CN109837050A - A kind of low temperature curing type conductive adhesive and preparation method thereof - Google Patents
A kind of low temperature curing type conductive adhesive and preparation method thereof Download PDFInfo
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- CN109837050A CN109837050A CN201910195988.4A CN201910195988A CN109837050A CN 109837050 A CN109837050 A CN 109837050A CN 201910195988 A CN201910195988 A CN 201910195988A CN 109837050 A CN109837050 A CN 109837050A
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- epoxy resin
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- 239000000853 adhesive Substances 0.000 title claims abstract 14
- 230000001070 adhesive effect Effects 0.000 title claims abstract 14
- 238000013035 low temperature curing Methods 0.000 title claims abstract 3
- 238000002360 preparation method Methods 0.000 title claims abstract 3
- 239000003822 epoxy resin Substances 0.000 claims abstract 6
- 229910052751 metal Inorganic materials 0.000 claims abstract 6
- 239000002184 metal Substances 0.000 claims abstract 6
- 238000012856 packing Methods 0.000 claims abstract 6
- 229920000647 polyepoxide Polymers 0.000 claims abstract 6
- 238000001723 curing Methods 0.000 claims abstract 5
- 239000003795 chemical substances by application Substances 0.000 claims abstract 4
- 239000007822 coupling agent Substances 0.000 claims abstract 4
- 239000003085 diluting agent Substances 0.000 claims abstract 4
- 150000004668 long chain fatty acids Chemical class 0.000 claims abstract 3
- 239000002994 raw material Substances 0.000 claims abstract 3
- 239000003381 stabilizer Substances 0.000 claims abstract 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract 2
- 239000000203 mixture Substances 0.000 claims 6
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims 4
- 238000003756 stirring Methods 0.000 claims 4
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims 3
- 239000004593 Epoxy Substances 0.000 claims 2
- 239000002253 acid Substances 0.000 claims 2
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 claims 2
- YSUQLAYJZDEMOT-UHFFFAOYSA-N 2-(butoxymethyl)oxirane Chemical compound CCCCOCC1CO1 YSUQLAYJZDEMOT-UHFFFAOYSA-N 0.000 claims 1
- QNYBOILAKBSWFG-UHFFFAOYSA-N 2-(phenylmethoxymethyl)oxirane Chemical compound C1OC1COCC1=CC=CC=C1 QNYBOILAKBSWFG-UHFFFAOYSA-N 0.000 claims 1
- WTYYGFLRBWMFRY-UHFFFAOYSA-N 2-[6-(oxiran-2-ylmethoxy)hexoxymethyl]oxirane Chemical class C1OC1COCCCCCCOCC1CO1 WTYYGFLRBWMFRY-UHFFFAOYSA-N 0.000 claims 1
- KUAUJXBLDYVELT-UHFFFAOYSA-N 2-[[2,2-dimethyl-3-(oxiran-2-ylmethoxy)propoxy]methyl]oxirane Chemical compound C1OC1COCC(C)(C)COCC1CO1 KUAUJXBLDYVELT-UHFFFAOYSA-N 0.000 claims 1
- RTZZCYNQPHTPPL-UHFFFAOYSA-N 3-nitrophenol Chemical compound OC1=CC=CC([N+]([O-])=O)=C1 RTZZCYNQPHTPPL-UHFFFAOYSA-N 0.000 claims 1
- BTJIUGUIPKRLHP-UHFFFAOYSA-N 4-nitrophenol Chemical compound OC1=CC=C([N+]([O-])=O)C=C1 BTJIUGUIPKRLHP-UHFFFAOYSA-N 0.000 claims 1
- 229930185605 Bisphenol Natural products 0.000 claims 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims 1
- 239000004952 Polyamide Substances 0.000 claims 1
- MCEBKLYUUDGVMD-UHFFFAOYSA-N [SiH3]S(=O)=O Chemical compound [SiH3]S(=O)=O MCEBKLYUUDGVMD-UHFFFAOYSA-N 0.000 claims 1
- 150000001412 amines Chemical class 0.000 claims 1
- 229910052796 boron Inorganic materials 0.000 claims 1
- CDQSJQSWAWPGKG-UHFFFAOYSA-N butane-1,1-diol Chemical compound CCCC(O)O CDQSJQSWAWPGKG-UHFFFAOYSA-N 0.000 claims 1
- 229910052799 carbon Inorganic materials 0.000 claims 1
- 125000004432 carbon atom Chemical group C* 0.000 claims 1
- 235000009508 confectionery Nutrition 0.000 claims 1
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 claims 1
- 239000006185 dispersion Substances 0.000 claims 1
- 150000002148 esters Chemical class 0.000 claims 1
- 238000000227 grinding Methods 0.000 claims 1
- 229940042795 hydrazides for tuberculosis treatment Drugs 0.000 claims 1
- 150000004678 hydrides Chemical class 0.000 claims 1
- 150000002460 imidazoles Chemical class 0.000 claims 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
- 239000004843 novolac epoxy resin Substances 0.000 claims 1
- 229920002647 polyamide Polymers 0.000 claims 1
- 229920001296 polysiloxane Polymers 0.000 claims 1
- FZHAPNGMFPVSLP-UHFFFAOYSA-N silanamine Chemical compound [SiH3]N FZHAPNGMFPVSLP-UHFFFAOYSA-N 0.000 claims 1
- -1 tert-butyl-phenyl Chemical group 0.000 claims 1
- LGQXXHMEBUOXRP-UHFFFAOYSA-N tributyl borate Chemical compound CCCCOB(OCCCC)OCCCC LGQXXHMEBUOXRP-UHFFFAOYSA-N 0.000 claims 1
- WRECIMRULFAWHA-UHFFFAOYSA-N trimethyl borate Chemical group COB(OC)OC WRECIMRULFAWHA-UHFFFAOYSA-N 0.000 claims 1
- UKRDPEFKFJNXQM-UHFFFAOYSA-N vinylsilane Chemical class [SiH3]C=C UKRDPEFKFJNXQM-UHFFFAOYSA-N 0.000 claims 1
- 238000007711 solidification Methods 0.000 abstract 1
- 230000008023 solidification Effects 0.000 abstract 1
- 230000009974 thixotropic effect Effects 0.000 abstract 1
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- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention discloses a kind of low temperature curing type conductive adhesives and preparation method thereof, the adhesive is made of the raw material of following mass fraction: 100-300 parts of epoxy resin, 50-200 portions of reactive diluents, 50-100 parts of curing agent, 10-50 parts of stabilizers, 5-20 parts of coupling agents, 400-900 parts of metal packings, wherein, the metal packing is by after spherical silver powder hybrid long chain fatty acid, it is ground to 4-10um partial size using three-roll grinder, then dries and is made under the conditions of 50 DEG C of -70 DEG C of temperature.Adhesive solidification temperature of the invention was low, curing time is short, while having preferable electric conductivity, thixotropic property and electromagnetic shielding performance, and the storage time under its room temperature is long, up to 72 hours or more.
Description
Technical field
The present invention relates to adhesive technology fields, and in particular to a kind of low temperature curing type conductive adhesive and its preparation side
Method.
Background technique
With the development of hyundai electronics information technology, electronic product is constantly to miniaturization, portability and multifunction
Direction is developed, and then proposes increasingly higher demands to packaging technology.Efficiently, inexpensive assembling solution is for each
It is all urgent demand for electronic product manufacturing enterprise.It is increasingly played as adhesive product essential in assembling process
Increasingly important role, adhesive can not only carry component and connection line during assembling product, while can also
To provide the functional applications such as conductive, thermally conductive and electromagnetic shielding.
Mobile communication technology is just undergoing the spanning development of 4G to 5G, the smart phone in 5G epoch due to transmission rate, frequency,
Signal strength etc. is obviously improved, from core chips to radio-frequency devices, slave stature matter to internal structure, 5G smart phone components
New change will be welcome, hardware innovation upgrading is to the electromagnetic shielding of smart phone and thermally conductive puts forward new requirements.Because of equipment
It constantly minimizes and lightening, the existing electromagnetic shielding adhesive tape in market has been unable to satisfy use on some special constructions, therefore
Electromagnetic shielding adhesive of the exploitation for the assembling of 5G communication apparatus is extremely urgent.
Summary of the invention
The purpose of the present invention is overcome the deficiencies of the prior art and provide a kind of low temperature curing type conductive adhesive, the gluing
Agent realizes low-temperature setting, and solidification temperature is lower than 100 DEG C, and at normal temperature with the Storage period of overlength, and glues with excellent
Connecing property and electromagnetic shielding performance.
In order to achieve the above objectives, the technical solution adopted by the present invention is that: a kind of low temperature curing type conductive adhesive, by following
The raw material of mass fraction forms:
Wherein, the metal packing is by being ground to 4- using three-roll grinder after spherical silver powder hybrid long chain fatty acid
10um partial size is then dried under the conditions of 50 DEG C of -70 DEG C of temperature and is made.
Preferably, the metal packing accounts for the 65%-85% of total mass of raw material.
Preferably, the long chain fatty acids are the fatty acid of carbon atom number 12 to 15.
Preferably, the epoxy resin be selected from bisphenol A epoxide resin, bisphenol f type epoxy resin, novolac epoxy resin,
One of benzenediol epoxy resin or a variety of mixtures.
Preferably, the reactive diluent is selected from Isosorbide-5-Nitrae butanediol glycidol ether, 1,6 hexanediol diglycidyl ethers, benzyl
Base glycidol ether, butyl glycidyl ether, C12-14Alkyl glycidyl ether, neopentylglycol diglycidyl ether, to tert-butyl
One of phenyl glycidyl ether or a variety of mixtures.
Preferably, the curing agent is selected from polyetheramine, the composition comprising polyetheramine, polyamide and its addition product, fat
One of amine and its addition product, imidazoles, dicyanodiamine, hydrazides or a variety of mixtures.
Preferably, the stabilizer is selected from trimethylborate, triethyl borate, butyl borate, p-nitrophenol, nitre
One of base phenol or a variety of mixtures.
Preferably, the coupling agent is selected from one of vinyl silanes, amino silane, epoxy radicals silicone hydride, hydrosulphonyl silane
Or a variety of mixture.
Another object of the present invention is to provide the preparation method of above-mentioned adhesive, is included the following steps:
1) epoxy resin, reactive diluent, curing agent, coupling agent are mixed according to mass parts ratio, and is ground using three rollers
Grinding machine carries out grinding distribution, and in process of lapping, temperature is controlled between 10-25 DEG C, is uniformly mixed it；
2) metal packing is mixed with the mixture that step 1) obtains, is added to the stirring of vacuum double-planet and carries out high speed
Dispersion stirring, for stirring rate in 1000r/min ± 50r/min, vacuum degree is less than 0.2MPa, and temperature controls the stirring at 10-25 DEG C
Required adhesive sufficiently can be obtained.
Due to the application of the above technical scheme, compared with the prior art, the invention has the following advantages: gluing of the invention
Agent, by using by metal packing obtained after spherical silver powder hybrid long chain fatty acid, so that obtained adhesive is having
While there are low temperature curing properties, there is preferable electric conductivity, which makes by carrying out rationally control to each component content
It mutually promotes between each component, cooperate jointly, and during preparing the adhesive, temperature is controlled between 10-25 DEG C always,
Enable adhesive obtained under the conditions of 70-75 DEG C of temperature, solidification is completed in 1 hour, while also there is preferable room temperature
Storge quality, can after 72 hours still have preferable viscosity, resistivity is low, electromagnetic shielding performance is good.
Detailed description of the invention
Attached drawing 1 is the electron microscopic picture of the cured rear section of adhesive obtained in embodiment 6；
Attached drawing 2 is the enlarged drawing of section top half in attached drawing 1；
Attached drawing 3 is the enlarged drawing that attached drawing 1 interrupts Middle face；
Attached drawing 4 is the enlarged drawing of section lower half portion in attached drawing 1.
Specific embodiment
Technical solution of the present invention is further elaborated combined with specific embodiments below.
Embodiment 1
A kind of low temperature curing type conductive adhesive is provided in this example, is made of the raw material of following mass fraction: bisphenol-A ring
120 parts of oxygen resin, 80 parts of 1,6 hexylene glycol glycidol ether, 50 parts of polyetheramine, 12 parts of triethyl borate, 6 parts of epoxy radicals silicone hydride,
725 parts of metal packing.
Embodiment 2
A kind of low temperature curing type conductive adhesive is provided in this example, is made of the raw material of following mass fraction: Bisphenol F ring
80 parts of oxygen resin, 80 parts of novolac epoxy resin, 80 parts of 1,6 hexylene glycol glycidol ether, polyamide and its 50 parts of addition product, boric acid
12 parts of triethyl, 6 parts of epoxy radicals silicone hydride, 720 parts of metal packing.
Embodiment 3
A kind of low temperature curing type conductive adhesive is provided in this example, is made of the raw material of following mass fraction: Bisphenol F ring
80 parts of oxygen resin, 50 parts of novolac epoxy resin, 60 parts of 1,4 butanediol glycidol ether, 20 parts of polyetheramine, the group comprising polyetheramine
Close 20 parts of object, 20 parts of imidazoles, 16 parts of triethyl borate, 10 parts of vinyl silanes, 550 parts of metal packing.
Embodiment 4
A kind of low temperature curing type conductive adhesive is provided in this example, is made of the raw material of following mass fraction: phenolic aldehyde ring
200 parts of oxygen resin, 30 parts of benzyl glycidyl ether, C12-1430 parts of alkyl glycidyl ether, fatty amine and its 30 parts of addition product, two
30 parts of cyanogen diamines, 15 parts of p-nitrophenol, 5 parts of epoxy radicals silicone hydride, 2 parts of hydrosulphonyl silane, 450 parts of metal packing.
Embodiment 5
A kind of low temperature curing type conductive adhesive is provided in this example, is made of the raw material of following mass fraction: isophthalic two
200 parts of phenol epoxy resin, to 30 parts of 60 parts of tert-butyl-phenyl glycidol ether, fatty amine and its addition product, 30 parts of hydrazides, to nitre
15 parts of base phenol, 5 parts of epoxy radicals silicone hydride, 2 parts of hydrosulphonyl silane, 450 parts of metal packing.
Embodiment 6
A kind of low temperature curing type conductive adhesive is provided in this example, is made of the raw material of following mass fraction: Bisphenol F ring
300 parts of oxygen resin, 180 parts of 1,4 butanediol glycidol ether, 10 parts of dicyanodiamine, 20 parts of hydrazides, 10 parts of trimethylborate, second
10 parts of alkenyl silanes, 900 parts of metal packing.
After metal packing in above-described embodiment 1 to 6 has been all made of commercially available spherical silver powder hybrid long chain fatty acid, use
Three-roll grinder is ground to 4-10um partial size, and dries and be made under the conditions of 50 DEG C of -70 DEG C of temperature.The long chain fatty acids are mainly adopted
With the fatty acid of carbon atom number 12 to 15, through the above method, treated that metal packing can make adhesive with low-temperature solid
Preferable electric conductivity is kept while changing performance.
Here, a kind of preparation method of adhesive is additionally provided, the formula in embodiment 1 to 6 is used to be prepared, is had
Production procedure is as follows:
1) epoxy resin, reactive diluent, curing agent, coupling agent are mixed according to mass parts ratio, and is ground using three rollers
Grinding machine carries out grinding distribution, and in process of lapping, temperature is controlled between 10-25 DEG C, is uniformly mixed it；
2) metal packing is mixed with the mixture that step 1) obtains, is added to the stirring of vacuum double-planet and carries out high speed
Dispersion stirring, for stirring rate in 1000r/min ± 50r/min, vacuum degree is less than 0.2MPa, and temperature controls the stirring at 10-25 DEG C
Required adhesive sufficiently can be obtained.
It is tested for the property, surveys to using adhesive obtained by the formula in above-mentioned preparation method in conjunction with the embodiments 1 to 6
Test result is shown in Table 1.
Testing standard:
(2) resistivity: four probe instruments
(1) viscosity test: HBTV2TCP cone and plate viscometer is flown using rich strangle, 25 DEG C of tests
(3) it is electromagnetically shielded: Agilent E5071C (100M-8.5G Hz)
Table 1
It will be seen that the adhesive being prepared according to the method described above using the formula of embodiment 1 to 6 from table 1,
Solidification, while modest viscosity under normal temperature conditions, and glue obtained can be completed in 1 hour under the conditions of 70-75 DEG C of temperature
The resistivity of glutinous agent is low, and thixotropic property and electromagnetic shielding performance are good, and Storage period is long under room temperature, up to 72 hours or more, especially
It is using the formula in embodiment 6, properties are optimal.
Here, after we are to the cured processing of adhesive obtained in embodiment 6, its section is observed, specifically
See attached drawing 1,2,3,4, therefrom it will be seen that silver powder is evenly distributed in the adhesive, pore-free and tomography.
As a result, it will be seen that adhesive of the invention, is used by addition by spherical silver powder hybrid long chain fat
Metal packing obtained after acid, so that obtained adhesive while with low temperature curing properties, has preferable conduction
Property, loading should control the 65%-85% in total mass of raw material, and the adhesive is by rationally controlling each component content
Make to mutually promote between each component, cooperate jointly, and during preparing the adhesive, temperature is controlled always at 10-25 DEG C
Between, the reaction speed and initiation temperature of epoxy resin and curing agent are effectively controlled, temperature of the adhesive at 70-75 DEG C obtained is enable
Under the conditions of degree, solidification is completed in 1 hour, while also there is preferable normal temperature storage performance, can still have after 72 hours preferable
Viscosity, adhesive electromagnetic shielding performance of the invention and thixotropic property are good.
The above embodiments merely illustrate the technical concept and features of the present invention, and its object is to allow person skilled in the art
Scholar cans understand the content of the present invention and implement it accordingly, and it is not intended to limit the scope of the present invention.It is all according to the present invention
Equivalent change or modification made by Spirit Essence, should be covered by the protection scope of the present invention.
Claims (9)
1. a kind of low temperature curing type conductive adhesive, which is characterized in that be made of the raw material of following mass fraction:
100-300 parts of epoxy resin
50-200 parts of reactive diluent
50-100 parts of curing agent
10-50 parts of stabilizer
5-20 parts of coupling agent
400-900 parts of metal packing
Wherein, the metal packing is by being ground to 4-10um using three-roll grinder after spherical silver powder hybrid long chain fatty acid
Partial size is then dried under the conditions of 50 DEG C of -70 DEG C of temperature and is made.
2. adhesive according to claim 1, which is characterized in that the metal packing accounts for the 65%-85% of total mass of raw material.
3. adhesive according to claim 1, which is characterized in that the long chain fatty acids are the rouge of carbon atom number 12 to 15
Fat acid.
4. adhesive according to claim 1, which is characterized in that the epoxy resin is selected from bisphenol A epoxide resin, bis-phenol
One of F type epoxy resin, novolac epoxy resin, resorcinol type epoxy or a variety of mixtures.
5. adhesive according to claim 1, which is characterized in that it is sweet that the reactive diluent is selected from the shrink of Isosorbide-5-Nitrae butanediol
Oily ether, 1,6 hexanediol diglycidyl ethers, benzyl glycidyl ether, butyl glycidyl ether, C12-14Alkyl glycidyl ether,
Neopentylglycol diglycidyl ether, to one of tert-butyl-phenyl glycidol ether or a variety of mixtures.
6. adhesive according to claim 1, which is characterized in that the curing agent is selected from polyetheramine, includes polyetheramine
One of composition, polyamide and its addition product, fatty amine and its addition product, imidazoles, dicyanodiamine, hydrazides are a variety of mixed
Close object.
7. adhesive according to claim 1, which is characterized in that the stabilizer is selected from trimethylborate, boron triethylenetetraminehexaacetic acid
One of ester, butyl borate, p-nitrophenol, metanitrophenol or a variety of mixtures.
8. adhesive according to claim 1, which is characterized in that the coupling agent be selected from vinyl silanes, amino silane,
One of epoxy radicals silicone hydride, hydrosulphonyl silane or a variety of mixtures.
9. a kind of preparation method of the adhesive as described in any in claim 1 to 8, which comprises the steps of:
1) epoxy resin, reactive diluent, curing agent, coupling agent are mixed according to mass parts ratio, and uses three-roll grinder
Grinding distribution is carried out, in process of lapping, temperature is controlled between 10-25 DEG C, is uniformly mixed it；
2) metal packing is mixed with the mixture that step 1) obtains, is added to the stirring of vacuum double-planet and carries out high speed dispersion
Stirring, for stirring rate in ± 50 r/min of 1000r/min, vacuum degree is less than 0.2MPa, and temperature is controlled at 10-25 DEG C, and stirring is filled
Dividing can be obtained required adhesive.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910195988.4A CN109837050A (en) | 2019-03-15 | 2019-03-15 | A kind of low temperature curing type conductive adhesive and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910195988.4A CN109837050A (en) | 2019-03-15 | 2019-03-15 | A kind of low temperature curing type conductive adhesive and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
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| CN109837050A true CN109837050A (en) | 2019-06-04 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
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| CN201910195988.4A Pending CN109837050A (en) | 2019-03-15 | 2019-03-15 | A kind of low temperature curing type conductive adhesive and preparation method thereof |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112852366A (en) * | 2021-02-25 | 2021-05-28 | 东莞依美聚合产品有限公司 | Adhesive with shielding function and preparation method thereof |
| CN113150731A (en) * | 2021-05-31 | 2021-07-23 | 深圳先进电子材料国际创新研究院 | Liquid epoxy resin composition with self-shielding effect and preparation method thereof |
| CN114507497A (en) * | 2022-01-21 | 2022-05-17 | 烟台信友新材料有限公司 | Electromagnetic shielding and heat conducting bifunctional adhesive for electronic packaging and preparation method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104140780A (en) * | 2013-05-06 | 2014-11-12 | 奇美实业股份有限公司 | Conductive adhesive |
| CN104968746A (en) * | 2012-12-27 | 2015-10-07 | 学校法人关西大学 | Thermally Conductive Conductive Adhesive Composition |
| CN108102578A (en) * | 2017-12-21 | 2018-06-01 | 上海市合成树脂研究所有限公司 | A kind of preparation method of conducting resinl |
-
2019
- 2019-03-15 CN CN201910195988.4A patent/CN109837050A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104968746A (en) * | 2012-12-27 | 2015-10-07 | 学校法人关西大学 | Thermally Conductive Conductive Adhesive Composition |
| CN104140780A (en) * | 2013-05-06 | 2014-11-12 | 奇美实业股份有限公司 | Conductive adhesive |
| CN108102578A (en) * | 2017-12-21 | 2018-06-01 | 上海市合成树脂研究所有限公司 | A kind of preparation method of conducting resinl |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112852366A (en) * | 2021-02-25 | 2021-05-28 | 东莞依美聚合产品有限公司 | Adhesive with shielding function and preparation method thereof |
| CN113150731A (en) * | 2021-05-31 | 2021-07-23 | 深圳先进电子材料国际创新研究院 | Liquid epoxy resin composition with self-shielding effect and preparation method thereof |
| CN114507497A (en) * | 2022-01-21 | 2022-05-17 | 烟台信友新材料有限公司 | Electromagnetic shielding and heat conducting bifunctional adhesive for electronic packaging and preparation method thereof |
| CN114507497B (en) * | 2022-01-21 | 2023-09-05 | 烟台信友新材料有限公司 | Electronic packaging adhesive with electromagnetic shielding and heat conduction functions and preparation method thereof |
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