CN109895198B

CN109895198B - Surface transparent compacting material based on high-frequency glue-free compacting technology and preparation method thereof

Info

Publication number: CN109895198B
Application number: CN201910181320.4A
Authority: CN
Inventors: 王凯
Original assignee: Individual
Current assignee: Santong Hainan International Technology Co ltd
Priority date: 2019-03-11
Filing date: 2019-03-11
Publication date: 2021-05-18
Anticipated expiration: 2039-03-11
Also published as: CN109895198A; JP6893042B2; JP2020147023A

Abstract

The invention relates to a surface transparent compacting material based on a high-frequency glue-free compacting technology, wherein at least one area of the surface transparent compacting material comprises a transparent layer and a compacting wood layer which are wholly or partially thermally combined together through high frequency. The surface transparent compacting material has the superior performances of the compacting wood and the transparent material, and can be widely applied to the industrial field, the military field and the civil field. The invention also provides a preparation method of the material, which comprises the following steps: s1, a laminated structure pretreatment step, S2, a laminated structure high-frequency heat seal step and S3, a cooling treatment step. The preparation method well solves the technical problems of water absorption and rebound of the compacted wood and the like brought by the high frequency technology.

Description

Surface transparent compacting material based on high-frequency glue-free compacting technology and preparation method thereof

Technical Field

The invention belongs to the field of manufacturing of special wood products, and particularly relates to a surface transparent compacting material based on a high-frequency glue-free compacting technology and a manufacturing method thereof.

Background

The novel glue-free compacted hardwood (compacted wood) based on the high-frequency (high-frequency) technology has excellent and wide application, and one of the applications is a new glue-free composite material based on a high-frequency mixed material. The novel glue-free composite material is prepared by mixing the compacted wood and the transparent material (such as glass and a toughened film) at high frequency, so that the physical properties of the compacted wood and the transparent material are fully utilized, and a novel material can be provided for the industrial field, the military field and the civil field. The method for mixing the compacted wood and the transparent material based on the high-frequency technology has not been reported, and the specific preparation process for mixing the wood and the transparent material based on the high-frequency technology has not been reported in detail.

Disclosure of Invention

The invention provides a surface transparent compacting material based on a high-frequency glue-free compacting technology, wherein at least one region of the surface transparent compacting material comprises a transparent layer and a compacting wood layer which are wholly or partially thermally combined together through high frequency. The transparent layer of the invention comprises EB film or glass, and the glass comprises tempered glass, semi-tempered glass and common glass. The step of preparing the surface transparent compaction material comprises the following steps:

s1, a laminated structure pretreatment step: sequentially placing a first thermoplastic resin film and a transparent layer on at least one area of the wood board to prepare a pre-treatment laminated structure;

s2, a high-frequency heat seal step of a laminated structure: applying a pressure intensity of 0.01-0.4 MPa to the pre-treatment laminated structure, using a hot pressing plate as an upper surface temperature and a lower surface temperature of the pre-treatment laminated structure at 70-160 ℃, wherein the temperature difference between the upper surface temperature and the lower surface temperature is less than 40 ℃, heating the heat-seal laminated structure to a wood board temperature of 110-150 ℃ by using high frequency, and then preserving heat for 1-10min to obtain a high frequency heat-seal laminated structure;

s3, cooling treatment: and cooling the high-frequency heat seal laminated structure to 70-90 ℃ to obtain the surface transparent compaction material.

The invention also provides a surface transparent compacting material based on the high-frequency glue-free compacting technology, and a third layer is arranged between the transparent layer and the compacting wood layer in a heat seal mode. The third layer comprises photos (including silver salt developing photographic paper, ink-jet printing photographic paper and printing photographic paper), calligraphy and painting works and plane color pages. The step of preparing a surface transparent compaction material comprising a third layer comprises:

s1, a laminated structure pretreatment step: sequentially placing a first thermoplastic resin film, a third layer, a second thermoplastic resin film and a transparent layer corresponding to at least one region of the pretreated wood board to obtain a pretreated laminated structure;

s3, cooling treatment: cooling the high-frequency heat-seal laminated structure at the speed of 5-15 ℃/min by using a water cooling technology until the temperature of the wood board is 70-90 ℃, the water flow rate of the water cooling technology is 0.9-1.5m/s, and cooling the wood board by wind when the surface temperature of the wood board is cooled to 85-90 ℃, wherein the wind speed is 9.2-9.7m/s, and the wind temperature is 55-60 ℃.

The once-compressed wood of the invention can be prepared by the following steps:

a. pretreatment: processing the wood board until the water content is 8-18% and the thickness is not more than 10cm to obtain a pretreated wood board;

b. heating and pressurizing treatment: heating the pretreated wood board to the temperature of 120-140 ℃, treating the wood board to the water content of 4-6%, preserving the heat for 4-6min, and then performing pressurization treatment according to the stress direction and the preset compression ratio;

c. curing treatment: heating the heated and pressurized wood board to the temperature of 180 ℃ and 220 ℃ by high frequency, preserving the heat for 5-8min, and curing to obtain a cured wood board;

d. cooling treatment: cooling the surface of the cured wood board by a water cooling technology at a speed of 5-15 ℃/min until the temperature of the wood board is 70-90 ℃, wherein the water flow rate of the water cooling technology is 0.9-1.5m/s, and when the surface temperature of the wood board is cooled to 85-90 ℃, performing air cooling at a wind speed of 9.2-9.7m/s and a wind temperature of 55-60 ℃;

e. and (3) health preserving treatment: and (3) placing the cooled wood board at normal temperature for 15-20 days to obtain the primary compressed wood.

The method further comprises a heating and compressing treatment between the heating and pressurizing treatment and the curing treatment in the preparation step of the primary compressed wood, and comprises the following specific steps: heating the wood subjected to heating and pressurizing treatment by using high frequency to the temperature of 150-.

The EB film is formed by using an Electron Beam (EB) as a radiation source to induce the rapid transformation of a reactive liquid with the solid content of 100 percent; the reactive liquid comprises an acrylate system film-forming material, and the acrylic resin comprises 1, 6-hexanediol diacrylate (HDDA), dipropylene glycol diacrylate (DPGDA) and tripropylene glycol diacrylate (TPGDA).

The thermoplastic resin film of the invention is a PVB intermediate film with the thickness of 0.5-0.9mm, the viscosity of 15.6-16.4 Pa.s and the elastic modulus of 8-90 multiplied by 10⁶Pa, and the area ratio of the contact surface of the wood board and the PVB intermediate film is 100:1-100: 100.

The thermoplastic resin film is a PVB intermediate film, and the PVB intermediate filmThe thickness of the film is 0.5-0.9mm, the viscosity is 15.6-16.4 Pa.s, and the elastic modulus of the PVB intermediate film is 8-90 multiplied by 10⁶Pa, and the area ratio of the contact surface of the wood board and the PVB intermediate film is 100:1-100: 100.

The transparent layer and the laminated wood layer of the present invention may be partially heat-sealed, and the partially heat-sealed intermediate region and periphery of the transparent layer and the laminated wood layer are heat-sealed with high frequency using different high frequency conditions, wherein:

s2, a high-frequency heat seal step of a laminated structure: applying a pressure intensity of 0.01-0.4 MPa to the pre-treatment laminated structure, using a hot pressing plate as the upper surface temperature and the lower surface temperature of the pre-treatment laminated structure at 70-160 ℃, wherein the temperature difference between the upper surface temperature and the lower surface temperature is less than 40 ℃, using high frequency as the peripheral area of the transparent layer and the laminated wood layer for heat sealing at 110-150 ℃, using high frequency as the middle area of the heat sealing laminated structure for heat sealing at 110-150 ℃, wherein the frequency ratio of the high frequency of the middle area to the high frequency of the peripheral area is 1:0.88-0.94, and preserving heat for 1-10min to obtain the high frequency heat sealing laminated structure.

When the photo is ink-jet printing photographic paper, the invention is prepared according to the following method;

the step of preparing the surface transparent compaction material comprises the following steps:

s2, a high-frequency heat seal step of a laminated structure: applying a pressure intensity of 0.01-0.4 MPa to the pre-treatment laminated structure, using a hot pressing plate as the upper surface temperature and the lower surface temperature of the pre-treatment laminated structure at 70-160 ℃, wherein the temperature difference between the upper surface temperature and the lower surface temperature is less than 40 ℃, heating the heat seal laminated structure to the temperature of the wood board at 127-129 ℃ by using high frequency, and then preserving heat for 1-10min to obtain a high frequency heat seal laminated structure;

The invention also provides a preparation method of the surface transparent compacting material based on the high-frequency non-glue compacting technology, and the preparation method of the surface transparent compacting material comprises the following steps:

The step of preparing the surface transparent compaction material provided by the invention further comprises the following steps:

The surface transparent compacting material based on the high-frequency glue-free compacting technology has the advantages that the surface transparent compacting material based on the high-frequency glue-free compacting technology has the excellent physical properties of the compacted wood and the transparent material, and can be widely applied to the industrial field, the military field and the civil field. The invention also provides various preparation methods of the surface transparent compacting material based on the high-frequency non-glue compacting technology, and the technical problems of water absorption and rebound of the compacted wood and the like caused by the high-frequency technology are well solved. In addition, the method can also press the photos or the painting and calligraphy artworks in the transparent pressing material on the surface, greatly prolongs the storage life, the aesthetic degree and the artistic quality of the photos or the painting and calligraphy artworks, and has no organic residue and water swelling.

Drawings

FIG. 1 is a schematic structural view of the whole heat-seal glass-laminated wood material of example 3;

FIG. 2 is a schematic structural view of a partially heat-sealed glass-pressed wood material of example 3;

FIG. 3 is a schematic structural view of a photo glass densified wood material of example 4;

FIG. 4 is a schematic structural view of a photo EB film pressed wood material of example 4;

FIG. 5 is a side view of the total heat-sealed glass-pressed wood material of example 3;

Detailed Description

In order to explain in detail the surface transparent compacting material based on the high-frequency non-glue compacting technology and the preparation method thereof, the invention provides the embodiment, the comparison example and some test examples, which are all used for explaining how the technical scheme provided by the invention solves the technical problems provided by the invention and which technical effects are generated, and the extension of the technical scheme according with the concept of the invention is within the protection scope of the invention.

EXAMPLE 1 one-time densified Wood production method

Equipment: high frequency compacting machine (including upper and lower pressing plates adopting electric heating, cathode and anode providing high frequency 13-40MHz, hydraulic device providing pressure, water cooling device, air cooling device)

The method comprises the following steps:

b. heat-pressure treatment (softening conditions): heating the pretreated wood board to the temperature of 120-140 ℃, treating the wood board to the water content of 4-6% (after softening), preserving the heat for 4-6min, and then carrying out pressurization treatment according to the stress direction and the preset compression ratio;

c. curing treatment (curing conditions): heating the heated and pressurized wood board to a temperature of 180 ℃ and 220 ℃ (high-temperature curing temperature) by using high frequency, preserving the heat for 5-8min, and curing to obtain a cured wood board;

d. temperature reduction treatment (quenching conditions): cooling the surface of the cured wood board by a water cooling technology at a speed of 5-15 ℃/min until the temperature of the wood board is 70-90 ℃, wherein the water flow rate of the water cooling technology is 0.9-1.5m/s, and when the surface temperature of the wood board is cooled to 85-90 ℃, performing air cooling at a wind speed of 9.2-9.7m/s and a wind temperature of 55-60 ℃;

EXAMPLE 2 one-shot densified Wood production

The method comprises the following steps:

b. heat-pressure treatment (softening conditions): heating the pretreated wood board to a temperature of 80-100 ℃, preserving heat for 4-6min, and then carrying out pressurization treatment according to the stress direction and a preset compression rate;

c. the heating compression treatment comprises the following specific steps: heating the wood subjected to heating and pressurizing treatment by using high frequency to the temperature of 150-;

d. curing treatment (curing conditions): heating the heated and pressurized wood board to the temperature of 180 ℃ and 220 ℃ by high frequency, preserving the heat for 5-8min, and curing to obtain a cured wood board;

e. temperature reduction treatment (quenching conditions): cooling the surface of the cured wood board by a water cooling technology at a speed of 5-15 ℃/min until the temperature of the wood board is 70-90 ℃, wherein the water flow rate of the water cooling technology is 0.9-1.5m/s, and when the surface temperature of the wood board is cooled to 85-90 ℃, performing air cooling at a wind speed of 9.2-9.7m/s and a wind temperature of 55-60 ℃;

f. and (3) health preserving treatment: and (3) placing the cooled wood board at normal temperature for 15-20 days to obtain the primary compressed wood.

Example 3 glass compaction Material

Raw materials: glass 40cm × 80cm × 0.8 cm; poplar 40cm by 80cm by 3.5cm (prepared by the single compaction method of example 1); PVB film 38cm x 78cm x 0.6mm

Equipment: high frequency compacting machine (including upper and lower pressing plates adopting electric heating, cathode and anode providing high frequency 13-40MHz, hydraulic device providing pressure)

The preparation method comprises the following steps:

s1, a laminated structure pretreatment step: sequentially placing a PVB film of 38cm multiplied by 78cm multiplied by 0.6mm and glass of 40cm multiplied by 80cm multiplied by 0.8cm on a poplar wood board of 40cm multiplied by 80cm multiplied by 3.5cm to prepare a pretreatment laminated structure, and placing the pretreatment laminated structure into a high-frequency compacting machine;

s2, a high-frequency heat seal step of a laminated structure: naturally tightening the pre-treatment laminated structure (applying pressure of 0.21 MPa) by using a hot pressing plate (1.5m by 0.8m by 0.1m steel plate), and heating the inner center temperature of the board with the heat-seal laminated structure to 130 ℃ by using high frequency when the temperature of the upper surface and the temperature of the lower surface of the pre-treatment laminated structure are not less than 130 ℃ and the temperature difference between the upper surface and the lower surface is less than 5 ℃, and preserving heat for 3min to obtain the high-frequency heat-seal laminated structure;

As a result: as shown in fig. 1 and 5, the glass press material of example 3 includes a glass layer 1 and a press wood layer 2 which are all thermally bonded together through high frequency. As a modification, the central area of the glass press material portion shown in FIG. 2 is entirely heated together by high frequency waves to form a glass layer 3 and a press wood layer 4. As a modification, the glass may be replaced by an EB film.

EXAMPLE 4 photo glass Press Material

Raw materials: glass 25.4cm × 30.5cm × 0.8 cm; poplar wood 28cm × 33cm × 3.5cm (primary densified wood of example 2); PVB film 24cm × 28cm × 0.6mm (Shanghai Meibang plastics Co., Ltd.); color photograph (ink-jet printing paper) 25.4cm × 30.5cm × 0.3mm

The preparation method comprises the following steps:

s1, a laminated structure pretreatment step: placing a PVB film with the thickness of 24cm multiplied by 28cm multiplied by 0.6mm, a color photo (ink-jet printing photographic paper) with the thickness of 25.4cm multiplied by 30.5cm multiplied by 0.3mm, a PVB film with the thickness of 24cm multiplied by 28cm multiplied by 0.6mm and glass with the thickness of 25.4cm multiplied by 30.5cm multiplied by 0.8cm on a poplar wood board with the thickness of 28cm multiplied by 33cm multiplied by 3.5cm in sequence to prepare a pre-treatment laminated structure, and placing the pre-treatment laminated structure into a high-frequency compacting machine;

s2, a high-frequency heat seal step of a laminated structure: tightening the pre-treatment laminated structure by using a hot pressing plate (applying pressure of 0.19 MPa), heating the inner core temperature of the board with the heat-seal laminated structure to 135 ℃ by using high frequency waves when the temperature of the upper surface and the temperature of the lower surface of the pre-treatment laminated structure are both not less than 135 ℃ and the temperature difference between the upper surface and the lower surface is less than 15 ℃, and preserving heat for 3min to obtain a high-frequency heat-seal laminated structure;

As a result: as shown in fig. 3, the surface transparent press material of example 4 comprises a glass layer 5 and a press wood layer 6 which are heat-sealed together via a high-frequency part at the periphery, and a photograph 7 is heat-sealed between the glass layer 5 and the press wood layer 6 in the middle of the surface transparent press material. As a modification, the photo 7 may be a painting and calligraphy work or a flat printed color page. This example is based on the compaction technique, where wood is first heat sealed, then the photo/painting artwork is placed between two PVB films, and then wood or glass is contacted with the PVB film respectively to perform a second heat seal. As a more preferred embodiment (see other examples for details), EB films are used instead of glass, because the finished cut after the glass is heat sealed will be damaged due to the large difference in physical properties between wood and glass, and thus glass composites are essentially customized. After EB film is used, the cutting can be conveniently carried out. The EB film also replaces paint and has the characteristics of high temperature resistance, wear resistance, transparency and skid resistance.

EXAMPLE 5 photo EB film compacting Material

Raw materials: EB film 25.4 cm. times.30.5 cm. times.0.8 cm (Japanese DNP Fine chemical Co., Ltd.); poplar 25.4cm by 30.5cm by 3.5cm (prepared by the single compaction method of example 2); PVB film 24cm × 28cm × 0.6mm (Shanghai Meibang plastics Co., Ltd.); color photograph (ink-jet printing paper) 25.4cm × 30.5cm × 0.3mm

The preparation method comprises the following steps:

s1, a laminated structure pretreatment step: placing a PVB film with the thickness of 24cm multiplied by 28cm multiplied by 0.6mm and an EB film with the thickness of 25.4cm multiplied by 30.5cm multiplied by 0.8cm on a poplar wood board with the thickness of 25.4cm multiplied by 30.5cm multiplied by 3.5cm in sequence to prepare a pre-treatment laminated structure, and placing the pre-treatment laminated structure into a high-frequency compacting machine;

s2, a high-frequency heat seal step of a laminated structure: naturally tightening the pre-treatment laminated structure by using a hot pressing plate (applying pressure of 0.13 MPa), and heating the inner center temperature of the board with the heat-seal laminated structure to 140 ℃ (heat-seal temperature) by using high frequency when the temperature difference between the upper surface temperature and the lower surface temperature of the pre-treatment laminated structure is less than 140 ℃ and the temperature difference between the upper surface temperature and the lower surface temperature is less than 10 ℃, and preserving heat for 3min to obtain the high-frequency heat-seal laminated structure;

As a result: as shown in fig. 4, the surface transparent press-bonding material of example 5 comprises an EB film layer 8 and a press-bonding wood layer 9 which are heat-bonded together by high frequency, and a photograph 10 is heat-bonded between the EB film layer 8 and the press-bonding wood layer 9 in the middle of the surface transparent press-bonding material.

EXAMPLE 6 Secondary Heat seal EB film sealing Material

Raw materials: EB film 25.4 cm. times.30.5 cm. times.0.8 cm (Japanese DNP Fine chemical Co., Ltd.); the primary compressed wood obtained in example 2 was 25.4cm × 30.5cm × 3.5 cm; PVB film 24cm × 28cm × 0.6 mm; color photograph (ink-jet printing paper) 25.4cm × 30.5cm × 0.3mm

The method comprises the following steps:

s1, a laminated structure pretreatment step: placing a PVB film of 24cm multiplied by 28cm multiplied by 0.6mm and an EB film of 25.4cm multiplied by 30.5cm multiplied by 0.8cm on a board of 25.4cm multiplied by 30.5cm multiplied by 3.5cm of a primary compressed wood in sequence to prepare a pretreatment laminated structure, and placing the pretreatment laminated structure into a high-frequency compacting machine;

s2, a high-frequency heat seal step of a laminated structure: naturally tightening the pre-treatment laminated structure by using a hot pressing plate (applying pressure of 0.13 MPa), raising the temperature after the temperature of an upper pressing plate and a lower pressing plate is preset to be 160 ℃, heating the inner core temperature of the board with the heat-seal laminated structure to 130-140 ℃ by using high frequency when the temperature of the upper surface and the temperature of the lower surface of the pre-treatment laminated structure are both not less than 130 ℃ and the temperature difference between the upper surface and the lower surface is less than 30 ℃, and preserving heat for 3min to obtain the high-frequency heat-seal laminated structure;

As a result: as shown in fig. 4, the surface transparent press-bonding material of example 5 comprises EB film layer 8 and press-bonding wood layer 9 which are heat-bonded together by high frequency, and photograph 10 is heat-bonded between EB film layer 8 and press-bonding wood layer 9.

EXAMPLE 7 one-time Heat-seal EB film sealing Material

Raw materials: EB film 25.4 cm. times.30.5 cm. times.0.8 cm (Japanese DNP Fine chemical Co., Ltd.); 25.4cm × 30.5cm × 3.5cm of poplar; PVB film 24cm × 28cm × 0.6mm (Shanghai Meibang plastics Co., Ltd.); color photograph (ink-jet printing paper) 25.4cm × 30.5cm × 0.3mm

The method comprises the following steps:

s0. pretreatment: processing the wood board until the water content is 8-18% and the thickness is not more than 10cm to obtain a pretreated wood board;

s2, a high-frequency heat seal step of a laminated structure: naturally tightening the pre-treatment laminated structure by using a hot pressing plate (applying pressure of 0.13 MPa), heating the inner core temperature of the board with the heat-seal laminated structure to 130-140 ℃ by using high frequency when the temperature of the upper surface and the temperature of the lower surface of the pre-treatment laminated structure are both not less than 130 ℃ and the temperature difference between the upper surface and the lower surface is less than 35 ℃, and preserving heat for 3min to obtain the high-frequency heat-seal laminated structure;

s3, curing treatment: heating the prepared high-frequency heat-seal laminated structure to the temperature of the wood board of 180 ℃ and 220 ℃ by using high frequency, preserving the heat for 5-8min, and curing to prepare a cured high-frequency heat-seal laminated structure;

s4, cooling treatment: cooling the surface of the cured high-frequency heat-seal laminated structure at the speed of 5-15 ℃/min by using a water cooling technology until the temperature of the wood board is 70-90 ℃, wherein the water flow rate of the water cooling technology is 0.9-1.5m/s, and when the surface temperature of the high-frequency heat-seal laminated structure is cooled to 85-90 ℃, carrying out air cooling at the wind speed of 9.2-9.7m/s and the wind temperature of 55-60 ℃;

s5, health preserving treatment: and (3) after cooling treatment, standing for 15-20 days at normal temperature to obtain the heat-sealing EB film compression material.

As a result: the surface transparent press material of example 7 included a compressed wood and EB film produced simultaneously by high frequency without secondary heat sealing.

EXAMPLE 8 photo EB film compacting Material

Raw materials: EB film 25.4 cm. times.30.5 cm. times.0.8 cm (Japanese DNP Fine chemical Co., Ltd.); poplar 25.4cm × 30.5cm × 0.5cm (primary densified wood of example 2); PVB film 24cm × 28cm × 0.6mm (Shanghai Meibang plastics Co., Ltd.); color photograph (ink-jet printing paper) 25.4cm × 30.5cm × 0.3mm

Equipment: self-made high frequency compacting machine (comprising an upper pressing plate and a lower pressing plate which adopt electric heating, a cathode and an anode which provide high frequency of 13-40MHz, and a hydraulic device which provides pressure)

The preparation method comprises the following steps:

s2, a high-frequency heat seal step of a laminated structure: covering electric insulation cloth on the upper surface or the lower surface of the wood board before heating and pressurizing treatment, naturally tightening the pre-treatment laminated structure by using a hot pressing plate (applying pressure of 0.13 MPa), presetting the temperature of an upper pressing plate and a lower pressing plate to be 160 ℃, then starting heating, heating the inner core temperature of the wood board with the heat-seal laminated structure to 130-140 ℃ (heat-seal temperature) by using high frequency when the temperature of the upper surface and the temperature of the lower surface of the pre-treatment laminated structure are not less than 130 ℃ and the temperature difference between the upper surface and the lower surface is less than 5 ℃, and preserving heat for 3min to obtain the high-frequency heat-seal laminated structure;

As a result: the EB film is used for heat sealing the picture on the compressed wood, can be cut at any time, and has wider application than glass compressed wood, such as making floor.

The present invention will be further described with reference to the following test examples.

Test example 1 effects of different photographic papers, sealing temperatures and PVB films on photographs

Purpose of the experiment: testing the thickness of the PVB film and the heat-sealing temperature which are key influencing factors, and observing the change of the photo image in an important way.

The preparation methods of experimental examples 9, 11, 13, 15, 17, 19, 21, 23, and 25 were substantially the same as example 5 (glass group), and the preparation methods of experimental examples 10, 12, 14, 16, 18, 20, 22, 24, and 26 were substantially the same as example 8 (EB film group), with the differences shown in table 1:

TABLE 1 photographic image influence factor test

And (3) test results: test example 1 shows that the ink-jet printing photographic paper has certain requirements on PVB film and hot-pressing temperature, when the heat-sealing temperature is 127-129 ℃, the glass photo only has slight blurring which can not be noticed by naked eyes, but the EB film has no influence, the two films do not influence the photo preservation completely, the effect of 0.38mm of the PVB film is better than 0.76mm, but the thickness of the PVB film is not a main influence factor. Silver salt developing paper and printing paper have strong adaptability, under the same condition, the influence of glass and EB film on image (photo) is not very different, but EB film has better cutting performance.

Test example 2 VOC emission

The purpose of the test is as follows: after compounding the EB film, the film was placed in a closed environment at 120 ℃ for 24 hours, and the emission of VOC (volatile organic compounds) in the wood was immediately detected by a volatile organic compound gas detector (Ware, USA).

TABLE 2 VOC emissions from EB film composite compaction Material

Group of	Wood material	VOC emissions (% by weight)
			Test example 7	Poplar	Is free of
Test example 8	Poplar	0.03％

And (3) test results: the EB film composite compact material almost has no VOC emission.

Test example 3 high humidity Environment test

The test method comprises the following steps: the test piece was placed in an air atmosphere having a relative humidity of 35%, 90%, or 30% for 10 days, repeatedly wetted and dried, and then placed under a relative humidity of 65%, 90%, or 65% for 150 days, and the hygroscopic expansion value was measured.

Moisture absorption expansion value: the difference before and after expansion corresponds to the percentage of thickness or length before expansion, i.e., the thickness expansion value T (%) and the length expansion value L (%).

TABLE 3 high humidity environmental test

Group of	L (%) (10 days)	T (%) (10 days)	L (%) (150 days)	T (%) (150 days)
					Blank group	0.5	2.3	0.7	2.8
Example 2	0.2	0.4	0.4	0.7
					Example 3	0.11	0.37	0.25	0.56
Example 4	0.12	0.32	0.35	0.59
					Example 5	0.11	0.31	0.19	0.53

The test result shows that: the thickness expansion value T (%) and the length expansion value L (%) of the test examples were smaller than those of the control example (example 2) and the blank example (pretreated uncompressed poplar).

Test example 4 test of influence factors on recovery from immersion

The test method comprises the following steps: referring to the manufacturing methods of example 1 and example 5, the water content after the heat and pressure treatment step (water content after softening%), the high temperature curing temperature (. degree. C.), the quenching conditions, and the heat-sealing temperature (. degree. C.) were used as influencing factors, and the other manufacturing methods were substantially the same as example 5, and 3 levels were designed for each factor. Taking the test piece, drying at 50 ℃ for 20 hours, then drying at 105 ℃ to be oven dry, and measuring the oven dry initial thickness T of the compacted wood₀Then vacuumized and injected with water to obtain the initial thickness W of the wet state₀After boiling in water for 2 hours, the film was taken out of the water and measured for thickness W after boiling_tThe wet thickness recovery (W%) was calculated according to formula I, and the test pieces were dried at 50 ℃ for 20 hours and then dried at 105 ℃ to oven dry T_tThe thickness was measured again and the dry thickness recovery (T%) was calculated according to formula II.

Wet thickness recovery (W%):

W＝(W_t-W₀) /(r × H) × 100% formula I

Wherein W represents the wet thickness recovery (W%), W₀Initial thickness in wet state, W_tThickness after boiling, r represents oneThe compression ratio of the secondary compressed wood (where 1 > r > 0), H, represents the original thickness of the primary compressed wood.

Dry thickness recovery (T%):

T＝(T_t-T₀) /(r. x H). times.100% formula II

Wherein T represents the dry thickness recovery (T%), T₀Initial oven dry thickness, T_tAbsolute dry thickness after boiling, r represents the compression ratio of the once-compressed wood (wherein 1 > r > 0), and H represents the original thickness of the once-compressed wood.

TABLE 4 influence factor List for the respective test examples

Group of	Water content after softening	High temperature curing (. degree. C.)	Quenching conditions	Sealing temperature (. degree. C.)
					EXAMPLE 1	2-3％	180	Reducing temperature to 70 deg.C for 10min	125
EXAMPLE 2	2-3％	200	Reducing the temperature to 90 ℃ after 10min	130
					EXAMPLE 3	2-3％	220	Reducing temperature to 100 deg.C for 10min	135
EXAMPLE 4	4-6％	180	Reducing the temperature to 90 ℃ after 10min	135
					EXAMPLE 5	4-6％	200	Reducing temperature to 100 deg.C for 10min	125
EXAMPLE 6	4-6％	220	Reducing temperature to 70 deg.C for 10min	130
					EXAMPLE 7	10-12％	180	Reducing temperature to 100 deg.C for 10min	130
EXAMPLE 8	10-12％	200	Reducing temperature to 70 deg.C for 10min	135
					EXAMPLE 9	10-12％	220	Reducing the temperature to 90 ℃ after 10min	125

TABLE 5 test results of the respective test examples

Group of	Wet thickness recovery (W%)	Dry thickness recovery (T%)
			EXAMPLE 1	2.01	0.77
EXAMPLE 2	2.13	1.22
			EXAMPLE 3	2.25	0.61
EXAMPLE 4	2.31	0.81
			EXAMPLE 5	2.92	1.12
EXAMPLE 6	2.11	0.75
			EXAMPLE 7	4.11	2.37
EXAMPLE 8	4.32	2.62
			EXAMPLE 9	4.15	2.51

The test result shows that: 1. the percentage of water content after softening, the high-temperature curing temperature (DEG C), the quenching conditions, and the heat-sealing temperature (DEG C) are related to the recovery rate. 2. The glass in the glass composite compaction material has excellent dimensional stability, and the dimensional stability of the compaction wood has great influence on the composite material. 3. The effect of the water content after high-frequency softening on the recovery rate is more remarkable. 4. The quenching condition is related to the cooling rate, the 180 ℃ rapid reduction to 70 ℃ or the 200 ℃ rapid reduction to 90 ℃ is better, the lower the temperature is, the better the temperature is, and subsequent tests show that the soaking recovery rate effect of the 200 ℃ rapid reduction to 70 ℃ is not good. 5. Because the compacted wood comprises elastic deformation, viscoelastic deformation and plastic deformation, if the compacted wood is heated and compressed under the condition of dehydration, the compacted wood is more favorable for fixing and preventing rebound. However, the composite material of the present invention maintains a low rebound value even after absorption of water. 6. The EB films also have substantially the same regularity as glass in the methods of example 1 and example 9.

Test example 6 hygroscopic expansion value of Wood Material

Different woods are selected, examples 47 to 32 are prepared according to examples 3, 4, 5, 6 and 7 in sequence, a test piece is soaked in normal temperature water for 2 hours, and the water absorption thickness expansion value t (%), the water absorption length expansion value l (%) and the water immersion recovery rate P (%) of the compacted wood part are measured, and the details are shown in a table 6:

moisture absorption expansion value: the difference before and after expansion corresponds to the percentage of thickness or length before expansion, i.e. the thickness expansion value t (%) and the length expansion value l (%).

TABLE 6 recovery from water immersion of different materials

Group of	Wood material	t(％)	l(％)
				Example 27	Pinus radiata 280 x 220 x 52(mm)	0.13	0.47
Example 28	Chinaberry 390X 33(mm)	0.11	0.32
				Example 29	Birch 950 x 180 x 60	0.11	0.31
Example 30	Safflower pear 440 x 340 x 137(mm)	0.14	0.34
				Example 31	Korean cedar 954X 100X 47(mm)	0.12	0.32
Example 32	Beech 400 x 80(mm)	0.15	0.33

And (3) test results: the water absorption thickness swelling value t (%) and the water absorption length swelling value l (%) were different depending on the wood material, but the water absorption recovery rate P (%) was better controlled in each example. In the prior art, for example, the suppression of the rebound of particle boards generally requires an increase in the amount of glue, which, however, entails a severe organic residue. The process of the present invention provides a method of suppressing rebound that does not exhibit a level of PVB film dependency.

Test example 7 recovery rate of upper and lower platen temperatures and dry thickness

The purpose is as follows: test examples 10 to 14 were obtained by adjusting the temperature difference between the upper platen temperature and the lower platen temperature according to the methods of examples 3 to 7, respectively, and the influence on the dry thickness recovery (T%) was measured by the method of test example 4, as shown in Table 7.

TABLE 7 temperature of upper and lower platens and recovery from immersion

Group of	Temperature difference (. degree.C.)	Upper platen temperature (. degree. C.)	Lower platen temperature (. degree. C.)	Dry thickness recovery (T%)
					EXAMPLE 10	5	135	140	0.75
Example 11	15	113	128	0.59
					EXAMPLE 12	10	135	145	0.61
Example 13	30	105	135	0.71
					EXAMPLE 14	35	105	140	0.65

And (3) test results: under the condition that the temperature difference between the temperature of the upper pressing plate and the temperature of the lower pressing plate is not more than 40 ℃, the recovery rate is not greatly influenced, and the high-frequency equipment can start working without waiting for the temperature of the upper pressing plate when in use, so that the process time is greatly saved, and the production cost is reduced.

The above-mentioned embodiments are merely illustrative of the preferred embodiments of the present invention, and do not limit the scope of the present invention, and various modifications and improvements of the technical solution of the present invention by those skilled in the art should fall within the protection scope defined by the claims of the present invention without departing from the spirit of the present invention.

Claims

1. A surface transparent compacting material based on high-frequency glueless compaction technology, characterized in that at least one area of the surface transparent compacting material comprises a transparent layer and a compacted wood layer that are thermally sealed together through high-frequency all or part of the , the transparent layer includes glass, EB film, and the glass includes tempered glass, semi-tempered glass, and ordinary glass;

The steps of preparing the surface transparent compacting material include:

S1. Laminated structure pretreatment step: place the first thermoplastic resin film and the transparent layer in sequence on at least one area of the wooden board to obtain a pretreated laminated structure;

S2. The high-frequency heat sealing step of the laminated structure: applying a pressure of 0.01-0.4 MPa to the pretreated laminated structure, and using a hot pressing plate to apply a temperature of 70-160°C on the upper surface and the lower surface of the pretreated laminated structure to obtain a heat-sealed laminated structure. The temperature difference between the upper surface and the lower surface is less than 40°C, and the heat-bonded laminated structure is heated to a board temperature of 110-150° C. by using a high-frequency wave, and then kept for 1-10 minutes to obtain a high-frequency wave heat-bonded laminated structure;

S3. cooling treatment step: cooling the high-frequency heat-bonded laminated structure to 70-90° C. to prepare the surface transparent compressing material;

The thermoplastic resin film is a PVB intermediate film, and the thickness of the PVB intermediate film is 0.5-0.9 mm;

Described wood board is primary compressed wood, and preparation described primary compressed wood comprises the steps:

a. Pretreatment: Treat the wood board to a moisture content of 8%-18% and a thickness of not more than 10cm to obtain a pretreated wood board;

b. Heat and pressure treatment: heat the pretreated wood board to a temperature of 120-140°C, process the wood board to a moisture content of 4%-6%, keep the temperature for 4-6 minutes, and then compress according to the preset direction according to the force direction. rate of pressure treatment;

c. Curing treatment: heat the wood board that has been heated and pressurized to a temperature of 180-220° C. with a high frequency, keep the temperature for 5-8 minutes, and carry out curing treatment to obtain a solidified wood board;

d. Cooling treatment: Cool the surface of the solidified wood board at a speed of 5-15℃/min with water cooling technology, and cool it to a temperature of 70-90℃. The water flow rate of the water cooling technology is 0.9-1.5m/s. The surface temperature of the board is cooled to 85-90°C, and the wind is cooled, the wind speed is 9.2-9.7m/s, and the temperature of the wind is 55-60°C;

e. Health treatment: the wood board after cooling treatment is placed at room temperature for 15-20 days to obtain the primary compressed wood.

2. The material according to claim 1, wherein a third layer is heat-sealed between the transparent layer and the compacted wood layer, and the third layer includes photographs, calligraphy and painting works, and flat color pages ;

The steps of preparing the surface transparent compacting material include:

In the S1. pretreatment step of the laminated structure: the first thermoplastic resin film, the third layer, the second thermoplastic resin film and the transparent layer are placed in sequence corresponding to at least one area of the pretreated wood board to obtain a pretreated laminated structure;

S2. The high-frequency heat sealing step of the laminated structure: apply a pressure of 0.01-0.4 MPa to the pre-treated laminated structure, and use a hot-pressing plate to pretreat the laminated structure for the upper surface temperature and the lower surface temperature of 70-160 ℃, the upper surface temperature and all When the temperature difference between the lower surfaces is less than 40°C, the heat-bonded laminate structure is heated to a board temperature of 110-150°C by using a high-frequency wave, and then kept for 1-10 minutes to obtain a high-frequency wave heat-bonded laminate structure;

In the step of S3. cooling treatment: the high-frequency thermally laminated laminated structure is cooled at a speed of 5-15°C/min by water cooling technology, and the temperature of the board is 70-90°C, and the water flow rate of the water cooling technology is 0.9-1.5m /s, when the surface temperature of the board is cooled to 85-90°C, air cooling is performed, the wind speed is 9.2-9.7m/s, and the air temperature is 55-60°C.

3. The material according to claim 1, characterized in that, between the heating and pressure treatment and the curing treatment, a temperature rise and compression treatment is also included, and the specific method is: the wood subjected to the heating and pressure treatment is heated to the wood temperature with high frequency waves The temperature is 150-155℃, the heat preservation is 5-10min, the frequency of the high frequency is 15-17MHz, the heating rate is 15-20℃/min, and then the wood temperature is cooled to 100-110℃ with water, and the cooling rate is 3-5℃/min , and then perform a second compression.

4. The material of claim 2, wherein

The transparent layer is an EB film, and the EB film is formed by rapidly transforming a reactive liquid with a solid content of 100% induced by electron beam (EB) as a radiation source;

The viscosity is 15.6-16.4 Pa·s, the elastic modulus of the PVB interlayer film is 8-90×10 ⁶ Pa, and the area ratio of the contact surface of the wood board and the PVB interlayer film is 100:1-100:100.

5. The material of claim 2, wherein the transparent layer and the compacted wood layer are partially heat-sealed, and the partial heat-sealing is an intermediate region and a middle area of the transparent layer and the compacted wood layer. The surrounding high frequency is used for heat sealing with different high frequency conditions, among which:

S2. The high-frequency heat sealing step of the laminated structure: apply a pressure of 0.01-0.4 MPa to the pre-treated laminated structure, and use a hot-pressing plate to pretreat the laminated structure for the upper surface temperature and the lower surface temperature of 70-160 ℃, the upper surface temperature and all The temperature difference of the lower surface is less than 40°C, and the peripheral area of the transparent layer and the compacted wood layer is heat-sealed at 110-150°C by high-frequency waves, and the middle area of the heat-sealed laminated structure is heated at 110-150°C by high-frequency waves. Under the condition of ℃, the frequency ratio of the high-frequency wave in the middle area and the frequency of the high-frequency wave in the surrounding area is 1:0.88-0.94, and the heat preservation is performed for 1-10 minutes to obtain a high-frequency heat-bonded laminated structure.

6. The material of claim 2, wherein the photograph is an inkjet printing photographic paper;

The steps of preparing the surface transparent compacting material include:

S2. Laminated structure high-frequency heat sealing step: apply a pressure of 0.01 to 0.4 MPa to the pretreated laminated structure, and use a hot pressing plate to pretreat the upper surface temperature and the lower surface temperature of the laminated structure at 70-160°C. When the temperature difference between the lower surfaces is less than 40°C, the heat-bonded laminated structure is heated to a board temperature of 127-129°C by using a high-frequency wave, and then kept for 1-10 minutes to obtain a high-frequency heat-bonded laminated structure;

7. a method for making a surface transparent compacting material based on high-frequency glueless compaction technology, characterized in that,

The steps of preparing the surface transparent compacting material include:

S3. Cooling treatment step: cooling the high-frequency heat-bonded laminated structure to 70-90° C. to prepare the surface transparent compressing material.

8. The method according to claim 7, wherein the step of preparing the surface transparent compacting material comprises: