CN110172170A - 一种聚酰亚胺与石墨烯复合膜的制造方法 - Google Patents
一种聚酰亚胺与石墨烯复合膜的制造方法 Download PDFInfo
- Publication number
- CN110172170A CN110172170A CN201910503454.3A CN201910503454A CN110172170A CN 110172170 A CN110172170 A CN 110172170A CN 201910503454 A CN201910503454 A CN 201910503454A CN 110172170 A CN110172170 A CN 110172170A
- Authority
- CN
- China
- Prior art keywords
- polyimides
- graphene
- manufacturing
- composite film
- dianhydride
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 title claims abstract description 36
- 229910021389 graphene Inorganic materials 0.000 title claims abstract description 35
- 229920001721 polyimide Polymers 0.000 title claims abstract description 31
- 239000004642 Polyimide Substances 0.000 title claims abstract description 30
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 21
- 239000002131 composite material Substances 0.000 title claims abstract description 17
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 claims abstract description 12
- 239000000463 material Substances 0.000 claims abstract description 11
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 claims abstract description 10
- 238000000034 method Methods 0.000 claims abstract description 10
- 229920005575 poly(amic acid) Polymers 0.000 claims abstract description 10
- 239000003822 epoxy resin Substances 0.000 claims abstract description 9
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 9
- 150000004985 diamines Chemical class 0.000 claims abstract description 8
- 239000002904 solvent Substances 0.000 claims abstract description 6
- 238000006116 polymerization reaction Methods 0.000 claims abstract description 4
- 238000006243 chemical reaction Methods 0.000 claims abstract description 3
- 239000004952 Polyamide Substances 0.000 claims description 5
- ANSXAPJVJOKRDJ-UHFFFAOYSA-N furo[3,4-f][2]benzofuran-1,3,5,7-tetrone Chemical compound C1=C2C(=O)OC(=O)C2=CC2=C1C(=O)OC2=O ANSXAPJVJOKRDJ-UHFFFAOYSA-N 0.000 claims description 5
- 229920002647 polyamide Polymers 0.000 claims description 5
- 238000004321 preservation Methods 0.000 claims description 5
- 150000001412 amines Chemical class 0.000 claims description 3
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 claims description 2
- 238000003490 calendering Methods 0.000 claims description 2
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 claims 3
- 150000002466 imines Chemical class 0.000 claims 2
- CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical compound NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 claims 1
- JVERADGGGBYHNP-UHFFFAOYSA-N 5-phenylbenzene-1,2,3,4-tetracarboxylic acid Chemical compound OC(=O)C1=C(C(O)=O)C(C(=O)O)=CC(C=2C=CC=CC=2)=C1C(O)=O JVERADGGGBYHNP-UHFFFAOYSA-N 0.000 claims 1
- 206010054949 Metaplasia Diseases 0.000 claims 1
- 229940113088 dimethylacetamide Drugs 0.000 claims 1
- 230000015689 metaplastic ossification Effects 0.000 claims 1
- 229910001220 stainless steel Inorganic materials 0.000 claims 1
- 239000010935 stainless steel Substances 0.000 claims 1
- 239000005341 toughened glass Substances 0.000 claims 1
- 238000011065 in-situ storage Methods 0.000 abstract description 3
- 239000010408 film Substances 0.000 description 16
- HLBLWEWZXPIGSM-UHFFFAOYSA-N 4-Aminophenyl ether Chemical compound C1=CC(N)=CC=C1OC1=CC=C(N)C=C1 HLBLWEWZXPIGSM-UHFFFAOYSA-N 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 239000002861 polymer material Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- OHLUUHNLEMFGTQ-UHFFFAOYSA-N N-methylacetamide Chemical compound CNC(C)=O OHLUUHNLEMFGTQ-UHFFFAOYSA-N 0.000 description 1
- 240000007594 Oryza sativa Species 0.000 description 1
- 235000007164 Oryza sativa Nutrition 0.000 description 1
- 150000001413 amino acids Chemical class 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 229920006231 aramid fiber Polymers 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 230000009194 climbing Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 230000009970 fire resistant effect Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 125000005462 imide group Chemical group 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000002086 nanomaterial Substances 0.000 description 1
- 239000002105 nanoparticle Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 229920000620 organic polymer Polymers 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 235000009566 rice Nutrition 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
- B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/08—Interconnection of layers by mechanical means
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1003—Preparatory processes
- C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
- C08G73/1071—Wholly aromatic polyimides containing oxygen in the form of ether bonds in the main chain
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
- C08K3/042—Graphene or derivatives, e.g. graphene oxides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2250/00—Layers arrangement
- B32B2250/24—All layers being polymeric
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2250/00—Layers arrangement
- B32B2250/40—Symmetrical or sandwich layers, e.g. ABA, ABCBA, ABCCBA
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/202—Conductive
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/54—Yield strength; Tensile strength
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
- C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/001—Conductive additives
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Laminated Bodies (AREA)
- Carbon And Carbon Compounds (AREA)
Abstract
本发明公开了一种聚酰亚胺与石墨烯复合膜的制造方法。其具体制造方法为采取原位聚合的方法将所需的石墨烯与溶剂和二胺、二酐混合反应制得带有石墨烯的聚酰胺酸。然后利用涂膜机将聚酰胺酸均匀的涂布在平面板材上，再将其放入高温烘箱中进行亚胺化生成所需的聚酰亚胺。最后取出产品将板材上的聚酰亚胺薄膜剥离后即可制得所需的聚酰亚胺层。接着将聚酰亚胺层放入中间，在其上下各铺一层环氧树脂层，利用压延机将其压延结合即可制得所需的材料。本方法制得的聚酰亚胺薄膜具有机械强度高，导电率提升显著的特点，是一种新型石墨烯掺杂聚酰亚胺薄膜。
Description
技术领域
本发明涉及一种薄膜制造方法，具体涉及一种聚酰亚胺与石墨烯复合膜的制造方法。
背景技术
聚酰亚胺(PI)是指主链上含有酰亚胺环的一类聚合物材料，是目前已经实现工业化的特殊高分子材料，具有优越的物理机械综合性能，优良的电气与化学稳定性，广泛的应用于高新技术领域。而聚酰亚胺薄膜是其中最早的商品之一同时又是用量最大的一种。这种新型耐高温有机聚合物薄膜是目前世界上性能最好的薄膜类绝缘材料和最贵的薄膜材料之一，被称为“黄金薄膜”。聚酰亚胺薄膜优良的性能使得其在诸多领域发挥着越来越重要的作用。聚酰亚胺薄膜与碳纤维、芳纶纤维一起，被认为是目前制约我国发展高技术产业的三大瓶颈性关键高分子材料。
目前，国内聚酰亚胺薄膜存在着产品质量差、综合性能不稳定、产品精细化程度不够、品种少等缺点，影响了其应用。石墨烯作为迄今为止最薄的二维材料，具有优异的机械性能、电学性能、光学性能及热学性能，已成为当今新材料研究的热点。聚合物材料具有易成型及成本低等特点而具有广泛的应用。然而，由于聚合物材料较低的力学性能、固有的绝缘性等特点不能满足一些领域的应用。利用炭纳米材料改性及增强聚合物被认为是十分有效的途径。本发明提供了一种石墨烯掺杂的聚酰亚胺薄膜的制造方法，生产出的聚酰亚胺薄膜机械性能好且导电，可应用在许多特殊领域。
发明内容
本发明目的在于提供一种一种聚酰亚胺与石墨烯复合膜的制造方法。
对于一种聚酰亚胺与石墨烯复合膜的制造方法，本发明所采取的技术方案为：一种聚酰亚胺与石墨烯复合膜的制造方法。其具体制造方法为采取原位聚合的方法将所需的石墨烯与溶剂和二胺、二酐混合反应制得带有石墨烯的聚酰胺酸。然后利用涂膜机将聚酰胺酸均匀的涂布在平面板材上，再将其放入高温烘箱中进行亚胺化生成所需的聚酰亚胺。最后取出产品将板材上的聚酰亚胺薄膜剥离后即可制得所需的聚酰亚胺层。接着将聚酰亚胺层放入中间，在其上下各铺一层环氧树脂层，利用压延机将其压延结合即可制得所需的材料。
作为优选，所采用的石墨烯填料可以是石墨烯粉末，也可以是氧化石墨烯，氧化还原石墨烯等，石墨烯作为一种填料，可以有效改善聚酰亚胺性能。
作为优选，所采用制造聚酰胺酸的方法为先将石墨烯与二氨基二苯醚混合溶入二甲基乙酰胺中，而后再缓慢加入均苯四甲酸二酐，当二氨基二苯醚与均苯四甲酸二酐摩尔数相等时体系黏度会快速增大，此时停止加入均苯四甲酸二酐。
作为优选，所采用的平面板材可以是钢化玻璃板，所采用薄膜厚度可以是20微米。
作为优选，生成聚酰胺酸在高温烘箱中进行亚胺化的温度开始可以是80℃保温1H，接着100℃,150℃,200℃,250℃，300℃各保温30分钟。
作为优选，在生成聚酰亚胺薄膜后再在其上下铺一层环氧树脂层，利用压延机压延使其紧密结合，所采用的环氧树脂层的厚度可以是20微米。
与现有技术相比所具有的优势是：
1：本发明采用原位聚合将石墨烯溶入聚酰胺酸中，而后再进行亚胺化生产聚酰亚胺，制作方法简单，纳米颗粒在聚酰亚胺中分散良好。
2：本发明生产的聚酰亚胺复合薄膜具有高机械强度高导电率的特性，可应用在一些特殊的领域。
具体实施方式
下面将结合本发明的方法进行实例描述，对本发明实例中的技术方案进行描述，显然，所述的实例仅仅是本发明一部分实例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本发明的保护范围。
例1：称取50g二氨基二苯醚，200g石墨烯粉末，将其溶于400g二甲基乙酰胺溶液中，边搅拌边缓慢加入63.2g均苯四甲酸二酐中，搅拌直至溶液黏度变大出现爬杆现象。将上述液体取出利用自动涂膜机将其均匀的涂覆在钢化玻璃板上，使其膜厚为20微米，接着将覆有聚酰胺酸溶液的钢化玻璃板放入高温烘箱中，控制升温保温速度，使其进行亚胺化，温度调控开始可以是80℃保温1H，接着100℃,150℃,200℃,250℃，300℃各保温30分钟。最后等烘箱温度降低取出板材，将上面的聚酰亚胺薄膜剥落，再在其上下铺一层厚度为20微米的环氧树脂层，放入压延机中进行压延直至聚酰亚胺层与环氧树脂层紧密结合，最后取出材料即可制得聚酰亚胺与石墨烯复合膜。
在室温下测试聚酰亚胺与石墨烯复合膜的机械强度如下表所示：
Claims (7)
1.一种聚酰亚胺与石墨烯复合膜的制造方法。其特征在于其具体制造方法为采取原位聚合的方法将所需的石墨烯与溶剂和二胺、二酐混合反应制得带有石墨烯的聚酰胺酸。然后利用涂膜机将聚酰胺酸均匀的涂布在平面板材上，再将其放入高温烘箱中进行亚胺化生成所需的聚酰亚胺。最后取出产品将板材上的聚酰亚胺薄膜剥离后即可制得所需的聚酰亚胺层。接着将聚酰亚胺层放入中间，在其上下各铺一层环氧树脂层，利用压延机将其压延结合即可制得所需的材料。
2.根据权利要求1所述的一种聚酰亚胺与石墨烯复合膜的制造方法，其特征在于所述的制造聚酰胺酸的方法为先将石墨烯溶入二胺与溶剂中，而后再缓慢加入二酐，当二胺与二酐摩尔数相等时体系黏度会快速增大，此时停止加入二酐。
3.根据权利要求2所述的一种聚酰亚胺与石墨烯复合膜的制造方法，其特征在于所述的二胺可以是44-二氨基二苯醚与对苯二胺等，所述的二酐可以是均苯四甲酸二酐与联苯四甲酸二酐，所述的溶剂可以是二甲基乙酰胺与二甲基甲酰胺。
4.根据权利要求1所述的一种聚酰亚胺与石墨烯复合膜的制造方法，其特征在于所述的平面板材可以是钢化玻璃板材，也可以是不锈钢板材，涂在平面板材上薄膜的厚度可以是5-200微米。
5.根据权利要求1所述的一种聚酰亚胺与石墨烯复合膜的制造方法，其特征在于高温烘箱中进行亚胺化的温度开始可以是80℃保温1H，接着100℃,150℃,200℃,250℃，300℃各保温30分钟。
6.根据权利要求1所述的一种聚酰亚胺与石墨烯复合膜的制造方法，其特征在于二酐与二胺的质量总和可以占溶剂质量的10％到30％，所述的石墨烯可以占二酐与二胺质量总和的1％到200％。
7.根据权利要求1所述的一种聚酰亚胺与石墨烯复合膜的制造方法，其特征在于得到聚酰亚胺薄膜后再在其上下铺一层环氧树脂层进行压延使其紧密结合，环氧树脂层与聚酰亚胺层的厚度比可以为0.1-10。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910503454.3A CN110172170A (zh) | 2019-06-11 | 2019-06-11 | 一种聚酰亚胺与石墨烯复合膜的制造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910503454.3A CN110172170A (zh) | 2019-06-11 | 2019-06-11 | 一种聚酰亚胺与石墨烯复合膜的制造方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110172170A true CN110172170A (zh) | 2019-08-27 |
Family
ID=67698266
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910503454.3A Pending CN110172170A (zh) | 2019-06-11 | 2019-06-11 | 一种聚酰亚胺与石墨烯复合膜的制造方法 |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110172170A (zh) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112829392A (zh) * | 2021-01-04 | 2021-05-25 | 北京环境特性研究所 | 一种耐高温超宽带吸波结构一体化材料及其制备方法 |
| CN112917955A (zh) * | 2021-01-06 | 2021-06-08 | 慧迈材料科技(广东)有限公司 | 一种石墨烯掺杂聚酰亚胺复合薄膜的制造方法 |
| CN113121233A (zh) * | 2020-01-16 | 2021-07-16 | 广东墨睿科技有限公司 | 一种氧化石墨烯三维自组装板材的制备工艺 |
| CN113501984A (zh) * | 2021-06-25 | 2021-10-15 | 浙江中科玖源新材料有限公司 | 一种石墨烯原位改性聚酰亚胺薄膜及其制备方法 |
| CN115819824A (zh) * | 2022-12-27 | 2023-03-21 | 中科合肥智慧农业协同创新研究院 | 一种石墨烯/聚酰亚胺渗水地膜及其制备方法 |
-
2019
- 2019-06-11 CN CN201910503454.3A patent/CN110172170A/zh active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113121233A (zh) * | 2020-01-16 | 2021-07-16 | 广东墨睿科技有限公司 | 一种氧化石墨烯三维自组装板材的制备工艺 |
| CN113121233B (zh) * | 2020-01-16 | 2022-06-07 | 广东墨睿科技有限公司 | 一种氧化石墨烯三维自组装板材的制备工艺 |
| CN112829392A (zh) * | 2021-01-04 | 2021-05-25 | 北京环境特性研究所 | 一种耐高温超宽带吸波结构一体化材料及其制备方法 |
| CN112917955A (zh) * | 2021-01-06 | 2021-06-08 | 慧迈材料科技(广东)有限公司 | 一种石墨烯掺杂聚酰亚胺复合薄膜的制造方法 |
| CN113501984A (zh) * | 2021-06-25 | 2021-10-15 | 浙江中科玖源新材料有限公司 | 一种石墨烯原位改性聚酰亚胺薄膜及其制备方法 |
| CN113501984B (zh) * | 2021-06-25 | 2023-11-21 | 浙江中科玖源新材料有限公司 | 一种石墨烯原位改性聚酰亚胺薄膜及其制备方法 |
| CN115819824A (zh) * | 2022-12-27 | 2023-03-21 | 中科合肥智慧农业协同创新研究院 | 一种石墨烯/聚酰亚胺渗水地膜及其制备方法 |
| CN115819824B (zh) * | 2022-12-27 | 2024-05-28 | 中科合肥智慧农业协同创新研究院 | 一种石墨烯/聚酰亚胺渗水地膜及其制备方法 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN110172170A (zh) | 一种聚酰亚胺与石墨烯复合膜的制造方法 | |
| TWI510529B (zh) | 聚醯亞胺膜、其製造方法及包含其之聚醯亞胺膜積層板 | |
| JP5834930B2 (ja) | ポリイミド前駆体水溶液組成物、及びポリイミド前駆体水溶液組成物の製造方法 | |
| CN112876680B (zh) | 一种聚酰胺酸浆料及其制备方法以及聚酰亚胺薄膜 | |
| CN103788651B (zh) | 低表观粘度的聚酰胺酸溶液及其制备方法 | |
| CN101831074A (zh) | 一种新型含氟共聚聚酰亚胺及其制备方法 | |
| CN104211962A (zh) | 一种高介电聚酰亚胺复合材料及其制备方法 | |
| US20130171459A1 (en) | Polyamic acid resin solution containing interpenetrating polymer and laminate using the same | |
| CN110218320A (zh) | 一种新型耐电晕pi薄膜制作方法 | |
| CN113604043B (zh) | 一种具有低吸湿和高粘结性的聚酰亚胺薄膜及其制备方法 | |
| CN109438735A (zh) | 一种高导热聚酰亚胺基复合薄膜及其制备方法 | |
| CN102443264A (zh) | 可成型聚酰亚胺薄膜的生产方法 | |
| CN106832277A (zh) | 一种具有高延伸率的白色聚酰亚胺薄膜及其制备方法 | |
| CN106046373A (zh) | 一种具有阻燃性的可溶聚酰亚胺膜及制备方法 | |
| CN109423047A (zh) | 耐热聚酰亚胺薄膜及其制备的显示器基板 | |
| CN110216955A (zh) | 一种可耐电晕的复合薄膜的制造方法 | |
| CN102643602A (zh) | 一种聚酰亚胺-环氧型电气绝缘漆及其制备方法 | |
| CN110128654A (zh) | 一种新型含石墨烯的聚酰亚胺薄膜 | |
| CN113896926A (zh) | 一种抗静电聚酰亚胺薄膜及其应用 | |
| CN111154433B (zh) | 一种含氟树脂混合物及其制备的覆铜板 | |
| CN110218319A (zh) | 一种导热聚酰亚胺薄膜 | |
| CN110172149A (zh) | 一种石墨烯掺杂聚酰亚胺薄膜 | |
| CN107189092A (zh) | 一种高导热型聚酰亚胺薄膜的制备方法 | |
| CN109054018B (zh) | 一种聚酰胺酸溶液及其制备方法 | |
| CN116218357B (zh) | 一种氰酸脂原位改性聚酰亚胺耐高温涂层及其制备方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20190827 |
|
| WD01 | Invention patent application deemed withdrawn after publication |