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JPH03165486A - Temperature regulating device for treatment - Google Patents

Temperature regulating device for treatment

Info

Publication number
JPH03165486A
JPH03165486A JP30503489A JP30503489A JPH03165486A JP H03165486 A JPH03165486 A JP H03165486A JP 30503489 A JP30503489 A JP 30503489A JP 30503489 A JP30503489 A JP 30503489A JP H03165486 A JPH03165486 A JP H03165486A
Authority
JP
Japan
Prior art keywords
temperature
resist
heating element
layer
element layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP30503489A
Other languages
Japanese (ja)
Inventor
Hidekazu Shirakawa
英一 白川
Tomohaya Tajima
田島 智早
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Kyushu Ltd
Original Assignee
Tokyo Electron Kyushu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Kyushu Ltd filed Critical Tokyo Electron Kyushu Ltd
Priority to JP30503489A priority Critical patent/JPH03165486A/en
Publication of JPH03165486A publication Critical patent/JPH03165486A/en
Pending legal-status Critical Current

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  • Coating Apparatus (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Resistance Heating (AREA)
  • Instantaneous Water Boilers, Portable Hot-Water Supply Apparatuses, And Control Of Portable Hot-Water Supply Apparatuses (AREA)

Abstract

PURPOSE:To efficiently raise temperature, and thereby facilitate temperature control by forming a heat element layer in a membrane state over the whole area of the outer circumferential surface of a treatment through pipe, and thereby controlling electric power supply to the heat element layer based on the result of measurement by a temperature measuring means. CONSTITUTION:An insulating layer 11 is provided for the whole area of the outer circumferential surface of a resist fluid through pipe 10 over which a heating element layer 12 is formed in a membrane state, and an insulating layer 13 is then laminated over the aforesaid heating element layer. When electric power is supplied to the layer 12 from a power supply through an electrode 14, the whole area of the layer 12 is heated up, the temperature of resist within the pipe 10 is instantly raised. A temperature regulation controller compares the result of temperature measurement from a temperature sensor 17 with a set temperature to control electric power supply. When the layer 12 is thus formed over the whole area of the outer circumferential surface 10, resist can be uniformly heated up so that the temperature of resist can efficiently be raised up to a set value, and the temperature control of resist can thereby be executed with ease.

Description

【発明の詳細な説明】 (産業上の利用分野) 本発明は処理液温度調節装置に関する。[Detailed description of the invention] (Industrial application field) The present invention relates to a processing liquid temperature control device.

(従来の技術) 処理液温度調節装置として、半導体ウェハ等の被処理体
の表面に処理液例えば塗布すべきレジストや現像液等の
塗布液を適切な温度にコントロールすることが要求され
る。
(Prior Art) A processing liquid temperature control device is required to control a processing liquid, such as a coating liquid such as a resist or a developer, to an appropriate temperature on the surface of an object to be processed such as a semiconductor wafer.

一般に、IC(集積回路)やLSI  (大規模集結回
路)等の半導体の製造において、例えば半導体ウェハ等
の被処理体の表面にレジストを塗布する工程がある。
2. Description of the Related Art Generally, in the manufacture of semiconductors such as ICs (integrated circuits) and LSIs (large scale integrated circuits), there is a step of applying a resist to the surface of an object to be processed, such as a semiconductor wafer.

このような工程においては、スピン、スプレィあるいは
静電等の方式を用いたレジスト塗布装置が使用される。
In such a process, a resist coating device using a spin, spray, or electrostatic method is used.

ところで、このようなレジスト塗布装置においては、塗
布すべきレジストを例えば21〜25℃程度に暖める必
要がある。
By the way, in such a resist coating apparatus, it is necessary to heat the resist to be coated to, for example, about 21 to 25 degrees Celsius.

これは、半導体ウェハの表面に塗布したレジストを均一
にするために、レジストの粘度変動を抑制するための条
件の一つでもある。
This is also one of the conditions for suppressing fluctuations in the viscosity of the resist in order to make the resist applied to the surface of the semiconductor wafer uniform.

第4図および第5図は、上記のレジスト塗布装置に具備
され、例えばレジストの温度をコントロールする塗布液
温調装置の一例を示すもので、暖水循環管1内の循環水
路2にレジストを通過させる塗布液通過管3が挿入され
ている。
4 and 5 show an example of a coating liquid temperature control device that is included in the above-mentioned resist coating apparatus and controls the temperature of the resist. A coating liquid passage tube 3 is inserted therein.

そして、サーモコントローラ4により設定温度にコント
ロールされた純水が暖水循環管1内の循環水路2内を循
環すると、塗布液通過管3の内部を流れるレジストが設
定された温度に温調される。
Then, when the pure water whose temperature is controlled to a set temperature by the thermo-controller 4 circulates in the circulation channel 2 in the warm water circulation pipe 1, the temperature of the resist flowing inside the coating liquid passage pipe 3 is controlled to the set temperature.

ところが、このような塗布液温調装置では、サーモコン
トローラ4が高直であったり、循環系を構成する管のス
ペースを要したりするため、塗布液温1個装置の低コス
ト化や小型化の妨げとなってしまう。
However, in such a coating liquid temperature control device, the thermocontroller 4 is tall and requires space for the pipes that make up the circulation system, so it is difficult to reduce the cost and size of a single coating liquid temperature device. It becomes a hindrance.

そこで、このような塗布液温調装置の低コスト化や小型
化の妨げを回避するために、例えば第6図に示すような
塗布液温調装置もある。
Therefore, in order to avoid such obstacles to cost reduction and miniaturization of the coating liquid temperature regulating apparatus, there is also a coating liquid temperature regulating apparatus as shown in FIG. 6, for example.

この塗布液温調装置は、例えばアルミニウムからなる塗
布液通過管5の外周にニクロム等の発熱体6を有する発
熱シート7を巻き付けた構成とされているもので、第4
図に示した塗布液温調装置に比べ、暖水循環管1やサー
モコントローラ4等を要しないため、低コスト化や小型
化を図ることができる。
This coating liquid temperature control device has a structure in which a heat generating sheet 7 having a heating element 6 made of nichrome or the like is wrapped around the outer periphery of a coating liquid passing tube 5 made of, for example, aluminum.
Compared to the coating liquid temperature control device shown in the figure, the hot water circulation pipe 1, thermocontroller 4, etc. are not required, so that cost reduction and size reduction can be achieved.

(発明が解決しようとする課題) しかしながら、上述した従来の塗布液温調装置では、発
熱シート7に設けられた発熱体6が線状であるため、塗
布液通過管5の外周面の略全域を均等に熱することがで
きない。
(Problems to be Solved by the Invention) However, in the conventional coating liquid temperature control device described above, since the heating element 6 provided on the heat generating sheet 7 is linear, almost the entire area of the outer peripheral surface of the coating liquid passage tube 5 is cannot be heated evenly.

また発熱シート7は、薄いフィルム状であるため、塗布
液通過管5の外周面に密接させることが困難であり、こ
れにより塗布液通過管5への熱伝導のむらを生してしま
う。
Furthermore, since the heat generating sheet 7 is in the form of a thin film, it is difficult to bring it into close contact with the outer circumferential surface of the coating liquid passage tube 5, resulting in uneven heat conduction to the coating liquid passage tube 5.

従って、このように、塗布液通過管5の外周面の略全域
を均等に熱することができない場合には、レジストを所
定の温度まで上昇させる際の効率が悪くなるばかりか、
レジストの温度を瞬時にしてコントロールすることも困
難となる。
Therefore, if substantially the entire outer peripheral surface of the coating liquid passage tube 5 cannot be heated evenly, not only will the efficiency in raising the resist to a predetermined temperature deteriorate,
It is also difficult to control the temperature of the resist instantly.

本発明は、このような事情に対処して成されたもので、
処理液の温度を効率良く瞬時にしてコントロールするこ
とができる処理液’tH度調節装置を提供することを目
的とする。
The present invention was made in response to these circumstances, and
It is an object of the present invention to provide a treatment liquid 'tH degree adjusting device that can efficiently and instantaneously control the temperature of a treatment liquid.

〔発明の(を成] (課題を解決するための手段) 処理液を通過させる処理液通過管と、この通過管の管壁
上に設けられ上記処理液を包囲する環状発熱体層と、こ
の発熱体層に電力を供給して加熱する電力供給手段と、
前記発熱体層から発せられる熱を測温する測温手段と、
このΔPI ?EL手段による1lll+温結果と設定
温度の値とによって前記電力の供給を制御する制御手段
とを具備するものである。
[Means for Solving the Problems] A processing liquid passage pipe through which a processing liquid passes, an annular heating element layer provided on a pipe wall of the passage pipe and surrounding the processing liquid, and a power supply means for supplying power to the heating element layer to heat it;
a temperature measuring means for measuring the heat emitted from the heating element layer;
This ΔPI? The apparatus includes a control means for controlling the power supply based on the 1llll+ temperature result from the EL means and the set temperature value.

(作 用) 本発明の加熱装置では、処理液通過管の例えば外周壁面
上全域に発熱体層を薄膜状に形成し、その発熱体層に電
力供給手段から電力を供給する。
(Function) In the heating device of the present invention, a heating element layer is formed in the form of a thin film over, for example, the entire outer peripheral wall surface of the processing liquid passage tube, and electric power is supplied to the heating element layer from the power supply means.

このとき、制御手段が発熱体層の熱を測温する測温手段
からの測温結果に基づき、測温結果か設定温度峙を越え
た場合には電力供給手段の供給動作を停止させ、71p
1温結果が設定値を下回った場合には電力供給手段の供
給動作を続行させるように制御する。
At this time, the control means stops the power supply operation of the power supply means based on the temperature measurement result from the temperature measurement means that measures the heat of the heating element layer, if the temperature measurement result exceeds the set temperature level, and stops the supply operation of the power supply means.
When the first temperature result is lower than the set value, the power supply means is controlled to continue the supply operation.

従って、発熱体層が塗布液通過管の外周壁の略全域を熱
するので、その外周面の略全域を均等に熱することがで
きる。
Therefore, since the heating element layer heats substantially the entire area of the outer circumferential wall of the coating liquid passage tube, substantially the entire area of the outer circumferential surface can be heated evenly.

また発熱体層を塗/li液通過管の外周壁の略全域に薄
膜状に形成したので、塗布液通過管への熱伝導のむらも
なくなる。
Furthermore, since the heating element layer is formed in a thin film form over substantially the entire outer circumferential wall of the coating/li liquid passage tube, uneven heat conduction to the coating liquid passage tube is eliminated.

さらには、発熱体層が塗布液通過管の外周壁の略全域を
均等に熱するので、塗布液を所定の温度まで効率良く上
昇させることができるため、塗布液を瞬時にしてコント
ロールすることもできる。
Furthermore, since the heating element layer evenly heats almost the entire area of the outer peripheral wall of the coating liquid passage tube, the coating liquid can be efficiently raised to a predetermined temperature, making it possible to control the coating liquid instantly. can.

(実施例) 以下、本発明の実施例の詳細を図面に基づいて説明する
(Example) Hereinafter, details of an example of the present invention will be described based on the drawings.

第1図および第2図は、本発明を処理液例えばレジスト
の温度をコントロールする塗布液a、2!J装置に適用
した場合の一実施例を示すものである。
FIGS. 1 and 2 show processing solutions of the present invention, such as coating solutions a, 2!, which control the temperature of resist. This shows an example in which the present invention is applied to a J device.

これらの図に示すように、角筒又は円筒状塗布液通過管
9の例えばアルミニウムからなる通過管10の外周面の
全域には、絶縁性をHした例えばアルミナからなる絶縁
層11が薄膜状に形成されている。絶縁層11の外周面
にはその絶縁層11の両端部を僅かに残して発熱体層1
2が薄膜状に形成され、さらに発熱体層12の外周面に
はその発熱体層12の両端部を僅かに残して絶縁層13
が薄膜状に形成されている。即ち、上記発熱体12はレ
ジスト液を包囲する如く環状に形成される。
As shown in these figures, an insulating layer 11 made of, for example, alumina with insulation property H is formed in the form of a thin film over the entire outer peripheral surface of the passage tube 10 made of aluminum, for example, of the rectangular tube or cylindrical coating liquid passage tube 9. It is formed. The heating element layer 1 is formed on the outer peripheral surface of the insulating layer 11 with a slight portion left at both ends of the insulating layer 11.
2 is formed in the form of a thin film, and an insulating layer 13 is further formed on the outer peripheral surface of the heating element layer 12 with a slight portion left at both ends of the heating element layer 12.
is formed into a thin film. That is, the heating element 12 is formed in an annular shape so as to surround the resist liquid.

そして、発熱体層12の露出した各端部12aには、例
えばリング状の電極14が嵌合されるようになっている
For example, a ring-shaped electrode 14 is fitted into each exposed end portion 12a of the heat generating layer 12.

各電極14には、例えば200■の交流を供給する交流
電源15が接続されている。
Each electrode 14 is connected to an AC power source 15 that supplies, for example, 200 square meters of alternating current.

交流電源15には、温調コントローラ16が接続されて
いる。
A temperature controller 16 is connected to the AC power supply 15 .

そして、温調コントローラ16は通過管10に取付けら
れた温感センサ17からのaFI 温信号に基づいてそ
の交流電源15の電力の供給を制御する。
The temperature controller 16 controls the supply of power from the AC power supply 15 based on the aFI temperature signal from the temperature sensor 17 attached to the passage pipe 10.

次に、塗布液通過管9の製造方法の一例を第3図を用い
て説明する。
Next, an example of a method for manufacturing the coating liquid passage tube 9 will be explained using FIG. 3.

まず、通過管10の外周面の全域に溶射あるいは爆射等
のプロセスを用いてアルミナの絶縁層11を薄膜状に形
成する。
First, an insulating layer 11 of alumina is formed in the form of a thin film over the entire outer peripheral surface of the passage tube 10 using a process such as thermal spraying or explosion spraying.

次いで、絶縁層11の外周面にその絶縁層11の両端部
を作かに残して発熱体層12例えば発熱体膜状を上記同
様のプロセスを用いて薄膜状に形成した後、発熱体層1
2の外周面にその発熱体層12の両端部を住かに残して
絶縁層13を同プロセスを用いて薄膜状に形成する。
Next, a heating element layer 12 such as a heating element film is formed into a thin film shape using a process similar to the above, leaving both ends of the insulation layer 11 uncut on the outer peripheral surface of the insulation layer 11.
Using the same process, an insulating layer 13 is formed in the form of a thin film on the outer peripheral surface of the heat generating layer 12, leaving both ends of the heat generating layer 12 intact.

このように、溶射あるいは爆射等のプロセスを用いるこ
とにより、各薄膜たる発熱体層12および絶縁層11.
13は、通過管10の外周面に緊密に形成される。
In this way, by using a process such as thermal spraying or explosion spraying, each thin film of the heating element layer 12 and the insulating layer 11.
13 is tightly formed on the outer peripheral surface of the passage tube 10.

続いて、このような構成による塗布液温調装置について
説明する。
Next, a coating liquid temperature control device having such a configuration will be explained.

まず、温調コントローラ16に9 /+iすべきレジス
トの温度を例えば21〜25℃程度の範囲内で設定する
と、温調コントローラ16は、温感センサ17からの測
温信号に基づき設定値に達するまで交流電源15に電力
の供給を行わせる。
First, when the temperature controller 16 is set to the temperature of the resist to be 9/+i within a range of, for example, 21 to 25 degrees Celsius, the temperature controller 16 reaches the set value based on the temperature measurement signal from the temperature sensor 17. The AC power supply 15 is caused to supply power until the end.

交流電源15から供給された電力は、各電極14を介し
て発熱体層12に供給される。
Electric power supplied from the AC power source 15 is supplied to the heat generating layer 12 via each electrode 14.

そして、発熱体層12の全域が発熱を行うと、この発熱
により通過管10の内部を流れるレジストの温度が上昇
する。
When the entire region of the heating element layer 12 generates heat, the temperature of the resist flowing inside the passage tube 10 rises due to this heat generation.

このとき、温調コントローラ16は、温感センサ17か
らの7IllI温信号に基づき交流電源15の供給動作
を制御する。
At this time, the temperature controller 16 controls the supply operation of the AC power source 15 based on the 7IllI temperature signal from the temperature sensor 17.

つまり、例えば温感センサ17からのII iEL信号
に基づ<測温結果が設定温度を越えた場合にはその供給
動作を停止1−1させ、逆にその側温結果が設定lH度
を下回った場合にはその(供給動作を続行させる。
In other words, for example, if the temperature measurement result exceeds the set temperature based on the II iEL signal from the temperature sensor 17, the supply operation is stopped 1-1, and conversely, if the side temperature result falls below the set temperature If so, continue the supply operation.

このように、本実施例では、レジストを通過させるべき
管の外周面の略全域に発熱体層を形成したので、その管
の外周面の略全域を均等に熱することができ、これによ
りレジストの温度を効率良く瞬時にして所定値まで上昇
させることができる。
As described above, in this example, since the heating element layer was formed over almost the entire outer circumferential surface of the tube through which the resist should pass, it is possible to uniformly heat almost the entire outer circumferential surface of the tube. temperature can be efficiently and instantaneously raised to a predetermined value.

また溶射あるいは爆射等のプロセスを用いて管の外周面
の略全域に発熱体層や絶縁層を形成したので、これらの
薄膜と管の外周面とが緊密となり、これにより熱を均一
に伝導させることができる。
In addition, since the heating element layer and insulating layer are formed on almost the entire outer circumferential surface of the tube using a process such as thermal spraying or explosion spraying, these thin films and the outer circumferential surface of the tube are tightly bonded, which allows heat to be conducted evenly. can be done.

なお、本実施例では、本発明をレジストの温度をコント
ロールする塗布液温調装置に適用した場合について説明
したが、この例に限らず現像液等の他の塗布液の温度を
コントロールする塗布液温調装置に適用してもよい。
In this example, the case where the present invention is applied to a coating liquid temperature control device that controls the temperature of a resist is explained, but the present invention is not limited to this example. It may also be applied to a temperature control device.

上記実施例では発熱体を処理液通過管の管外壁面上に被
着した例について説明したが、管内壁面上に被着しても
よい。この場合直接処理液に熱か印加されるので速熱効
果がある。
In the above embodiment, an example was described in which the heating element was attached to the outer wall surface of the processing liquid passage tube, but it may be attached to the inner wall surface of the tube. In this case, heat is applied directly to the processing liquid, so there is a rapid heating effect.

また、温度制御の方法としてオンオフ制御について説明
したが、PID制御器等を用いても良い。
Furthermore, although on/off control has been described as a temperature control method, a PID controller or the like may also be used.

[発明の効果] 以上説明したように、本発明の処理液温度調節装置によ
れば、発熱体層が塗布液通過管の外周壁を周壁に沿って
環状に熱するので、棒状処理液の全周面から加熱するこ
とができる。さらに塗布液温度を効率良くコントロール
することができる。
[Effects of the Invention] As explained above, according to the processing liquid temperature control device of the present invention, the heating element layer heats the outer circumferential wall of the coating liquid passage tube in an annular manner along the circumferential wall. It can be heated from the surrounding surface. Furthermore, the temperature of the coating solution can be efficiently controlled.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明をレジストの温度をコントロールする塗
布液温度調節装置に適用した場合の一実施例を示す概略
図、第2図は第1図の塗布液通過管を示す溝断面図、第
3図は第1図の塗rIT液通過管の製造手順を示す図、
第4図および第5図は従来の塗布液温調装置の一例を示
す図、第6図は従来の塗布液温調装置の他の例を示す図
である。 9・・・塗布液通過管、10・・・供給管、11.13
・・・絶縁層、12・・・発熱体層層、14・・・電極
、15・・・交流電源、16・・・温調コントローラ、
17・・・in感センサ。
FIG. 1 is a schematic view showing an embodiment of the present invention applied to a coating liquid temperature control device for controlling the temperature of a resist, and FIG. Figure 3 is a diagram showing the manufacturing procedure of the coated IT liquid passage tube shown in Figure 1;
4 and 5 are diagrams showing an example of a conventional coating liquid temperature regulating device, and FIG. 6 is a diagram showing another example of the conventional coating liquid temperature regulating device. 9... Coating liquid passage pipe, 10... Supply pipe, 11.13
... Insulating layer, 12 ... Heating element layer, 14 ... Electrode, 15 ... AC power supply, 16 ... Temperature controller,
17...in sensing sensor.

Claims (1)

【特許請求の範囲】[Claims] (1)処理液を通過させる処理液通過管と、この通過管
の管壁上に設けられ上記処理液を包囲する環状発熱体層
と、 この発熱体層に電力を供給して加熱する電力供給手段と
、 前記発熱体層から発せられる熱を測温する測温手段と、 この測温手段による測温結果と設定温度の値とによって
前記電力の供給を制御する制御手段とを具備することを
特徴とする処理液温度調節装置。
(1) A processing liquid passage pipe through which the processing liquid passes; an annular heating element layer provided on the wall of the passage pipe and surrounding the processing liquid; and a power supply supplying electric power to the heating element layer to heat it. a temperature measuring means for measuring the heat emitted from the heating element layer; and a control means for controlling the supply of electric power based on the temperature measurement result by the temperature measuring means and a set temperature value. Features processing liquid temperature control device.
JP30503489A 1989-11-24 1989-11-24 Temperature regulating device for treatment Pending JPH03165486A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP30503489A JPH03165486A (en) 1989-11-24 1989-11-24 Temperature regulating device for treatment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP30503489A JPH03165486A (en) 1989-11-24 1989-11-24 Temperature regulating device for treatment

Publications (1)

Publication Number Publication Date
JPH03165486A true JPH03165486A (en) 1991-07-17

Family

ID=17940303

Family Applications (1)

Application Number Title Priority Date Filing Date
JP30503489A Pending JPH03165486A (en) 1989-11-24 1989-11-24 Temperature regulating device for treatment

Country Status (1)

Country Link
JP (1) JPH03165486A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001067819A1 (en) * 2000-03-03 2001-09-13 Cooper Richard P Thin film tubular heater
JP2005322594A (en) * 2004-05-11 2005-11-17 Susumu Kiyokawa Heating pipe, and apparatus using it
JP2007157577A (en) * 2005-12-07 2007-06-21 Fujiki Kosan Kk Spray heating element for low temperature and method of manufacturing, and heating device using it
JP2019033752A (en) * 2013-03-15 2019-03-07 アール・ジエイ・レイノルズ・タバコ・カンパニー Heating elements formed from sheet of material, inputs and methods for production of atomizers, cartridge for aerosol delivery device, and method for assembling cartridge for smoking article
US11000075B2 (en) 2013-03-15 2021-05-11 Rai Strategic Holdings, Inc. Aerosol delivery device

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62186493A (en) * 1986-02-13 1987-08-14 三菱電機株式会社 Heater
JPS6253591B2 (en) * 1980-12-29 1987-11-11 Fujitsu Ltd
JPS633593B2 (en) * 1983-04-22 1988-01-25 Sutooru Risaachi Ando Dev Corp Za
JPH01154487A (en) * 1987-12-10 1989-06-16 Hitachi Metals Ltd Heat insulation tube for heating of conduit

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6253591B2 (en) * 1980-12-29 1987-11-11 Fujitsu Ltd
JPS633593B2 (en) * 1983-04-22 1988-01-25 Sutooru Risaachi Ando Dev Corp Za
JPS62186493A (en) * 1986-02-13 1987-08-14 三菱電機株式会社 Heater
JPH01154487A (en) * 1987-12-10 1989-06-16 Hitachi Metals Ltd Heat insulation tube for heating of conduit

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001067819A1 (en) * 2000-03-03 2001-09-13 Cooper Richard P Thin film tubular heater
JP2005322594A (en) * 2004-05-11 2005-11-17 Susumu Kiyokawa Heating pipe, and apparatus using it
JP2007157577A (en) * 2005-12-07 2007-06-21 Fujiki Kosan Kk Spray heating element for low temperature and method of manufacturing, and heating device using it
JP2019033752A (en) * 2013-03-15 2019-03-07 アール・ジエイ・レイノルズ・タバコ・カンパニー Heating elements formed from sheet of material, inputs and methods for production of atomizers, cartridge for aerosol delivery device, and method for assembling cartridge for smoking article
US11000075B2 (en) 2013-03-15 2021-05-11 Rai Strategic Holdings, Inc. Aerosol delivery device
JP2021074017A (en) * 2013-03-15 2021-05-20 アール・エイ・アイ・ストラテジック・ホールディングス・インコーポレイテッド Heating elements formed from sheet of material, inputs and methods for production of atomizers, cartridge for aerosol delivery device, and method for assembling cartridge for smoking article
US11871484B2 (en) 2013-03-15 2024-01-09 Rai Strategic Holdings, Inc. Aerosol delivery device

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