CN109800845A - A kind of implementation method of smart card module and a kind of smart card module - Google Patents
A kind of implementation method of smart card module and a kind of smart card module Download PDFInfo
- Publication number
- CN109800845A CN109800845A CN201910014513.0A CN201910014513A CN109800845A CN 109800845 A CN109800845 A CN 109800845A CN 201910014513 A CN201910014513 A CN 201910014513A CN 109800845 A CN109800845 A CN 109800845A
- Authority
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- China
- Prior art keywords
- smart card
- module
- card module
- pcb board
- double
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 22
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 26
- 229910000831 Steel Inorganic materials 0.000 claims abstract description 22
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 22
- 239000010959 steel Substances 0.000 claims abstract description 22
- 241000218202 Coptis Species 0.000 claims abstract description 18
- 235000002991 Coptis groenlandica Nutrition 0.000 claims abstract description 18
- 238000013461 design Methods 0.000 claims abstract description 15
- 239000000463 material Substances 0.000 claims abstract description 8
- 238000005538 encapsulation Methods 0.000 claims description 3
- 230000009466 transformation Effects 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 238000010586 diagram Methods 0.000 description 10
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 238000004891 communication Methods 0.000 description 1
- 229940126214 compound 3 Drugs 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- -1 is reduced costs Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Credit Cards Or The Like (AREA)
Abstract
The invention discloses a kind of implementation method of smart card module and a kind of smart card modules, method includes: S1, using double-layer circuit board production smart card module, and be attached double-layer circuit board by via hole, double-layer circuit board includes the first pcb board and the second pcb board；S2, multiple modules on the first pcb board are arranged by way of sheet material layout, and reduces the area of single product according to standard；S3, the chip on the first pcb board；S4, the Parallel Design for meeting pcb board between gold thread bonding and bonding aluminum steel is replaced by Al wire bonding, finally carry out chip package.The implementation method and smart card module of smart card module provided by the present invention, electromagnetic compatibility is preferably realized by the doubling plate design of card class product, each module is arranged by special layout mode, improve production capacity, gold thread bonding is substituted by aluminum steel, it reduces costs, caused risk during the bonding of aluminum steel is avoided by the design that via hole connected and crossed hole site.
Description
Technical field
The present invention relates to technical field of intelligent card, and in particular to a kind of implementation method of smart card module and a kind of smart card
Module.
Background technique
With the fast development of communication chip, support that the chip more applied is also more and more, the pin definitions of chip
Changing frequent occurrence, the pin definitions of some chips can carry out routing according to traditional card, the intersection of gold thread will not be generated,
But there is the pin of some chips but to be changed, if beaten also according to the pin definitions of original intelligent card chip
Line connection, the case where sometimes intersecting there is gold thread, although controlling gold thread halved belt by bonding techniques such as banks
Short-circuit risks come, but after all or there is certain risk since carry out can with control bank, that is certainly existed
The increase of encapsulation overhead.
Summary of the invention
In view of the deficiencies in the prior art, the purpose of the present invention is to provide a kind of implementation methods of smart card module
And a kind of smart card module, electromagnetic compatibility may be implemented, improve production capacity, reduce cost.
To achieve the above object, The technical solution adopted by the invention is as follows:
A kind of implementation method of smart card module, comprising the following steps:
S1, smart card module is made using double-layer circuit board, and is attached the double-layer circuit board by via hole, institute
Stating double-layer circuit board includes the first pcb board and the second pcb board；
S2, multiple modules on first pcb board are arranged by way of sheet material layout, and is subtracted according to standard
The area of small single product；
S3, the chip on first pcb board；
S4, the Parallel Design for meeting pcb board between gold thread bonding and bonding aluminum steel is replaced by Al wire bonding, finally carry out
Chip package.
Further, in step S1, the via hole is arranged in institute for a kind of implementation method of smart card module as described above
State the most edge of double-layer circuit board and by being punched into half bore.
Further, in step S1, the via hole is arranged in institute for a kind of implementation method of smart card module as described above
State the middle position of double-layer circuit board.
Further, a kind of implementation method of smart card module as described above, in step S2, the standard is ISO7816
Standard.
Further, a kind of implementation method of smart card module as described above, in step S2, the multiple module includes:
I/O module, clock signal module, reset signal module, supply voltage module, GND module and varying supply voltage module.
The present invention also provides a kind of smart card modules, comprising: double-layer circuit board, i.e. the first pcb board and the second pcb board, institute
It states the first pcb board and is equipped with the multiple modules arranged by way of sheet material layout, pass through via hole between the double-layer circuit board
It is attached, chip is installed on first pcb board, wherein the chip between Al wire bonding and bonding aluminum steel by according with
Close the Parallel Design of pcb board.
Further, the most edge of the double-layer circuit board is arranged in a kind of smart card module as described above, the via hole
And by being punched into half bore, or the middle position of the double-layer circuit board is set.
Further, a kind of smart card module as described above, the multiple module includes: I/O module, clock signal mould
Block, reset signal module, supply voltage module, GND module and varying supply voltage module.
Further, a kind of smart card module as described above, the size of the smart card module meet ISO7816 standard.
Further, a kind of smart card module as described above, the smart card module be SIM card, UIM card, usim card or
PSAM card.
The beneficial effects of the present invention are: a kind of implementation method and a kind of intelligence of smart card module provided by the present invention
Card module preferably realizes electromagnetic compatibility by the doubling plate design of card class product, by special layout mode to each mould
Block is arranged, and production capacity is improved, and is substituted gold thread bonding by aluminum steel, is reduced costs, and hole location is connected and crossed by via hole
Risk caused by the design set avoids during the bonding of aluminum steel.
Detailed description of the invention
Fig. 1 is a kind of flow diagram of the implementation method of the smart card module provided in the embodiment of the present invention；
Fig. 2 is the front elevation of the existing product provided in the embodiment of the present invention；
Fig. 3 is the back view of the existing product provided in the embodiment of the present invention；
Fig. 4 is the structural schematic diagram of the existing product provided in the embodiment of the present invention；
Fig. 5 is the routing connection schematic diagram of the existing product provided in the embodiment of the present invention；
Fig. 6 is the via hole connection schematic diagram of the double-layer circuit board provided in the embodiment of the present invention；
Fig. 7 is the scale diagrams of the ISO7816 standard provided in the embodiment of the present invention；
Fig. 8 is that the contact of the ISO7816 standard provided in the embodiment of the present invention defines table；
Fig. 9 is the structural schematic diagram of the single product provided in the embodiment of the present invention；
Figure 10 is the chip pin distribution map provided in the embodiment of the present invention；
Figure 11 is the bonding effect schematic diagram of the aluminum steel provided in the embodiment of the present invention；
Figure 12 is the smart card module schematic diagram that middle position is arranged in the via hole provided in the embodiment of the present invention；
Figure 13 is the smart card module schematic diagram that edge is arranged in the via hole provided in the embodiment of the present invention.
In attached drawing, 1, chip, 2, gold thread, 3, encapsulating compound, 4, substrate, 5, glue, 6, layer gold, via hole, 8, conducting wire, 9, aluminum steel.
Specific embodiment
The present invention is described in further detail with specific embodiment with reference to the accompanying drawings of the specification.
As shown in Figure 1, a kind of implementation method of smart card module, comprising the following steps:
S1, smart card module is made using double-layer circuit board, and is attached double-layer circuit board by via hole, double-layer electric
Road plate includes the first pcb board and the second pcb board；
The most edge of double-layer circuit board is arranged in via hole and by being punched into half bore.Alternatively, being arranged via hole in bilayer
The middle position of circuit board.
S2, multiple modules on the first pcb board are arranged by way of sheet material layout, and list is reduced according to standard
The area of product；
Standard is ISO7816 standard.
Multiple modules include: I/O module, clock signal module, reset signal module, supply voltage module, GND module,
And varying supply voltage module.
S3, the chip on the first pcb board；
S4, the Parallel Design for meeting pcb board between gold thread bonding and bonding aluminum steel is replaced by Al wire bonding, finally carry out
Chip package.
As shown in figure 4, existing smart card module includes: layer gold 6, layer gold 6 is equipped with substrate 4, by glue 5 by chip 1
It is fixed on substrate 4, chip 1 is encapsulated by 2 bonding of gold thread finally by encapsulating compound 3.Existing product uses traditional item
Chip before encapsulation, is placed on progress routing connection on band as Figure 2-3 by band.When the pin definitions of chip occur
When variation, if also there is the risk of gold thread intersection using above-mentioned routing, as shown in Figure 5.Or because electromagnetic compatibility etc.
Aspect needs cabling to have certain requirement.The present invention carries out cabling via hole by doubling plate, avoids in the presence of the risk intersected.Such as
Shown in Fig. 6, upper and lower two metal layer is realized by via hole 7 and conducting wire 8 and is connected, there is the risks that gold thread intersects solving, i.e.,
Just different variations has occurred in the pin of chip, bonding face by by way of cabling there is intersect risk pin into
Row evacuation is opened.
The present invention can increase the product quantity of unit area using sheet material layout.To the greatest extent may be used by using the mode of layout
Can increase unit area module number, and reduce according to ISO7816 standard the area of single product, single product
Structure is as shown in Figure 9.Fig. 7 is the scale diagrams of ISO7816 standard.Fig. 8 is that the contact of ISO7816 standard defines table.By
Above-mentioned layout mode can increase by about 40% or so product in unit area, improve production capacity, reduce costs.
Al wire bonding is substituted gold thread by the present invention, since the cost of gold thread is far longer than the cost of aluminum steel, and aluminum steel from
Unit cross-sectional area can by electric current meet product demand.So being using aluminum steel is replaced gold thread from products application
Product demand can be met.In order to reduce cost, gold thread is changed into aluminum steel 9, as shown in figure 11, there is short for the line tail of aluminum steel
The risk connect, since the lead pin pitch of all kinds of card chips is smaller, as shown in Figure 10.Lead to short circuit to improve Al wire bonding
Risk is designed to doubling plate to guarantee the consistency of aluminum steel line tail, and makes the Parallel Design for meeting pcb board between bonding aluminum steel,
Thus there is no the risks of short circuit, but the thin plate cost of doubling plate is very high, not only need as far as possible to do via hole it is small,
Via hole filling also to be carried out to reach effect, in this way, the cost of product is with regard to higher.In order to solve the problems, such as cost, if handle
Via hole accomplishes most edge, by being punched into half bore, as shown in figure 13, or via hole is accomplished to intermediate position, as shown in figure 12,
Appearance is neither influenced in this way, and can also reduce the cost of plate.
The embodiment of the present invention also provides a kind of smart card module, comprising: double-layer circuit board, i.e. the first pcb board and the 2nd PCB
Plate, the first pcb board are equipped with the multiple modules arranged by way of sheet material layout, are carried out between double-layer circuit board by via hole
It connects, chip is installed on the first pcb board, wherein chip is by meeting the parallel of pcb board between Al wire bonding and bonding aluminum steel
Design.
Via hole is arranged in the most edge of double-layer circuit board and by being punched into half bore, or the centre of double-layer circuit board is arranged in
Position.
Multiple modules include: I/O module, clock signal module, reset signal module, supply voltage module, GND module,
And varying supply voltage module.
The size of smart card module meets ISO7816 standard.
Smart card module is SIM card, UIM card, usim card or PSAM card.
Technical solution of the present invention bring beneficial effect includes:
1, electromagnetic compatibility is preferably realized by the doubling plate design of card class product.
2, it may be implemented to cause routing bring to intersect wind when the PAD irrational distribution of chip by the design of doubling plate
Danger.
3, replacing gold thread by layout design and aluminum steel reduces cost, and is avoided by the special designing of PCB
Aluminum steel possible risk during bonding, preferably reduces the cost of product.
Obviously, various changes and modifications can be made to the invention without departing from essence of the invention by those skilled in the art
Mind and range.In this way, if these modifications and changes of the present invention belongs to the range of the claims in the present invention and its equivalent technology
Within, then the present invention is also intended to include these modifications and variations.
Claims (10)
1. a kind of implementation method of smart card module characterized by comprising
S1, smart card module is made using double-layer circuit board, and is attached the double-layer circuit board by via hole, it is described double
Layer circuit board includes the first pcb board and the second pcb board；
S2, multiple modules on first pcb board are arranged by way of sheet material layout, and list is reduced according to standard
The area of product；
S3, the chip on first pcb board；
S4, the Parallel Design for meeting pcb board between gold thread bonding and bonding aluminum steel is replaced by Al wire bonding, finally carry out chip
Encapsulation.
2. a kind of implementation method of smart card module according to claim 1, which is characterized in that, will be described in step S1
Via hole is arranged in the most edge of the double-layer circuit board and by being punched into half bore.
3. a kind of implementation method of smart card module according to claim 1, which is characterized in that, will be described in step S1
The middle position of the double-layer circuit board is arranged in via hole.
4. a kind of implementation method of smart card module according to claim 1, which is characterized in that in step S2, the mark
Standard is ISO7816 standard.
5. a kind of implementation method of smart card module according to claim 1, which is characterized in that described more in step S2
A module includes: I/O module, clock signal module, reset signal module, supply voltage module, GND module, and can power transformation
Source voltage module.
6. a kind of smart card module characterized by comprising double-layer circuit board, i.e. the first pcb board and the second pcb board, described
One pcb board is equipped with the multiple modules arranged by way of sheet material layout, is carried out between the double-layer circuit board by via hole
It connects, chip is installed on first pcb board, wherein the chip is by meeting PCB between Al wire bonding and bonding aluminum steel
The Parallel Design of plate.
7. a kind of smart card module according to claim 6, which is characterized in that the via hole is arranged in the odt circuit
The most edge of plate and by being punched into half bore, or the middle position of the double-layer circuit board is set.
8. a kind of smart card module according to claim 6, which is characterized in that the multiple module includes: I/O module,
Clock signal module, reset signal module, supply voltage module, GND module and varying supply voltage module.
9. a kind of smart card module according to claim 6, which is characterized in that the size of the smart card module meets
ISO7816 standard.
10. a kind of smart card module according to claim 6, which is characterized in that the smart card module is SIM card, UIM
Card, usim card or PSAM card.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910014513.0A CN109800845A (en) | 2019-01-07 | 2019-01-07 | A kind of implementation method of smart card module and a kind of smart card module |
| PCT/CN2019/109044 WO2020143254A1 (en) | 2019-01-07 | 2019-09-29 | Implementation method of intelligent card module, and intelligent card module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910014513.0A CN109800845A (en) | 2019-01-07 | 2019-01-07 | A kind of implementation method of smart card module and a kind of smart card module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109800845A true CN109800845A (en) | 2019-05-24 |
Family
ID=66558650
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910014513.0A Pending CN109800845A (en) | 2019-01-07 | 2019-01-07 | A kind of implementation method of smart card module and a kind of smart card module |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN109800845A (en) |
| WO (1) | WO2020143254A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020143254A1 (en) * | 2019-01-07 | 2020-07-16 | 北京握奇智能科技有限公司 | Implementation method of intelligent card module, and intelligent card module |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201828951U (en) * | 2010-10-21 | 2011-05-11 | 上海长丰智能卡有限公司 | Smart card module based on aluminum wire bonding |
| CN102360447A (en) * | 2011-11-01 | 2012-02-22 | 上海祯显电子科技有限公司 | Film substrate |
| CN107027239A (en) * | 2016-02-02 | 2017-08-08 | 上海伯乐电子有限公司 | Flexible circuit board and apply its smart card module and smart card |
| CN209447207U (en) * | 2019-01-07 | 2019-09-27 | 北京握奇智能科技有限公司 | A kind of smart card module |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2002061668A1 (en) * | 2000-12-05 | 2002-08-08 | Arete Associates, A California Corporation | Linear contact sensor apparatus and method for use in imaging features of an object |
| US8915746B2 (en) * | 2013-03-14 | 2014-12-23 | Sierra Wireless | Reverse through-board low profile module connector |
| CN109800845A (en) * | 2019-01-07 | 2019-05-24 | 北京握奇智能科技有限公司 | A kind of implementation method of smart card module and a kind of smart card module |
-
2019
- 2019-01-07 CN CN201910014513.0A patent/CN109800845A/en active Pending
- 2019-09-29 WO PCT/CN2019/109044 patent/WO2020143254A1/en active Application Filing
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201828951U (en) * | 2010-10-21 | 2011-05-11 | 上海长丰智能卡有限公司 | Smart card module based on aluminum wire bonding |
| CN102360447A (en) * | 2011-11-01 | 2012-02-22 | 上海祯显电子科技有限公司 | Film substrate |
| CN107027239A (en) * | 2016-02-02 | 2017-08-08 | 上海伯乐电子有限公司 | Flexible circuit board and apply its smart card module and smart card |
| CN209447207U (en) * | 2019-01-07 | 2019-09-27 | 北京握奇智能科技有限公司 | A kind of smart card module |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020143254A1 (en) * | 2019-01-07 | 2020-07-16 | 北京握奇智能科技有限公司 | Implementation method of intelligent card module, and intelligent card module |
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| Publication number | Publication date |
|---|---|
| WO2020143254A1 (en) | 2020-07-16 |
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