CN110145848A - Heat abstractor, heat exchange circulation system and electrical equipment - Google Patents

Abstract

The application relates to a heat dissipation device, a heat exchange circulation system and electrical equipment, and belongs to the technical field of heat dissipation. The heat dissipation device of the present application includes: a first refrigeration medium channel, used to transport the first refrigeration medium, and conduct heat from at least one heat dissipation element to the first refrigeration medium, wherein the first refrigeration medium is a refrigerant for heat exchange cycle The second refrigerant medium channel is used to transport the second refrigerant medium, the temperature of the second refrigerant medium entering the second refrigerant medium channel is lower than the temperature of the first refrigerant medium entering the first refrigerant medium channel; the first refrigerant medium channel and Both the second cooling medium passages are configured to enable heat exchange between the first cooling medium and the second cooling medium. The application helps to meet the dual requirements of effectively dissipating heat from components and ensuring the cooling effect when cooling is performed with the refrigerant used in the heat exchange cycle.

Description

Radiator, heat exchange circulation system and electrical equipment

technical field

The application belongs to the technical field of heat dissipation, and in particular relates to a heat dissipation device, a heat exchange cycle system and electrical equipment.

Background technique

In air-conditioning equipment, the controller is an important part. In the controller, there are some high-power components, such as: IPM (Intelligent Power Module), PFC (Power Factor Correction) and other components. When the controller is working, these Components with high power levels generate a lot of heat, which accumulates in the controller, which will affect the overall performance of the controller and further affect the reliability of the controller.

Therefore, the heat treatment scheme of high-power components has become a thorny problem for controller designers and structural designers. In the related art, combined with the refrigeration system of the air conditioner, the performance and reliability of the controller can be guaranteed by using the refrigeration medium to dissipate heat from the elements that need to dissipate heat. However, there is a problem that: due to the use of cooling medium for heat dissipation, the supercooled cooling medium absorbs the heat of the heat dissipation elements in the controller, resulting in loss of the cooling capacity of the cooling medium, resulting in the overcooling of the cooling medium in the air-conditioning refrigeration cycle system. The coldness decreases and the pressure drop increases at the same time, which adversely affects the cooling capacity of the air conditioner.

Contents of the invention

In order to overcome the problems existing in the related technologies at least to a certain extent, the application provides a heat sink, a heat exchange cycle system and electrical equipment, which help to meet the requirements of effective heat dissipation for components and reducing or maintaining the temperature of the refrigerant used in the heat exchange cycle Double need.

In order to achieve the above object, the application adopts the following technical solutions:

first,

The application provides a cooling device, comprising:

The first cooling medium channel is used to transport the first cooling medium, and conduct the heat of at least one heat dissipation element to the first cooling medium, wherein the first cooling medium is a cooling medium for heat exchange cycle;

The second cooling medium channel is used to transport the second cooling medium, the temperature of the second cooling medium entering the second cooling medium channel is lower than the temperature of the first cooling medium entering the first cooling medium channel ;

Both the first cooling medium channel and the second cooling medium channel are configured to enable heat exchange between the first cooling medium and the second cooling medium.

Further, it also includes:

The heat conduction fixing part is in thermal contact with the first cooling medium channel, and at least one groove is formed on the heat conduction fixation part, which is used to make the at least one heat dissipation element in one-to-one thermal contact with the at least one groove In the process, the heat of the at least one heat dissipation element required to be dissipated is conducted to the first refrigeration medium through the thermal contact between the heat conduction fixing part and the first refrigeration medium passage.

Further, the inlet of the second refrigerant channel is located below the outlet of the second refrigerant channel.

Further, a plurality of fins are formed on the inner wall of the second cooling medium passage, at least in the area where heat exchange with the first cooling medium passage is performed.

Further, the fins are arranged longitudinally through the second refrigerant medium passage, and the arrangement direction of the fins is the same as the conveying direction of the second refrigerant medium.

Further, the first refrigerant medium channel is a hydraulically smooth channel.

Further, on the first cooling medium channel, along the conveying direction of the first cooling medium, the area for heat exchange with the second cooling medium channel is located in the area for dissipating heat from the at least one heat dissipation element. downstream position.

Further, both the first cooling medium channel and the second cooling medium channel are configured to form a plate-fin heat exchange structure, so that the first cooling medium and the second cooling medium can perform heat exchange.

Second aspect,

The application provides a heat exchange circulation system, comprising:

A cooling device as described in any one of the above;

A controller having said at least one heat dissipation element required to dissipate heat through said heat dissipation device;

a condenser, configured to deliver the first refrigeration medium to the first refrigeration medium channel;

The evaporator is configured to receive the first cooling medium output from the first cooling medium channel.

Further, it also includes: a condensed water collecting and conveying device, configured to collect condensed water generated by the evaporator, and transport it as the second refrigerating medium to the second refrigerating medium channel.

Further, the condensed water collection and delivery device includes: a water collection container and a water pump.

third aspect,

The application provides an electrical device, including:

Heat exchange cycle system as described above.

Further, the electrical equipment is an air conditioner.

The application adopts the above technical solutions, and at least has the following beneficial effects:

This application uses the refrigerant for heat exchange circulation in the first refrigerant channel to effectively dissipate the heat that needs to be dissipated, and then passes through the second refrigerant with a lower temperature in the second refrigerant channel to interact with the first refrigerant. The refrigerant for the heat exchange cycle in the channel performs heat exchange, and the refrigerant for the heat exchange cycle is refrigerated by the second refrigerant medium, which helps to achieve effective heat dissipation for the components and to reduce or maintain the temperature of the refrigerant for the heat exchange cycle. Demand, which in turn helps to ensure the cooling effect when using the heat exchange cycle to cool with the refrigerant.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the application.

Description of drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings that need to be used in the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description are only These are some embodiments of the present application. Those skilled in the art can also obtain other drawings based on these drawings without creative work.

FIG. 1 is a schematic diagram of the overall structure of a heat dissipation device provided by an embodiment of the present application;

Fig. 2 is a structural schematic diagram of the arrangement relationship among the first cooling medium channel, the second cooling medium channel and the heat dissipation elements provided by one embodiment of the present application;

Fig. 3 is a cross-sectional structural schematic diagram of the arrangement relationship between the heat conduction fixing part of the first refrigerant medium channel and the required heat dissipation elements provided by an embodiment of the present application;

Fig. 4 is a schematic diagram of the cross-sectional structure of the inner wall of the second refrigerant medium channel provided by an embodiment of the present application;

FIG. 5 is a schematic structural diagram of a heat exchange cycle system provided by an embodiment of the present application;

FIG. 6 is a schematic structural diagram of electrical equipment provided by an embodiment of the present application;

In the figure,

1- Electrical equipment;

11-Heat exchange circulation system;

101-radiating device, 102-controller, 103-condenser, 104-evaporator, 105-condensed water collection and delivery device, 106-compressor, 107-gas-liquid separator, 108-four-way valve, 109-first Electronic expansion valve, 110-second electronic expansion valve, 111-first filter, 112-second filter, 113-muffler;

1001-the first refrigerant channel, 1001a-the inlet pipe of the first refrigerant channel, 1001b-the outlet pipe of the first refrigerant channel, 1002-the second refrigerant channel, 1002a-the inlet pipe of the second refrigerant channel Road, 1002b-the outlet pipeline of the second refrigerant channel, 1002c-fins, 1003-heat conduction fixing part, 1003a-groove;

2001 - Cooling element required.

Detailed ways

In order to make the purpose, technical solution and advantages of the present application clearer, the technical solution of the present application will be described in detail below. Apparently, the described embodiments are only some of the embodiments of this application, not all of them. Based on the embodiments in the present application, all other implementation manners obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present application.

Figure 1 is a schematic diagram of the overall structure of a heat dissipation device provided by an embodiment of the present application, and Figure 2 is a schematic structural diagram of the arrangement relationship between the first cooling medium channel, the second cooling medium channel and the heat dissipation elements provided by one embodiment of the present application, As shown in Figures 1 and 2, the cooling device 101 includes:

The first cooling medium channel 1001 is used to transport the first cooling medium and transfer the heat of at least one heat dissipation element 2001 to the first cooling medium, wherein the first cooling medium is a cooling medium for heat exchange cycle;

The second refrigerant medium channel 1002 is used to convey the second refrigerant medium, and the temperature of the second refrigerant medium entering the second refrigerant medium channel 1002 is lower than that of the first refrigerant medium entering the first refrigerant medium channel 1001 temperature at the time;

Both the first cooling medium channel 1001 and the second cooling medium channel 1002 are configured to enable heat exchange between the first cooling medium and the second cooling medium.

In the following, the heat dissipation device 101 of the above embodiment is further described by applying the heat dissipation device 101 of the above embodiment to the heat dissipation of some high-power components on the air conditioner controller, so as to explain the original intention of the invention of the present application .

In a specific application, the first refrigerant medium channel 1001 and the second refrigerant medium channel 1002 transport the corresponding refrigerant independently, and the two are not connected. As shown in FIG. 2, each refrigerant medium channel in FIG. 2 corresponds to The arrows indicate the conveying direction of the refrigerant, wherein the first refrigerant conveyed by the first refrigerant channel 1001 is a refrigerant used in the air-conditioning heat exchange cycle, such as R32 or R410a. In a specific application, as shown in Figure 5, Figure 5 is a schematic structural diagram of a heat exchange cycle system provided by an embodiment of the present application. In Figure 5, the first refrigerant medium channel 1001 is connected in series to the condenser in the air conditioning cycle system 103 and the evaporator 104, specifically, connect the inlet pipeline 1001a of the first refrigerant medium channel of the cooling device 101 in FIG. The outlet pipeline 1001b of is in communication with the evaporator 104. Utilize the cooling medium coming out of the condenser to absorb the heat generated by the cooling element 2001 on the controller, because after the condenser condenses and releases heat, the cooling medium coming out of the condenser is a subcooling cooling medium, and the temperature of the subcooling cooling medium The range is 30°C-40°C. When the air conditioner controller is working, the high-power components on the circuit board generate heat, and the temperature can reach above 90°C. The cooling medium coming out of the condenser is used to absorb the heat generated by the heat dissipation element 2001 to dissipate heat from the heat dissipation element 2001 to ensure the performance and reliability of the controller.

After the cooling medium absorbs the heat generated by the cooling element 2001, the cooling capacity of the cooling medium is lost. In order to avoid adverse effects on the cooling capacity of the air conditioner, as shown in FIG. The inlet pipeline 1002a of the refrigerant medium channel enters and flows out from the outlet pipeline 1002b of the second refrigerant medium channel. The second refrigerant in the second refrigerant channel 1002 exchanges heat with the first refrigerant in the first refrigerant channel 1001, because the temperature of the second refrigerant entering the second refrigerant channel 1002 is lower than that of the first refrigerant When entering the first cooling medium channel 1001, the second cooling medium cools the first cooling medium. For example, in practical applications, the condensed water produced by the evaporator can be used as the second cooling medium. The temperature of the condensed water produced by the evaporator is relatively low, and its temperature range is 7°C-15°C. 30°C-40°C, the two perform heat exchange to form refrigeration for the first refrigerant medium, for example, the cooling capacity of the first refrigerant medium can be compensated to reach the state when the first refrigerant medium enters the first refrigerant medium channel 1001, Alternatively, the cooling capacity of the first refrigerant medium is further increased compared to when it enters the first refrigerant medium channel 1001, so as to restore or increase the degree of supercooling of the first refrigerant medium, and then through the above-mentioned embodiment scheme of the present application, the first refrigerant medium After coming out of the first refrigerant channel 1001, it enters the evaporator, and the evaporating heat absorption effect of the evaporator is maintained or improved.

In this application, the second cooling medium channel 1002 is not directly used to make thermal contact with the required heat dissipation element 2001 to dissipate heat from the required heat dissipation element 2001, but cooperates with the first cooling medium channel 1001 to realize the second cooling medium and the first cooling medium. The heat exchange between the two refrigerant mediums is to make up for the cooling capacity of the first cooling medium, to achieve the state when the first cooling medium enters the first cooling medium channel 1001, or to make the cooling capacity of the first cooling medium to be higher than that of entering the first refrigeration medium. The media channel 1001 is further increased. The formation of the above embodiments of the present application also takes into account the fact that the temperature of the second refrigerant medium entering the second refrigerant medium passage 1002 is lower than the temperature of the first refrigerant medium entering the first refrigerant medium passage 1001 .

In the following, the solution of the above embodiments of the present application is further explained considering that the temperature of the second refrigerant medium entering the second refrigerant medium passage 1002 is lower than the temperature of the first refrigerant medium entering the first refrigerant medium passage 1001 .

In practical application, the condensed water produced by the evaporator can be used as the second cooling medium. The temperature of the condensed water produced by the evaporator is relatively low, and its temperature range is 7°C-15°C. Compared with 40°C, the temperature of the condensed water produced by the evaporator is obviously lower, and the gap between the two is still relatively large. In practical applications, the heat dissipation element 2001 on the controller is dissipated by the supercooled refrigerant medium, which is easier to control so that the temperature of the controller is higher than the dew point, so that condensation does not occur on the heat dissipation element 2001 to avoid Condensation needs to be formed on the surface of the heat dissipation element 2001 to cause damage to the controller. However, if the second cooling medium channel 1002 is in direct thermal contact with the cooling element 2001, the condensed water in the second cooling medium channel 1002 at a temperature ranging from 7°C to 15°C will directly dissipate heat to the cooling element 2001. In this case , the temperature difference between the condensed water and the required heat dissipation element 2001 becomes larger, the heat exchange efficiency between the condensed water and the required heat dissipation element 2001 is higher, and it is very likely that the temperature of the required heat dissipation element 2001 on the controller circuit board is lower than the condensation The dew point requires condensation on the surface of the cooling element 2001, and then the problem of damage to the controller occurs due to the condensation.

To sum up, the above embodiments of the present application use the refrigerant for heat exchange circulation in the first refrigerant channel 1001 to effectively dissipate the heat that needs to be dissipated by the heat dissipation element 2001, and then pass through the second refrigerant channel 1002 with a lower temperature. The second refrigerating medium exchanges heat with the refrigerant for heat exchange cycle in the first refrigerating medium channel 1001, and the first refrigerating medium is refrigerated by the second refrigerating medium, so that the heat exchange cycle output from the first refrigerating medium channel 1001 can be The temperature of the refrigerant is reduced or maintained, thereby helping to realize the dual requirements of effectively dissipating heat from the cooling element 2001 and reducing or maintaining the temperature of the refrigerant for the heat exchange cycle, thereby helping to ensure that the refrigerant for the heat exchange cycle is used for refrigeration. cooling effect.

Regarding the use of the first cooling medium channel 1001 to transfer the heat of at least one heat dissipation element 2001 to the first cooling medium, the present application will be described in the following several implementation manners.

As shown in FIG. 2 , in one embodiment, the heat dissipation element 2001 can be directly attached to the outer wall of the first cooling medium passage 1001 to realize that the heat generated by the heat dissipation element 2001 needs to be conducted through the first cooling medium passage 1001 to the the first cooling medium.

In the specific application of the scheme of the above embodiment, take the cooling of the plurality of heat dissipation elements 2001 on the controller circuit board as an example, and according to the specific distribution positions of the plurality of heat dissipation elements 2001 on the controller to dissipate heat, the first cooling medium The area where the channel 1001 is in contact with it is designed, because in actual products, the circuit board layout design of various controllers will be different, which will lead to the emergence of multiple specific distribution positions on the circuit board that require heat dissipation of the heat dissipation element 2001 Therefore, the design of the corresponding bonding contact area of the first cooling medium channel 1001 will also be different.

In another embodiment, as shown in FIG. 3, FIG. 3 is a cross-sectional structural schematic diagram of the arrangement relationship between the heat conduction fixing part of the first refrigerant channel and the required heat dissipation elements provided by one embodiment of the present application. The heat dissipation device 101 Also includes:

The heat conduction fixing part 1003 is in thermal contact with the first cooling medium channel 1001, and at least one groove 1003a is formed on the heat conduction fixation part 1003, which is used to make the at least one heat dissipation element 2001 need to be in one-to-one thermal contact with each other. In the at least one groove 1003a, the heat of the at least one heat dissipation element 2001 is transferred to the first cooling medium through the thermal contact between the heat conducting fixing part 1003 and the first cooling medium channel 1001.

Through the above-mentioned embodiment scheme, when the circuit board layout designs of various controllers 102 are different, the specific distribution positions of multiple heat dissipation elements 2001 on the circuit board need to be changed, which can be solved by the heat conduction fixing part 1003. 1003 can be made of copper or aluminum alloy, has good thermal conductivity, and can very well conduct the heat that needs to be dissipated from the cooling element 2001 to the first cooling medium channel 1001, so that it can be absorbed by the first cooling medium. According to the specific distribution positions of the heat dissipation elements 2001 on the circuit board, correspondingly, a groove 1003a is provided at the corresponding position of the heat conduction fixing part 1003, so that the heat dissipation energy of the heat dissipation elements 2001 on the circuit board can be pasted one by one. Into the corresponding groove 1003a, on the one hand, the groove 1003a forms a corresponding accommodation space for the heat dissipation element 2001, and the heat dissipation element 2001 is required to go deep into the groove 1003a, which can increase the heat conduction area. On the other hand, In practical applications, the groove 1003a can form a match with the required heat dissipation element 2001, and it is better to just accommodate the required heat dissipation element 2001, so that the groove 1003a forms a limit to the required heat dissipation element 2001, which helps to increase the number of circuit boards and heat conduction fixing parts Fixed stability between 1003.

In this application, both the first refrigerant medium channel 1001 and the second refrigerant medium channel 1002 transport the corresponding refrigerant independently, and there is no communication between them. For both the first refrigerant medium channel 1001 and the second refrigerant medium channel 1002 Specifically, the setting of both the first refrigerant medium channel 1001 and the second refrigerant medium channel 1002 can be such that both of them share a part of the channel wall, which is used to realize the communication between the first refrigerant medium and the second refrigerant medium through the common channel wall. For heat exchange, for example, the first refrigerant medium channel 1001 and the second refrigerant medium channel 1002 are arranged side by side, and both share a part of the channel wall. For example, as shown in FIG. The two medium channels 1002 are intersected, and both share a part of the channel wall. In practical applications, the two refrigerant medium channels in the plate-fin heat exchange structure are vertically intersected, and both share a part of the channel wall. In a specific application, both the first refrigerant channel 1001 and the second refrigerant channel 1002 of the present application can be configured to form a plate-fin heat exchange structure, so that the first refrigerant and the The second refrigerant medium performs heat exchange. For the plate-fin heat exchange structure, its details can be implemented with reference to related technologies, and will not be repeated in this application.

As shown in Figure 2, in one embodiment, on the first refrigerant medium channel 1001, along the delivery direction of the first refrigerant medium (the arrows corresponding to each refrigerant medium channel in Figure 2 indicate the transport direction of the refrigerant medium ), the area for exchanging heat with the second cooling medium channel 1002 is located downstream of the at least one area that requires the heat dissipation element 2001 to dissipate heat.

Through the solution of this embodiment, in the process of the refrigerant for heat exchange cycle transported by the first refrigerant medium channel 1001, as shown in Figure 2, it is possible to dissipate heat for each required heat dissipation element 2001 first, and then pass through the first refrigerant medium channel 1001 and The channel wall shared by both of the second cooling medium channel 1002 performs heat exchange with the second cooling medium to ensure that the refrigerant used in the heat exchange cycle has the highest temperature when it dissipates heat to each cooling element 2001 that needs to be dissipated. The temperature difference between the refrigerant and the heat dissipation elements 2001 is sufficient to meet the heat dissipation requirements of the heat dissipation elements 2001 , and is more helpful to realize that the temperature of each heat dissipation element 2001 after heat dissipation is higher than the dew point.

As shown in Figure 1 and Figure 2, regarding the way the second refrigerant medium enters and leaves the second refrigerant medium passage 1002, in one embodiment of the present application, the inlet of the second refrigerant medium passage 1002 is located at the second Below the outlet of the refrigerant medium channel 1002.

In the specific application of the scheme of the above embodiment, as shown in Figure 1, the inlet and outlet of the first cooling medium channel 1001 are arranged on the left and right sides of the heat sink 101 respectively, and the inlet of the first cooling medium channel 1001 is connected with the first cooling medium channel 1001. The inlet pipeline 1001a of the medium channel is connected, and the outlet of the first cooling medium channel 1001 is connected with the outlet pipeline 1001b of the first cooling medium channel; The inlet pipeline 1002a of the second refrigerant medium channel communicates with it; the outlet of the second refrigerant medium channel 1002 is arranged on the top surface of the heat sink 101 of the application, and the outlet pipeline 1002b of the second refrigerant medium channel communicates with it correspondingly, so that The second refrigerant medium enters from the bottom of the heat sink 101 of the present application, and finally flows out from the top.

Under the solution of this embodiment, when the actual amount of the second refrigerant medium is not arbitrarily large, it is helpful to realize sufficient heat exchange of the second refrigerant medium in the second refrigerant medium channel 1002 . Taking the condensed water produced by the evaporator as the second cooling medium as an example, in the cooling process of the air conditioner, although the evaporator can continuously produce condensed water, it is not arbitrarily large. For example, in the relevant verification, a 1.5 HP The air conditioner can produce about 3 kilograms of condensed water per hour. Making good use of this amount of condensed water can meet the needs of heat exchange with the first cooling medium. At the same time, considering that the condensed water is used for one-time heat exchange, it is necessary to make good use of this amount of condensed water to improve its heat exchange efficiency with the first refrigeration medium. Through the solution of this embodiment, the condensed water inlet is located below the outlet. In actual situations, the flow rate of condensed water is relatively small. After the condensed water enters, the liquid level in the second refrigerant medium channel 1002 gradually rises. The residence time of the water in the second cooling medium channel 1002 is relatively long, and it will not flow out of the second cooling medium channel 1002 at once, thereby ensuring that the condensed water in the second cooling medium channel 1002 is compatible with the heat in the first cooling medium channel 1001. The exchange cycle fully exchanges heat with the refrigerant.

In one embodiment, a plurality of fins 1002c are formed on the inner wall of the second cooling medium passage 1002, at least in the area where heat exchange with the first cooling medium passage 1001 is performed.

Through this embodiment, at least in the area where the second refrigerant channel 1002 exchanges heat with the first refrigerant channel 1001, a plurality of fins 1002c are formed, which can not only increase the heat transfer area, but also help the second refrigerant to conduct heat exchange more efficiently. The cold energy is conducted out from the heat exchange area with the first refrigerant channel 1001 .

In one embodiment, the fins are arranged longitudinally through the second refrigerant medium passage 1002, and the arrangement direction of the fins 1002c is the same as the conveying direction of the second refrigerant medium.

The scheme of the above-mentioned embodiment will be described below in conjunction with FIG. 4. FIG. 4 is a schematic diagram of the cross-sectional structure of the inner wall of the second refrigerant medium channel provided by an embodiment of the present application. As shown in FIG. 4, each fin 1002c shown in FIG. 4 The cross-section is triangular, arranged to form a zigzag distribution, and the second refrigerant medium channel exchanges heat with the first refrigerant medium channel through one side of the zigzag distribution. The cooling medium channel 1002 is transported in a bottom-up manner as an example. The fins are arranged vertically. With the entry of condensed water, they start to continuously contact the fins 1002c arranged vertically, which is more conducive to condensation. The water efficiently conducts its cold energy from the heat exchange area with the first refrigerant channel 1001 .

In one embodiment, the first refrigerant channel is a hydraulically smooth channel.

Through this embodiment scheme, when the first refrigerant medium channel 1001 is a hydraulically smooth channel, the first refrigerant medium channel 1001 transports the first refrigerant medium, and the roughness of the inner wall surface of the first refrigerant medium channel 1001 does not reflect the effect on the first refrigerant medium. The resistance loss has an impact, which in turn helps to ensure that the refrigerant for the heat exchange cycle is output from the cooling device 101 of the present application, and avoids adverse effects on the subsequent cooling use of the refrigerant for the heat exchange cycle.

Fig. 5 is a schematic structural diagram of a heat exchange cycle system provided by an embodiment of the present application. As shown in Fig. 5, the heat exchange cycle system 11 includes:

The heat dissipation device 101 as described in any one of the above;

The controller 102 has the at least one required heat dissipation element 2001 to dissipate heat through the heat dissipation device 101 (the heat dissipation of the heat dissipation device 101 to the controller 102 can refer to FIG. 3 );

a condenser 103, configured to deliver the first refrigerant to the first refrigerant channel 1001;

An evaporator 104, configured to receive the first refrigerant output from the first refrigerant passage 1001; and

The condensed water collecting and conveying device 105 is used to collect the condensed water generated by the evaporator 104 and transport it to the second refrigerating medium channel 1002 as the second refrigerating medium.

As shown in Figure 5, the heat exchange cycle system 11 also includes: a compressor 106, a gas-liquid separator 107, a four-way valve 108, a first electronic expansion valve 109, a second electronic expansion valve 110, and a first filter 111 , the second filter 112 and the muffler 113, the connection relationship of each component is as shown in Figure 5, the heat exchange cycle operation in the heat exchange cycle system 11 shown in Figure 5 can refer to the heat exchange cycle system in the related art The heat exchange cycle process will not be repeated here.

In a specific application, the condensed water collection and delivery device 105 includes: a water collection container and a water pump. The condensed water generated by the evaporator 104 is collected through the water collection container, and then the condensed water in the water collection container is pumped out by a water pump, and delivered to the second refrigerant medium channel 1002 as the second refrigerant medium. In practical applications, the second cooling medium channel 1002 can be connected with the condensed water drainage line of the air conditioner indoor unit, and the condensed water output from the second cooling medium channel 1002 can be discharged from the condensed water drain line of the air conditioner indoor unit.

Through the scheme of the above-mentioned heat exchange cycle system 11, the refrigerant for the heat exchange cycle in the first refrigerant channel 1001 of the heat dissipation device 101 can effectively dissipate the heat that requires the heat dissipation element 2001, and then pass through the refrigerant in the second refrigerant channel 1002. The second refrigerant with a lower temperature exchanges heat with the refrigerant for the heat exchange cycle in the first refrigerant channel 1001, so that the temperature of the refrigerant for the heat exchange cycle output by the first refrigerant channel 1001 is reduced or maintained, thereby It is helpful to realize the dual requirements of effectively dissipating heat from the cooling element 2001 and reducing or maintaining the temperature of the refrigerant used in the heat exchange cycle, thereby helping to ensure the cooling effect when the refrigerant used in the heat exchange cycle is used for cooling.

In addition, the above-mentioned heat exchange cycle system 11 solution provided by this application collects condensed water as the second refrigeration medium, so that the second refrigeration medium can be obtained without additional power consumption. Part of the energy consumption of the heat exchange cycle system 11 exists in In the condensed water, the above-mentioned heat exchange cycle system 11 of the present application reuses the condensed water, and a part of the cold energy of the recovered condensed water enters the heat exchange cycle of the heat exchange cycle system, thereby achieving the purpose of saving energy, reducing consumption, and improving energy efficiency.

Fig. 6 is a schematic structural diagram of an electrical device provided by an embodiment of the present application. As shown in Fig. 6, the electrical device 1 includes:

Heat exchange cycle system 11 as described above.

Regarding the electrical equipment 1 in the above embodiment, the specific implementation of the heat exchange cycle system 11 has been described in detail in the above embodiment, and will not be described in detail here.

In addition, for the specific application product of the heat exchange cycle system 11 , it may be an air conditioner, or a product with the heat exchange cycle system 11 such as a dehumidifier.

It can be understood that, the same or similar parts in the above embodiments can be referred to each other, and the content that is not described in detail in some embodiments can be referred to the same or similar content in other embodiments.

It should be noted that in the description of the present application, terms such as "first" and "second" are used for description purposes only, and should not be understood as indicating or implying relative importance. In addition, in the description of the present application, unless otherwise specified, the meanings of "plurality" and "many" refer to at least two.

Any process or method descriptions in flowcharts or otherwise described herein may be understood as representing a module, segment or portion of code comprising one or more executable instructions for implementing specific logical functions or steps of the process , and the scope of preferred embodiments of the present application includes additional implementations in which functions may be performed out of the order shown or discussed, including in substantially simultaneous fashion or in reverse order depending on the functions involved, which shall It should be understood by those skilled in the art to which the embodiments of the present application belong.

It should be understood that each part of the present application may be realized by hardware, software, firmware or a combination thereof. In the embodiments described above, various steps or methods may be implemented by software or firmware stored in memory and executed by a suitable instruction execution system. For example, if implemented in hardware, as in another embodiment, it can be implemented by any one or combination of the following techniques known in the art: Discrete logic circuits, ASICs with suitable combinational logic gates, programmable gate arrays (PGAs), field programmable gate arrays (FPGAs), etc.

Those of ordinary skill in the art can understand that all or part of the steps carried by the methods of the above embodiments can be completed by instructing related hardware through a program, and the program can be stored in a computer-readable storage medium. During execution, one or a combination of the steps of the method embodiments is included.

In addition, each functional unit in each embodiment of the present application may be integrated into one processing module, each unit may exist separately physically, or two or more units may be integrated into one module. The above-mentioned integrated modules can be implemented in the form of hardware or in the form of software function modules. If the integrated modules are realized in the form of software function modules and sold or used as independent products, they can also be stored in a computer-readable storage medium.

The storage medium mentioned above may be a read-only memory, a magnetic disk or an optical disk, and the like.

In the description of this specification, descriptions referring to the terms "one embodiment", "some embodiments", "example", "specific examples", or "some examples" mean that specific features described in connection with the embodiment or example , structure, material or characteristic is included in at least one embodiment or example of the present application. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

Although the embodiments of the present application have been shown and described above, it can be understood that the above embodiments are exemplary and should not be construed as limitations on the present application, and those skilled in the art can make the above-mentioned The embodiments are subject to changes, modifications, substitutions and variations.

Claims (13)

1. a kind of radiator characterized by comprising

At least one for the first refrigerant of conveying, and is needed the heat of heat dissipation element to pass by the first refrigerant channel It is directed in first refrigerant, wherein first refrigerant is heat exchange circulation refrigerant；

Second refrigerant channel, for conveying the second refrigerant, second refrigerant enters second refrigeration and is situated between Temperature when matter channel enters temperature when the first refrigerant channel lower than first refrigerant；

Both first refrigerant channel and second refrigerant channel are configured to make first refrigeration Medium and second refrigerant carry out heat exchange.

2. radiator according to claim 1, which is characterized in that further include:

Thermally conductive fixed part is thermally contacted with first refrigerant channel, and it is recessed to be formed at least one on the thermally conductive fixed part Slot, for make it is described at least one need heat dissipation element to correspond thermo-contact at least one described groove, to pass through The thermo-contact for stating thermally conductive fixed part and first refrigerant channel, by it is described at least one need the heat of heat dissipation element to pass It is directed in first refrigerant.

3. radiator according to claim 1, which is characterized in that the import in second refrigerant channel is located at institute State the lower section of the outlet in the second refrigerant channel.

4. radiator according to claim 1-3, which is characterized in that

On the inner wall in second refrigerant channel, the area of heat exchange is at least carried out with first refrigerant channel Domain is formed with multiple fins.

5. radiator according to claim 4, which is characterized in that

The fin passes through the setting of second refrigerant channel, and the setting direction of the fin and second refrigeration are situated between The conveying direction of matter is identical.

6. radiator according to claim 1-3, which is characterized in that

First refrigerant channel is hydraulically smooth channel.

7. radiator according to claim 1-3, which is characterized in that

It is logical with second refrigerant along the conveying direction of first refrigerant on first refrigerant channel Road carries out the region of heat exchange, positioned at the downstream position at least one region for needing heat dissipation element to radiate.

8. radiator according to claim 1-3, which is characterized in that first refrigerant channel and institute It states both second refrigerant channels to be arranged to form plate fin heat-exchanging structure, so that first refrigerant and described Two refrigerants carry out heat exchange.

9. a kind of heat exchange circulation system characterized by comprising

Such as the described in any item radiators of claim 1-8；

Controller, at least one needs heat dissipation element with described in, to be radiated by the radiator；

Condenser, for conveying first refrigerant to first refrigerant channel；

Evaporator, for receiving first refrigerant exported from first refrigerant channel.

10. heat exchange circulation system according to claim 9, which is characterized in that further include:

Condensation water collection conveying device is situated between for collecting the condensed water of evaporator generation using condensed water as second refrigeration Matter is delivered in second refrigerant channel.

11. heat exchange circulation system according to claim 10, which is characterized in that the condensation water collection conveying device packet It includes: collecting container and water pump.

12. a kind of electrical equipment characterized by comprising

Such as the described in any item heat exchange circulation systems of claim 9-11.

13. electrical equipment according to claim 12, which is characterized in that the electrical equipment is air-conditioning.