CN109492622A - For shielding the recognizer component and electronic equipment of lower optical finger print - Google Patents

Abstract

The present invention provides an identification component and an electronic device for an optical fingerprint under the screen. The identification component is used to be arranged below the display screen, and includes: a photosensitive chip, which is used when the identification component is arranged under the display screen. The target signal light reflected from the target organism above the display screen is received; the light-sensing chip at least includes a metal layer; the protective component located above the light-sensing chip has a light-transmitting area, and the target signal light reaches the light-sensing area through the light-transmitting area chip; a protective cavity for protecting the metal layer is formed under the protective component; the metal layer is accommodated in the protective cavity; Connect with external circuits. The identification component of the embodiment of the present invention has higher production efficiency.

Description

Recognition components and electronic devices for under-screen optical fingerprints

technical field

The present invention relates to the field of under-screen optics, and in particular, to an identification component for under-screen optical fingerprints, and an electronic device using or equipped with the identification component.

Background technique

The descriptions in this section merely provide background information related to the present disclosure and do not constitute prior art.

The under-screen optical fingerprint recognition technology has been rapidly developed and applied because it does not occupy the surface space of electronic devices (such as smartphones).

At present, most of the processes of the identification components included in the fingerprint identification device used in the under-screen optics are completed in the module factory. Specifically, firstly, reflow soldering can be used to solder electronic components such as capacitors and resistors to FPC (Flexible Printed Circuit, flexible circuit board), then transfer the FPC to a clean workshop for cleaning, and then use COB (Chips on Board, board) The chip-on-chip packaging) process encapsulates the fingerprint chip. That is, the fingerprint chip is first fixed on the FPC, and then gold wires are used to connect the fingerprint chip and the FPC, and then the FPC is fixed on the steel plate.

That is to say, the identification components in the known fingerprint identification devices at least need to perform two processes of reflow soldering and COB in the module factory. Conventionally, when performing the same process, the efficiency of the module factory is much lower than that of the packaging factory. As a result, the production efficiency of the existing identification components applied to the under-screen optics is very low.

It should be noted that the above description of the technical background is only for the convenience of clearly and completely describing the technical solutions of the present invention and facilitating the understanding of those skilled in the art. It should not be assumed that the above-mentioned technical solutions are well known to those skilled in the art simply because these solutions are described in the background section of the present invention.

SUMMARY OF THE INVENTION

Based on the aforementioned defects of the prior art, embodiments of the present invention provide an identification component for an under-screen optical fingerprint, and an electronic device using or equipped with the identification component, and the identification component has high production efficiency.

In order to achieve the above objects, the present invention provides the following technical solutions.

An identification component for an optical fingerprint under the screen, the identification component is used to be arranged below the display screen; the identification component includes:

a light-sensing chip, which is used for receiving target signal light reflected from a target organism above the display screen when the identification component is arranged below the display screen; the light-sensing chip at least includes a metal layer;

A protective component located above the light-sensitive chip, the protective component has a light-transmitting area, and the target signal light reaches the light-sensitive chip through the light-transmitting area; a protective cavity of the metal layer; the metal layer is accommodated in the protective cavity; or, the photosensitive chip constitutes a part of the inner wall of the protective cavity;

One end of the conductive path is conductively connected with the metal layer, and the other end is used for connecting with an external circuit.

An electronic device comprising:

display screen;

According to the identification component for under-screen optical fingerprints in the above-mentioned embodiments, the identification component is disposed below the display screen.

Since the metal layer of the photosensitive chip is protected by the protective cavity, this provides conditions for the identification component of the embodiment of the present invention to be packaged first, and then to be electrically connected to the external circuit by reflow soldering.

That is to say, the identification component of the embodiment of the present invention can complete the packaging of the photosensitive chip in the packaging factory, and then realize the connection with the external circuit in the module factory. In this way, compared with the prior art, the identification component of the embodiment of the present invention only needs to perform a reflow soldering process in the module factory, so that the production efficiency is greatly improved.

With reference to the following description and drawings, specific embodiments of the invention are disclosed in detail, indicating the manner in which the principles of the invention may be employed. It should be understood that embodiments of the present invention are not thereby limited in scope. Embodiments of the invention include many changes, modifications and equivalents within the spirit and scope of the appended claims.

Features described and/or illustrated for one embodiment may be used in the same or similar manner in one or more other embodiments, in combination with, or in place of features of other embodiments .

It should be emphasized that the term "comprising/comprising" as used herein refers to the presence of a feature, integer, step or component, but does not exclude the presence or addition of one or more other features, integers, steps or components.

Description of drawings

The drawings described herein are for explanatory purposes only and are not intended to limit the scope of the present disclosure in any way. In addition, the shapes and proportions of the components in the figures are only schematic and are used to help the understanding of the present invention, and do not specifically limit the shapes and proportions of the components of the present invention. Under the teachings of the present invention, those skilled in the art can select various possible shapes and proportions according to specific conditions to implement the present invention. In the attached image:

FIG. 1 is a schematic structural diagram of an identification component for an under-screen optical fingerprint according to a first embodiment of the present invention;

2 is a schematic structural diagram of an identification component for an under-screen optical fingerprint according to a second embodiment of the present invention;

3 is a schematic structural diagram of an identification component for an under-screen optical fingerprint according to a third embodiment of the present invention;

4 is a schematic structural diagram of an identification component for an under-screen optical fingerprint according to a fourth embodiment of the present invention;

5 is a schematic structural diagram of an identification component for an under-screen optical fingerprint according to a fifth embodiment of the present invention;

6 is a schematic structural diagram of a recognition component for an under-screen optical fingerprint according to a sixth embodiment of the present invention;

7 is a schematic structural diagram of an identification component for an under-screen optical fingerprint according to a seventh embodiment of the present invention;

8 is a schematic structural diagram of an identification component for an under-screen optical fingerprint according to an eighth embodiment of the present invention;

9 is a schematic structural diagram of an identification component for an under-screen optical fingerprint according to a ninth embodiment of the present invention;

10 is a schematic structural diagram of an identification component for an under-screen optical fingerprint according to a tenth embodiment of the present invention;

11 is a schematic structural diagram of an identification component for an under-screen optical fingerprint according to an eleventh embodiment of the present invention;

12 is a schematic structural diagram of an identification component for an under-screen optical fingerprint according to a twelfth embodiment of the present invention;

13 is a schematic structural diagram of an identification component for an under-screen optical fingerprint according to a thirteenth embodiment of the present invention;

14 is a schematic structural diagram of an identification component for an under-screen optical fingerprint according to a fourteenth embodiment of the present invention;

15 is a schematic structural diagram of an identification component for an under-screen optical fingerprint according to a fifteenth embodiment of the present invention;

16 is a schematic structural diagram of an identification component for an under-screen optical fingerprint according to a sixteenth embodiment of the present invention;

17 is a schematic structural diagram of an identification component for an under-screen optical fingerprint according to a seventeenth embodiment of the present invention;

18 is a schematic structural diagram of an identification component for an under-screen optical fingerprint according to an eighteenth embodiment of the present invention;

19 is a schematic structural diagram of an identification component for an under-screen optical fingerprint according to a nineteenth embodiment of the present invention;

20 is a schematic structural diagram of an identification component for an under-screen optical fingerprint according to a twentieth embodiment of the present invention;

21 is a schematic structural diagram of an identification component for an under-screen optical fingerprint according to a twenty-first embodiment of the present invention;

22 is a schematic structural diagram of an identification component for an under-screen optical fingerprint according to a twenty-second embodiment of the present invention;

23 is a schematic structural diagram of an identification component for an under-screen optical fingerprint according to a twenty-third embodiment of the present invention;

24 is a schematic structural diagram of an identification component for an under-screen optical fingerprint according to a twenty-fourth embodiment of the present invention;

25 is a schematic structural diagram of an electronic device configured with the identification component of any one of the above-mentioned embodiments of the present invention;

FIG. 26 is a schematic structural diagram of an under-screen biometric identification device according to a known embodiment in the prior art.

Detailed ways

In order to make those skilled in the art better understand the technical solutions of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described The embodiments are only some of the embodiments of the present invention, but not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative work shall fall within the protection scope of the present invention.

It should be noted that when an element is referred to as being "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for the purpose of illustration only and do not represent the only embodiment.

Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terms used herein in the description of the present invention are for the purpose of describing specific embodiments only, and are not intended to limit the present invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

As can be seen from the above description, the conventionally known identification components used to assemble and form a fingerprint identification device need to perform a reflow soldering process first, and then perform a COB process. And these two processes need to be completed in the module factory.

However, limited to the structure after COB packaging, it is difficult to reverse the execution order of the above two processes. The main reasons are as follows:

It can be seen from the above description of the COB process that after the COB process is used for packaging, the fingerprint chip is in an exposed state. During the reflow soldering process, the hot air also plays the role of purging impurities or dust while heating the FPC and the electronic components to be soldered. If the COB package is completed, reflow soldering is used to solder electronic components on the FPC. Then, in the process of reflow soldering, impurities or dust blown by hot air will adhere to the exposed fingerprint chip. Impurities or dust will have a serious or even fatal impact on the normal operation of the fingerprint chip.

Therefore, the known identification components used for assembling and forming fingerprint identification devices, due to the relatively fixed execution sequence of the reflow soldering process and the COB process in the manufacturing process, the two processes can only be performed in the module factory. It is not possible to transfer the COB process to the packaging factory for completion. As a result, the production efficiency of the identification components is greatly reduced.

In view of this, embodiments of the present invention provide an identification component for an under-screen optical fingerprint, which can complete the preparation of the entire identification component in a packaging factory, thereby greatly improving production efficiency.

In this specification, in the normal use state of the identification component of the embodiment of the present invention, the direction pointing to or facing the user is defined as "up", and the direction opposite to or facing away from the user is defined as "down" .

More specifically, the upward direction illustrated in FIGS. 1 to 25 is defined as “up”, and the downward direction illustrated in FIGS. 1 to 25 is defined as “down”.

It is worth noting that the definition of each direction in this specification is only for the convenience of explaining the technical solution of the present invention, and does not limit the identification components of the embodiments of the present invention, including but not limited to use, testing, transportation, manufacturing, etc. Orientation in a scene that can cause the recognition component to be oriented upside down or shifted in position.

The identification component provided by the embodiment of the present invention can be applied to scenarios including but not limited to under-screen fingerprint unlocking, user identity verification, and permission acquisition.

Specifically, when the identification component of the embodiment of the present invention is configured in the electronic device, the electronic device can obtain the fingerprint feature information of the user based on the identification component, so as to match the stored fingerprint information, so as to realize the identification of the current user. Verification to confirm whether it has the corresponding authority to perform related operations on the electronic device.

It should be noted that the fingerprint information obtained above is only a common example of user biometrics. Within the conceivable scope, those skilled in the art can extend the technical solutions of the embodiments of the present invention to any suitable biometric verification scenarios. For example, in a scenario where the user's iris, which is the biometric information, is obtained for verification, the embodiment of the present invention does not limit this.

The following description takes the acquisition of user fingerprint information as the main scenario. However, based on the above description, it can be seen that the protection scope of the embodiments of the present invention is not limited thereby.

The identification component for off-screen optical fingerprints according to the embodiments of the present invention can be applied to electronic devices including but not limited to mobile smart phones, tablet electronic devices, computers, GPS navigators, personal digital assistants, and smart wearable devices.

In order to implement the basic functions of the electronic device, the electronic device in this embodiment of the present invention may further include other necessary modules or components. Taking a mobile smart phone as an example, it may also include a communication module, a battery, and the like.

It should be noted that other necessary modules or components included in the electronic device can be selected from any suitable existing structures. In order to clearly and briefly describe the technical solutions provided by the present invention, the above-mentioned parts will not be repeated here, and the accompanying drawings in the description are also simplified accordingly. It should be understood, however, that the present invention is not thereby limited in scope.

As shown in FIG. 25 , the electronic device may be configured with a display screen 200 . The display screen 200 may be a self-luminous display screen using self-luminous units as display pixels, for example, an OLED display screen or an LED display screen. Certainly, the display screen 200 may also be an LCD display screen or other passive light-emitting display screen, which is not limited in this embodiment of the present invention.

The identification component 100 of the embodiment of the present invention is disposed below the display screen 200 . Specifically, the electronic device may be provided with a middle frame, and the identification assembly 100 is installed under the display screen 200 through the middle frame, and is fixed. Moreover, the identification assembly 100 and the display screen 200 are opposite and spaced apart.

The identification component 100 of the embodiment of the present invention will be explained and described below with reference to FIG. 1 to FIG. 24 . It should be noted that, for convenience of description, in the embodiments of the present invention, the same reference numerals denote the same components. For the sake of brevity, in different embodiments, the detailed descriptions of the same components are omitted, and the descriptions of the same components can be referred to and quoted from each other.

As shown in FIG. 1 to FIG. 24 , the identification assembly 100 includes a photosensitive chip 1 for converting optical signals into electrical signals. When the identification component 100 is disposed below the display screen 200 , the light sensor chip 1 is used to receive the target signal light reflected from the target organism (eg, the user's finger) above the display screen 200 . And, the target signal light can be converted into an electrical signal to generate a fingerprint image. The photosensitive chip 1 can further send the fingerprint image to an image processor that is signal-connected to it, and the image processor performs image processing to obtain a fingerprint signal, and performs fingerprint identification on the fingerprint signal through an algorithm.

The photosensitive chip 1 at least includes a metal layer 1a. Since the metal layer 1a is used for wiring or wiring, the metal layer 1a needs to be protected. The photosensitive chip 1 may further include a silicon layer 1b, which is stacked with the metal layer 1a. And the relative positions of the two can be transformed and adjusted according to different situations.

A light-condensing member may be disposed above the photosensitive chip 1 , and specifically, the light-concentrating member may be located in the protection cavity 2 mentioned below. In addition, when the identification assembly 100 is disposed below the display screen 200, the light-condensing member is located between the photosensitive chip 1 and the display screen 200, and is used for collecting the signal light, so that the signal light scattered in the wide-angle range can be concentrated to the display screen 200. on the photosensitive chip 1 to improve the imaging quality.

In this embodiment, the condensing member may be composed of a plurality of microlenses 13 . A plurality of microlenses 13 can be arranged on the photosensitive chip 1 , so that the photosensitive chip 1 can provide arrangement positions and supports for the plurality of microlenses 13 .

Of course, the plurality of microlenses 13 may also be arranged at intervals from the photosensitive chip 1 . Specifically, a light-transmitting plate or a light-transmitting sheet for arranging the plurality of microlenses 13 may be arranged above the photosensitive chip 1 , thereby realizing the spaced arrangement of the plurality of microlenses 13 and the photosensitive chip 1 .

In order not to affect the imaging quality of the photosensitive chip 1 , the spacing distance between the plurality of microlenses 13 and the photosensitive chip 1 is equal to or similar to the focal length of the microlenses 13 . Specifically, the difference between the distances between the plurality of microlenses 13 and the photosensitive chip 1 can be considered as the separation distance between the plurality of microlenses 13 and the photosensitive chip 1 when the difference in the distance between the plurality of microlenses 13 and the photosensitive chip 1 is within a predetermined range [0, Φ]. It is equal to or close to the focal length of the microlens 13 .

The upper limit value Φ of the predetermined range may be set according to actual conditions, which is not limited in this embodiment of the present invention.

A protective component 5 is arranged above the photosensitive chip 1 , and the protective component 5 has a light-transmitting area, and the target signal light can reach the photosensitive chip 1 through the light-transmitting area.

The light-transmitting area may occupy the entire light-facing surface (eg, the upper surface) of the shield assembly 5 . At this time, the entire protective component 5 can be made of light-transmitting material, and there is no area on the light-facing surface where the light cannot penetrate.

Alternatively, the light-transmitting area may only occupy part of the light-facing surface of the protective assembly 5 . For example, the protective component 5 is made of light-transmitting material and opaque material in different regions; the region occupied by the light-transmitting material forms a light-transmitting region.

Alternatively, the protective component 5 is made of light-transmitting material as a whole, and areas covered by the opaque material may exist or be distributed on the light-facing surface; and the area that is not covered by the opaque material can form the light-transmitting area. .

The protection component 5 can be arranged at any position along the propagation path of the target signal light to the direction in which the photosensitive chip 1 is located. In other words, it is the projection of the protection component 5 along the propagation direction of the target signal light, at least partially covering the photosensitive chip 1 .

For example, if the target signal light propagates in a manner perpendicular to the light-facing surface of the photosensitive chip 1 , the protective component 5 may be located directly above the photosensitive chip 1 . However, if the target information light propagates in a manner inclined to the light-facing surface of the photosensitive chip 1 , the protective component 5 can be correspondingly located obliquely above the photosensitive chip 1 . In this way, the target information light can pass through the light-transmitting area of the protection component 5 as much as possible to reach the photosensitive chip 1 .

In addition, the withstand temperature of the protective assembly 5 is higher than 150°C. That is, when the temperature of the protective component 5 is higher than 150° C., its physical form does not change (for example, softening deformation, melting). Therefore, when the identification component 100 of the embodiment of the present invention is subsequently connected to the external circuit through reflow soldering, even if the protection component 5 is heated up, it will not be deformed or damaged, so that the adjacent or connected components can also remain original shape.

Due to the reflow process, the temperature rises in a step-like manner. Therefore, 150° C. can be the withstand temperature of the shield assembly 5 at the beginning of reflow soldering. In order to adapt to the step-like temperature rise of reflow soldering, the withstand temperature of the protective component 5 can be further increased. For example, the highest temperature in the reflow soldering process may be 260°C, and the withstand temperature of the protective component 5 is correspondingly greater than 260°C, eg, 280°C or 300°C.

Specifically, the protective assembly 5 may include at least one of a light-transmitting carrier 5a and a light filter 5b. For example, any one of the light-transmitting carrier 5a and the optical filter 5b may constitute the protective component, for example, only the light-transmitting carrier 5a constitutes the protective component 5, or only the optical filter 5b constitutes the protective component 5. Of course, the protective component can also be formed by combining the light-transmitting carrier 5a and the filter 5b.

When the protective component 5 is specifically formed by at least one of the light-transmitting carrier 5a and the optical filter 5b, the entire light-facing surface of the protective component 5 can form a light-transmitting area.

The light-transmitting carrier 5a can provide a setting position for the optical filter 5b, and play a role of supporting the optical filter 5b. Thus, the relative position between the light-transmitting carrier 5a and the optical filter 5b can be relatively free.

Specifically, the filter 5b may be disposed on the upper surface or the lower surface of the light-transmitting carrier 5a in a sticking manner. Therefore, the surface of the optical filter 5b is attached to the surface of the light-transmitting carrier 5a.

In this embodiment, the filter 5b may be attached to the surface of the light-transmitting carrier 5a in the form of a film. In addition, the filter 5b may be provided on the upper surface and the lower surface of the light-transmitting carrier 5a at the same time.

Alternatively, the filter 5b may be embedded in the light-transmitting carrier 5a. That is, the filter 5b is integrated with the light-transmitting carrier 5a, and the light-transmitting carrier 5a at this time has the function of filtering noise light.

In this embodiment, the light-transmitting carrier 5a may be a single-layer member, and the optical filter 5b may be formed in the light-transmitting carrier 5a in the form of an optical filter coating. Also, the optical filter coating may be discretely or continuously distributed in the light-transmitting carrier 5a.

In addition, there may also be a plurality of light-transmitting carriers 5a. Then the optical filter 5b may be attached between two adjacent light-transmitting carriers 5a in the form of a film, or may be formed in one or several light-transmitting carriers 5a in the form of an optical filter coating.

In one embodiment, the light-transmitting carrier 5a may be a cover glass or a sapphire cover.

Moreover, the protective component 5 is spaced apart from the photosensitive chip 1 . In this way, damage to the photosensitive chip 1 due to contact between the protective component 5 and the photosensitive chip 1 can be avoided.

The optical filter 5b is used to at least partially filter out the noise light mixed in the target signal light, so as to improve the sensitivity of the light sensing chip 1 to the received light and improve the imaging quality.

When the excitation light source is different, the noise light also changes accordingly. The excitation light source is used to emit excitation light to the user's finger, the excitation light is reflected by the user's finger, and the reflected light is the target signal light carrying fingerprint information.

In some scenarios, when the display screen 200 is a self-luminous display screen, the self-luminous display screen can be the excitation light source. The excitation light emitted by the excitation light source is generally visible light, and similarly, the target signal light is also visible light. Then, in this scenario, the noise light may be invisible light in ambient light, such as infrared light, near-infrared light, and the like. In this case, the filter 5b may specifically be an infrared filter.

In this scenario, the filter 5b can allow the light emitted by the self-luminous display screen to pass, and filter the noise light (including invisible light such as infrared light, near-infrared light, etc.) in ambient light (eg, sunlight). The light emitted by the self-luminous display screen includes non-target signal light that does not contain fingerprint information directly toward the filter 5b, and also includes target signal light that carries fingerprint information after being reflected by the user's finger.

Therefore, when the electronic device configured with the identification component 100 of the embodiment of the present invention is used outdoors, the filter 5b can effectively filter the noise light in the external ambient light, thereby improving the signal-to-noise of the light reaching the photosensitive chip 1 . Compare.

In some cases, the excitation light source may be an invisible light source additionally disposed under the display screen 200, such as an infrared light source, and the excitation light and target signal light emitted by the excitation light source are both invisible light. In this scenario, then, the noise light is the visible light in the ambient light, such as white light. In this case, the filter 5b may be a visible light filter specifically.

In this scenario, the filter 5b can allow the invisible excitation light emitted by the excitation light source to pass through, and filter the noise light (including visible light such as white light) in the ambient light.

Generally, when the excitation light source is an additionally configured invisible light source, it can realize directional emission of light, that is, emit light toward a specific area on the display screen 200 , and the specific area is generally a pressing area of a user's finger. Therefore, most of the invisible excitation light emitted by the excitation light source is reflected by the finger to form target signal light carrying fingerprint information, and will not propagate directly to the photosensitive chip 1 .

Therefore, when the electronic device equipped with the identification component 100 of the embodiment of the present invention is used outdoors, the optical filter 5b can also effectively filter the noise light in the external ambient light. In addition, since the identification component 100 in the embodiment of the present invention is disposed below the display screen 200, the filter 5b can also filter out the visible light part of the light emitted downward from the display screen 200, thereby improving the reach of the light-sensing chip 1. The signal-to-noise ratio of the light.

A protective cavity 2 for protecting the metal layer 1a is formed below the protective component 5 . The protective effect of the protective cavity 2 on the metal layer 1a at least includes blocking impurities or dust, and may further include anti-oxidation protection.

In addition, the main form of protection of the metal layer 1 a by the protection cavity 2 may include: accommodating the metal layer 1 a in the protection cavity 2 . Alternatively, the photosensitive chip 1 forms part of the inner wall of the protection cavity 2 .

Further, the identification component 100 of the embodiment of the present invention is further configured with a conductive path. One end (inner end) of the conductive path is conductively connected to the metal layer 1a, and the other end (outer end) is used for connection with an external circuit.

Since the metal layer 1a of the photosensitive chip 1 is protected by the protective cavity 2, conditions are provided for the identification component 100 of the embodiment of the present invention to be packaged first, and then to be electrically connected to an external circuit by reflow soldering.

That is to say, the identification component 100 according to the embodiment of the present invention can complete the packaging of the photosensitive chip 1 in the packaging factory, and then realize the connection with the external circuit in the module factory. In this way, compared with the prior art, the identification component 100 of the embodiment of the present invention only needs to perform a reflow soldering process in a module factory, so that the production efficiency is greatly improved.

It should be noted that, although the prior art is in the technical field of under-screen optical fingerprint identification, there are known embodiments of an enclosed space in which a fingerprint chip is accommodated. However, in these known embodiments, the identification components have been assembled with other related structures for realizing under-screen optical fingerprint identification to form corresponding identification devices. The enclosed space is formed by the identification components and other related structures. That is, the closed space for accommodating the fingerprint chip exists in the identification device, but cannot exist in the identification assembly.

At this point, the assembled identification device has completed the operation of the reflow soldering process. When connecting the identification device or the identification component with the external circuit, it is generally not realized by reflow soldering. And practice has proved that it is difficult or even impossible to achieve through the reflow soldering process.

Specifically, for example, the bulletin number CN208027382U provides an under-screen biometric identification device and electronic equipment. Among them, the under-screen biometric identification device is described as a known embodiment.

As shown in FIG. 26 , in this known embodiment, the FPC 270 is fixed on a steel plate, and the imaging chip 250 (ie, the fingerprint chip mentioned above) is fixed on the upper surface of the FPC 270 by bonding pads. The upper surface of the FPC 270 is in the edge region of the imaging chip 250 and is fixedly connected with the lower surface of the bracket 230 . And, a closed space is formed between the bracket 230 and the FPC 270 . Thus, the closed space accommodates the imaging chip 250 therein.

In essence, in this known embodiment, the structure including the steel plate, the FPC 270 and the imaging chip 250 is equivalent to the identification component 100 of the embodiment of the present invention (for brevity and difference from the present invention, it is named the identification structure). The bracket 230 configured with the lens 210 and the lens barrel 220 is a related structure matched with it. Thus, the identification structure and the related structure are assembled to form an under-screen biometric identification device.

Although not mentioned in this known embodiment, the realization of the connection of the structure to the external circuit is identified. However, it is worth noting that, due to the limitation of its own structure and the consideration of product yield, reflow soldering cannot be used to realize the connection between the identification structure and the external circuit. The main reason is that the lens 210 cannot be subjected to reflow soldering, that is, the temperature atmosphere in which the reflow soldering is performed will damage the lens 210 . details as follows:

The temperature resistance of the lens 210 is poor (at present, the lenses used in the field of under-screen optics are mostly made of plastic materials, and the heat-resistant temperature is low, generally around 60°C). The temperature atmosphere during the reflow soldering process will cause the lens 210 deformed.

Further, in this known embodiment, the lens 210 is fixed in the lens barrel 220, and the lens barrel 220 is connected with the bracket 230 by means of screw connection. Similarly, the support 230 also generally has poor temperature resistance (generally about 100° C.). The temperature atmosphere during the reflow soldering process will cause the bracket 230 to soften and change, squeezing the lens 210 .

Since the lens 210 is a precision device, slight damage or deformation will cause it to be scrapped.

Therefore, the known embodiment adopts the COB process to obtain the identification structure, and the identification device assembled by using the identification structure is difficult to realize the connection with the external circuit through reflow soldering.

Therefore, the closed space in which the fingerprint chip is housed is formed in the identification device because of the structure that must be formed when the identification component is assembled with the related structure. However, after the identification components are assembled to form the identification device and then reflow soldering is performed to realize the connection with the external circuit, the relatively fragile and delicate components in the identification device will be damaged. Therefore, reflow soldering cannot be performed, or forcible reflow soldering will result in product rejection.

However, if the above embodiment does not form a closed space (that is, at this time, the identification structure is not assembled with the bracket 230 configured with the lens 210 and the lens barrel 220, and there is no such precise device as the lens 210), through Reflow soldering is used to realize the connection between the identification structure and the external circuit, although it will not cause damage to the lens 210 . However, at this time, the imaging chip 250 in the identification structure is in an exposed state, and impurities or dust blown by hot air during the reflow soldering process may adhere to the surface of the imaging chip 250 , thereby causing the imaging chip 250 to be damaged.

It can be seen that, in the known embodiment, no matter in the stage of identifying the structure or the stage after the identification device is assembled by using the identification structure, the conductive connection between the identification structure and the external circuit cannot be realized by the process of reflow soldering. .

However, in the embodiment of the present invention, a protection cavity 2 for protecting the photosensitive chip 1 is formed in the identification assembly 100, and since the identification assembly 100 does not involve the lens 210 in the above-mentioned known embodiments, such a precise and relatively temperature-resistant poor device, thereby making it possible to connect the identification assembly 100 to an external circuit through reflow soldering. And reduce the cost of consumables due to damage to these expensive precision devices.

Further, the identification component 100 according to the embodiment of the present invention can be completed in a packaging factory, that is, including the packaging of the photosensitive chip 1 and the formation of the protective cavity 2, and in the module factory, only reflow soldering is required to connect the identification component 100 to the outside. a process. As a result, as many processes as possible can be completed in a packaging factory with higher production efficiency, and the overall production efficiency is greatly improved. In addition, reflow soldering does not require high cleanliness of the operating environment or atmosphere, which can further improve production efficiency.

Thus, the identification component 100 of the embodiment of the present invention can be connected to the external circuit through reflow soldering. Specifically, the identification component 100 of the embodiment of the present invention is configured with a conductive path with one end conductively connected to the metal layer 1a of the photosensitive chip 1, and the other end of the conductive path can be conductively connected to an external circuit through reflow soldering. Thereby, the conductive communication between the identification component 100 of the embodiment of the present invention and the external circuit is realized.

In addition, the other end of the conductive path is connected to the external circuit through reflow soldering. The other end of the conductive path is connected to the FPC through reflow soldering, and the FPC is connected to other peripheral circuits or electronic components through connectors or connecting plugs in a plug-and-pull manner. device connection.

In addition, in order to facilitate the connection between the other end of the conductive path and the external circuit through reflow soldering, the other end of the conductive path may be exposed. Specifically, the other end of the conductive path may not be blocked by the wall of the identification component 100 . For example, when the other end of the conductive path is located in the wall of the identification component 100 , it can be exposed by providing an opening or a through hole on the wall of the identification component 100 to connect the other end of the conductive path with the outside.

Alternatively, the other end of the conductive path may be exposed or protruded from the outer surface of the identification component 100 . For example, the other end of the conductive path is flush with the outer surface of the identification component 100 , or extends to the outside of the outer surface of the identification component 100 . Thus, the other end of the conductive path is exposed and extends to the outside of the protective cavity 2 .

The other end of the conductive path may be formed with solder balls 15 through a ball mounting process. The solder balls 15 have better solderability, such as solder balls, so as to conveniently realize the connection between the solder balls 15 and external circuits through reflow soldering.

The photosensitive chip 1 included in the identification component 100 of the embodiment of the present invention can be packaged by using the same COB process as the above-mentioned embodiment. Of course, other packaging processes can also be used for implementation.

For example, in a feasible embodiment, the photosensitive chip 1 may be packaged through a chip scale package (CSP, Chip ScalePackage) process. Due to the CSP process, the thickness and volume of the packaged product can be reduced. Therefore, the embodiment of the present invention adopts the CSP process to realize the packaging of the photosensitive chip 1, which can make the thickness and volume of the identification component 100 smaller, so that the identification component 100 of the optical fingerprint under the screen of the electronic device can be thinner and smaller. need.

By adopting the CSP process, the ratio of the area of the photosensitive chip 1 to the package is greater than 1:1.14, which is close to 1:1.

Since the photosensitive chip 1 needs to be supported by a support carrier, ie, a carrier, during the packaging process using the CSP process. Therefore, after the encapsulation is completed, the carrier can be kept in a combined state with the photosensitive chip 1, or can be removed.

That is to say, in one case, the photosensitive chip 1 is combined with the carrier through the CSP process. Moreover, after the photosensitive chip 1 is packaged, the carrier and the photosensitive chip 1 continue to maintain this combined state. That is, the carrier is included in the final identification assembly 100 .

In another case, the carrier only supports the photosensitive chip 1 during the process of being packaged by the CSP process. After the encapsulation is completed, the carrier can be peeled off, so as to be separated from the photosensitive chip 1 . That is, the carrier is not included in the final identification assembly 100 .

As shown in FIG. 1 to FIG. 18 , it is the situation in which the carrier continues to be combined with the photosensitive chip 1 after the packaging of the photosensitive chip 1 is completed.

In this case, the photosensitive chip 1 includes a metal layer 1a and a silicon layer 1b. In order to protect the metal layer 1 a, the metal layer 1 a may be accommodated in the protection cavity 2 ; or, the photosensitive chip 1 forms a part of the inner wall of the protection cavity 2 . Therefore, during the process of reflow soldering, impurities or dust can be blocked out of the protective cavity 2 . Furthermore, the metal layer 1a can be protected from oxidation.

Further, the silicon layer 1b may also be accommodated in the protection cavity 2 . That is, at this time, the entire photosensitive chip 1 is accommodated in the protective cavity 2 .

As shown in FIG. 1 to FIG. 8 , the metal layer 1 a is accommodated in the protective cavity 2 , and the silicon layer 1 b is also accommodated therein. In these embodiments, the carrier may be a substrate 3 (Substrate, SUB). The substrate 3 can provide functions such as electrical connection, protection, support, heat dissipation, and assembly for the photosensitive chip 1 .

The substrate 3 may take any suitable existing configuration. Specifically, the substrate 3 may be a flexible substrate made of a flexible material (eg, a plastic film), and a multi-layer metal wiring is fabricated on the flexible sheet. Alternatively, the substrate 3 may also be a rigid substrate made of a multilayer wiring ceramic or a multilayer wiring laminate resin board. Alternatively, the substrate 3 may also be a lead frame.

In addition, the base plate 3 is provided with a support wall 4 , and the lower end of the support wall 4 can be adhered to the base plate 3 by the adhesive 304 . And, the guard assembly 5 is supported on the upper end of the support wall 4 . Similarly, the guard assembly 5 can also be fixed on the upper end of the support wall 4 by adhesive. In this way, the protective cavity 2 is defined between the base plate 3 , the support wall 4 and the protective assembly 5 .

In the embodiment of the present invention, the glue used for bonding the adjacent components adopts thermosetting glue. Therefore, during subsequent reflow soldering, the high-temperature atmosphere will not only not damage the connection between the components, but also strengthen the curing effect of the glue, making the connection between the components stronger.

In this embodiment, the protection chamber 2 may be a sealed chamber or a non-sealed chamber.

The protective cavity 2 being a closed cavity can be realized by configuring the support wall 4 to be continuous in the circumferential direction. The support wall 4 may be continuous in the circumferential direction, it defines an inner space, and the inner space is not communicated with the outer space in the radial direction.

Specifically, for example, the support wall 4 may be a cylindrical body, and the wall of the cylindrical body is not provided with any through structures, such as through holes, openings, etc., which can connect the inner space and the outer space thereof. In addition, the cross-section of the cylindrical body may be in a circle, a polygon, an opposite shape, or any other feasible shape, which is not limited in this embodiment of the present invention.

The protective chamber 2 being a non-hermetic chamber can be achieved by configuring the support wall 4 to be discontinuous in the circumferential direction. Likewise, the support wall 4 may be continuous in the circumferential direction, and the inner space defined by the support wall 4 may not communicate with the outer space in the radial direction.

Specifically, for example, the support wall 4 can also be a cylindrical body, and the wall of the cylindrical body is provided with a through structure such as a through hole, an opening, etc. that connects the inner space and the outer space thereof.

Alternatively, the support wall 4 is a casing structure that is not closed in the circumferential direction, for example, the cross-sectional shape of the support wall 4 may be circular arc shape, C shape, or the like.

Alternatively, the support wall 4 can be a plurality of cylinders, and the upper and lower ends of the plurality of cylinders are respectively connected to the lower surface of the protection assembly 5 and the upper surface of the base plate 3, so that the multiple cylinders are erected on the protection assembly 5 and the base plate 3. between. Additionally, a plurality of posts may be spaced circumferentially to form a structure similar to a fence.

The above are only several feasible implementation manners in which the circumferential direction of the support wall 4 is discontinuous to realize the non-sealing of the protection cavity 2, and the embodiment of the present invention is not limited thereto.

In addition, the support wall 4 needs to be configured to be capable of over-reflow soldering. Therefore, as described above, the withstand temperature of the support wall 4 is at least greater than 150°C, and may further be greater than 260°C. Accordingly, the support wall 4 can be made of any suitable material that does not change its physical form when the temperature is above 150°C or even 260°C, such as metal (light metal is preferred, such as aluminum or aluminum alloy), ceramics, etc.

The upper surface of the substrate 3 may be provided with upper pins 301 , and the lower surface of the substrate 3 may be provided with lower pins 302 in conductive communication with the upper pins 301 . Specifically, metal pillars 303 are embedded in the substrate 3 , and the upper and lower ends of the metal pillars 303 are respectively connected to the upper and lower surfaces of the substrate 3 to form upper pins 301 and lower pins 302 respectively.

The upper pins 301 and the lower pins 302 of the substrate 3 form part of the conductive paths. The upper pins 301 are used for conductive connection with the metal layer 1 a of the photosensitive chip 1 , and the upper pins 301 are in conductive communication with the lower pins 302 , so that the photosensitive chip 1 and the lower pins 302 are also in conductive communication.

The lower pin 302 is located outside the protective cavity 2 and forms the other end of the conductive path for connecting with an external circuit. As described above, the lower pins 302 may have solder balls 15 formed thereon.

The manner in which the upper pin 301 is electrically connected to the metal layer 1a of the photosensitive chip 1 is as follows:

In the embodiment shown in FIGS. 1 to 2 , the photosensitive chip 1 is bonded to the substrate 3 by an adhesive 103 . In addition, a bonding pad 101 is formed on the photosensitive chip 1 . Specifically, a bonding pad 101 may be formed on the surface of the metal layer 1 a of the photosensitive chip 1 .

The bonding pads 101 and the upper pins 301 are conductively connected through the leads 6 . The lead 6 may be a conductive metal wire such as a gold wire or a copper wire, which may be specifically connected to the pad 101 and the upper pin 301 through a wire bonding (WB, Wire Bonding) process. Thus, the bonding pads 101, the leads 6, the upper pins 301 and the lower pins 302 form conductive paths.

In the embodiment as shown in FIG. 3 to FIG. 4 , the photosensitive chip 1 is embedded with conductive pillars 7 connected to the lower surface thereof. The conductive pillars 7 may be metal pillars such as copper pillars, which may be formed in the photosensitive chip 1 by a through silicon via (TSV, Through Silicon Vias).

The conductive pillars 7 are conductively connected to the upper pins 301 . Specifically, the conductive posts 7 can be fixed to the upper pins 301 by an adhesive bonding welding process. Thus, the conductive pillars 7 , the upper pins 301 and the lower pins 302 form conductive paths.

Actually, in this embodiment, the photosensitive chip 1 can be electrically connected to the substrate 3 through an FC (Flip Chip, flip-chip) process.

Further, solder balls 701 may also be formed on the lower ends of the conductive pillars 7 through a ball mounting process. And, the solder balls 701 abut on the pins 301 . Thereby, the conductive connection between the conductive column 7 and the upper pin 301 is preferably realized.

In the embodiments shown in FIGS. 5 to 6 , a bonding pad 101 is formed on the photosensitive chip 1 , and a conductive column 7 is provided outside the photosensitive chip 1 . Specifically, the conductive layer 8 can be in conductive communication with the pads 101 and the conductive pillars 7 through physical contact. The upper ends of the conductive pillars 7 are connected to the conductive layer 8 .

Further, the conductive pillars 7 are conductively connected to the upper pins 301 of the substrate 3 through an adhesive bonding welding process. Thus, the bonding pads 101 , the conductive layer 8 , the conductive pillars 7 , the upper pins 301 and the lower pins 302 form conductive paths.

In addition, a support layer 9 may be disposed between the photosensitive chip 1 and the support wall 4 , and the conductive pillars 7 may be disposed in the support layer 9 . Therefore, by disposing the support layer 9 , it is possible to provide a setting position for the conductive column 7 to fix the conductive column 7 , so as to maintain the stability of the conductive column 7 , so that the conductive column 7 can conduct electricity with the conductive layer 8 and the upper pins 301 connect.

The support layer 9 can be made of any suitable existing material. For example, the support layer 9 may be of the same material as the substrate 3 . Then, the conductive layer 8 may be formed on the surface or inside of the support layer 9 through a redistribution layer (RDL) process.

Of course, the support layer 9 may not be limited to the above-mentioned materials, and may also be EMC (Epoxy Molding Compound, epoxy molding compound), so that the side surface of the photosensitive chip 1 can be covered by the packaging process. In this way, the side surfaces of the photosensitive chip 1, especially the side surfaces of the metal layer 1a, can be protected against oxidation.

In addition, the conductive layer 8 may not be limited to the above-mentioned embodiment. In other feasible embodiments, for example, the conductive layer 8 may be implemented as a metal conductive sheet, etc., as long as the conductive connection pads 101 and the conductive pillars 7 can be implemented, all should be included in the protection scope of the present invention.

Further, the support layer 9 may be spaced apart from the inner wall of the support wall 4 . In this way, an interval is formed between the support layer 9 and the support wall 4 , which provides an appropriate operation space for performing the adhesion of the support wall 4 and the substrate 3 .

In the embodiment shown in FIGS. 7 to 8 , the lower surface of the photosensitive chip 1 is provided with conductive bumps 10 , and the conductive bumps 10 can be fixed to the upper pins 301 of the substrate 3 by adhesive bonding. Thus, the conductive bumps 10 , the upper pins 301 and the lower pins 302 form conductive paths.

Likewise, in this embodiment, the photosensitive chip 1 may be electrically connected to the substrate 3 through the FC process.

In addition, the lower ends of the conductive bumps 10 may also be formed with solder balls 1001 through a ball-mounting process, and the solder balls 1001 are connected to the upper pins 301 through a soldering process. Thereby, the conductive connection between the conductive bump 10 and the upper pin 301 is preferably realized.

The above is the embodiment in which the substrate 3 is used as the carrier. In other feasible embodiments, the material for encapsulating the photosensitive chip 1 may also be used to construct the carrier.

As shown in FIG. 9 to FIG. 18 , it is an embodiment in which the carrier is formed by the encapsulation layer 11 . In these embodiments, the photosensitive chip 1 can also be combined with the packaging layer 11 through a CSP packaging process.

Moreover, the encapsulation layer 11 can be any one or a combination of EMC, SMF or underfill glue, which can be combined with the photosensitive chip 1 through a CSP process.

It should be noted that, in the embodiment in which the carrier is formed by the encapsulation layer 11, the same or repeated structures appear in the embodiment in which the carrier is formed by the substrate 3, such as the supporting wall 4, the protection component 5, the conductive column 7. For the conductive layer 8, the support layer 9, etc., reference may be made to the above description, and details are not repeated here.

It can be seen from the above description that at least the metal layer 1a of the photosensitive chip 1 needs to be protected. Therefore, when the metal layer 1a is located above the silicon layer 1b, only the metal layer 1a of the photosensitive chip 1 can be encapsulated and protected.

Based on this, when the metal layer 1 a is located below the silicon layer 1 b (as shown in the embodiments shown in FIGS. 11 to 12 ), the encapsulation layer 11 needs to encapsulate the bottom and side surfaces of the photosensitive chip 1 .

When the metal layer 1a is located above the silicon layer 1b (as shown in FIGS. 9 to 10 and the embodiments shown in FIGS. 13 to 18 ), the encapsulation layer 11 may only cover the side surface of the photosensitive chip 1, or may further Cover the bottom surface of the photosensitive chip 1 .

Therefore, the encapsulation layer 11 at least includes a peripheral portion 11 b surrounding the side surface of the photosensitive chip 1 , and may further include a substrate portion 11 a covering the bottom surface of the photosensitive chip 1 .

The substrate portion 11a is constructed integrally with the peripheral portion 11b. Therefore, the encapsulation layer 11 can be roughly in the shape of a shell with an open upper end, and the photosensitive chip 1 is embedded or wrapped in the encapsulation layer 11 .

In addition, the peripheral portion 11 b surrounds the side surface of the photosensitive chip 1 , and the peripheral portion 11 b may be in direct contact with the side surface of the photosensitive chip 1 . 9 to 12, and 15 to 18 of the embodiment. At this time, the peripheral portion 11b covers the side surface of the photosensitive chip 1 .

Alternatively, the peripheral portion 11b surrounds the side surface of the photosensitive chip 1, or the peripheral portion 11b surrounds the outer side of the photosensitive chip 1, and the two are spaced apart, and a support layer for fixing the conductive pillars 7 is disposed between the two. 9. 13 to 14 of the embodiment. In addition, the support layer 9 is attached to the outer side surface of the photosensitive chip 1 and the inner wall of the peripheral portion 1b. At this time, the side surface of the photosensitive chip 1 is protected by the support layer 9 .

Therefore, according to the contact relationship between the peripheral portion 11b and the side surface of the photosensitive chip 1, the protective cavity 2 is formed in a different manner.

For example, in the embodiments shown in FIGS. 9 to 12 , the peripheral portion 11 b covers the side surface of the photosensitive chip 1 . In this embodiment, the upper end of the peripheral portion 11b is provided with a support wall 4 , and the upper end of the support wall 4 supports the guard assembly 5 . Therefore, the protection cavity 2 is defined by the photosensitive chip 1 , the support wall 4 and the protection component 5 .

In the embodiment shown in FIGS. 13 to 14 , the difference from the embodiment shown in FIGS. 9 to 12 is that the peripheral portion 11 b surrounds the outer side of the photosensitive chip 1 , and the two are spaced apart, and The side surfaces of the photosensitive chip 1 and the inner wall of the peripheral portion 11b are filled with the support layer 9 before. In this embodiment, the protection cavity 2 is defined by the photosensitive chip 1 , the support layer 9 , the support wall 4 and the protection component 5 .

In the embodiments shown in FIGS. 9 to 14 , the conductive paths may be formed by conductive pillars 7 or conductive bumps 10 connected to the photosensitive chip 1 . The specific methods are as follows:

In the embodiment shown in FIGS. 9 to 10 , the conductive column 7 is embedded in the photosensitive chip 1 , and its lower end extends out of the protective cavity 2 to form the other end of the conductive path for connecting to an external circuit. Likewise, the lower ends of the conductive pillars 7 may be formed with solder balls 15 .

Furthermore, in embodiments where the encapsulation layer 11 includes the substrate portion 11a, the lower surface of the substrate portion 11a constitutes the outer surface of the identification assembly 100 . Then the lower ends of the conductive pillars 7 may penetrate through the thickness of the substrate portion 11a.

And the lower end of the conductive column 7 can be flush with the lower surface of the substrate portion 11a, that is, the other end of the conductive path is exposed to the outer surface of the identification component 100 and is flush with it. Alternatively, the lower ends of the conductive pillars 7 may protrude from the lower surface of the substrate portion 11a, that is, the other end of the conductive path exposes the outer surface of the identification component 100 and extends to the outside thereof.

11 to 12, the conductive bumps 10 are formed on the lower surface of the photosensitive chip 1, the lower ends of which extend to the outside of the protective cavity 2 to form the other end of the conductive paths for connecting with external circuits. Likewise, the lower ends of the conductive bumps 10 may be formed with solder balls 15 .

Likewise, in embodiments where the encapsulation layer 11 includes the substrate portion 11a, the lower ends of the conductive bumps 10 may penetrate the thickness of the substrate portion 11a.

And the lower ends of the conductive bumps 10 may be flush with the lower surface of the substrate portion 11a; alternatively, the lower ends of the conductive bumps 10 may protrude from the lower surface of the substrate portion 11a.

In the embodiment shown in FIGS. 13 to 14 , the photosensitive chip 1 is formed with a bonding pad 101 , and the outer side of the photosensitive chip 1 is provided with a conductive column 7 . Moreover, the lower ends of the conductive pillars 7 extend outside the protection cavity 2 . Thus, the pads 101, the conductive layers 8 and the conductive pillars 7 form conductive paths.

Wherein, the lower end of the conductive column 7 forms the other end of the conductive path for connecting with an external circuit.

Likewise, the lower ends of the conductive pillars 7 may penetrate through the support layer 9 . And the lower ends of the conductive pillars 7 may be flush with the lower surface of the support layer 9 ; or, the lower ends of the conductive pillars 7 may protrude from the lower surface of the support layer 9 .

It should be noted that, in the embodiments shown in FIGS. 9 to 14 , when the encapsulation layer 11 only includes the peripheral portion 11 b without the substrate portion 11 a (ie, the embodiments shown in FIGS. 9 and 11 to 13 ) , the lower ends of the conductive pillars 7 or the conductive bumps 10 can directly form the other end of the conductive path.

At this time, the lower ends of the conductive pillars 7 or the conductive bumps 10 may be flush with the lower surface of the photosensitive chip 1 (specifically, the lower surface of the silicon layer 1 b ), or may protrude or protrude beyond the lower surface of the photosensitive chip 1 .

As shown in FIG. 15 to FIG. 18 , in another case in which the carrier is formed by the encapsulation layer 11, the upper end of the peripheral portion 11b supports the circuit board 12. opening, so that the target signal light can reach the photosensitive chip 1 through the opening.

The guard assembly 5 may be embedded in the opening (embodiments illustrated in Figures 15-16). In addition, the outer wall of the protective assembly 5 is in sealing contact with the inner wall of the opening. Specifically, a sealant can be arranged between the two.

Alternatively, the guard assembly 5 may be disposed on the circuit board 12 and cover the opening (the embodiment shown in FIGS. 17 to 18 ). Moreover, the protective component 5 can be fixed on the circuit board 12 by the adhesive 14, and seal the edge of the opening.

It should be noted that, in this embodiment, the protection component 5 may be disposed on the upper surface of the circuit board 12 or may be disposed on the lower surface of the circuit board 12 , which is not limited in this embodiment of the present invention.

Thus, a protective cavity 2 is defined between the photosensitive chip 1 , the circuit board 12 and the protective component 5 .

In the embodiments illustrated in FIGS. 15 to 18 , the conductive paths may be formed by the conductive pillars 7 connected to the photosensitive chip 1 through the peripheral portion 11 b of the encapsulation layer 11 . The specific methods are as follows:

Specifically, a bonding pad 101 is formed on the photosensitive chip 1 , and a conductive post 7 is embedded in the peripheral portion 11 b . The pads 101 are conductively connected. Thus, the pads 101 , the conductive bumps 16 , the conductive layers 8 and the conductive pillars 7 form conductive paths.

In this embodiment, the conductive bumps 16 may be formed on the lower surface of the circuit board 12 by electroplating, and solder balls may also be formed at the lower ends thereof. Therefore, the conductive protrusions 16 can be fixed on the lower surface of the circuit board 12 by soldering.

Of course, the conductive bumps 16 are also formed on the upper surface of the photosensitive chip 1 .

Alternatively, the conductive bump 16 may be any conductive body, and the upper and lower ends of the conductive body touch the conductive layer 8 and the pads 101 of the photosensitive chip 1 respectively.

The lower end of the conductive column 7 extends out of the protective cavity 2 to form the other end of the conductive path for connecting with an external circuit. Likewise, the lower ends of the conductive pillars 7 pass through the peripheral portion 11b and extend out of the protective cavity 2 .

And the conductive column 7 penetrates through the peripheral portion 11b, and its lower end may be flush with the lower surface of the peripheral portion 11b, or may protrude from the lower surface of the peripheral portion 11b.

1 to 2 , 5 to 6 , 13 to 18 , etc., in all the embodiments involving or including the bonding pads 101 , the bonding pads 101 only need to be conductive with the metal layer 1 a of the photosensitive chip 1 . Connect it. Therefore, the bonding pads 101 may not be limited to be formed on the upper surface of the photosensitive chip 1 as shown in the above drawings.

In all embodiments involving or including the conductive pillars 7 as shown in FIGS. 3 to 6 , 9 to 10 , 13 to 18 , etc., the conductive pillars 7 can be formed on the photosensitive chip 1 by a TSV process. , the peripheral portion 11b or the support layer 9 . Moreover, the conductive pillars 7 penetrate through the thickness of the photosensitive chip 1 , the peripheral portion 11 b or the supporting layer 9 . Thus, the upper ends of the conductive pillars 7 can be connected to the layer on which the photosensitive chip 1 is located.

In these embodiments, the lower ends of the conductive pillars 7 can directly form the outer ends of the conductive paths (as shown in the embodiments shown in FIGS. Figures 3 to 6 illustrate the embodiment). Therefore, the upper ends of the conductive pillars 7 are connected to the metal layer 1 a of the photosensitive chip 1 .

Therefore, in these embodiments, the metal layer 1a is located above the silicon layer 1b, ie the metal layer 1a is located above.

Correspondingly, in all embodiments involving or including the conductive bumps 10 as shown in FIGS. 7 to 8 , 11 to 12 , etc., the conductive bumps 10 can be formed on the photosensitive chip 1 by an electroplating process. the lower surface. As described above, the conductive bump 10 is connected to the metal layer 1 a of the photosensitive chip 1 .

Therefore, in these embodiments, the metal layer 1a is located below the silicon layer 1b, ie the metal layer 1a is located below.

The above is the situation in which the carrier continues to be combined with the photosensitive chip 1 after the packaging of the photosensitive chip 1 is completed. In this case, the specific preparation process or flow of the identification component 100 is generally to first realize the packaging of the photosensitive chip 1 and the carrier through the CSP process, and then to attach or assemble other corresponding components.

In the identification assembly 100 as shown in FIGS. 1 to 8 , the substrate 3 is used as a carrier. Taking the identification component 100 as shown in FIGS. 1 to 2 as an example, the manufacturing process thereof is roughly as follows:

1. Obtain a single photosensitive chip 1 monomer by cutting the wafer;

2. Paste the obtained photosensitive chip 1 on the upper surface of the substrate 3 through the adhesive 103;

3. Execute the WB process to realize the conductive connection between the photosensitive chip 1 and the substrate 3;

4. Paste the support wall 4 on the substrate 3 through the adhesive 304;

5. Fit the protective assembly 5 to the upper end of the support wall 4 .

3 to 4 and FIGS. 7 to 8 show the identification component 100 , the difference between the manufacturing process and the above is that the photosensitive chip 1 and the substrate 3 are electrically connected through the FC process. The other processes are roughly the same.

The difference between the manufacturing process of the identification component 100 shown in FIGS. 5 to 6 and the above is that the photosensitive chip 1 and the substrate 3 are electrically connected through the conductive pillars 7 and the conductive layer 8 . The conductive pillars 7 are embedded in the support layer 9 , and the materials of the support layer 9 and the substrate 3 can be the same, so that the conductive layer 8 can be formed or implanted in the support layer 9 by the RDL process. And the support layer 9 and the substrate 3 can be pasted and fixed by gluing.

In the identification assembly 100 as shown in FIGS. 9 to 18 , the encapsulation layer 11 is used as the carrier. Taking the identification component 100 as shown in FIGS. 9 to 10 as an example, the preparation process thereof is roughly as follows:

1. Obtain a single light sensor chip 1 by cutting the wafer, and the light sensor chip 1 is embedded with a conductive column 7;

2. Encapsulate the obtained photosensitive chip 1 monomer to form an encapsulation layer 11 covering its lower surface and/or side surface, and expose the lower end of the conductive post 7;

3. Paste the support wall 4 on the substrate 3 through the adhesive 304;

4. Fit the protective assembly 5 to the upper end of the support wall 4 .

The difference between the manufacturing process of the identification component 100 shown in FIGS. 11 to 12 and the above is that the conductive bumps 10 are formed on the lower surface of the photosensitive chip 1 . The other processes are roughly the same.

13 to 14, the difference between the manufacturing process of the identification component 100 and the above is that the conductive pillars 7 are not embedded in the photosensitive chip 1, but are embedded in the supporting layer 9, and pass through the conductive layer 8. A conductive connection is achieved with the photosensitive chip 1 . The other processes are roughly the same.

The difference in the manufacturing process of the identification assembly 100 shown in FIGS. 15 to 18 from the identification assembly 100 shown in FIGS. 13 to 14 is that the upper end of the support layer 9 supports the circuit board 12 provided with the opening, and The guard assembly 5 is arranged in the opening or on the circuit board 12 . The other processes are roughly the same.

As shown in FIG. 19 to FIG. 24 , after the packaging of the photosensitive chip 1 is completed, the carrier is removed.

Similarly, in the case where the carrier is removed after the packaging of the photosensitive chip 1 is completed, the same or repeated structures occur in the case where the carrier continues to be protected and combined with the photosensitive chip 1, such as the protective component 5, the conductive For the pillars 7 , the conductive layer 8 , the support layer 9 , the circuit board 12 , the conductive bumps 16 , etc., reference may be made to the above descriptions, which will not be repeated here.

In this case, the carrier is removed after the packaging of the photosensitive chip 1 is finally completed. Therefore, the carrier in this case may not be limited to being composed of the substrate 3 or the encapsulation layer 11 in the previous case.

In fact, the carrier in this case may be any object capable of providing a support or setting surface for the photosensitive chip 1 , and may be flexible or rigid.

For example, in a feasible embodiment, glass, plastic film or release film may be used as the carrier.

As described above, in order not to affect the yield and normal operation of the photosensitive chip 1 , at least the metal layer 1 a of the photosensitive chip 1 needs to be protected.

However, since the carrier is in the packaging process of the photosensitive chip 1, it needs to be supported. Therefore, in general, the carrier is arranged on the lower surface of the photosensitive chip 1 . In this way, after the package carrier is removed, the lower surface of the photosensitive chip 1 will be in an exposed state.

Therefore, in this case, the metal layer 1a included in the photosensitive chip 1 needs to be disposed above the silicon layer 1b. In this way, after the carrier is removed, the lower surface of the silicon layer 1b is exposed without affecting the protection of the metal layer 1a.

In addition, in order to realize the conductive connection between the photosensitive chip 1 and the external circuit, the identification component 100 in this case also needs to be configured with a conductive path. Since the metal layer 1a is disposed on the upper layer, in this case, the components used to form the conductive path and conduct conductive connection with the metal layer 1a of the photosensitive chip 1 cannot generally be located below.

That is, in this case, the components used to form conductive paths and conductively connect with the metal layer 1a of the photosensitive chip 1 cannot use conductive bumps 10 similar to those shown in FIGS. 11 to 12 . Therefore, it is necessary to use the manner in which the bonding pads 101 cooperate with the conductive pillars 7 to construct the conductive paths.

Since the thickness of the metal layer 1 a is relatively thin, the bonding pads 101 and wirings or traces are generally formed on the upper surface of the photosensitive chip 1 . Therefore, in order not to affect the yield rate and normal operation of the photosensitive chip 1 , at least the upper surface of the metal layer 1 a needs to be protected. In a specific embodiment, only the upper surface of the metal layer 1a may be protected, or the upper surface and the side surface of the metal layer 1a may be protected at the same time. For example, the sides of the metal layer 1a may be coated with a protective coating.

In addition, since the carrier is removed, the bottom surface or the side surface of the photosensitive chip 1 loses the structure that can support it. Therefore, in this case, the photosensitive chip 1 can be fixed by means of suspension.

Specifically, in the embodiments shown in FIGS. 19 to 22 , the outer side of the photosensitive chip 1 is provided with a supporting layer 9 spaced therefrom, the upper end of the supporting layer 9 supports the circuit board 12 , and the photosensitive chip 1 can pass through the conductive protrusions. The lift 16 is fixed below the circuit board 12 .

Specifically, the upper end of the conductive bump 16 is fixedly connected to the lower surface of the circuit board 12 , and the lower end thereof can be fixed to the photosensitive chip 1 by welding. Thus, the photosensitive chip 1 is suspended on the lower surface of the circuit board 12 .

There are a plurality of conductive bumps 16 , and the plurality of conductive bumps 16 are uniformly and spaced apart along the circumferential direction, so as to uniformly fix the photosensitive chip 1 .

In addition, the circuit board 12 is provided with an opening, and the protection component 5 may be provided in the opening, or may be provided on the circuit board 12 and cover the opening. Thus, the protection cavity 2 is defined between the photosensitive chip 1 , the circuit board 12 , the protection component 5 and the conductive bumps 16 .

Therefore, the protection chamber 2 can be a non-hermetic chamber.

Of course, the protection chamber 2 can also be a closed chamber. Specifically, a sealing layer 17 may be provided between the upper surface of the photosensitive chip 1 and the lower surface of the circuit board 12 , and the sealing layer 17 is stopped outside the plurality of conductive bumps 16 . Thus, the sealing layer 17 seals the protective chamber 2 to form a closed chamber.

The sealing layer 17 can also be any one or a combination of EMC, SMF, or underfill glue, which can be enclosed on the outer side of the plurality of conductive bumps 16 through a packaging process.

In addition, the sealing layer 17 can be in contact with the upper surface of the photosensitive chip 1 and the lower surface of the circuit board 12 and be adhered and fixed, thereby improving the fixing strength of the photosensitive chip 1 .

A pad 101 is formed on the upper surface of the photosensitive chip 1 , that is, the upper surface of the metal layer 1 a , and a conductive layer 8 is provided on the circuit board 12 . Specifically, the two ends of the conductive bump 16 are electrically connected to the pad 101 and the conductive layer 8 through physical contact. In addition, the support layer 9 is embedded with conductive pillars 7 , and the conductive pillars 7 are electrically connected to the conductive layer 8 . Specifically, the upper ends of the conductive pillars 7 contact the conductive layer 8 for electrical connection. The lower ends of the conductive pillars 7 are located outside the protection cavity 2 .

Thus, the bonding pads 101 , the conductive bumps 16 , the conductive layers 8 and the conductive pillars 7 form conductive paths.

Wherein, the lower end of the conductive column 7 forms the other end of the conductive path for connecting with an external circuit.

The lower ends of the conductive pillars 7 may penetrate through the support layer 9 . And the lower ends of the conductive pillars 7 may be flush with the lower surface of the support layer 9 ; or, the lower ends of the conductive pillars 7 may protrude from the lower surface of the support layer 9 .

Likewise, the conductive layer 8 may be formed by an RDL process or embedded in the circuit board 12 so that the conductive layer 8 forms part of the structure of the circuit board 12 itself. Specifically, the circuit board 12 may be a PCB, and the conductive layer 8 may be formed on the lower surface of the circuit board 12 by an RDL process, so as to realize the conductive connection with the bonding pads 101 through the conductive bumps 16 . In addition, by making the conductive layer 8 form a part of the structure of the circuit board 12 itself, the integration of the circuit structure can be realized, which is beneficial to the reduction of the volume.

The above is the embodiment in which the photosensitive chip 1 is fixed on the lower surface of the circuit board 12 through the conductive bumps 16 . Of course, in the case of no carrier, the manner in which the photosensitive chip 1 is fixed may not be limited to this. In other feasible embodiments, the photosensitive chip 1 can also be fixed by directly attaching and bonding the upper surface of the photosensitive chip 1 and the lower surface of the circuit board 12 .

Specifically, as shown in the embodiments shown in FIGS. 23 to 24 , a support layer 9 is provided on the outer side of the photosensitive chip 1 , and the upper end of the support layer 9 supports the circuit board 12 , and the upper surface of the photosensitive chip 1 is It is attached and fixed with the lower surface of the circuit board 12 .

Similarly, the circuit board 12 is provided with an opening, and the protection component 5 may be provided in the opening, or may be provided on the circuit board 12 and cover the opening.

However, it is worth noting that, since the upper surface of the photosensitive chip 1 is attached to the lower surface of the circuit board 12 . Therefore, in order to form the protection cavity 2 , the lower surface of the protection component 5 needs to be higher than the lower surface of the circuit board 12 .

Specifically, when the protective component 5 is embedded in the opening, the thickness of the protective component 5 may be smaller than the thickness of the circuit board 12 . In addition, the upper surface of the protection assembly 5 is disposed flush with the upper surface of the circuit board 12 . In this way, the lower surface of the guard assembly 5 will be higher than the lower surface of the circuit board 12 .

Alternatively, the thickness of the protective component 5 can be equal to or even greater than the thickness of the circuit board 12, and the protective component 5 is embedded in the opening, the upper surface of the protective component 5 is higher than the upper surface of the circuit board 12, and its lower surface is also higher than the upper surface of the circuit board 12. The lower surface of the circuit board 12 is sufficient.

Alternatively, the cross-sectional area of the protective component 5 is larger than the cross-sectional area of the opening, the protective component 5 is disposed on the upper surface of the circuit board 12 , and the edge of the protective component 5 overlaps the edge of the opening. Likewise, the lower surface of the protection assembly 5 can be made higher than the lower surface of the circuit board 12 .

Thus, a protection cavity 2 is defined between the photosensitive chip 1 , the circuit board 12 and the protection component 5 .

Likewise, the protection chamber 2 may be a non-sealed chamber or a non-sealed chamber. For a specific implementation manner, reference may be made to the above description, which is not repeated here.

Pads 101 are formed on the upper surface of the photosensitive chip 1 , that is, the upper surface of the metal layer 1 a , and the conductive layer 8 is formed on the lower surface of the circuit board 12 . A conductive column 7 is embedded in the support layer 9 , the conductive column 7 is electrically connected to the conductive layer 8 , and the lower end of the conductive column 7 is located outside the protection cavity 2 .

Thus, the bonding pads 101 , the conductive layers 8 and the conductive pillars 7 form conductive paths.

Similarly, the lower end of the conductive column 7 forms the other end of the conductive path for connecting with an external circuit.

The above is the case where the carrier is removed after the packaging of the photosensitive chip 1 is completed. Similarly, in this case, the specific preparation process or process of the identification component 100 is generally to first realize the packaging of the photosensitive chip 1 and the carrier through the CSP process, and then attach or assemble other corresponding components, and then Remove the carrier.

19 to 24, the manufacturing process of the identification component 100 shown in FIGS. 19 to 24 is different from the preparation process of the identification component 100 shown in FIGS. 15 to 18 in that the peripheral portion 11b of the encapsulation layer 11 covers the side surface of the photosensitive chip 1, That is, the peripheral portion 11 b of the encapsulation layer 11 is in contact with the side surface of the photosensitive chip 1 . The support layer 9 surrounds the outside of the photosensitive chip 1 , that is, the support layer 9 is not in contact with the side surface of the photosensitive chip 1 . And, after the bonding of the guard assembly 5 is completed, the carrier is removed. The other processes are roughly the same.

It should be noted that, in the description of the present invention, the terms "first", "second", etc. are only used for the purpose of description and to distinguish similar objects, and there is no sequence between the two, nor can they be construed as indicating or imply relative importance. Also, in the description of the present invention, unless otherwise specified, "plurality" means two or more.

It should be understood that the above description is for purposes of illustration and not limitation. From reading the above description, many embodiments and many applications beyond the examples provided will be apparent to those skilled in the art. The scope of the present teachings should, therefore, be determined not with reference to the above description, but should instead be determined with reference to the preceding claims, along with the full scope of equivalents to which such claims are entitled. The disclosures of all articles and references, including patent applications and publications, are incorporated herein by reference for the purpose of being comprehensive. The omission of any aspect of the subject matter disclosed herein in the preceding claims is not intended to disclaim such subject matter, nor should the applicant be considered as not considering such subject matter as part of the disclosed subject matter.

Claims (51)

1. An identification component for an off-screen optical fingerprint, the identification component for placement below a display screen; wherein the identification component comprises:

the light sensing chip is used for receiving target signal light reflected by a target organism above the display screen when the identification component is arranged below the display screen; the light sensing chip at least comprises a metal layer;

the protective assembly is positioned above the light sensing chip and provided with a light transmitting area, and the target signal light can reach the light sensing chip through the light transmitting area; a protection cavity for protecting the metal layer is formed below the protection component; the metal layer is accommodated in the protection cavity; or the light sensing chip forms part of the inner wall of the protection cavity;

and one end of the conductive path is electrically connected with the metal layer, and the other end of the conductive path is used for being connected with an external circuit.

2. The identification assembly for an off-screen optical fingerprint of claim 1 wherein the other end of the conductive path is exposed.

3. An identification assembly for an underscreen optical fingerprint as claimed in claim 1 or 2 wherein the other end of said conductive path is exposed or protrudes from the outer surface of said identification assembly.

4. The identification assembly for an underscreen optical fingerprint as claimed in claim 1 wherein another end of said conductive path is formed with a solder ball.

5. The identification assembly for an underscreen optical fingerprint as claimed in claim 1 wherein another end of said conductive path is located outside said protection cavity.

6. The identification assembly for an optical fingerprint under a screen of claim 1 wherein the shielding assembly is spaced apart from the light sensing chip.

7. An identification assembly for an underscreen optical fingerprint as claimed in claim 1 wherein said shield assembly is resistant to temperatures above 150 ℃.

8. An identification assembly for an off-screen optical fingerprint as recited in claim 1 wherein said shield assembly comprises an optical filter at least partially filtering noise light entrained in said target signal light.

9. An identification assembly for an underscreen optical fingerprint as claimed in claim 8 wherein said shield assembly further includes a light transmissive carrier for carrying said optical filter.

10. The identification assembly for an off-screen optical fingerprint of claim 9,

the optical filter is arranged on the upper surface of the light-transmitting carrier; or,

the optical filter is arranged on the lower surface of the light-transmitting carrier; either or both of the first and second substrates may be,

the optical filter is arranged in the light-transmitting carrier.

11. An identification assembly for an underscreen optical fingerprint as claimed in claim 9 wherein said light transmissive carrier is a cover glass or sapphire cover.

12. An identification assembly for an underscreen optical fingerprint according to claim 1 wherein said shield assembly is comprised of a light transmissive carrier.

13. The identification assembly for optical fingerprints as in claim 1, wherein the photo sensor chip is bonded to a carrier by a packaging process; the carrier body and the light sensing chip are continuously kept in a combined state after the light sensing chip is packaged.

14. The identification assembly for optical fingerprints as in claim 13, wherein the carrier is a substrate, the photo sensor chip is disposed on the substrate, a supporting wall is disposed on the substrate and is located outside the photo sensor chip, and an upper end of the supporting wall supports the protection assembly;

the protection cavity is defined among the base plate, the supporting wall and the protection component.

15. The identification assembly for an optical fingerprint under a screen of claim 14, wherein the light sensing chip further comprises a silicon layer, and the metal layer and the silicon layer are both received in the protection cavity.

16. An identification assembly for an underscreen optical fingerprint as claimed in claim 14 wherein said supporting wall is circumferentially continuous so that said protection cavity is a closed cavity.

17. An identification assembly for an underscreen optical fingerprint as claimed in claim 14 wherein said support wall is circumferentially discontinuous such that said protection cavity is a non-hermetic chamber.

18. The identification assembly for an optical fingerprint under a screen of claim 14 wherein the photo sensing chip has a pad formed thereon; the upper surface of the substrate is provided with an upper pin, and the lower surface of the substrate is provided with a lower pin which is in conductive communication with the upper pin; the welding pad is electrically connected with the upper pin through a lead;

the bonding pad, the lead, the upper pin and the lower pin form the conductive path.

19. The identification assembly for an optical fingerprint under a screen of claim 14 wherein the light sensing chip has embedded therein conductive posts; the upper surface of the substrate is provided with an upper pin, and the lower surface of the substrate is provided with a lower pin which is in conductive communication with the upper pin; the conductive column is in conductive connection with the upper pin;

the conductive posts, the upper pins and the lower pins form the conductive paths.

20. The identification assembly for an optical fingerprint under a screen of claim 14 wherein the photo sensing chip has a pad formed thereon; the outer side of the light sensing chip is provided with a conductive column, and the welding pad is in conductive connection with the conductive column through a conductive layer; the upper surface of the substrate is provided with an upper pin, and the lower surface of the substrate is provided with a lower pin which is in conductive communication with the upper pin; the conductive column is in conductive connection with the upper pin;

the bonding pad, the conductive layer, the conductive column, the upper pin and the lower pin form the conductive path.

21. An identification assembly for an underscreen optical fingerprint as claimed in claim 20 wherein a support layer is disposed between said light sensing chip and said support wall, said conductive posts being embedded in said support layer.

22. An identification assembly for an underscreen optical fingerprint as claimed in claim 21 wherein said support layer is spaced from said support wall.

23. The identification assembly for an optical fingerprint under a screen of claim 21 wherein the supporting layer wraps around the sides of the photo sensor chip.

24. The identification assembly for an optical fingerprint under a screen of claim 14 wherein the lower surface of the light sensing chip is provided with conductive bumps; the upper surface of the substrate is provided with an upper pin, and the lower surface of the substrate is provided with a lower pin which is in conductive communication with the upper pin; the conductive convex points are in conductive connection with the upper pins;

the conductive bump, the upper pin and the lower pin form the conductive path.

25. The identification assembly for optical fingerprint under screen of claim 14 wherein the carrier is a packaging layer, the packaging layer at least includes a peripheral portion covering the side of the light sensing chip; the peripheral edge part is provided with a supporting wall, and the upper end of the supporting wall props against the protection component;

the light sense chip, the supporting wall and the protection component define the protection cavity.

26. The identification assembly for an underscreen optical fingerprint as claimed in claim 25 wherein said encapsulation layer further includes a substrate portion encapsulating the bottom surface of said light sensing chip.

27. The identification assembly for an optical fingerprint under a screen of claim 26, wherein the light sensing chip is embedded with a conductive pillar, and a lower end of the conductive pillar is located outside the protection cavity;

the conductive posts form the conductive vias.

28. An identification assembly for an underscreen optical fingerprint as claimed in claim 27 wherein said conductive posts have lower ends extending through said substrate portion;

the lower end of the conductive post is flush with the lower surface of the substrate part; or,

the lower end of the conductive post protrudes out of the lower surface of the substrate portion.

29. The identification assembly for an optical fingerprint under a screen of claim 26, wherein the lower surface of the light sensing chip is provided with a conductive bump, and the lower end of the conductive bump is located outside the protection cavity;

the conductive bump forms the conductive via.

30. An identification assembly for an underscreen optical fingerprint as claimed in claim 29 wherein a lower end of said conductive bump extends through said substrate portion;

the lower end of the conductive bump is flush with the lower surface of the substrate part; or,

the lower end of the conductive bump protrudes out of the lower surface of the substrate portion.

31. The identification assembly for the optical fingerprint under the screen of any one of claims 24 and 29 to 30, wherein the light sensing chip further comprises a silicon layer, and the metal layer is positioned below the silicon layer.

32. The identification assembly for optical fingerprint under screen of claim 14 wherein the carrier is a packaging layer, the packaging layer at least includes a peripheral portion surrounding the light sensing chip; the peripheral part and the light sensation chip are spaced, and a supporting layer is filled between the side surface of the light sensation chip and the inner wall of the peripheral part; the peripheral edge part is provided with a supporting wall, and the upper end of the supporting wall props against the protection component;

the light sensation chip, the supporting layer, the supporting wall and the protection component define the protection cavity.

33. The assembly according to claim 32, wherein a pad is formed on the photo sensor chip, conductive posts are embedded in the supporting layer, the conductive posts are electrically connected to the pad through a conductive layer, and lower ends of the conductive posts are located outside the protection cavity;

the bonding pad, the conductive layer and the conductive pillar form the conductive path.

34. An identification assembly for an underscreen optical fingerprint as claimed in claim 33 wherein said lower ends of said conductive posts extend through said support layer;

the lower ends of the conductive columns are flush with the lower surface of the supporting layer; or,

the lower ends of the conductive columns protrude out of the lower surface of the supporting layer.

35. The identification assembly for optical fingerprint under screen of claim 14 wherein the carrier is a packaging layer, the packaging layer at least includes a peripheral portion covering the side of the light sensing chip; the upper end of the peripheral part supports against a circuit board, and the circuit board is provided with an opening; the shield assembly is disposed in the opening; or the protection component is arranged on the circuit board and covers the opening;

the light sense chip, the circuit board and the protection assembly define the protection cavity.

36. The identification assembly for an underscreen optical fingerprint as claimed in claim 35 wherein said encapsulation layer further includes a substrate portion encapsulating the bottom surface of said light sensing chip.

37. The assembly according to claim 35, wherein the light sensing chip has a pad formed thereon, the peripheral portion has a conductive post embedded therein, the circuit board has a conductive layer electrically connected to the conductive post, the conductive layer is electrically connected to the pad through a conductive bump, and a lower end of the conductive post is located outside the protection cavity;

the bonding pad, the conductive bump, the conductive layer and the conductive pillar form the conductive path.

38. An identification assembly for an off-screen optical fingerprint as defined in claim 37 wherein said conductive post has a lower end extending through said peripheral portion;

the lower end of the conductive post is flush with the lower surface of the peripheral part; or,

the lower end of the conductive post protrudes from the lower surface of the peripheral portion.

39. The identification assembly for optical fingerprints as in claim 1, wherein the photo sensor die is supported by a carrier during the packaging process; the carrier can be peeled off after the light sensing chip is packaged, so that the carrier is separated from the light sensing chip.

40. The identification assembly for the optical fingerprint under the screen of claim 1, wherein the light sensing chip is provided at an outer side thereof with a supporting layer spaced apart therefrom, a circuit board is supported at an upper end of the supporting layer, and the light sensing chip is fixed below the circuit board by a conductive bump; the circuit board is provided with an opening; the shield assembly is disposed in the opening; or the protection component is arranged on the circuit board and covers the opening;

the light sense chip, the circuit board, the protection assembly and the conductive protrusion define the protection cavity.

41. The assembly according to claim 40, wherein the plurality of conductive protrusions are fixedly connected to the circuit board at upper ends thereof and fixedly connected to the light sensing chip at lower ends thereof.

42. An identification assembly for an optical fingerprint under a screen as recited in claim 40 wherein a sealing layer is disposed between the upper surface of said light sensing chip and the lower surface of said circuit board, said sealing layer being stopped at the outside of said conductive bumps; the sealing layer seals the protection cavity to form a closed chamber.

43. An identification component for optical fingerprints as claimed in claim 40, wherein the light sensing chip is formed with a pad, and the circuit board is provided with a conductive layer; the welding pad is in conductive connection with the conductive layer through the conductive protrusion; conductive columns are embedded in the supporting layer and are electrically connected with the conductive layer, and the lower ends of the conductive columns are located outside the protection cavity;

the bonding pad, the conductive bump, the conductive layer and the conductive pillar form the conductive path.

44. An identification assembly for an off-screen optical fingerprint as claimed in claim 43 wherein said lower ends of said conductive posts extend through said support layer;

the lower ends of the conductive columns are flush with the lower surface of the supporting layer; or,

the lower ends of the conductive columns protrude out of the lower surface of the supporting layer.

45. An identification assembly for an underscreen optical fingerprint as claimed in claim 43 wherein said conductive layer is built into said wiring board, said conductive layer forming part of the structure of said wiring board itself.

46. The identification assembly for the optical fingerprint under the screen of claim 1, wherein the light sensing chip is provided at an outer side thereof with a supporting layer spaced apart from the light sensing chip, a circuit board is supported at an upper end of the supporting layer, and an upper surface of the light sensing chip is fixedly attached to a lower surface of the circuit board; the circuit board is provided with an opening; the shield assembly is disposed in the opening; or the protection component is arranged on the circuit board and covers the opening; the lower surface of the protection component is higher than the lower surface of the circuit board;

the light sense chip, the circuit board and the protection assembly define the protection cavity.

47. An identification assembly for an optical fingerprint under a screen as recited in claim 46 wherein said light sensing chip has a bonding pad formed on an upper surface thereof and a conductive layer formed on a lower surface thereof; the welding pad is contacted with the conductive layer; conductive columns are embedded in the supporting layer and are electrically connected with the conductive layer, and the lower ends of the conductive columns are located outside the protection cavity;

the bonding pad, the conductive layer and the conductive pillar form the conductive path.

48. The identification assembly for the optical fingerprint under the screen of any one of claims 18 to 23, 27 to 28 and 32 to 47, wherein the light sensing chip further comprises a silicon layer, and the metal layer is located above the silicon layer.

49. The identification assembly for an optical fingerprint under a screen of claim 1, wherein a light condensing member for condensing the target signal light is disposed in the protection cavity, and the light condensing member is located above the light sensing chip.

50. An identification assembly for an underscreen optical fingerprint as claimed in claim 49 wherein said light gathering member includes a plurality of micro lenses;

a plurality of the microlenses are arranged on the light sensing chip; or,

the micro lenses and the light sensing chip are spaced at intervals, and the spacing distance is equal to or close to the focal length of the micro lenses.

51. An electronic device, comprising:

a display screen;

an identification assembly for an off-screen optical fingerprint as claimed in any one of claims 1 to 50, said identification assembly being disposed below said display screen.