CN110198623A - Heat dissipation apparatus and electrical device - Google Patents

Abstract

The invention relates to the technical field of cooling and heat dissipation, in particular to heat dissipation equipment and an electrical device. The heat dissipation equipment comprises a bearing device and a heat dissipation fin group, wherein the heat dissipation fin group comprises at least two heat dissipation fins which are arranged on the first surface of the bearing device and are arranged at intervals, a diversion trench is formed between every two adjacent heat dissipation fins, the length direction of the diversion trench is parallel to the direction of the first surface, the diversion trench is used for guiding fluid carrying heat of a cooled target to flow along the length direction of the diversion trench, and the effective flow area of the diversion trench is reduced along the flow direction of the fluid. Based on this, can effectively improve the radiating effect of radiator.

Description

Cooling equipment and electrical installations

technical field

The invention relates to the technical field of cooling and heat dissipation, in particular to a heat dissipation device and an electrical device.

Background technique

With the rapid development of electronic technology, the calorific value of electronic components is increasing, the power density is getting higher and higher, and the heat dissipation performance requirements of heat dissipation equipment are getting higher and higher. However, the existing heat dissipation equipment still has the problem of poor heat dissipation effect, and it is difficult to meet the increasing demand for heat dissipation.

Contents of the invention

A technical problem to be solved by the present invention is to improve the heat dissipation effect of the heat dissipation equipment.

In order to solve the above technical problems, the present invention provides a cooling device, which includes:

carrying device; and

The heat dissipation device includes a heat dissipation fin group, the heat dissipation fin group includes at least two heat dissipation fins arranged on the first surface of the carrying device and arranged at intervals from each other, and the length direction between two adjacent heat dissipation fins is formed along the direction parallel to the first The direction of the diversion groove on the surface, the diversion groove is used to guide the fluid to flow along the length direction of the diversion groove, and the effective flow area of the diversion groove becomes smaller along the flow direction of the fluid.

In some embodiments, two adjacent cooling fins move closer to each other along the flow direction of the fluid, so that the effective flow area of the guide groove becomes smaller along the flow direction of the fluid; and/or, along the flow direction of the fluid direction, the arrangement density of the cooling fins becomes larger, so that the effective flow area of the guide groove becomes smaller along the flow direction of the fluid.

In some embodiments, along the flow direction of the fluid, the heat dissipation device has at least two heat dissipation zones distributed sequentially, and the arrangement density of the heat dissipation fins in the downstream heat dissipation zone is greater than that of the heat dissipation fins in the adjacent upstream heat dissipation zone Arrangement density.

In some embodiments, the arrangement density of the fins in the downstream cooling zone is at least 2 times the arrangement density of the cooling fins in the most upstream cooling zone.

In some embodiments, the at least two heat dissipation regions include a first heat dissipation region, a second heat dissipation region and a third heat dissipation region arranged in sequence along the flow direction of the fluid, and the rows of fins in the second heat dissipation region and the third heat dissipation region The arrangement density is respectively 2 times and 3 times of the arrangement density of the heat sink in the first heat dissipation zone.

In some embodiments, the minimum width of the diversion groove is greater than 3mm.

In some embodiments, the length direction of the guide groove is along the vertical direction.

In some embodiments, the heat dissipation device further includes a driving device for driving the fluid to flow along the length direction of the guide groove.

In some embodiments, the fluid includes air flow, and the driving device includes an air supply device, and the air supply device is used to drive the air flow to flow along the length direction of the guide slot.

In some embodiments, the blower device includes at least one of the following:

A blowing fan is arranged upstream of the diversion slot along the air flow direction;

The exhaust fan is arranged downstream of the diversion groove along the air flow direction;

The blower is arranged upstream of the diversion groove along the flow direction of the airflow;

The exhaust fan is arranged downstream of the diversion slot along the flow direction of the airflow.

In some embodiments, the heat dissipation device further includes a cover, and the cover is disposed on a side of the heat sink set away from the first surface.

In some embodiments, a dimension h of the heat sink along a direction perpendicular to the first surface is greater than or equal to 10 mm.

In some embodiments, the carrying device has an accommodating cavity inside, and the accommodating cavity is used for accommodating the object to be cooled by the cooling device, and the outer surface of the accommodating cavity includes a first surface.

In some embodiments, the heat sink group is integrally formed with the carrying device.

Another aspect of the present invention also provides an electrical device, which includes electronic components and the heat dissipation device of the present invention, and the electronic components are cooling targets and are arranged on the carrying device of the heat dissipation device.

In some embodiments, the electrical device includes an air conditioner.

By configuring the guide groove of the heat dissipation device so that the effective flow area becomes smaller along the fluid flow direction, the invention can effectively improve the heat dissipation effect of the heat dissipation device.

Other features of the present invention and advantages thereof will become apparent through the following detailed description of exemplary embodiments of the present invention with reference to the accompanying drawings.

Description of drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings that need to be used in the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description are only These are some embodiments of the present invention. For those skilled in the art, other drawings can also be obtained according to these drawings without any creative effort.

FIG. 1 shows a schematic perspective view of the three-dimensional structure of a heat dissipation device according to a first embodiment of the present invention.

FIG. 2 shows an exploded view of FIG. 1 .

FIG. 3 shows a front view of the first board body and heat sink assembly in FIG. 2 .

FIG. 4 shows a bottom view of FIG. 3 .

FIG. 5 shows a schematic perspective view of the three-dimensional structure of the cover in FIG. 2 .

FIG. 6 shows a comparison diagram of experimental results between the heat dissipation device shown in FIG. 1 and the traditional heat dissipation device.

Fig. 7 shows an exploded view of a heat dissipation device according to a second embodiment of the present invention.

Fig. 8 shows a schematic perspective view of the three-dimensional structure of the heat dissipation device according to the third embodiment of the present invention.

FIG. 9 shows an exploded view of FIG. 8 .

Fig. 10 shows a schematic structural diagram of a heat dissipation device according to a fourth embodiment of the present invention.

FIG. 11 shows a schematic structural diagram of a heat dissipation device according to a fifth embodiment of the present invention.

In the picture:

100. Heat dissipation equipment;

1. Carrying device; 11. The first board; 12. The second board; 13. The third board; 14. The fourth board;

2. Heat dissipation device; 21. Heat sink; 22. Cover body; 221. Accommodating hole; 222. First connection hole; 223. Second connection hole; 231. Exhaust fan; 232. Blowing fan; 241. Exhaust fan; 242: hair dryer;

3. Screws;

a, airflow; 11a, first surface; 2a, diversion groove;

Z1, the first heat dissipation zone; Z2, the second heat dissipation zone; Z3, the third heat dissipation zone.

Detailed ways

The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. The following description of at least one exemplary embodiment is merely illustrative in nature and in no way taken as limiting the invention, its application or uses. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative work fall within the protection scope of the present invention.

Techniques, methods and devices known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, such techniques, methods and devices should be considered part of the Authorized Specification.

In the description of the present invention, it should be understood that orientation words such as "front, back, up, down, left, right", "horizontal, vertical, vertical, horizontal" and "top, bottom" etc. indicate the orientation Or positional relationship is generally based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description. In the absence of a contrary description, these orientation words do not indicate or imply the device or element referred to. It must have a specific orientation or be constructed and operated in a specific orientation, so it should not be construed as limiting the protection scope of the present invention; the orientation words "inner and outer" refer to the inner and outer relative to the outline of each component itself.

In the description of the present invention, it should be understood that the use of words such as "first" and "second" to define parts is only for the convenience of distinguishing corresponding parts. Therefore, it should not be construed as limiting the protection scope of the present invention.

In addition, the technical features involved in the different embodiments of the present invention described below may be combined with each other as long as there is no conflict with each other.

In the process of practicing the present invention, the inventors have found that in the existing heat dissipation equipment for cooling cooled objects such as electronic components, the flow guide grooves used to guide the flow of fluid (thermal fluid) carrying heat are usually equal in size. cross-section, and the heat sinks are usually arranged laterally (arranged along the horizontal direction), which restricts the improvement of the heat dissipation effect.

In view of the above situation, the present invention improves the structure of the heat dissipation device to improve the heat dissipation effect and improve the working safety of the cooled object.

1-11 show several embodiments of the heat dissipation device of the present invention. Referring to Figures 1-11, the heat dissipation device 100 provided by the present invention includes:

carrying means 1; and

The heat dissipation device 2 includes a heat dissipation fin group, the heat dissipation fin group includes at least two heat dissipation fins 21 arranged on the first surface 11a of the carrier device 1 and arranged at intervals from each other, and a longitudinal direction along the length direction is formed between two adjacent heat dissipation fins 21. Along the direction of the diversion groove 2a parallel to the first surface 11a, the diversion groove 2a is used to guide the fluid to flow along the length direction of the diversion groove 2a, and the effective flow area of the diversion groove 2a is along the flow direction of the fluid get smaller.

Different from the existing solution of equal cross-section of the diversion groove 2a, the present invention sets the diversion groove 2a to have a variable cross-section, and is specifically configured so that the effective flow area becomes smaller along the fluid flow direction, which can effectively increase the heat exchange area , and at the same time, it is also beneficial to increase the flow velocity of the fluid in the diversion groove 2a, therefore, the heat exchange performance of the heat dissipation device 100 can be effectively improved, and the heat exchange effect of the heat dissipation device 100 can be improved.

In the present invention, the effective flow area of the flow guide groove 2a refers to the area of the flow guide groove 2a that the fluid actually flows through. Generally, when the flow guide groove 2a has a regular cross section, the effective flow area of the flow guide groove 2a is the cross-sectional area of the diversion groove 2a, and when the diversion groove 2a has an irregular cross-section, the effective flow area of the diversion groove 2a is the equivalent cross-sectional area of the diversion groove 2a.

Among them, various means can be adopted to reduce the effective flow area of the guide groove 2a along the flow direction of the fluid.

For example, two adjacent cooling fins 21 may be arranged to be close to each other along the flow direction of the fluid. In this case, since each cooling fin 21 is arranged obliquely, and the distance between two adjacent cooling fins 21 (that is, the width of the flow guide groove 2a) gradually decreases along the direction of fluid flow, therefore, the flow guide groove 2a It gradually narrows along the direction of fluid flow, and the effective flow area of the guide groove 2a gradually becomes smaller along the direction of fluid flow.

For another example, the cooling fin group may be arranged such that the arrangement density of the cooling fins 21 increases along the flow direction of the fluid. In this way, by changing the arrangement density of the cooling fins 21, the cooling fins 21 are gradually denser along the fluid flow direction, and the width of the flow guide groove 2a is gradually reduced, so that the effective flow area of the flow guide groove 2a is gradually reduced.

For another example, the thickness of the heat sink 21 can also be changed so that the thickness of the heat sink 21 becomes thicker along the fluid flow direction, thereby reducing the width of the flow guide groove 2a, thereby reducing the effective flow area of the flow guide groove 2a.

The above-mentioned three ways, no matter by obliquely arranging the heat sink 21, or by increasing the density of the heat sink 21, or by increasing the thickness of the heat sink 21, all reduce the width of the flow guide groove 2a by narrowing the width of the flow guide groove 2a. The effective flow area of the launder 2a.

It should be understood that two or three of the above three ways can also be combined, that is, it is also possible to adopt at least two of the three ways of arranging the heat sink 21 obliquely, increasing the density of the heat sink 21 and increasing the thickness of the heat sink 21. To narrow the width of the diversion groove 2a and reduce the effective flow area of the diversion groove 2a.

Moreover, it should be noted that, in addition to reducing the width of the flow guide groove 2a along the fluid flow direction to achieve the purpose of reducing the effective flow area of the flow guide groove 2a, it is also possible to reduce the depth of the flow guide groove 2a Reduce along the direction of fluid flow and other means to reduce the effective flow area of the guide groove 2a along the direction of fluid flow.

In order to further improve the heat dissipation effect of the heat dissipation device 100, in some embodiments of the present invention, not only the diversion groove 2a is set to have a variable cross-section, but also the arrangement direction of the heat dissipation fins 21 is changed from horizontal to vertical. The arrangement direction of the sheet 21 makes the length direction of the diversion groove 2a no longer along the horizontal direction, but along the vertical direction. Since this can better adapt to the characteristics of the thermal fluid floating up, it can make full use of the thermal fluid floating up. The principle is to improve the heat transfer performance and improve the heat transfer effect.

In addition, the heat dissipation device 2 of the present invention may further include a driving device, which is used to drive the fluid to flow along the length direction of the guide groove 2a. Based on the set driving device, the heat dissipation mode of the heat dissipation device 2 is changed from natural convection heat dissipation to forced convection heat dissipation, which can better meet the higher heat dissipation requirements of the cooled target, especially through the diversion groove 2a with variable cross-section Cooperating, the driving device can more effectively accelerate the flow velocity of the fluid in the guide groove 2a, and draw the fluid out more efficiently, so the heat dissipation effect can be further improved.

Both airflow and liquid can be used as the fluid for cooling the object to be cooled. Wherein, when the fluid includes airflow, the driving device may include an air blower for driving the airflow along the length direction of the guide slot 2a. Moreover, in the present invention, the air supply device may include a fan and/or a fan, wherein the fan may include at least one of a blower and an exhaust fan, and the fan may also include at least one of a blowing fan and an exhaust fan.

The present invention will be further described below in conjunction with various embodiments shown in FIGS. 1-11 . The arrows in Figures 1-11 are all used to show the flow direction of the airflow a.

1-6 show a first embodiment of the invention.

As shown in Figures 1-6, in this embodiment, the heat dissipation device 100 includes a carrying device 1 and a heat dissipation device 2, the carrying device 1 is used to carry the heat dissipation device 2 and the object to be cooled, and is used to realize the object to be cooled and the heat dissipation device 2 The heat conduction between them; the heat dissipation device 2 is arranged on the carrier device 1, and is used for cooling and dissipating heat from the object to be cooled.

For convenience of description, the surface of the carrying device 1 on which the heat sink 2 is provided is referred to as the first surface 11a.

Wherein, it can be seen from 2 that the carrying device 1 of this embodiment is a hollow box structure, and there is an accommodating cavity for accommodating the object to be cooled inside, and the heat sink 2 is arranged on the outer surface of the accommodating cavity, so that During operation, the carrying device 1 can transfer the heat of the object to be cooled to the cooling device 2 through its box wall. It can be understood that, in this embodiment, the outer surface of the accommodating cavity includes the first surface 11a.

Specifically, as shown in FIG. 2 , in this embodiment, the carrying device 1 includes a first board 11 , a second board 12 , a third board 13 and a fourth board 14 , and these four boards enclose Form a hollow cuboid shape, wherein, the third plate body 13 and the fourth plate body 14 are located in the vertical direction and arranged in sequence along the direction of gravity at intervals from each other, and the first plate body 11 and the second plate body 12 are then connected to the first plate body 11 and the second plate body 12 Between the third plate body 13 and the fourth plate body 14, side surfaces of a cuboid are formed. More specifically, the first plate body 11 is U-shaped and has an upper opening, a lower opening and a side opening, and the second plate body 12, third plate body 13 and fourth plate body 14 are all in the shape of a flat plate and are snapped together respectively. On the upper opening, the lower opening and the side opening of the first plate body 11 , the supporting device 1 is formed into a hollow and sealed rectangular parallelepiped box structure. The object to be cooled is placed in the carrying device 1 , located on the fourth board 14 , and carried by the fourth board 14 .

Wherein, the second plate body 12 , the third plate body 13 and the fourth plate body 14 can be connected to the first plate body 11 through connecting members such as screws 3 shown in FIG. 2 . The entire carrying device 1 can be made of aluminum or other high thermal conductivity materials to improve heat transfer efficiency.

The heat dissipation device 2 is arranged on the supporting device 1, and is specifically located on the outer surface of the first board body 11 opposite to the second board body 12, in other words, the outer surface of the first board body 11 opposite to the second board body 12 The surface is the first surface 11a.

As shown in FIGS. 1-5 , in this embodiment, the cooling device 2 is arranged vertically and includes a cooling fin set, a cover body 22 and an exhaust fan 231 .

Wherein, the cooling fin group includes a plurality of cooling fins 21, and the plurality of cooling fins 21 are vertically arranged on the first surface 11a, that is, the length direction of the cooling fins 21 is along the vertical direction, and between each cooling fin 21 Spaced apart from each other, so that the air guide groove 2a is formed between adjacent cooling fins 21, and the length direction of the air guide groove 2a is along the vertical direction, like this, the air guide groove 2a can guide the airflow a for cooling the cooled target along the flow vertically.

Due to the low density of thermal air flow, it will float upward under the effect of buoyancy. Therefore, the existing horizontally arranged cooling fins 21 cannot actually adapt to the characteristics of thermal air flow rising, and will block the floating thermal air flow, resulting in an impact In this embodiment, the arrangement of the cooling fins 21 is changed from a horizontal arrangement to a longitudinal arrangement. Since the length direction of the guide groove 2a can be made to conform to the upward direction of the hot air flow, and the discharge speed of the hot air flow can be accelerated, it can fully The heat dissipation performance of the heat dissipation device 100 is utilized to effectively improve the heat dissipation effect.

Wherein, the heat sink group and the carrying device 1 can be a split structure and assembled together through a connection structure, or the heat sink group and the carrying device 1 can also be integrally formed by extrusion, casting, machining, etc., so that the heat sink group It is integrated with the carrying device 1 to further improve the strength and simplify the assembly steps of the heat dissipation device 100 .

2 and 3, it can be seen that in this embodiment, along the direction from bottom to top (also the flow direction of airflow a), the arrangement density of fins 21 in the fin group gradually increases, and according to the arrangement The different distribution densities are specifically divided into three sections that are gradually denser from bottom to top, so that the heat sink 2 has three heat dissipation areas that are distributed sequentially from bottom to top. The cooling zone Z2 and the third cooling zone Z3. Wherein, the arrangement density of the heat dissipation fins 21 in the second heat dissipation zone Z2 and the third heat dissipation zone Z3 is twice and three times that of the heat dissipation fins 21 in the first heat dissipation zone Z1 respectively. Based on this setting, it can be seen from FIG. 3 that along the direction from bottom to top, the width of the flow guide groove 2a (the distance between two adjacent cooling fins 21, in FIG. 3 is the size of the flow guide groove 2a along the left and right direction) Gradually narrowing, the effective flow area of the diversion groove 2a gradually becomes smaller, because this can increase the heat transfer area, and at the same time help to increase the convective heat transfer coefficient and heat transfer temperature difference, so the heat dissipation effect can be effectively improved, making the heat dissipation The device 100 can more efficiently and reliably control the temperature of the cooled target within a reasonable range, prevent the cooled target from thermal failure due to excessive temperature rise, effectively improve the performance of the cooled target, and prolong the life of the cooled target.

Since the arrangement density of the fins 21 in the second heat dissipation zone Z2 and the third heat dissipation zone Z3 is 2 times and 3 times of the arrangement density of the heat dissipation fins 21 in the first heat dissipation zone Z1, respectively, the conduction density in the second heat dissipation zone Z2 The width D2 of the flow channel 2a and the width D3 of the flow guide channel 2a in the third heat dissipation zone Z3 are respectively 1/2 and 1/3 of the width D1 of the flow guide channel 2a in the first heat dissipation zone Z1, that is, D1, D2 and D3 The relationship between is: D3<D2<D1, and Wherein, in order to improve the heat dissipation effect more effectively, the minimum width of the flow guide groove 2a can be set to be greater than 3mm, specifically in this embodiment, that is, the width D3 of the flow guide groove 2a in the third heat dissipation zone Z3 can be set to be greater than 3mm, that is, D3>3mm.

In addition, as shown in FIG. 4 , the dimension h of the heat sink 21 along the direction perpendicular to the first surface 11 a is greater than or equal to 10 mm, that is, h≥10 mm, so as to further improve the heat dissipation effect.

The cover body 22 is arranged on the side of the heat sink set away from the first surface 11a, and closes the notch of the guide groove 2a on the side away from the first surface 11a to form a flow channel for the airflow a to flow. By setting the cover body 22, it can cooperate with the cooling fin group to better guide the airflow a to flow along the length direction of the guide groove 2a, and the cover body 22 can also protect the cooling fins 21 in the cooling fin group , to prevent the heat sink 21 from being knocked, squeezed and impacted.

The exhaust fan 231 is arranged on the top of the cover body 22, which makes the exhaust fan 231 located at the downstream of the flow guide groove 2a along the flow direction of the airflow a, so that in the working process, the exhaust fan 231 can suck the hot air in the flow guide groove 2a , to accelerate the discharge of the hot air flow, so that the cooling device 100 adopts a forced convection heat exchange method to cool the object to be cooled. It can be seen that the exhaust fan 231 in this embodiment is used as an air blowing device for driving the airflow a to flow in the guide slot 2a.

Specifically, referring to Fig. 1, Fig. 2 and Fig. 5, it can be seen that the cover body 22 is a sheet metal part with a cross-section in the shape of a "several", and a plurality of accommodating holes 221 and a plurality of first connecting holes 222 are arranged on the top thereof, In addition, a plurality of second connection holes 223 are provided on the two horizontally extending bending sides of the "Ji" shape, wherein the cover body 22 is fixed to the second connection holes 223 through the cooperation of screws 3 and other connecting parts. On the first surface 11a, each accommodating hole 221 accommodates an exhaust fan 231 respectively, and the exhaust fan 231 is fixed on the top of the cover body 22 through the cooperation of the first connecting hole 222 with the screw 3 and other connectors.

When the heat dissipation device 100 of this embodiment is in operation, the heat of the object to be cooled inside the carrying device 1 is conducted to the heat sink 21 through the carrying device 1, and is dissipated to the outside of the carrying device 1 through the heat sink 21. The airflow a) for cooling the heat of the target is less dense and floats up under the influence of the buoyancy effect. Therefore, the hot airflow flows along the vertically extending flow guide groove 2a, and under the suction action of the exhaust fan 231, it passes through the accommodating hole 221 quickly. discharge.

During the flow of the above-mentioned hot air flow along the flow guide groove 2a, due to the flow direction of the hot air flow (that is, along the direction from bottom to top), the cooling fins 21 are changed from sparse to dense, and the flow guide groove 2a is tapered, so , the heat exchange area A gradually increases, the flow velocity of the airflow a gradually accelerates, and the convective heat transfer coefficient h gradually increases. In particular, the tapered diversion groove 2a also cooperates with the exhaust fan 231, so that the suction effect of the exhaust fan 231 is gradually strengthened , this can not only further speed up the flow velocity of the hot air in the diversion groove 2a, so that the convective heat transfer coefficient h can be further increased, but at the same time, because the hot air can be drawn out more quickly in this case, it can also compensate for the hot air floating up The characteristic that the heat transfer temperature difference ΔT gradually decreases during the process makes the reduction of the heat transfer temperature difference ΔT smaller during the rising process of the hot air flow, and even makes the heat transfer temperature difference ΔT increase during the rising process of the hot air flow, while According to Newton’s cooling formula Q=h×A×ΔT, it can be known that when any one of the heat transfer area A, convective heat transfer coefficient h and heat transfer temperature difference ΔT is increased, the heat transfer amount Q can be increased. Therefore, this implementation In the heat dissipation device 100 of the example, due to the cooperation of the exhaust fan 231 and the vertically arranged and tapered diversion groove 2a, the heat transfer area A, the convective heat transfer coefficient h and the heat transfer temperature difference ΔT are all increased. Therefore, it can Significantly improve the heat transfer performance, improve the heat dissipation effect, and more efficiently and reliably prevent the thermal failure of the cooled target due to excessive temperature.

Specifically, as shown in FIG. 6 , through experimental tests, the heat dissipation device 100 of this embodiment can greatly reduce the temperature of the object to be cooled compared with the traditional heat dissipation device, and the improvement effect is obvious. In Figure 6, the abscissa is dimensionless height refers to the ratio between the center of gravity height H2 of the cooling device 100 and the total height H1, that is,

It can be seen that in the first embodiment, the vertically arranged tapered diversion grooves 2a can not only make full use of the characteristics of the hot air flow rising up, but also can match and cooperate with the air supply characteristics of the air supply devices such as the exhaust fan 231, effectively enhancing the forced convection The adequacy of heat exchange optimizes the heat dissipation performance of the heat dissipation device 100 and improves the heat dissipation effect of the heat dissipation device 100 .

In addition to the first embodiment shown in Figs. 1-6, the present invention also provides other embodiments as shown in Figs. 7-11. In order to simplify the description, when describing the embodiment shown in FIGS. 7-11 , only the differences from the first embodiment will be focused on, and the similarities will not be described in detail.

Among them, Fig. 7 shows the second embodiment. As shown in Figure 7, the main difference between this second embodiment and the aforementioned first embodiment is that, along the flow direction of the airflow a, according to the difference in arrangement density of the cooling fins 21, the cooling device 2 no longer has three cooling zones , but only has two heat dissipation zones, namely the first heat dissipation zone Z1 and the second heat dissipation zone Z2, wherein the arrangement density of the second heat dissipation zone Z2 is twice that of the first heat dissipation zone Z1.

It should be understood that the number of heat dissipation zones is not limited to two or three, but may be more than three, and the heat dissipation zone located downstream of the first heat dissipation zone Z1 (that is, the most upstream heat dissipation zone) The arrangement density is not limited to be 2 times or 3 times that of the first heat dissipation zone Z1. In fact, the arrangement density of the heat dissipation fins 21 in the downstream heat dissipation zone can be 21 rows of heat dissipation fins in the most upstream heat dissipation zone. At least 2 times the cloth density.

8 and 9 show a third embodiment. As shown in Figures 8 and 9, the main difference between the third embodiment and the aforementioned first embodiment is that in the third embodiment, the air supply device no longer uses the exhaust fan 231, but uses a blower fan 232, and the blowing fan 232 is arranged upstream of the flow guide groove 2a (ie, the lower end of the flow guide groove 2a) along the flow direction of the airflow a. Based on this, the hot air flows upward along the guide groove 2 a under the blowing effect of the blowing fan 232 .

In the present invention, the air blower can also be a fan in addition to fans such as the blowing fan 232 or the exhaust fan 231 . Fig. 10 and Fig. 11 respectively show the embodiments using fans.

Wherein, in the fourth embodiment shown in FIG. 10 , the air supply device adopts an exhaust fan 241, and the exhaust fan 241 is arranged downstream of the flow guide groove 2a (ie, the upper end of the flow guide groove 2a) along the flow direction of the airflow a, The airflow a is driven to flow from bottom to top in the guide groove 2a by suction; and in the fifth embodiment shown in FIG. Upstream of the flow guide groove 2a (ie, the lower end of the flow guide groove 2a), the airflow a is driven to flow from bottom to top in the flow guide groove 2a by blowing.

It should be noted that although in each embodiment shown in FIGS. In an embodiment, the air supply device may also include a combination of two or more of the blower fan 232, the exhaust fan 231, the blower 242, and the exhaust fan 241. and blowing fan 232, or arrange exhaust fan 241 and blower 242 respectively, again for example, also can arrange exhaust fan 231 and blower 242 respectively at the upper and lower ends of flow guide groove 2a, perhaps, arrange exhaust blower 241 and blower fan 232 respectively.

In addition, although in the embodiments shown in FIGS. 1-11 , the carrying device 1 is in the shape of a cuboid, in other embodiments, the carrying device 1 may also be in other shapes such as a cylinder.

Based on the above, it can be known that the present invention can improve the heat exchange performance of the heat dissipation device 100 by providing vertically arranged tapered flow guide grooves and cooperating with the driving device. Applying the heat dissipation device 100 of the present invention to electrical devices such as converters and air conditioners to dissipate heat from electronic components can efficiently and reliably control the operating temperature of the electrical device within a reasonable range, reducing the risk of damage to the electrical device due to excessive temperature. Risk of thermal failure. Therefore, the present invention also provides an electrical device. Wherein, the electrical device includes the heat dissipation device 100 of the present invention and electronic components used as cooling targets, and the electronic components are arranged on the carrying device 1 of the heat dissipation device 100 . Specifically, the electronic components can be arranged in the accommodating cavity inside the carrying device 1 .

The above descriptions are only exemplary embodiments of the present invention, and are not intended to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention shall be included in the protection of the present invention. within range.

Claims (16)

1. A cooling device (100), characterized in that it comprises: carrying means (1); and The heat dissipation device (2) includes a heat dissipation fin group, the heat dissipation fin group includes at least two heat dissipation fins (21) arranged on the first surface (11a) of the carrying device (1) and arranged at intervals from each other, adjacent to each other A flow guide groove (2a) whose length direction is parallel to the first surface (11a) is formed between the two heat sinks (21), and the flow guide groove (2a) is used to guide the fluid along the The fluid flows along the length direction of the flow guide groove (2a), and the effective flow area of the flow guide groove (2a) becomes smaller along the flow direction of the fluid. 2. The cooling device (100) according to claim 1, characterized in that two adjacent cooling fins (21) move closer to each other along the flow direction of the fluid, so that the guide groove ( 2a) The effective flow area becomes smaller along the flow direction of the fluid; and/or, along the flow direction of the fluid, the arrangement density of the fins (21) becomes larger, so that the guide The effective flow area of the flow groove (2a) becomes smaller along the flow direction of the fluid. 3. The heat dissipation device (100) according to claim 2, characterized in that, along the flow direction of the fluid, the heat dissipation device (2) has at least two heat dissipation areas distributed in sequence, and the one located downstream The arrangement density of the heat dissipation fins (21) in the heat dissipation area is greater than the arrangement density of the heat dissipation fins (21) in the adjacent upstream heat dissipation area. 4. The heat dissipation device (100) according to claim 3, characterized in that the arrangement density of the heat dissipation fins (21) in the downstream heat dissipation zone is the same as the arrangement density of the heat dissipation fins (21) in the most upstream heat dissipation zone at least 2 times. 5. The heat dissipation device (100) according to claim 4, characterized in that, the at least two heat dissipation zones include a first heat dissipation zone (Z1) and a second heat dissipation zone arranged in sequence along the flow direction of the fluid. (Z2) and the third heat dissipation zone (Z3), the arrangement density of the cooling fins (21) in the second heat dissipation zone (Z2) and the third heat dissipation zone (Z3) is respectively the first heat dissipation zone ( 2 times and 3 times the arrangement density of the cooling fins (21) in Z1). 6. The heat dissipation device (100) according to Claim 1, characterized in that, the minimum width of the guide groove (2a) is greater than 3mm. 7. The heat dissipation device (100) according to any one of claims 1-6, characterized in that, the length direction of the guide groove (2a) is along the vertical direction. 8. The heat dissipation device (100) according to any one of claims 1-6, characterized in that, the heat dissipation device (2) further comprises a driving device for driving the fluid along the guide Flow in the length direction of the launder (2a). 9. The heat dissipation device (100) according to claim 9, characterized in that, the fluid includes air flow, and the driving device includes an air supply device, and the air supply device is used to drive the air flow along the guide groove (2a) flows in the length direction. 10. The heat dissipation device (100) according to claim 9, characterized in that the air supply device comprises at least one of the following: A blowing fan (232), arranged upstream of the guide groove (2a) along the air flow direction; An exhaust fan (231), arranged downstream of the guide groove (2a) along the air flow direction; A blower (242), arranged upstream of the guide groove (2a) along the flow direction of the air flow; The exhaust fan (241) is arranged downstream of the guide slot (2a) along the flow direction of the airflow. 11. The heat dissipation device (100) according to any one of claims 1-6, characterized in that, the heat dissipation device (2) further comprises a cover (22), and the cover (22) is arranged on the The side of the fin group away from the first surface (11a). 12. The heat dissipation device (100) according to any one of claims 1-6, characterized in that, the dimension h of the heat dissipation fin (21) along the direction perpendicular to the first surface (11a) is greater than or equal to 10mm . 13. The heat dissipation device (100) according to any one of claims 1-6, characterized in that, the carrying device (1) has an accommodating cavity inside, and the accommodating cavity is used to accommodate the heat dissipating device (2) A cooled object to be cooled, the outer surface of the accommodating cavity includes the first surface (11a). 14. The heat dissipation device (100) according to any one of claims 1-6, characterized in that, the heat dissipation fin group is integrally formed with the carrying device (1). 15. An electrical device, comprising electronic components, characterized in that it further comprises the heat dissipation device (100) according to any one of claims 1-14, the electronic components are the objects to be cooled and are arranged in the heat dissipation on the carrying device (1) of the device (100). 16. The electrical device of claim 15, wherein the electrical device comprises an air conditioner.