CN110210337A - Living things feature recognition mould group, preparation method and electronic equipment - Google Patents
Living things feature recognition mould group, preparation method and electronic equipment Download PDFInfo
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- CN110210337A CN110210337A CN201910411708.9A CN201910411708A CN110210337A CN 110210337 A CN110210337 A CN 110210337A CN 201910411708 A CN201910411708 A CN 201910411708A CN 110210337 A CN110210337 A CN 110210337A
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- 238000005538 encapsulation Methods 0.000 claims abstract description 19
- 230000006698 induction Effects 0.000 claims abstract description 4
- 230000035807 sensation Effects 0.000 claims abstract description 3
- 239000010410 layer Substances 0.000 claims description 109
- 238000004806 packaging method and process Methods 0.000 claims description 45
- 238000011049 filling Methods 0.000 claims description 33
- 238000000034 method Methods 0.000 claims description 25
- 239000012790 adhesive layer Substances 0.000 claims description 17
- 238000005520 cutting process Methods 0.000 claims description 16
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- 238000003466 welding Methods 0.000 claims description 14
- 239000000945 filler Substances 0.000 claims description 12
- 230000008569 process Effects 0.000 claims description 12
- 239000002313 adhesive film Substances 0.000 claims description 8
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- 239000011248 coating agent Substances 0.000 claims description 5
- 238000000576 coating method Methods 0.000 claims description 5
- 229910052710 silicon Inorganic materials 0.000 claims description 5
- 239000010703 silicon Substances 0.000 claims description 5
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- 229920002120 photoresistant polymer Polymers 0.000 claims description 3
- 238000005530 etching Methods 0.000 claims description 2
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
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Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1318—Sensors therefor using electro-optical elements or layers, e.g. electroluminescent sensing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3114—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed the device being a chip scale package, e.g. CSP
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Human Computer Interaction (AREA)
- Multimedia (AREA)
- Theoretical Computer Science (AREA)
- Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)
Abstract
The present invention provides a kind of living things feature recognition mould group, preparation method and electronic equipment, living things feature recognition mould group includes base unit and encapsulation monomer；Base unit has the groove and the multiple collimating apertures being connected to groove that Open Side Down；Encapsulation monomer includes the light sensation chip that upper surface has induction region；It encapsulates monomer setting in a groove, and encapsulates and be provided with packing material between the outer wall of monomer and the inner wall of groove, collimating aperture corresponds to the induction region.Living things feature recognition mould group of the embodiment of the present invention has the advantages that intensity is higher, thinner thickness.
Description
Technical Field
The invention relates to the technical field of optical technology under a screen, in particular to a biological characteristic identification module suitable for optical fingerprints under the screen, a preparation method and electronic equipment.
Background
The statements in this section merely provide background information related to the present disclosure and may not constitute prior art.
The technology of optical fingerprint recognition under screen is rapidly developed and applied because it does not occupy the surface space of electronic devices (e.g., smart phones).
In order to improve the imaging quality, the prior art generally collimates the light. Currently, a relatively wide light collimation mode is to arrange an optical fiber collimator on a fingerprint chip. However, in this way, the fiber collimator is fragile and easily broken.
In view of this, the package structure of the fingerprint identification chip disclosed in CN108022904A provides a new alignment method. As shown in fig. 1A and 1B, the package structure of the fingerprint identification chip includes a fingerprint identification chip 11 and a semiconductor cover 12. The sensing area a of the first surface 111 of the fingerprint identification chip 11 is provided with a plurality of pixel points 13 for collecting fingerprint information. The semiconductor cover plate 12 covers the first surface 111 of the fingerprint identification chip 11, and the semiconductor cover plate 12 has a plurality of through holes 14 corresponding to the pixel points 13, and the plurality of through holes 14 can achieve the purpose of light collimation.
However, in the above package structure, the fingerprint identification chip 11 and the semiconductor cover 12 are stacked, and the opposing surfaces of the two are fixed by adhesion, welding, or the like. Thus, the package structure has a problem of weak structural strength.
Further, as shown in fig. 1B, some embodiments of the package structure further include a back plate 22, which is adhered and fixed to the fingerprint identification chip 11 by a glue layer 23. Thus, in this embodiment, the laminated structure is increased due to the presence of the back plate 22, thereby exacerbating the weakening of the strength of the package structure.
In addition, due to the trend of lighter and thinner electronic devices (e.g., smart phones), the thickness of the package structure is required to be thinner. However, the existence of the stacked structure results in a thick package structure, which makes it difficult to satisfy the demand for further thinning of electronic devices.
It should be noted that the above background description is only for the sake of clarity and complete description of the technical solutions of the present invention and for the understanding of those skilled in the art. Such solutions are not considered to be known to the person skilled in the art merely because they have been set forth in the background section of the invention.
Disclosure of Invention
Based on the foregoing defects in the prior art, embodiments of the present invention provide a biometric identification module, a manufacturing method thereof, and an electronic device.
In order to achieve the above object, the present invention provides the following technical solutions.
A biometric identification module comprising: a base unit and a package unit; wherein,
the base unit is provided with a groove with a downward opening and a plurality of alignment holes communicated with the groove;
the encapsulation monomer includes: the upper surface of the light sensing chip is provided with a sensing area;
the packaging single body is arranged in the groove, a filling material is arranged between the outer wall of the packaging single body and the inner wall of the groove, and the collimation hole corresponds to the induction area.
Preferably, the collimating holes are filled with photoresist.
Preferably, a filter layer is arranged above the light sensing chip; the filter layer is arranged on the upper surface of the base unit and is positioned above the plurality of alignment holes; or the filter layer is arranged on the upper surface of the light sensing chip.
Preferably, the thickness of the filter layer is 1-20 μm, the depth of the collimating holes is 50-450 μm, and the thickness of the light sensing chip is 10-200 μm.
Preferably, the encapsulation monomer further includes: the transparent adhesive layer is arranged on the upper surface of the light sensing chip; the light sensation chip is fixedly adhered to the inner wall of the groove through the transparent adhesive layer.
Preferably, the thickness of the transparent adhesive layer is 5 to 40 μm.
Preferably, the encapsulation monomer further includes: the protective layer is arranged at the bottom of the filling material; the protective layer comprises a first conductive wiring layer positioned on the inner side and an insulating layer positioned on the outer side;
the upper surface of the light sensing chip is provided with a non-sensing area, and a welding pad connected with the pixel points on the sensing area is arranged on the non-sensing area; the first conductive wiring layer is connected with the welding pad through a conductive element, and the first conductive wiring layer is provided with a pin used for being connected with an external circuit.
Preferably, the encapsulation monomer further includes: a support layer disposed in the groove; the supporting layer is coated by the filling material;
the conductive elements are conductive columns embedded in the supporting layer, and the upper ends of the conductive columns are connected with the welding pads through a second conductive wiring layer.
Preferably, the conductive element is a third conductive wiring layer formed on the light sensing chip through a TSV process, the upper end of the third conductive wiring layer is connected to the bonding pad, and the lower end of the third conductive wiring layer is connected to the first conductive wiring layer.
Preferably, the thickness of the protective layer is 10-100 μm.
Preferably, the upper surface of the light sensing chip is provided with a non-sensing area, and the non-sensing area is provided with a conductive bump connected with a pixel point on the sensing area;
the conductive bump is connected with a flexible circuit board, the flexible circuit board penetrates through the side wall of the base unit and extends to the outside of the groove, and therefore the conductive bump is used for being connected with an external circuit through the flexible circuit board.
Preferably, a conductive adhesive film is arranged on the conductive bump, and the flexible circuit board is in conductive connection with the conductive bump through the conductive adhesive film.
Preferably, the side wall of the base unit is provided with a through hole communicated with the groove, and the flexible circuit board penetrates through the through hole and extends out of the groove.
A method for preparing a biometric identification module as described in any one of the above, comprising: preparing a base unit, preparing a packaging monomer and assembling; wherein,
the preparation steps of the matrix unit comprise:
obtaining a substrate comprising a plurality of base units;
etching a groove and a plurality of alignment holes in the base unit;
the preparation method of the packaging monomer comprises the following steps:
obtaining a wafer comprising a plurality of light sensing chips;
cutting the wafer along the cutting path to obtain the packaging single body;
the assembling step includes:
placing the packaging monomer obtained by cutting into a groove of the base unit;
filling a filling material into the groove to enable the filling material to be filled between the outer side wall of the packaging single body and the inner wall of the groove;
and after the filling material is solidified, cutting along the cutting path of the substrate to obtain the biological characteristic identification module.
Preferably, the preparation step of the encapsulation monomer further comprises:
coating a wafer containing a plurality of light sensing chips to form a transparent adhesive layer on the upper surfaces of the light sensing chips;
the assembling step further comprises:
after the packaging single body is placed in the groove of the base unit, the packaging single body is adhered and fixed on the inner wall of the groove through the transparent adhesion layer.
Preferably, the preparation step of the encapsulation monomer further comprises:
and forming a protective layer, wherein the protective layer comprises a first conductive wiring layer positioned on the inner side and an insulating layer positioned on the outer side, pins used for being connected with an external circuit are arranged on the first conductive wiring layer, and the first conductive wiring layer and the welding pad of the light sensing chip are connected through a conductive element.
Preferably, the preparation step of the encapsulation monomer further comprises:
forming a second conductive wiring layer connected with the welding pad by adopting an RDL (remote description language) process;
preparing a support layer embedded with conductive pillars as the conductive elements connecting the second conductive wiring layer and the first conductive wiring layer.
Preferably, the preparation step of the encapsulation monomer further comprises:
and a third conductive wiring layer on the light sensing chip by adopting a TSV (through silicon via) process, wherein the upper end of the third conductive wiring layer is connected with the welding pad, and the lower end of the third conductive wiring layer is connected with the first conductive wiring layer.
Preferably, the preparing step of the base unit further comprises:
forming a through hole communicating with the groove on the side wall of the base unit;
the preparation step of the packaging monomer further comprises the following steps:
forming a conductive convex column on a non-photosensitive area on the upper surface of the light sensing chip;
the assembling step further comprises:
after the filling material is injected, reserving the position of the conductive convex column to expose the conductive convex column;
the flexible circuit board is connected with the conductive convex column, so that the flexible circuit board extends out of the groove through the through hole.
Preferably, the preparation step of the encapsulation monomer further comprises:
and polishing the lower surface of the light sensing chip to reduce the thickness of the light sensing chip.
Preferably, the assembling step further comprises:
coating a conductive adhesive film on the upper end of the conductive convex column; and the flexible circuit board is electrically connected with the conductive bump through the conductive adhesive film.
Preferably, the filling material is underfil glue;
after the filling of the filler is completed, the filler is pressurized to deaerate the filler.
An electronic device, comprising:
a display screen;
the biometric feature recognition module as claimed in any one of the above claims, wherein the biometric feature recognition module is disposed below the display screen.
Through set up the recess that is used for acceping the encapsulation monomer on the base member unit to fix the encapsulation monomer through filler material, thereby avoid appearing laminated structure because of needs fixed encapsulation monomer, when reducing biological characteristic identification module thickness, very big improvement structural strength.
The embodiment of the invention fixes the packaging monomer by the base unit, and can eliminate a cover plate or a clapboard structure which is required by the prior art for fixing the packaging structure. Furthermore, the traditional scheme that an optical fiber is used as a collimator on a fingerprint chip is abandoned, so that the aim of light collimation is fulfilled by arranging a collimation hole on a base body unit. Therefore, the embodiment of the invention can form the groove on the base unit firstly and then form the collimation hole on the basis of the groove, and the processing of the base unit is relatively simple.
Specific embodiments of the present invention are disclosed in detail with reference to the following description and drawings, indicating the manner in which the principles of the invention may be employed. It should be understood that the embodiments of the invention are not so limited in scope.
Features that are described and/or illustrated with respect to one embodiment may be used in the same way or in a similar way in one or more other embodiments, in combination with or instead of the features of the other embodiments.
It should be emphasized that the term "comprises/comprising" when used herein, is taken to specify the presence of stated features, integers, steps or components but does not preclude the presence or addition of one or more other features, integers, steps or components.
Drawings
The drawings described herein are for illustration purposes only and are not intended to limit the scope of the present disclosure in any way. In addition, the shapes, the proportional sizes, and the like of the respective members in the drawings are merely schematic for facilitating the understanding of the present invention, and do not specifically limit the shapes, the proportional sizes, and the like of the respective members of the present invention. Those skilled in the art, having the benefit of the teachings of this invention, may choose from the various possible shapes and proportional sizes to implement the invention as a matter of case. In the drawings:
FIG. 1A is a schematic structural diagram of a package structure of a fingerprint identification chip according to a first known embodiment in the prior art;
FIG. 1B is a diagram illustrating a package structure of a fingerprint identification chip according to a second embodiment of the present invention;
FIG. 2 is a schematic structural diagram of an electronic device formed by a biometric identification module and a display screen according to a first preferred embodiment of the invention;
FIG. 3 is a schematic structural diagram of an electronic device formed by a biometric identification module and a display screen according to a second preferred embodiment of the invention;
FIG. 4 is a schematic structural diagram of an electronic device formed by a biometric identification module and a display screen according to a third preferred embodiment of the invention;
fig. 5 is a schematic top view of the biometric module of fig. 4 according to the third preferred embodiment.
Detailed Description
In order to make those skilled in the art better understand the technical solution of the present invention, the technical solution in the embodiment of the present invention will be clearly and completely described below with reference to the drawings in the embodiment of the present invention, and it is obvious that the described embodiment is only a part of the embodiment of the present invention, and not all embodiments. All other embodiments, which can be obtained by a person skilled in the art without any inventive step based on the embodiments of the present invention, shall fall within the scope of protection of the present invention.
It will be understood that when an element is referred to as being "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only and do not denote a single embodiment.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
In this specification, the direction of the biometric identification module of the embodiment of the present invention, which is directed toward or facing the user in the normal use state, is defined as "up", and the opposite direction, or the direction away from the user is defined as "down".
More specifically, the upward direction illustrated in fig. 2 to 4 is defined as "up", and the downward direction illustrated in fig. 2 to 4 is defined as "down".
It should be noted that the definitions of the directions in the present specification are only for convenience of describing the technical solution of the present invention, and do not limit the directions of the biometric module according to the embodiments of the present invention in other scenarios, including but not limited to use, test, transportation, and manufacturing, which may cause the orientation of the biometric module to be reversed or the position of the biometric module to be changed.
The biological characteristic identification module provided by the embodiment of the invention can be applied to scenes including but not limited to unlocking fingerprint under a screen, user identity verification, authority acquisition and the like.
Specifically, when the biometric module of the embodiment of the present invention is configured in the electronic device, the electronic device may obtain the fingerprint feature information of the user based on the biometric module, so as to match the fingerprint feature information with the stored fingerprint information, so as to verify the identity of the current user, and thus determine whether the biometric module has the corresponding authority to perform the related operation on the electronic device.
It should be noted that the fingerprint information obtained as described above is only one common example of the user's biometric features. Those skilled in the art can extend the technical solution of the embodiments of the present invention to any suitable biometric authentication scenario within the scope that can be envisioned. For example, the scenario of verifying by acquiring biometric information, that is, the iris of the user, is not limited in the embodiment of the present invention.
The following is set forth in a scenario in which user fingerprint information is obtained as a main description. It will nevertheless be understood that no limitation of the scope of the embodiments of the invention is thereby intended, as illustrated in the accompanying drawings.
The biometric identification module for the optical fingerprint under the screen of the embodiment of the invention can be applied to electronic devices including but not limited to mobile smart phones, tablet electronic devices, computers, GPS navigators, personal digital assistants, intelligent wearable devices and the like.
The electronic device in the embodiment of the present invention may further include other necessary modules or components in order to realize the basic functions of the electronic device. Taking a mobile smart phone as an example, it may further include a communication module, a battery, and the like.
It should be noted that any other necessary modules or components included in the electronic device may be used in any suitable existing configuration. For clearly and briefly explaining the technical scheme provided by the invention, the parts are not described again, and the drawings in the specification are correspondingly simplified. It will nevertheless be understood that no limitation of the scope of the invention is thereby intended.
As shown in fig. 2-5, the electronic device may be configured with a display screen 300. the display screen 300 may be a self-luminous display screen employing self-luminous elements as display pixels, such as an OLED display screen or an LED display screen, thus, the display screen 300 may serve as an excitation light source emitting excitation light ① toward a target organism (e.g., a user's finger).
When the display screen 300 is a passive light-emitting display screen, the electronic device may be configured with an additional light source located below the display screen 300, and the additional light source serves as an excitation light source to emit the excitation light ① to the target organism.
When a user's finger presses, touches, or approaches display screen 300, excitation light ① may be reflected off the surface of the user's finger, forming target signal light ② carrying fingerprint information.
The biometric feature recognition module of the embodiment of the present invention is disposed below the display screen 300. Specifically, the electronic device may be provided with a middle frame, and the biometric identification module may be mounted below the display screen 300 through the middle frame, and may be fixed. And, the biometric characteristic identification module and the display screen 300 are arranged oppositely and at intervals.
The biometric identification module according to the embodiment of the present invention will be explained and explained with reference to fig. 2 to 5. It should be noted that, for convenience of description, like reference numerals denote like parts in the embodiments of the present invention. And for the sake of brevity, detailed descriptions of the same components are omitted in different embodiments, and the descriptions of the same components may be mutually referred to and cited.
The biometric identification module of the embodiment of the invention comprises a base unit 100 and a packaging unit 200.
The base unit 100 may take any suitable conventional configuration, and the embodiment of the present invention is not limited thereto. In one exemplary embodiment, the base unit 100 may be a silicon crystal.
The base unit 100 has a groove 101 opened downward and a plurality of alignment holes 102 communicating with the groove 101. The groove 101 and the plurality of alignment holes 102 may be formed by chemical etching or photo etching such that the groove 101 and the plurality of alignment holes 102 are a part of the structure of the base unit 100 itself, or the groove 101 and the plurality of alignment holes 102 are integrally or monolithically constructed with the base unit 100.
A filling material 400 is arranged between the outer wall of the single package 200 and the inner wall of the groove 101, and is used for fixing the single package 200 and playing a role in packaging to a certain extent.
The filling material 400 may be underfill (underfill paste), which is thermally cured after being injected between the outer wall of the package unit 200 and the inner wall of the groove 101, so as to fix the package unit 200. In order to avoid the influence of bubbles in the cured filler 400 on the fixing strength, after the filling of the filler 400 is completed, the filler 400 is pressurized to be deaerated to remove the bubbles in the filler 400.
In the prior art, when a laminated structure is used for fixing a packaging structure containing a fingerprint chip, the adhesive is used for bonding each layer structure, and the strength of the laminated structure is weak.
In the embodiment of the invention, the groove 101 for accommodating the single packaging unit 200 is formed in the base unit 100, and the single packaging unit 200 is fixed by the filling material 400, so that a laminated structure caused by fixing the single packaging unit 200 is avoided, the thickness of the biological characteristic identification module is reduced, and the structural strength is greatly improved.
In the embodiment of the invention, the base unit 100 is used to fix the packaging unit 200, so that a cover plate or a partition plate structure required by the prior art for fixing the packaging structure can be eliminated. Further, the conventional scheme of using an optical fiber as a collimator on a fingerprint chip is eliminated, so that the collimating hole 102 needs to be arranged on the base unit 100 to achieve light collimation. Therefore, in the embodiment of the present invention, the groove 101 may be formed on the base unit 100, and then the collimating hole 102 may be formed on the basis of the groove 101, so that the base unit 100 may be processed relatively simply.
The single package 200 at least includes a light sensing chip 201, which receives the target signal light ② propagated after being collimated by the plurality of collimating holes 102, and can convert the collimated target signal light ② into an electrical signal to generate a fingerprint image, the light sensing chip 201 further can send the fingerprint image to an image processor in signal connection therewith, the image processor performs image processing to obtain a fingerprint signal, and performs fingerprint identification on the fingerprint signal through an algorithm.
In the present embodiment, the thickness of the photo sensor chip 201 is 10 to 200 μm, preferably 30 to 150 μm, and more preferably 40 to 100 μm.
The upper surface of the light sensing chip 201 has a sensing area and a non-sensing area, the sensing area may be provided with a pixel (not shown) for collecting fingerprint information, the non-sensing area may be provided with a conductive portion connected with the pixel, and the conductive portion is used for being connected with an external circuit.
In the embodiment illustrated in fig. 2 and 3, the conductive portion may also be a pad 201 a. In the embodiment illustrated in fig. 4, the conductive portion may also be a conductive bump 201 b. The conductive bump 201b may be a metal bump or a metal bump.
The plurality of alignment holes 102 are used for allowing the target signal light ② to pass through and collimating the target signal light ②. the plurality of alignment holes 102 correspond to the sensing region, and specifically, the projection of the plurality of alignment holes 102 towards the upper surface of the light sensing chip 201 falls within the range of the sensing region. the plurality of alignment holes 102 are substantially perpendicular to the sensing region, and the plurality of alignment holes 102 can correspond to the pixel points on the sensing region one by one, and the alignment holes 102 are filled with photoresist (not shown) to prevent external impurities or particles (particles) from entering.
In the present embodiment, the depth of the collimating holes 102 is 50 to 450 μm, preferably 100 to 350 μm, and more preferably 150 to 250 μm.
The optical filter layer 500 may be disposed above the optical sensor chip 201, and the optical filter layer 500 is located upstream of the optical sensor chip 201 along the propagation direction of the target signal light ② and is configured to at least partially filter noise light included in the target signal light ②, so as to improve the sensing of the optical sensor chip 201 on the received light and improve the imaging quality.
The filter layer 500 may be disposed on the upper surface of the base unit 100 and over the plurality of alignment holes 102; alternatively, the filter layer 500 may be disposed on the upper surface of the light-sensing chip 201 and the light-sensing chip 201.
In the present embodiment, the thickness of the filter layer 500 is 1 to 20 μm, preferably 8 to 15 μm, and more preferably 10 to 12 μm.
In particular, in some scenarios, when the display 300 is a self-emissive display, the display 300 is the excitation light source, the excitation light emitted by the display 300 is typically visible light, and the target signal light ② is also visible light.
In other scenarios, when the excitation light source is an invisible light source such as an infrared light source additionally disposed under the display 300, the excitation light emitted by the excitation light source and the target signal light ② are both invisible light.
Further, the single package 200 may further include a transparent adhesive layer 202 disposed on the upper surface of the light sensing chip 201, and the light sensing chip 201 may be adhered to the inner wall of the groove 101 through the transparent adhesive layer 202. since the transparent adhesive layer 202 is adhered on the upper surface of the light sensing chip 201, in order to prevent the light sensing chip 201 from blocking the target signal light ②, the transparent adhesive layer 202 should have a light-transmitting property.
The transparent adhesive layer 202 may be adhered to the upper surface of the photo sensor chip 201 in advance, and after the single package 200 is placed in the groove 101 and before the filling material 400 is injected, the transparent adhesive layer 202 may adhere the single package 200 to the inner wall of the groove 101 to pre-fix the single package 200 in preparation for the subsequent injection of the filling material 400.
In the present embodiment, the thickness of the transparent adhesive layer 202 is 5 to 40 μm, preferably 10 to 35 μm, and more preferably 15 to 25 μm.
The encapsulation unit 200 may further include a protection layer 203 disposed at the bottom of the filling material 400. The protection layer 203 includes a first conductive wiring layer 203a on the inner side and an insulating layer 203b on the outer side, wherein the first conductive wiring layer 203a is connected to the pad 201a of the light sensing chip 201 through a conductive element, and the first conductive wiring layer 203a is provided with a pin 203c for connection with an external circuit.
The first conductive wiring layer 203a and the insulating layer 203b included in the protective layer 203 are stacked on each other, and the first conductive wiring layer 203a is pressed between the insulating layer 203b and the bottom of the filling material 400. The connection between the light sensing chip 201 and an external circuit can be realized by providing the protection layer 203 including the first conductive wiring layer 203 a. Further, the insulating layer 203b included in the protective layer 203 may protect the first conductive wiring layer 203 a.
In the present embodiment, the thickness of the passivation layer 203 is 10 to 100 μm, preferably 30 to 70 μm, and more preferably 40 to 60 μm.
As shown in fig. 2, in one embodiment, in order to connect the first conductive wiring layer 203a with the pad 201a of the photo sensor chip 201, the package unit 200 further includes a supporting layer 205 disposed in the groove 101, and the supporting layer 205 is encapsulated and fixed by the filling material 400. The conductive elements are conductive pillars 204 embedded in the supporting layer 205, and the upper ends of the conductive pillars 204 are connected to the pads 201a of the optical sensing chip 201 through a second conductive wiring layer 206.
Thereby, the connection of the first conductive wiring layer 203a and the pad 201a of the light-sensing chip 201 is indirectly achieved through the second conductive wiring layer 206 and the conductive pillar 204.
In this embodiment, the conductive pillars 204 may be metal pillars, and the supporting layer 205 may be made of any suitable conventional material. For example, the support layer 205 may be a PCB, and the second conductive wiring layer 206 may be formed on a surface or inside of the support layer 205 through a re-wiring process (RDL). Alternatively, the supporting layer 205 may be an EMC (Epoxy Molding Compound) so that the side of the optical sensor chip 201 can be covered by a packaging process.
As shown in fig. 3, another embodiment for connecting the first conductive wiring layer 203a to the pad 201a of the light sensing chip 201 may be that the conductive element is a third conductive wiring layer 207 formed on the light sensing chip 201 by a TSV (Through Silicon Vias) process, the upper end of the third conductive wiring layer 207 is connected to the pad 201a of the light sensing chip 201, and the lower end is connected to the first conductive wiring layer 203 a. Thereby, the direct connection of the first conductive wiring layer 203a and the pad 201a of the light-sensing chip 201 can be achieved by the third conductive wiring layer 207.
As shown in fig. 4 and 5, in another embodiment of the present invention, the optical sensor chip 201 may be connected to an external Circuit through a Flexible Printed Circuit (FPC) 600. Specifically, the conductive bump 201b of the optical sensor chip 201 is connected to the flexible circuit board 600, and the flexible circuit board 600 extends to the outside of the groove 101, so that the conductive bump 201b of the optical sensor chip 201 is connected to an external circuit through the flexible circuit board 600.
The sidewall of the base unit 100 may be provided with a through hole 103 for the flexible circuit board 600 to pass through. The upper end of the Conductive bump 201b may be provided with an Anisotropic Conductive Film (ACF) 201c, and the flexible circuit board 600 is connected to the pad 201a of the photo sensor chip 201 through the ACF 201 c.
The following describes a method for manufacturing a biometric module according to an embodiment of the present invention, the method including a step S100 of manufacturing a base unit 100, a step S200 of manufacturing a packaging unit 200, and a step S300 of assembling. Wherein,
the preparing step S100 of the base unit 100 may include:
step S101: a substrate including a plurality of base units 100 is obtained. The base body units 100 are arranged in a multi-row and multi-column array form, so that cutting channels are formed between the base body units 100 in two adjacent rows or two adjacent columns; as described above, the substrate may be a silicon wafer;
step S102: a groove 101 and a plurality of alignment holes 102 are formed in the base unit 100 by chemical etching or photolithography.
The preparing step S200 of the encapsulation monomer 200 may include:
step S201: a wafer including a plurality of photo dies 201 is obtained. Similarly, the light sensing chips 201 are arranged in a multi-row and multi-column array form, so that a cutting path is formed between two adjacent rows or two adjacent columns of the light sensing chips 201;
step S202: and cutting the wafer along the cutting lines to obtain the packaging single body 200.
The assembling step S300 may include:
step S301: placing the cut packaging monomer 200 in the groove 101 of the base unit 100;
step S302: filling the groove 101 with a filling material 400, so that the filling material 400 is filled between the outer side wall of the packaging unit 200 and the inner wall of the groove 101;
step S303: and after the filling material 400 is solidified, cutting along the cutting path of the substrate to obtain the biological characteristic identification module.
Further, the preparing step S200 of the packaging monomer 200 may further include:
step S203: a coating operation is performed on a wafer including a plurality of photo-sensing chips 201 to form a transparent adhesive layer 202 on the upper surfaces of the photo-sensing chips 201.
Step S203 is performed before step S202.
Correspondingly, the assembling step S300 further includes:
step S304: after the single package 200 is placed in the groove 101 of the base unit 100, the single package 200 is adhesively fixed to the inner wall of the groove 101 by the transparent adhesive layer 202.
Step S304 is performed between step S301 and step S302.
In addition, in order to connect the photo sensor chip 201 to an external circuit, the step S200 of preparing the single package 200 may further include an operation for forming a conductive path, which is as follows:
step S205: the protective layer 203 is formed by an SMF process, the protective layer 203 includes a first conductive wiring layer 203a on the inner side and an insulating layer 203b on the outer side, a pin 203c for connecting with an external circuit is provided on the first conductive wiring layer 203a, and the first conductive wiring layer 203a and the pad 201a of the photo chip 201 are connected by a conductive element.
Step S205 is performed before step S203.
In order to form the structure of the biometric identification module shown in fig. 2, the step S200 of preparing the packaging unit 200 may further include:
step S206: forming a second conductive wiring layer 206 connected with the pad 201a of the light sensing chip 201 by using an RDL process;
step S207: a support layer 205 is prepared embedding conductive pillars as conductive elements connecting the second conductive wiring layer 206 and the first conductive wiring layer 203 a.
Step S206 is performed before step S203.
In order to form the structure of the biometric identification module shown in fig. 3, the step S200 of preparing the packaging unit 200 may further include:
step S208: and a third conductive wiring layer 207 on the light sensing chip 201 by adopting a TSV process, wherein the upper end of the third conductive wiring layer 207 is connected with the welding pad 201a of the light sensing chip 201, and the lower end of the third conductive wiring layer is connected with the first conductive wiring layer 203 a.
Step S208 is performed before step S203.
In order to form the structure of the biometric identification module as shown in fig. 4, the preparing step S100 of the base unit 100 may further include:
step S103: a through hole 103 communicating with the groove 101 is formed on the side wall of the base unit 100. The through holes 103 are also formed by chemical etching or photo etching.
Step S103 may be implemented together with step S102, or may be implemented in two steps in succession.
Accordingly, the preparation step S200 of the encapsulation monomer 200 includes:
step S209: a conductive pillar 201b is formed on a non-photosensitive region of the upper surface of the photo sensor chip 201.
Step S209 is performed before step S202.
The assembling step S300 includes:
step S305: after the filling material 400 is injected, reserving the position of the conductive convex column 201b to expose the conductive convex column 201 b;
step S306: the flexible circuit board 600 is connected with the conductive convex column 201b, so that the flexible circuit board 600 extends out of the groove 101 through the through hole 103.
Specifically, the conductive film 201c may be coated on the upper end of the conductive pillar 201b, and the flexible circuit board 600 is conductively connected to the conductive bump 201b through the conductive film 201b by the Tieguanyin.
Further, the preparing step of the encapsulation monomer 200 may further include:
step S210: the lower surface of the light sensing chip 201 is polished to reduce the thickness of the light sensing chip 201.
Step S209 may be implemented together with step S202.
It should be noted that, in the description of the present invention, the terms "first", "second", and the like are used for descriptive purposes only and for distinguishing similar objects, and no precedence between the two is considered as indicating or implying relative importance. In addition, in the description of the present invention, "a plurality" means two or more unless otherwise specified.
Any numerical value recited herein includes all values from the lower value to the upper value that are incremented by one unit, provided that there is a separation of at least two units between any lower value and any higher value. For example, if it is stated that the number of a component or a value of a process variable (e.g., temperature, pressure, time, etc.) is from 1 to 90, preferably from 21 to 80, and more preferably from 30 to 70, it is intended that equivalents such as 15 to 85, 22 to 68, 43 to 51, 30 to 32 are also expressly enumerated in this specification. For values less than 1, one unit is suitably considered to be 0.0001, 0.001, 0.01, 0.1. These are only examples of what is intended to be explicitly recited, and all possible combinations of numerical values between the lowest value and the highest value that are explicitly recited in the specification in a similar manner are to be considered.
Unless otherwise indicated, all ranges include the endpoints and all numbers between the endpoints. The use of "about" or "approximately" with a range applies to both endpoints of the range. Thus, "about 20 to about 30" is intended to cover "about 20 to about 30", including at least the endpoints specified.
The above description is only a few embodiments of the present invention, and those skilled in the art can make various changes or modifications to the embodiments of the present invention according to the disclosure of the application document without departing from the spirit and scope of the present invention.
Claims (23)
1. A biometric identification module, comprising: a base unit and a package unit; wherein,
the base unit is provided with a groove with a downward opening and a plurality of alignment holes communicated with the groove;
the encapsulation monomer includes: the upper surface of the light sensing chip is provided with a sensing area;
the packaging single body is arranged in the groove, a filling material is arranged between the outer wall of the packaging single body and the inner wall of the groove, and the collimation hole corresponds to the induction area.
2. The biometric identification module of claim 1, wherein the alignment holes are filled with a photoresist.
3. The biometric identification module as in claim 1, wherein a filter layer is disposed over the light-sensitive chip; the filter layer is arranged on the upper surface of the base unit and is positioned above the plurality of alignment holes; or the filter layer is arranged on the upper surface of the light sensing chip.
4. The biometric identification module according to claim 3, wherein the filter layer has a thickness of 1 to 20 μm, the collimating holes have a depth of 50 to 450 μm, and the photo sensor chip has a thickness of 10 to 200 μm.
5. The biometric identification module of claim 1, wherein the packaging unit further comprises: the transparent adhesive layer is arranged on the upper surface of the light sensing chip; the light sensation chip is fixedly adhered to the inner wall of the groove through the transparent adhesive layer.
6. The biometric identification module of claim 5, wherein the transparent adhesive layer has a thickness of 5 to 40 μm.
7. The biometric identification module of claim 1, wherein the packaging unit further comprises: the protective layer is arranged at the bottom of the filling material; the protective layer comprises a first conductive wiring layer positioned on the inner side and an insulating layer positioned on the outer side;
the upper surface of the light sensing chip is provided with a non-sensing area, and a welding pad connected with the pixel points on the sensing area is arranged on the non-sensing area; the first conductive wiring layer is connected with the welding pad through a conductive element, and the first conductive wiring layer is provided with a pin used for being connected with an external circuit.
8. The biometric identification module of claim 7, wherein the packaging unit further comprises: a support layer disposed in the groove; the supporting layer is coated by the filling material;
the conductive elements are conductive columns embedded in the supporting layer, and the upper ends of the conductive columns are connected with the welding pads through a second conductive wiring layer.
9. The biometric identification module of claim 7, wherein the conductive element is a third conductive wiring layer formed on the photo sensor chip by a TSV process, and the third conductive wiring layer has an upper end connected to the pad and a lower end connected to the first conductive wiring layer.
10. The biometric identification module of claim 7, wherein the protective layer has a thickness of 10 to 100 μm.
11. The biometric identification module as claimed in claim 1, wherein the light sensor chip has a non-sensing area on an upper surface thereof, and the non-sensing area is provided with conductive bumps connected to the pixels on the sensing area;
the conductive bump is connected with a flexible circuit board, the flexible circuit board penetrates through the side wall of the base unit and extends to the outside of the groove, and therefore the conductive bump is used for being connected with an external circuit through the flexible circuit board.
12. The biometric identification module of claim 11, wherein a conductive adhesive film is disposed on the conductive bump, and the flexible circuit board is electrically connected to the conductive bump through the conductive adhesive film.
13. The biometric identification module of claim 11, wherein the sidewall of the base unit is provided with a through hole communicating with the recess, and the flexible circuit board passes through the through hole and extends out of the recess.
14. A method for preparing the biometric identification module according to any one of claims 1 to 13, comprising: preparing a base unit, preparing a packaging monomer and assembling; wherein,
the preparation steps of the matrix unit comprise:
obtaining a substrate comprising a plurality of base units;
etching a groove and a plurality of alignment holes in the base unit;
the preparation method of the packaging monomer comprises the following steps:
obtaining a wafer comprising a plurality of light sensing chips;
cutting the wafer along the cutting path to obtain the packaging single body;
the assembling step includes:
placing the packaging monomer obtained by cutting into a groove of the base unit;
filling a filling material into the groove to enable the filling material to be filled between the outer side wall of the packaging single body and the inner wall of the groove;
and after the filling material is solidified, cutting along the cutting path of the substrate to obtain the biological characteristic identification module.
15. The method according to claim 14,
the preparation step of the packaging monomer further comprises the following steps:
coating a wafer containing a plurality of light sensing chips to form a transparent adhesive layer on the upper surfaces of the light sensing chips;
the assembling step further comprises:
after the packaging single body is placed in the groove of the base unit, the packaging single body is adhered and fixed on the inner wall of the groove through the transparent adhesion layer.
16. The method according to claim 14,
the preparation step of the packaging monomer further comprises the following steps:
and forming a protective layer, wherein the protective layer comprises a first conductive wiring layer positioned on the inner side and an insulating layer positioned on the outer side, pins used for being connected with an external circuit are arranged on the first conductive wiring layer, and the first conductive wiring layer and the welding pad of the light sensing chip are connected through a conductive element.
17. The method according to claim 16, wherein the step of preparing the resin composition,
the preparation step of the packaging monomer further comprises the following steps:
forming a second conductive wiring layer connected with the welding pad by adopting an RDL (remote description language) process;
preparing a support layer embedded with conductive pillars as the conductive elements connecting the second conductive wiring layer and the first conductive wiring layer.
18. The method according to claim 16, wherein the step of preparing the resin composition,
the preparation step of the packaging monomer further comprises the following steps:
and a third conductive wiring layer on the light sensing chip by adopting a TSV (through silicon via) process, wherein the upper end of the third conductive wiring layer is connected with the welding pad, and the lower end of the third conductive wiring layer is connected with the first conductive wiring layer.
19. The method according to claim 14,
the preparation step of the base unit further comprises:
forming a through hole communicating with the groove on the side wall of the base unit;
the preparation step of the packaging monomer further comprises the following steps:
forming a conductive convex column on a non-photosensitive area on the upper surface of the light sensing chip;
the assembling step further comprises:
after the filling material is injected, reserving the position of the conductive convex column to expose the conductive convex column;
the flexible circuit board is connected with the conductive convex column, so that the flexible circuit board extends out of the groove through the through hole.
20. The method according to claim 19,
the preparation step of the packaging monomer further comprises the following steps:
and polishing the lower surface of the light sensing chip to reduce the thickness of the light sensing chip.
21. The method according to claim 19,
the assembling step further comprises:
coating a conductive adhesive film on the upper end of the conductive convex column; and the flexible circuit board is electrically connected with the conductive bump through the conductive adhesive film.
22. The method of claim 14, wherein the filler material is underfil glue;
after the filling of the filler is completed, the filler is pressurized to deaerate the filler.
23. An electronic device, comprising:
a display screen;
the biometric identification module according to any one of claims 1 to 13, wherein the biometric identification module is disposed below the display screen.
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