CN109803490A - A kind of double-faced flexible wiring board and preparation method thereof of conductive silver paste connection upper and lower level - Google Patents
A kind of double-faced flexible wiring board and preparation method thereof of conductive silver paste connection upper and lower level Download PDFInfo
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- CN109803490A CN109803490A CN201910188327.9A CN201910188327A CN109803490A CN 109803490 A CN109803490 A CN 109803490A CN 201910188327 A CN201910188327 A CN 201910188327A CN 109803490 A CN109803490 A CN 109803490A
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Abstract
A kind of double-faced flexible wiring board and preparation method thereof of conductive silver paste connection upper and lower level provided by the invention, shown wiring board includes insulation material layer, insulation material layer two sides are respectively the first metal layer and second metal layer, route is etched in the first metal layer and second metal layer, the first blind hole is offered on the first metal layer and insulation material layer, conductive silver slurry layer is filled in first blind hole, conductive silver slurry layer both ends are overlapped in the route on the first metal layer and second metal layer respectively.The present invention is on the metal layer of insulation material layer two sides after circuit etching, one layer of peelable glue is pressed on the metal layer, it carries out printing conductive silver paste in laser drilling and hole again, it can get the Double-layer flexible circuit board that conductive silver paste connects upper lower metal layer after baking, compared with metallizing and the Double-layer flexible of upper and lower level is connected in plating copper wiring, the Double-layer flexible circuit board of conductive silver paste conducting upper and lower level reduces the chemicals and dry film material of many pollution environment in the production process, and process shortens.
Description
Technical field:
The present invention relates to flexible circuit board technical fields, and in particular to a kind of double-faced flexible of conductive silver paste connection upper and lower level
Wiring board and preparation method thereof.
Background technique:
In recent years under the growth driving of smart phone etc., FPC remains every year to be increased at high speed, promotes national warp
The development of Ji and create more job opportunities.But a large amount of chemicals has been used during the entire manufacturing of FPC,
The sewage of discharge causes larger pollution to environment, and country reinforces the sewage discharge intensity of review of FPC industry in recent years, much
FPC enterprise is suspended business to bring up to standard, and how to be reduced the sewage discharge of FPC industry and is realized that the sustainable development of FPC industry becomes correlation
The problem of practitioner must face.
The double-deck FPC plate currently on the market first uses laser drilling, then carries out the hole metallizations systems such as electroless copper and shadow
The conducting of Cheng Shixian hole wall non-conductor polyimide base material, finally in metalization layer plating (graphic plating or parcel plating)
The layers of copper of 12 microns realizes the conducting connection of upper and lower substrate copper.Hole metallization processing procedure uses a large amount of chemicals, sewage row
It is larger to put environmental pollution；It needs to carry out ground of the dry film pressing exposure development so as to dry film covering without plating before parcel plating copper
Side, subsequent parcel plating copper realize the conducting connection of upper and lower substrate layers of copper.Realize that substrate copper is etched dry again after being connected up and down
Membrane pressure closes exposure and imaging etching striping and obtains the wiring board for having the Double-layer flexible of line pattern.But it is existing to be connected using electro-coppering
Process is more in the fabrication process for the Double-layer flexible plate of upper and lower substrate copper, and has pollution using a large amount of chemicals and to environment
Dry film material
In this case, more need to propose a kind of double-faced flexible line of more applicable conductive silver paste connection upper and lower level
Road plate and preparation method thereof, to meet actual use demand.
Summary of the invention:
The object of the present invention is to provide chemicals and dry film that one kind reduces many pollution environment in the production process
The double-faced flexible wiring board and preparation method thereof of the conductive silver paste connection upper and lower level of material.
To achieve the above object, the invention adopts the following technical scheme:
The double-faced flexible wiring board of a kind of conductive silver paste connection upper and lower level provided by the invention, comprising: insulation material layer, institute
Stating insulation material layer two sides is respectively the first metal layer and second metal layer, is etched in the first metal layer and second metal layer
There is route, the first blind hole is offered on the first metal layer and insulation material layer, is filled with conductive silver in first blind hole
Pulp layer, the conductive silver slurry layer both ends are overlapped in the route in the first metal layer and second metal layer respectively.
The material of the insulation material layer is polyimides, and the metal layer material is copper.
The conductive silver slurry layer is T-shaped structure, and the web portion of the T-shaped structure is inserted in the first metal layer and insulation
In material layer, the lower end surface of the web portion is overlapped in one end end face of the second metal layer close to the insulation material layer,
The edge of a wing portion of the T-shaped structure is overlapped in one end end face of the first metal layer far from the insulation material layer.
A kind of preparation method of the double-faced flexible wiring board of above-mentioned conductive silver paste connection upper and lower level, includes the following steps:
Step 1: pressing one layer of etching dry film respectively on the metal layer of substrate two sides, and the substrate is MULTILAYER COMPOSITE knot
Structure, wherein interbed is insulation material layer, and the two sides of the insulation material layer are respectively the first metal layer and second metal layer；
Step 2: selective exposure is carried out to the etching dry film different location, and to the etching dry film of unexposed position
It is removed；
Step 3: the first metal layer and second metal layer that expose are etched；
Step 4: the etching dry film of exposure position in the step 2 is removed；
Step 5: to the first metal layer and second metal layer one layer of peelable glue of pressing after etching；
Step 6: radium-shine second blind hole on peelable glue, and in radium-shine first blind hole of the same position of the substrate, it is described
The bottom hole of first blind hole is connected on the insulation material layer close to the end face of its downside second metal layer, the hole of first blind hole
Diameter is less than the aperture of second blind hole；
Step 7: printing conductive silver paste in first blind hole and the second blind hole, forms conductive silver slurry layer；
Step 8: removing the peelable glue, and baking removes the organic solvent in the conductive silver slurry layer and melts metal and leads
Charged particle.
In step 2, it is removed by the dry film that developer solution aligns exposure position.
The material of the insulation material layer is polyimides, and the material of the first metal layer and second metal layer is
Copper.
The conductive silver slurry layer is T-shaped structure, and the web portion of the T-shaped structure is inserted in the first metal layer and insulation
In material layer, the lower end surface of the web portion is overlapped in one end end face of the second metal layer close to the insulation material layer,
The edge of a wing portion of the T-shaped structure is overlapped in one end end face of the first metal layer far from the insulation material layer.
Double-faced flexible wiring board of the present invention a kind of conductive silver paste connection upper and lower level and preparation method thereof the utility model has the advantages that this
Invention after circuit etching, presses one layer of peelable glue, then carry out radium-shine on the metal layer of insulation material layer two sides on the metal layer
Conductive silver paste is printed in drilling and hole, can get the Double-layer flexible circuit board that conductive silver paste connects upper lower metal layer after baking, with
It metallizes and is compared with the Double-layer flexible of plating copper wiring conducting upper and lower level, the Double-layer flexible circuit board of upper and lower level is connected in conductive silver paste
Reduce the chemicals and dry film material of many pollution environment in the production process, and process shortens.
Detailed description of the invention:
Fig. 1 is the structural schematic diagram for the double-faced flexible wiring board that a kind of conductive silver paste of the invention connects upper and lower level；
Fig. 2 is to be covered with the structural schematic diagram of metal layer in insulation material layer two sides；
Fig. 3 is that structure is etched the structural schematic diagram after dry film pressing exposure development in above-mentioned Fig. 2；
Fig. 4 be above-mentioned Fig. 3 in structure be etched after structural schematic diagram；
Fig. 5 is the structural schematic diagram that structure carries out after striping in above-mentioned Fig. 4；
Fig. 6 is that structure carries out the structural schematic diagram after pressing peelable glue in above-mentioned Fig. 5；
Structural schematic diagram of the Fig. 7 for structure progress blind hole in above-mentioned Fig. 6 after radium-shine；
Fig. 8 is that structure carries out the structural schematic diagram after printing conductive silver paste in above-mentioned Fig. 7；
In figure: 1- insulation material layer, 2- the first metal layer, 3- second metal layer, 4- etch dry film, 5- peelable glue, 6- the
One blind hole, the second blind hole of 7-, 8- conductive silver slurry layer, the edge of a wing 9- portion, 10- web portion.
Specific embodiment:
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiment is only a part of the embodiments of the present invention, instead of all the embodiments.Base
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts it is all its
His embodiment, shall fall within the protection scope of the present invention.
It is to be appreciated that the directional instruction (such as up, down, left, right, before and after ...) of institute is only used in the embodiment of the present invention
In explaining in relative positional relationship, the motion conditions etc. under a certain particular pose (as shown in the picture) between each component, if should
When particular pose changes, then directionality instruction also correspondingly changes correspondingly.
In addition, the description for being related to " first ", " second " etc. in the present invention is used for description purposes only, and should not be understood as referring to
Show or imply its relative importance or implicitly indicates the quantity of indicated technical characteristic." first ", " are defined as a result,
Two " feature can explicitly or implicitly include at least one of the features.In addition, the technical solution between each embodiment can
It to be combined with each other, but must be based on can be realized by those of ordinary skill in the art, when the combination of technical solution occurs
Conflicting or cannot achieve when, will be understood that the combination of this technical solution is not present, also not the present invention claims protection model
Within enclosing.
According to Fig. 1, the double-faced flexible wiring board of a kind of conductive silver paste connection upper and lower level provided by the invention, comprising:
Insulation material layer 1,1 two sides of insulation material layer are respectively the first metal layer 2 and second metal layer 3, the first metal layer 2
With route is etched in second metal layer 3, the first blind hole 6 is offered on the first metal layer 2 and insulation material layer 1, it is described
Conductive silver slurry layer 8 is filled in first blind hole 6,8 both ends of conductive silver slurry layer are overlapped in the first metal layer 2 and the respectively
Route on two metal layers 3, specifically, the material of the insulation material layer 1 is polyimides in one of the embodiments,
The material of the first metal layer 2 and second metal layer 3 is copper.
Further, in the present embodiment, the conductive silver slurry layer 8 is T-shaped structure, the T-shaped structure to insulation material layer
Web portion 10 be inserted in the first metal layer 2 and insulation material layer 1, the lower end surface of the web portion 10 is overlapped in described
Second metal layer 3 is overlapped in first gold medal close to one end end face of the insulation material layer 1, the edge of a wing portion 9 of the T-shaped structure
Belong to one end end face of the layer 2 far from the insulation material layer 1, about 1 the first gold medal of two sides of insulation material layer is realized using conductive silver paste
Belong to layer 2 to connect with the conducting of second metal layer 3, prepare the Double-layer flexible circuit board that conductive silver paste connects upper lower metal layer,
Compared with metallizing and the Double-layer flexible of upper and lower level is connected in plating copper wiring, the Double-layer flexible route of upper and lower level is connected in conductive silver paste
Plate reduces the chemicals and dry film material of many pollution environment in the production process, and process shortens.
A kind of preparation method of the double-faced flexible wiring board of above-mentioned conductive silver paste connection upper and lower level, includes the following steps:
Step 1: one layer of etching dry film 4, institute are pressed respectively on the first metal layer 2 of substrate two sides and second metal layer 3
Stating substrate is multi-layer compound structure, and wherein interbed is insulation material layer 1, and the two sides of the insulation material layer 1 are respectively the first gold medal
Belong to layer 2 and second metal layer 3；
Step 2: selective exposure is carried out to 4 different location of etching dry film, and to the etching dry film of unexposed position
4 are removed；
Step 3: the first metal layer 2 and second metal layer 3 that expose are etched；
Step 4: the etching dry film 4 of exposure position in the step 2 is removed；
Step 5: to the first metal layer 2 and the one layer of peelable glue 5 of pressing of second metal layer 3 after etching；
Step 6: radium-shine second blind hole 7 on peelable glue 5, and in radium-shine first blind hole 6 of the same position of the substrate,
The bottom hole of first blind hole 6 be connected on the insulation material layer 1 close to its downside second metal layer 3 end face, described first
The aperture of blind hole 6 is less than the aperture of second blind hole 7；
Step 7: printing conductive silver paste in first blind hole 6 and the second blind hole 7, forms conductive silver slurry layer 8；
Step 8: removing the peelable glue 5, and baking removes the organic solvent in the conductive silver slurry layer 8 and melts metal
Conducting particles.
Further, in the present embodiment, in step 2, by developer solution align exposure position etching dry film 4 into
Row removal.
Further, in the present embodiment, the material of the insulation material layer 1 is polyimides, the first metal layer 2
Material with second metal layer 3 is copper.
Further, in the present embodiment, the conductive silver slurry layer 8 is T-shaped structure, the web portion 10 of the T-shaped structure
It is inserted in the first metal layer 2 and insulation material layer 1, the lower end surface of the web portion 10 is overlapped in the second metal layer
3 close to one end end face of the insulation material layer 1, and it is separate that the edge of a wing portion 9 of the T-shaped structure is overlapped in the first metal layer 2
One end end face of the insulation material layer 1.
The present invention realizes the conducting of lower metal layer on substrate with conductive silver paste, and the principle is as follows, what flexible circuit board used
1 material of substrate intermediate insulating material layer is insulating materials polyimides, and upper and lower the first metal layer 2 and second metal layer 3 are
The substrate metal copper of 12 microns, as shown in Figure 2.Main manufacturing process includes that etching dry film presses exposure development, erosion
Quarter and striping press peelable glue, and blind hole is radium-shine, print conductive silver paste, peelable glue removal and baking.Wherein the pressing of etching dry film exposes
Photodevelopment is that upper one layer of etching dry film 4 is pressed on the first metal layer 2 of 1 two sides of insulation material layer and second metal layer 3, is passed through
Exposure process realizes the selectivity exposure of etching dry film different location, the developed liquid of etching dry film 4 of unexposed position when development
Removal, and the etching dry film 4 of exposure position is still present in the first metal layer 2 and the of 1 two sides of insulation material layer after development
On two metal layers 3, as shown in Figure 3；Etching is to remove the first metal exposed by the dissolution of copper chloride hydrochloric acid system etching solution
Layer 2 and second metal layer 3, and etch the first metal layer 2 under dry film 4 and second metal layer 3 still has, as shown in Figure 4；It goes
Film is the etching dry film 4 after going film liquid removal etching by organic amine on the first metal layer 2 and second metal layer 3, such as Fig. 5 institute
Show；Pressing peelable glue is that one layer of peelable glue 5 being easily peeled off, the purpose of peelable glue 5 are pressed in flexible circuit board after the etching
It is easy for subsequent part printing conductive silver paste, is printed as shown in fig. 6, being blocked before printing using peelable glue 5 without conductive silver paste
The position of brush；Blind hole is radium-shine be on peelable glue 5 it is radium-shine go out 500 micron pore size of about 100 ∽ the second blind hole 7, same position
Again it is radium-shine fall upper layer the first metal layer 2 and interlayer insulating material layer 1, form 50 ∽, 450 the first blind hole of microns 6, and the
One blind hole, 6 aperture less than the second blind hole 7 aperture, as shown in Figure 7；It is then blind in the first blind hole 6 and second for printing conductive silver paste
Upper conductive silver paste is printed in hole 7, forms conductive silver slurry layer 8, as shown in Figure 8；Peelable glue 5 removal and baking be removing peelable glue 5,
Baking removes the organic solvent in conductive silver slurry layer 8 and melts metal conductive particles.Conduction can be prepared by the above process
The Double-layer flexible circuit board of silver slurry layer 8 connection upper and lower sides the first metal layer 2 and second metal layer 3.
Finally it should be noted that: the above embodiments are merely illustrative of the technical scheme of the present invention and are not intended to be limiting thereof, to the greatest extent
Pipe is described the invention in detail referring to above-described embodiment, it should be understood by those ordinary skilled in the art that: still may be used
With modifications or equivalent substitutions are made to specific embodiments of the invention, and repaired without departing from any of spirit and scope of the invention
Change or equivalent replacement, should all cover in present claims range.
Claims (7)
1. a kind of double-faced flexible wiring board of conductive silver paste connection upper and lower level characterized by comprising insulation material layer, it is described
Insulation material layer two sides are respectively the first metal layer and second metal layer, are etched in the first metal layer and second metal layer
Route offers the first blind hole on the first metal layer and insulation material layer, is filled with conductive silver paste in first blind hole
Layer, the conductive silver slurry layer both ends are overlapped in the route in the first metal layer and second metal layer respectively.
2. a kind of double-faced flexible wiring board of conductive silver paste connection upper and lower level according to claim 1, it is characterised in that: institute
The material for stating insulation material layer is polyimides, and the metal layer material is copper.
3. a kind of double-faced flexible wiring board of conductive silver paste connection upper and lower level according to claim 1, it is characterised in that: institute
Stating conductive silver slurry layer is T-shaped structure, and the web portion of the T-shaped structure is inserted in the first metal layer and insulation material layer,
The lower end surface of the web portion is overlapped in one end end face of the second metal layer close to the insulation material layer, the T shape knot
The edge of a wing portion of structure is overlapped in one end end face of the first metal layer far from the insulation material layer.
4. a kind of preparation method of the double-faced flexible wiring board of conductive silver paste connection upper and lower level according to claim 1,
It is characterized in that, includes the following steps:
Step 1: pressing one layer of etching dry film respectively on the metal layer of substrate two sides, and the substrate is multi-layer compound structure,
Middle layer is insulation material layer, and the two sides of the insulation material layer are respectively the first metal layer and second metal layer；
Step 2: selective exposure is carried out to the etching dry film different location, and the etching dry film of unexposed position is carried out
Removal；
Step 3: the first metal layer and second metal layer that expose are etched；
Step 4: the etching dry film of exposure position in the step 2 is removed；
Step 5: to the first metal layer and second metal layer one layer of peelable glue of pressing after etching；
Step 6: radium-shine second blind hole on peelable glue, and in radium-shine first blind hole of the same position of the substrate, described first
The bottom hole of blind hole is connected on the insulation material layer close to the end face of its downside second metal layer, and the aperture of first blind hole is small
In the aperture of second blind hole；
Step 7: printing conductive silver paste in first blind hole and the second blind hole, forms conductive silver slurry layer；
Step 8: removing the peelable glue, and baking removes the organic solvent in the conductive silver slurry layer and melts metal conductive particle
Son.
5. the preparation method according to claim 4, it is characterised in that: in step 2, align exposure position by developer solution
The dry film set is removed.
6. the preparation method according to claim 4, it is characterised in that: the material of the insulation material layer is polyimides,
The material of the first metal layer and second metal layer is copper.
7. the preparation method according to claim 4, it is characterised in that: the conductive silver slurry layer is T-shaped structure, the T shape
The web portion of structure is inserted in the first metal layer and insulation material layer, and the lower end surface of the web portion is overlapped in described
Two metal layers are overlapped in the first metal layer close to one end end face of the insulation material layer, the edge of a wing portion of the T-shaped structure
One end end face far from the insulation material layer.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910188327.9A CN109803490A (en) | 2019-03-13 | 2019-03-13 | A kind of double-faced flexible wiring board and preparation method thereof of conductive silver paste connection upper and lower level |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910188327.9A CN109803490A (en) | 2019-03-13 | 2019-03-13 | A kind of double-faced flexible wiring board and preparation method thereof of conductive silver paste connection upper and lower level |
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| Publication Number | Publication Date |
|---|---|
| CN109803490A true CN109803490A (en) | 2019-05-24 |
Family
ID=66563298
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910188327.9A Pending CN109803490A (en) | 2019-03-13 | 2019-03-13 | A kind of double-faced flexible wiring board and preparation method thereof of conductive silver paste connection upper and lower level |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110544595A (en) * | 2019-09-07 | 2019-12-06 | 厦门铭彩电子科技有限公司 | Antistatic membrane switch and manufacturing method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04199782A (en) * | 1990-11-29 | 1992-07-20 | Sharp Corp | Forming method for through hole of flexible board |
| CN101530014A (en) * | 2006-10-19 | 2009-09-09 | 住友电气工业株式会社 | Multilayer printed wiring board and method for manufacturing the same |
| CN106063393A (en) * | 2015-02-16 | 2016-10-26 | 日本梅克特隆株式会社 | Method for producing flexible printed wiring board |
| CN210042390U (en) * | 2019-03-13 | 2020-02-07 | 盐城维信电子有限公司 | Double-sided flexible circuit board of upper and lower layers of conductive silver paste |
-
2019
- 2019-03-13 CN CN201910188327.9A patent/CN109803490A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04199782A (en) * | 1990-11-29 | 1992-07-20 | Sharp Corp | Forming method for through hole of flexible board |
| CN101530014A (en) * | 2006-10-19 | 2009-09-09 | 住友电气工业株式会社 | Multilayer printed wiring board and method for manufacturing the same |
| CN106063393A (en) * | 2015-02-16 | 2016-10-26 | 日本梅克特隆株式会社 | Method for producing flexible printed wiring board |
| CN210042390U (en) * | 2019-03-13 | 2020-02-07 | 盐城维信电子有限公司 | Double-sided flexible circuit board of upper and lower layers of conductive silver paste |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110544595A (en) * | 2019-09-07 | 2019-12-06 | 厦门铭彩电子科技有限公司 | Antistatic membrane switch and manufacturing method thereof |
| CN110544595B (en) * | 2019-09-07 | 2024-02-27 | 厦门铭彩电子科技有限公司 | Antistatic membrane switch and manufacturing method thereof |
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