CN109796903B - Anisotropic conductive adhesive structure and production method thereof - Google Patents
Anisotropic conductive adhesive structure and production method thereof Download PDFInfo
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- CN109796903B CN109796903B CN201910176391.5A CN201910176391A CN109796903B CN 109796903 B CN109796903 B CN 109796903B CN 201910176391 A CN201910176391 A CN 201910176391A CN 109796903 B CN109796903 B CN 109796903B
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- conductive
- nail
- anisotropic conductive
- conductive adhesive
- nail head
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/02—Single bars, rods, wires, or strips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Non-Insulated Conductors (AREA)
- Manufacturing Of Electrical Connectors (AREA)
Abstract
The invention relates to an anisotropic conductive adhesive structure and a production method thereof. An anisotropic conductive adhesive structure comprises a plurality of uniformly distributed conductive wires and a bonding layer for fixing the conductive wires; the two ends of the conductive wire penetrate through the bonding layer, and the two ends of the conductive wire are used for conducting. The conductive adhesive replaces conductive beads in the prior art by conductive wires, is simpler in structure and stronger in plasticity, and is higher in resolution in use; simple production process, high production efficiency and low cost.
Description
Technical Field
The invention relates to an electronic connector, in particular to an anisotropic conductive adhesive structure and a production method thereof.
Background
The anisotropic conductive paste is generally used as an electronic connector in electronic products, particularly in connection with display screens and circuits. As shown in fig. 1, the conventional anisotropic conductive adhesive is usually formed by disposing a metal conductive ball with an insulating layer in an adhesive, and when in use, the metal conductive ball needs to be forced to be extruded to break military aid layers on the outer sides of the metal conductive ball, and then the metal conductive ball can be conducted, which is very inconvenient in use. In addition, the existing anisotropic conductive adhesive is very complex in the manufacturing process, has higher cost, for example, the production of the metal conductive balls needs more working procedures, and the diameter of each metal conductive ball is ensured to be the same, otherwise the use effect is influenced during extrusion; and the volume is smaller, wrap up one deck insulating layer in the outside, the technical difficulty is big.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provides an anisotropic conductive adhesive structure and a production method thereof.
In order to achieve the above purpose, the present invention adopts the following technical scheme:
An anisotropic conductive adhesive structure comprises a plurality of uniformly distributed conductive wires and a bonding layer for fixing the conductive wires; the two ends of the conductive wire penetrate through the bonding layer, and the two ends of the conductive wire are used for conducting.
The further technical scheme is as follows: the conductive wire comprises a conductor and an insulating layer wrapping the outer side of the conductor; the insulating layer is fixedly connected with the bonding layer.
The further technical scheme is as follows: the conductive wires are arranged on the bonding layer in an outward extending mode to form a block-shaped structure or a sheet-shaped structure.
The further technical scheme is as follows: the conductive wires are arranged in parallel.
The further technical scheme is as follows: the thickness of the block structure is 0.01-015mm.
The further technical scheme is as follows: the conductor is conductive metal and has a diameter of 0.005-0.01mm.
The further technical scheme is as follows: and the two ends of the conductive wire are provided with nail head parts for increasing the contact area.
The further technical scheme is as follows: a connecting layer is arranged on the outer side of the insulating layer; concave parts or convex parts are uniformly distributed on the outer side of the connecting layer.
The production method of the anisotropic conductive adhesive comprises the following steps:
step one, drawing a conductive metal strip into a metal wire with a set diameter;
Step two, wrapping an insulating layer on the outer side of the metal wire;
Step four, uniformly distributing the insulating layers in the mould according to a set arrangement sequence, and pouring bonding glue; then vibrating, pressurizing and heating the die to ensure that the bonding glue is solidified, and forming a block-shaped structure by the conductive wires and the bonding glue;
And fifthly, taking out the block structure, and transversely cutting the block structure according to the set thickness to obtain the sheet-shaped or block-shaped anisotropic conductive adhesive structure.
The further technical scheme is as follows: and step five, the transverse cutting is cold cutting and laser cutting.
The further technical scheme is as follows: and step six, forming nail heads at two ends of the anisotropic conductive adhesive structure in a sheet or block shape through electroplating, electroforming or sputtering.
An anisotropic conductive adhesive structure convenient to connect comprises a conductive adhesive body; the conductive adhesive body is uniformly distributed with conductive wires, and two ends of the conductive wires extend to two sides of the conductive adhesive body; one end or two ends of the conductive wire are provided with nail head parts which are convenient to connect.
The further technical scheme is as follows: the head of the nail is an arc-shaped bulge.
The further technical scheme is as follows: the nail head is provided with a groove.
The further technical scheme is as follows: the nail head part is provided with a deformation part; the deformation part comprises a connection part connected with the nail head part and a crown part arranged at the tail end of the connection part; the crown portion has a cross-sectional area greater than the connecting portion.
The further technical scheme is as follows: a concave hole is formed in the center of the nail head part; the concave holes are stepped holes.
The further technical scheme is as follows: the nail head part comprises a buffer part connected with the conductive wire and a contact part arranged at the tail end of the buffer part; the cross-sectional area of the contact portion is larger than the cross-sectional area of the buffer portion.
The further technical scheme is as follows: the nail head is of a needle-shaped structure.
Compared with the prior art, the invention has the beneficial effects that: the conductive adhesive replaces conductive beads in the prior art by conductive wires, is simpler in structure and stronger in plasticity, and is higher in resolution in use; simple production process, high production efficiency and low cost.
The invention is further described below with reference to the drawings and specific embodiments.
Drawings
FIG. 1 is a schematic diagram of a prior art structure;
FIG. 2 is a top view of an anisotropic conductive adhesive structure according to the present invention;
FIG. 3 is a front view of an anisotropic conductive paste structure according to the present invention;
FIG. 4 is a cross-sectional view of a conductive wire of an anisotropic conductive paste structure according to the present invention;
FIG. 5 is a schematic diagram and partial cross-sectional view of a connecting layer of an anisotropic conductive adhesive structure according to the present invention;
FIG. 6 is a cut-away view of an anisotropic conductive paste structure according to the present invention;
FIG. 7 is a block diagram of a structure with a nail head of an anisotropic conductive adhesive according to the present invention;
FIG. 8 is a diagram showing a structure of a stud portion with a recess of the anisotropic conductive adhesive structure of the present invention;
FIG. 9 is a diagram showing a structure of a deformed portion of a nail head portion of an anisotropic conductive adhesive structure according to the present invention;
FIG. 10 is a block diagram of a structure of anisotropic conductive adhesive with a recessed hole pin head;
FIG. 11 is a block diagram of a contact pin head structure of an anisotropic conductive paste structure according to the present invention;
Fig. 12 is a pin-shaped structure of the head of an anisotropic conductive adhesive structure according to the present invention.
Detailed Description
In order to more fully understand the technical content of the present invention, the following technical solutions of the present invention will be further described and illustrated with reference to specific embodiments, but are not limited thereto.
Such as the drawings of the embodiment of the present invention in fig. 2 to 12.
An anisotropic conductive adhesive structure 10, as shown in fig. 2 to 3, comprises a plurality of uniformly distributed conductive wires 11 and a bonding layer 12 for fixing the plurality of conductive wires 11. The two ends of the conductive wire 11 penetrate through the bonding layer 12, and the two ends of the conductive wire 11 are used for conduction. The conductive wire 11 is used as a channel for transmitting signals, and is usually used for electrically connecting the display screen and the control circuit. Since the number of the conductive wires 11 can be designed according to the wishes of the designer, the resolution of the display screen can be improved.
As shown in fig. 4, the conductive wire 11 includes a conductive body 111 and an insulating layer 112 wrapped around the conductive body 111. The insulating layer 112 is fixedly coupled to the adhesive layer 12. Each conductor 111 is conductive only at both ends and cannot be conductive with the adjacent conductor 111, so that the insulating layer and the adhesive layer 12 on the outer side can play a role of blocking.
The conductive wires 11 are arranged on the adhesive layer 12 in an outward extending manner to form a block structure or a sheet structure. The conductive wires 11 are vertically disposed in the adhesive layer 12, and may be continuously extended outward centering on one, so that a sheet-like or block-like structure may be formed. The conductive lines 11 in the adhesive layer 12 may all be used as conductive lines.
Preferably, the conductive wires 11 are arranged parallel to each other, are easily cut during production, and can save materials.
Preferably, the thickness of the block structure is 0.01-015mm.
Preferably, the electrical conductor 111 is an electrically conductive metal and has a diameter of 0.005-0.01mm. In general, the conductor 111 is a conductive metal such as gold, silver, or copper.
As shown in fig. 7, the conductive wire 11 is provided with a nail head 13 at both ends thereof for increasing the contact area. The nail head 13 of each conductive wire 11 is not associated with each other, and can increase the contact area and the conduction rate when contacting with the electrical element.
As shown in fig. 5, in order to make the connection between the insulating layer 112 and the adhesive layer 12 stronger, a connection layer 14 is provided outside the insulating layer 112. The concave parts or the convex parts 141 are uniformly distributed on the outer side of the connecting layer 14, and the concave parts or the convex parts 141 are matched with the bonding layer 12, so that the conductive wires 11 are not easy to shift or fall off when being cut into sheets or blocks.
The production method of the anisotropic conductive adhesive comprises the following steps:
step one, drawing the conductive metal strip into a metal wire with a set diameter, and drawing the metal wire into a metal wire with a diameter of 0.005-0.01mm according to the requirement.
And step two, wrapping an insulating layer 112 on the outer side of the metal wire.
Step four, uniformly distributing the insulating layers 112 in the mould according to a set arrangement sequence, and pouring bonding glue; and then vibrating, pressurizing and heating the die to ensure that the bonding glue is solidified, and forming a block structure by the conductive wires 11 and the bonding glue.
And fifthly, taking out the block structure, and transversely cutting the block structure according to the set thickness to obtain the sheet-shaped or block-shaped anisotropic conductive adhesive structure (shown in fig. 6).
And the transverse cutting in the fifth step is cold cutting, laser cutting or hot cutting.
The method further comprises a step six of forming nail heads 13 on two ends of the anisotropic conductive adhesive structure in a sheet or block shape through electroplating, electroforming or sputtering.
Preferably, step two further comprises wrapping the upper connection layer 14 outside the insulating layer 112.
The anisotropic conductive adhesive structure produced by the method has the advantages that the process is greatly simplified, the production efficiency is obviously improved, the processing procedures of the existing conductive adhesive metal balls are reduced, the cost can be greatly reduced, and in addition, the resolution of a display screen can be greatly improved in the conducting process.
The anisotropic conductive adhesive structure with convenient connection, as shown in fig. 7, comprises a conductive adhesive body. The conductive adhesive body is uniformly distributed with conductive wires 11, and two ends of the conductive wires 11 extend to two sides of the conductive adhesive body. One or both ends of the conductive wire 11 are provided with a nail head 13 which is convenient to connect.
The nail head 13 is an arc-shaped bulge, which can be a hemispherical structure, and has enough deformation allowance during connection extrusion.
In other embodiments, as shown in fig. 8, the nail 13 is provided with a groove 131, so as to leave enough space for deformation during extrusion deformation, and avoid contact with the adjacent nail 13, which results in a short circuit phenomenon.
In other embodiments, as shown in fig. 9, the nail head 13 is provided with a deformation portion 132. The deformation portion 132 includes a connection portion 133 coupled to the head portion 13, and a crown portion 134 provided at the end of the connection portion 133. The cross-sectional area of crown 134 is greater than the cross-sectional area of the connecting portion. At the time of press mounting, the deformed portion 132 is first deformed, and the connecting portion 133 is pressed, so that the deformed portion 132 is pressed against the surface of the nail head 13. Preferably, the surface of the nail head 13 is provided with an annular groove 135, and when the deformed portion 132 is pressed against the surface of the nail head 13, the deformed structure of the deformed portion 132 is folded on the annular groove 135.
As shown in fig. 10, the center of the nail head 13 is provided with a concave hole 136, and the concave hole 136 is a stepped hole, so that when contacting with other electronic components, the concave hole can be matched with the protrusions on the other electronic components, and the connection stability is improved.
In other embodiments, as shown in fig. 11, the nail head 13 includes a buffer portion 137 coupled to the conductive wire 11, and a contact portion 138 disposed at the end of the buffer portion 137. The cross-sectional area of the contact portion 138 is larger than that of the buffer portion 137.
The above embodiments can be freely combined and the technical features can be complemented.
In other embodiments, as shown in fig. 12, the pin head 13 is a pin structure 139 that is connected to the holes of other electronic components.
The nail head 13 is arranged on the conductive adhesive body, so that the deformation can be counteracted in a space enough to increase the contact area and improve the conductivity, and the conductive adhesive body is more firmly connected.
In summary, the conductive adhesive replaces the conductive beads in the prior art by the conductive wires, so that the structure is simpler, the plasticity is stronger, and the resolution is higher in use; simple production process, high production efficiency and low cost.
The foregoing examples are provided to further illustrate the technical contents of the present invention for the convenience of the reader, but are not intended to limit the embodiments of the present invention thereto, and any technical extension or re-creation according to the present invention is protected by the present invention. The protection scope of the invention is subject to the claims.
Claims (3)
1. The anisotropic conductive adhesive structure is characterized by comprising a plurality of uniformly distributed conductive wires and a bonding layer for fixing the conductive wires; the two ends of the conductive wire penetrate through the bonding layer, and the two ends of the conductive wire are used for conducting;
The conductive wires are arranged in parallel;
The conductive wires are vertically arranged in the bonding layer;
the two ends of the conductive wires are provided with nail heads for increasing the contact area, the nail heads of each conductive wire are not related to each other, and the nail heads are arc-shaped bulges;
the nail head part is provided with a groove;
Or the nail head is provided with a deformation part, the deformation part comprises a connecting part connected with the nail head, a top crown part arranged at the tail end of the connecting part, the cross section area of the top crown part is larger than that of the connecting part, the surface of the nail head is provided with an annular groove, and when the deformation part is pressed on the surface of the nail head, the deformed structure of the deformation part is folded on the annular groove;
or a concave hole is formed in the center of the head of the nail, and the concave hole is a stepped hole;
or the nail head part comprises a buffer part connected with the conductive wire and a contact part arranged at the tail end of the buffer part, and the cross section area of the contact part is larger than that of the buffer part;
or the nail head is in a needle-shaped structure and is connected with holes of other electronic elements;
The conductive wire comprises a conductor and an insulating layer wrapping the outer side of the conductor; the insulating layer is fixedly connected with the bonding layer;
a connecting layer is arranged on the outer side of the insulating layer; concave parts or convex parts are uniformly distributed on the outer side of the connecting layer;
The concave part or the convex part is matched with the bonding layer;
the conductive wires are arranged on the bonding layer in an outward extending way to form a block structure or a sheet structure;
the production method of the anisotropic conductive adhesive structure comprises the following steps:
step one, drawing a conductive metal strip into a metal wire with a set diameter;
Step two, wrapping an insulating layer on the outer side of the metal wire;
Step four, uniformly distributing the insulating layers in the mould according to a set arrangement sequence, and pouring bonding glue; then vibrating, pressurizing and heating the die to ensure that the bonding glue is solidified, and forming a block-shaped structure by the conductive wires and the bonding glue;
Step five, taking out the block structure, and transversely cutting the block structure according to a set thickness to obtain a flaky or block anisotropic conductive adhesive structure;
And step six, forming nail heads at two ends of the anisotropic conductive adhesive structure in a sheet or block shape through electroplating, electroforming or sputtering.
2. An anisotropic conductive paste structure according to claim 1, wherein the thickness of the block structure is 0.01-015mm.
3. An anisotropic conductive paste structure according to claim 1, wherein the conductive body is a conductive metal and has a diameter of 0.005-0.01mm.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910176391.5A CN109796903B (en) | 2019-03-08 | 2019-03-08 | Anisotropic conductive adhesive structure and production method thereof |
| PCT/CN2019/104684 WO2020181747A1 (en) | 2019-03-08 | 2019-09-06 | Anisotropic conductive adhesive structure and production method therefor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910176391.5A CN109796903B (en) | 2019-03-08 | 2019-03-08 | Anisotropic conductive adhesive structure and production method thereof |
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| Publication Number | Publication Date |
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| CN109796903A CN109796903A (en) | 2019-05-24 |
| CN109796903B true CN109796903B (en) | 2024-06-21 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201910176391.5A Active CN109796903B (en) | 2019-03-08 | 2019-03-08 | Anisotropic conductive adhesive structure and production method thereof |
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| CN (1) | CN109796903B (en) |
| WO (1) | WO2020181747A1 (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109796903B (en) * | 2019-03-08 | 2024-06-21 | 深圳市润沃自动化工程有限公司 | Anisotropic conductive adhesive structure and production method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1233350A (en) * | 1996-08-08 | 1999-10-27 | 日东电工株式会社 | Anisotropic conductive film and method for manufacturing the same |
| CN209778732U (en) * | 2019-03-08 | 2019-12-13 | 深圳市润沃自动化工程有限公司 | anisotropic conductive adhesive structure convenient for connection |
| CN209778731U (en) * | 2019-03-08 | 2019-12-13 | 深圳市润沃自动化工程有限公司 | Anisotropic conductive adhesive structure |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4522604B2 (en) * | 2001-03-19 | 2010-08-11 | 日東電工株式会社 | Anisotropic conductive film |
| ATE419661T1 (en) * | 2003-09-09 | 2009-01-15 | Nitto Denko Corp | ANISOTROPIC CONDUCTING FILM, PROCESS OF PRODUCTION AND USE |
| TWI463615B (en) * | 2004-11-04 | 2014-12-01 | Taiwan Semiconductor Mfg Co Ltd | Nanotube-based directionally-conductive adhesive |
| CN100405506C (en) * | 2004-11-26 | 2008-07-23 | 鸿富锦精密工业（深圳）有限公司 | Conducting material with anisotropy |
| JP2006278014A (en) * | 2005-03-28 | 2006-10-12 | Three M Innovative Properties Co | Anisotropic conductive structure |
| CN104600057B (en) * | 2007-09-12 | 2018-11-02 | 斯莫特克有限公司 | Use nanostructure connection and bonding adjacent layers |
| KR101067353B1 (en) * | 2008-09-05 | 2011-09-23 | 팀켐 컴퍼니 | Anisotropic conductive materials |
| US20100252783A1 (en) * | 2009-04-07 | 2010-10-07 | Syh-Tau Yeh | Ambient-curable anisotropic conductive adhesive |
| TWI462244B (en) * | 2011-10-17 | 2014-11-21 | Ind Tech Res Inst | Anisotropic conductive film and fabrication method thereof |
| JP6039905B2 (en) * | 2012-02-14 | 2016-12-07 | デクセリアルズ株式会社 | Conductive adhesive, solar cell module, and method for manufacturing solar cell module |
| TW201405590A (en) * | 2012-07-25 | 2014-02-01 | Benq Materials Corp | Anisotropic conductive film |
| CN105184287B (en) * | 2015-10-29 | 2019-10-01 | 京东方科技集团股份有限公司 | A kind of electrode structure, fingerprint recognition mould group and preparation method thereof, display device |
| CN109796903B (en) * | 2019-03-08 | 2024-06-21 | 深圳市润沃自动化工程有限公司 | Anisotropic conductive adhesive structure and production method thereof |
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2019
- 2019-03-08 CN CN201910176391.5A patent/CN109796903B/en active Active
- 2019-09-06 WO PCT/CN2019/104684 patent/WO2020181747A1/en active Application Filing
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1233350A (en) * | 1996-08-08 | 1999-10-27 | 日东电工株式会社 | Anisotropic conductive film and method for manufacturing the same |
| CN209778732U (en) * | 2019-03-08 | 2019-12-13 | 深圳市润沃自动化工程有限公司 | anisotropic conductive adhesive structure convenient for connection |
| CN209778731U (en) * | 2019-03-08 | 2019-12-13 | 深圳市润沃自动化工程有限公司 | Anisotropic conductive adhesive structure |
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| Publication number | Publication date |
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| CN109796903A (en) | 2019-05-24 |
| WO2020181747A1 (en) | 2020-09-17 |
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