CN112820685B - Get brilliant blue membrane fixed establishment of wafer - Google Patents
Get brilliant blue membrane fixed establishment of wafer Download PDFInfo
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- CN112820685B CN112820685B CN202011609292.0A CN202011609292A CN112820685B CN 112820685 B CN112820685 B CN 112820685B CN 202011609292 A CN202011609292 A CN 202011609292A CN 112820685 B CN112820685 B CN 112820685B
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- 239000012528 membrane Substances 0.000 title claims description 4
- SGHZXLIDFTYFHQ-UHFFFAOYSA-L Brilliant Blue Chemical compound [Na+].[Na+].C=1C=C(C(=C2C=CC(C=C2)=[N+](CC)CC=2C=C(C=CC=2)S([O-])(=O)=O)C=2C(=CC=CC=2)S([O-])(=O)=O)C=CC=1N(CC)CC1=CC=CC(S([O-])(=O)=O)=C1 SGHZXLIDFTYFHQ-UHFFFAOYSA-L 0.000 title claims description 3
- 230000007246 mechanism Effects 0.000 claims abstract description 39
- 239000013078 crystal Substances 0.000 claims abstract description 26
- 230000005540 biological transmission Effects 0.000 claims description 4
- 235000012431 wafers Nutrition 0.000 abstract description 42
- 238000000034 method Methods 0.000 abstract description 7
- 230000008569 process Effects 0.000 abstract description 6
- 230000003068 static effect Effects 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68318—Auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention provides a wafer blue film fixing mechanism for taking crystals, which comprises a rack, a support ring, an ejector rod, a first motor and a support, wherein the rack comprises a mounting plate arranged along the horizontal direction, a mounting hole is formed in the mounting plate, the support ring is rotatably mounted in the mounting hole, a crystal expansion ring is arranged in the support ring, the first motor is fixedly mounted on the support, an eccentric wheel is mounted on an output shaft of the first motor, the eccentric wheel can drive the ejector rod to move up and down through rotation, the ejector rod is arranged on a horizontal adjusting mechanism, the horizontal adjusting mechanism drives the ejector rod to push wafers at different positions on a wafer blue film upwards to match crystal taking work, the blue film is in a static state in the crystal taking process, the stability in the crystal taking process is improved, and the crystal taking precision is ensured.
Description
Technical Field
The invention relates to the field of electronic element manufacturing, in particular to a wafer blue film fixing mechanism for crystal taking.
Background
In the manufacturing process of the diode package, the wafer stored on the blue film of the wafer needs to be taken out and mounted on the graphite disc, in the prior art, the wafer is generally taken out by matching with the device in a way of moving the blue film, and the way of moving the blue film needs to perform positioning for many times, and the accuracy is not high.
Disclosure of Invention
The invention aims to solve the technical problem that in the prior art, a blue film moving mode is generally matched with a device for crystal taking, and the blue film moving mode needs to perform positioning for many times and is low in accuracy.
The technical scheme adopted by the invention for solving the technical problems is as follows: a wafer blue film fixing mechanism for taking a crystal comprises a rack and a support ring, wherein the rack comprises a mounting plate arranged along the horizontal direction, a mounting hole is formed in the mounting plate, the support ring is rotatably mounted in the mounting hole, the rotating axis of the support ring is arranged along the vertical direction, a crystal expansion ring for placing a wafer blue film is arranged in the support ring, the mechanism also comprises a push rod, a first motor and a support, the first motor is fixedly mounted on the support, the output shaft of the first motor is arranged along the horizontal direction, an eccentric wheel is mounted on the output shaft of the first motor, the push rod is movably mounted on the support along the vertical direction and is positioned below the crystal expansion ring, and the eccentric wheel rotates to drive the push rod to move up and down; the support passes through horizontal adjustment mechanism and sets up in the frame, horizontal adjustment mechanism can drive the support is in horizontal direction adjustment position.
Further: the horizontal adjusting mechanism comprises a transverse guide rail, a transverse lead screw, a transverse sliding block, a second motor, a longitudinal guide rail, a longitudinal lead screw, a longitudinal sliding block and a third motor, the transverse guide rail is fixedly installed on the rack along the horizontal direction, the transverse lead screw is rotatably installed on the transverse guide rail and is arranged in parallel to the transverse guide rail, the transverse sliding block is installed on the transverse lead screw, the transverse lead screw can drive the transverse sliding block to slide along the transverse guide rail through rotation, the second motor is fixedly installed on the rack, and an output shaft of the second motor is fixedly connected with the transverse lead screw and can drive the transverse lead screw to rotate; the longitudinal guide rail is fixedly installed on the transverse sliding block along the horizontal direction and is perpendicular to the transverse guide rail, the longitudinal lead screw is installed on the longitudinal guide rail and is parallel to the longitudinal guide rail, the support is fixedly installed on the longitudinal sliding block, the longitudinal sliding block is installed on the longitudinal lead screw, the longitudinal lead screw rotates to drive the longitudinal sliding block to move along the longitudinal guide rail, the third motor is fixedly installed on the longitudinal guide rail, and an output shaft of the third motor is fixedly connected with the longitudinal lead screw and can drive the longitudinal lead screw to rotate.
Further: be equipped with the annular tooth on the outer wall of support ring, install the fourth motor in the frame, install drive gear on the output shaft of fourth motor, drive gear's rotation axle center is on a parallel with the rotation axle center of support ring, drive gear with the annular tooth passes through the area and connects.
Further: the wafer blue film forming device is characterized in that a half-divided ring is arranged above the support ring, the number of the half-divided rings is two, the two half-divided rings are installed on the support ring through a vertical adjusting mechanism, the vertical adjusting mechanism can drive the two half-divided rings to move in the vertical direction, and the middle of a wafer blue film is tensioned on the wafer expanding ring.
Further: the vertical adjusting mechanism comprises a movable ring and a connecting shaft, the movable ring is sleeved on the periphery of the crystal expansion ring, the two semi-sub-rings are symmetrically arranged on the movable ring, a threaded hole is formed in the movable ring in the vertical direction, the connecting shaft is arranged in the vertical direction, the bottom of the connecting shaft is rotatably arranged on the supporting ring, an external thread matched with the threaded hole is arranged at the top of the connecting shaft, the external thread is arranged in the threaded hole, the connecting shaft can drive the movable ring to move up and down by rotating, the number of the connecting shaft and the number of the threaded holes are equal to a plurality, and the connecting shafts and the threaded holes are circumferentially arranged; the vertical adjusting mechanism further comprises a fifth motor, a connecting frame and a first cylinder, wherein the cylinder body of the first cylinder is fixedly arranged on the frame, the piston rod of the first cylinder is arranged along the horizontal direction and is fixedly connected with the connecting frame, a guide rod is arranged on the connecting frame and is parallel to the piston rod of the first cylinder, a guide sleeve matched with the guide rod is arranged on the frame, the guide rod is inserted into the guide sleeve and can slide along the guide sleeve, the fifth motor is fixedly arranged on the connecting frame, a first helical gear is arranged on an output shaft of the fifth motor, a support shaft is rotatably arranged on the support ring and is arranged along the vertical direction, a second helical gear is fixedly arranged on the support shaft and is meshed with the first helical gear, and rotating wheels are fixedly arranged on the support shaft and the connecting shafts, the rotating wheels are connected through a closed-loop transmission belt to rotate synchronously.
Further: still fixed mounting has a gag lever post on the support ring, the gag lever post sets up along vertical direction, be provided with the second cylinder in the frame, the piston rod of second cylinder sets up along the horizontal direction, fixed mounting has the stopper on the piston rod of second cylinder, be provided with the spacing groove along vertical direction on the stopper, the piston rod work of second cylinder can push away the spacing groove chucking is in on the gag lever post.
The wafer blue film fixing mechanism for crystal taking has the advantages that the ejector rod is arranged on the horizontal adjusting mechanism, the ejector rod is driven by the horizontal adjusting mechanism to upwards push wafers at different positions on the wafer blue film to match with the crystal taking work, the blue film is in a static state in the crystal taking process, the stability in the crystal taking process is improved, and the crystal taking precision is guaranteed.
Drawings
The invention is further illustrated with reference to the following figures and examples.
FIG. 1 is a schematic structural diagram of a wafer blue film fixing mechanism for taking a wafer according to the present invention;
FIG. 2 is a schematic view of the structure of the horizontal adjustment mechanism;
FIG. 3 is a schematic view of a rotational structure of the support ring;
FIG. 4 is a schematic view of the movable ring mounted on the support ring;
FIG. 5 is a schematic view of the structure in which the connecting shaft is mounted in the threaded hole;
fig. 6 is a schematic view of a mounting structure of a fifth motor;
fig. 7 is a schematic structural diagram of a limiting block.
In the figure, the device comprises a frame 1, a frame 2, a support ring 3, a mounting plate 4, a crystal expansion ring 5, a push rod 6, a first motor 7, a support 8, an eccentric wheel 11, a transverse guide rail 12, a transverse screw rod 13, a transverse sliding block 14, a second motor 15, a longitudinal guide rail 16, a longitudinal screw rod 17, a longitudinal sliding block 18, a third motor 21, annular teeth 22, a fourth motor 23, a driving gear 31, a half-split ring 32, a movable ring 321, a threaded hole 33, a connecting shaft 331, an external thread 34, a fifth motor 35, a connecting frame 36, a first air cylinder 37, a guide rod 38, a first bevel gear 39, a supporting shaft 40, a second bevel gear 41, a rotating wheel 42, a limiting rod 43, a second air cylinder 44 and a limiting groove.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention. On the contrary, the embodiments of the invention include all changes, modifications and equivalents coming within the spirit and terms of the claims appended hereto.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "axial", "radial", "circumferential", and the like, indicate orientations and positional relationships based on the orientations and positional relationships shown in the drawings, and are used merely for convenience of description and for simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be considered as limiting the present invention.
Furthermore, the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "connected" and "connected" are to be interpreted broadly, e.g., as being fixed or detachable or integrally connected; can be mechanically or electrically connected; may be directly connected or indirectly connected through an intermediate. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art. In addition, in the description of the present invention, "a plurality" means two or more unless otherwise specified.
Any process or method descriptions in flow charts or otherwise described herein may be understood as representing modules, segments, or portions of code which include one or more executable instructions for implementing specific logical functions or steps of the process, and alternate implementations are included within the scope of the preferred embodiment of the present invention in which functions may be executed out of order from that shown or discussed, including substantially concurrently or in reverse order, depending on the functionality involved, as would be understood by those reasonably skilled in the art of the present invention.
As shown in FIG. 1, the present invention provides a blue film fixing mechanism for a wafer, which comprises a frame 1 and a support ring 2, the frame 1 comprises a mounting plate 3 arranged along the horizontal direction, a mounting hole is arranged in the mounting plate 3, the support ring 2 is rotatably installed in the installation hole, the rotating axis of the support ring 2 is arranged along the vertical direction, the support ring 2 is internally provided with a wafer expanding ring 4 for placing a wafer blue film, and also comprises a mandril 5, a first motor 6 and a bracket 7, the first motor 6 is fixedly arranged on the bracket 7, the output shaft of the first motor 6 is arranged along the horizontal direction, an eccentric wheel 8 is arranged on an output shaft of the first motor 6, the mandril 5 is movably arranged on the bracket 7 along the vertical direction, the eccentric wheel 8 rotates to drive the ejector rod 5 to move up and down; the support 7 is arranged on the rack 1 through a horizontal adjusting mechanism, and the horizontal adjusting mechanism can drive the support 7 to adjust the position in the horizontal direction.
During operation, a wafer blue film is placed on the wafer expanding ring 4, the first motor 6 operates to drive the eccentric wheel 8 to rotate so as to control the ejector rod 5 to move up and down, and the wafer on the wafer blue film is ejected upwards so as to take the wafer conveniently. The support 7 is adjusted through the horizontal adjusting mechanism, and then the ejector rod 5 is controlled to move in the horizontal direction, so that the crystal taking operation of wafers at different positions is met.
Referring to fig. 2, the horizontal adjustment mechanism includes a transverse guide rail 11, a transverse lead screw 12, a transverse slider 13, a second motor 14, a longitudinal guide rail 15, a longitudinal lead screw 16, a longitudinal slider 17, and a third motor 18, the transverse guide rail 11 is fixedly mounted on the frame 1 along a horizontal direction, the transverse lead screw 12 is rotatably mounted on the transverse guide rail 11 and is arranged parallel to the transverse guide rail 11, the transverse slider 13 is mounted on the transverse lead screw 12, the transverse lead screw 12 is rotatably capable of driving the transverse slider 13 to slide along the transverse guide rail 11, the second motor 14 is fixedly mounted on the frame 1, and an output shaft of the second motor 14 is fixedly connected to the transverse lead screw 12 and is capable of driving the transverse lead screw 12 to rotate; the longitudinal guide rail 15 is fixedly installed on the transverse sliding block 13 along the horizontal direction and is perpendicular to the transverse guide rail 11, the longitudinal lead screw 16 is installed on the longitudinal guide rail 15 and is parallel to the longitudinal guide rail 15, the bracket 7 is fixedly installed on the longitudinal sliding block 17, the longitudinal sliding block 17 is installed on the longitudinal lead screw 16, the longitudinal lead screw 16 rotates to drive the longitudinal sliding block 17 to move along the longitudinal guide rail 15, the third motor 18 is fixedly installed on the longitudinal guide rail 15, and an output shaft of the third motor 18 is fixedly connected with the longitudinal lead screw 16 and can drive the longitudinal lead screw 16 to rotate.
During operation, the second motor 14 drives the transverse sliding block 13 to move, so that the mandril 5 has a transverse movement degree of freedom, and the third motor 18 drives the longitudinal sliding block 17 to move, so that the mandril 5 has a longitudinal movement degree of freedom, and therefore the jacking operation of wafers at different positions is met. According to the horizontal adjusting mode of the screw rod sliding block, the moving parameters of the sliding block can be accurately controlled by controlling the rotation quantity of the motor, so that the horizontal position of the ejector rod 5 is accurately controlled, and automatic control is realized.
As shown in fig. 3, the outer wall of the support ring 2 is provided with annular teeth 21, the rack 1 is provided with a fourth motor 22, an output shaft of the fourth motor 22 is provided with a driving gear 23, a rotation axis of the driving gear 23 is parallel to the rotation axis of the support ring 2, and the driving gear 23 is connected with the annular teeth 21 through a belt. The fourth motor 22 works to control the rotation of the support ring 2 to correct the angle position of the blue film of the wafer placed on the wafer expanding disc, so as to avoid the influence of the angle deviation of the blue film of the wafer on the wafer taking work.
As shown in fig. 5 and 6, two half rings 31 are arranged above the support ring 2, the number of the half rings 31 is two, the two half rings 31 are mounted on the support ring 2 through a vertical adjustment mechanism, and the vertical adjustment mechanism can drive the two half rings 31 to move in the vertical direction and tension the middle of the wafer blue film on the wafer expanding ring 4. During feeding, the vertical adjusting mechanism drives the half-split ring 31 to move upwards, so that the half-split ring 31 is far away from the wafer expanding ring 4, then the wafer blue film is placed below the two half-split rings 31, then the vertical adjusting mechanism drives the half-split ring 31 to move downwards, so that the middle part of the wafer blue film is tensioned on the wafer expanding ring 4, and further the wafer blue film is prevented from being loosened to influence the wafer taking precision.
The vertical adjusting mechanism comprises a movable ring 32 and a connecting shaft 33, the movable ring 32 is sleeved on the periphery of the crystal expanding ring 4, the two half rings 31 are symmetrically arranged on the movable ring 32, a threaded hole 321 is formed in the movable ring 32 and arranged in the vertical direction, the connecting shaft 33 is arranged in the vertical direction, the bottom of the connecting shaft 33 is rotatably arranged on the supporting ring 2, an external thread 331 matched with the threaded hole 321 is arranged at the top of the connecting shaft 33, the external thread 331 is arranged in the threaded hole 321, the connecting shaft 33 can drive the movable ring 32 to move up and down by rotating, the number of the connecting shaft 33 and the number of the threaded holes 321 are equal, and the connecting shafts 33 and the threaded holes 321 are circumferentially arranged; the vertical adjusting mechanism further comprises a fifth motor 34, a connecting frame 35 and a first air cylinder 36, wherein the cylinder body of the first air cylinder 36 is fixedly installed on the frame 1, the piston rod of the first air cylinder 36 is arranged along the horizontal direction and is fixedly connected with the connecting frame 35, a guide rod 37 is arranged on the connecting frame 35, the guide rod 37 is arranged in parallel with the piston rod of the first air cylinder 36, a guide sleeve matched with the guide rod 37 is arranged on the frame 1, the guide rod 37 is inserted into the guide sleeve and can slide along the guide sleeve, the fifth motor 34 is fixedly installed on the connecting frame 35, a first bevel gear 38 is installed on the output shaft of the fifth motor 34, a support shaft 39 is rotatably installed on the support ring 2, the support shaft 39 is arranged along the vertical direction, a second bevel gear 40 is fixedly installed on the support shaft 39, and the second bevel gear 40 is meshed with the first bevel gear 38, the supporting shaft 39 and the connecting shafts 33 are fixedly provided with rotating wheels 41, and the rotating wheels 41 are connected through a closed-loop transmission belt to rotate synchronously.
It is shown in combination with fig. 7, still fixed mounting has gag lever post 42 on the support ring 2, gag lever post 42 sets up along vertical direction, be provided with second cylinder 43 in the frame 1, the piston rod of second cylinder 43 sets up along the horizontal direction, fixed mounting has the stopper on the piston rod of second cylinder 43, be provided with spacing groove 44 along vertical direction on the stopper, the piston rod work of second cylinder 43 can push away spacing groove 44 chucking is in on the gag lever post 42.
The fourth motor 22 works to control the supporting ring 2 to rotate, so that the limiting rod 42 rotates to the position of the limiting block, the piston rod of the second cylinder 43 pushes the limiting block to move, and the limiting groove 44 is clamped on the limiting rod 42 to prevent the supporting ring 2 from rotating, then the piston rod of the first cylinder 36 pushes the connecting frame 35 to move, and the first bevel gear 38 and the second bevel gear 40 are engaged, the first bevel gear 38 rotates under the driving of the fifth motor 34 to drive the second bevel gear 40 to rotate, then the rotating wheel 41 is driven to rotate by the closed-loop transmission belt, the rotating wheel 41 drives the connecting shaft 33 to rotate and drive the movable ring 32 to move up and down, the movable ring 32 moves up and down and drives the half-split ring 31 to move up and down for loading and unloading, the first cylinder 36 is then operated so that the first bevel gear 38 is remote from the second bevel gear 40, the second cylinder 43 is operated, the spacing groove 44 is far away from the spacing rod 42 so that the support ring 2 can rotate to correct the angle position of the wafer blue film placed on the wafer expanding disc.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, a schematic representation of the term does not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
In light of the foregoing description of the preferred embodiment of the present invention, many modifications and variations will be apparent to those skilled in the art without departing from the spirit and scope of the invention. The technical scope of the present invention is not limited to the content of the specification, and must be determined according to the scope of the claims.
Claims (4)
1. The utility model provides a get brilliant blue membrane fixed establishment of wafer, includes frame (1) and support ring (2), frame (1) is including mounting panel (3) that set up along the horizontal direction, seted up the mounting hole in mounting panel (3), support ring (2) rotate to be installed in the mounting hole, the rotation axle center of support ring (2) sets up along vertical direction, be equipped with in support ring (2) and be used for placing the brilliant ring (4) of expanding of blue membrane of wafer, its characterized in that:
the automatic crystal expanding device is characterized by further comprising a top rod (5), a first motor (6) and a support (7), wherein the first motor (6) is fixedly installed on the support (7), an output shaft of the first motor (6) is arranged in the horizontal direction, an eccentric wheel (8) is installed on an output shaft of the first motor (6), the top rod (5) is movably installed on the support (7) in the vertical direction and is located below the crystal expanding ring (4), and the eccentric wheel (8) rotates to drive the top rod (5) to move up and down; the support (7) is arranged on the rack (1) through a horizontal adjusting mechanism, and the horizontal adjusting mechanism can drive the support (7) to adjust the position in the horizontal direction;
a half-split ring (31) is arranged above the support ring (2), the number of the half-split rings (31) is two, the two half-split rings (31) are mounted on the support ring (2) through a vertical adjusting mechanism, the vertical adjusting mechanism can drive the two half-split rings (31) to move along the vertical direction, and the middle part of the wafer blue film is tensioned on the wafer expanding ring (4);
the vertical adjusting mechanism comprises a movable ring (32) and a connecting shaft (33), the movable ring (32) is sleeved on the periphery of the crystal expansion ring (4), the two semi-sub-rings (31) are symmetrically arranged on the movable ring (32), the movable ring (32) is provided with a threaded hole (321) arranged along the vertical direction, the connecting shaft (33) is arranged along the vertical direction, the bottom of the connecting shaft (33) is rotatably arranged on the supporting ring (2), the top of the connecting shaft (33) is provided with an external thread (331) matched with the threaded hole (321), the external thread (331) is arranged in the threaded hole (321), the connecting shaft (33) rotates to drive the movable ring (32) to move up and down, the connecting shafts (33) and the threaded holes (321) are multiple in number, and the connecting shafts (33) and the threaded holes (321) are arranged along the circumferential direction;
the vertical adjusting mechanism further comprises a fifth motor (34), a connecting frame (35) and a first air cylinder (36), wherein a cylinder body of the first air cylinder (36) is fixedly installed on the rack (1), a piston rod of the first air cylinder (36) is arranged along the horizontal direction and is fixedly connected with the connecting frame (35), a guide rod (37) is arranged on the connecting frame (35), the guide rod (37) is arranged in parallel with the piston rod of the first air cylinder (36), a guide sleeve matched with the guide rod (37) is arranged on the rack (1), the guide rod (37) is inserted into the guide sleeve and can slide along the guide sleeve, the fifth motor (34) is fixedly installed on the connecting frame (35), a first helical gear (38) is installed on an output shaft of the fifth motor (34), a support shaft (39) is rotatably installed on the support ring (2), the supporting shaft (39) is arranged along the vertical direction, a second bevel gear (40) is fixedly mounted on the supporting shaft (39), the second bevel gear (40) is meshed with the first bevel gear (38), the supporting shaft (39) and the connecting shaft (33) are fixedly mounted with rotating wheels (41), and the rotating wheels (41) are connected through a closed-loop transmission belt to rotate synchronously.
2. The wafer blue film fixing mechanism for crystal picking according to claim 1, wherein: the horizontal adjusting mechanism comprises a transverse guide rail (11), a transverse screw rod (12), a transverse sliding block (13), a second motor (14), a longitudinal guide rail (15), a longitudinal screw rod (16), a longitudinal sliding block (17) and a third motor (18), the transverse guide rail (11) is fixedly arranged on the frame (1) along the horizontal direction, the transverse screw rod (12) is rotatably arranged on the transverse guide rail (11), and is arranged parallel to the transverse guide rail (11), the transverse sliding block (13) is arranged on the transverse screw rod (12), the transverse lead screw (12) rotates to drive the transverse sliding block (13) to slide along the transverse guide rail (11), the second motor (14) is fixedly arranged on the rack (1), and an output shaft of the second motor (14) is fixedly connected with the transverse lead screw (12) and can drive the transverse lead screw (12) to rotate;
the longitudinal guide rail (15) is fixedly installed on the transverse sliding block (13) along the horizontal direction and is perpendicular to the transverse guide rail (11), the longitudinal lead screw (16) is installed on the longitudinal guide rail (15) and is arranged in parallel to the longitudinal guide rail (15), the support (7) is fixedly installed on the longitudinal sliding block (17), the longitudinal sliding block (17) is installed on the longitudinal lead screw (16), the longitudinal lead screw (16) can drive the longitudinal sliding block (17) to move along the longitudinal guide rail (15) in a rotating mode, the third motor (18) is fixedly installed on the longitudinal guide rail (15), and an output shaft of the third motor (18) is fixedly connected with the longitudinal lead screw (16) and can drive the longitudinal lead screw (16) to rotate.
3. The wafer blue film fixing mechanism for crystal picking according to claim 1, wherein: be equipped with annular tooth (21) on the outer wall of support ring (2), install fourth motor (22) on frame (1), install drive gear (23) on the output shaft of fourth motor (22), the rotation axle center of drive gear (23) is on a parallel with the rotation axle center of support ring (2), drive gear (23) with annular tooth (21) are connected through the area.
4. The wafer blue film fixing mechanism for crystal picking according to claim 3, wherein: still fixed mounting has gag lever post (42) on support ring (2), gag lever post (42) set up along vertical direction, be provided with second cylinder (43) on frame (1), the piston rod of second cylinder (43) sets up along the horizontal direction, fixed mounting has the stopper on the piston rod of second cylinder (43), be provided with spacing groove (44) along vertical direction on the stopper, the piston rod work of second cylinder (43) can push away spacing groove (44) chucking is in on gag lever post (42).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011609292.0A CN112820685B (en) | 2020-12-30 | 2020-12-30 | Get brilliant blue membrane fixed establishment of wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011609292.0A CN112820685B (en) | 2020-12-30 | 2020-12-30 | Get brilliant blue membrane fixed establishment of wafer |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112820685A CN112820685A (en) | 2021-05-18 |
| CN112820685B true CN112820685B (en) | 2022-03-22 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011609292.0A Active CN112820685B (en) | 2020-12-30 | 2020-12-30 | Get brilliant blue membrane fixed establishment of wafer |
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| CN (1) | CN112820685B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114664689A (en) * | 2021-12-03 | 2022-06-24 | 江苏稳润光电有限公司 | A pretreatment and crystal expansion equipment for the preparation of digital display module LED devices |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN206584956U (en) * | 2017-03-27 | 2017-10-24 | 江苏新智达新能源设备有限公司 | A kind of Lan Moqujing die bonds mechanism |
| CN109216245A (en) * | 2018-09-21 | 2019-01-15 | 江苏新智达新能源设备有限公司 | Continuous Qu Jing die bond mechanism |
| CN109759819A (en) * | 2019-03-18 | 2019-05-17 | 江苏新智达新能源设备有限公司 | Wafer automatic installation apparatus |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JP4515041B2 (en) * | 2003-04-24 | 2010-07-28 | キヤノンマシナリー株式会社 | Wafer sheet expander |
| JP5269522B2 (en) * | 2008-08-27 | 2013-08-21 | キヤノンマシナリー株式会社 | Expanding device |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN206584956U (en) * | 2017-03-27 | 2017-10-24 | 江苏新智达新能源设备有限公司 | A kind of Lan Moqujing die bonds mechanism |
| CN109216245A (en) * | 2018-09-21 | 2019-01-15 | 江苏新智达新能源设备有限公司 | Continuous Qu Jing die bond mechanism |
| CN109759819A (en) * | 2019-03-18 | 2019-05-17 | 江苏新智达新能源设备有限公司 | Wafer automatic installation apparatus |
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