine grinding system 1 of the circuit board packaging device provided by the present invention can include a conveying device 11, a grinding device 12, a first retrieving device 13, a second retrieving device 14 and a controller for controlling the aforementioned devices (not shown in the figure) output), the controller is used to control the working cooperation of the grinding device 12, the first reclaiming device 13 and the second reclaiming device 14.

Wherein, the conveying device 11 may include a conveying belt 111 for conveying the circuit board micro-slice 2, the conveying belt 12 includes a conveying start end and a conveying end, and the conveying direction of the conveying belt 111 conveying the circuit board micro-slice is from the conveying start end Point in the direction of the delivery end. A first processing station 112 and a second processing station 113 are sequentially arranged between the conveying start end and the conveying end, and the first processing station 112 transports the circuit board micro-sections to a specific area for the conveyor belt 111 Similarly, the second processing position 112 is a preset area for the conveyor belt 111 to transport the circuit board micro slices to another specific area for subsequent devices to pick up or place.

The grinding device 12 can provide a grinding station, which is a working area for grinding circuit board micro-sections, and the grinding station can include a rough grinding station corresponding to the position of the first processing station 112 121. The fine grinding station 122 corresponding to the position of the second processing station 113, the grinding device 12 may include the first grinding surface 1211 providing the rough grinding station 121 and the surface 121 providing the fine grinding station 122 The second grinding surface 1221 .

The first pick-up device 13 can be used to pick and place the circuit board micro-sections located at the first processing position 112, and can specifically include a first carrier 131 and a first carrier fixed on the first carrier 131. Pickup 132 . The first picker 132 can be used to pick and place the micro-slices of the circuit board, and drives the preset slicing surface of the micro-slices of the circuit board to contact with the surface of the first grinding surface 1211 during rough grinding. The first carrier 131 is used to transport the first picker 132 to reciprocate between the rough grinding station 121 and the first processing station 112 . Here, the preset slicing plane of the circuit board micro-slicing is the preset plane requiring secondary grinding.

The second pick-up device 14 can be used to pick and place the circuit board micro-sections located at the second processing position 113, and can specifically include a second carrier 141 and a second carrier fixed on the second carrier 141. The picker 142, the second picker 142 is used to pick and place the circuit board micro-slice, and drives the preset slicing surface of the circuit board micro-slice to contact with the surface of the second grinding surface 1221 during fine grinding. The second carrier 141 is used to transport the second picker 142 to reciprocate between the fine grinding station 122 and the second processing station 113 .

During the operation of this embodiment, the action cooperation between the various devices can be roughly as follows: the circuit board micro-slices are transported to the first processing position 112 by the conveyor belt 111, and then the first picker 132 is driven by the first carrier 131 from the The first processing station 112 picks up the circuit board micro-section and drives the first picker 132 to move to the coarse grinding station 121 . When the first picker 132 and the circuit board microsection move to the rough grinding station 121, the first carrier 131 drives the first picker 132 close to the first grinding surface 1211 and makes the circuit board microsection The preset slicing surface is in contact with the surface of the first grinding surface 1211; thereafter, the first pick-up 132 can drive the circuit board micro-slice to rotate so as to form grinding with the first grinding surface 1211, or the first grinding surface of the grinding device 12 can The face 1211 is rotated to form a lap with the circuit board microsection on the first picker 132 . After using the first grinding surface 1211 to grind the micro-slice of the circuit board for a preset time or to grind the preset section surface of the micro-slice of the circuit board to a preset smoothness, control the first carrier 131 to drive the second A picker 132 transfers the roughly ground circuit board micro-slices to the first processing station 112 , and then transports the circuit board micro-slices to the second processing station 113 by the conveyor belt 111 . Thereafter, the second picker 142 is driven by the second carrier 141 to pick up the circuit board micro-section from the second processing station 113 and drives the second picker 142 to move to the finishing station 122 . When the second picker 142 moves to the fine grinding station 122, the second carrier 141 then drives the second picker 142 close to the second grinding surface 1221 and makes the preset slicing surface of the circuit board micro-section and The surface contact of the second grinding surface 1221; Similarly, the second pick-up 142 can drive the circuit board micro-section to rotate so that it forms grinding with the second grinding surface 1221, or the second grinding surface 1221 of the grinding device 12 can be rotated to make it It forms a grind with the circuit board microsection on the first picker 132 .

It can be understood that the above-mentioned action coordination can be controlled by the controller to control the grinding device 12, the first reclaiming device 13 and the second reclaiming device 14, or to control the conveying device 11, the grinding device 12, the first reclaiming device 13 and the second reclaiming device. The second pick-up device 14 realizes that the controller is used to control: when the circuit board micro-slice is transported to the first processing position by the conveying device, the first pick-up device transfers the circuit board micro-slice to the coarse grinding station and making the circuit board micro-slice contact with the surface of the first grinding surface; using the first grinding surface to grind the circuit board micro-slice for a preset duration or grinding the preset slice surface of the circuit board micro-slice to a preset smoothness; controlling After the first pick-up device transfers the roughly ground circuit board micro-slices to the first processing position, the circuit board micro-slices are transported to the second processing position by the conveying device; The circuit board is transferred to the fine grinding station and the micro-section of the circuit board is contacted with the surface of the second grinding surface; the second grinding surface is used to grind the micro-section of the circuit board for a second preset duration or the pre-set time of the micro-section of the circuit board Grinding the slice surface to a second preset smoothness; controlling the second pick-up device to transfer the finely ground circuit board micro-slices to the second processing position, and then transporting the circuit board micro-slices by the conveying device .

The present invention also provides a grinding method of an intelligent fine grinding system for a circuit board packaged device, referring to FIG. 2 , which provides a flowchart of a grinding method for an intelligent fine grinding system for a circuit board packaged device in an embodiment of the present invention, combined with FIG. 1 , the method may include the following steps:

S11: When the circuit board micro-section is transported to the first processing position 112 by the conveying device 11, the first pick-up device 13 transfers the circuit board micro-section to the coarse grinding station 121 and makes the circuit board micro-section and the first grinding surface 1211 surface contact. Wherein, the conveying device 11 can use its conveying belt 111 to convey the circuit board micro-slices to the first processing position 112, and the time, speed and degree of completion of the conveying device 11 can be controlled by the controller . The circuit board micro-section is picked up by the first picker 132 of the first pick-up device 13 and carried by the first carrier 131 to achieve a corresponding spatial position transfer.

S12: Utilize the first grinding surface 1211 to grind the circuit board micro-slice for a preset time or grind the preset slice surface of the circuit board micro-slice to a preset smoothness. Here, the first pick-up 132 can drive the circuit board micro-slice to rotate so that it can be ground with the first grinding surface 1211, or can be rotated by the first grinding surface 1211 of the grinding device 12 so that it can be ground with the first grinding surface 1211 on the first pick-up 132. The micro-section of the circuit board is ground, or the first grinding surface 1211 of the grinding device 12 can be rotated to form grinding with the micro-section of the circuit board on the first picker 132 .

S13 : Control the first picking device 13 to transfer the roughly ground circuit board micro-slices to the first processing station 112 , and then transport the circuit board micro-slices to the second processing station 113 by the conveying device 11 .

S14 : Using the second pick-up device 14 to transfer the circuit board to the fine grinding station 122 and make the micro-section of the circuit board contact the surface of the second grinding surface 1221 . Wherein, the conveying device 11 can use its conveyor belt 111 to transport the circuit board micro-section to the second processing position 113. The circuit board micro-section is picked up by the second picker 142 of the second pick-up device 14 and passed through The carrying function of the first carrying member 141 realizes corresponding spatial position transfer.

S15: Utilize the second grinding surface 1221 to grind the circuit board micro-slice for a second preset duration or grind the preset slicing surface of the circuit board micro-slice to a second preset smoothness. Here, it is the same as that of step S12, which will not be repeated here.

S16: Use the second pick-up device to transfer the circuit board micro-slice to the fine grinding station and control the second pick-up device to transfer the fine-grinded circuit board micro-slice to the surface of the circuit board micro-slice and the second grinding surface After arriving at the second processing position, the circuit board micro-slices are transported by the transport device.

It should be understood that the steps involved in the grinding method provided in this embodiment may be added, replaced, deleted and/or the order of the steps may be changed in order to achieve the desired or specific purpose.

The intelligent fine grinding system for circuit board packaged devices provided in this embodiment is provided with a rough grinding station and a fine grinding station on the grinding device, and conveys the circuit board micro-slices to the first processing station and the second processing station through a conveyor belt. bit. When the circuit board micro-slices are transported to the first processing station, the circuit board micro-slices on the first processing station are transferred to the coarse grinding station by the provided first pick-up device. After the coarse grinding process is completed, the first pick-up device transfers the circuit board micro-slices to the conveyor belt located in the first processing station area, and then transports the circuit board micro-slices to the second processing station through the conveyor belt. When the circuit board micro-slices are transported to the second processing station, the circuit board micro-slices on the second processing station are transferred to the fine grinding station by the provided second pick-up device. After the fine grinding process is completed, the second pick-up device transfers the circuit board micro-slices to the second processing station area for conveyance, and finally sent out by the conveyor belt, thereby realizing the requirement for automatic secondary grinding of the circuit board micro-slices , and involves two reclaiming structures of the first reclaiming device and the second reclaiming device, which is conducive to improving the grinding efficiency.

Fig. 3 is a structural schematic diagram of an implementation of an embossing grinder that provides an intelligent fine grinding system including the aforementioned circuit board packaging device according to the present invention; Fig. 4 is a schematic structural view of the embossing grinder in Fig. 3 in a top view. Fig. 5 is a schematic diagram of the three-dimensional structure of the feeding device involved in Fig. 3 . FIG. 6 is a schematic perspective view of the three-dimensional structure of the material feeding and transferring device involved in FIG. 3 . Fig. 7 is a schematic side view of the feeding and charging device involved in Fig. 6 . FIG. 8 is a schematic perspective view of the delivery device involved in FIG. 3 . FIG. 9 is a three-dimensional structural schematic diagram of the turning device involved in FIG. 3 . FIG. 10 is a schematic plan view of the first material reclaiming device, the second material reclaiming device and the third material reclaiming device involved in FIG. 3 . FIG. 11 is a schematic diagram of the side structure of the second reclaiming device involved in 10. FIG. FIG. 12 is a schematic perspective view of the three-dimensional structure of the grinding device involved in FIG. 3 . FIG. 13 is a schematic diagram of the three-dimensional structure of the discharging device involved in FIG. 3 .

3 to 13, the grinding mill 3 can include a frame 31 and the aforementioned devices and/or systems arranged on the frame 31, and the frame 31 is provided with a feeding device 32, a conveying Device 33, grinding device 34, first reclaiming device 35, second reclaiming device 36, the 3rd reclaiming device 37, discharging device 38, turning device 39 and control panel 311, wherein, described feeding device 32 comprises The first conveyor belt 322 for placing the circuit board micro-section 4 and the feeding and transferring device 323 for transferring the circuit board micro-section 4 on the first conveyor belt 322 to the conveying device 22, specifically, the The input device 33 includes a conveyor belt 331 for conveying the circuit board micro-slices 4 , and the feeding and transferring device 323 is used for transferring the circuit board micro-slices 4 to the conveyor belt 331 . Similarly, the discharge device 38 includes a second conveyer belt 383 for accommodating the circuit board micro-slice 4 and is used to transfer the circuit board micro-slice 4 on the conveyer belt 331 to the second conveyer belt 331 after being finely ground. The material transfer device 382 on the conveyor belt 383.

The conveying belt 331 of the conveying device 33 includes a conveying start end and a conveying end, and a first processing station 332 and a second processing station 333 are sequentially arranged between the conveying start end and the conveying end. In this embodiment, the conveyor belt 331 drives the circuit board micro-slice 4 to move in the longitudinal direction. More specifically, the conveying direction of the first conveying belt 322 faces the conveying belt 331 , and the conveying direction of the first conveying belt 322 may be perpendicular to the conveying direction of the conveying belt 331 . Referring to FIG. 8 , the conveying device 33 may further include a conveying rail 334 for guiding the conveying belt 331 to move in a specific direction and a conveying drive motor 337 for driving the conveying belt 331 to rotate. A plurality of fixing parts 335 are further provided on the conveyor belt 331, and the plurality of fixing parts 335 are evenly distributed at predetermined intervals, and the fixing parts 335 include grooves for accommodating circuit board microsections 4 .

Referring to Fig. 6 and Fig. 7, in combination with Fig. 3 and Fig. 4, the feeding device 32 may also include an inlet for transferring the circuit board micro-section 4 on the first conveyor belt 322 to the conveyor belt 331. The material transfer device 323, the feed transfer device 323 can also include a feed transfer support frame 3231, and the first transfer carrier 3232 is arranged on the feed transfer support frame 3231, which can specifically include The first material transfer slide table cylinder 3233 and the first material transfer double rod cylinder 3234, the fixed end of the first material transfer double rod cylinder 3234 is arranged on the movable block of the first material transfer slide table cylinder 3233, and the The first material transfer jaw 3235 is arranged on the movable block of the first material transfer double-rod cylinder 3234 . Here, the active path of the first material transfer double-rod cylinder 3234 partially overlaps with the projection of the conveying path of the first conveyor belt 322 on the horizontal plane.

The feeding and transferring device 323 is arranged at the starting end of the conveying belt 331 . The material feeding and transferring device 323 includes a first transfer carrier 3232 and a first transfer gripper 3235 arranged on the first transfer carrier 3232, and the first transfer carrier 3232 is used to drive The first transfer jaw 3235 reciprocates between the first conveyor belt 322 and the conveyor belt 331 . Here, the feeding and transferring device 323 may further include a sensor 3236 for collecting the height position of the first transferring jaw 3235 .

Further, the discharge device 38 may also include a discharge transfer device 383 for transferring the circuit board micro slice 4 on the conveyor belt 331 to the second conveyor belt 382, the discharge transfer device 383 The specific structure of the device 383 is similar to that of the feeding and transferring device 323, the difference being that it is arranged at the conveying end of the conveyor belt 331, and the discharging and transferring device 383 includes a second transferring carrier (not shown, its The same structure as the first transfer carrier 3232 in Fig. 6) and the second transfer gripper (not shown in the figure, which is the same as the first transfer carrier in Fig. 6) arranged on the second transfer carrier The clamping jaws have the same structure), and the second material transfer carrier is used to drive the second material transfer jaws to reciprocate between the conveyor belt and the second conveyor belt.

Further, the discharge transfer device 383 may also include a discharge transfer support frame (same structure as 3231 in FIG. 6 ), and the second transfer carrier may include a second transfer slide cylinder and Two-rotating double-rod cylinder, the second rotating material slide cylinder is set on the discharge material transfer support frame, and the fixed end of the second rotating material double-rod cylinder is set on the second material turning slide On the movable block of the air cylinder; the second material transfer jaw is arranged on the movable block of the second material transfer double-rod cylinder. It should be understood that, because the structure of the discharging and transferring device 383 is similar to that of the feeding and transferring device 323 , no further description is given here.

The grinding device 34 is used to provide a grinding station, and the grinding station may include a rough grinding station 341 corresponding to the first processing station 332 and a fine grinding station corresponding to the second processing station 333. position 342 , the grinding device 34 includes a first grinding surface 3411 providing the rough grinding station 341 and a second grinding surface 3421 providing the fine grinding station 342 .

The first pick-up device 35 is used to take and place the circuit board micro-section 4 located at the first processing position 332, including a first carrier 352 and a first picker fixed on the first carrier 352. device 354, the first picker 354 is used to pick and place the circuit board micro-slice 4, and drives the preset slicing surface of the circuit board micro-slice 4 to contact the surface of the first grinding surface 3411 during rough grinding, the The first carrying part 352 is used for transporting the first picker 354 to reciprocate between the rough grinding station 341 and the first processing station 332 . Specifically, the first carrier 352 may include a first lead screw and a first telescopic cylinder 353 arranged on the movable end of the first lead screw, and the first pick-up 354 is arranged on the first telescopic cylinder. The lifting movable end of 353.

Specifically, referring to Fig. 10 and Fig. 11, the first retrieving device 35 also includes a first support frame 351, and both the second reclaiming device 36 and the third reclaiming device 37 can be supported by the first support frame 351 . Viewed from the direction of the axis where the first carrier 352 drives the first picker 354 to move, the first carrier 352 includes a first Y-axis module and a first Y-axis module arranged on the first Y-axis module. Z-axis module, the first Y-axis module is used to drive the first Z-axis module to reciprocate in the width direction, specifically the first Y-axis module can be the aforementioned first lead screw, and the first Z-axis module can A picker 354 is disposed on the first Z-axis module, and the first Z-axis module is used to drive the first picker 354 to reciprocate in the height direction. Specifically, the first Z-axis module can be the aforementioned first telescopic cylinder 353 . Here, the movement path of the first Y-axis module that drives the first Z-axis module to move intersects with the projection of the conveying path of the conveyor belt 331 on the horizontal plane, so that the first pick-up device 35 can pick up Strip 331 on the circuit board for micro-slicing 4 .

Similarly, viewed from the axis direction in which the second carrier 361 drives the second picker 363 to move, the second carrier 361 includes a second Y-axis module and is arranged on the second Y-axis module. The second Z-axis module, the second Y-axis module is used to drive the second Z-axis module to reciprocate in the width direction, specifically the second Y-axis module can be the second screw cylinder, so The second picker 363 is arranged on the second Z-axis module, and the second Z-axis module is used to drive the second picker 363 to reciprocate in the height direction. Specifically, the second Z-axis module can be the aforementioned second telescopic cylinder 362 . Here, the movement path that the second Y-axis module drives the second Z-axis module to move intersects with the projection of the conveying path of the conveyor belt 331 on the horizontal plane, so that the second picking device 36 can pick up Strip 331 on the circuit board for micro-slicing 4 . It should be understood that the above-mentioned length direction, width direction and height direction are based on the direction description of the side pressure grinder placed in an ideal horizontal state, and the length and height of the side pressure grinder can be observed from the front view of the side pressure grinder. high.

A third processing station 334 is also provided between the conveying starting end and the conveying end, and the first processing station 332 is located between the third processing station 334 and the second processing station 333 The rock grinder 3 can also include the third reclaiming device 37, the grinding station also includes an additional coarse grinding station 343 corresponding to the third processing station 334, and the grinding device 34 also includes the The third grinding surface 3431 of the additional coarse grinding station 343, the additional coarse grinding station 343 is used for rough grinding the back slice surface of the circuit board micro-slice 4, the back slice surface and the preset slice surface relative position. It can be understood that, compared with the aforementioned structure, only the preset slicing surface of the circuit board micro-slicing 4 is ground for the second time, and the third retrieving device 37 and the third grinding surface 3431 added can make the back of the circuit board micro-slicing 4 The sliced surface is ground to save the traditional labor cost of manually grinding the back slice of the circuit board micro-slice 4 .

Here, the third retrieving device 37 is used to pick and place the circuit board micro-section 4 at the third processing position 334, similar to the structure of the first retrieving device 35 and the second retrieving device 36, the The 3rd pick-up device 37 comprises the 3rd carrier 371 and the 3rd picker 373 that is fixed on the described 3rd carrier 371, and the 3rd picker 373 is used for picking and placing circuit board micro-section 4, and in coarse When grinding, the back slicing surface of the circuit board micro-slice 4 is brought into contact with the surface of the third grinding surface 3431; Reciprocating movement with the third processing position. The third retrieving device 37 has the same retrieving action and process as the first retrieving device 35 and the second retrieving device 36 described above. In order to avoid repeated description, it will not be described here.

It can be understood that the surface to be ground of the circuit board micro-slice 4 taken and placed by the third pick-up device 37 is different from the preset slicing surface of the circuit board micro-slice 4 , so that the circuit board micro-slice 4 is removed by the conveyor belt 331 Before being transported to the first processing position 332, the circuit board micro-slice 4 on the conveyor belt 331 needs to be turned over, so that the preset slice surface of the circuit board micro-slice 4 picked up by the first pick-up device 35 faces the first grinding Face 3411.

It can be understood that the feeding device 32, the conveying device 33 and the discharging device 38 can constitute a grinding conveying system, of course, the feeding and transferring device 323 and the discharging transferring device 383 can be further included to form a grinding and conveying system. Wherein, the feeding device 32 can be used to input the circuit board micro-slice 4 to be ground, including the first conveyor belt 322 for accommodating the circuit board micro-slice 4; Slicing, including the second conveyor belt 382 for loading circuit board micro slices; the conveyor belt 331 of the conveying device 33 is arranged between the first conveyor belt 322 and the second conveyor belt 382, the first The conveying direction of the conveying belt 322 faces the conveying belt 331 , and the conveying direction of the second conveying belt 382 is away from the conveying belt 331 .

The feeding transfer device 323 is used to transfer the circuit board micro-sections on the first conveyor belt 322 to the conveyor belt 331, and the output transfer device 383 is used to transfer the finely ground circuit board micro slices to the conveyor belt 331. The circuit board microsections on the belt 331 are transferred to the second conveyor belt 382 . Thus, through the feeding device 32, the feeding device 323, the conveying device 33, the discharging device 383 and the discharging device 38 that cooperate with each other, it can be beneficial to the rapid delivery of the circuit board micro-slices, which is conducive to improving the micro-section of the circuit board. slice delivery efficiency.

Here, the conveyor belt 331 is set on the side of the transmission end of the first conveyor belt 322, and is located on the side of the transmission start end of the second conveyor belt 382, more specifically, the first conveyor belt and the second conveyor belt The two conveyor belts are arranged in parallel, and the conveyor belts 331 are perpendicular to the first conveyor belt 322 and the second conveyor belt 382 .

Referring to Fig. 9, and in conjunction with Fig. 3, Fig. 4 and Fig. 8, the overturning device 39 is used to overturn and place the circuit board micro-section 4, and may include a fourth picker 392 and an overturning device that drives the fourth picker 392 to overturn. structure 391 , the fourth picker 392 intersects the horizontal projection of the transport path of the conveyor belt 331 , so that the fourth picker 392 can pick up the circuit board micro-slices on the conveyor belt 331 . The flipping structure 391 may include a displacement driver 393 for driving the fourth picker 392 close to the circuit board micro-section and a rotary driver 394 arranged on the movable end of the displacement driver 393, the fourth picker is set On the rotating movable end of said rotating drive 394 .

The fourth picker 392 is used to pick up the circuit board micro-section 4 placed on the third processing position 334 after rough grinding, and turn over the circuit board micro-section under the driving action of the flipping structure 391. After slicing 4, the circuit board micro-slice 4 is placed 334 on the third processing position. Here, the displacement driver 393 is a lifting driver, and the rotation driver 394 is arranged on the lifting movable end of the lifting driver, where the lifting driver can be a slide cylinder or a lead screw. The fourth picker 392 includes a fourth jaw 3921 and a fourth jaw driver 3922 for driving the jaw to clamp and place. The fourth clamping jaw 3921 includes a first clamping portion and a second clamping portion for forming a clamping fit, and the first clamping portion and the second clamping portion are provided with a circuit board micro Dimples that match the shape of the edge of the slice.

It can be understood that the overturning device 39 can be arranged at any position between the third processing position 334 and the second processing position 332, so as to transport the back slices of the roughly ground circuit board micro-slices 4 to the conveyor belt 331 The circuit board micro-slice 4 on one side is turned over, thereby realizing automatic double-sided grinding of the circuit board micro-slice 4, which is beneficial to improving the grinding efficiency.

Referring to Fig. 12, the grinding device 34 includes three coarse grinding stations 341, fine grinding stations 342 and additional coarse grinding stations respectively corresponding to the first reclaimer 35, the second reclaimer 36 and the third reclaimer 37. 343, and when grinding, the grinding driver can be used to drive the rotation of each of the first grinding surface 3411, the second grinding surface 3421 and the third grinding surface 3431, so as to form grinding with the circuit board micro-slice 4 and realize the grinding function. During the grinding process, the liquid injected by the liquid injector 3412 can also be used for grinding, so as to achieve the corresponding grinding purpose. Here, the first grinding surface 3411 can be provided by a first grinding disc (not shown in the figure, which is a disc-shaped structure in the figure), the second grinding surface 3421 can be provided by a second grinding disc, and the third grinding Face 3431 may be provided by a third grinding disc.

13, and in conjunction with the previous figure, the discharge device 38 includes a second conveyor belt 382 for placing circuit board micro slices 4, the conveying direction of the second conveyor belt 382 is away from the conveyor belt 331, and the second conveyor belt 382 The conveying direction of the conveying belt 382 is perpendicular to the conveying direction of the conveying belt 311 . Here, the second conveyor belt 382 is driven by the provided discharge driver 385 to convey, further, the discharge device 38 also includes a discharge support 384, and the discharge support 384 is arranged on the second conveyor belt. 382, and the discharge driver 385 is arranged on the discharge support.

It can be understood that, on the basis of the foregoing, the conveyor belt 311 is perpendicular to the first conveyor belt 322 and the second conveyor belt 382 respectively, so devices such as the grinding device 34 can be arranged in the space between the first conveyor belt 322 and the second conveyor belt 382 Therefore, the degree of integration of the rocker grinder 3 can be improved, which is beneficial to reducing the volume of the rocker grinder 3 .

The above descriptions are only preferred embodiments of the present invention, and are not intended to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention shall be included in the protection of the present invention. within range.

Claims (10)

1. a kind of Intelligent fine grinding system of circuit board package device is applied to whetstone and presses grinder, which is characterized in that the system System includes:

Conveying device, including the conveyer belt for the micro- slice of transporting circuit board, the conveyer belt includes conveying beginning and conveying end End, is sequentially provided with the first machining position and the second machining position between the conveying beginning and the conveying end；

For providing the grinding device of ground station, the ground station includes corase grinding corresponding with first machining position position Station, fine grinding station corresponding with second machining position position, the grinding device include provide the corase grinding station the Second abradant surface of one abradant surface and the offer fine grinding station；

For picking and placing the first feeding device for being located at the micro- slice of circuit board of the first processing bit positions, including the first delivery Part and the first pick-up being fixed in first carrier member, first pick-up are used to pick and place the micro- slice of circuit board, and The default sliced surfaces of the micro- slice of circuit board are driven to contact with the surface of first abradant surface in corase grinding；First carrier member It is moved back and forth between the corase grinding station and first machining position for transporting first pick-up；

For picking and placing the second feeding device for being located at the micro- slice of circuit board of the second processing bit positions, including the second delivery Part and the second pick-up being fixed in second carrier member, second pick-up are used to pick and place the micro- slice of circuit board, and The default sliced surfaces of the micro- slice of circuit board are driven to contact with the surface of second abradant surface in fine grinding；Second carrier member It is moved back and forth between the fine grinding station and second machining position for transporting second pick-up；And

Controller, for controlling: when using conveying device by the micro- slices synthesis method of circuit board to the first machining position, the first feeding dress It sets and the micro- slice of circuit board is transferred to corase grinding station and contacts the micro- slice of circuit board with the surface of the first abradant surface；Utilize first Abradant surface grinds the micro- slice of circuit board pre- to be ground to up to preset duration or by the default sliced surfaces of the micro- slice of circuit board If smooth degree；Control first feeding device by the circuit board after corase grinding it is micro- slice be transferred to first machining position after, By the conveying device by the micro- slices synthesis method of circuit board to the second machining position；The micro- slice of circuit board is turned using the second feeding device It moves to fine grinding station and contacts the micro- slice of circuit board with the surface of the second abradant surface；It is cut using the second abradant surface is micro- to circuit board Piece is ground to be ground to the second default smooth degree up to the second preset duration or by the default sliced surfaces of the micro- slice of circuit board； Control second feeding device by the circuit board after fine grinding it is micro- slice be transferred to second machining position after, by the conveying dress It sets the micro- slices synthesis method of circuit board.

2. the Intelligent fine grinding system of circuit board package device according to claim 1, which is characterized in that in the conveying Be additionally provided with third machining position between beginning and the conveying end, first machining position be located at the third machining position with it is described Between second machining position；

The ground station further includes additional corase grinding station corresponding with third machining position position, and the grinding device also wraps It includes and the third abradant surface of the additional corase grinding station is provided, the additional corase grinding station is for cutting the back of the micro- slice of circuit board Unilateral to be roughly ground, the back sliced surfaces are opposite with the default sliced surfaces position；

The system also includes:

For pick and place be located at third processing bit positions the micro- slice of circuit board third feeding device, including third carrier member and The third pick-up being fixed in the third carrier member, the third pick-up are used to pick and place the micro- slice of circuit board, and thick The back sliced surfaces of the micro- slice of circuit board are driven to contact with the surface of the third abradant surface when mill；The third carrier member is used for The third pick-up is transported to move back and forth between the additional corase grinding station and the third machining position.

3. the Intelligent fine grinding system of circuit board package device according to claim 2, which is characterized in that the system is also Include:

Turnover device for the micro- slice of circuit board to be overturn and placed, including the 4th pick-up and drive the described 40th The overturning structure for taking device to overturn, the 4th pick-up are used for being placed in the third machining position after after rough lapping The micro- slice of circuit board is picked up, and after the micro- slice of reverse circuit plate that circuit board is micro- under the induced effect of the overturning structure Slice is placed in the third machining position.

4. the Intelligent fine grinding system of circuit board package device according to claim 3, which is characterized in that described first takes Material device further includes with the first support frame, and first carrier member is arranged on first support frame；

First carrier member includes the first Y-axis mould group and the first Z axis mould group being arranged in the first Y-axis mould group, described For driving the first Z axis mould group reciprocating movement in the direction of the width, first pick-up is arranged in institute first Y-axis mould group It states in the first Z axis mould group, the first Z axis mould group is for driving first pick-up reciprocating movement in the height direction；

The conveyer belt drives the micro- slice of circuit board to move in length direction, and the first Y-axis mould group drives the first Z axis mould The movable motion path of group intersects with the projection of the transport path of the conveyer belt in the horizontal plane.

5. the Intelligent fine grinding system of circuit board package device according to claim 4, which is characterized in that

First pick-up includes the first clamping jaw mould group, and the first clamping jaw mould group includes the first clamping jaw and driving described first Clamping jaw carries out folding up movable first clamping jaw cylinder；

The first Y-axis mould group includes the first lead screw, and the first Z axis mould group includes the first telescopic cylinder, and described first is flexible Cylinder is arranged on the movable block of first lead screw, and the activity of first telescopic cylinder is arranged in the first clamping jaw cylinder End.

6. the Intelligent fine grinding system of circuit board package device according to claim 2, which is characterized in that

The grinding device includes for respectively driving first abradant surface, second abradant surface and the third abradant surface The grinding driver of rotation.

7. according to claim 1 to the Intelligent fine grinding system of any one of 6 circuit board package devices, which is characterized in that The system also includes:

Feeding device, including the first conveyer belt for putting the micro- slice of circuit board, the direction of transfer court of first conveyer belt To the conveyer belt, and the direction of transfer of first conveyer belt is vertical with the conveying direction of the conveyer belt；And

Pan feeding material transfering device for the micro- slice of the circuit board on first conveyer belt to be transferred on the conveyer belt, including First turn of material carrier member and first turn of feed collet pawl being arranged in first turn of material carrier member, first turn of material carrier member are used It is moved back and forth between first conveyer belt and the conveyer belt in drive first turn of feed collet pawl.

8. according to claim to the Intelligent fine grinding system of the 7 circuit board package devices, which is characterized in that the system Further include:

Discharging device, including the second conveyer belt for putting the micro- slice of circuit board, the sender of second conveyer belt supports or opposes From the conveyer belt, and the direction of transfer court of second conveyer belt is vertical with the conveying direction of the conveyer belt；And

Discharging for the micro- slice of the circuit board on the conveyer belt described after smooth grinding to be transferred on second conveyer belt turns Expect device, the second turn of feed collet pawl expecting carrier member including second turn and being arranged in second turn of material carrier member, described second Turn material carrier member for driving second turn of feed collet pawl to move back and forth between the conveyer belt and second conveyer belt.

9. the Intelligent fine grinding system of the 7 circuit board package devices according to claim, which is characterized in that described Multiple fixing pieces are provided on conveyer belt, the multiple fixing piece is arranged by preset interval, is arranged on the fixing piece for putting The groove of the micro- slice of circuits plate.

10. a kind of applied to the Intelligent fine grinding system of circuit board package device as described in any one of claims 1 to 9 Grinding method, which is characterized in that the described method includes:

When using conveying device by the micro- slices synthesis method of circuit board to the first machining position, the first feeding device is by the micro- slice of circuit board It is transferred to corase grinding station and contacts the micro- slice of circuit board with the surface of the first abradant surface；

The micro- slice of circuit board is ground up to preset duration or by default the cutting of the micro- slice of circuit board using the first abradant surface It is unilateral to be ground to default smooth degree；

Control first feeding device by the circuit board after corase grinding it is micro- slice be transferred to first machining position after, by described defeated Send device by the micro- slices synthesis method of circuit board to the second machining position；

The micro- slice of circuit board is transferred to fine grinding station using the second feeding device and makes the micro- slice of circuit board and the second abradant surface Surface contact；

The micro- slice of circuit board is ground up to the second preset duration or by the pre- of the micro- slice of circuit board using the second abradant surface If sliced surfaces are ground to the second default smooth degree；

Control second feeding device by the circuit board after fine grinding it is micro- slice be transferred to second machining position after, by described defeated Send device by the micro- slices synthesis method of circuit board.