CN109791319B - Method and apparatus for peeling flexible substrate - Google Patents
Method and apparatus for peeling flexible substrate Download PDFInfo
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- CN109791319B CN109791319B CN201780058750.6A CN201780058750A CN109791319B CN 109791319 B CN109791319 B CN 109791319B CN 201780058750 A CN201780058750 A CN 201780058750A CN 109791319 B CN109791319 B CN 109791319B
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- 239000000758 substrate Substances 0.000 title claims abstract description 287
- 238000000034 method Methods 0.000 title claims abstract description 37
- 239000011521 glass Substances 0.000 claims abstract description 127
- 238000005520 cutting process Methods 0.000 claims abstract description 40
- 238000001179 sorption measurement Methods 0.000 claims description 9
- 238000003825 pressing Methods 0.000 claims description 6
- 230000008569 process Effects 0.000 description 13
- 238000004519 manufacturing process Methods 0.000 description 10
- 239000000463 material Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 239000010410 layer Substances 0.000 description 3
- 230000014759 maintenance of location Effects 0.000 description 3
- 230000004075 alteration Effects 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
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- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
Abstract
A peeling method and a peeling apparatus (10) of a flexible substrate (20). The peeling method is used for peeling a flexible substrate (20) and a glass substrate (30), and comprises the following steps: (S1) cutting the glass substrate (30) of a predetermined size into a cut section (31); (S3) holding the cutout section (31) and the flexible substrate (20) corresponding to the cutout section (31); and (S5) moving the nipped singulating section (31) and the flexible substrate (20) to separate the singulating section (31) from the glass substrate (30) and peel the flexible substrate (20) from the glass substrate (30).
Description
Technical Field
The invention relates to the technical field of display screens, in particular to a method and equipment for peeling a flexible substrate.
Background
In the manufacturing process of the flexible substrate, in order to peel the flexible substrate from the glass substrate, it is generally necessary to irradiate the contact surface between the flexible substrate and the glass substrate with laser light to destroy the adsorption force of the contact surface, and then to cut the flexible substrate between the glass substrate and the flexible display screen by using a cutter to further peel the flexible substrate.
Disclosure of Invention
The embodiment of the invention provides a stripping method and a stripping device for a flexible substrate.
The peeling method of the flexible substrate of the embodiment of the invention is used for peeling the flexible substrate and the glass substrate, and comprises the following steps:
intercepting the glass substrate with a preset size into an intercepting section;
clamping the intercepting section and the flexible substrate corresponding to the intercepting section; and
moving the gripped cutting section and the flexible substrate to separate the cutting section from the glass substrate and peel the flexible substrate and the glass substrate.
In some embodiments, the peeling method further comprises, before the cutting the glass substrate of the predetermined size into cut pieces:
and placing the glass substrate and the flexible substrate on a bearing platform, wherein the flexible substrate is positioned between the glass substrate and the bearing platform.
In some embodiments, the sectioning the glass substrate of the predetermined size into a sectioned section is performed by applying pressure to a side of the glass substrate opposite the flexible substrate to form a fracture on the glass substrate, the fracture separating the glass substrate into the sectioned section and a retained section.
In some embodiments, the peeling method further comprises, after the cutting the glass substrate of the predetermined size into cut pieces:
and moving the glass substrate and the flexible substrate to separate the flexible substrate from the bearing platform.
In some embodiments, the glass substrate further comprises a retaining section, and the moving the glass substrate and the flexible substrate is performed by moving the glass substrate and the flexible substrate after adsorbing the retaining section.
In certain embodiments, the peeling method further comprises:
placing the separated cutting section and the stripped flexible substrate on a bearing platform; and
and cutting the cutting section and the flexible substrate corresponding to the cutting section.
The peeling apparatus of a flexible substrate of an embodiment of the present invention is for peeling a flexible substrate and a glass substrate, and includes:
the intercepting device is used for intercepting the glass substrate with a preset size into an intercepting section; and
a clamping device for clamping the intercepting section and the flexible substrate corresponding to the intercepting section, and moving the intercepted section and the flexible substrate so as to separate the intercepting section from the glass substrate and peel the flexible substrate from the glass substrate.
In some embodiments, the peeling apparatus further comprises a carrying platform for carrying the glass substrate and the flexible substrate, the flexible substrate being located between the glass substrate and the carrying platform.
In some embodiments, the intercepting device includes a knife wheel for applying pressure on a side of the glass substrate opposite the flexible substrate to form a crack on the glass substrate that separates the glass substrate into the intercepting section and the retaining section.
In some embodiments, the peeling apparatus further comprises a gripping device for gripping the glass substrate and moving the glass substrate and the flexible substrate to separate the flexible substrate from the carrying platform.
In some embodiments, the glass substrate further comprises a retaining section, and the grasping device comprises an adsorption platform for generating negative pressure and adsorbing the retaining section to grasp the retaining section.
In some embodiments, the peeling apparatus further includes a carrying platform for carrying the separated cut section and the peeled flexible substrate, and further includes a cutting device for cutting the cut section and the flexible substrate corresponding to the cut section.
According to the stripping method and the stripping equipment for the flexible substrate, the flexible substrate and the glass substrate are directly stripped after the cutting section and the corresponding flexible substrate are clamped, the stripping process and the stripping equipment are simple, and the manufacturing cost of the flexible substrate is low.
Additional aspects and advantages of embodiments of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of embodiments of the invention.
Drawings
The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
FIG. 1 is a schematic flow diagram of a stripping process according to an embodiment of the present invention;
FIG. 2 is a schematic flow diagram of a stripping process according to an embodiment of the present invention;
FIG. 3 is a schematic flow diagram of a stripping process according to an embodiment of the invention;
FIG. 4 is a schematic flow diagram of a stripping process according to an embodiment of the invention;
FIG. 5 is a schematic view of a peeling scenario of a flexible substrate according to an embodiment of the invention;
FIG. 6 is a schematic view of a peeling scenario of a flexible substrate according to an embodiment of the invention;
FIG. 7 is a schematic view of a peeling scenario of a flexible substrate according to an embodiment of the invention;
fig. 8 is a schematic view of a peeling scene of the flexible substrate according to the embodiment of the present invention.
Description of the drawings with the main elements symbols:
the device comprises a stripping device 10, an intercepting device 11, a knife wheel 111, a clamping device 12, an upper clamping plate 121, a lower clamping plate 122, a bearing platform 13, a grabbing device 14, an adsorption platform 141, a suction cup 1411, a cutting device 15, a flexible substrate 20, an edge area 21, a glass substrate 30, an intercepting section 31 and a retaining section 32.
Detailed Description
The following further describes embodiments of the present invention with reference to the drawings. The same or similar reference numbers in the drawings identify the same or similar elements or elements having the same or similar functionality throughout.
In addition, the embodiments of the present invention described below with reference to the accompanying drawings are exemplary only for the purpose of explaining the embodiments of the present invention, and are not to be construed as limiting the present invention.
In the present invention, unless otherwise expressly stated or limited, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through an intermediate. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.
Referring to fig. 1 and fig. 5 to 7, a peeling method of a flexible substrate 20 according to an embodiment of the present invention is used for peeling the flexible substrate 20 and a glass substrate 30, and the peeling method includes the steps of:
s1: cutting a glass substrate 30 of a predetermined size into a cutting section 31;
s3: clamping the intercepting section 31 and the flexible substrate 20 corresponding to the intercepting section 31; and
s5: the nipped intercepting section 31 and the flexible substrate 20 are moved to separate the intercepting section 31 from the glass substrate 30 and peel the flexible substrate 20 and the glass substrate 30.
The peeling apparatus 10 of the flexible substrate 20 according to the embodiment of the present invention may be used to peel the flexible substrate 20 from the glass substrate 30, and the peeling apparatus 10 includes a cutting device 11 and a holding device 12. The intercepting means 11 may be used to perform the step S1, and the holding means 12 may be used to perform the steps S3 and S5. That is, the intercepting apparatus 11 may be used to intercept the glass substrate 30 of a predetermined size into the intercepting section 31. The holding device 12 may be used to hold the sectioning section 31 and the flexible substrate 20 corresponding to the sectioning section 31, and move the held sectioning section 31 and the flexible substrate 20 to separate the sectioning section 31 from the glass substrate 30 and peel the flexible substrate 20 and the glass substrate 30.
According to the peeling method and the peeling apparatus 10 for the flexible substrate 20 of the embodiment of the invention, the flexible substrate 20 and the glass substrate 30 are directly peeled after the cutting section 31 and the corresponding flexible substrate 20 are clamped, so that the peeling process and the peeling apparatus 10 are simple, and the manufacturing cost of the flexible substrate 20 is low.
The flexible substrate 20 may be an OLED panel, and generally, a layer of flexible substrate is fabricated on the glass substrate 30, and device layers, protective layers, etc. are fabricated on the flexible substrate to form the flexible substrate 20, and then the flexible substrate 20 is peeled off from the glass substrate 30.
Specifically, the peeling method according to the embodiment of the present invention does not need to destroy the bonding force between the flexible substrate 20 and the glass substrate 30 by laser irradiation or the like, and does not need to cut a special tool into the space between the glass substrate 30 and the flexible substrate 20 to peel them, and the peeling process of the flexible substrate 20 is simple, and similarly, the peeling apparatus 10 does not need to be provided with a laser for emitting laser, and does not need to be provided with a tool for cutting the space between the glass substrate 30 and the flexible substrate 20, and the structure of the peeling apparatus 10 is simple, thereby saving the manufacturing cost of the flexible substrate 20.
The intercepting section 31 may be reserved when the flexible substrate 20 is attached to the glass substrate 30, and the intercepting section 31 may be reserved at an edge position of the glass substrate 30 so that the intercepting section 31 is intercepted and clamped. The flexible substrate 20 comprises an edge region 21 corresponding to the intercepting section 31, the edge region 21 is located at an edge position of the flexible substrate 20, and during the production process, the edge region 21 facilitates the peeling device 10 to perform operations on the flexible substrate 20, such as operations of fixing, clamping, moving the flexible substrate 20 and the like, and prevents the rest region of the flexible substrate 20 from being damaged due to too much contact with the peeling device 10 during the production process. In an example, in a production process of the flexible substrate 20, no device layer is prepared on the edge region 21, the edge region 21 does not affect a use function of the flexible substrate 20, and the edge region 21 may be cut off before the flexible substrate 20 leaves a factory.
It can be understood that the flexible substrate 20 has a relatively thin thickness and a relatively soft texture, i.e. the flexible substrate 20 is relatively weak and easily deformed to be difficult to be clamped alone, and due to the relatively high hardness and the relatively flat shape of the cutting section 31, the clamping device 12 is relatively stable when clamping the cutting section 31 and the edge region 21 at the same time, so that the edge region 21 can pull the whole flexible substrate 20 to be peeled off from the glass substrate 30 when moving the clamping device 12.
Referring to fig. 2 and 5, in some embodiments, the peeling method further includes, before step S1, step S0: the glass substrate 30 and the flexible substrate 20 are placed on the carrying platform 13, and the flexible substrate 20 is located between the glass substrate 30 and the carrying platform 13.
The peeling apparatus 10 of the embodiment of the present invention further includes a carrying platform 13, the carrying platform 13 is used for carrying the glass substrate 30 and the flexible substrate 20, and the flexible substrate 20 is located between the glass substrate 30 and the carrying platform 13.
In the process of producing the flexible substrate 20, the glass substrate 30 may be fixed on the supporting platform 13, for example, a fixing groove may be formed on the supporting platform 13, the glass substrate 30 is placed on the supporting platform 13, and air in the fixing groove is extracted to form a negative pressure in the fixing groove and adsorb the glass substrate 30. The flexible substrate 20 is then prepared on the glass substrate 30. When the flexible substrate 20 is prepared and the flexible substrate 20 needs to be peeled off from the glass substrate 30, the glass substrate 30 is taken off from the carrying platform 13, and after the glass substrate 30 and the flexible substrate 20 are turned over, the glass substrate 30 and the flexible substrate 20 are placed on the carrying platform 13. At this time, the flexible substrate 20 is brought into contact with the mounting stage 13, and the glass substrate 30 is placed above the flexible substrate 20, so that the cutting operation of the glass substrate 30 is facilitated.
Referring to fig. 5, in some embodiments, step S1 is performed by applying pressure to the side of the glass substrate 30 opposite the flexible substrate 20 to form a crack on the glass substrate 30, wherein the crack separates the glass substrate 30 into the intercepting section 31 and the retaining section 32.
In some embodiments, the intercepting apparatus 11 further comprises a cutter wheel 11, and the cutter wheel 11 is used for applying pressure on the side of the glass substrate 30 opposite to the flexible substrate 20 to form a crack on the glass substrate 30, and the crack divides the glass substrate 30 into an intercepting section 31 and a retaining section 32.
The cutter wheel 11 is a cutting tool, the cutter wheel 11 can form a crack on the article to be cut so as to facilitate the separation of the article to be cut along the crack, the material of the cutter wheel 11 can be a material with higher hardness such as diamond, and the cutter wheel 11 can be in a disc shape. It is understood that the material of the glass substrate 30 may be glass, which has a relatively large brittleness, and after a crack is cut on the surface of the glass substrate 30, the crack is easily extended in the thickness direction of the glass substrate 30, that is, the glass substrate 30 is easily divided along the crack. The fracture divides the glass substrate 30 into the intercepting section 31 and the retaining section 32, and because the intercepting section 31 is difficult to recycle in subsequent manufacturing processes, on the basis of ensuring the stripping effect, the area of the intercepting section 31 can be reduced as much as possible and the area of the retaining section 32 can be increased, and the retaining section 32 is easy to recycle after the flexible substrate 20 is stripped from the glass substrate 30, for example, the retaining section 32 can be used as the glass substrate 30 for manufacturing another flexible substrate 20.
It should be noted that, in step S1, the intercepting part 31 may not be completely separated from the retaining part 32, for example, a crack is formed between the intercepting part 31 and the retaining part 32, so as to separate the intercepting part 31 and the retaining part by an external force in a subsequent process. Of course, in step S1, the intercepting section 31 may be completely separated from the holding section 32, which is not limited herein.
Referring to fig. 3 and 6, in some embodiments, the peeling method further includes a step S2 after the step S1: the glass substrate 30 and the flexible substrate 20 are moved to separate the flexible substrate 20 from the carrier stage 13.
In certain embodiments, the stripping apparatus 10 further comprises a gripping device 14, and the gripping device 14 may be used to implement step S2. That is, the grasping device 14 is used to grasp the glass substrate 30 and move the glass substrate 30 and the flexible substrate 20 to separate the flexible substrate 20 from the carrying platform 13.
Since the flexible substrate 20 is fragile, the flexible substrate 20 is easily damaged after contacting the supporting platform 13 for a long time, and therefore, after the intercepting section 31 is intercepted, the flexible substrate 20 needs to be separated from the supporting platform 13 to avoid the flexible substrate 20 from being damaged. And since the glass substrate 30 is less vulnerable to damage than the flexible substrate 20, the gripping device 14 is preferably used to grip the glass substrate 30 to bring the flexible substrate 20 away from the carrying platform 13.
Specifically, the glass substrate 30 and the flexible substrate 20 may be moved upward to separate the flexible substrate 20 from the supporting platform 13, so as to prevent the flexible substrate 20 from being damaged due to friction between the flexible substrate 20 and the supporting platform 13 during the moving process, and to reserve sufficient operating space for the subsequent clamping and moving of the intercepting section 31 and the edge section 31.
Referring to fig. 6, in some embodiments, the glass substrate 30 further includes a retaining section 32, and the glass substrate 30 and the flexible substrate 20 are moved by adsorbing the retaining section 32 and then moving the glass substrate 30 and the flexible substrate 20.
In some embodiments, the grasping device 14 includes an adsorption platform 141, and the adsorption platform 141 is configured to generate a negative pressure and adsorb the retention section 32 to grasp the retention section 32.
Specifically, the adsorption platform 141 includes a plurality of suction cups 1411, each suction cup 1411 being in communication with a vacuum pump. The vacuum pump is turned on to evacuate air from the suction cup 1411 to form a negative pressure in the suction cup 1411, the suction platform 141 is moved close to the glass substrate 30 until the retaining segment 32 is sucked on the suction cup 1411, and then the suction platform 141 is moved to move the glass substrate 30 and the flexible substrate 20. The size of the suction force of the suction cup 1411 can be adjusted by adjusting the power of the vacuum pump, when the retaining segment 32 does not need to be fixed, the retaining segment 32 can be placed on the carrying platform 13, then the vacuum pump is turned off and the suction cup 1411 is communicated with the atmosphere, and the suction platform 141 is moved away after the suction force of the suction cup 1411 on the retaining segment 32 disappears.
Since the adsorption platform 141 adsorbs the retention section 32 to fix the glass substrate 30, the adsorption platform 141 does not affect the operation of the subsequent peeling apparatus 10 on the cutting section 31.
The holding device 12 may be a movable robot, and the holding device 12 includes an upper plate 121 and a lower plate 122, and when it is required to hold the intercepting section 31 and the edge zone 21, the holding device 12 is moved so that the intercepting section 31 and the edge zone 21 are located between the upper plate 121 and the lower plate 122. Then, the upper clamp plate 121 or the lower clamp plate 122 is moved, or the upper clamp plate 121 and the lower clamp plate 122 are moved simultaneously, so that the upper clamp plate 121 contacts the cutout section 31 and the lower clamp plate 122 contacts the flexible substrate 20 and clamps the cutout section 31 and the edge region 21.
Referring to fig. 7, after clamping the intercepting section 31 and the edge area 21, the clamping device 12 may be controlled to rotate integrally to completely separate the intercepting section 31 from the remaining section 32. Specifically, since the glass substrate 30 has already formed a crack in step S1, when the cutout segment 31 is clamped and the cutout segment 31 is broken off with an external force, the crack extends in the thickness direction of the glass substrate 30 and causes the glass substrate 30 to be completely divided into the cutout segment 31 and the holding segment 32.
Subsequently, the holding device 12 can be controlled to move to peel the flexible substrate 20 from the retaining section 32. Specifically, the position where the flexible substrate 20 is to be peeled from the glass substrate 30 is D, and the length of the flexible substrate 20 that has been peeled is L, and the holding device 12 may be controlled to move in a tangential direction of an arc having a radius of L and a center of D, as shown in the direction B. It is understood that as the flexible substrate 20 is gradually peeled from the glass substrate 30, the position D, the length L, and the direction B are also changed in real time, so that the flexible substrate 20 is peeled with less pulling of the flexible substrate 20.
After the intercepting section 31 and the edge area 21 are clamped, and in the process of moving the intercepting section 31 and the edge area 21, the flexible substrate 20 is not always in contact with the bearing platform 13, so that the interaction force between the flexible substrate 20 and the bearing platform 13 in the stripping process is reduced, and the possibility that the flexible substrate 20 is damaged by the bearing platform 13 is reduced.
Referring to fig. 4 and 8, in some embodiments, the peeling method further includes:
s6: placing the separated cut segment 31 and the peeled flexible substrate 20 on the carrying platform 13; and
s7: the cutout section 31 and the flexible substrate 20 corresponding to the cutout section 31 are cut out.
In some embodiments, the stripping apparatus 10 further comprises a carrying platform 13, the carrying platform 13 is used for carrying the separated cutting segment 31 and the stripped flexible substrate 20, and the stripping apparatus 10 further comprises a cutting device 15. The clamping device 12 and the cutting device 15 may be used to perform steps S6 and S7. That is, the holding device 12 may be used to place the separated skimmed section 31 and the peeled flexible substrate 20 on the carrier platform 13. The cutting device 15 may be used to cut the cut section 31 and the flexible substrate 20 corresponding to the cut section 31.
The edge region 21 and the cutting section 31 are directly cut off together, the edge region 21 and the cutting section 31 do not need to be separated, the peeling process of the flexible substrate 20 is simplified, and the edge region 21 does not influence the subsequent manufacture and use of the flexible substrate 20.
In the description herein, reference to the description of the terms "certain embodiments," "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, unless specifically limited otherwise.
Although embodiments of the present invention have been shown and described above, it should be understood that the above embodiments are exemplary and not to be construed as limiting the present invention, and those skilled in the art can make variations, modifications, substitutions and alterations to the above embodiments within the scope of the present invention, which is defined by the claims and their equivalents.
Claims (8)
1. A peeling method of a flexible substrate for peeling the flexible substrate and a glass substrate, the peeling method comprising:
intercepting the glass substrate with a preset size into an intercepting section;
clamping the intercepting section and the flexible substrate corresponding to the intercepting section; and
moving the nipped intercepting section and the flexible substrate to separate the intercepting section from the glass substrate and peel the flexible substrate and the glass substrate,
the peeling method further includes, before the cutting of the glass substrate of a predetermined size into a cut section:
placing the glass substrate and the flexible substrate on a carrier platform, the flexible substrate being located between the glass substrate and the carrier platform,
the cutting of the glass substrate with the preset size into the cutting section is realized by applying pressure to one side of the glass substrate opposite to the flexible substrate to form a crack on the glass substrate, and the crack divides the glass substrate into the cutting section and the retaining section.
2. The peeling method according to claim 1, further comprising, after the cutting of the glass substrate of a predetermined size into cut sections:
and moving the glass substrate and the flexible substrate to separate the flexible substrate from the bearing platform.
3. The peeling method according to claim 2, wherein the glass substrate further comprises a holding section, and the moving of the glass substrate and the flexible substrate is performed by moving the glass substrate and the flexible substrate after the holding section is adsorbed.
4. The peeling method as claimed in claim 1, further comprising:
placing the separated cutting section and the stripped flexible substrate on a bearing platform; and
and cutting the cutting section and the flexible substrate corresponding to the cutting section.
5. A peeling apparatus of a flexible substrate for peeling the flexible substrate from a glass substrate, comprising:
the intercepting device is used for intercepting the glass substrate with a preset size into an intercepting section; and
a holding device for holding the intercepting section and the flexible substrate corresponding to the intercepting section, and moving the held intercepting section and the flexible substrate to separate the intercepting section from the glass substrate and peel the flexible substrate and the glass substrate,
the peeling equipment also comprises a bearing platform, the bearing platform is used for placing the glass substrate and the flexible substrate, the flexible substrate is positioned between the glass substrate and the bearing platform,
the intercepting device comprises a knife wheel, wherein the knife wheel is used for applying pressure on one side of the glass substrate, which is opposite to the flexible substrate, so that a crack is formed on the glass substrate, and the crack divides the glass substrate into the intercepting section and the retaining section.
6. The peeling apparatus as claimed in claim 5, further comprising a gripping device for gripping the glass substrate and moving the glass substrate and the flexible substrate to separate the flexible substrate from the carrying platform.
7. The peeling apparatus as claimed in claim 6, wherein the glass substrate further comprises a retaining section, and the grasping device comprises an adsorption platform for generating a negative pressure and adsorbing the retaining section to grasp the retaining section.
8. The peeling apparatus as claimed in claim 5, further comprising a carrying platform for carrying the separated cut section and the peeled flexible substrate, and further comprising a cutting device for cutting the cut section and the flexible substrate corresponding to the cut section.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2017/092372 WO2019010607A1 (en) | 2017-07-10 | 2017-07-10 | Peeling method and peeling device for flexible substrate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109791319A CN109791319A (en) | 2019-05-21 |
| CN109791319B true CN109791319B (en) | 2022-05-17 |
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| CN201780058750.6A Active CN109791319B (en) | 2017-07-10 | 2017-07-10 | Method and apparatus for peeling flexible substrate |
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| WO (1) | WO2019010607A1 (en) |
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| CN112340522A (en) * | 2019-08-09 | 2021-02-09 | 格力电器（石家庄）有限公司 | Sponge pastes dress device, production line |
| US20240075732A1 (en) * | 2021-02-23 | 2024-03-07 | Beijing Boe Sensor Technology Co., Ltd. | Peeling system and peeling method for flexible fingerprint component |
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| CN109791319A (en) | 2019-05-21 |
| WO2019010607A1 (en) | 2019-01-17 |
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