CN109791377B - Detergent composition for resin mask stripping - Google Patents

Abstract

Disclosed is a detergent composition for resin mask peeling, which has excellent resin mask removability and a low drainage load. The present disclosure relates to a detergent composition for resin mask peeling, which contains an inorganic base (component a), an organic solvent (component B), and water (component C) in a same formula, wherein the hansen solubility parameter of component B has coordinates of 1.5MPa radius centered on δ d =17.5, δ p =5.0, and δ h =11.5 ^0.5 The content of the component C in the detergent composition during use is 85 mass% or more, and the mass ratio (a/B) of the component a to the component B is 1 to 60 inclusive.

Description

Cleaning agent composition for resin mask stripping

Technical Field

The present disclosure relates to a cleaning agent composition for removing a resin mask, and a method for removing a resin mask and a method for producing an electronic component using the cleaning agent composition.

Background Art

In recent years, personal computers and various electronic devices have been developing towards lower power consumption, faster processing speeds, and smaller sizes, and the wiring on their package substrates has become increasingly finer. The formation of such fine wiring and connecting terminals such as pillars and bumps has been mainly done using the metal mask method, but due to its low versatility and difficulty in responding to the miniaturization of wiring, it is gradually being converted to other new methods.

As one of the new methods, it is known that a dry film resist is used as a thick film resin mask instead of a metal mask. The resin mask will eventually be stripped and removed, and an alkaline stripping detergent is used at this time. As such a stripping detergent, for example, Patent Document 1 records a detergent composition for a resin mask layer for manufacturing a circuit substrate, which contains 0.5 mass parts or more and 3.0 mass parts or less of a quaternary ammonium hydroxide, 3.0 mass parts or more and 10.0 mass parts or less of a water-soluble amine, 0.3 mass parts or more and 2.5 mass parts or less of an acid or its ammonium salt, and 50.0 mass parts or more and 95.0 mass parts or less of water in 100 mass parts of the detergent composition.

Patent document 2 describes a composition for removing films and resists, which comprises: about 2 to 55 weight % of at least one alkanolamine, at least one morpholine or a mixture thereof, based on the total weight of the composition; about 20 to 94 weight % of at least one organic solvent; and about 0.5 to 60 weight % of water.

Patent document 3 describes an anti-etching agent stripping solution, which is used to remove residues produced after etching and ashing when manufacturing semiconductor elements such as IC (integrated circuit) or LSI (large-scale integrated circuit) or liquid crystal panel elements, and contains (a) a fluorine compound, (b) a diol compound having an ether bond in the molecule, (c) an organic acid compound, and (d) water.

Patent Document 4 describes a stripping solution which is a so-called resist developer and is used to strip non-photosensitive portions of an epoxy resin-based photo solder resist. The stripping solution is characterized in that an additive of propylene glycol ether is added to an alkaline solution.

Patent document 5 describes a thinner composition for resist removal, which is used to remove the resist of useless film components formed on the edge of the resist film coated on the substrate or on the back side of the substrate to prevent corrosion of the equipment, characterized in that it contains: a) 0.1 to 5 weight % of an inorganic alkaline compound, b) 0.1 to 5 weight % of an organic amine, c) 0.1 to 30 weight % of an organic solvent, d) 0.01 to 5 weight % of a surfactant containing an anionic surfactant and a nonionic surfactant in a weight ratio of 1:5 to 25, and e) 60 to 99 weight % of water.

Prior Art Literature

Patent Literature

Patent Document 1: Japanese Patent Application Publication No. 2015-79244

Patent Document 2: Japanese Patent Application Publication No. 2014-78009

Patent Document 3: Japanese Patent Application Publication No. 2004-157284

Patent Document 4: Japanese Patent Application Laid-Open No. 7-140676

Patent Document 5: Japanese Patent Application No. 2005-509693

Summary of the invention

Problems to be solved by the invention

After forming fine wiring on a printed circuit board, etc., in order to reduce the remaining of the resin mask and the remaining of the auxiliary agent contained in the solder or plating solution used for the formation of fine wiring or bumps, the detergent composition requires higher washing properties. The resin mask is formed by using a resist whose physical properties such as solubility in the developer are changed by light, electron beams, etc. In addition, the resist is roughly divided into negative and positive types according to the reaction method with light and electron beams. The negative resist has the characteristic that the solubility in the developer is reduced if exposed. For the layer containing the negative resist (hereinafter also referred to as "negative resist layer"), after exposure and development, the exposed part is used as a resin mask. The positive resist has the characteristic that the solubility in the developer is increased if exposed. For the layer containing the positive resist (hereinafter also referred to as "positive resist layer"), after exposure and development, the exposed part is removed and the unexposed part is used as a resin mask. By using a resin mask with such characteristics, fine connections of circuit substrates such as metal wiring, metal columns, and solder bumps can be formed. However, the characteristics of the resin mask change due to the plating treatment, heat treatment, etc. used when forming these connections, and it is difficult to remove the resin mask in the washing process of the following process. In particular, since the negative resist has the characteristic of solidifying due to the reaction with light and electron beams, the resin mask formed using the negative resist is solidified beyond the required level due to the plating treatment, heat treatment, etc. used when forming the connection, and cannot be completely removed by the washing process, or the time spent on removal is very long, thereby causing damage to the substrate and the metal surface. In this way, since the resin mask treated with plating and/or heat treatment is difficult to peel off, the detergent composition requires a higher resin mask removability.

On the other hand, in various fields, electronicization is developing continuously, and the production volume of printed circuit boards and the like is increasing. In addition, for the purpose of miniaturization of the machines or devices used, high processing speed, and reduced power consumption, there is a tendency to increase the wiring miniaturization, multi-layering, stripping, and washing processes, and the use amount of detergent compositions is also increasing. With the increase in the use amount of the detergent composition, the drainage treatment load of waste liquids such as detergent compositions or flushing water, and the eutrophication of lakes and marshes caused by the influx of waste liquids are also increased. Therefore, there is a strong demand for a detergent composition with a small drainage treatment load, which does not contain nitrogen and phosphorus that cause eutrophication of lakes and marshes, and can efficiently remove resin masks. However, according to the method described in the above patent document, it is difficult to have both high resin mask removal performance and low drainage treatment load.

Therefore, the present disclosure provides a detergent composition for removing a resin mask that is excellent in resin mask removability and has a small wastewater treatment load, and a method for removing a resin mask and a method for producing a substrate using the detergent composition.

Means for solving problems

The present disclosure relates in one embodiment to a cleaning composition for removing a resin mask, comprising an inorganic base (component A), an organic solvent (component B) and water (component C).

The coordinates of the Hansen solubility parameters of component B are within the range of a sphere with a radius of 1.5 MPa ^0.5 and centered at δd = 17.5, δp = 5.0, and δh = 11.5.

The content of component C in the detergent composition during use is 85% by mass or more,

The mass ratio (A/B) of component A to component B is 1 or more and 60 or less.

The present disclosure, in one aspect, relates to a method for removing a resin mask, comprising: washing an object to be washed with the detergent composition of the present disclosure.

The present disclosure, in one aspect, relates to a method for manufacturing an electronic component, comprising: washing an object to be washed having a resin mask attached thereto, using the detergent composition of the present disclosure.

In one form, the present disclosure relates to the use of the detergent composition of the present disclosure in the manufacture of electronic parts.

Effects of the Invention

According to the present disclosure, a detergent composition for resin mask stripping having excellent resin mask removal performance and low drainage treatment load can be provided. Moreover, by using the detergent composition of the present disclosure, high-quality electronic parts can be obtained with a high yield. In addition, by using the detergent composition of the present disclosure, electronic parts having fine wiring patterns can be efficiently manufactured.

DETAILED DESCRIPTION

The present disclosure is based on the knowledge that resin masks, especially plated and/or heated resin masks, can be efficiently removed even at a relatively low wastewater treatment load by using a detergent composition containing an inorganic base (component A), an organic solvent having a predetermined Hansen solubility parameter (component B), and water (component C), wherein the content of component C and the mass ratio of component A to component B are specified. In addition, the disclosure is based on the knowledge that eutrophication of lakes and marshes can be suppressed by excluding nitrogen-containing compounds and phosphorus-containing compounds from the detergent composition.

That is, the present disclosure, in one form, relates to a detergent composition for stripping a resin mask (hereinafter also referred to as "the detergent composition of the present disclosure"), which contains an inorganic base (component A), an organic solvent (component B) and water (component C), the coordinates of the Hansen solubility parameter of component B are within the range of a sphere with a radius of 1.5 MPa ^0.5 centered at δd=17.5, δp=5.0, δh=11.5, the content of component C during use of the detergent composition is 85% by mass or more, and the mass ratio of component A to component B (A/B) is 1 or more and 60 or less. According to the present disclosure, a detergent composition having excellent resin mask removal properties and a small drainage treatment load can be provided. Therefore, even with a relatively low drainage treatment load, the detergent composition of the present disclosure can efficiently remove resin masks, especially resin masks that have been plated and/or heated. Moreover, by using the detergent composition of the present disclosure, high-quality electronic components can be obtained with a high yield. Furthermore, by using the detergent composition of the present disclosure, electronic components having fine wiring patterns can be efficiently produced.

The detailed mechanism of action of the effect of the detergent composition of the present disclosure is partially unclear, but is presumed as follows.

In general, it is believed that the peeling of the resin mask is caused by the interfacial stress generated by the impregnation of the resin mask with the components of the detergent composition, thereby swelling the resin mask. With regard to the detergent composition disclosed in the present invention, it is presumed that component A (inorganic base) and component C (water) are impregnated into the resin mask, thereby promoting the dissociation of the alkali-soluble resin incorporated into the resin mask, and further promoting the peeling of the resin mask by causing charge repulsion. At this time, it is presumed that component B (organic solvent) having a specified Hansen solubility parameter acts between the substrate surface and the resin mask, thereby reducing the adhesion between the substrate and the resin and further promoting the peeling of the resin mask, and the removability of the resin mask is significantly improved.

In addition, it is estimated that the detergent composition of the present disclosure contains component B having a predetermined Hansen solubility parameter at a predetermined mass ratio (A/B=1 to 60), so that component B has high compatibility with the resin component of the resin mask, exerts an effective peeling effect at the interface between the resin mask and water, and further improves the resin mask removability.

In addition, it is estimated that since the water content of component C when using the detergent composition of the present disclosure is as high as 85% by mass or more, the organic matter content in the detergent composition can be reduced, and the increase in the wastewater treatment load can be suppressed. Therefore, it is believed that a fine circuit (wiring pattern) can be formed on a substrate efficiently and with a high degree of cleanliness.

However, the present disclosure is not limited to this mechanism for interpretation.

In the present disclosure, a resin mask refers to a mask used to protect the surface of a substance from being affected by treatments such as etching, plating, and heating, that is, a mask that functions as a protective film. As a resin mask, in one or more embodiments, it can be listed: a resist layer after an exposure or development process, a resist layer subjected to at least one of exposure and development (hereinafter also referred to as "exposed and/or developed"), or a cured resist layer. As a resin material for forming a resin mask, in one or more embodiments, it can be listed: a film-like photosensitive resin or a resist film. A general-purpose resist film can be used.

[Ingredient A: Inorganic base]

The detergent composition of the present disclosure contains an inorganic base (component A). Component A can be used alone or in combination of two or more.

As component A, for example, one or a combination of two or more selected from sodium hydroxide, potassium hydroxide, lithium hydroxide, calcium hydroxide, sodium carbonate, potassium carbonate, sodium silicate and potassium silicate can be listed. From the viewpoint of improving the removability of the resin mask, one or a combination of two or more selected from sodium hydroxide, potassium hydroxide, sodium carbonate and potassium carbonate is preferred, and at least one of sodium hydroxide and potassium hydroxide is more preferred.

The content of component A when using the detergent composition of the present disclosure is preferably 0.1% by mass or more, more preferably 0.3% by mass or more, further preferably 0.5% by mass or more, further preferably 1% by mass or more, further preferably 2% by mass or more, from the viewpoint of improving the resin mask removability and suppressing metal corrosion, and preferably 15% by mass or less, more preferably 10% by mass or less, further preferably 7% by mass or less, further preferably 5% by mass or less, from the viewpoint of improving the resin mask removability and suppressing metal corrosion. When component A contains two or more inorganic bases, the content of component A refers to the total content thereof.

In the present disclosure, “the content of each component of the detergent composition at the time of use” means the content of each component at the time of washing, that is, at the time when the detergent composition is used for washing.

Ingredient B: Organic solvent

The detergent composition of the present disclosure contains an organic solvent (component B). Component B can be used alone or in combination of two or more.

In the present disclosure, the coordinates of the Hansen solubility parameters of component B are within the range of a sphere with a radius of 1.5 MPa ^0.5 and centered at δd = 17.5, δp = 5.0, and δh = 11.5. In the case where the detergent composition of the present disclosure contains two or more organic solvents (hereinafter also referred to as "mixed organic solvent"), the Hansen solubility parameter of the mixed organic solvent as a whole may not be within the above range, and the effect of the present disclosure can be exerted as long as the mixed organic solvent contains at least one organic solvent having a Hansen solubility parameter within the above range.

Here, the Hansen solubility parameter (hereinafter also referred to as "HSP") is a value for predicting the solubility of a substance published by Charles M. Hansen in 1967, and is a parameter based on the idea that "two substances with similar intermolecular interactions tend to dissolve each other." The HSP consists of the following three parameters (unit: MPa ^0.5 ).

δd: Energy based on the dispersion force between molecules

δp: Energy based on dipole interactions between molecules

δh: Energy based on hydrogen bonds between molecules

The above three parameters can be regarded as coordinates of a three-dimensional space (Hansen space). When the HSPs of two substances are placed in the Hansen space, the closer the distance between the two points is, the easier it is for them to dissolve in each other. There is a detailed description in the March 2010 issue of Chemical Industry (Chemical Industry Company), etc., and the Hansen solubility parameters of various substances can be obtained by using computer software such as "HSPiP: Hansen Solubility Parameters in Practice". The present disclosure uses the Hansen solubility parameters obtained using the computer software "HSPiP: Hansen Solubility Parameters in Practice".

The coordinates of the HSP of component B in the present disclosure can also be expressed as follows. That is, when the coordinates of the HSP of component B are (δd _B , δp _B , δh _B ), the distance (unit: MPa 0.5 ) between the coordinates of the HSP of component B (δd _B , δp _B , δh _B ) and the component coordinate X (δd=17.5, δp=5.0, δh= ^11.5 ) can be expressed as follows.

Distance = [(δd _B －17.5) ² + (δp _B －5.0) ² + (δh _B －11.5) ² ] ^0.5

≤1.5MPa ^0.5

As component B, there is no particular limitation as long as the distance between the coordinate of the HSP of component B and the component coordinate X satisfies the above formula. For example, it can be selected from glycol ethers such as propylene glycol phenyl ether (distance: 0.32 MPa ^0.5 ), ethylene glycol monobenzyl ether (distance: 1.18 MPa ^0.5 ), and ethylene glycol mono-n-hexyl ether (distance: 1.50 MPa ^0.5 ); monoalkyl alcohols such as 1-methylcyclohexanol (distance: 1.19 MPa ^0.5 ), 3-methylcyclohexanol (distance: 1.08 MPa ^0.5 ), and 4-methylcyclohexanol (distance: 0.59 MPa ^0.5 ); aromatic alcohols such as 1-phenyl-1-propanol (distance: 1.39 MPa ^0.5 ), and 2-phenyl-1-propanol (distance: 1.37 MPa ^0.5 ); and the like. From the viewpoint of durability, it is preferably one or more selected from propylene glycol phenyl ether, ethylene glycol monobenzyl ether, ethylene glycol mono-n-hexyl ether, 1-phenyl-1-propanol and 2-phenyl-1-propanol, and more preferably at least one of propylene glycol phenyl ether and ethylene glycol monobenzyl ether. From the viewpoint of storage stability of the concentrate of the detergent composition, it is preferably one or more selected from ethylene glycol monobenzyl ether, ethylene glycol mono-n-hexyl ether, 1-methylcyclohexanol, 2-phenyl-1-propanol and 1-phenyl-1-propanol, and more preferably one or more selected from ethylene glycol monobenzyl ether, 2-phenyl-1-propanol and 1-phenyl-1-propanol. The numerical value in the bracket represents the distance between the coordinate of the HSP of component B and the component coordinate X (unit: MPa ^0.5 ). In the present disclosure, durability means that good washing performance is ensured even if the detergent composition is used for a long time (cycle washing).

From the viewpoint of reducing the risk of fire caused by ignition and durability, the component B in the present disclosure preferably has a high boiling point, for example, the boiling point of the component B is preferably 160° C. or higher, more preferably 250° C. or higher. From the viewpoint of concentrability, the component B in the present disclosure preferably has a high solubility in water, for example, the solubility of the component B in 100 mL of water is preferably 0.3 g or more.

From the viewpoint of improving the resin mask removability, the content of component B when using the detergent composition of the present disclosure is preferably 0.01% by mass or more, more preferably 0.05% by mass or more, and further preferably 0.1% by mass or more, from the viewpoint of durability, further preferably 0.2% by mass or more, and from the viewpoint of reducing the load of wastewater treatment, preferably 3% by mass or less, more preferably 2% by mass or less, further preferably 1% by mass or less, and further preferably 0.5% by mass or less. When component B contains two or more organic solvents, the content of component B refers to the total content thereof.

The mass ratio (A/B) of component A to component B in the detergent composition of the present disclosure is 1 or more and 60 or less, and from the viewpoint of improving the resin mask removability, it is preferably 1.1 or more, more preferably 1.2 or more, further preferably 1.5 or more, further preferably 2 or more, further preferably 3 or more, further preferably 5 or more, further preferably 10 or more, further preferably 15 or more, and from the viewpoint of storage stability and reduction of wastewater treatment load, it is preferably 50 or less, more preferably 40 or less, further preferably 30 or less, further preferably 20 or less.

[Ingredient C: Water]

The detergent composition of the present disclosure contains water (ingredient C). As the water of ingredient C, ion exchange water, RO water (Reverse Osmosis water), distilled water, pure water, and ultrapure water can be used. The content of water can be appropriately set according to the usage of the detergent composition of the present disclosure.

The content of component C when using the detergent composition of the present disclosure is 85% by mass or more, preferably 90% by mass or more, more preferably 95% by mass or more, from the viewpoint of improving the resin mask removability, and, from the same viewpoint, preferably 99% by mass or less, more preferably 98% by mass or less, and further preferably 97% by mass or less.

[Optional Ingredients]

The detergent composition of the present disclosure may contain any component as needed in addition to the above-mentioned components A to C. As the optional component, components that can be used in general detergents can be listed, for example, chelating agents, thickeners, dispersants, rust inhibitors, alkaline substances, surfactants, polymer compounds, solubilizers, antioxidants, preservatives, defoaming agents, antibacterial agents, etc. The total content of the optional components when using the detergent composition of the present disclosure is preferably 0% by mass or more and 2.0% by mass or less, more preferably 0% by mass or more and 1.5% by mass or less, further preferably 0% by mass or more and 1.3% by mass or less, and further preferably 0% by mass or more and 1.0% by mass or less.

From the viewpoint of reducing the wastewater treatment load, the total content of component B and organic matter derived from any component in the detergent composition of the present disclosure is preferably 3% by mass or less, more preferably 2% by mass or less, further preferably 1% by mass or less, and further preferably 0.5% by mass or less, and from the viewpoint of improving the resin mask removability, it is preferably 0.01% by mass or more, more preferably 0.05% by mass or more, and further preferably 0.1% by mass or more.

From the viewpoint of reducing the drainage treatment load and suppressing the eutrophication of the drainage area, it is preferred that the detergent composition of the present disclosure does not substantially contain nitrogen-containing compounds and phosphorus-containing compounds. In the present disclosure, "substantially not containing" means that the total content of nitrogen-containing compounds and phosphorus-containing compounds in the detergent composition of the present disclosure does not reach 0.1% by mass. From the viewpoint of reducing the drainage treatment load and suppressing the eutrophication of the drainage area, the total content of nitrogen-containing compounds and phosphorus-containing compounds in the detergent composition of the present disclosure is preferably 0.05% by mass or less, more preferably 0.01% by mass or less, and further preferably 0% by mass. As nitrogen-containing compounds, nitrogen-containing compounds widely used in the past as detergent compositions can be listed, for example, at least one or a combination of two or more selected from amines and their salts, ammonia, and ammonium salts can be listed. As the above-mentioned amines, for example, amino alcohols such as monoethanolamine and diethanolamine can be listed. As the above-mentioned ammonium salts, for example, quaternary ammonium salts such as tetramethylammonium hydroxide (TMAH) can be listed. Examples of the phosphorus-containing compound include those that have been widely used in detergent compositions in the past, such as inorganic phosphoric acids selected from phosphoric acid and its salts, condensed phosphoric acids such as pyrophosphoric acid, polyphosphoric acid, and metaphosphoric acid and their salts, and organic phosphoric acids and phosphate esters, or a combination of at least one or more thereof.

[Method for producing detergent composition]

The detergent composition of the present disclosure can be manufactured by blending the above-mentioned components A to C and any of the above-mentioned components as needed using a known method. For example, the detergent composition of the present disclosure can be prepared by blending at least the above-mentioned components A to C. Therefore, the present disclosure relates to a method for manufacturing a detergent composition, which includes a step of blending at least the above-mentioned components A to C. In the present disclosure, "blending" includes mixing components A to C and other components as needed simultaneously or in any order. In the method for manufacturing the detergent composition of the present disclosure, the preferred blending amount of each component can be set to be the same as the preferred content of each component of the above-mentioned detergent composition of the present disclosure.

From the viewpoint of improving the resin mask removability, the pH when using the detergent composition of the present disclosure is preferably 10.0 or more, more preferably 10.5 or more, and from the viewpoint of suppressing metal corrosion, it is preferably 14 or less, more preferably 13.9 or less, and further preferably 13.7 or less. The pH is the pH of the detergent composition at 25° C., which can be measured, for example, using a pH meter (Adenpa Kogyo Co., Ltd., HM-30G).

In the present disclosure, pH can be adjusted as needed by appropriately adding the following substances in required amounts: inorganic acids such as nitric acid and sulfuric acid; organic acids such as hydroxycarboxylic acids, polycarboxylic acids, aminopolycarboxylic acids, and amino acids; and alkaline substances other than component A such as their metal salts or ammonium salts, ammonia, and amines.

The detergent composition of the present disclosure can also be prepared as a concentrate in which the amount of water of component C is reduced within a range that does not cause separation or precipitation and impair storage stability. As for the concentrate of the detergent composition, from the viewpoint of transportation and storage, it is preferably prepared as a concentrate with a dilution ratio of 3 times or more, and from the viewpoint of storage stability, it is preferably prepared as a concentrate with a dilution ratio of 10 times or less. The concentrate of the detergent composition can be used by diluting it with water in such a manner that components A to C become the above-mentioned content (i.e., the content during washing). In addition, the concentrate of the detergent composition can also be used by adding each component separately during use. In the present disclosure, "when using" or "when washing" of the concentrated detergent composition refers to the state of the concentrate of the detergent composition after dilution.

When the detergent composition of the present disclosure is a concentrated product, the content of component A in the concentrated product of the detergent composition is preferably 1% by mass or more, more preferably 2% by mass or more, further preferably 5% by mass or more, and further preferably 10% by mass or more, from the viewpoint of improving the resin mask removability, and is preferably 40% by mass or less, more preferably 30% by mass or less, further preferably 20% by mass or less, and further preferably 10% by mass or less, from the viewpoint of suppressing metal corrosion and storage stability.

When the detergent composition of the present disclosure is a concentrated product, the content of component B in the concentrated product of the detergent composition is preferably 0.1% by mass or more, more preferably 0.2% by mass or more, further preferably 0.5% by mass or more, and further preferably 1% by mass or more, from the viewpoint of improving the resin mask removability, and is preferably 10% by mass or less, more preferably 5% by mass or less, further preferably 2% by mass or less, and further preferably 1.5% by mass or less, from the viewpoint of storage stability and reduction of wastewater treatment load.

When the detergent composition of the present disclosure is a concentrated product, the content of component C in the concentrated product of the detergent composition is preferably 50% by mass or more, more preferably 60% by mass or more, and even more preferably 70% by mass or more, from the viewpoint of improving the resin mask removability and stabilizing the detergent composition, and from the same viewpoint, it is preferably 95% by mass or less, more preferably 90% by mass or less, and even more preferably 85% by mass or less.

The pH of the concentrate of the detergent composition of the present disclosure is preferably 10.0 or higher, more preferably 10.5 or higher, from the viewpoint of improving the resin mask removability after dilution, and is preferably 14 or lower from the viewpoint of safety during storage and use.

[Washing]

In one or more embodiments, the detergent composition of the present disclosure can be used to clean an object to be cleaned to which a resin mask is attached. Examples of the object to be cleaned include electronic components and intermediate products thereof. Examples of electronic components include at least one component selected from metal plates such as printed circuit boards, chips, copper plates, and aluminum plates. The intermediate products are intermediate products in the manufacturing process of electronic components, including intermediate products after resin mask treatment. Specific examples of the object to be cleaned to which a resin mask is attached include electronic components, etc., which have been subjected to processes such as soldering, plating (copper plating, aluminum plating, nickel plating, etc.) using a resin mask, thereby forming wiring, connecting terminals, etc. on the surface of the substrate.

In one or more embodiments, the detergent composition of the present disclosure can be suitably used for washing a washed object to which a resin mask is attached, or to which a resin mask has been plated and/or heated, from the perspective of the washing effect. As a resin mask, for example, it can be a negative resin mask or a positive resin mask. From the perspective of the ease of exerting the effect of the present disclosure, a negative resin mask is preferred. As a negative resin mask, for example, negative dry film resists that have been exposed and/or developed can be cited. In the present disclosure, a negative resin mask is formed using a negative resist, and for example, a negative resist layer that has been exposed and/or developed can be cited. In the present disclosure, a positive resin mask is formed using a positive resist, and for example, a positive resist layer that has been exposed and/or developed can be cited.

[Resin mask removal method]

The present disclosure, in one form, relates to a method for removing a resin mask (hereinafter also referred to as the removal method of the present disclosure), which includes: bringing an object to be cleaned with a resin mask attached thereto into contact with the detergent composition of the present disclosure. The removal method of the present disclosure has: a step of washing the object to be cleaned with the detergent composition of the present disclosure. Examples of the object to be cleaned include the above-mentioned objects to be cleaned. As a method of bringing the detergent composition of the present disclosure into contact with an object to be cleaned, or a method of washing an object to be cleaned with the detergent composition of the present disclosure, for example, there can be mentioned: a method of bringing the two into contact by immersing them in a washing bath filled with a detergent composition; a method of bringing the two into contact by spraying the detergent composition in a spray form (showering method); an ultrasonic washing method of irradiating the object with ultrasonic waves during immersion, etc. The detergent composition of the present disclosure can be used directly for washing without dilution. Preferably, the removal method of the present disclosure includes: after bringing the object to be cleaned into contact with the detergent composition, rinsing with water, and drying. According to the removal method disclosed herein, resin masks, especially resin masks that have been plated and/or heated, can be removed efficiently. From the perspective of easily exerting the cleaning ability of the detergent composition disclosed herein, the removal method disclosed herein preferably irradiates ultrasonic waves when the detergent composition disclosed herein contacts the object to be washed, and more preferably, the frequency of the ultrasonic waves is relatively high. From the same viewpoint, the irradiation conditions of the above-mentioned ultrasonic waves are preferably, for example, 26 to 72 kHz, 80 to 1500 W, and more preferably 36 to 72 kHz, 80 to 1500 W.

[Method for manufacturing electronic components]

The manufacturing method of the electronic parts disclosed in the present invention includes, in one form, a step of washing an object to which a resin mask is attached using the detergent composition disclosed in the present invention. Examples of the object to be washed include the above-mentioned objects to be washed. The manufacturing method of the electronic parts disclosed in the present invention can suppress metal corrosion while effectively removing the resin mask attached to the electronic parts by washing using the detergent composition disclosed in the present invention, thereby manufacturing electronic parts with higher reliability. In addition, by performing the removal method disclosed in the present invention, the resin mask attached to the electronic parts can be easily removed, thereby shortening the washing time and improving the manufacturing efficiency of the electronic parts.

[Kit]

The present disclosure relates to a kit for use in any one of the removal method of the present disclosure and the method for manufacturing an electronic component of the present disclosure, the kit comprising at least one of the above-mentioned components A to C constituting the detergent composition of the present disclosure in a state not mixed with other components. According to the kit of the present disclosure, a detergent composition having excellent resin mask removal performance and a small wastewater treatment load can be obtained.

As the kit of the present disclosure, for example, there can be mentioned a kit (two-liquid detergent composition) comprising a solution containing component A (first liquid) and a solution containing component B (second liquid) in a state where they are not mixed with each other, at least one of the first liquid and the second liquid further contains component C, and the first liquid and the second liquid are mixed when used. Each of the first liquid and the second liquid may contain the above-mentioned arbitrary components as needed.

The present disclosure also relates to the following detergent compositions, removal methods, and production methods.

<1> A cleaning composition for removing a resin mask, comprising an inorganic base (component A), an organic solvent (component B) and water (component C),

The coordinates of the Hansen solubility parameters of component B are within the range of a sphere with a radius of 1.5 MPa ^0.5 and centered at δd = 17.5, δp = 5.0, and δh = 11.5.

The content of component C in the detergent composition during use is 85% by mass or more,

The mass ratio (A/B) of component A to component B is 1 or more and 60 or less.

<2> The detergent composition according to <1>, wherein component B is one or a combination of two or more selected from propylene glycol phenyl ether, ethylene glycol monobenzyl ether, ethylene glycol mono-n-hexyl ether, 1-methylcyclohexanol, 3-methylcyclohexanol, 4-methylcyclohexanol, 1-phenyl-1-propanol and 2-phenyl-1-propanol.

<3> The detergent composition according to <1> or <2>, wherein the content of Component A during use of the detergent composition is 0.1% by mass or more and 15% by mass or less,

The content of Component B in the detergent composition during use is 0.01% by mass or more and 3% by mass or less.

<4> The detergent composition as described in any one of <1> to <3>, wherein the content of component A when the detergent composition is used is preferably 0.1% by mass or more, more preferably 0.3% by mass or more, further preferably 0.5% by mass or more, further preferably 1% by mass or more, further preferably 2% by mass or more.

<5> The detergent composition according to any one of <1> to <4>, wherein the content of Component A during use of the detergent composition is preferably 15% by mass or less, more preferably 10% by mass or less, further preferably 7% by mass or less, and further preferably 5% by mass or less.

<6> The detergent composition according to any one of <1> to <5>, wherein the boiling point of component B is preferably 160°C or higher, more preferably 250°C or higher.

<7> The detergent composition according to any one of <1> to <6>, wherein the solubility of component B in 100 mL of water is 0.3 g or more.

<8> The detergent composition according to any one of <1> to <7>, wherein the content of Component B during use of the detergent composition is preferably 0.01% by mass or more, more preferably 0.05% by mass or more, further preferably 0.1% by mass or more, and further preferably 0.2% by mass or more.

<9> The detergent composition according to any one of <1> to <8>, wherein the content of Component B during use of the detergent composition is preferably 3% by mass or less, more preferably 2% by mass or less, further preferably 1% by mass or less, and further preferably 0.5% by mass or less.

<10> A detergent composition as described in any one of <1> to <9>, wherein the mass ratio of component A to component B in the detergent composition (A/B) is greater than 1 and less than 60, preferably greater than 1.1, more preferably greater than 1.2, further preferably greater than 1.5, further preferably greater than 2, further preferably greater than 3, further preferably greater than 5, further preferably greater than 10, further preferably greater than 15.

<11> The detergent composition according to any one of <1> to <10>, wherein the mass ratio of component A to component B (A/B) in the detergent composition is preferably 50 or less, more preferably 40 or less, further preferably 30 or less, and further preferably 20 or less.

<12> The detergent composition according to any one of <1> to <11>, wherein the content of Component C in the detergent composition during use is preferably 90% by mass or more, more preferably 95% by mass or more.

<13> The detergent composition according to any one of <1> to <12>, wherein the content of Component C during use of the detergent composition is preferably 99% by mass or less, more preferably 98% by mass or less, and even more preferably 97% by mass or less.

<14> A detergent composition as described in any one of <1> to <13>, wherein the total content of the optional components when the detergent composition is used is preferably from 0 mass % to 2.0 mass %, more preferably from 0 mass % to 1.5 mass %, further preferably from 0 mass % to 1.3 mass %, and even more preferably from 0 mass % to 1.0 mass %.

<15> The detergent composition according to any one of <1> to <14>, wherein the total content of organic matter in the detergent composition is preferably 3% by mass or less, more preferably 2% by mass or less, further preferably 1% by mass or less, and further preferably 0.5% by mass or less.

<16> The detergent composition according to any one of <1> to <15>, wherein the total content of organic matter in the detergent composition is preferably 0.01% by mass or more, more preferably 0.05% by mass or more, and even more preferably 0.1% by mass or more.

<17> The detergent composition according to any one of <1> to <16>, which does not substantially contain a nitrogen-containing compound and a phosphorus-containing compound.

<18> The detergent composition according to any one of <1> to <17>, wherein the total content of the nitrogen-containing compound and the phosphorus-containing compound in the detergent composition is less than 0.1% by mass, preferably 0.05% by mass or less, more preferably 0.01% by mass or less, and even more preferably 0% by mass.

<19> The detergent composition according to any one of <1> to <18>, wherein the pH of the detergent composition during use is preferably 10.0 or more, more preferably 10.5 or more.

<20> The detergent composition according to any one of <1> to <19>, wherein the pH of the detergent composition during use is preferably 14 or less, more preferably 13.9 or less, and even more preferably 13.7 or less.

<21> The detergent composition according to any one of <1> to <20>, wherein, when the detergent composition is a concentrate, the content of component A in the concentrate of the detergent composition is preferably 1% by mass or more, more preferably 2% by mass or more, further preferably 5% by mass or more, and further preferably 10% by mass or more.

<22> The detergent composition according to any one of <1> to <21>, wherein, when the detergent composition is a concentrate, the content of component A in the concentrate of the detergent composition is preferably 40% by mass or less, more preferably 30% by mass or less, further preferably 20% by mass or less, and even more preferably 10% by mass or less.

<23> The detergent composition according to any one of <1> to <22>, wherein, when the detergent composition is a concentrate, the content of component B in the concentrate of the detergent composition is preferably 0.1% by mass or more, more preferably 0.2% by mass or more, further preferably 0.5% by mass or more, and further preferably 1% by mass or more.

<24> The detergent composition according to any one of <1> to <23>, wherein, when the detergent composition is a concentrate, the content of component B in the concentrate of the detergent composition is preferably 10% by mass or less, more preferably 5% by mass or less, further preferably 2% by mass or less, and further preferably 1.5% by mass or less.

<25> The detergent composition according to any one of <1> to <24>, wherein, when the detergent composition is a concentrate, the content of Component C in the concentrate of the detergent composition is preferably 50% by mass or more, more preferably 60% by mass or more, and even more preferably 70% by mass or more.

<26> The detergent composition according to any one of <1> to <25>, wherein when the detergent composition is a concentrate, the content of Component C in the concentrate of the detergent composition is preferably 95% by mass or less, more preferably 90% by mass or less, and even more preferably 85% by mass or less.

<27> The detergent composition according to any one of <1> to <26>, wherein, when the detergent composition is a concentrated product, the pH of the concentrated detergent composition is preferably 10.0 or higher, more preferably 10.5 or higher.

<28> The detergent composition according to any one of <1> to <27>, wherein, when the detergent composition is a concentrated product, the pH of the concentrated detergent composition is preferably 14 or less.

<29> The detergent composition according to any one of <1> to <28>, wherein the resin mask is a negative dry film resist subjected to at least one of exposure and development.

<30> A method for removing a resin mask, comprising the step of washing an object to which the resin mask is attached using the detergent composition according to any one of <1> to <29>.

<31> The removal method according to <30>, wherein the object to be cleaned is an intermediate product in the production of electronic components.

<32> A method for producing an electronic component, comprising the step of cleaning an object to which a resin mask is attached using the cleaning composition according to any one of <1> or <29>.

<33> Use of the detergent composition according to any one of <1> to <29> in the production of electronic parts.

<34> A kit for use in any of the removal methods <30> or <31> and the method for manufacturing an electronic component described in <32>, the kit comprising at least one of the components A to C constituting the detergent composition described in any one of <1> to <29> in a state not mixed with other components.

<35> The kit as described in <34> comprises a solution containing component A (first liquid) and a solution containing component B (second liquid) in an unmixed state, and at least one of the first liquid and the second liquid further contains component C. The first liquid and the second liquid are mixed during use.

<36> Use of the detergent composition according to any one of <1> to <29>, for removing a resin mask from an object to be cleaned.

<37> Use of the detergent composition according to any one of <1> to <29> for cleaning electronic parts.

[Example]

The present disclosure is specifically described below through examples, but the present disclosure is not limited to these examples.

1. Physical properties of the solvent (component B) (coordinates and distances of HSP)

The coordinates of HSP (δd ₁ , δp ₁ , δh ₁ ) of each solvent B1 to 20 were calculated using computer software "HSPiP: Hansen Solubility Parameters in Practice". The distance between the coordinates of HSP (δd ₁ , δp ₁ , δh ₁ ) of component B and the component coordinate X (δd=17.5, δp=5.0, δh=11.5) was calculated using the following formula. The calculation results are shown in Table 1.

Distance = [(δd ₁ －17.5) ² + (δp ₁ －5.0) ² + (δh ₁ －11.5) ² ] ^0.5

[Table 1]

2. Preparation of detergent compositions (Examples 1 to 29 and Comparative Examples 1 to 22)

[Preparation of detergent compositions of Examples 1 to 26 and Comparative Examples 1 to 19]

In a 500 mL glass beaker, 17.5 g of sodium hydroxide (component A), 1.0 g of propylene glycol phenyl ether (component B) and 481.5 g of water (component C) were added in terms of active ingredients, and stirred to uniformly mix, thereby preparing the detergent composition of Example 1. Then, by the same method as Example 1, the detergent compositions of Examples 2 to 26 and Comparative Examples 1 to 19 were prepared with the composition ratios of the active ingredients shown in Table 2-1, Table 2-2 and Table 3. The content (mass %) and mass ratio A/B of each component of each detergent composition are shown in Table 2-1, Table 2-2 and Table 3. In Table 2-1 and Table 2-2, the distance of the HSP as a mixed organic solvent was calculated using the HSP calculation function of the mixed organic solvent of "HSPiP: Hansen Solubility Parameters in Practice".

[Detergent compositions of Examples 27 to 29 and Comparative Examples 20 to 22]

In a 10L stainless steel beaker, 175g of sodium hydroxide (component A), 10g of propylene glycol phenyl ether (component B) and 4815g of water (component C) were added in terms of effective ingredients, and stirred to uniformly mix, thereby preparing the detergent composition of Example 27. Then, by the same method as Example 27, the detergent compositions of Examples 28 to 29 and Comparative Examples 20 to 22 were prepared in the same manner as in Example 27 with the composition ratios of the effective ingredients shown in Table 4. The content (mass %) of each component of each detergent composition is shown in Table 4.

As components of the detergent compositions of Examples 1 to 29 and Comparative Examples 1 to 22, the following components were used.

Sodium hydroxide (component A) (manufactured by Kanto Chemical Co., Ltd., deer special grade, solid content 48% by mass)

Potassium hydroxide (component A) (manufactured by Kanto Chemical Co., Ltd., special grade, solid content 48% by mass)

Tetramethylammonium hydroxide (non-component A) (manufactured by Showa Denko K.K., TMAH (25%))

· Propylene glycol phenyl ether (ingredient B) (manufactured by Nippon Emulsifier Co., Ltd., phenyl propanediol (PhFG))

1-Methylcyclohexanol (component B) (manufactured by Tokyo Chemical Industry Co., Ltd.)

·3-Methylcyclohexanol (component B) (manufactured by Merck Co., Ltd.)

4-Methylcyclohexanol (component B) (manufactured by Tokyo Chemical Industry Co., Ltd.)

· Ethylene glycol monobenzyl ether (component B) (manufactured by Nippon Emulsifier Co., Ltd., benzyl glycol (BzG))

1-Phenyl-1-propanol (component B) (manufactured by Tokyo Chemical Industry Co., Ltd.)

·2-Phenyl-1-propanol (component B) (manufactured by Tokyo Chemical Industry Co., Ltd.)

· Ethylene glycol mono-n-hexyl ether (component B) (manufactured by Nippon Emulsifier Co., Ltd., 2-(hexyloxy)ethanol (HeG))

· Ethylene glycol monobutyl ether (not component B) (manufactured by Nippon Emulsifier Co., Ltd., 2-butoxyethanol (BG))

· Ethylene glycol mono-2-ethylhexyl ether (not component B) (manufactured by Nippon Emulsifier Co., Ltd., 2-(2-ethylhexyloxy)ethanol (EHG))

o-Methoxyphenol (not component B) (manufactured by Tokyo Chemical Industry Co., Ltd., guaiacol)

· Cyclohexanol (non-component B) (manufactured by Wako Pure Chemical Industries, Ltd.)

・Diethylene glycol monobutyl ether (not component B) (manufactured by Nippon Emulsifier Co., Ltd., 2-(2-butoxyethoxy)ethanol (BDG))

Benzyl alcohol (not component B) (manufactured by Lanxess Co., Ltd.)

·2-Phenoxyethanol (not component B) (manufactured by Tokyo Chemical Industry Co., Ltd.)

· Propylene glycol monobutyl ether (not component B) (manufactured by Nippon Emulsifier Co., Ltd., 1-butoxy-2-propanol (BFG))

·Monoethanolamine (not component B) (manufactured by Nippon Shokubai Co., Ltd.)

· Propylene glycol monomethyl ether (not component B) (manufactured by Nippon Emulsifier Co., Ltd., 1-methoxy-2-propanol (MFG))

· Propylene glycol monomethyl ether acetate (not component B) (manufactured by Nippon Emulsifier Co., Ltd., 1-methoxy-2-propyl acetate (MFG-AC))

·Dimethyl sulfoxide (not component B) (manufactured by Nacalai Tesque Co., Ltd.)

Water (component C) (pure water with a concentration of 1 μS/cm or less produced by a pure water device G-10DSTSET produced by Organo Co., Ltd.)

3. Evaluation of detergent compositions

The resin mask removability of the prepared detergent compositions of Examples 1 to 29 and Comparative Examples 1 to 22 was evaluated.

[Preparation of samples]

A photosensitive film for direct imaging (direct drawing) (Photec RD-1215, manufactured by Hitachi Chemical Co., Ltd., negative dry film resist) was laminated on the surface of a glass epoxy multilayer substrate (MCL-E-679FG, manufactured by Hitachi Chemical Co., Ltd.) under the following conditions, and after selective exposure treatment to cure the exposed portion (exposure step), the unexposed portion was removed by development treatment (development step), thereby obtaining a substrate having a resist pattern (negative resin mask of the following three pattern shapes). Then, the area where the unexposed portion was removed by the above-mentioned development treatment was subjected to copper plating treatment, thereby obtaining a sample (4 cm×4.5 cm).

(1) Lamination: A clean roll (RY-505Z manufactured by Rayon Industries, Ltd.) and a vacuum coater (VA7024/HP5 manufactured by Rohm and Haas) were used under the conditions of a roll temperature of 50° C., a roll pressure of 1.4 Bar, and a treatment time of 30 seconds.

(2) Exposure: Exposure was performed at an exposure dose of 15 mJ/cm ² using a direct drawing apparatus for printed substrates (Mercurex LI-9500, manufactured by SCREEN Graphic and Precision Solutions Co., Ltd.).

(3) Pattern shape: The following three patterns

Solid: A portion having an area of 30 μm×30 μm or more

Stripe pattern 1: a stripe pattern in which the ratio of line width L to line spacing S (L/S) = 20 μm/20 μm

Stripe pattern 2: Stripe pattern with L/S = 15 μm/15 μm

(4) Development: Using a substrate developing device (manufactured by Yangbo Technology Co., Ltd., LT-980366) and a 1% sodium carbonate aqueous solution at 30° C., the resin mask of the unexposed portion was removed under the conditions of a spray pressure of 0.2 MPa for 47 seconds.

[Washing Test 1 (Immersion Washing)] (Examples 1 to 26 and Comparative Examples 1 to 19)

100 g of each detergent composition of Examples 1 to 26 and Comparative Examples 1 to 19 was added to a 100 mL glass beaker and heated to 60°C. The sample was immersed for 3 minutes while being stirred at 400 rpm using a rotor (fluororesin (PTFE), φ8 mm × 25 mm). Then, the sample was immersed in a rinse tank in which 100 g of water was added to a 100 mL glass beaker and rinsed, and then naturally dried. In addition, the detergent compositions of Examples 18 to 26 and Comparative Examples 17 to 19 were subjected to a washing test with the immersion time set to 3 minutes, 6 minutes, 25 minutes, and 30 minutes.

[Washing Test 2 (Spray Washing)] (Examples 27 to 29 and Comparative Examples 20 to 22)

10 kg of each detergent composition of Examples 27 to 29 and Comparative Examples 20 to 22 was added to a 10L stainless steel beaker and heated to 60°C. A box-type spray washer equipped with a single-fluid nozzle (solid cone) JJXP030 (manufactured by IKEUCHI Co., Ltd.) was used as a spray nozzle. The sample was sprayed for 3 minutes (pressure: 0.2 MPa, spray distance: 8 cm) while circulating at a flow rate of 3 L/min. Then, it was immersed in a rinse tank in which 100 g of water was added to a 100mL glass beaker and rinsed, and then dried using nitrogen blowing.

[Evaluation 1 of Resin Mask Removability] (Examples 1 to 17, 27 to 29 and Comparative Examples 1 to 16, 20 to 22)

The resin mask removability of the samples cleaned with the cleaning compositions of Examples 1 to 17, 27 to 29 and Comparative Examples 1 to 16 and 20 to 22 was evaluated under the following conditions.

Using an optical microscope "Digital Microscope VHX-2000" (manufactured by Keyence Co., Ltd.), the image was magnified 300 times to visually check whether there was any residual resin mask in each part of the dried sample, and the resin mask removability was evaluated. The case where it could be completely removed was set as "1", and the case where a small amount of it remained was set as "2". The results are shown in Tables 2-1, 2-2, and 4.

In Table 2-1, Table 2-2 and Table 4, “Solid State Peelability” indicates the peelability of the resin mask when the resist pattern is a solid state, “Striped Pattern 1 Peelability” indicates the peelability of the resin mask when the resist pattern is striped pattern 1 (L/S=20μm/20μm), and “Striped Pattern 2 Peelability” indicates the peelability when the resist pattern is striped pattern 2 (L/S=15μm/15μm).

[Evaluation 2 of Resin Mask Removability] (Examples 1, 4, 8, 18 to 26 and Comparative Examples 17 to 19)

The resin mask removability of the samples cleaned with the cleaning compositions of Examples 1, 4, 8, 18 to 26 and Comparative Examples 17 to 19 was evaluated under the following conditions.

The resin mask removability was evaluated by visually checking the presence or absence of the remaining resin mask at each part of the dried sample using an optical microscope "Digital Microscope VHX-2000" (manufactured by Keyence Co., Ltd.) at a magnification of 300 times. The shortest immersion time in the detergent composition required to completely remove the resin mask was evaluated as described below, and the results are shown in Table 3. The shorter the immersion time, the higher the resin mask removability.

In Table 3, “Solid surface peeling” indicates the peeling property of the resin mask when the resist pattern is a solid surface, “Striped pattern 1 peeling property” indicates the peeling property of the resin mask when the resist pattern is striped pattern 1 (L/S=20μm/20μm), and “Striped pattern 2 peeling property” indicates the peeling property when the resist pattern is striped pattern 2 (L/S=15μm/15μm).

＜Evaluation Criteria＞

1: Complete peeling is achieved when the immersion time is 3 minutes

2: Complete peeling is achieved when the immersion time is 6 minutes

3: Complete peeling is achieved after immersion for 25 minutes

4: Even after immersion for 30 minutes, peeling still remains

[Durability Evaluation] (Examples 1, 3 and 4)

300 g of each detergent composition of Examples 1, 3 and 4 was added to a 300 mL glass beaker, kept warm in a water bath at 60°C, and stirred at 300 rpm using a rotor (fluororesin (PTFE), φ8 mm × 40 mm). The amount of liquid reduced due to evaporation was supplemented by adding water, and the total organic carbon (TOC) of each detergent composition after 5 hours was measured using a Hiranuma total organic carbon measuring device TOC-2000 (manufactured by Hiranuma Sangyo Co., Ltd.), and the change in TOC was calculated using the following formula. The closer the residual organic carbon rate is to 100%, the less the change in the active ingredient (ingredient B) and the better the durability. Here, "change in the active ingredient" means that ingredient B scatters, volatilizes or evaporates during long-term use of the detergent composition, thereby reducing the content of ingredient B in the detergent composition.

Residual organic carbon rate (%) = TOC after test ÷ TOC before test × 100

[Evaluation of Concentration Properties] (Examples 1 to 8)

Water was added to the components other than water in each detergent composition of Examples 1 to 8, and the concentration ratio was visually measured until the composition became uniformly transparent without turbidity or precipitation. The measurement was started from 10-fold concentration.

＜Method for determining the concentration ratio＞

48% NaOH (7.29 g = 3.50 g of active ingredient) and each solvent (0.20 g) were added to a 100 mL beaker (empty weight measurement), and water was added thereto until the mixture became uniform and transparent. The weight (final weight) was measured to calculate the concentration ratio.

Concentration ratio = 100 ÷ (final weight - empty weight of beaker)

[Table 3]

[Table 4]

As shown in Table 2-1, Table 2-2, Table 3 and Table 4, the detergent compositions of Examples 1 to 29 can efficiently remove the resin mask after the plating treatment compared with Comparative Examples 1 to 16 not containing the prescribed solvent (component B) and Comparative Examples 17 to 22 not containing the inorganic base (component A). That is, the detergent compositions of Examples 1 to 29 are superior in resin mask removal performance compared with Comparative Examples 1 to 22.

[Industrial Applicability]

By using the present disclosure, the resin mask can be removed efficiently without increasing the wastewater treatment load. Therefore, the detergent composition of the present disclosure is useful as a detergent composition used in the manufacturing process of electronic parts, and can shorten the washing process of electronic parts with resin masks attached, improve the performance and reliability of the manufactured electronic parts, and improve the productivity of semiconductor devices.

Claims (27)

1. A cleaning composition for stripping a resin mask, comprising an inorganic base (component A), an organic solvent (component B), and water (component C), and substantially containing no nitrogen-containing compounds and phosphorus-containing compounds, The coordinates of the Hansen solubility parameters of component B are within the range of a sphere with a radius of 1.5 MPa ^0.5 and centered at δd = 17.5, δp = 5.0, and δh = 11.5. Component B is one or a combination of two or more selected from propylene glycol phenyl ether, ethylene glycol monobenzyl ether, ethylene glycol mono-n-hexyl ether, 1-methylcyclohexanol, 3-methylcyclohexanol, 4-methylcyclohexanol, 1-phenyl-1-propanol and 2-phenyl-1-propanol, The content of component C in the detergent composition is 85% by mass or more, The mass ratio A/B of component A to component B is 10 or more and 60 or less. 2. The detergent composition according to claim 1, wherein component A is one or a combination of two or more selected from the group consisting of sodium hydroxide, potassium hydroxide, sodium carbonate and potassium carbonate. 3. The detergent composition according to claim 1, wherein component A is one or a combination of two or more selected from sodium hydroxide and potassium hydroxide. 4. The detergent composition according to any one of claims 1 to 3, wherein component B is one or a combination of two or more selected from ethylene glycol monobenzyl ether, ethylene glycol mono-n-hexyl ether, 1-methylcyclohexanol, 2-phenyl-1-propanol and 1-phenyl-1-propanol. 5. The detergent composition according to any one of claims 1 to 3, wherein component B is one or a combination of two or more selected from propylene glycol phenyl ether and ethylene glycol monobenzyl ether. 6 . The detergent composition according to claim 1 , wherein component B is one or a combination of two or more selected from ethylene glycol monobenzyl ether, 2-phenyl-1-propanol and 1-phenyl-1-propanol. 7. The detergent composition according to any one of claims 1 to 3, wherein the content of Component A in the detergent composition is 0.1% by mass or more and 15% by mass or less, The content of Component B in the detergent composition is 0.01% by mass or more and 3% by mass or less. 8. The detergent composition according to any one of claims 1 to 3, wherein the content of Component A in the detergent composition is 0.3% by mass or more and 10% by mass or less, The content of Component B in the detergent composition is 0.1% by mass or more and 2% by mass or less. 9 . The detergent composition according to claim 1 , wherein the content of Component A in the detergent composition is 0.3% by mass or more and 10% by mass or less. 10 . The detergent composition according to claim 1 , wherein the content of Component B in the detergent composition is 0.1% by mass or more and 2% by mass or less. 11 . The detergent composition according to claim 1 , wherein a mass ratio (A/B) of component A to component B in the detergent composition is 10 or more and 50 or less. 12 . The detergent composition according to claim 1 , wherein the content of Component C in the detergent composition is 85% by mass or more and 99% by mass or less. 13 . The detergent composition according to claim 1 , wherein the content of Component C in the detergent composition is 90% by mass or more and 99% by mass or less. 14. A detergent composition comprising an inorganic base (component A), an organic solvent (component B), and water (component C), which does not substantially contain nitrogen-containing compounds and phosphorus-containing compounds, the content of component A is 1% by mass or more and 40% by mass or less, and the coordinates of the Hansen solubility parameters of component B are within the range of a sphere with a radius of 1.5 MPa ^0.5 and centered at δd=17.5, δp=5.0, and δh=11.5, Component B is one or a combination of two or more selected from propylene glycol phenyl ether, ethylene glycol monobenzyl ether, ethylene glycol mono-n-hexyl ether, 1-methylcyclohexanol, 3-methylcyclohexanol, 4-methylcyclohexanol, 1-phenyl-1-propanol and 2-phenyl-1-propanol, The mass ratio A/B of component A to component B is 10 or more and 60 or less. 15 . The detergent composition according to claim 14 , wherein the content of component B is 0.1% by mass or more and 10% by mass or less. 16 . The detergent composition according to claim 14 , wherein the content of Component C is 50% by mass or more and 95% by mass or less. 17 . The detergent composition according to claim 1 , wherein component B has a boiling point of 160° C. or higher. 18 . The detergent composition according to claim 1 , wherein the solubility of component B in 100 mL of water at 25° C. is 0.3 g or more. 19. The detergent composition according to any one of claims 1 to 3 and 14 to 16, wherein the total content of organic matter in the detergent composition is 3% by mass or less. 20. The detergent composition according to any one of claims 1 to 3 and 14 to 16, wherein the resin mask is a negative dry film resist subjected to at least one of exposure and development. 21. A method for removing a resin mask, comprising the step of washing an object to which the resin mask is attached using the detergent composition according to any one of claims 1 to 20. 22. The removal method according to claim 21, wherein the object to be cleaned is an intermediate product in the manufacture of electronic parts. 23. A method for producing an electronic component, comprising the step of cleaning an object to which a resin mask is attached using the cleaning composition according to any one of claims 1 to 20. 24. Use of the detergent composition according to any one of claims 1 to 20 in the production of electronic parts. 25. A kit used in any one of the removal method according to claim 21 or 22 and the method for manufacturing an electronic component according to claim 23, The kit contains the components A to C constituting the detergent composition according to any one of claims 1 to 20 simultaneously, and contains at least one of the components A to C in a state not mixed with other components. 26. Use of the detergent composition according to any one of claims 1 to 20 for removing a resin mask from an object to be cleaned. 27. Use of the detergent composition according to any one of claims 1 to 20 for cleaning electronic parts.