CN1099894A - Magnetic head for recording with ultra low force - Google Patents
Magnetic head for recording with ultra low force Download PDFInfo
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- CN1099894A CN1099894A CN 93118811 CN93118811A CN1099894A CN 1099894 A CN1099894 A CN 1099894A CN 93118811 CN93118811 CN 93118811 CN 93118811 A CN93118811 A CN 93118811A CN 1099894 A CN1099894 A CN 1099894A
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Abstract
一种磁盘驱动装配件，其中支承件和读取/记录 传感器被集成为组合装配件并采用薄膜沉积技术制 造，由此产生一种允许接触录音的轻质装配件。在一 个实施例中，传感器以排和列结构被沉积在覆盖晶片 基片的可剥离和支持层上，该基片厚度等于所需支承 件长度。晶片被分离成许多排部分，每个排部分上， 第二可剥离层被形成在分离的一侧上，并且用适合的 材料沉积多层薄层，以形成包括延伸到薄膜传感器导 线的支承层。
A disk drive assembly in which the support and read/record sensor are integrated as a combined assembly and fabricated using thin film deposition techniques, resulting in a lightweight assembly that allows access to recordings. In one embodiment, the sensors are deposited in a row and column configuration on a peelable and support layer covering a wafer substrate with a thickness equal to the desired support length. The wafer is separated into a number of row sections, and on each row section, a second peelable layer is formed on the separated side, and multiple thin layers of suitable material are deposited to form a support layer including wires extending to the thin film sensors. .
Description
The present invention relates to movable magnetic memory apparatus and recording element thereof, more particularly is combination sensor carrier arrangement that is suitable for being produced in batches and the method for making this device.
Seek a kind of effective record scheme that is used for magnetic disk memory and still be one of problem that override need consider.The needs that increase data storage density and prolong equipment life impel and carry out this research.
Magnetic disk memory is an information-storing device, and it adopts at least one rotating data storage disk, and this disk has the concentric data tracks of holding data information; A sensor is used for never with reading data on the track or data logging being arrived different tracks; A slide block is used for making sensor to be fixed near the track place with the form that is suspended on this medium usually; A supporting member is used for flexibly the sensor and the slide block of fixing track top; And a positioning stop that is connected to this subassembly, so that when reading or write down, movable sensor makes this sensor remain on the center line top of this track to the track place that will arrive simultaneously.Sensor is connected on the air-supported slide block, and they all contact the air cushion that produces by the disk that rotates or with disk again and are supported on the track of disk.Supporting mass provides high resiliency rigidity and spatial stability between slide block and brake toggle.Require this supporting member to keep the data surface of sensor and the close disk of slide block with alap load forces.Reading in servicely, detent makes sensor be fixed on correct track top according to desired data, and at the record run duration, detent makes sensor be positioned at the correct track place that data is arranged.So the control brake device promptly usually to move mobile combination support spare-sensor-slide block assembly parts transverse to track, makes sensor be in correct track top.
In conventional disk set, sensor and slide block are to separate manufacturing with supporting member, and the controller by an in check accurate operation connects then.These parts are very little, and their mutual positions must be accurately.Sensor must accurately be arranged to the related track place, and this just means that supporting member must accurately be arranged to slide block.Supporting member is necessary for slide block and provides flexible, gradient and rolling movement with respect to the direction of motion of rotating disk, and anti-swing performance also is provided simultaneously.Supporting member exists any error all can cause the breaking-up of these parts with respect to the orientation of slide block.The amplifier that is placed on the supporting member or on the detent drawn and is connected to by lead along supporting member.Lead must not increase the elastic stiffness of slide block when good electrical connection is provided.Usually lead is welded by scolder, for example is welded to sensor output lead and amplifier.In addition, error can cause that whole subassembly damages.
People's such as the deputy Kant of the present invention United States Patent (USP) 4670804 has been described a kind of slide block-supporting member assembly parts, and it comprises the supporting member of flexible material sheet, deposits the conductor that is used for sensor thereon, and supporting member is being supported slide block and sensor module.The flexible strip that stainless steel supporting member of the prior art is deposited conductor is replaced.In this patent, polyimide flexible strip and slide block/sensor pack are made respectively, with for example bonding method they are connected to each other then.Here do not show a kind of like this combination sensor/slide block/supporting member assembly parts, these assembly parts do not need other Connection Step between supporting member and slide block.
Known supporting member arm can be made by polyimide material, and it has many leads, and these leads are connected to the sensor that directly is deposited on the polyimide supporting member.People's such as the deputy Ainslie of the present invention United States Patent (USP) 4789914 discloses and can weld the direct technology that is connected with slide block of the supporting member that will contain lead in enough contacts.This sensor has been deposited on this slide block.This slide block comprises the lead seat and is arranged at connection wire on the slide block between lead seat and sensor.In addition, this slide block and sensor also are to separate manufacturing with the supporting member arm, then by with the disclosed contact welding of this patent they being interconnected.Disclosed as other known technology, the combination of this slide block and Sensor section is to separate to produce with the supporting assembly parts that comprise internal connecting line.Do not show combination sensor/slide block/the have supporting member of lead, the yet undeclared method that makes up.
Contact is read technology and has been shown very big development prospect in recent years.Slide block device with supporting member made from active material adopts and to make the cycle sensor sex work realize that contact reads, that is, only just contact when requiring to read/write down operation, and all the other times, this slide block floats on the disk contact one and highly locates.The scheme that another kind of contact is read is to adopt " flexible " magnetic head magnetic disk surface that nuzzles up.Used magnetic head is by forming a film on substrate, separating this film then and make in this scheme.For example, the United States Patent (USP) 5041932(Hamilton of Censtor Corp.), disclose a kind of be used for contact history and read information lightweight, combination sensor/flexible head/conductor structure.Yet " flexible " magnetic head scheme needs an elaborate mechanism, with that realize suiting and control precision.
Have been found that vertical sensor head realized several advantages; The most significant advantage is to make this magnetic head winding along wafer length.This structure is applicable to the situation of the big variation of electrode tip length that the super life-span mechanical wear of storer causes, thereby has prolonged the life-span of whole device.
Regrettably, related some drawbacks limit of all these design proposals their application and enforcement.Surpassing typical products under the life-span, estimating that head wear is 400 microinchs.This a large amount of wearing and tearing have limited the application of many this schemes, and the top of electrodes of conventional head approximately only is 1 micron long usually, wears away soon in this application.
In addition, although film-forming method allows magnetic head to be combined on the supporting member, the wafer area that this structural requirement is a large amount of so just makes the magnetic head output of each wafer be significantly less than the level of conventional head production run, also is lower than admissible level.
Therefore, the purpose of this invention is to provide a kind of disk system, particularly a kind of sensor and support system, this system has overcome the defective of prior art.
Another object of the present invention provides a kind of supporting member and sensor element of enhancing.
Another object of the present invention provides a kind of lightweight supporting member-sensor that reduces head wear.
A further object of the present invention provides and a kind of useful supporting member-sensor assembly parts is read in contact.
A further object of the invention is to produce a kind of film supports part-sensor that can control its startup.
Have a purpose to provide a kind of record drive unit again, this device has adopted film supports part-sensor of the present invention.
The invention provides a kind of disk drive Equipment Part, wherein supporting system and sensor are combined into one, and adopting the film deposition techniques manufacturing, the assembly parts that thin film technique is produced have very little weight, therefore allow to select between suspension or contact history.Sensor that is combined into one and supporting system are to make by produce a plurality of sensors in batches with row or array structure on substrate.These sensors of one row's part further come batch machining by form slide block-supporting member assembly on each sensor, form the lead of supporting part and each sensor on each sensor of substrate row part together.By etching or cutting, or, remove the structure of support bearing part by removing the strippable coating that before forming supporting part, deposits.This supporting part has flexible, and maintenance simultaneously is connected with slide block and its sensor.Cut or cut into individual unit by arranging part, can be made into single-sensor-support system.
In the manufacturing of a kind of embodiment, equal at thickness to form first strippable coating on the wafer substrate of required supporting member length.Then, on first strippable coating, form supporting layer, then on this supporting layer, form a plurality of thin film sensors with the layout of row and column.Wafer is separated into a plurality of row's parts, and each row who has a sensor simultaneously separates from each row, and these row form this row's part of the thin film sensor that has been shaped.Second strippable coating forms in the separation side of row's part of separating from the resulting wafer substrate that has thin film sensor.Then, on second strippable coating, by the thin layer formation supporting course of deposition resilient material.Lead is that two coil-end from thin film sensor extend to the opposite end (free end) of supporting course and form.At last, with the dissolving of first and second strippable coatings, it is standby to stay supporting/sensor assembly parts.Resulting device allows to adopt conventional sensor on the integrated slide block-supporting assembly parts of very little weight.This device can adopt the slide block technology and the high-density film magnetic head product of generally acknowledging to make.In second embodiment, the thickness of substrate equals the needed width of supporting part.This thin film sensor is deposited on the substrate with strippable coating subsequently, and it also is the structure deposition with row and column.Yet in row's part, sensor is cut apart at a certain distance, and this distance will become the length of slide block.Row's part is separated from wafer substrate, and supporting course deposits to the suitable side of this row's part.To arrange part then and be separated into single sensor-supporting member, with the strippable coating dissolving, make it and substrate separation subsequently by incision, etching, cutting or mechanical method.
Sensor and supporting course can replace strippable coating directly to deposit on the substrate.Substrate is removed by etching or sawing on request.In this case, can the reserve part substrate, with slide block holder as sensor.
Aforesaid and other purpose of the present invention, feature and advantage will show from the more specific description of the preferred embodiments of the present invention of doing below in conjunction with accompanying drawing.
Fig. 1 is the skeleton view by the magnetic disk surface sensing relation of the combine and assemble part of the present invention of detent connection location and magnetic disk memory;
Fig. 2 is the top view that has swing brake and adopt magnetic recording of the present invention mechanism;
Fig. 3 A is the skeleton view of an embodiment that is used for the combination sensor-supporting member of the present invention of magnetic disk memory combine and assemble part shown in Figure 1;
Fig. 3 B is used in the process of combine and assemble part shown in the shop drawings 3A, forms the skeleton view of substrate of a plurality of Magnetic Sensors of row and column structure thereon;
Fig. 4 A is the top view of the wafer substrate of row or the sensor of array structure layout on the circular wafer that is presented at shown in Fig. 3 B;
Fig. 4 B is the substrate cut-open view along 4B-4B line among Fig. 4 A;
Fig. 5 A is the skeleton view that is used for second embodiment of magnetic disk memory shown in Figure 2 combine and assemble part of the present invention;
Fig. 5 B is used in the process of combine and assemble part shown in the shop drawings 5A, forms the skeleton view of substrate of a plurality of Magnetic Sensors of row and column thereon;
Fig. 6 is a skeleton view of arranging that takes off from wafer shown in Fig. 5 B.
Fig. 7 A is the top view that deposits the row shown in Figure 6 who forms support layering of the present invention;
Fig. 7 B is the row's with supporting part sensor that takes off along 7B-7B line among Fig. 7 A a cut-open view;
Fig. 8 be when with substrate when the supporting of Fig. 7 A and 7B and sensor element are removed, the side view of row's combine and assemble part is described.
Supporting system of the present invention, slide block and sensor are combined into one, and adopt the film deposition techniques manufacturing, and the assembly parts of thin film technique manufacturing have very little weight. The preferred embodiments of the present invention are generally used in the large-scale multiple media drive, but also find to be used for single media drive, generally use in slim calculator. Said medium can be also disk of band shape.
A kind of sensor of standard is in the decision of adopting supporting member length as origination wafer thickness Obtained among the embodiment of factor. In addition, choose wantonly with this textural association all-in-one-piece arm, and can be improved to movable, therefore only when for reading/record when needing to contact, permission dynamic load(loading) and unload from coiling.
In this embodiment, the conventional sensors of well-known structures is fabricated on the wafer substrate. The technology of making sensor on the above-mentioned United States Patent (USP) 4624048 described wafer substrate to this example that implements usefulness. In this technology, sensor and the mechanism that is associated are known. Sensor is deposited over quite thick aluminium or other can rise on the material layer that is fit to that stops etching action, and this layer also may be as Slipper. Row's part is cut off from wafer, and is ground to as the needed size of inductive pick-up, for example critical cross-section height. Another kind method is to determine this size with photoetching technique. The top of this row's part grinds to form a smooth surface.
Stop etched material layer in this row's part top deposition. This step provides a last crooked thick material as supporting member. The deposits conductive material layer is as the part of supporting member, and the electrode effect that sensor element is connected with its electric part of control that provides is provided.
Among another embodiment, allow before introducing conductor, to deposit earlier first ground plane layer. One deck top ground plane layer provides bigger scattered field isolation, makes simultaneously the symmetrical stressed reduction that produces owing to thermal mismatching, and in some applications, the two all needs.
Etch process can be used for making substrate to remove from slide block-support body part, only stays supporting material and the sensing element with related lead. Extremely light supporting-sensor assembly parts so just are provided. Removing of substrate can be finished by adopting strippable coating. At the beginning, apply at substrate and to cover a strippable coating, so that the film of deposition as discussed above is in the end peeled off in the operation easily. Also having a kind of scheme is the material that grinds off or corrode suitable thickness from row's part, stays required structure. Being suitable for the lead that " bending " is connected on the sensor around the turning can realize with various technology. A kind of scheme is the termination electrode, so as in grinding steps this side Face is exposed, and allows to deposit from the top in order to connect so far subsequently. If the top lateral margin on sensor head surface is made to circle, then this processing becomes more convenient. Supporting part is with any reinforcement of selecting in several technology. The reinforcement of supporting member is needs in special applications or for adapting to dynamical system.
This reinforcement is preferably finished by the thickness distribution that changes supporting member itself. The variation of thickness is little to the increase of whole weight, and provides high control to add powerful feature. Anisotropic rigidity adopts the groove line to realize.
In order automatically partly to aim at analogous shape, on-chip groove also is used to determine area. Utilization by tiny chip increases with regard to the number of the sensing element that allows to make at single wafer for this, these little chips are adhered on the bigger supporting member, in these little chip form, provide a groove, so that this chip and supporting member auto-alignment simultaneously.
The low rigidity of supporting assembly parts allows it easily to be attached on the brake toggle. Any problem that causes for fear of static friction, zero load when the arm made from active material or supporting part can make slide block contact with disk with sensor usually. By the Activation Activity material, slide block is contacted under gratifying active force with disk with its sensor.
With reference to Fig. 1, a kind of magnetic disk memory of the present invention system that embodies is described, it comprises linear brake 10 and the part of the disk 12 of the data logging magnetic disk memory that matches.This linear brake 10 comprises a sound (sound line) coil motor 14, this voice coil motor 14 comprises a coil that can move in the magnetic field of fixing permanent magnetism assembly parts (not shown), these fixing permanent magnetism assembly parts have a magnetic core and an external structure of being supported by shell 16.A brake toggle 20 is connected to movable coil 14.Be connected to brake arm 20 the other end be a plurality of arms 21, they each is being supported a combination sensor-slide block-supporting assembly parts 22, it is the explained hereafter that proposed below this paper.Assembly parts 22 comprise sensor-slide block 24 and supporting part 26.This supporting part 26 can support sensor-slide block 24 on the surface of disk 12 on the air-supported or pad that is produced by disk 12 rotations.If desired, supporting part 26 can support sensor-slide block 24 to contact with magnetic disk media.Air-supported surface refers to the shoe surface of parallel and close magnetic disk surface.It comprises two aspect structures, and promptly She Ji slider suspension is on disk and at run duration, and the slide block of design contacts with the surface of recording medium-disk 12.
The supporting part 26 of combination sensor-slide block-supporting assembly parts 22 provides a load to sensor-slide block assembly parts 24, normally perpendicular to the surface of disk 12, this normal load makes sensor-slide block assembly parts 24 keep contacting with the data surface of disk 12 when disk 12 does not rotate for it.When disk 12 rotations, resist mutually with the normal load that is applied on sensor-slide block assembly parts 24 by supporting part 26 the air-supported of generation between sensor-slide block assembly parts 24 and the disk 12.
At run duration, sensor-slide block assembly parts 24 are moved on the disk 12 data faces with one heart in the data tracks on the needed track by starting voice coil motor 14.In order to read or record, require sensor-slide block assembly parts promptly to move on on another track from a track.The sensor of assembly parts 24 must be fixed on the suitable position, required track top, and in the shortest time, reach this track.The detent 10 that Fig. 1 described is linear brakes, and it moves combine and assemble part 22 on accurately transverse to the direction of track.The magnetic disk memory of the routine of other type adopts swing brake, as in the above-mentioned United States Patent (USP) 3849800 and as shown in Fig. 2.Swing brake usually only moves combine and assemble part of the present invention on arching trajectory radially, and as the alternative part of linear brake 10.
When combine and assemble part 22 on disk 12, be suspended in air-supported on the time, it must provide radial rigidity and tilt and rotating direction on tangible elasticity is arranged.If desired, on the supporting part 26 of combine and assemble part 22, also can make an integrated circuit package 28.This integrated amplifier is represented with label 28, and will be described as another embodiment of the present invention.
Fig. 2 depicts a data logging magnetic disk memory, it comprises swing brake 32 that is contained in the shell 36 and the disk that matches 34 that is rotated by drive unit 35, swing brake 32 moves combine and assemble part of the present invention with arching trajectory above disk 34, swing brake comprises a voice coil motor, and it is a coil 37 that can move in the magnetic field of the fixing permanent-magnet component with magnetic core 38.Brake toggle 33 is connected with movable coil 37, and the other end of brake toggle 33 and combination sensor of the present invention-supporting assembly parts link, and the technology manufacturing that proposes below according to this paper.
The combine and assemble part 22 of an amplification on the magnetic disk memory that is used for Fig. 1 has been shown among Fig. 3 A.On the supporting part 26 whole surface that is deposited over wafer like that as described later.The part of wafer becomes the slide block 23 of sensor-slide block assembly parts 24.Though only show a sensor 25 that on slide block 23, forms, be appreciated that more sensor also can form and be used for to match with the track of disk 12.Usually, deposit two or more sensors 25 in order to increase output, because only need a sensor 25 to produce a suitable combine and assemble part 22 at work.
Supporting part 26 can comprise an insulation course 40, a circuit layer 42, a dielectric layer 44 and a supporting structure layer 46.Supporting structure layer may be a dielectric layer 44 for example made of aluminum, maybe may be the medium of an individual layer, for example also is aluminum.Supporting structure layer also can be formed by nickel plating-iron alloy layer, spraying plating copper beryllium alloy layer or spraying plating stainless steel layer.Lead 43 interconnects sensor 25 and circuit layer 42.Terminal at circuit layer 42 is equipped with the electric mortiser joint chair, so that be connected with external amplifier, external amplifier can be an integrated amplifier, and 28(sees Fig. 1 as integrated amplifier), it can be deposited with other layer that is used for supporting part 26.Insulation course 40 provides electrical isolation between the substrate that may conduct electricity of conductive layer 42 and slide block 23, dielectric layer 44 makes circuit 42 and 46 insulation of metal support structure layer, also one or more ground plane layer can be set if desired.Or independent dielectric layer 44, or dielectric layer provides support to supporting member with arbitrary supporting structure layer 46, so that combine and assemble part 22 remains on the track top of disk 12.Picture is noted earlier, and supporting part 26 must keep sensor-Slipper 24 in the position of disk 12 tops.Supporting part allows and rolling movement, so that sensor-Slipper 24 can be followed the surface of disk 12, stops simultaneously to swing, and this swing can make sensor 25 break away from from the lateral attitude with respect to track.
Fig. 3 B illustrates the first step according to the manufacture method of the combine and assemble part 22 of first embodiment of the magnetic disk memory that is used for Fig. 1, by preparing a non-magnetocrystalline sheet substrate 50, realizes the batch manufacturing of thin film sensor 25.The thickness of substrate 50 is T, and when the thickness of the thin film sensor 25 that adds deposition, it will equal to support the length of the width and the slide block 23 of assembly parts 26.Sensor 25 can be the film induction pick-up, as described above shown in the United States Patent (USP) 4190872, or magnetoresistive transducer, United States Patent (USP) 3975772 is shown as described above.Sensor 25 is drawn together lead 52 and 54, so that for magnetic medium reads and writes down sensor is started, sensor 25 is deposited on the substrate 50 with the row and column structure shown in Fig. 4 A.Before being described further, the row and column structure can well be described with reference to figure 4A according to technology of the present invention.
In Fig. 4 A, shown circular wafer substrate 100 has a plurality of sensors 25, for example, and many rows 102 of deposition and multiple row 104 on this substrate.Shown in wafer 100 have a plurality of squares, as square 106 and 108, each square is represented a sensor, and is known on single wafer substrate 100, can make the row 102 of arbitrary quantity and the size that row 104 these quantity depend on wafer size and single combine and assemble part.Shown in Fig. 4 B, substrate comprises a strippable layer 109, and it is formed between substrate 100 and the layer 110.In this embodiment, those layers of layer 110 representative formation sensor 25.
Therefore, refer again to Fig. 3 B, on substrate 50, each sensor constitutes a square.After having deposited those layers that form sensor 25, with cutting or other cutting method is separated in a row substrate 50, under a shown row 56 separates from substrate 50 by kerf 58.In this program back, this row 56 is by the kerf 60 separated squares 62 that comprise a transducing part 25 with generation.64 of another kerfs make this row 56 be separated into single square 66 and 68 fully, and three squares have been shown in every row of Fig. 3 B.Show kerf 58 corresponding to kerf 64.Single square also can with for example etching, machine cut or cut separated, in the method according to the invention, before forming the layer 110 of sensor 25 on the substrate 100, deposition one strippable coating 109 earlier.The purposes of strippable coating 109 will be below with reference to Fig. 7 B explanation.
Fig. 5 A expresses the combine and assemble part 30 of an amplification, and it is to use with the swing brake 32 of the magnetic disk memory of Fig. 2, and supporting part 70 is deposited on a row's the whole surface, and the erect image back will illustrate in Fig. 5 B.The part of wafer can become the slide block 72 of combine and assemble part 30.Although only shown a sensor 74 that on slide block 72, forms, be appreciated that more sensor can be formed, and be used for cooperating with the track of disk 34.
Supporting part 70 can comprise an insulation course 76, a conductor layer 78, a dielectric layer 80 and a supporting structure layer 82, and this supporting structure layer can be the copper beryllium alloy layer of spraying plating, or the stainless steel layer of spraying plating.Lead 84 and 86 interconnects sensor 74 and circuit layer 78, and electric connection socket 88 is placed in conductor layer 78 terminals, joins with an amplifier.This amplifier can be the integrated amplifier of those layers deposition in the supporting part 26 that is used in Fig. 7 B.Insulation course 76 provides electrical isolation between the substrate that may conduct electricity of conductor layer 78 and slide block 72.If desired, dielectric layer 80 can provide insulation to conductive layer 78.If need, also one or more ground plane layer can be set, dielectric layer 80 mainly is to be used for support bearing spare with arbitrary supporting structure layer 82, is in the position of the track top of disk 34 to keep combine and assemble part 30.
Fig. 5 B illustrates the first step according to combine and assemble part 30 manufacture methods of first embodiment of the magnetic disk memory structure that is used for Fig. 2.By preparing a non-magnetocrystalline sheet substrate 90, realize the batch manufacturing of thin film sensor 74.The thickness of this substrate 90 is T, when the thickness of the thin film sensor 74 that adds deposition, then equals the length of supporting part 70.Each sensor 74 can be the film induction pick-up, United States Patent (USP) 4190872 is described as described above, or magnetoresistive transducer, United States Patent (USP) 3975772 is shown as previously mentioned, each sensor 74 comprises lead 84 and 86, so that for magnetic medium is read and writes down sensor is started.Sensor 74 is deposited on the substrate 90 with the structure of the row and column shown in Fig. 4 A, and row is described no longer explanation herein with the structure of row with reference to Fig. 4 A.
Continue to discuss the formation of combine and assemble part 30 of the present invention with Fig. 5 B.After having deposited sensor 74, substrate 90 is divided into a plurality of row's parts, expresses by score 94 and separates down one from wafer substrate 90 and arrange part 92.A plurality of sensors 74 are drawn together in every package.Fig. 6 has represented the further skeleton view of this row's part 92.
With reference to Fig. 6, to make sensor 74 and going between 84 and at 86 o'clock, a strippable coating 94 at first is deposited, so that the layer of sensor 74 is isolated with wafer substrate.The row 92 of Fig. 6 is processed to the shape shown in Fig. 5 A then.The top of the substrate sections of the layer row of being deposited over 92 of supporting part 70 to form a preferred embodiment of supporting part 70 on row 92 and sensor 74, has provided more detailed description below in conjunction with Fig. 7 A and 7B.
With reference to Fig. 7 A and 7B, in this embodiment, supporting part 70 is isolated by the strippable coating 96 and the substrate sections 93 of row's part 92.The used material of the material of strippable coating 96 and strippable coating 94 is same or similar.Desirable strippable coating is the Rhometal of electroplating, and other material that can be used as strippable coating comprises copper or chromium.
On strippable coating 96, form the layer of supporting part 70.These layers can be the layers shown in Fig. 5 A.Binding post 97 is connected with 86 lead 84 with 98 with the conductor of conductive layer.If desired, can comprise ground plane shown in Fig. 7 B.In Fig. 7 B, insulation course 76 is deposited on the strippable coating 96.First ground plane layer 99 can be deposited on this insulation course 76.Another insulation course 76A is deposited on the ground plane layer 99 then.Back deposited conductor layer 78 again, and obviously, conductor layer 78 comprises that each sensor of a plurality of conductors has two at least as conductor 78A and 78B among Fig. 7 A.81 pairs of combine and assemble parts of supporting supporting layer provide the support of class sheet spring, and can comprise the layer 80 and 82 of Fig. 5 A.Another ground plane (not shown) can deposit on the top that is deposited on another insulation course on the conductor layer 78.Top ground plane provides good insulation and stress symmetric, and dealing with thermal mismatching, and in some applications, the two all needs.Binding post 89 is connected to the gang socket 88 of Fig. 5 A with the conductor of conductive layer 78, only expresses two in Fig. 7 A.
Notice that supporting part 70 and Sensor section 72 are overlapping and bonding mutually under the situation of not inserting strippable coating.This step provides the thick material of a bending.Utilize strippable coating 94 and 96, permission will be arranged the substrate 93 of part 92 and be removed from the combine and assemble part, only stay supporting part 70 and any supporting layer of supporting to have the sensor 72 that is connected lead.Thus, produce the extremely light supporting system that has sensor.
Strippable coating is divesting of Rhometal layer for example, as for example adopt that ammonium persulfate is to be easy to realize, but it does not play destruction to the aluminium that is generally used for making in the sensor step.
The reinforcement of supporting system can realize that in the state shown in Fig. 7 A and the 7B, the thickness of supporting part 70 is uniformly, but in some applications, requires this thickness distribution to change for adapting to concrete application by the thickness distribution that for example changes supporting part 70.Incorgruous rigidity can assign to realize by for example making corrugated part along the length of supporting part 70.
Fig. 8 represents to have complete row's part of not wishing the unnecessary substrate sections wanting and will remove, kerf 112 makes a combine and assemble part 30 separate from row's part, and this combine and assemble part reservation comprises the supporting part 114 of itself, the Slipper 116 of self and the combine and assemble part of the sensor of self 118.Other kerf then makes remaining combine and assemble part separate, in case made such combine and assemble part, it is introduced the rigid disks reader is to realize easily, also is conspicuous to those of ordinary skills, and such disk reader has been described in United States Patent (USP) 3849800.
When only needing, guarantee among the embodiment of sensor near the supporting member of medium, form an active material devices on the supporting member, this active material can be to comprise piezo-electric device, send a telegraph a kind of in several known devices of retractor device or well heater, but is not limited only to these devices.Active material devices control supporting member itself, thus be easy to the contact that sensor was read/write down in realization, also have other embodiment to adopt and contain the supporting member of electric strip line so that be connected with sensor.By changing the thickness of supporting member, the selectivity reinforcement of supporting member is to realize easily.This characteristic allows supporting member to be retrofited, to adapt to the needs of concrete application.
Another removes the scheme that contains the substrate that has deposited the rows of sensors part is to remove substrate by the etching of grinding or other method.With the example of Fig. 7 B as this scheme, wherein, do not adopt strippable coating 94, be unnecessary substrate 93 to be removed on the contrary by grinding or other suitable excision technology.By this technology, the part of substrate can stay as the matrix of sensor 72 and support Slipper.If require sensor to be suspended on the magnetic medium of disk by the air cushion supporting, then this method is useful especially.
Said here scheme has been created condition for production has very the supporting member-slide block of high yield-sensor combinations assembly parts product.Adjacent system can carry out photoetching composition by the film to deposition and come separately, has therefore eliminated the kerf gap, and same, thin-film head depth height is determined by lithographic printing, because have only the thickness of supporting system material just need grind or etch into required length.
Although the present invention shows particularly and illustrate by having done with reference to some preferred embodiments, should be appreciated that for a person skilled in the art and under the situation that does not break away from the spirit and scope of the present invention, can make the change of various forms and details.For example, a kind of sensor is made on wafer can be in the United States Patent (USP) 4190872 that procurator of the present invention acted on behalf of said.The preparation material of this wafer is the theme of the United States Patent (USP) 4251841 of Jacobs.In accordance with the preferred embodiment, supporting part can be any in several structures such as the bilayer that is formed by the metal level on polyimide material and its, supports needed enough elasticity of assembly parts and rigidity to provide.Should be noted that supporting assembly parts also can make with individual layer, as long as this individual layer has correct thickness and rigidity.Know clearly that also many conductive materials can be used for making circuit and sensor conductor.Copper or gold are preferable material, but many other materials also generally acknowledged being suitable in this technology.Though at this air-supported surperficial slide block has been discussed, the present invention also comprises the contact history slide block, wherein the air-supported surface of slide block is any surface that is suitable for, and it can contact with medium at run duration.A horizon sensor has been shown, yet the present invention also can use vertical reference in the preferred embodiment, wherein except that sensor this slide block-set of bearings component by disclosed technology manufacturing.The only product of vertical-type sensor coverlet adheres on slide block-set of bearings component then.
Claims (12)
1, a kind of data storage device comprises:
A shell;
The data storage disk that at least one rotatably is placed in the said shell is equipped with thereon with the equipment of data storage in the track;
Be used to rotate the equipment of the said data storage disk in the said shell;
Be placed in the said shell, near a brake arm of said data storage disk;
A sensor is formed on the supporting layer, and has the lead that makes its startup; And supporting member;
Said supporting member is characterised in that by the material of deposition and makes, it has predetermined length, first end of said supporting member is deposited on the said thin film sensor, said supporting member is connected with said brake arm on second end, so that said sensor is placed near said data storage disk place, said supporting member comprises the electrical connecting element that extends to said first end from second end of said supporting member, and is electrically connected with the said lead of said sensor.
2, according to the data storage device of claim 1, it is characterized in that, be included in an active material devices that forms on the said supporting member.
3, according to the data storage device of claim 1, it is characterized in that, comprise an integrated amplifier, it is to form on said supporting member and be electrically connected with said electrical connecting element.
4, a kind of combination sensor and supporting member assembly parts is characterized in that, comprise:
The said sensor that on supporting layer, forms, it has the lead that is used for its startup; And
The supporting member of said deposition materials, said supporting member has a predetermined length, first end of said supporting member is deposited on the said thin film sensor, said supporting member comprises the electrical connecting element that extends to said first end from second end of said supporting member, and is electrically connected to the lead of said sensor.
5, a kind of method of making combination sensor and supporting assembly parts is characterized in that, comprises following steps:
Provide thickness to equal the wafer substrate of required supporting member length;
On the first type surface of said substrate, form first strippable coating;
On said first strippable coating, form supporting layer;
On said supporting layer, form a plurality of thin film sensors with the layout of row and column;
Isolate row's part from said wafer substrate, each row's part has the sensor of a plurality of said shapings, and each sensor comes self-corresponding said row;
Row's part under said separation, near forming second strippable coating on separation one side of said first type surface, said second strippable coating extends to the opposite end of the row's part under the said separation from said first strippable coating;
Formation extends to the conducting element of the said opposite end of said supporting course from said sensor;
Dissolve said first and second strippable coatings;
And said row part is separated into single sensor, each said sensor has the mating part of a said supporting part.
6, according to the method for claim 5, the said electrical connecting element that provides on the deposition materials that is formed on the said supporting part of one deck at least is provided the step that it is characterized in that forming conducting element, deposits a conductive material thin film layer and makes it to extend to from the said opposite end of said supporting part the step of the lead of said sensor.
7, according to the method for claim 6, it is characterized in that being included in after the said supporting part step of formation, on said supporting member, form the step of the integrated amplifier of locating and being electrically connected near said opposite end with said electrical connecting element.
8, according to the method for claim 5, it is characterized in that, before said first and second strippable coatings dissolving, on said supporting course, form the step of active material devices.
9, the manufacture method of a kind of combination sensor and supporting assembly parts is characterized in that, comprises following steps:
Provide a thickness to equal the wafer substrate of required supporting member width;
On the first type surface of said substrate, form first strippable coating;
On said first strippable coating, form a supporting layer;
On said supporting layer, form a plurality of sensors and their related leads with the row and column layout, said every row's sensor is separated by required supporting member length distance;
Separate next row's part from said wafer substrate, each row's part has a plurality of said sensors, and each sensor is listed as corresponding to each;
On said row's part of separating, form second strippable coating by said first type surface place, said second strippable coating extends to the opposite end of the row's part under the said separation from said first strippable coating;
On second strippable coating of said formation, deposit one deck elastomeric layer at least and form supporting part;
Formation extends to the conducting element of opposite end of the supporting course of said formation from thin film sensor;
Dissolve said first and second strippable coatings; And said row part is separated into single sensor, each said sensor has the mating part of the supporting part of a said formation.
10, a kind of method of making combination sensor and supporting member assembly parts is characterized in that may further comprise the steps:
Provide thickness to equal the wafer substrate of required supporting member length;
On the first type surface of said wafer substrate,, form a plurality of sensors with the row and column layout;
Isolate row's part from said wafer, every row partly has a plurality of said sensors, and each sensor is corresponding to every row;
On row's separation side partly of said separation, deposit one deck resilient material at least, to form supporting part;
The opposite end that extends to said support layering from said sensor forms conducting element;
Remove unwanted wafer substrate part;
Said row's part is separated into single-sensor, and each said sensor has the mating part of a said supporting part.
According to the method for claim 10, it is characterized in that 11, the step of removing unwanted wafer substrate part will stay the slide block that is used for each said sensor and support part.
12, a kind of method of making combination sensor and supporting member assembly parts is characterized in that, may further comprise the steps:
Provide thickness to equal the wafer substrate of required supporting member width;
On the first type surface of said wafer substrate, form the lead that is connected of a plurality of sensors and they with the pattern of row and column, said sensor is separated in a row by required supporting member length distance;
Isolate row's part from said wafer substrate, every row has a plurality of said sensors and is connected lead, the corresponding row of each sensor;
Row's separation side partly in said separation deposits one deck resilient material at least and forms supporting part;
The opposite end that extends to said supporting course from said each sensor forms conducting element, and said conducting element is connected to said connection lead;
Remove unwanted wafer substrate part;
Said row's part is separated into single-sensor, and each said sensor has the mating part of a said supporting part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN93118811A CN1129893C (en) | 1993-08-28 | 1993-08-28 | Magnetic head for recording with ultra low force |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN93118811A CN1129893C (en) | 1993-08-28 | 1993-08-28 | Magnetic head for recording with ultra low force |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1099894A true CN1099894A (en) | 1995-03-08 |
| CN1129893C CN1129893C (en) | 2003-12-03 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN93118811A Expired - Fee Related CN1129893C (en) | 1993-08-28 | 1993-08-28 | Magnetic head for recording with ultra low force |
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| CN (1) | CN1129893C (en) |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4670804A (en) * | 1985-10-15 | 1987-06-02 | International Business Machines Corporation | Expandable suspension for a read/write head in a disk file |
| JPS62149088A (en) * | 1985-12-23 | 1987-07-03 | Hitachi Ltd | magnetic disk device |
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1993
- 1993-08-28 CN CN93118811A patent/CN1129893C/en not_active Expired - Fee Related
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| CN1129893C (en) | 2003-12-03 |
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