CN111526694B - Liquid cooling system for server cabinet and server cabinet - Google Patents
Liquid cooling system for server cabinet and server cabinet Download PDFInfo
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- CN111526694B CN111526694B CN201910107841.5A CN201910107841A CN111526694B CN 111526694 B CN111526694 B CN 111526694B CN 201910107841 A CN201910107841 A CN 201910107841A CN 111526694 B CN111526694 B CN 111526694B
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- 239000007788 liquid Substances 0.000 title claims abstract description 177
- 238000001816 cooling Methods 0.000 title claims abstract description 89
- 239000012530 fluid Substances 0.000 claims abstract description 55
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 18
- 238000000034 method Methods 0.000 abstract description 6
- 238000005265 energy consumption Methods 0.000 abstract description 2
- 239000000110 cooling liquid Substances 0.000 description 13
- 239000002826 coolant Substances 0.000 description 7
- 239000012809 cooling fluid Substances 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 238000012546 transfer Methods 0.000 description 6
- 238000004891 communication Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 5
- 239000003507 refrigerant Substances 0.000 description 3
- 238000010276 construction Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000005057 refrigeration Methods 0.000 description 2
- 238000013473 artificial intelligence Methods 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000001143 conditioned effect Effects 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 239000003344 environmental pollutant Substances 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 231100000719 pollutant Toxicity 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000000032 total current spectroscopy Methods 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20763—Liquid cooling without phase change
- H05K7/20781—Liquid cooling without phase change within cabinets for removing heat from server blades
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The embodiment of the disclosure discloses a liquid cooling system for a server cabinet and the server cabinet. This a liquid cooling system for server rack includes: the CDU heat exchanger is arranged at the bottom of the server cabinet, and a liquid supply pipeline and a liquid return pipeline on the cold fluid side of the CDU heat exchanger are respectively connected with a refrigerating fluid supply pipeline and a refrigerating fluid return pipeline of the CDU; the fin tube type heat exchanger is arranged at the bottom of the server cabinet, and a liquid supply pipeline and a liquid return pipeline on the cold fluid side of the fin tube type heat exchanger are respectively connected with a liquid supply pipeline and a liquid return pipeline on the hot fluid side of the CDU heat exchanger; and the liquid cooling plate is arranged in each server of the server cabinet to absorb the heat of the heat source in the server, and a liquid supply pipeline and a liquid return pipeline of the liquid cooling plate are respectively connected with a liquid supply pipeline and a liquid return pipeline on the side of a heat fluid of the finned tube heat exchanger. The method realizes cascade utilization of different temperatures and reduces the energy consumption of the liquid cooling system.
Description
Technical Field
The present disclosure relates to the field of computer technology, and more particularly to the field of computer network technology, and more particularly to a liquid cooling system for a server rack and a server rack.
Background
With the rapid advance of the Chinese information-based society and the rise of industries such as artificial intelligence, cloud computing and the Internet of things, the construction of a large-scale data center in China shows a rapid growth trend. Large-scale national enterprises and government institutions such as finance, communication, petrifaction and electric power construct data centers and disaster recovery centers of the large-scale national enterprises and government institutions. Data flooding has brought about a great increase in the development of networks and the construction requirements of data centers, and therefore more and more servers are required to process and store data.
At present, more and more IT equipment are installed in a data center cabinet, and the overall power consumption is greatly increased. The more finely integrated chip architecture brings higher computational performance and also leads to a rapid increase in unit server cabinet power density, and the traditional air-cooled refrigeration technology is no longer the best choice. The liquid cooling technology directly radiates heat to the server or the chip by using cooling liquid, so that an intermediate air cooling link is omitted, and the radiating efficiency is higher.
Common liquid cooling schemes include cold plate cooling, immersion cooling, and spray cooling. Among them, the cold plate type cooling is the most mature and widely applied. In a cold plate cooling system, heat is dissipated to equipment in a machine room through a water chiller + a terminal air conditioner or a direct expansion air-cooled air conditioner. The cold plate cooling fluid flows within the cold plate, carrying approximately 70% of the heat of the server chip through the cold plate, with the remaining 30% being carried away by the cold air.
Disclosure of Invention
The embodiment of the disclosure provides a liquid cooling system for a server cabinet and the server cabinet.
In a first aspect, an embodiment of the present disclosure provides a liquid cooling system for a server cabinet, including: the CDU heat exchanger is arranged at the bottom of the server cabinet, and a liquid supply pipeline and a liquid return pipeline on the cold fluid side of the CDU heat exchanger are respectively connected with a refrigerating fluid supply pipeline and a refrigerating fluid return pipeline of the CDU; the fin tube type heat exchanger is arranged at the bottom of the server cabinet, and a liquid supply pipeline and a liquid return pipeline on the cold fluid side of the fin tube type heat exchanger are respectively connected with a liquid supply pipeline and a liquid return pipeline on the hot fluid side of the CDU heat exchanger; and the liquid cooling cold plate is arranged in each server of the server cabinet to absorb heat of a heat source in the server, and a liquid supply pipeline and a liquid return pipeline of the liquid cooling cold plate are respectively connected with a liquid supply pipeline and a liquid return pipeline on the side of a heat fluid of the fin tube type heat exchanger.
In some embodiments, a fan is vertically arranged in the finned tube heat exchanger, and the fan supplies air to an air inlet of the server.
In some embodiments, the liquid supply and return lines of the liquid cold plate are coupled to the liquid supply and return lines on the hot fluid side of the CDU heat exchanger via valves.
In some embodiments, the cooling fluid is a non-conductive solution.
In some embodiments, the bottom of the server cabinet is provided with an access for the liquid cooling system pipeline.
In some embodiments, the heat source comprises one or more of: server mainboard, power and hard disk.
In some embodiments, the liquid cooling system further comprises: and the water collecting tray is arranged below the CDU heat exchanger, the finned tube heat exchanger and the fan.
In a second aspect, an embodiment of the present disclosure provides a server rack, including: the liquid cooling system for the server cabinet as described in any one of the above.
According to the liquid cooling system for the server cabinet and the server cabinet provided by the embodiment of the disclosure, the CDU heat exchanger is arranged at the bottom of the server cabinet, and a liquid supply pipeline and a liquid return pipeline on the cold fluid side of the CDU heat exchanger are respectively connected with a refrigerating fluid supply pipeline and a refrigerating fluid return pipeline of the CDU; the method comprises the following steps that a fin tube type heat exchanger is arranged at the bottom of a server cabinet, and a liquid supply pipeline and a liquid return pipeline on the cold fluid side of the fin tube type heat exchanger are respectively connected with a liquid supply pipeline and a liquid return pipeline on the hot fluid side of a CDU heat exchanger; and the liquid cooling plate is arranged in each server of the server cabinet to absorb the heat of the heat source in the server, and the liquid supply pipeline and the liquid return pipeline of the liquid cooling plate are respectively connected with the liquid supply pipeline and the liquid return pipeline on the side of the heat fluid of the fin tube type heat exchanger. In the process, the CDU heat exchanger and the finned tube heat exchanger which are connected in series are arranged at the bottom of the server cabinet, and the finned tube heat exchanger is connected in series with the liquid cooling cold plates of the servers, so that cascade utilization at different temperatures is realized, and energy consumption can be reduced; the cold and hot air of the cabinet is in internal circulation and is not influenced by the external environment and the air quality; the investment cost is low, the delivery speed is high, the deployment is flexible, and the energy conservation is reliable.
Drawings
Other features, objects and advantages of the present disclosure will become more apparent upon reading of the following detailed description of non-limiting embodiments thereof, with reference to the accompanying drawings in which:
fig. 1 is an exemplary block diagram of one embodiment of a liquid cooling system for a server cabinet according to the present disclosure;
fig. 2 is a schematic diagram of another embodiment of a liquid cooling system for a server cabinet according to the present disclosure;
fig. 3 is a flow diagram of a third embodiment of a liquid cooling system for a server cabinet according to the present disclosure.
Detailed Description
The present disclosure is described in further detail below with reference to the figures and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not to be construed as limiting the invention. It should be noted that, for convenience of description, only the portions related to the present invention are shown in the drawings.
It should be noted that, in the present disclosure, the embodiments and the features of the embodiments may be combined with each other without conflict. The present disclosure will be described in detail below with reference to the accompanying drawings in conjunction with embodiments.
As shown in fig. 1, fig. 1 illustrates an exemplary block diagram of one embodiment of a liquid cooling system for a server rack.
This a liquid cooling system 100 for server rack includes: CDU heat exchanger 110, finned tube heat exchanger 120, and liquid cold plate 130.
And the CDU heat exchanger 110 is arranged at the bottom of the server cabinet 140, and the cold fluid side 111 of the CDU heat exchanger is connected with a refrigerating fluid supply pipeline and a refrigerating fluid return pipeline of the CDU. A heat exchanger (heat exchanger) is a device that transfers part of the heat of a hot fluid to a cold fluid, and is also called a heat exchanger.
Cold liquid distribution units (CDUs) regulate cold liquid in TCSs or DECSs in various ways and circulate the cold liquid through process cooling system (TCS) or data-communication equipment cooling system (DECS) loops to cooling loops within racks, cabinets or data communication equipment. A CDU typically includes a heat exchanger, a reservoir (accumulator), a water pump (or multiple water pumps for redundancy), a chemical bypass filter for solvent and water removal, and a particulate filter.
For example, the CDU can regulate the temperature and cleanliness (particulate and compound composition) of the cold liquid. The CDU configuration shows that the cold liquid temperature is controlled by means of a heat exchanger. It is noted that cold liquid temperature control may also be achieved by exchanger bypass. The CDU may also be designed to condition the cold liquid if the cold liquid in the TCS or the DECS is a refrigerant or a non-conductive fluid. The rack-level or facility-level refrigerant liquid delivered to the CDU may be a refrigerant provided by a direct expansion system (DX).
The function of the CDU depends primarily on the chilled liquid being conditioned and the level at which the CDU is located (e.g., whether inside the data communications equipment or inside the rack/cabinet, or at the facility level or outside the rack). In all cases, the CDU always has a water pump and compressor for circulating fluid through the cold liquid loop.
The CDU may be configured to interface with one or more controllers that control the operation of the CDU, which may utilize sensor inputs located in the data communications equipment, racks, or facility levels.
And the finned tube heat exchanger 120 is arranged at the bottom of the server cabinet, and the cold fluid side 121 of the finned tube heat exchanger is connected with the liquid supply pipeline and the liquid return pipeline of the hot fluid side 112 of the CDU heat exchanger.
In this embodiment, the basic heat transfer element of the finned tube heat exchanger is a finned tube, and the finned tube is formed by combining a base tube and fins. The base pipe is usually a circular pipe, but also an oval pipe and a flat pipe. The surface structure of the fin comprises a flat fin, an intermittent fin, a corrugated fin, a perforated fin and the like. Wherein, the latter two are high-efficiency heat exchange plate type.
The finned tubes can be divided into two basic types of longitudinal and radial from the structural type, and other types are the development and the deformation of the two types, for example, the large helix angle finned tube is close to the longitudinal direction, and the small helix angle finned tube is close to the radial fin and has the shapes of round, rectangular and needle. In addition, the fins can be arranged outside the tube and are called as outer finned tubes; or can be arranged in a tube, namely an inner finned tube or both the inner tube and the outer tube.
And the liquid cooling plate 130 is arranged in each server 141 of the server cabinet to absorb heat of a heat source in the server, and a liquid supply pipeline and a liquid return pipeline of the liquid cooling plate are respectively connected with a liquid supply pipeline and a liquid return pipeline of the heat fluid side 122 of the fin tube type heat exchanger.
In this embodiment, the heat source refers to a heat dissipation element in the server cabinet. For example, the heat source may include one or more of: server mainboard, power and hard disk.
A liquid cooling plate (liquid cooling plate) is used for indirect liquid cooling of electronic equipment, is a single-fluid heat exchanger, has a large heat exchange area, a small equivalent diameter of a fluid channel and a high heat exchange coefficient. The principle of the liquid cooling cold plate is that a flow channel is formed in a metal plate in a processing mode, an electronic element is installed on the surface of the plate (a heat conducting medium is coated in the middle of the plate), cooling liquid enters from an inlet of the plate and exits from an outlet of the plate, and heat emitted by the element is taken away.
In this embodiment, liquid cooling plate and server chip are pressed close to and are arranged, and the coolant liquid in the liquid cooling plate is given in the heat transfer in the server chip, and the coolant liquid after absorbing the heat gives the refrigerated water with heat transfer in fin tubular heat exchanger, later gives the refrigerated water in the CDU heat exchanger via the heat transfer in fin tubular heat exchanger with the coolant liquid. The temperature range of the cooling liquid in the liquid cooling plate is 20-50 ℃, and the temperature of the server chip can be ensured not to exceed the standard by adjusting the flow of the cooling liquid.
Here, it is assumed that the temperature of the chilled water supply (the liquid supply line on the cold fluid side 111 of the CDU heat exchanger) is T1, the temperature of the coolant flowing out of the CDU (the liquid supply line on the hot fluid side 112 of the CDU heat exchanger) is T2, the temperature of the cold air cooled by the fin tube heat exchanger is T3, the temperature of the coolant heated by the fin tube heat exchanger (the liquid supply line on the hot fluid side 122 of the fin tube heat exchanger) is T4, and finally the coolant reaches the liquid cooling cold plate through the water collecting and distributing device to dissipate heat for the server chip, so T1 < T2 < T3 < T4.
In some alternative implementations of the present embodiment, the cooling fluid is a non-conductive solution. In this implementation, by setting the cooling fluid to be a non-conductive solution, damage to the server chip when a leak occurs can be avoided.
In some optional implementations of this embodiment (not shown in the figures), the bottom of the server cabinet is provided with an inlet and an outlet for the pipes of the liquid cooling system to enter and exit. In this implementation, the inlet and outlet for the liquid cooling system to enter and exit are arranged at the bottom of the server cabinet, so that the liquid cooling system can be installed quickly.
According to the liquid cooling system for the server cabinet in the embodiment of the disclosure, the cooling liquid absorbs heat in the fin tube type heat exchanger to heat up, and then flows through the cold plate heat exchanger to cool down the server chip, so that the investment of a tail end air conditioner can be saved, the space can be saved, and the gradient utilization of cooling capacity can be realized. The utilization efficiency of cold volume and the refrigeration efficiency of liquid cooling system have been improved.
An exemplary block diagram of another embodiment of a liquid cooling system for a server rack of the present disclosure is described below in conjunction with fig. 2.
As shown in fig. 2, the liquid cooling system 200 for a server cabinet includes: CDU heat exchanger 110, finned tube heat exchanger 120, and liquid cold plate 130. Wherein, a fan 123 is vertically arranged in the fin-tube heat exchanger 120, and the fan 123 supplies air to the air inlet 142 of the server 141.
And the CDU heat exchanger 110 is arranged at the bottom of the server cabinet 140, and the cold fluid side 111 of the CDU heat exchanger is connected with a refrigerating fluid supply pipeline and a refrigerating fluid return pipeline of the CDU. A heat exchanger (also called heat exchanger) is a device that transfers part of the heat of a hot fluid to a cold fluid.
And the finned tube heat exchanger 120 is arranged at the bottom of the server cabinet, and the cold fluid side 121 of the finned tube heat exchanger is connected with the liquid supply pipeline and the liquid return pipeline of the hot fluid side 112 of the CDU heat exchanger.
And the liquid cooling plate 130 is arranged in each server of the server cabinet to absorb heat of a heat source in the server, and a liquid supply pipeline and a liquid return pipeline of the liquid cooling plate are respectively connected with a liquid supply pipeline and a liquid return pipeline of the heat fluid side 122 of the fin tube type heat exchanger.
In some alternative implementations of the present embodiment, the cooling fluid is a non-conductive solution. In this implementation, by setting the cooling fluid to be a non-conductive solution, damage to the server chip when a leak occurs can be avoided.
In some optional implementations of this embodiment (not shown in the figures), the bottom of the server cabinet is provided with an inlet and an outlet for the pipes of the liquid cooling system to enter and exit. In this implementation, the inlet and outlet for the liquid cooling system to enter and exit are arranged at the bottom of the server cabinet, so that the liquid cooling system can be installed quickly.
It should be understood that the CDU heat exchanger 110, the finned tube heat exchanger 120, and the liquid cold plate 130 in the embodiment shown in fig. 2 described above correspond to the CDU heat exchanger 110, the finned tube heat exchanger 120, and the liquid cold plate 130 in the embodiment shown in fig. 1 described above. Therefore, in the embodiment shown in fig. 1, the descriptions of the operations and features of the CDU heat exchanger 110, the finned tube heat exchanger 120, and the liquid-cooled cold plate 130 also apply to the CDU heat exchanger 110, the finned tube heat exchanger 120, and the liquid-cooled cold plate 130 in the embodiment shown in fig. 2, and are not repeated herein.
Compared with the liquid cooling system for the server cabinet in the embodiment of fig. 1, the liquid cooling system for the server cabinet provided by the above embodiment of the disclosure has the advantages that the fan 123 is added, heat exchange is performed between the chilled water and the cooling liquid in the CDU heat exchanger, the cooled cooling liquid flows through the finned tube heat exchanger first, the generated cold air dissipates heat for the server main board, the power supply, the hard disk and the like, and the fan plays a role in enhancing heat exchange by forced convection and drives the air to circulate in the cabinet.
Referring to fig. 3, an exemplary block diagram of a third embodiment of a liquid cooling system for a server cabinet according to the present disclosure is shown.
As shown in fig. 3, the process 400 of the liquid cooling system for a server cabinet of the embodiment may include: CDU heat exchanger 110, finned tube heat exchanger 120 and liquid cold plate 130. Wherein, a fan 123 is vertically arranged in the finned tube heat exchanger 120, and the fan 123 supplies air to the air inlet 142 of the server 141. The liquid supply and return lines of the liquid cold plate are coupled to the liquid supply and return lines on the hot fluid side 112 of the CDU heat exchanger via valves 150.
In this embodiment, the liquid supply pipeline and the liquid return pipeline of the liquid cooling cold plate are respectively communicated with the liquid supply pipeline and the liquid return pipeline of the hot fluid side 112 of the CDU heat exchanger via the valve 150, that is, the valve 150 for bypassing the liquid supply pipeline and the liquid return pipeline of the hot fluid side 112 of the CDU heat exchanger to the liquid supply pipeline and the liquid return pipeline of the liquid cooling cold plate respectively is disposed on the cold fluid side 121 of the fin tube heat exchanger.
When the finned tube heat exchanger breaks down, the valve 150 can be opened, so that the cooling liquid of the CDU heat exchanger does not flow through the finned tube heat exchanger any more, and is directly output to the liquid cooling cold plate from the CDU heat exchanger. Furthermore, front and rear doors of the cabinet can be opened to ensure normal operation of the server by adopting other heat dissipation modes such as air cooling and the like. When the cabinet normally operates at ordinary times, the front door and the rear door of the cabinet are kept closed, and pollutants or water vapor of air are prevented from entering the cabinet.
In some alternative implementations of the present embodiment, the cooling fluid is a non-conductive solution. In this implementation, by setting the cooling liquid to be a non-conductive solution, damage to the server chip when leakage occurs can be avoided.
In some optional implementations of this embodiment (not shown in the figures), the bottom of the server cabinet is provided with an inlet and an outlet for the pipes of the liquid cooling system to enter and exit. In this implementation, the inlet and outlet for the liquid cooling system to enter and exit are arranged at the bottom of the server cabinet, so that the liquid cooling system can be installed quickly.
In some optional implementations of this embodiment, the liquid cooling system further includes: a water collection tray 160 located below the CDU heat exchanger, the finned tube heat exchanger, and the fan. In the implementation mode, the bottom of the cabinet is also provided with a water pan, and liquid leaked from the pipeline and condensed water generated by the fin tube type heat exchanger are collected to the water pan and are discharged out of the cabinet through a drain pipe.
It should be understood that the CDU heat exchanger 110, the finned tube heat exchanger 120, and the liquid cold plate 130 in the embodiment illustrated in fig. 3 described above correspond to the CDU heat exchanger 110, the finned tube heat exchanger 120, and the liquid cold plate 130 in the embodiment illustrated in fig. 1 described above. Therefore, in the embodiment shown in fig. 1, the descriptions of the operations and features of the CDU heat exchanger 110, the finned tube heat exchanger 120, and the liquid-cooled cold plate 130 also apply to the CDU heat exchanger 110, the finned tube heat exchanger 120, and the liquid-cooled cold plate 130 in the embodiment shown in fig. 3, and are not repeated herein.
Different from the embodiment shown in fig. 1, the liquid cooling system for a server cabinet according to the above embodiment of the disclosure is that: the fan 123 is additionally arranged, heat exchange is carried out between the frozen water and the cooling liquid in the CDU heat exchanger, the cooled cooling liquid flows through the finned tube heat exchanger firstly, the generated cold air dissipates heat of a server main board, a power supply, a hard disk and the like, and the fan plays a role in forced convection to enhance heat exchange and drives the air to circulate in the cabinet. Further, through setting up the bypass valve in this embodiment, can make the coolant liquid of CDU heat exchanger no longer flow through fin tubular heat exchanger, and other radiating mode of deuterogamying can guarantee the normal operating of server when fin tubular heat exchanger trouble.
The present disclosure also provides a server cabinet, which may include any one of the above liquid cooling systems for a server cabinet.
It should be understood by those skilled in the art that the cold fluid side 111 of the CDU heat exchanger 110 and the cold fluid side 121 of the fin-and-tube heat exchanger 120 in the above embodiments refer to the sides of the CDU heat exchanger 110 and the fin-and-tube heat exchanger 120, respectively, which receive cold from the outside and exchange heat to the outside; the heat fluid side of the CDU heat exchanger 110 and the heat fluid side of the fin-and-tube heat exchanger 120 are sides of the CDU heat exchanger 110 and the fin-and-tube heat exchanger 120 that receive heat from the outside and provide cooling to the outside, respectively.
The liquid supply pipelines of the CDU heat exchanger 110, the finned tube heat exchanger 120, and the liquid cooling plate 130 in the above embodiments refer to pipelines through which low-temperature cooling liquid flowing to the liquid cooling plate flows; the liquid return pipeline in the above embodiment refers to a pipeline through which heated cooling liquid, of which heat flows out of the liquid cooling cold plate, circulates.
The foregoing description is only exemplary of the preferred embodiments of the disclosure and is illustrative of the principles of the technology employed. It will be appreciated by those skilled in the art that the scope of the invention in the embodiments of the present disclosure is not limited to the specific combination of the above-mentioned features, but also encompasses other embodiments in which any combination of the above-mentioned features or their equivalents is made without departing from the inventive concept as defined above. For example, the above features and (but not limited to) technical features with similar functions disclosed in the embodiments of the present disclosure are mutually replaced to form the technical solution.
Claims (8)
1. A liquid cooling system for a server cabinet, comprising:
the cold liquid distribution device CDU heat exchanger is arranged at the bottom of the server cabinet, and a liquid supply pipeline and a liquid return pipeline on the cold fluid side of the CDU heat exchanger are respectively connected with a refrigerating liquid supply pipeline and a refrigerating liquid return pipeline of the CDU;
the fin tube type heat exchanger is arranged at the bottom of the server cabinet, and a liquid supply pipeline and a liquid return pipeline on the cold fluid side of the fin tube type heat exchanger are respectively connected with a liquid supply pipeline and a liquid return pipeline on the hot fluid side of the CDU heat exchanger;
and the liquid cooling cold plate is arranged in each server of the server cabinet to absorb the heat of the heat source in the server, and a liquid supply pipeline and a liquid return pipeline of the liquid cooling cold plate are respectively connected with a liquid supply pipeline and a liquid return pipeline on the side of the heat fluid of the fin tube type heat exchanger.
2. The liquid cooling system of claim 1, wherein a fan is vertically disposed in the finned tube heat exchanger, and the fan blows air to an air inlet of the server.
3. The liquid cooling system of any one of claims 1 or 2, wherein the liquid supply and return lines of the liquid cooling plate are coupled to the liquid supply and return lines on the hot fluid side of the CDU heat exchanger via valves.
4. The liquid cooling system of claim 1, wherein the chilled liquid is a non-conductive solution.
5. The liquid cooling system of claim 1, wherein the bottom of the server cabinet is provided with an access for ingress and egress of the pipes of the liquid cooling system.
6. The liquid cooling system of claim 1, wherein the heat source comprises one or more of: server mainboard, power and hard disk.
7. The liquid cooling system of claim 2, wherein the liquid cooling system further comprises: and the water collecting tray is arranged below the CDU heat exchanger, the finned tube heat exchanger and the fan.
8. A server cabinet comprising a liquid cooling system for a server cabinet as described in any of the above 1-7.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910107841.5A CN111526694B (en) | 2019-02-02 | 2019-02-02 | Liquid cooling system for server cabinet and server cabinet |
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| CN201910107841.5A CN111526694B (en) | 2019-02-02 | 2019-02-02 | Liquid cooling system for server cabinet and server cabinet |
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| CN111526694B true CN111526694B (en) | 2022-12-13 |
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| CN112804856B (en) * | 2020-12-21 | 2023-01-17 | 广东申菱环境系统股份有限公司 | Heat exchange device for non-full liquid cooling server |
| US11839064B2 (en) * | 2021-04-19 | 2023-12-05 | Baidu Usa Llc | Rack liquid distribution system with redundant design |
| CN116321934B (en) * | 2022-12-30 | 2023-12-22 | 比赫电气（太仓）有限公司 | 5U rack-type immersion liquid cooling system |
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| CN103052304A (en) * | 2012-12-14 | 2013-04-17 | 广州高澜节能技术股份有限公司 | Server cabinet cooling system |
| CN105929917A (en) * | 2016-04-28 | 2016-09-07 | 浪潮集团有限公司 | Mute heat dissipation system and mute heat dissipation method applied to server |
| CN106659083A (en) * | 2016-12-28 | 2017-05-10 | 郑州云海信息技术有限公司 | Cooling system for liquid-cooled server |
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