CN109759819B - Automatic mounting device for wafer - Google Patents
Automatic mounting device for wafer Download PDFInfo
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- CN109759819B CN109759819B CN201910203382.0A CN201910203382A CN109759819B CN 109759819 B CN109759819 B CN 109759819B CN 201910203382 A CN201910203382 A CN 201910203382A CN 109759819 B CN109759819 B CN 109759819B
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- fixedly connected
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- pushing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention relates to an automatic mounting device for a wafer, which comprises a flat plate, wherein the upper end surface of the flat plate is fixedly connected with a wafer rotating mechanism, a wafer grabbing mechanism and a graphite disc moving mechanism; the wafer grabbing mechanism is suitable for grabbing the wafer on the wafer rotating mechanism onto the graphite disc of the graphite disc moving mechanism. The wafer grabbing mechanism grabs the wafer on the wafer rotating mechanism onto the graphite disc of the graphite disc moving mechanism, so that the automation of production is realized, the production speed is improved, and the effect of manpower and material resources is saved.
Description
Technical Field
The present invention relates to an automatic wafer mounting apparatus.
Background
At present, in the processing procedure of installing the wafer on the graphite disc, the wafer is generally stored on the wafer expanding ring, the wafer is taken down from the wafer expanding ring in a mode of manually adopting a sucker, after the wafer adsorbed on the sucker is installed on the corresponding position on the graphite disc and one wafer is installed on the corresponding position on the graphite disc each time, the next wafer is required to be taken down again from the wafer expanding ring, a large amount of working time is wasted when the installation position corresponding to the wafer on the graphite disc is found, and the installation position of the wafer is manually found each time, so that the labor is wasted, and the yield cannot meet the market demand.
Disclosure of Invention
The invention aims to solve the technical problem of providing an automatic mounting device for wafers, which is used for solving the problem that the wafers are required to be manually mounted on a graphite disc.
The technical scheme adopted for solving the technical problems is as follows:
the automatic mounting device for the wafer comprises a flat plate, wherein the upper end surface of the flat plate is fixedly connected with a wafer rotating mechanism, a wafer grabbing mechanism and a graphite disc moving mechanism, and the wafer grabbing mechanism is arranged between the wafer rotating mechanism and the graphite disc moving mechanism;
The wafer grabbing mechanism is suitable for grabbing the wafer on the wafer rotating mechanism onto the graphite disc of the graphite disc moving mechanism.
Further, the graphite disc moving mechanism comprises a third sliding table bottom plate, a fourth sliding table bottom plate and a supporting plate for supporting the graphite disc, wherein the lower end of the supporting plate is fixedly connected with a third nut capable of sliding left and right on the third sliding table bottom plate, the third sliding table bottom plate is rotationally connected with a third screw rod, the third nut is in threaded connection with the third screw rod, the side wall surface of the third sliding table bottom plate is fixedly connected with a third motor, an output shaft of the third motor is fixedly connected with the third screw rod, and the third motor drives the third screw rod to rotate so that the supporting plate moves left and right above the flat plate;
The lower end of the third sliding table bottom plate is fixedly connected with a fourth nut which can slide back and forth on the fourth sliding table bottom plate, the fourth sliding table bottom plate is rotationally connected with a fourth screw rod, the fourth nut is in threaded connection with the fourth screw rod, the side wall surface of the fourth sliding table bottom plate is fixedly connected with a fourth motor, an output shaft of the fourth motor is fixedly connected with the fourth screw rod, and the fourth motor drives the fourth screw rod to rotate so that the supporting plate moves back and forth above the flat plate;
the left end of the supporting plate is fixedly connected with a positioning plate, the right end of the supporting plate is slidably connected with a clamping plate, and a fixing area for clamping the graphite disc is formed among the upper end face of the supporting plate, the right end face of the positioning plate and the left end face of the clamping plate;
The positioning plate is provided with a clamping cylinder, the upper end of the positioning plate is provided with an avoidance groove, the cylinder body of the clamping cylinder is fixedly connected to the left end face of the positioning plate, a push rod of the clamping cylinder is fixedly connected with a compression block used for sliding in the avoidance groove, and the clamping cylinder drives the compression block to slide left and right so that the graphite disc is clamped in the fixed area;
The locating plate is characterized in that a displacement rod is arranged between the locating plate and the clamping plate, one end of the displacement rod is fixedly connected to the locating plate, the other end of the displacement rod is slidably connected to the clamping plate, a locking block is fixedly connected to the clamping plate and matched with the displacement rod, a displacement sliding block is fixedly connected to the lower end of the clamping plate, a displacement guide rail is fixedly connected to the upper end of the supporting plate, the displacement sliding block is slidably connected to the displacement guide rail, and the clamping plate slides left and right on the supporting plate to enable a fixing area to be matched with the graphite disc.
Further, the graphite disc moving mechanism further comprises a cross beam, the cross beam is fixedly connected to the flat plate, a pushing seat is connected to the cross beam in a sliding manner, the front end of the cross beam is fixedly connected with a pushing motor, a main pushing gear is fixedly connected to an output shaft of the pushing motor, a pushing belt is meshed with the main pushing gear, a secondary pushing gear is connected to the rear end of the cross beam in a rotating manner, and the pushing belt is meshed with the secondary pushing gear;
The lower end of the pushing seat is fixedly connected with a toothed plate, a moving gap is formed between the upper end face of the toothed plate and the lower end face of the pushing seat, the pushing belt is arranged in the moving gap, and teeth on the toothed plate are matched with teeth on the pushing belt to drive the pushing seat to move back and forth on the cross beam;
The upper end of the pushing seat is provided with a pushing cylinder, the cylinder body of the pushing cylinder is fixedly connected to the pushing seat, a pushing plate is fixedly connected to a pushing rod of the pushing cylinder, the front end and the rear end of the pushing plate are both connected with pushing pins in a sliding manner, and a buffer spring is arranged between the two pushing pins;
The side wall surface of the flat plate is connected with a material rack in a sliding manner, a plurality of material storage chambers for placing graphite discs are formed in the material rack, a material pushing opening is formed in the left wall surface of the material storage chamber, the material pushing plate is connected in the material pushing opening in a sliding manner, and the material pushing plate slides back and forth and moves the graphite discs in the material storage chamber into a fixed area;
The feeding device comprises a feeding frame, a feeding screw rod, a feeding nut, a feeding motor and a feeding motor, wherein the feeding nut is fixedly connected to the lower end of the feeding frame, the feeding motor is fixedly connected to the side wall surface of the flat plate, the feeding screw rod is fixedly connected to the output shaft of the feeding motor, the feeding nut is in threaded connection with the feeding screw rod, and the feeding motor drives the feeding screw rod to rotate so that the feeding frame moves up and down.
Further, the wafer rotating mechanism comprises a wafer rotating supporting plate, and the lower end of the wafer rotating supporting plate is arranged on the flat plate;
The wafer rotating support plate is provided with a rotating hole, a fixed ring is arranged in the rotating hole, the lower end of the fixed ring is rotationally connected in the rotating hole of the wafer rotating support plate, the upper end of the fixed ring is fixedly connected with a semicircular baffle plate and a spring seat, an L-shaped supporting groove is formed between the side wall surface of the semicircular baffle plate and the upper end surface of the fixed ring, and a clamping area for placing a wafer expanding ring is formed between the spring seat and the supporting groove;
The lower end of the spring seat is fixedly connected to the upper end face of the fixed ring, the left end and the right end of the spring seat are respectively and rotatably connected with a clamping gripper, the clamping gripper comprises a clamping hand end and a jacking end, a spring on the spring seat is jacked on the jacking end of the clamping gripper, and the clamping hand end of the clamping gripper clamps the crystal expanding ring in the clamping area;
the wafer rotating support plate is provided with a first air cylinder, the cylinder body of the first air cylinder is fixedly connected to the upper end face of the wafer rotating support plate, and the push rod of the first air cylinder is tightly propped against the propping ends of the two clamping grippers, so that the clamping ends of the clamping grippers are separated from the wafer expanding ring.
Further, a transposition motor is arranged on the wafer rotating support plate, the flange end of the transposition motor is fixedly connected to the lower end face of the wafer rotating support plate, and the output shaft of the transposition motor penetrates through the wafer rotating support plate;
the outer side surface of the fixed ring is provided with annular teeth, the annular teeth are meshed with a transmission belt, an output gear is fixedly connected to an output shaft of the transposition motor, the output gear is meshed with the transmission belt, and the transposition motor drives the fixed ring to rotate in a rotating hole of the wafer rotating support plate through the transmission belt;
The upper end face of the flat plate is fixedly connected with a first sliding table bottom plate, a first screw rod and a first motor for driving the first screw rod to rotate are arranged on the first sliding table bottom plate, the flange end of the first motor is fixedly connected to the side wall face of the first sliding table bottom plate, and the output shaft of the first motor is fixedly connected to the first screw rod;
the first screw rod is in threaded connection with a first nut capable of sliding left and right on the first sliding table bottom plate, the first nut is fixedly connected to the lower end face of the second sliding table bottom plate, and the first motor drives the first screw rod to rotate so that the second sliding table bottom plate moves left and right above the flat plate;
The second sliding table bottom plate is provided with a second screw rod and a second motor for driving the second screw rod to rotate, the flange end of the second motor is fixedly connected to the side wall surface of the second sliding table bottom plate, and the output shaft of the second motor is fixedly connected to the second screw rod;
the second screw rod is connected with a second nut capable of sliding left and right on the second sliding table bottom plate in a threaded mode, the second nut is fixedly connected to the lower end face of the wafer rotary supporting plate, and the second motor drives the second screw rod to rotate so that the wafer rotary supporting plate moves back and forth above the flat plate.
Further, a jacking mechanism for jacking up the wafer on the wafer expanding ring is arranged on the wafer rotating supporting plate;
The jacking mechanism comprises an adjusting seat and a jacking motor, the lower end face of the adjusting seat is fixedly connected to the upper end face of the flat plate, the flange end of the jacking motor is fixedly connected to the adjusting seat, an eccentric shaft is fixedly connected to the output shaft of the jacking motor, and an eccentric ring is sleeved on the eccentric shaft;
The lifting device is characterized in that a lifting seat is arranged on the adjusting seat, the lower end of the lifting seat is fixedly connected to the upper end of the adjusting seat, a thimble cap capable of sliding up and down is arranged at the upper end of the lifting seat, a through hole penetrating up and down is formed in the lifting seat, a mandrel is connected to the through hole in a sliding mode, the upper end of the mandrel is tightly propped against the thimble cap, the lower end of the mandrel is fixedly connected with a mounting block used for being matched with an eccentric ring, a reset spring is sleeved at the lower end of the mandrel, the lower end of the reset spring is tightly propped against the mounting block, the upper end of the reset spring is tightly propped against the through hole of the lifting seat, a sliding hole is formed in the mounting block, a guide rod is connected to the sliding hole in a sliding mode, the upper end of the guide rod is fixedly connected to the lifting seat, and the lifting motor drives the eccentric ring to rotate so that the mandrel drives the thimble cap to move up and down.
Further, the wafer snatchs mechanism includes the stand, be equipped with fixing base and linking frame on the stand, fixing base fixed connection is on the lateral wall of stand, the lower extreme of linking frame rotates the lower extreme of connection at the fixing base, the upper end fixedly connected with of fixing base gets the material motor, the output shaft fixed connection of getting the material motor is in the upper end of linking frame, linking frame lower extreme fixedly connected with swing arm, a plurality of holes of getting material have been seted up on the swing arm, just get the material motor and drive the linking frame and rotate on the fixing base so that the swing arm snatchs the wafer on the ring that expands to the graphite dish.
Further, the wafer grabbing mechanism further comprises a rotating rod, a fifth sliding table bottom plate and a fifth motor;
The lower end of the bottom plate of the fifth sliding table is fixedly connected to the flat plate, the flange end of the fifth motor is fixedly connected to the upper end of the bottom plate of the fifth sliding table, a fifth screw rod is fixedly connected to the output shaft of the fifth motor, and a fifth nut capable of sliding up and down on the bottom plate of the fifth sliding table is connected to the fifth screw rod in a threaded manner;
The fifth nut is fixedly connected with a tray, four guide holes are formed in the tray, wafer guide shafts are slidably connected in the guide holes, a storage area for stacking a plurality of crystal expansion rings is formed between the four wafer guide shafts and the upper end face of the tray, and the fifth motor drives the fifth screw rod to rotate so that the fifth nut drives the crystal expansion rings in the storage area to move up and down;
The rotary rod comprises a fixed end and a material sucking end, four material sucking grippers are fixedly connected to the material sucking end of the rotary rod, and suction cups for sucking the crystal expanding ring are arranged on the material sucking grippers;
The lower extreme fixed connection of stand is on the flat board, fixedly connected with lug on the lateral wall of stand, the upper end fixedly connected with rotating electrical machines of lug, the lower extreme rotation of lug is connected with the rotation axis, the stiff end fixed connection of rotary rod is in the lower extreme of rotation axis, the output shaft fixed connection of rotating electrical machines is in the upper end of rotation axis, just the rotating electrical machines drives the rotary rod and rotates in order to make the sucking disc that the material was grabbed in with the expanded brilliant ring of storage area snatch to graphite dish mobile mechanism's fixed zone.
Further, be equipped with left lens barrel and right lens barrel on the stand, the lower extreme fixedly connected with ring light lamp of left side lens barrel, just ring light lamp sets up towards graphite dish moving mechanism's fixed zone, the lower extreme fixedly connected with light source of right side lens barrel, just the light source sets up towards wafer rotary mechanism's clamping area.
Further, the lower end of the flat plate is fixedly connected with a bracket, and the upper end of the fixed plate is provided with an annular cover for protecting the wafer rotating mechanism, the wafer grabbing mechanism and the graphite disc moving mechanism;
the plate is fixedly connected with a receiving hopper, and the receiving hopper is arranged below the material absorbing gripper.
The beneficial effects of the invention are as follows: the wafer grabbing mechanism grabs the wafer on the wafer rotating mechanism onto the graphite disc of the graphite disc moving mechanism, so that the automation of production is realized, the production speed is improved, and the effect of manpower and material resources is saved.
Drawings
The invention is further described below with reference to the accompanying drawings.
FIG. 1 is a schematic diagram of a single loading and unloading machine of the present invention;
FIG. 2 is an isometric view of a single loading and unloading machine of the present invention;
FIG. 3 is a schematic view of a wafer rotation mechanism in a single loading and unloading machine according to the present invention;
FIG. 4 is an isometric view of a wafer rotation mechanism in a single loading and unloading machine of the present invention;
FIG. 5 is a schematic view of a wafer rotating support plate in a single loading and unloading machine according to the present invention;
FIG. 6 is a schematic view of a lifting mechanism in a single feeding and discharging machine of the present invention;
FIG. 7 is a schematic view of an adjusting seat in a single feeding and discharging machine of the invention;
FIG. 8 is a schematic view of a jack in a single loading and unloading machine of the present invention;
FIG. 9 is a schematic view of a graphite disk moving mechanism in a single loading and unloading machine of the present invention;
FIG. 10 is an isometric view of a graphite disk moving mechanism in a single loading and unloading machine of the present invention;
FIG. 11 is a schematic view of a third slipway bottom plate and a fourth slipway bottom plate in a single loading and unloading machine of the present invention;
FIG. 12 is a schematic view of a single loading and unloading center cross beam of the present invention;
FIG. 13 is a schematic view of a material rack in a single loading and unloading machine of the present invention;
FIG. 14 is a schematic view of a wafer grabbing mechanism in a single loading and unloading machine according to the present invention;
FIG. 15 is a schematic view of a storage area in a single wafer handling mechanism with loading and unloading according to the present invention;
FIG. 16 is a schematic view of a swing arm in a single loading and unloading machine of the present invention;
FIG. 17 is a schematic view of a spin lever in a single loading and unloading machine of the present invention;
wherein; a flat plate 1, a bracket 11, an annular cover 12 and a receiving hopper 13;
The wafer rotating mechanism 2, the wafer rotating support plate 21, the rotating hole 211, the fixing ring 22, the semicircular shutter 221, the spring seat 23, the pinch grip 231, the first cylinder 24, the index motor 25, the output gear 251, the transmission belt 26, the first slide table base plate 27, the first screw rod 271, the first motor 272, the first nut 273, the second slide table base plate 28, the second screw rod 281, the second motor 282, the second nut 283,
The wafer grabbing mechanism 3, the upright posts 31, the rotating rods 32, the material sucking grabs 321, the sucking discs 322, the fifth sliding table bottom plate 33, the fifth motor 34, the fifth screw rod 341, the fifth nuts 342, the tray 35, the wafer guide shafts 351, the lugs 36, the rotating motors 361, the rotating shafts 362, the fixing seats 37, the material taking motors 371, the connecting frames 38, the swing arms 381 and the material taking holes 382;
The graphite disc moving mechanism 4, the third sliding table bottom plate 41, the third lead screw 411, the third motor 412, the fourth nut 413, the fourth sliding table bottom plate 42, the fourth lead screw 421, the fourth motor 422, the pallet 43, the third nut 431, the positioning plate 432, the clamping plate 433, the clamping cylinder 434, the pressing block 44, the displacement rod 45, the locking block 46, the displacement slide block 47, the displacement guide 471, the cross beam 48, the pushing seat 481, the pushing motor 482, the pushing belt 483, the toothed plate 484, the pushing cylinder 485, the pushing plate 486, the pushing pin 487, the buffer spring 488, the material rack 49, the material storage chamber 491, the pushing opening 492, the feeding nut 493, the feeding motor 494, and the feeding lead screw 495;
A crystal expansion ring 5;
The lifting mechanism 6, the adjusting seat 61, the lifting motor 62, the eccentric shaft 63, the lifting seat 64, the thimble cap 641, the mandrel 642, the reset spring 643, the mounting block 65 and the guide rod 66;
a left lens barrel 7, a ring light 71;
Right lens barrel 8, light source 81.
Detailed Description
The invention will now be further described with reference to the accompanying drawings. These drawings are simplified schematic views illustrating the basic structure of the present invention by way of illustration only, and thus show only the constitution related to the present invention.
As shown in fig. 1 to 17;
The utility model provides an automatic installation device for wafer, including dull and stereotyped 1, fixedly connected with wafer rotary mechanism 2, wafer snatch mechanism 3 and graphite dish moving mechanism 4 on the up end of dull and stereotyped 1, wafer snatch mechanism 3 sets up between wafer rotary mechanism 2 and graphite dish moving mechanism 4, wafer snatch mechanism 3 is suitable for snatching the wafer on the wafer rotary mechanism 2 to the graphite dish of graphite dish moving mechanism 4, the lower extreme fixedly connected with support 11 of dull and stereotyped 1, the upper end of fixed plate is equipped with the annular cover 12 that is used for protecting wafer rotary mechanism 2, wafer snatch mechanism 3 and graphite dish moving mechanism 4.
The graphite disc moving mechanism 4 comprises a third sliding table bottom plate 41, a fourth sliding table bottom plate 42 and a supporting plate 43 for supporting the graphite disc, wherein the lower end of the supporting plate 43 is fixedly connected with a third nut 431 capable of sliding left and right on the third sliding table bottom plate 41, the third sliding table bottom plate 41 is rotatably connected with a third screw rod 411, the third nut 431 is in threaded connection with the third screw rod 411, the side wall surface of the third sliding table bottom plate 41 is fixedly connected with a third motor 412, the output shaft of the third motor 412 is fixedly connected with the third screw rod 411, and the third motor 412 drives the third screw rod 411 to rotate so as to enable the supporting plate 43 to move left and right above the flat plate 1;
The lower end of the third sliding table bottom plate 41 is fixedly connected with a fourth nut 413 which can slide back and forth on the fourth sliding table bottom plate 42, the fourth sliding table bottom plate 42 is rotationally connected with a fourth screw rod 421, the fourth nut 413 is in threaded connection with the fourth screw rod 421, the side wall surface of the fourth sliding table bottom plate 42 is fixedly connected with a fourth motor 422, an output shaft of the fourth motor 422 is fixedly connected with the fourth screw rod 421, and the fourth motor 422 drives the fourth screw rod 421 to rotate so as to enable the supporting plate 43 to move back and forth above the flat plate 1; the left end of the supporting plate 43 is fixedly connected with a positioning plate 432, the right end of the supporting plate 43 is slidably connected with a clamping plate 433, and a fixing area for clamping the graphite disc is formed among the upper end face of the supporting plate 43, the right end face of the positioning plate 432 and the left end face of the clamping plate 433; the positioning plate 432 is provided with a clamping cylinder 434, the upper end of the positioning plate 432 is provided with an avoidance groove, the cylinder body of the clamping cylinder 434 is fixedly connected to the left end surface of the positioning plate 432, a push rod of the clamping cylinder 434 is fixedly connected with a compression block 44 which is used for sliding in the avoidance groove, and the clamping cylinder 434 drives the compression block 44 to slide left and right so that the graphite disc is clamped in a fixed area;
Be equipped with displacement pole 45 between locating plate 432 and the clamping plate 433, the one end fixed connection of displacement pole 45 is on locating plate 432, the other end sliding connection of displacement pole 45 is on clamping plate 433, fixedly connected with latch segment 46 on the clamping plate 433, latch segment 46 with displacement pole 45 cooperatees, the lower extreme fixedly connected with displacement slider 47 of clamping plate 433, the upper end fixedly connected with displacement guide 471 of layer board 43, displacement slider 47 sliding connection is on displacement guide 471, clamping plate 433 slides about on layer board 43 so that the fixed area cooperatees with the graphite dish.
The graphite disc moving mechanism 4 further comprises a cross beam 48, the cross beam 48 is fixedly connected to the flat plate 1, a pushing seat 481 is connected to the cross beam 48 in a sliding manner, a pushing motor 482 is fixedly connected to the front end of the cross beam 48, a main pushing gear is fixedly connected to an output shaft of the pushing motor 482, a pushing belt 483 is meshed with the main pushing gear, a secondary pushing gear is connected to the rear end of the cross beam 48 in a rotating manner, and the pushing belt 483 is meshed with the secondary pushing gear; the lower end of the pushing seat 481 is fixedly connected with a toothed plate 484, a moving gap is formed between the upper end surface of the toothed plate 484 and the lower end surface of the pushing seat 481, the pushing belt 483 is arranged in the moving gap, and teeth on the toothed plate 484 are matched with teeth on the pushing belt 483 to drive the pushing seat 481 to move back and forth on the cross beam 48; the upper end of the pushing seat 481 is provided with a pushing cylinder 485, the cylinder body of the pushing cylinder 485 is fixedly connected to the pushing seat 481, a pushing plate 486 is fixedly connected to the pushing rod of the pushing cylinder 485, the front end and the rear end of the pushing plate 486 are both slidably connected with pushing pins 487, and a buffer spring 488 is arranged between the two pushing pins 487; a material rack 49 is slidably connected to the side wall surface of the flat plate 1, a plurality of material storage chambers 491 for placing graphite discs are formed in the material rack 49, a material pushing opening 492 is formed in the left wall surface of the material storage chamber 491, the material pushing plate 486 is slidably connected to the material pushing opening 492, and the material pushing plate 486 slides back and forth and moves the graphite discs in the material storage chamber 491 to a fixed area; the lower end of the material rack 49 is fixedly connected with a feeding nut 493, the side wall surface of the flat plate 1 is fixedly connected with a feeding motor 494, the output shaft of the feeding motor 494 is fixedly connected with a feeding screw 495, the feeding nut 493 is in threaded connection with the feeding screw 495, and the feeding motor 494 drives the feeding screw 495 to rotate so as to enable the material rack 49 to move up and down.
The wafer rotating mechanism 2 comprises a wafer rotating supporting plate 21, and the lower end of the wafer rotating supporting plate 21 is arranged on the flat plate 1; the wafer rotating support plate 21 is provided with a rotating hole 211, a fixed ring 22 is arranged in the rotating hole 211, the lower end of the fixed ring 22 is rotatably connected in the rotating hole 211 of the wafer rotating support plate 21, in order to conveniently control the rotating angle of the fixed ring 22 in the rotating hole 211, an inductor can be arranged on the wafer rotating support plate 21, the upper end of the fixed ring 22 is fixedly connected with a semicircular baffle 221 and a spring seat 23, an L-shaped supporting groove is formed between the side wall surface of the semicircular baffle 221 and the upper end surface of the fixed ring 22, and a clamping area for placing a wafer-expanding ring 5 of a wafer is formed between the spring seat 23 and the supporting groove; the lower end of the spring seat 23 is fixedly connected to the upper end surface of the fixed ring 22, the left end and the right end of the spring seat 23 are respectively and rotatably connected with a clamping jaw 231, the clamping jaw 231 comprises a clamping hand end and a jacking end, a spring on the spring seat 23 is jacked on the jacking end of the clamping jaw 231, and the clamping hand end of the clamping jaw 231 clamps the crystal expanding ring 5 in the clamping area; the wafer rotating support plate 21 is provided with a first cylinder 24, a cylinder body of the first cylinder 24 is fixedly connected to the upper end surface of the wafer rotating support plate 21, a push rod of the first cylinder 24 is tightly pushed against the tightly pushing ends of the two clamping claws 231, and the clamping ends of the clamping claws 231 are separated from the wafer expanding ring 5.
The wafer rotating support plate 21 is provided with a transposition motor 25, a flange end of the transposition motor 25 is fixedly connected to the lower end face of the wafer rotating support plate 21, and an output shaft of the transposition motor 25 passes through the wafer rotating support plate 21; an annular tooth is arranged on the outer side surface of the fixed ring 22, a transmission belt 26 is meshed on the annular tooth, an output gear 251 is fixedly connected to an output shaft of the transposition motor 25, the output gear 251 is meshed with the transmission belt 26, and the transposition motor 25 drives the fixed ring 22 to rotate in a rotation hole 211 of the wafer rotation supporting plate 21 through the transmission belt 26; the upper end face of the flat plate 1 is fixedly connected with a first sliding table bottom plate 27, the first sliding table bottom plate 27 is provided with a first screw rod 271 and a first motor 272 for driving the first screw rod 271 to rotate, a flange end of the first motor 272 is fixedly connected to a side wall face of the first sliding table bottom plate 27, and an output shaft of the first motor 272 is fixedly connected to the first screw rod 271; the first screw rod 271 is in threaded connection with a first nut 273 which can slide left and right on the first sliding table bottom plate 27, the first nut 273 is fixedly connected to the lower end surface of the second sliding table bottom plate 28, and the first motor 272 drives the first screw rod 271 to rotate so as to enable the second sliding table bottom plate 28 to move left and right above the flat plate 1; the second sliding table bottom plate 28 is provided with a second screw rod 281 and a second motor 282 for driving the second screw rod 281 to rotate, a flange end of the second motor 282 is fixedly connected to a side wall surface of the second sliding table bottom plate 28, and an output shaft of the second motor 282 is fixedly connected to the second screw rod 281; the second screw rod 281 is connected with a second nut 283 that can slide left and right on the second sliding table bottom plate 28 in a threaded manner, the second nut 283 is fixedly connected to the lower end surface of the wafer rotating support plate 21, and the second motor 282 drives the second screw rod 281 to rotate so that the wafer rotating support plate 21 moves back and forth above the flat plate 1.
The wafer rotation support plate 21 is provided with a jacking mechanism 6 for jacking up the wafer on the wafer expanding ring 5;
The jacking mechanism 6 comprises an adjusting seat 61 and a jacking motor 62, wherein the lower end surface of the adjusting seat 61 is fixedly connected to the upper end surface of the flat plate 1, the flange end of the jacking motor 62 is fixedly connected to the adjusting seat 61, an eccentric shaft 63 is fixedly connected to the output shaft of the jacking motor 62, and an eccentric ring 631 is sleeved on the eccentric shaft 63; the upper part of the adjusting seat 61 is provided with a jacking seat 64, the lower end of the jacking seat 64 is fixedly connected to the upper end of the adjusting seat 61, the upper end of the jacking seat 64 is provided with a thimble cap 641 which can slide up and down, the jacking seat 64 is provided with a through hole which penetrates up and down, a mandrel 642 is connected in a sliding manner in the through hole, the upper end of the mandrel 642 is tightly jacked on the thimble cap 641, the lower end of the mandrel 642 is fixedly connected with a mounting block 65 which is matched with the eccentric ring 631, the lower end of the mandrel 642 is sleeved with a reset spring 643, the lower end of the reset spring 643 is tightly jacked on the mounting block 65, the upper end of the reset spring 643 is tightly jacked in the through hole of the jacking seat 64, the mounting block 65 is provided with a sliding hole, the sliding connection with a guide rod 66 in the sliding hole is provided with the upper end of the guide rod 66 fixedly connected to the jacking seat 64, and the jacking motor 62 drives the eccentric ring 631 to rotate so that the mandrel 642 drives the thimble cap 641 to move up and down.
The wafer grabbing mechanism 3 comprises a stand column 31, a fixed seat 37 and a connecting frame 38 are arranged on the stand column 31, the fixed seat 37 is fixedly connected to the side wall surface of the stand column 31, the lower end of the connecting frame 38 is rotationally connected to the lower end of the fixed seat 37, the upper end of the fixed seat 37 is fixedly connected with a material taking motor 371, the output shaft of the material taking motor 371 is fixedly connected to the upper end of the connecting frame 38, the lower end of the connecting frame 38 is fixedly connected with a swing arm 381, a plurality of material taking holes 382 are formed in the swing arm 381, and the material taking motor 371 drives the connecting frame 38 to rotate on the fixed seat 37 so that the swing arm 381 grabs a wafer on the wafer expanding ring 5 onto a graphite disc.
The wafer grabbing mechanism 3 further comprises a rotating rod 32, a fifth sliding table bottom plate 33 and a fifth motor 34;
the lower end of the fifth sliding table bottom plate 33 is fixedly connected to the flat plate 1, the flange end of the fifth motor 34 is fixedly connected to the upper end of the fifth sliding table bottom plate 33, a fifth screw rod 341 is fixedly connected to an output shaft of the fifth motor 34, and a fifth nut 342 capable of sliding up and down on the fifth sliding table bottom plate 33 is connected to the fifth screw rod 341 in a threaded manner; the fifth nut 342 is fixedly connected with the tray 35, four guide holes are formed in the tray 35, the wafer guide shafts 351 are slidably connected in the guide holes, a storage area for stacking a plurality of expanding rings 5 is formed between the four wafer guide shafts 351 and the upper end surface of the tray 35, and the fifth motor 34 drives the fifth screw 341 to rotate so that the fifth nut 342 drives the expanding rings 5 in the storage area to move up and down; the rotary rod 32 comprises a fixed end and a material sucking end, four material sucking grippers 321 are fixedly connected to the material sucking end of the rotary rod 32, and suction discs 322 for sucking the crystal expanding ring 5 are arranged on the material sucking grippers 321; the lower extreme fixed connection of stand 31 is on dull and stereotyped 1, fixedly connected with receiving hopper 13 on the dull and stereotyped 1, receiving hopper 13 sets up in the below of inhaling material grab 321. The side wall of the upright column 31 is fixedly connected with a lug 36, the upper end of the lug 36 is fixedly connected with a rotating motor 361, the lower end of the lug 36 is rotationally connected with a rotating shaft 362, the fixed end of the rotating rod 32 is fixedly connected with the lower end of the rotating shaft 362, the output shaft of the rotating motor 361 is fixedly connected with the upper end of the rotating shaft 362, and the rotating motor 361 drives the rotating rod 32 to rotate so that a sucking disc 322 on a sucking gripper 321 grips a crystal expansion ring 5 in a storage area into a fixed area of a graphite disc moving mechanism 4. The upright post 31 is provided with a left lens barrel 7 and a right lens barrel 8, the lower end of the left lens barrel 7 is fixedly connected with a ring light lamp 71, the ring light lamp 71 is arranged towards a fixed area of the graphite disc moving mechanism 4, the lower end of the right lens barrel 8 is fixedly connected with a light source 81, and the light source 81 is arranged towards a clamping area of the wafer rotating mechanism 2.
In actual operation, a plurality of expanding rings 5 with wafers are stacked in a storage area formed between four wafer guide shafts 351 and the upper end face of a tray 35, when a rotating motor 361 drives a rotating rod 32 to rotate so that a sucking disc 322 on a sucking grip 321 grips the expanding rings 5 in the storage area into a clamping area of a wafer rotating mechanism 2, a fifth motor 34 drives a fifth screw 341 to rotate so that a fifth nut 342 drives the expanding rings 5 in the storage area to move upwards for next operation, the expanding rings 5 gripped on a wafer rotating mechanism 2 clamp a fixed ring 22 in the clamping area through the clamping hand ends of two clamping grips 231, and when a jacking motor 62 drives an eccentric ring 631 to rotate so that a spindle 642 drives a thimble cap 641 to move upwards, a wafer on the expanding rings 5 is gripped through a fixed seat 381, a connecting frame 38 is driven to rotate on a connecting frame 37 so that a graphite motor 272 is driven to move upwards to a second support plate 21 in the rotating region of the rotating rod 1 to drive a graphite support plate 21 to rotate a second support plate 21 in the rotating mechanism 2 to grip a rotating the clamping plate 21 in front of the rotating shaft 1, and the rotating rod 21 is driven by a rotating the rotating rod 35 to rotate a second support plate 21 to drive the graphite ring 21 to move the clamping plate 21 in the rotating mechanism to rotate a second support plate 21 in the rotating plate 21 repeatedly;
After the operation of the graphite disks in the fixed area of the graphite disk moving mechanism 4 is completed, the completed graphite disks are taken down, and the pushing motor 482 drives the pushing seat 481 to move back and forth on the cross beam 48, the feeding motor 494 drives the feeding screw 495 to rotate so as to enable the material rack 49 to move upwards, so that the pushing plate 486 pushes the graphite disks in the material storage chamber 491 of the material rack 49 onto the supporting plate 43, and the clamping cylinder 434 drives the compression block 44 to slide left and right so as to clamp the graphite disks in the fixed area, thereby realizing the quick replacement of the graphite disks in the fixed area of the graphite disk moving mechanism 4;
In summary, when the working procedures of the wafer and the graphite disc are carried out, the effect of operation automation is achieved without manual operation, and therefore the production speed is effectively improved.
With the above-described preferred embodiments according to the present invention as an illustration, the above-described descriptions can be used by persons skilled in the relevant art to make various changes and modifications without departing from the scope of the technical idea of the present invention. The technical scope of the present invention is not limited to the description, but must be determined according to the scope of claims.
Claims (7)
1. The automatic mounting device for the wafer is characterized by comprising a flat plate (1), wherein a wafer rotating mechanism (2), a wafer grabbing mechanism (3) and a graphite disc moving mechanism (4) are fixedly connected to the upper end face of the flat plate (1), and the wafer grabbing mechanism (3) is arranged between the wafer rotating mechanism (2) and the graphite disc moving mechanism (4);
The wafer grabbing mechanism (3) is suitable for grabbing the wafer on the wafer rotating mechanism (2) onto a graphite disc of the graphite disc moving mechanism (4);
The wafer rotating mechanism (2) comprises a wafer rotating supporting plate (21), and the lower end of the wafer rotating supporting plate (21) is arranged on the flat plate (1);
the wafer rotating support plate (21) is provided with a rotating hole (211), a fixed ring (22) is arranged in the rotating hole (211), the lower end of the fixed ring (22) is rotationally connected in the rotating hole (211) of the wafer rotating support plate (21), the upper end of the fixed ring (22) is fixedly connected with a semicircular baffle plate (221) and a spring seat (23), an L-shaped supporting groove is formed between the side wall surface of the semicircular baffle plate (221) and the upper end surface of the fixed ring (22), and a clamping area for placing a wafer expanding ring (5) of a wafer is formed between the spring seat (23) and the supporting groove;
the lower end of the spring seat (23) is fixedly connected to the upper end face of the fixed ring (22), the left end and the right end of the spring seat (23) are respectively and rotatably connected with a clamping gripper (231), the clamping gripper (231) comprises a clamping hand end and a jacking end, a spring on the spring seat (23) is jacked on the jacking end of the clamping gripper (231), and the clamping hand end of the clamping gripper (231) clamps the crystal expanding ring (5) in the clamping area;
The wafer rotating support plate (21) is provided with a first air cylinder (24), the cylinder body of the first air cylinder (24) is fixedly connected to the upper end face of the wafer rotating support plate (21), the push rod of the first air cylinder (24) is tightly propped against the propping ends of the two clamping grabs (231), and the clamping ends of the clamping grabs (231) are separated from the wafer expanding ring (5);
The wafer rotating support plate (21) is provided with a transposition motor (25), the flange end of the transposition motor (25) is fixedly connected to the lower end face of the wafer rotating support plate (21), and an output shaft of the transposition motor (25) penetrates through the wafer rotating support plate (21);
An annular tooth is formed on the outer side surface of the fixed ring (22), a transmission belt (26) is meshed with the annular tooth, an output gear (251) is fixedly connected to an output shaft of the transposition motor (25), the output gear (251) is meshed with the transmission belt (26), and the transposition motor (25) drives the fixed ring (22) to rotate in a rotating hole (211) of the wafer rotating supporting plate (21) through the transmission belt (26);
the upper end face of the flat plate (1) is fixedly connected with a first sliding table bottom plate (27), a first screw rod (271) and a first motor (272) for driving the first screw rod (271) to rotate are arranged on the first sliding table bottom plate (27), the flange end of the first motor (272) is fixedly connected to the side wall surface of the first sliding table bottom plate (27), and the output shaft of the first motor (272) is fixedly connected to the first screw rod (271);
the first screw rod (271) is in threaded connection with a first nut (273) capable of sliding left and right on the first sliding table bottom plate (27), the first nut (273) is fixedly connected to the lower end face of the second sliding table bottom plate (28), and the first motor (272) drives the first screw rod (271) to rotate so that the second sliding table bottom plate (28) moves left and right above the flat plate (1);
The second sliding table bottom plate (28) is provided with a second screw rod (281) and a second motor (282) for driving the second screw rod (281) to rotate, the flange end of the second motor (282) is fixedly connected to the side wall surface of the second sliding table bottom plate (28), and the output shaft of the second motor (282) is fixedly connected to the second screw rod (281);
A second nut (283) capable of sliding left and right on the second sliding table bottom plate (28) is connected to the second screw rod (281) in a threaded manner, the second nut (283) is fixedly connected to the lower end face of the wafer rotating support plate (21), and the second motor (282) drives the second screw rod (281) to rotate so that the wafer rotating support plate (21) moves back and forth above the flat plate (1);
A jacking mechanism (6) for jacking up the wafer on the wafer expanding ring (5) is arranged on the wafer rotating supporting plate (21);
The jacking mechanism (6) comprises an adjusting seat (61) and a jacking motor (62), wherein the lower end face of the adjusting seat (61) is fixedly connected to the upper end face of the flat plate (1), the flange end of the jacking motor (62) is fixedly connected to the adjusting seat (61), an eccentric shaft (63) is fixedly connected to the output shaft of the jacking motor (62), and an eccentric ring (631) is sleeved on the eccentric shaft (63);
The automatic lifting device is characterized in that a lifting seat (64) is arranged on the adjusting seat (61), the lower end of the lifting seat (64) is fixedly connected to the upper end of the adjusting seat (61), a lifting cap (641) capable of sliding up and down is arranged at the upper end of the lifting seat (64), a through hole penetrating up and down is formed in the lifting seat (64), a mandrel (642) is connected in the through hole in a sliding mode, the upper end of the mandrel (642) is tightly propped up on the lifting cap (641), the lower end of the mandrel (642) is fixedly connected with a quick mounting (65) matched with an eccentric ring (631), a return spring (643) is sleeved at the lower end of the mandrel (642), the upper end of the return spring (643) is tightly propped up on the quick mounting (65), a sliding hole is formed in the quick mounting (65), a guide rod (66) is slidingly connected in the sliding hole, and the upper end of the guide rod (66) is fixedly connected to the lifting seat (64) and drives the lifting cap (641) to rotate.
2. The automatic wafer mounting device according to claim 1, wherein the graphite disc moving mechanism (4) comprises a third sliding table bottom plate (41), a fourth sliding table bottom plate (42) and a supporting plate (43) for supporting the graphite disc, a third nut (431) capable of sliding left and right on the third sliding table bottom plate (41) is fixedly connected to the lower end of the supporting plate (43), a third screw rod (411) is rotatably connected to the third sliding table bottom plate (41), the third nut (431) is in threaded connection with the third screw rod (411), a third motor (412) is fixedly connected to the side wall surface of the third sliding table bottom plate (41), an output shaft of the third motor (412) is fixedly connected with the third screw rod (411), and the third motor (412) drives the third screw rod (411) to rotate so that the supporting plate (43) moves left and right above the flat plate (1);
The lower end of the third sliding table bottom plate (41) is fixedly connected with a fourth nut (413) which can slide back and forth on the fourth sliding table bottom plate (42), the fourth sliding table bottom plate (42) is rotationally connected with a fourth screw rod (421), the fourth nut (413) is in threaded connection with the fourth screw rod (421), the side wall surface of the fourth sliding table bottom plate (42) is fixedly connected with a fourth motor (422), an output shaft of the fourth motor (422) is fixedly connected with the fourth screw rod (421), and the fourth motor (422) drives the fourth screw rod (421) to rotate so that the supporting plate (43) moves back and forth above the flat plate (1);
The left end of the supporting plate (43) is fixedly connected with a positioning plate (432), the right end of the supporting plate (43) is slidably connected with a clamping plate (433), and a fixing area for clamping the graphite disc is formed among the upper end face of the supporting plate (43), the right end face of the positioning plate (432) and the left end face of the clamping plate (433);
the positioning plate (432) is provided with a clamping cylinder (434), the upper end of the positioning plate (432) is provided with an avoidance groove, the cylinder body of the clamping cylinder (434) is fixedly connected to the left end face of the positioning plate (432), a push rod of the clamping cylinder (434) is fixedly connected with a compression block (44) which slides in the avoidance groove, and the clamping cylinder (434) drives the compression block (44) to slide left and right so that the graphite disc is clamped in a fixed area;
The locating plate (432) and clamping plate (433) between be equipped with displacement pole (45), the one end fixed connection of displacement pole (45) is on locating plate (432), the other end sliding connection of displacement pole (45) is on clamping plate (433), fixedly connected with latch segment (46) on clamping plate (433), latch segment (46) with displacement pole (45) cooperate, the lower extreme fixedly connected with displacement slider (47) of clamping plate (433), the upper end fixedly connected with displacement guide rail (471) of layer board (43), displacement slider (47) sliding connection is on displacement guide rail (471), clamping plate (433) are left and right sliding so that the fixed area cooperatees with the graphite dish on layer board (43).
3. The automatic wafer mounting device according to claim 2, wherein the graphite disc moving mechanism (4) further comprises a cross beam (48), the cross beam (48) is fixedly connected to the flat plate (1), a pushing seat (481) is connected to the cross beam (48) in a sliding manner, a pushing motor (482) is fixedly connected to the front end of the cross beam (48), a main pushing gear is fixedly connected to an output shaft of the pushing motor (482), a pushing belt (483) is meshed with the main pushing gear, a secondary pushing gear is connected to the rear end of the cross beam (48) in a rotating manner, and the pushing belt (483) is meshed with the secondary pushing gear;
The lower end of the pushing seat (481) is fixedly connected with a toothed plate (484), a moving gap is formed between the upper end face of the toothed plate (484) and the lower end face of the pushing seat (481), the pushing belt (483) is arranged in the moving gap, and teeth on the toothed plate (484) are matched with teeth on the pushing belt (483) to drive the pushing seat (481) to move back and forth on the cross beam (48);
the upper end of the pushing seat (481) is provided with a pushing cylinder (485), the cylinder body of the pushing cylinder (485) is fixedly connected to the pushing seat (481), a pushing plate (486) is fixedly connected to a push rod of the pushing cylinder (485), the front end and the rear end of the pushing plate (486) are both slidably connected with pushing pins (487), and a buffer spring (488) is arranged between the two pushing pins (487);
A material rack (49) is connected to the side wall surface of the flat plate (1) in a sliding manner, a plurality of material storage chambers (491) for placing graphite discs are formed in the material rack (49), a material pushing opening (492) is formed in the left wall surface of the material storage chamber (491), a material pushing plate (486) is connected to the material pushing opening (492) in a sliding manner, and the material pushing plate (486) slides back and forth and moves the graphite discs in the material storage chambers (491) to a fixed area;
The feeding device is characterized in that a feeding nut (493) is fixedly connected to the lower end of the material rack (49), a feeding motor (494) is fixedly connected to the side wall surface of the flat plate (1), a feeding screw (495) is fixedly connected to an output shaft of the feeding motor (494), the feeding nut (493) is in threaded connection with the feeding screw (495), and the feeding motor (494) drives the feeding screw (495) to rotate so that the material rack (49) moves up and down.
4. The automatic wafer mounting device according to claim 1, wherein the wafer grabbing mechanism (3) comprises a stand column (31), a fixed seat (37) and a connecting frame (38) are arranged on the stand column (31), the fixed seat (37) is fixedly connected to the side wall surface of the stand column (31), the lower end of the connecting frame (38) is rotatably connected to the lower end of the fixed seat (37), the upper end of the fixed seat (37) is fixedly connected with a material taking motor (371), the output shaft of the material taking motor (371) is fixedly connected to the upper end of the connecting frame (38), the lower end of the connecting frame (38) is fixedly connected with a swing arm (381), a plurality of material taking holes (382) are formed in the swing arm (381), and the material taking motor (371) drives the connecting frame (38) to rotate on the fixed seat (37) so that the swing arm (381) grabs a wafer on the wafer expanding ring (5) onto the graphite disc.
5. The automatic wafer mounting apparatus according to claim 4, wherein the wafer gripping mechanism (3) further includes a rotating lever (32), a fifth slide table base plate (33), and a fifth motor (34);
The lower end of the fifth sliding table bottom plate (33) is fixedly connected to the flat plate (1), the flange end of the fifth motor (34) is fixedly connected to the upper end of the fifth sliding table bottom plate (33), a fifth screw rod (341) is fixedly connected to an output shaft of the fifth motor (34), and a fifth nut (342) capable of sliding up and down on the fifth sliding table bottom plate (33) is connected to the fifth screw rod (341) in a threaded manner;
The fifth nut (342) is fixedly connected with the tray (35), four guide holes are formed in the tray (35), the wafer guide shafts (351) are connected in the guide holes in a sliding mode, a storage area for stacking a plurality of wafer expansion rings (5) is formed between the four wafer guide shafts (351) and the upper end face of the tray (35), and the fifth motor (34) drives the fifth screw rod (341) to rotate so that the fifth nut (342) drives the wafer expansion rings (5) in the storage area to move up and down;
The rotary rod (32) comprises a fixed end and a material sucking end, four material sucking grippers (321) are fixedly connected to the material sucking end of the rotary rod (32), and suction discs (322) for sucking the crystal expanding ring (5) are arranged on the material sucking grippers (321);
The lower extreme fixed connection of stand (31) is on dull and stereotyped (1), fixedly connected with lug (36) on the lateral wall of stand (31), the upper end fixedly connected with rotating electrical machines (361) of lug (36), the lower extreme rotation of lug (36) is connected with rotation axis (362), the stiff end fixed connection of rotary rod (32) is in the lower extreme of rotation axis (362), the output shaft fixed connection of rotating electrical machines (361) is in the upper end of rotation axis (362), just rotating electrical machines (361) drive rotary rod (32) rotate so that inhale sucking disc (322) on material grasp (321) snatch expanded brilliant ring (5) in the holding area to graphite dish mobile mechanism (4) fixed area.
6. The automatic wafer mounting device according to claim 5, wherein a left lens barrel (7) and a right lens barrel (8) are arranged on the upright post (31), a ring light lamp (71) is fixedly connected to the lower end of the left lens barrel (7), the ring light lamp (71) is arranged towards a fixed area of the graphite disc moving mechanism (4), a light source (81) is fixedly connected to the lower end of the right lens barrel (8), and the light source (81) is arranged towards a clamping area of the wafer rotating mechanism (2).
7. The automatic wafer mounting device according to claim 6, wherein a bracket (11) is fixedly connected to the lower end of the flat plate (1), and an annular cover (12) for protecting the wafer rotating mechanism (2), the wafer grabbing mechanism (3) and the graphite disc moving mechanism (4) is arranged at the upper end of the flat plate (1);
The flat plate (1) is fixedly connected with a receiving hopper (13), and the receiving hopper (13) is arranged below the material absorbing grab (321).
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410588421.4A CN118448336A (en) | 2019-03-18 | 2019-03-18 | Wafer rotating mechanism of automatic mounting device for wafer |
| CN201910203382.0A CN109759819B (en) | 2019-03-18 | 2019-03-18 | Automatic mounting device for wafer |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910203382.0A CN109759819B (en) | 2019-03-18 | 2019-03-18 | Automatic mounting device for wafer |
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| CN202410588421.4A Division CN118448336A (en) | 2019-03-18 | 2019-03-18 | Wafer rotating mechanism of automatic mounting device for wafer |
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| CN109759819B true CN109759819B (en) | 2024-06-04 |
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| CN202410588421.4A Pending CN118448336A (en) | 2019-03-18 | 2019-03-18 | Wafer rotating mechanism of automatic mounting device for wafer |
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| CN112713116B (en) * | 2020-12-30 | 2021-12-21 | 江苏新智达新能源设备有限公司 | Get brilliant blue membrane straining device of wafer |
| CN112820685B (en) * | 2020-12-30 | 2022-03-22 | 江苏新智达新能源设备有限公司 | Get brilliant blue membrane fixed establishment of wafer |
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| CN109094919A (en) * | 2018-09-03 | 2018-12-28 | 吴美珍 | Label charging/discharging device and integrated circuit wafer labeling apparatus |
| CN209986481U (en) * | 2019-03-18 | 2020-01-24 | 江苏新智达新能源设备有限公司 | Automatic mounting device for wafer |
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2019
- 2019-03-18 CN CN201910203382.0A patent/CN109759819B/en active Active
- 2019-03-18 CN CN202410588421.4A patent/CN118448336A/en active Pending
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| CN207566455U (en) * | 2017-11-16 | 2018-07-03 | 蓝思智能机器人(长沙)有限公司 | Automatic loading and unloading device and loading and unloading system |
| CN109094919A (en) * | 2018-09-03 | 2018-12-28 | 吴美珍 | Label charging/discharging device and integrated circuit wafer labeling apparatus |
| CN209986481U (en) * | 2019-03-18 | 2020-01-24 | 江苏新智达新能源设备有限公司 | Automatic mounting device for wafer |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109759819A (en) | 2019-05-17 |
| CN118448336A (en) | 2024-08-06 |
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