CN109962080A - display device - Google Patents
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- CN109962080A CN109962080A CN201711403682.0A CN201711403682A CN109962080A CN 109962080 A CN109962080 A CN 109962080A CN 201711403682 A CN201711403682 A CN 201711403682A CN 109962080 A CN109962080 A CN 109962080A
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
- H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
- H10H29/14—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00 comprising multiple light-emitting semiconductor components
- H10H29/142—Two-dimensional arrangements, e.g. asymmetric LED layout
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Abstract
Description
技术领域technical field
本发明涉及一种显示装置,且特别是涉及一种具有较佳显示品质及良率的显示装置。The present invention relates to a display device, and more particularly, to a display device with better display quality and yield.
背景技术Background technique
发光二极管(light emitting diode;LED)具有诸如寿命长、体积小、高抗震性、低热产生及低功率消耗等优点,因此已被广泛应用于家用及各种设备中的指示器或光源。近年来,发光二极管已朝多色彩及高亮度发展,因此其应用领域已扩展至大型户外看板、交通号志灯及相关领域。在未来,发光二极管甚至可能成为兼具省电及环保功能的主要照明光源。Light emitting diodes (LEDs) have advantages such as long life, small size, high shock resistance, low heat generation, and low power consumption, and thus have been widely used as indicators or light sources in households and various devices. In recent years, light-emitting diodes have developed towards multi-color and high brightness, so their application fields have expanded to large outdoor signboards, traffic lights and related fields. In the future, light-emitting diodes may even become the main lighting source with both power saving and environmental protection functions.
一般具有发光二极管的显示装置中,通常可以通过表面安装元件(surface mountdevices;SMD)技术或芯片直接封装(chip on board;COB)技术将发光二极管配置于线路基板上。然而,在表面安装元件技术中,通常会将至少一组红光、绿光以及蓝光的发光元件封装至一个支架内,而当上述的红光、绿光或蓝光发光元件与像素边界的距离不同时,就会产生色差,因而造成显示品质的低落。另外,在芯片直接封装技术中,若原本的发光元件失效或效能低落,则由于发光元件的芯片较小且缺乏可拾取的结构,因此则较难采用重工(rework)的方式进行原位置换,因而造成显示装置的良率降低。而为了提升显示装置的良率,方法之一是一开始就提供多余的发光元件,但会耗费过多的成本。因此,为了追求更高层次的画质表现,如何进一步提升显示装置的良率及显示品质,且又不会耗费过多的成本,实已成目前亟欲解决的课题。Generally, in a display device having light emitting diodes, the light emitting diodes can be arranged on a circuit substrate through surface mount devices (SMD) technology or chip on board (COB) technology. However, in the surface mount component technology, at least one group of red, green and blue light-emitting elements is usually packaged into a bracket, and when the distance between the above-mentioned red, green or blue light-emitting elements and the pixel boundary is not At the same time, chromatic aberration will occur, resulting in lower display quality. In addition, in the direct chip packaging technology, if the original light-emitting element fails or the performance is low, because the chip of the light-emitting element is small and lacks a pick-up structure, it is difficult to perform in-situ replacement by rework. As a result, the yield of the display device is lowered. In order to improve the yield of the display device, one of the methods is to provide redundant light-emitting elements from the beginning, but it will consume too much cost. Therefore, in order to pursue higher-level image quality performance, how to further improve the yield rate and display quality of the display device without spending too much cost has become an urgent problem to be solved at present.
发明内容SUMMARY OF THE INVENTION
本发明的实施例公开一种显示装置,其具有较佳的显示品质及良率。Embodiments of the present invention disclose a display device having better display quality and yield.
本发明一实施例的显示装置,其包括线路基板、多个像素以及遮光层。像素包括多个发光元件,其中发光元件配置于线路基板上并与线路基板电连接,且像素中的多个发光元件沿着排列方向排列。遮光层位于线路基板上且具有多个像素开口,像素位于对应的一个像素开口内。遮光层包括多个沿着排列方向延伸的第一遮光图案以及与第一遮光图案连接的多个第二遮光图案。第二遮光图案的延伸方向与第一遮光图案的延伸方向不同。第一遮光图案的具有第一厚度,第二遮光图案的具有第二厚度,且第一厚度大于或等于第二厚度。A display device according to an embodiment of the present invention includes a circuit substrate, a plurality of pixels, and a light shielding layer. The pixel includes a plurality of light-emitting elements, wherein the light-emitting elements are arranged on the circuit substrate and are electrically connected to the circuit substrate, and the plurality of light-emitting elements in the pixel are arranged along the arrangement direction. The light shielding layer is located on the circuit substrate and has a plurality of pixel openings, and the pixels are located in a corresponding one of the pixel openings. The light shielding layer includes a plurality of first light shielding patterns extending along the arrangement direction and a plurality of second light shielding patterns connected with the first light shielding patterns. The extending direction of the second light shielding pattern is different from the extending direction of the first light shielding pattern. The first shading pattern has a first thickness, the second shading pattern has a second thickness, and the first thickness is greater than or equal to the second thickness.
本发明一实施例的显示装置,其包括线路基板、遮光层以及发光元件。线路基板具有第一表面。遮光层位于第一表面上且具有遮光顶面,且遮光顶面与第一表面之间具有第一厚度。发光元件配置于第一表面上且具有出光顶面,且出光顶面与第一表面之间具有出光高度,发光元件的与遮光层之间具有元件间距,且元件间距对第一厚度与出光高度之间的差值的比值大于0.66。A display device according to an embodiment of the present invention includes a circuit substrate, a light-shielding layer, and a light-emitting element. The circuit substrate has a first surface. The light-shielding layer is located on the first surface and has a light-shielding top surface with a first thickness between the light-shielding top surface and the first surface. The light-emitting element is arranged on the first surface and has a light-emitting top surface, and there is a light-emitting height between the light-emitting top surface and the first surface. There is an element spacing between the light-emitting element and the light-shielding layer, and the element spacing is related to the first thickness and the light-emitting height. The ratio of the differences between is greater than 0.66.
为让本发明的上述特征和优点能更明显易懂,下文特举实施例,并配合所附的附图作详细说明如下。In order to make the above-mentioned features and advantages of the present invention more obvious and easy to understand, the following embodiments are given and described in detail with the accompanying drawings as follows.
在附图中,为了清楚起见,放大或缩小了部分的元件或膜层的尺寸。并且,在说明书中所表示的数值,可以包括所述数值以及在本领域中具有通常知识者可接受的偏差范围内的偏差值。上述偏差值可以是于制造过程或测量过程的一个或多个标准偏差(StandardDeviation),或是于计算或换算过程因采用位数的多寡、四舍五入或经由误差传递(ErrorPropagation)等其他因素所产生的计算误差。In the drawings, the dimensions of some elements or layers are exaggerated or reduced for clarity. And, the numerical value expressed in the specification may include the numerical value and the deviation value within the range of deviation acceptable to those generally skilled in the art. The above deviation value can be one or more standard deviations (StandardDeviation) in the manufacturing process or measurement process, or in the calculation or conversion process due to the number of digits used, rounding or other factors such as error propagation (ErrorPropagation) generated. Calculation error.
附图说明Description of drawings
图1A为本发明的第一实施例的一种显示装置的部分上视示意图;FIG. 1A is a schematic partial top view of a display device according to the first embodiment of the present invention;
图1B为沿图1A中的I-I’剖线的剖面示意图;Figure 1B is a schematic cross-sectional view along the line I-I' in Figure 1A;
图1C为沿图1A中的II-II’剖线的剖面示意图;Figure 1C is a schematic cross-sectional view along the line II-II' in Figure 1A;
图2为本发明的第二实施例的一种显示装置的部分剖面示意图;2 is a partial cross-sectional schematic diagram of a display device according to a second embodiment of the present invention;
图3为本发明的第三实施例的一种显示装置的部分上视示意图。FIG. 3 is a schematic partial top view of a display device according to a third embodiment of the present invention.
符号说明Symbol Description
100、200、300:显示装置100, 200, 300: Display device
110:线路基板110: circuit substrate
110a:第一表面110a: first surface
111:连接垫111: Connection pad
111a:连接垫最大宽度111a: Connection pad maximum width
111b:第一端111b: first end
111c:第二端111c: second end
112:导电连接件112: Conductive connectors
120:发光元件120: Light-emitting element
120a:排列方向120a: Arrangement direction
120b:出光顶面120b: light-emitting top surface
120c:元件宽度120c: Component width
120d:主轴光线120d: Principal axis rays
121:第一发光元件121: The first light-emitting element
121a:第一距离121a: first distance
122:第二发光元件122: Second light-emitting element
122a:第二距离122a: second distance
123:第三发光元件123: Third light-emitting element
123a:第三距离123a: Third Distance
124:修补发光元件124: Repair Lighting Components
125:失效或效能低落的发光元件125: Light-emitting elements that fail or have low efficacy
130、330:遮光层130, 330: shading layer
130a:像素开口130a: pixel opening
131、331:第一遮光图案131, 331: The first shading pattern
132、332:第二遮光图案132, 332: Second shading pattern
140、240:封装层140, 240: encapsulation layer
140a、240a:封装顶面140a, 240a: Package top surface
PU、PU’、PU”:像素PU, PU’, PU”: pixels
L:光线L: light
A:元件间距A: Component spacing
B:出光高度B: light output height
C:第一厚度C: first thickness
C':第二厚度C': second thickness
E:封装厚度E: Package thickness
F:像素间距F: pixel pitch
G:表面粗糙度G: Surface roughness
W:元件长度W: Element length
X、Y、Z:方向X, Y, Z: direction
具体实施方式Detailed ways
图1A是依照本发明的第一实施例的一种显示装置的部分上视示意图。图1B是沿图1A中的I-I’剖线的剖面示意图。图1C是沿图1A中的II-II’剖线的剖面示意图。为求清晰,图1A省略绘示了部分的膜层。FIG. 1A is a schematic partial top view of a display device according to a first embodiment of the present invention. Fig. 1B is a schematic cross-sectional view along the line I-I' in Fig. 1A. Fig. 1C is a schematic cross-sectional view taken along the line II-II' in Fig. 1A. For clarity, FIG. 1A omits and illustrates some of the film layers.
请同时参照图1A至图1C,本实施例的显示装置100包括线路基板110、多个像素PU、遮光层130以及封装层140。多个像素PU、遮光层130以及封装层140配置于线路基板110的第一表面110a上,且封装层140覆盖遮光层130以及像素PU。Please refer to FIGS. 1A to 1C at the same time, the display device 100 of this embodiment includes a circuit substrate 110 , a plurality of pixels PU, a light shielding layer 130 and an encapsulation layer 140 . The plurality of pixels PU, the light shielding layer 130 and the encapsulation layer 140 are disposed on the first surface 110 a of the circuit substrate 110 , and the encapsulation layer 140 covers the light shielding layer 130 and the pixels PU.
像素PU包括多个发光元件120。在本实施例中,像素PU可以包括第一发光元件121、第二发光元件122以及第三发光元件123。第一发光元件121、第二发光元件122以及第三发光元件123可以发出不同颜色的光,且第一发光元件121、第二发光元件122以及第三发光元件123沿着排列方向120a排列。举例而言,第一发光元件121可以发出红色光,第二发光元件122可以发出绿色光,第三发光元件123可以发出蓝色光,且第一发光元件121、第二发光元件122以及第三发光元件123的排列方向120a大致上平行于Y方向,但本发明不限于此。The pixel PU includes a plurality of light emitting elements 120 . In this embodiment, the pixel PU may include a first light-emitting element 121 , a second light-emitting element 122 and a third light-emitting element 123 . The first light emitting element 121 , the second light emitting element 122 and the third light emitting element 123 can emit light of different colors, and the first light emitting element 121 , the second light emitting element 122 and the third light emitting element 123 are arranged along the arrangement direction 120 a. For example, the first light emitting element 121 can emit red light, the second light emitting element 122 can emit green light, the third light emitting element 123 can emit blue light, and the first light emitting element 121, the second light emitting element 122 and the third light emitting element 122 The arrangement direction 120a of the elements 123 is substantially parallel to the Y direction, but the present invention is not limited thereto.
发光元件120配置于线路基板110上并与线路基板110电连接。具体而言,线路基板110可以具有多组连接垫111,且发光元件120对应于其中一组连接垫111配置。在本实施例中,发光元件120可以倒装接合(flip chip bonding)的方式通过导电连接件112电连接至对应的连接垫111。导电连接件112例如为焊球,但本发明不限于此。在本实施例中,在排列方向120a上,各个发光元件120具有对应的元件宽度120c,各组连接垫111具有对应的连接垫最大宽度111a,且前述的连接垫最大宽度111a大于两倍的前述的元件宽度120c。除此之外,在排列方向120a上,各组连接垫111具有相对的第一端111b与第二端111c,发光元件120配置于第一端111b与第二端111c的其中之一。以图1A所绘示的实施例为例,发光元件120仅配置于对应的一组连接垫111的第一端111b。如此一来,在各组连接垫111上,未配置发光元件120的另一端(如1A所绘示的实施例中的第二端111c)可以预留作为修补的用途。The light emitting element 120 is disposed on the circuit substrate 110 and is electrically connected to the circuit substrate 110 . Specifically, the circuit substrate 110 may have multiple groups of connection pads 111 , and the light-emitting element 120 is configured corresponding to one of the groups of connection pads 111 . In this embodiment, the light emitting element 120 may be electrically connected to the corresponding connection pad 111 through the conductive connection member 112 in a flip chip bonding manner. The conductive connection member 112 is, for example, a solder ball, but the present invention is not limited thereto. In the present embodiment, in the arrangement direction 120a, each light-emitting element 120 has a corresponding element width 120c, each group of connection pads 111 has a corresponding maximum width 111a of the connection pad, and the aforementioned maximum width 111a of the connection pad is greater than twice the aforementioned maximum width 111a The element width is 120c. Besides, in the arrangement direction 120a, each group of connection pads 111 has opposite first ends 111b and second ends 111c, and the light emitting element 120 is disposed on one of the first ends 111b and the second ends 111c. Taking the embodiment shown in FIG. 1A as an example, the light emitting element 120 is only disposed on the first end 111 b of a corresponding set of connection pads 111 . In this way, on each set of connection pads 111 , the other end (such as the second end 111 c in the embodiment shown in 1A ) not disposed with the light-emitting element 120 can be reserved for repairing.
在本实施例中,各组连接垫111可以为两个T字型的导电结构,但本发明不限于此。在其他实施例中,各组连接垫111也可以为两个条状的导电结构。In this embodiment, each group of connection pads 111 may be two T-shaped conductive structures, but the present invention is not limited thereto. In other embodiments, each group of connection pads 111 may also be two strip-shaped conductive structures.
遮光层130包括多个第一遮光图案131以及多个第二遮光图案132。第一遮光图案131沿着排列方向120a延伸,且第二遮光图案132的延伸方向与第一遮光图案131的延伸方向不同。第一遮光图案131的具有第一厚度C,第二遮光图案132的具有第二厚度C’,且第一厚度C大于或等于第二厚度C’。第一遮光图案131与第二遮光图案132相连接,以构成多个像素开口130a,且像素PU分别位于对应的像素开口130a内。遮光层130可以遮挡像素开口130a内的发光元件120所发出的光线。在本实施例中,遮光层130的材质可以包括具有遮光性的防焊材料,但本发明不限于此。The light shielding layer 130 includes a plurality of first light shielding patterns 131 and a plurality of second light shielding patterns 132 . The first light shielding patterns 131 extend along the arrangement direction 120 a, and the extending direction of the second light shielding patterns 132 is different from the extending direction of the first light shielding patterns 131 . The first shading pattern 131 has a first thickness C, and the second shading pattern 132 has a second thickness C', and the first thickness C is greater than or equal to the second thickness C'. The first light shielding pattern 131 and the second light shielding pattern 132 are connected to form a plurality of pixel openings 130a, and the pixels PU are respectively located in the corresponding pixel openings 130a. The light shielding layer 130 can shield the light emitted by the light emitting element 120 in the pixel opening 130a. In this embodiment, the material of the light shielding layer 130 may include a light shielding solder resist material, but the present invention is not limited thereto.
在本实施例中,各个像素PU分别位于对应的一个像素开口130a内,但本发明不限于此。在其他实施例中,可以是多个像素PU位于对应的一个像素开口130a内。其他可行的实施例中,像素开口130a内也可以不具有像素PU,而不具有像素PU的像素开口130a可以用于对位、测试或其他适宜的制作工艺。In this embodiment, each pixel PU is located in a corresponding one of the pixel openings 130a, but the present invention is not limited thereto. In other embodiments, a plurality of pixels PU may be located in a corresponding pixel opening 130a. In other possible embodiments, the pixel opening 130a may not have the pixel PU, and the pixel opening 130a without the pixel PU may be used for alignment, testing or other suitable fabrication processes.
在本实施例中,第一遮光图案131的延伸方向与第二遮光图案132的延伸方向不同,且相邻的两个第一遮光图案131之间具有多个第二遮光图案132。在一些实施例中,第一遮光图案131的延伸方向与第二遮光图案132的延伸方向大致上垂直。举例而言,第一遮光图案131大致上是平行于Y方向延伸,第二遮光图案132大致上是平行于X方向延伸,但本发明不限于此。In this embodiment, the extending direction of the first light-shielding patterns 131 is different from the extending direction of the second light-shielding patterns 132 , and there are a plurality of second light-shielding patterns 132 between two adjacent first light-shielding patterns 131 . In some embodiments, the extending direction of the first light shielding pattern 131 is substantially perpendicular to the extending direction of the second light shielding pattern 132 . For example, the first light shielding pattern 131 extends substantially parallel to the Y direction, and the second light shielding pattern 132 extends substantially parallel to the X direction, but the invention is not limited thereto.
在同一个像素PU中,发光元件120与对应的第二遮光图案132之间的距离彼此不同。举例而言,在同一个像素PU中,对应于相同的第二遮光图案132,第一发光元件121与第二遮光图案132的距离为第一距离121a,第二发光元件122与第二遮光图案132的距离为第二距离122a,第三发光元件123与第二遮光图案132的距离为第三距离123a,且第一距离121a、第二距离122a与第三距离123a彼此不相同。在本实施例中,第三距离123a大于第二距离122a,且第二距离122a大于第一距离121a,但本发明不限于此。In the same pixel PU, the distances between the light emitting elements 120 and the corresponding second light shielding patterns 132 are different from each other. For example, in the same pixel PU, corresponding to the same second light-shielding pattern 132, the distance between the first light-emitting element 121 and the second light-shielding pattern 132 is the first distance 121a, and the second light-emitting element 122 and the second light-shielding pattern The distance of 132 is the second distance 122a, the distance between the third light emitting element 123 and the second light shielding pattern 132 is the third distance 123a, and the first distance 121a, the second distance 122a and the third distance 123a are different from each other. In this embodiment, the third distance 123a is greater than the second distance 122a, and the second distance 122a is greater than the first distance 121a, but the invention is not limited thereto.
一般而言,在第二遮光图案132两侧的相邻两个像素PU中,第一发光元件121、第二发光元件122以及第三发光元件123可以具有相同的排列方式。也就是说,在上述相邻两个像素PU中,其第一发光元件121、第二发光元件122以及第三发光元件123都是沿着排列方向120a排列。换句话说,在第二遮光图案132两侧的具有相同发光颜色的两个发光元件120之间,至少具有一个第二遮光图案132以及其他两个发光颜色相异的发光元件120。举例来说,在第二遮光图案132两侧的两个第一发光元件121之间,至少具有一个第二遮光图案132、一个第二发光元件122以及一个第三发光元件123。或是,在第二遮光图案132两侧的两个第二发光元件122之间,至少具有一个第二遮光图案132、一个第一发光元件121以及一个第三发光元件123。或是,在第三遮光图案两侧的两个第一发光元件121之间,至少具有一个第二遮光图案132、一个第一发光元件121以及一个第二发光元件122。并且,由于各个发光元件120的出光顶面120b与第一表面110a之间的出光高度B小于第二遮光图案132的第二厚度C’。因此,通过上述的配置方式以及高度/厚度关系,可以降低在第二遮光图案132两侧的相邻两个像素PU之间的串光。并且,由于第二遮光图案132的第二厚度C’小于或等于第一遮光图案131的第一厚度C,也可以降低显示装置100在排列方向120a上的色差。Generally speaking, in two adjacent pixels PU on both sides of the second light-shielding pattern 132 , the first light-emitting element 121 , the second light-emitting element 122 and the third light-emitting element 123 may have the same arrangement. That is to say, in the above-mentioned two adjacent pixels PU, the first light-emitting elements 121 , the second light-emitting elements 122 and the third light-emitting elements 123 are all arranged along the arrangement direction 120 a. In other words, between the two light-emitting elements 120 with the same light-emitting color on both sides of the second light-shielding pattern 132, there are at least one second light-shielding pattern 132 and other two light-emitting elements 120 with different light-emitting colors. For example, between the two first light-emitting elements 121 on both sides of the second light-shielding pattern 132 , there are at least one second light-shielding pattern 132 , one second light-emitting element 122 and one third light-emitting element 123 . Or, between the two second light-emitting elements 122 on both sides of the second light-shielding pattern 132 , there are at least one second light-shielding pattern 132 , one first light-emitting element 121 and one third light-emitting element 123 . Or, between the two first light-emitting elements 121 on both sides of the third light-shielding pattern, there are at least one second light-shielding pattern 132 , one first light-emitting element 121 and one second light-emitting element 122 . Moreover, since the light-emitting height B between the light-emitting top surface 120b of each light-emitting element 120 and the first surface 110a is smaller than the second thickness C' of the second light-shielding pattern 132 . Therefore, the cross-light between two adjacent pixels PU on both sides of the second light-shielding pattern 132 can be reduced by the above-mentioned configuration manner and the height/thickness relationship. Moreover, since the second thickness C' of the second light shielding pattern 132 is less than or equal to the first thickness C of the first light shielding pattern 131, the color difference of the display device 100 in the arrangement direction 120a can also be reduced.
在同一个像素PU中,发光元件120与对应的第一遮光图案131之间的元件间距A彼此相同。举例而言,在同一个像素PU中,对应于相同的第一遮光图案131,元件间距A可以是第一发光元件121与第一遮光图案131之间的距离,或是第二发光元件122与第一遮光图案131之间的距离,或是第三发光元件123与第一遮光图案131之间的距离。因此,可以降低显示装置100在垂直于排列方向120a的方向(即,X方向)上的色偏。In the same pixel PU, the element spacing A between the light emitting elements 120 and the corresponding first light shielding patterns 131 is the same as each other. For example, in the same pixel PU, corresponding to the same first light-shielding pattern 131, the element spacing A may be the distance between the first light-emitting element 121 and the first light-shielding pattern 131, or the distance between the second light-emitting element 122 and the first light-shielding pattern 131. The distance between the first light-shielding patterns 131 , or the distance between the third light-emitting element 123 and the first light-shielding patterns 131 . Therefore, the color shift of the display device 100 in the direction perpendicular to the arrangement direction 120a (ie, the X direction) can be reduced.
相邻的第一遮光图案131的中线所构成的像素间距F,封装层140的封装顶面140a与线路基板110的第一表面110a之间具有封装厚度E。根据几何的比例关系可知当像素间距F对封装厚度E与出光高度B之间的差值的比值大于两倍的元件间距A对第一厚度C与出光高度B之间的差值的比值时,从发光元件120的出光面120b的正中心法线120d上所发出的光线L(即,主轴光线(Chief Ray))无法跨越第一遮光图案131达到垂直于排列方向120a的方向(即,X方向)上的任一侧,借此达到降低串光的效果,即具有以下的方程式(1-1)来表示:The pixel pitch F formed by the center lines of the adjacent first light-shielding patterns 131 has an encapsulation thickness E between the encapsulation top surface 140 a of the encapsulation layer 140 and the first surface 110 a of the circuit substrate 110 . According to the geometric proportional relationship, when the ratio of the pixel pitch F to the difference between the package thickness E and the light-emitting height B is greater than twice the ratio of the element pitch A to the difference between the first thickness C and the light-emitting height B, The ray L (ie, the chief ray) emitted from the center normal 120d of the light-emitting surface 120b of the light-emitting element 120 cannot cross the first shading pattern 131 to reach the direction perpendicular to the arrangement direction 120a (ie, the X direction). ) on either side, thereby achieving the effect of reducing cross-light, which is represented by the following equation (1-1):
如此一来,可以降低在第一遮光图案131两侧的相邻两个像素PU之间的光线L产生的串光的现象。In this way, the phenomenon of cross-light generated between two adjacent pixels PU on both sides of the first light shielding pattern 131 can be reduced.
以微发光二极管(micro LED;μLED)作为发光元件120为例,发光元件120在垂直于排列方向120a上的元件长度W可以至少是5微米(micrometer;μm)。另外,相邻的第一遮光图案131的中线所构成的像素间距F最大可以是2000微米。并且,第一遮光图案131的第一厚度C最小可以是10.1微米。以及,发光元件120的出光高度B最大可以是10微米。而在前述的相关尺寸之下,通过相似三角型的比例关系可以使元件间距A对第一厚度C与出光高度B之间的差值的比值小于5000,即具有以下的方程式(1-2)来表示:Taking a micro light emitting diode (micro LED; μLED) as the light emitting element 120 as an example, the element length W of the light emitting element 120 perpendicular to the arrangement direction 120a may be at least 5 micrometers (micrometer; μm). In addition, the pixel pitch F formed by the center lines of the adjacent first light-shielding patterns 131 may be at most 2000 microns. Also, the first thickness C of the first light shielding pattern 131 may be at least 10.1 microns. Also, the light-emitting height B of the light-emitting element 120 may be at most 10 microns. Under the aforementioned relative dimensions, the ratio of the element spacing A to the difference between the first thickness C and the light exit height B can be less than 5000 through the proportional relationship of similar triangles, that is, the following equation (1-2) To represent:
另外,一般而言,封装层140的材质例如是选自包括环氧树脂(epoxy)、硅氧树脂(silicone)及其化合物其中之一,且封装层140的折射率(Refractive Index)介于1.4至1.8。发光元件120的主轴光L有部份会被全反射(total reflection)困在封装层140内部,为了使主轴光L不再进一步被第一遮光图案131阻挡,在经由司乃耳定律(Snell’s Law)的推导下,可以使元件间距A对第一厚度C与出光高度B之间的差值的比值大于0.66,即具有以下的方程式(2)来表示:In addition, generally speaking, the material of the encapsulation layer 140 is selected from, for example, one of epoxy resins, silicone resins and compounds thereof, and the Refractive Index of the encapsulation layer 140 is between 1.4 to 1.8. The main axis light L of the light emitting element 120 is partially trapped in the encapsulation layer 140 by total reflection. In order to prevent the main axis light L from being further blocked by the first shading pattern 131, Snell's Law is used. ), the ratio of the element spacing A to the difference between the first thickness C and the light exit height B can be greater than 0.66, which is represented by the following equation (2):
除此之外,在上述的条件之下,封装层140的封装厚度E可以小于或等于1506.61微米,以降低第一遮光图案131两侧的相邻两个发光元件120之间产生串光的可能。Besides, under the above conditions, the encapsulation thickness E of the encapsulation layer 140 may be less than or equal to 1506.61 μm, so as to reduce the possibility of cross-light generation between two adjacent light-emitting elements 120 on both sides of the first light-shielding pattern 131 . .
在本实施例中,部分的像素PU(如:像素PU’)可以还包括修补发光元件124,配置于相同的一组连接垫111上的修补发光元件124及发光元件125具有相同的发光颜色,且前述的修补发光元件124的位置与前述的发光元件125的位置不同。举例而言,在像素PU’中,在相同的一组连接垫111上,前述的发光元件125配置于连接垫111的第一端111b,而前述的修补发光元件124配置于连接垫111的第二端111c。在显示装置100的制作过程中,作为修补用途的修补发光元件124可以在发光元件125失效或效能低落的情况下,通过与发光元件125相同或相似的配置方式直接配置于连接垫111的第二端111c。如此一来,显示装置100可以通过重工而具有较佳的良率。In this embodiment, some of the pixels PU (eg, pixel PU') may further include a repair light-emitting element 124, and the repair light-emitting element 124 and the light-emitting element 125 disposed on the same set of connection pads 111 have the same light-emitting color, Moreover, the position of the aforementioned repairing light-emitting element 124 is different from that of the aforementioned light-emitting element 125 . For example, in the pixel PU′, on the same set of connection pads 111 , the aforementioned light-emitting element 125 is arranged at the first end 111 b of the connection pad 111 , and the aforementioned repair light-emitting element 124 is arranged at the first end 111 b of the connection pad 111 . Two ends 111c. During the manufacturing process of the display device 100 , the repairing light-emitting element 124 for repairing can be directly disposed on the second connection pad 111 in the same or similar manner as the light-emitting element 125 when the light-emitting element 125 fails or has low performance. end 111c. In this way, the display device 100 can have better yield through rework.
值得注意的是,在图1A所绘示的实施例中,具有修补发光元件124的像素PU’、PU”的数量是以两个为例,且修补发光元件124的数量是以两个为例,但本发明对于具有修补发光元件124的像素的数量以及修补发光元件124的数量并不加以限制。并且,在一些实施方式中,失效或效能低落的发光元件可以被移除(例如:图1A中,相较于其他的像素PU中的第二发光元件122,在纸面最右下的像素PU”不具有类似的第二发光元件122,而具有修补发光元件124),以降低失效或效能低落的发光元件可能会产生进一步的损坏。It is worth noting that, in the embodiment shown in FIG. 1A , the number of pixels PU′, PU″ having the repair light-emitting elements 124 is two, and the number of the repairing light-emitting elements 124 is two, for example , but the present invention is not limited to the number of pixels with repaired light-emitting elements 124 and the number of repaired light-emitting elements 124. Also, in some embodiments, failed or low-efficiency light-emitting elements may be removed (eg, FIG. 1A ). , compared with the second light-emitting element 122 in the other pixels PU, the pixel PU" in the lower rightmost corner of the paper does not have a similar second light-emitting element 122, but has a repair light-emitting element 124) to reduce failure or performance A lowered light-emitting element may cause further damage.
修补发光元件124的配置方式与于相同的一组连接垫111上的发光元件125类似。也就是说,修补发光元件124与像素PU’、PU”中的其他的多个发光元件120沿着排列方向120a排列。并且,相较于其他发光元件120与第一遮光图案131之间的距离(即,元件间距A),修补发光元件124与第一遮光图案131之间的距离(即,元件间距A)与上述的距离(即,元件间距A)基本上相同。The configuration of the repaired light-emitting element 124 is similar to that of the light-emitting element 125 on the same set of connection pads 111 . That is to say, the repaired light-emitting element 124 and the other plurality of light-emitting elements 120 in the pixels PU′, PU″ are arranged along the arrangement direction 120 a. In addition, compared with the distance between the other light-emitting elements 120 and the first shading pattern 131 (ie, element pitch A), the distance between the repaired light emitting elements 124 and the first light shielding pattern 131 (ie, element pitch A) is substantially the same as the aforementioned distance (ie, element pitch A).
图2是依照本发明的第二实施例的一种显示装置的部分剖面示意图。在此必须说明的是,图2的实施例沿用图1A至图1C的实施例的元件标号与部分内容,其中采用相同或近似的标号来表示相同或近似的元件,并且省略了相同技术内容的说明,关于省略部分的说明可参考前述实施例,下述实施例不再重复赘述。FIG. 2 is a partial cross-sectional schematic diagram of a display device according to a second embodiment of the present invention. It must be noted here that the embodiment of FIG. 2 uses the element numbers and part of the content of the embodiment of FIG. 1A to FIG. 1C , wherein the same or similar numbers are used to represent the same or similar elements, and the same technical content is omitted. It is noted that for the description of the omitted part, reference may be made to the foregoing embodiments, and repeated descriptions in the following embodiments will not be repeated.
请同时参照图2,本实施例的显示装置200与图1A至图1C的实施例的显示装置100相似,两者的差异在于:封装层240的封装顶面240a为粗糙面。在第一表面110a的法线方向(即,Z方向)上,封装顶面240a的最高处与最低处之间的距离为表面粗糙度G,且封装层240的封装厚度E大于十倍的表面粗糙度G。如此一来,可以降低显示装置200的雾度(haze),因而可以提升显示装置200的显示品质。Please also refer to FIG. 2 , the display device 200 of this embodiment is similar to the display device 100 of the embodiment of FIGS. 1A to 1C , the difference between the two is that the package top surface 240 a of the package layer 240 is a rough surface. In the normal direction (ie, Z direction) of the first surface 110a, the distance between the highest point and the lowest point of the package top surface 240a is the surface roughness G, and the package thickness E of the package layer 240 is greater than ten times the surface Roughness G. In this way, the haze of the display device 200 can be reduced, and thus the display quality of the display device 200 can be improved.
一般而言,可以通过粗糙面来降低全反射以增加出光效率,然而,过于粗糙的表面会造成辉度(luminance)分布零乱,致使装置上的影像在特定视角时产生破碎感,因此需要适中的雾度。在本实施例中,可以通过将封装层240的封装厚度E大于十倍的表面粗糙度G,以降低全反射而增加出光效率,且可使显示装置200具有良好的显示品质。Generally speaking, a rough surface can be used to reduce the total reflection to increase the light extraction efficiency. However, an excessively rough surface will result in disordered luminance distribution, resulting in a broken image on the device at certain viewing angles. haze. In the present embodiment, the encapsulation thickness E of the encapsulation layer 240 can be greater than ten times the surface roughness G to reduce total reflection and increase light extraction efficiency, and the display device 200 can have good display quality.
图3是依照本发明的第三实施例的一种显示装置的部分上视示意图。在此必须说明的是,图3的实施例沿用图1A至图1C的实施例的元件标号与部分内容,其中采用相同或近似的标号来表示相同或近似的元件,并且省略了相同技术内容的说明,关于省略部分的说明可参考前述实施例,下述实施例不再重复赘述。FIG. 3 is a schematic partial top view of a display device according to a third embodiment of the present invention. It must be noted here that the embodiment of FIG. 3 uses the element numbers and part of the content of the embodiment of FIG. 1A to FIG. 1C , wherein the same or similar numbers are used to represent the same or similar elements, and the same technical content is omitted. It is noted that for the description of the omitted part, reference may be made to the foregoing embodiments, and repeated descriptions in the following embodiments will not be repeated.
请同时参照图3,本实施例的显示装置300与图1A至图1C的实施例的显示装置100相似,两者的差异在于:第一遮光图案331的延伸方向与第二遮光图案332的延伸方向不同,且相邻的两个第二遮光图案332之间具有多个第一遮光图案331。在一些实施例中,第一遮光图案331的延伸方向与第二遮光图案332的延伸方向大致上垂直。举例而言,第一遮光图案331大致上是平行于Y方向延伸,第二遮光图案332大致上是平行于X方向延伸。Please also refer to FIG. 3 , the display device 300 of this embodiment is similar to the display device 100 of the embodiment of FIGS. 1A to 1C , and the difference between the two is: the extension direction of the first light-shielding pattern 331 and the extension of the second light-shielding pattern 332 The directions are different, and there are a plurality of first light-shielding patterns 331 between two adjacent second light-shielding patterns 332 . In some embodiments, the extending direction of the first light shielding pattern 331 is substantially perpendicular to the extending direction of the second light shielding pattern 332 . For example, the first light shielding pattern 331 extends substantially parallel to the Y direction, and the second light shielding pattern 332 extends substantially parallel to the X direction.
综上所述,在本发明的显示装置的多个像素中,各个像素的多个发光元件沿着排列方向排列,第一遮光图案沿着排列方向延伸,第二遮光图案的延伸方向与第一遮光图案的延伸方向不同,且第一遮光图案的厚度大于或等于第二遮光图案的厚度。如此一来,在垂直于排列方向上,显示装置的出光效率与视角可以增加。并且,在排列方向上,可以降低显示装置的色差。另外,通过第一遮光图案及/或第二遮光图案的配置也可以降低像素间的串光。因此,显示装置具有较佳的显示品质。To sum up, in the plurality of pixels of the display device of the present invention, the plurality of light-emitting elements of each pixel are arranged along the arrangement direction, the first light-shielding pattern extends along the arrangement direction, and the extension direction of the second light-shielding pattern is the same as that of the first light-shielding pattern. The extending directions of the light-shielding patterns are different, and the thickness of the first light-shielding pattern is greater than or equal to the thickness of the second light-shielding pattern. In this way, in the direction perpendicular to the arrangement direction, the light extraction efficiency and the viewing angle of the display device can be increased. Also, in the arrangement direction, the chromatic aberration of the display device can be reduced. In addition, cross-light between pixels can also be reduced by the arrangement of the first light shielding pattern and/or the second light shielding pattern. Therefore, the display device has better display quality.
虽然结合以上实施例公开了本发明,然而其并非用以限定本发明,任何所属技术领域中具有通常知识者,在不脱离本发明的精神和范围内,可作些许的更动与润饰,故本发明的保护范围应当以附上的权利要求所界定的为准。Although the present invention is disclosed in conjunction with the above embodiments, it is not intended to limit the present invention. Anyone with ordinary knowledge in the technical field can make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, The scope of protection of the present invention should be defined by the appended claims.
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| CN113937125A (en) * | 2021-04-16 | 2022-01-14 | 友达光电股份有限公司 | Display module and display device including the same |
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| CN112786763A (en) * | 2019-11-01 | 2021-05-11 | 成都辰显光电有限公司 | Display panel and display device |
| CN112102735A (en) * | 2020-02-21 | 2020-12-18 | 友达光电股份有限公司 | Display device |
| EP4304304A4 (en) * | 2021-03-05 | 2025-03-12 | Seoul Semiconductor Co., Ltd. | Circuit board having multiple solder resist and display device having same |
| US12419149B2 (en) | 2021-03-05 | 2025-09-16 | Seoul Semiconductor Co., Ltd. | Circuit board having multiple solder resists and displaying apparatus having the same |
| CN113937125A (en) * | 2021-04-16 | 2022-01-14 | 友达光电股份有限公司 | Display module and display device including the same |
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