CN109920747B - Wet etching equipment and photoresist cleaning and developing device - Google Patents
Wet etching equipment and photoresist cleaning and developing device Download PDFInfo
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- CN109920747B CN109920747B CN201910185830.9A CN201910185830A CN109920747B CN 109920747 B CN109920747 B CN 109920747B CN 201910185830 A CN201910185830 A CN 201910185830A CN 109920747 B CN109920747 B CN 109920747B
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- basin
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- wet etching
- liquid carrying
- control panel
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- 238000001039 wet etching Methods 0.000 title claims abstract description 41
- 238000004140 cleaning Methods 0.000 title claims abstract description 11
- 229920002120 photoresistant polymer Polymers 0.000 title abstract description 16
- 239000007788 liquid Substances 0.000 claims abstract description 74
- 238000005530 etching Methods 0.000 claims abstract description 56
- 238000010438 heat treatment Methods 0.000 claims description 8
- 238000007789 sealing Methods 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 5
- 239000004809 Teflon Substances 0.000 claims description 3
- 229920006362 Teflon® Polymers 0.000 claims description 3
- 238000000034 method Methods 0.000 description 14
- 238000005485 electric heating Methods 0.000 description 9
- 230000001105 regulatory effect Effects 0.000 description 6
- 238000003756 stirring Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 2
- 230000001276 controlling effect Effects 0.000 description 2
- 239000008367 deionised water Substances 0.000 description 2
- 229910021641 deionized water Inorganic materials 0.000 description 2
- 238000001312 dry etching Methods 0.000 description 2
- 238000001259 photo etching Methods 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 238000002791 soaking Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 230000008092 positive effect Effects 0.000 description 1
- 238000011897 real-time detection Methods 0.000 description 1
- 238000005389 semiconductor device fabrication Methods 0.000 description 1
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Abstract
本发明公开了一种湿法刻蚀设备及光刻胶清洗显影装置，该湿法刻蚀设备包括：壳体，壳体的外壁上设有控制面板；载液盆设于壳体内，用于盛放溶液；该载液盆的盆沿与壳体的内壁固连；超声波雾化器固设于载液盆的底部，用于将载液盆中的溶液雾化成液滴；刻蚀花篮设于载液盆的盆沿上，用于盛放被刻蚀器件；该被刻蚀器件与溶液分离；供电模块设于壳体的底部；其中，超声波雾化器与控制面板电连接；超声波雾化器、控制面板均与供电模块电连接。采用刻蚀花篮使被刻蚀器件与溶液分离，并用超声波雾化器将刻蚀液雾化，利用雾化液滴刻蚀器件，使镂空、栅格等精细复杂结构平稳释放，提供刻蚀精细复杂结构的成功率。
The invention discloses a wet etching equipment and a photoresist cleaning and developing device. The wet etching equipment comprises: a casing, a control panel is arranged on the outer wall of the casing; a liquid carrier basin is arranged in the casing and is used for The solution is contained; the basin edge of the liquid carrier basin is fixedly connected with the inner wall of the shell; the ultrasonic atomizer is fixed at the bottom of the liquid carrier basin, and is used to atomize the solution in the liquid carrier basin into droplets; On the basin edge of the liquid carrier basin, it is used to hold the device to be etched; the device to be etched is separated from the solution; the power supply module is arranged at the bottom of the casing; wherein, the ultrasonic atomizer is electrically connected to the control panel; The heater and the control panel are all electrically connected to the power supply module. The etching flower basket is used to separate the etched device from the solution, and the etching solution is atomized by an ultrasonic atomizer. The success rate of complex structures.
Description
Technical Field
The invention belongs to the technical field of MEMS (micro electro mechanical system), and particularly relates to wet etching equipment and a photoresist cleaning and developing device.
Background
Photolithography is an important step in the semiconductor device fabrication process, which uses exposure and development to pattern geometric structures on a photoresist layer, and then transfers the pattern on a photomask to a substrate by etching.
Etching is most commonly divided into: dry etching and wet etching. Wet etching is a pure chemical reaction process, which means that chemical reaction between solution and pre-etching material is used to remove the part not masked by the masking film material for etching purpose.
In the existing wet etching, a required etching device is usually placed in etching liquid for soaking, and when the process method is used for etching the structures of small-size (5 micrometers) complex precise devices such as hollows, grids and the like, the fine structures such as the hollows, the grids and the like are broken and broken due to the surface tension of the liquid when the etched device leaves the etching liquid.
Disclosure of Invention
The technical purpose of the invention is to provide wet etching equipment and a photoetching device, which can destroy the inertia and surface tension of a liquid level, stably release fine and complex structures with small sizes (5 micrometers) such as hollows, grids and the like, and provide a success rate for etching the fine and complex structures.
In order to solve the problems, the technical scheme of the invention is as follows:
a wet etching apparatus, comprising:
the control panel is arranged on the outer wall of the shell;
the liquid carrying basin is arranged in the shell and used for containing a solution; the basin edge of the liquid carrying basin is fixedly connected with the inner wall of the shell;
the ultrasonic atomizer is fixedly arranged at the bottom of the liquid carrying basin and is used for atomizing the solution in the liquid carrying basin into liquid drops;
the etching flower basket is arranged on the edge of the liquid carrying basin and used for containing etched devices; the etched device is separated from the solution;
the power supply module is arranged at the bottom of the shell;
the ultrasonic atomizer is electrically connected with the control panel; the ultrasonic atomizer and the control panel are electrically connected with the power supply module.
According to an embodiment of the invention, the wet etching apparatus further includes a heating element fixedly arranged on an outer wall of the liquid carrying basin, the heating element is electrically connected with the control panel, and the heating element is electrically connected with the power supply module.
According to an embodiment of the invention, the wet etching equipment further comprises a magnetic stirrer, wherein a driving part of the magnetic stirrer is fixedly arranged at the bottom in the shell and is aligned with the bottom of the liquid carrying basin; a magnetic stirrer of the magnetic stirrer is arranged in the liquid carrying basin;
the driving part is electrically connected with the power supply module and the control panel.
According to an embodiment of the invention, the wet etching device further comprises a top cover, and the top cover is in threaded connection with the upper end face of the shell.
According to an embodiment of the invention, a temperature sensor is arranged on the lower surface of the top cover, a temperature display is arranged on the upper surface of the top cover, and the temperature sensor is connected with the temperature display.
According to an embodiment of the invention, the wet etching device further comprises a sealing ring for sealing the shell, and the sealing ring is sleeved on the thread of the top cover.
According to an embodiment of the present invention, the control unit in the control panel is a single chip microcomputer.
According to an embodiment of the invention, the liquid carrying basin and the shell are both made of teflon materials.
According to an embodiment of the present invention, the solution is an etching solution.
According to an embodiment of the invention, the liquid carrying basin is conical.
A photoresist cleaning and developing device comprises the wet etching equipment.
Due to the adoption of the technical scheme, compared with the prior art, the invention has the following advantages and positive effects:
1) in the wet etching equipment in the embodiment of the invention, the etched device is separated from the solution by adopting the etching basket, the etching liquid is atomized by the ultrasonic atomizer, and the device is etched by utilizing atomized liquid drops, so that fine and complex structures such as hollows, grids and the like are stably released, and the success rate of etching the fine and complex structures is provided.
2) In the wet etching equipment in the embodiment of the invention, the heating element is arranged on the side wall of the carrier basin, and the etching temperature is adjusted by the control panel, so that the etching rate can be improved.
3) The wet etching equipment in the embodiment of the invention adopts the magnetic stirrer, so that the equipment can automatically and uniformly stir, the solution can be kept to circulate, and the etching uniformity is improved.
4) The wet etching equipment in the embodiment of the invention is provided with the temperature sensor and the temperature display, so that the etching temperature can be detected in real time, and the temperature can be conveniently adjusted to meet the requirements of the etching process.
5) In the wet etching equipment in the embodiment of the invention, the shell and the carrier basin are both made of Teflon, so that the corrosion resistance is high.
Drawings
Fig. 1 is a schematic structural diagram of an external shape of a wet etching apparatus in an embodiment of the present invention;
FIG. 2 is a schematic diagram of an internal structure of the wet etching apparatus according to an embodiment of the present invention;
fig. 3 is an electrical block diagram of a wet etching apparatus in an embodiment of the invention.
Description of reference numerals:
1: a top cover; 2: a housing; 3: a base; 4: a temperature display; 5: a control panel; 6: a liquid carrying basin; 7: an ultrasonic atomizer; 8: a speed-regulating motor; 9: a magnetic stirrer; 10: a temperature sensor; 11: etching the flower basket; 12: electrically heating the patch; 13: a power supply module; 14: a thermistor; 15: thermal fusing; 16: and (7) a temperature controller.
Detailed Description
The wet etching apparatus and the photolithography apparatus according to the present invention will be described in detail with reference to the accompanying drawings and specific embodiments. Advantages and features of the present invention will become apparent from the following description and from the claims.
Example one
As shown in fig. 1 and 2, the wet etching apparatus provided by the present invention includes: the device comprises a shell, wherein a control panel 5 is arranged on the outer wall of the shell; the liquid carrying basin 6 is arranged in the shell and used for containing solution; the basin edge of the liquid carrying basin 6 is fixedly connected with the inner wall of the shell; the ultrasonic atomizer 7 is fixedly arranged at the bottom of the liquid carrying basin 6 and is used for atomizing the solution in the liquid carrying basin 6 into liquid drops; the etching flower basket 11 is arranged on the edge of the liquid carrying basin 6 and used for containing etched devices; separating the etched device from the solution; the power supply module 13 is arranged at the bottom of the shell; wherein, the ultrasonic atomizer 7 is electrically connected with the control panel 5; the ultrasonic atomizer 7 and the control panel 5 are both electrically connected with the power supply module 13.
The wet etching equipment adopts the etching basket 11 to separate the etched device from the solution, atomizes the etching liquid by the ultrasonic atomizer 7, and utilizes the atomized liquid drop etching device to stably release fine and complex structures such as hollow parts, grids and the like, thereby providing the success rate of etching the fine and complex structures.
Specifically, the wet etching equipment is integrally cylindrical, and the shell is composed of a top cover 1, a shell 2 and a base 3. Be equipped with control panel 5 on the lateral wall of shell 2, top cap 1 and 2 threaded connection of shell, base 3 passes through the screw fixation with shell 2. The upper surface of top cap 1 is equipped with temperature monitor 4, and the lower surface of top cap 1 is equipped with temperature sensor 10, and this temperature sensor 10 links to each other with temperature monitor 4, and the temperature that temperature sensor 10 detected can be shown by temperature monitor 4, but the temperature in the real-time detection wet etching equipment to conveniently adjust the temperature, make it satisfy the etching process requirement.
The shell 2 is internally provided with a liquid carrying basin 6 which is conical, and the conical liquid carrying basin 6 can reduce the consumption of etching liquid. The edge of the liquid carrying basin 6 is fixedly connected with the inner wall of the shell 2. The bottom of liquid carrying basin 6 is equipped with ultrasonic atomizer 7, and this ultrasonic atomizer 7 can inlay in the bottom of liquid carrying basin 6, makes the atomizing piece of ultrasonic atomizer 7 and the solution contact in liquid carrying basin 6, and ultrasonic atomizer 7 starts the back, can atomize into the liquid droplet with the solution in liquid carrying basin 6. An etching flower basket 11 is arranged on the edge of the liquid carrying basin 6, and the etching flower basket 11 can contain an etched device to separate the etched device from the solution in the liquid carrying basin 6. An electrically heated patch 12 is provided on the side wall of the carrier bowl 6, and the electrically heated patch 12 can heat the solution in the carrier bowl 6 to provide an etching rate.
The base 3 internal stability is equipped with magnetic stirrers's buncher 8, and this buncher 8 aligns with the bottom of carrying liquid basin 6, and in carrying liquid basin 6 was arranged in to magnetic stirrers's magnetic stirrers 9, after buncher 8 started, produced magnetic field, by magnetic field promotion magnetic stirrers 9 make circular motion to realize stirring the solution in carrying liquid basin 6, provide the sculpture homogeneity. The base 3 is also provided with a power supply module 13 which is connected with an external power supply of 220V and 50Hz through a power line plug.
The ultrasonic atomizer 7, the speed regulating motor 8 and the electric heating patch 12 are all electrically connected with the control panel 5, the control panel 5 can control the switch of the ultrasonic atomizer 7, the rotating speed of the speed regulating motor 8 and the temperature of the electric heating patch 12, and the temperature of the electric heating patch 12 can reach 200 ℃.
The electrical block diagram of the wet etching equipment is shown in fig. 3, wherein an ultrasonic atomizer 7, a speed regulating motor 8, an electric heating patch 12, a thermistor 14, a thermal fuse 15 and a temperature controller 16 are all electrically connected with a power supply module 13; wherein, the thermistor 14 is a sensing unit, transmits a temperature signal to the temperature controller 16, and the temperature controller 16 adjusts the temperature according to the received temperature signal; the thermal fuse 15 is equivalent to a fuse, and when the temperature is too high or the circuit is short-circuited, the power supply is cut off, and the equipment is protected.
This wet etching equipment is when the fine structure of sculpture small-size (5 microns), pour into the etching solution of appropriate capacity in carrying liquid basin 6, then load on etching basket of flowers 11, put on etching basket of flowers 11 by the sculpture device, because the etching solution has stronger corrosivity, shell 2 and carrying liquid basin 6 all adopt special fluorine dragon material to make, for preventing that the sculpture steam from causing the influence to the surrounding environment, need use the sealing washer to seal top cap 1 and shell 2, this sealing washer can overlap and establish on the screw thread of top cap 1, at the in-process that top cap 1 and shell 2 were screwed up, the sealing washer is pushed to the junction of screw thread and top cap 1 lower surface, can seal shell 2. Starting an ultrasonic atomizer 7 through a control panel 5, atomizing the etching liquid in the liquid carrying basin 6 into liquid drops, and etching the device by using the liquid drops; in the process that the etching liquid is atomized, the temperature of the electric heating patch 12 can be adjusted through the control panel 5, and the speed regulating motor 8 can be started, so that the magnetic stirrer 9 can stir the etching liquid, and the etching speed and the etching uniformity are improved.
When the wet etching equipment is used for a traditional soaking etching process, the ultrasonic atomizer 7 is closed, the etching basket 11 does not need to be installed, an etched device is immersed in etching liquid in the liquid carrying basin 6, the electric heating patch 12 is adjusted to heat the etching liquid, the magnetic stirrer 9 is controlled to stir the etching liquid by controlling the rotating speed of the speed regulating motor 8, and the general wet etching process conditions are met.
Example two
The invention also provides a photoresist cleaning and developing device which comprises the wet etching equipment in the first embodiment.
Specifically, the photoresist cleaning and developing device is used for the developing process after traditional photoetching exposure, photoresist developing solution is poured into the liquid carrying basin 6 and is immersed into a device to be developed, the electric heating patch 12 can be adjusted to heat the developing solution if needed, and the etching basket 11 does not need to be installed and the ultrasonic atomizer 7 does not need to be started.
In the post-exposure drying process of the photoresist cleaning and developing device, if the photoresist falls off and cracks are easily etched due to a small adhesive force between the photoresist and a substrate and a large internal stress of a photoresist surface in a traditional developing mode, as described in the first embodiment, an etching basket 11 needs to be installed and an ultrasonic atomizer 7 needs to be started, and the process conditions are adjusted to regulate an electric heating plate 12 to control the temperature of atomized developing solution and slowly develop the photoresist by utilizing atomized liquid drops; for example, the magnetic stirrer 9 is controlled to stir the developing solution by controlling the rotating speed of the speed regulating motor 8, so that the photoresist developing yield is improved.
When the device is used for general cleaning, deionized water is poured into the carrier liquid basin 6 and is immersed into a device to be cleaned, the electric heating patch 12 can be adjusted to heat the deionized water if needed, the ultrasonic atomizer 7 is started, and the etching flower basket 11 is not required to be installed.
In conclusion, the wet etching equipment and the photoresist cleaning and developing device provided by the invention satisfy the requirements of the traditional immersion etching process method, and overcome the process defects of the traditional wet etching, namely the problem that when the traditional wet etching is used for etching the structures of small-size (5 microns) complex precise devices such as hollows, grids and the like, the etched devices leave the etching liquid level, and the fine structures such as the hollows, the grids and the like are broken and broken due to the surface tension of the liquid; the etching of the small-size (5 micron) complex precise device structure can be completed without using high-cost dry etching, the cost is low, and the yield of the fine and complex etched structure is improved.
The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the above embodiments. Even if various changes are made to the present invention, it is still within the scope of the present invention if they fall within the scope of the claims of the present invention and their equivalents.
Claims (5)
1. A wet etching apparatus, comprising:
the control panel is arranged on the outer wall of the shell;
the liquid carrying basin is arranged in the shell and used for containing a solution; the basin edge of the liquid carrying basin is fixedly connected with the inner wall of the shell;
the ultrasonic atomizer is fixedly arranged at the bottom of the liquid carrying basin and is used for atomizing the solution in the liquid carrying basin into liquid drops;
the etching flower basket is arranged on the edge of the liquid carrying basin and used for containing etched devices; the etched device is separated from the solution;
the power supply module is arranged at the bottom of the shell;
the ultrasonic atomizer is electrically connected with the control panel; the ultrasonic atomizer and the control panel are electrically connected with the power supply module; the liquid carrying basin is characterized by further comprising a heating element fixedly arranged on the outer wall of the liquid carrying basin, the heating element is electrically connected with the control panel, and the heating element is electrically connected with the power supply module;
the driving part of the magnetic stirrer is fixedly arranged at the bottom in the shell and is aligned with the bottom of the liquid carrying basin; a magnetic stirrer of the magnetic stirrer is arranged in the liquid carrying basin;
the driving part is electrically connected with the power supply module and the control panel;
the top cover is in threaded connection with the upper end face of the shell;
the lower surface of the top cover is provided with a temperature sensor, the upper surface of the top cover is provided with a temperature display, and the temperature sensor is connected with the temperature display;
the sealing ring is used for sealing the shell and sleeved on the thread of the top cover;
the liquid carrying basin is conical.
2. The wet etching apparatus as claimed in claim 1, wherein the control unit in the control panel is a single chip microcomputer.
3. The wet etching apparatus as claimed in claim 1 or 2, wherein the carrier bowl and the housing are made of teflon material.
4. The wet etching apparatus of claim 3, wherein the solution is an etching liquid.
5. A resist cleaning and developing apparatus comprising the wet etching device according to any one of claims 1 to 4.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910185830.9A CN109920747B (en) | 2019-03-12 | 2019-03-12 | Wet etching equipment and photoresist cleaning and developing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910185830.9A CN109920747B (en) | 2019-03-12 | 2019-03-12 | Wet etching equipment and photoresist cleaning and developing device |
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| Publication Number | Publication Date |
|---|---|
| CN109920747A CN109920747A (en) | 2019-06-21 |
| CN109920747B true CN109920747B (en) | 2021-04-13 |
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| CN201910185830.9A Expired - Fee Related CN109920747B (en) | 2019-03-12 | 2019-03-12 | Wet etching equipment and photoresist cleaning and developing device |
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Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7391297B2 (en) * | 2019-06-28 | 2023-12-05 | 株式会社Flosfia | Etching processing method and etching processing equipment |
| CN110806496A (en) * | 2019-10-10 | 2020-02-18 | 上海应用技术大学 | An all-metal micro-inertial system device and its processing method |
| CN110993528B (en) * | 2019-11-07 | 2023-05-02 | 复旦大学 | A device for wet etching single-sided substrate |
| CN118818924A (en) * | 2024-09-12 | 2024-10-22 | 香港科技大学(广州) | Fully automatic developing components, developing devices and developing machines for scientific research |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04318930A (en) * | 1991-04-17 | 1992-11-10 | Tokyo Electron Ltd | Method and device for removing natural oxide film |
| CN107316829A (en) * | 2017-07-06 | 2017-11-03 | 中北大学 | Gas phase lithographic method and vapor etching device based on TMAH |
| CN107352501A (en) * | 2017-07-05 | 2017-11-17 | 中北大学 | TMAH silicon is atomized gas phase etching system |
-
2019
- 2019-03-12 CN CN201910185830.9A patent/CN109920747B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04318930A (en) * | 1991-04-17 | 1992-11-10 | Tokyo Electron Ltd | Method and device for removing natural oxide film |
| CN107352501A (en) * | 2017-07-05 | 2017-11-17 | 中北大学 | TMAH silicon is atomized gas phase etching system |
| CN107316829A (en) * | 2017-07-06 | 2017-11-03 | 中北大学 | Gas phase lithographic method and vapor etching device based on TMAH |
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