CN110149781B - Heat abstractor and be equipped with its electrical equipment - Google Patents
Heat abstractor and be equipped with its electrical equipment Download PDFInfo
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- CN110149781B CN110149781B CN201910406859.5A CN201910406859A CN110149781B CN 110149781 B CN110149781 B CN 110149781B CN 201910406859 A CN201910406859 A CN 201910406859A CN 110149781 B CN110149781 B CN 110149781B
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- heat dissipation
- heat dissipating
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- 230000017525 heat dissipation Effects 0.000 claims abstract description 154
- 230000002035 prolonged effect Effects 0.000 abstract description 2
- 239000000758 substrate Substances 0.000 description 6
- 239000007787 solid Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 230000007847 structural defect Effects 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
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- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention relates to a heat dissipation device and electrical equipment with the same. According to the heat dissipation device, the heat dissipation fins are provided with the heat dissipation air channels, so that the weight of the heat dissipation device is reduced, and the light weight development of electrical equipment provided with the heat dissipation device is facilitated. Moreover, the air flow can pass through the heat dissipation air duct to take away heat on the heat dissipation base, so that the heat dissipation device has higher heat dissipation efficiency, and the service life of the electrical equipment provided with the heat dissipation device is effectively prolonged.
Description
Technical Field
The invention relates to the technical field of electric appliances, in particular to a heat dissipation device and electric equipment with the same.
Background
Many electrical equipment's electronic components (for example, the controller of air conditioner) power is great, can give off very high heat in the course of the work to lead to the inside temperature rise of air conditioner, seriously influenced the life of these components and parts, and then seriously influenced electrical equipment's stability in use and life. Therefore, in the conventional technology, a heat sink is generally provided to dissipate heat of an electronic component having a large heat generation amount.
At present, a conventional heat sink generally includes a substrate and a plurality of fins integrally formed on the substrate, and heat generated by an electronic component can be transferred to the fins through the substrate and then dissipated through the fins. However, due to the structural defects of the heat sink, the self weight of the heat sink is large, so that the overall weight of the electrical equipment is increased, and the light weight development of the electrical equipment is not facilitated. Meanwhile, the heat dissipation efficiency of the radiator is low, a good heat dissipation effect cannot be achieved only through heat dissipation of the radiator, and the problem that the electronic component is overheated is difficult to well solve.
Disclosure of Invention
Accordingly, it is desirable to provide a heat sink with a small weight and a high heat dissipation efficiency and an electrical apparatus having the same, which solve the problems of the heat sink with a large weight and a low heat dissipation efficiency.
A heat dissipation device comprises a heat dissipation base and a plurality of heat dissipation fins, wherein the heat dissipation fins are arranged on one side of the heat dissipation base at intervals along a first direction, and each heat dissipation fin is provided with a heat dissipation air channel communicated with the heat dissipation base and the external environment.
According to the heat dissipation device, the heat dissipation fins are provided with the heat dissipation air channels, so that the weight of the heat dissipation device is reduced, and the light weight development of electrical equipment provided with the heat dissipation device is facilitated. Moreover, the air flow can pass through the heat dissipation air duct to take away heat on the heat dissipation base, so that the heat dissipation device has higher heat dissipation efficiency, and the service life of the electrical equipment provided with the heat dissipation device is effectively prolonged.
In one embodiment, each heat dissipation air duct extends from the heat dissipation base to one end of the heat dissipation fin far away from the heat dissipation base along the third direction, and is communicated with two ends of the heat dissipation fin in the second direction; wherein the first direction, the second direction, and the third direction intersect with each other.
In one embodiment, each of the heat dissipation fins includes a first heat dissipation sidewall and a second heat dissipation sidewall that are disposed at an interval in the first direction, and the heat dissipation air duct is formed between the first heat dissipation sidewall and the second heat dissipation sidewall.
In one embodiment, the heat dissipation fin further includes a connection top wall, and two sides of the connection top wall in the first direction are respectively connected to one ends, away from the heat dissipation base, of the first heat dissipation side wall and the second heat dissipation side wall.
In one embodiment, the heat dissipation fins further include air guiding sheets, the air guiding sheets are disposed on one side of the first heat dissipation side wall and/or the second heat dissipation side wall facing the heat dissipation air duct, and the air guiding sheets are arranged at intervals from one end of the heat dissipation fin close to the heat dissipation base to one end of the heat dissipation fin far away from the heat dissipation base along the third direction.
In one embodiment, the air guiding plate extends obliquely from one of the first heat dissipation sidewall and the second heat dissipation sidewall to the other of the first heat dissipation sidewall and the second heat dissipation sidewall.
In one embodiment, the heat dissipation base is provided with a plurality of mounting grooves arranged at intervals along the first direction, and one end of one heat dissipation fin is detachably inserted into one mounting groove.
In one embodiment, the heat dissipation base includes a base plate and a plurality of mounting fins, the plurality of mounting fins are arranged at intervals along the first direction on one side of the base plate, and one mounting groove is formed between every two adjacent mounting fins.
In one embodiment, the mounting fin is provided with a heat dissipation groove communicated with the external environment.
In one embodiment, the heat dissipation fins can be subjected to restorable deformation in the first direction, and the size of the heat dissipation fins in the first direction can be reduced under the action of an external force until the heat dissipation fins are clamped in the mounting groove.
An electrical apparatus comprises the heat dissipation device.
Drawings
FIG. 1 is an assembly view of a heat dissipation device in accordance with an embodiment of the present invention;
FIG. 2 is a front view of the heat sink of FIG. 1;
FIG. 3 is an exploded view of the heat sink of FIG. 1;
fig. 4 is a schematic structural diagram of a heat dissipation fin of the heat dissipation device shown in fig. 1.
Detailed Description
To facilitate an understanding of the invention, the invention will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
As shown in fig. 1 and fig. 2, an electrical apparatus according to an embodiment of the present invention includes a housing (not shown), an electronic component (not shown) mounted in the housing, and a heat dissipation device 100 for assisting the electronic component in dissipating heat. The electrical device may be a heat exchange device, such as an air conditioner outdoor unit, or other devices to which the heat dissipation apparatus 100 may be mounted, and is not limited herein.
As shown in fig. 1 and 3, the heat dissipation apparatus 100 includes a heat dissipation base 20 and a plurality of heat dissipation fins 40 detachably mounted on the heat dissipation base 20, wherein heat generated by electronic components in the electrical equipment can be transferred to the heat dissipation base 20 and then dissipated through the heat dissipation fins 40.
The heat sink 20 includes a base plate 21 and mounting fins 23 which are integrally formed. The substrate 21 has a substantially rectangular plate-like structure in cross section, the longitudinal direction of the substrate 21 is a first direction, the width direction is a second direction, the thickness direction of the substrate 21 is a third direction, and the first direction, the second direction, and the third direction intersect with each other. Preferably, the first direction, the second direction and the third direction are perpendicular to each other. The plurality of mounting fins 23 are arranged on one side surface of the base plate 21 at intervals along the first direction, and a mounting groove 25 is formed between every two adjacent mounting fins 23. In this way, a plurality of mounting grooves 25 arranged at intervals in the first direction are formed on the heat dissipation base 20 to mount the heat dissipation fins 40.
In some embodiments, the mounting fins 23 are in an elongated structure, the length direction of the mounting fins 23 extends along the second direction, and the length of the mounting fins 23 is slightly shorter than the width of the base plate 21, the width direction of the mounting fins 23 extends along the first direction, and a mounting groove 25 extending along the second direction and having a length slightly shorter than the length of the base plate 21 is formed between every two adjacent mounting fins 23. It will be appreciated that the specific configuration of the mounting fin 23 is not limited, and in some embodiments, the mounting fin 23 is a solid structure, thereby providing greater strength while being less difficult to form. In other embodiments, the mounting fins 23 are non-solid structures, and the mounting fins 23 are provided with heat dissipation grooves communicating with the external environment to form airflow channels, so as to reduce the weight of the heat dissipation base 20 and improve the heat dissipation efficiency of the heat dissipation device 100. Specifically, in one embodiment, the heat dissipation groove of the mounting fin 23 extends in the second direction and communicates with both ends of the mounting fin 23 in the second direction, so that the air flow can pass through the heat dissipation groove in the second direction to take off part of the heat in the mounting fin 23.
Specifically, in some embodiments, the thickness of the base plate 21 is less than 10mm, and the dimension of the mounting fins 23 in the third direction (i.e., the height of the mounting fins 23) is preferably 3mm, so that the heat dissipation fins 40 can be firmly fixed, and the weight of the heat dissipation base 20 can be reduced.
The heat dissipation fins 40 are made of rigid elastic materials (such as stainless steel) and can be restored to deform in the first direction, and the size of the heat dissipation fins 40 in the first direction can be reduced under the action of external force until the heat dissipation fins are clamped in the mounting grooves 25. In this way, one end of one heat dissipation fin 40 is detachably inserted into one mounting groove 25 of the heat dissipation base 20, and then a plurality of heat dissipation fins 40 are arranged at intervals along the first direction on one side of the heat dissipation base 20. It can be understood that different types of mounting seats and different types and numbers of heat dissipation fins 40 can be selected to be matched with each other to form different heat dissipation devices 100 according to requirements, so that requirements of different electrical equipment are met, the generalization rate of the heat dissipation devices 100 is effectively improved, and the production cost and the storage cost are reduced.
Referring to fig. 1, 3 and 4, each of the heat dissipating fins 40 includes a first heat dissipating side wall 41, a second heat dissipating side wall 43 and a connecting top wall 45, and the first heat dissipating side plate 41, the second heat dissipating side wall 43 and the connecting top wall 45 are all rectangular plate-shaped structures. The first heat dissipation sidewall 41 and the second heat dissipation sidewall 43 are spaced and parallel to each other in the first direction, and an orthographic projection of the first heat dissipation sidewall 41 on the second heat dissipation sidewall 43 coincides with an edge of the second heat dissipation sidewall 43. Two sides of the connecting top wall 45 in the first direction are respectively connected to the ends of the first heat dissipating sidewall 41 and the second heat dissipating sidewall 43 away from the heat dissipating base 20. Therefore, the heat dissipation fins 40 form a structure independent from the heat dissipation base 20, the heat dissipation air channels 47 are formed between the first heat dissipation side wall 41 and the second heat dissipation side wall 43, and each heat dissipation air channel 47 extends from the heat dissipation base 20 to one end of the heat dissipation fins 40 away from the heat dissipation base 20 along the third direction and is communicated with two ends of the heat dissipation fins 40 in the second direction.
Thus, each fin 40 is provided with a heat dissipation air duct 47 communicating the heat dissipation base 20 with the external environment, and the air flow can pass through the heat dissipation air duct 47 to take away the heat on the heat dissipation base 20. Compared with the solid or other heat dissipation fins 40, the heat dissipation fins 40 with the heat dissipation air ducts 47 communicated with the heat dissipation base 20 have higher heat dissipation efficiency, and the weight of the heat dissipation device 100 is greatly reduced, which is beneficial to the light weight of the electrical equipment.
Further, in an embodiment, the heat dissipating fin 40 further includes a plurality of air guiding sheets 49, the air guiding sheets 49 are disposed on the first heat dissipating side wall 41 and the second heat dissipating side wall 43 facing the heat dissipating air duct 47, and the plurality of air guiding sheets 49 are arranged at intervals from one end of the heat dissipating fin 40 close to the heat dissipating base 20 to one end of the heat dissipating fin 40 away from the heat dissipating base 20 along the third direction, so as to perform a flow guiding function, so that the air flow flows from one end of the heat dissipating fin 40 in the second direction to the other end of the heat dissipating fin 40 in the second direction to take away the heat on the heat dissipating.
Specifically, each of the air guiding plates 49 is a plate-shaped structure extending along the second direction, and the air guiding plate 49 extends obliquely from one of the first heat dissipating sidewall 41 and the second heat dissipating sidewall 43 to the other of the first heat dissipating sidewall 41 and the second heat dissipating sidewall 43. Preferably, the air guiding sheet 49 extends upwards from the first heat dissipating sidewall 41 or the second heat dissipating sidewall 43 in a direction away from the heat dissipating base 20, and an included angle between the air guiding sheet 49 and the first heat dissipating sidewall 41 is 45 °, so as to have a better air guiding effect. It is understood that, in some other embodiments, the air guiding plate 49 may be disposed on only one of the first heat dissipating sidewall 41 or the second heat dissipating sidewall 43, the air guiding plate 49 may extend obliquely toward the heat dissipating base 20, the angle of inclination of the air guiding plate 49 is not limited to 45 °, and the air guiding plate 49 may be disposed according to actual requirements.
In the heat dissipation device 100 and the electrical equipment provided with the same, because the heat dissipation fins 40 of the heat dissipation device 100 are detachably mounted on the heat dissipation base 20, different types of heat dissipation bases 20 and different types and numbers of heat dissipation fins 40 can be selected to be mutually combined to form heat dissipation devices 100 with different structures according to needs, so as to meet different needs, thereby having higher universality. Moreover, the heat dissipation air duct 47 formed on the heat dissipation fin 40 effectively improves the heat dissipation efficiency and reduces the weight of the heat dissipation device 100, thereby improving the working stability of the electrical equipment, prolonging the service life of the electrical equipment and contributing to the lightweight development of the electrical equipment.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. The heat dissipation device (100) is characterized by comprising a heat dissipation base (20) and a plurality of heat dissipation fins (40), wherein the heat dissipation base (20) comprises a base plate (21) and mounting fins (23), the mounting fins (23) are arranged on one side of the base plate (21) at intervals along a first direction, a mounting groove (25) is formed between every two adjacent mounting fins (23), and the mounting fins (23) are provided with heat dissipation grooves communicated with the external environment; the radiating fins (40) are arranged on one side of the radiating base (20) at intervals along the first direction, one end of one radiating fin (40) is detachably inserted into one mounting groove (25), and each radiating fin (40) is provided with a radiating air duct (47) for communicating the radiating base (20) with the external environment;
the heat dissipation fins (40) can be restored to deform in the first direction, and the size of the heat dissipation fins (40) in the first direction can be reduced under the action of external force until the heat dissipation fins are clamped in the mounting grooves (25).
2. The heat dissipating device (100) according to claim 1, wherein each of the heat dissipating air ducts (47) extends from the heat dissipating base (20) to an end of the heat dissipating fin (40) away from the heat dissipating base (20) in the third direction, and communicates with both ends of the heat dissipating fin (40) in the second direction; wherein the first direction, the second direction, and the third direction intersect with each other.
3. The heat dissipating device (100) according to claim 2, wherein each of the heat dissipating fins (40) comprises a first heat dissipating sidewall (41) and a second heat dissipating sidewall (43) spaced apart from each other in the first direction, and the heat dissipating air duct (47) is formed between the first heat dissipating sidewall (41) and the second heat dissipating sidewall (43).
4. The heat dissipating device (100) according to claim 3, wherein the first heat dissipating sidewall (41) and the second heat dissipating sidewall (43) are spaced apart and arranged in parallel in the first direction, and an orthographic projection of the first heat dissipating sidewall (41) on the second heat dissipating sidewall (43) coincides with an edge of the second heat dissipating sidewall (43).
5. The heat dissipating device (100) according to claim 3, wherein the heat dissipating fin (40) further comprises a connecting top wall (45), and two sides of the connecting top wall (45) in the first direction respectively connect the first heat dissipating side wall (41) and one end of the second heat dissipating side wall (43) away from the heat dissipating base (20).
6. The heat dissipation device (100) according to claim 5, wherein the heat dissipation fins (40) further include air guiding fins (49), the air guiding fins (49) are disposed on a side of the first heat dissipation side wall (41) and/or the second heat dissipation side wall (43) facing the heat dissipation air duct (47), and a plurality of the air guiding fins (49) are spaced from one end of the heat dissipation fins (40) close to the heat dissipation base (20) to one end of the heat dissipation fins (40) far away from the heat dissipation base (20) along the third direction.
7. The heat dissipating device (100) of claim 6, wherein the air guiding plate (49) extends obliquely from one of the first heat dissipating sidewall (41) and the second heat dissipating sidewall (43) to the other of the first heat dissipating sidewall (41) and the second heat dissipating sidewall (43).
8. The heat dissipating device (100) of claim 7, wherein the air guiding plate (49) extends obliquely from the first heat dissipating sidewall (41) or the second heat dissipating sidewall (43) to a direction away from the heat dissipating base (20), and an included angle between the air guiding plate (49) and the first heat dissipating sidewall (41) is 45 degrees.
9. The heat dissipating device (100) according to claim 2, wherein the heat dissipating grooves of the mounting fins (23) extend in the second direction and communicate with both ends of the mounting fins (23) in the second direction.
10. An electrical appliance, characterized in that it comprises a heat sink (100) according to any one of claims 1-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910406859.5A CN110149781B (en) | 2019-05-16 | 2019-05-16 | Heat abstractor and be equipped with its electrical equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910406859.5A CN110149781B (en) | 2019-05-16 | 2019-05-16 | Heat abstractor and be equipped with its electrical equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110149781A CN110149781A (en) | 2019-08-20 |
| CN110149781B true CN110149781B (en) | 2020-12-08 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201910406859.5A Active CN110149781B (en) | 2019-05-16 | 2019-05-16 | Heat abstractor and be equipped with its electrical equipment |
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| CN (1) | CN110149781B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112904655B (en) * | 2019-12-03 | 2023-08-29 | 深圳光峰科技股份有限公司 | Heat sinks, secure processing modules and projectors |
| CN112696965A (en) * | 2021-01-22 | 2021-04-23 | 东莞市万维热传导技术有限公司 | Adopt 3D heat dissipation module of samming plate structure |
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| CN204598540U (en) * | 2015-03-04 | 2015-08-26 | 江苏三恊铝业科技有限公司 | A kind of extruding fin-inserted radiator device |
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| CN102345991A (en) * | 2010-07-25 | 2012-02-08 | 东莞市为开金属制品厂 | Heat pipe type radiator |
| CN203586901U (en) * | 2011-02-17 | 2014-05-07 | 贝洱两合公司 | Fin for heat exchanger |
| CN202232012U (en) * | 2011-09-14 | 2012-05-23 | 中国北车股份有限公司大连电力牵引研发中心 | Radiator |
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| CN110149781A (en) | 2019-08-20 |
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