CN109735058A - A kind of computer circuit board insulating substrate and preparation method thereof - Google Patents
A kind of computer circuit board insulating substrate and preparation method thereof Download PDFInfo
- Publication number
- CN109735058A CN109735058A CN201910059843.1A CN201910059843A CN109735058A CN 109735058 A CN109735058 A CN 109735058A CN 201910059843 A CN201910059843 A CN 201910059843A CN 109735058 A CN109735058 A CN 109735058A
- Authority
- CN
- China
- Prior art keywords
- parts
- circuit board
- insulating substrate
- computer circuit
- ethylhexyl
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The present invention relates to computer circuit board technical fields, disclose a kind of computer circuit board insulating substrate, main includes below according to the raw material of parts by weight: 60-80 parts of epoxy resin, 20-30 parts of phenolic resin, 6-12 parts of calcium carbonate, 4-8 parts of silicon carbide, 6-10 parts of zirconium dioxide, 2-5 parts of calcium stearate, 3-7 parts of titanium dioxide, 4-8 parts of Fypro, 10-20 parts of polyethylene glycol, 2-4 parts of microencapsulated powder oil, 1-2 parts of tri-2-ethylhexyl phosphate, 1-3 parts of 2- ethylhexyl diphenyl phosphate, 1-2 parts of three isooctyl acrylate of phosphorous acid, 2, 4-8 parts of 4- dichlorobenzoperoxide.The invention also discloses the preparation methods of the computer circuit board insulating substrate.Insulating substrate insulation performance prepared by the present invention is strong, has good flame retardant property.
Description
Technical field
The present invention relates to computer circuit board technical field, specifically a kind of computer circuit board insulating substrate and its preparation
Method.
Background technique
Computer is commonly called as computer, is a kind of modern electronic computer device for supercomputing, can carry out numerical value calculating,
Logic calculation can be carried out again, also has the function of store-memory, be that can run according to program, automatic, high speed processing magnanimity number
According to modernization intelligent electronic device；Circuit board is essential element in computer, computer motherboard, calculator memory,
The manufacturing of computer display card be unable to do without circuit board.
Computer hardware can generate heat when working mostly, and wherein processor and video card are two of heat production most serious, place
Reason device core and video card core are respectively mounted on circuit boards, in computer components overload operation or computer hardware aging
In the case of, it may occur that failure generates a large amount of heat or generates electric spark etc., the insulating substrate of ordinary circuit board be easy to by
Puncture or light, so as to cause circuit board burning, not only results in the loss on property, there is also some potential safety problemss.
Summary of the invention
The purpose of the present invention is to provide a kind of computer circuit board insulating substrates, to solve to propose in above-mentioned background technique
The problem of.
To achieve the above object, the invention provides the following technical scheme:
A kind of computer circuit board insulating substrate, including below according to the raw material of parts by weight: 60-80 parts of epoxy resin, phenol
20-30 parts of urea formaldehyde, 6-12 parts of calcium carbonate, 4-8 parts of silicon carbide, 6-10 parts of zirconium dioxide, 2-5 parts of calcium stearate, titanium dioxide 3-7
Part, 4-8 parts of Fypro, 10-20 parts of polyethylene glycol, 2-6 parts of diaminodiphenylsulfone, 2-4 parts of microencapsulated powder oil, tricresyl phosphate
1-2 parts of (2- ethylhexyl) ester, 1-3 parts of 2- ethylhexyl diphenyl phosphate, 2-5 parts of O-phthalic alkanol amides, phosphorous
Sour 1-2 parts of three isooctyl acrylate, 4-8 parts of nonylphenol polyoxyethylene ether, 4-8 parts of 2,4- dichlorobenzoperoxide, inorganic fire retardants
4-8 parts.
As a further solution of the present invention: including below according to the raw material of parts by weight: 65-75 parts of epoxy resin, phenolic aldehyde
22-28 parts of resin, 8-10 parts of calcium carbonate, 5-7 parts of silicon carbide, 7-9 parts of zirconium dioxide, 3-4 parts of calcium stearate, 4-6 parts of titanium dioxide,
5-7 parts of Fypro, 12-18 parts of polyethylene glycol, 3-5 parts of diaminodiphenylsulfone, 2.5-3.5 parts of microencapsulated powder oil, phosphoric acid
Three 1.2-1.8 parts of (2- ethylhexyl) esters, 1.5-2.5 parts of 2- ethylhexyl diphenyl phosphate, O-phthalic alkanol amides
3-4 parts, 1.2-1.8 parts of three isooctyl acrylate of phosphorous acid, 5-7 parts of nonylphenol polyoxyethylene ether, 2,4- dichlorobenzoperoxide 5-7
Part, 5-7 parts of inorganic fire retardants.
As further scheme of the invention: including below according to the raw material of parts by weight: 70 parts of epoxy resin, phenolic aldehyde tree
25 parts of rouge, 9 parts of calcium carbonate, 6 parts of silicon carbide, 8 parts of zirconium dioxide, 3.5 parts of calcium stearate, 5 parts of titanium dioxide, 6 parts of Fypro,
15 parts of polyethylene glycol, 4 parts of diaminodiphenylsulfone, 3 parts of microencapsulated powder oil, 1.5 parts of tri-2-ethylhexyl phosphate, 2- ethyl
2 parts of hexyl diphenyl phosphoester, 3.5 parts of O-phthalic alkanol amides, 1.5 parts of three isooctyl acrylate of phosphorous acid, polyoxyethylene nonyl phenyl
6 parts of vinethene, 6 parts of 2,4- dichlorobenzoperoxide, 6 parts of inorganic fire retardants.
As further scheme of the invention: the Fypro diameter is 2-4 μm, length 3-5mm.
As further scheme of the invention: the inorganic fire retardants is by aluminium hydroxide and magnesium hydroxide by weight 3:
1 mixes.
The preparation method of the computer circuit board insulating substrate, steps are as follows:
1) after calcium carbonate, silicon carbide, zirconium dioxide, calcium stearate, titanium dioxide, polyethylene glycol, inorganic fire retardants being mixed
It is put into mechanical ball grinding machine, ball milling 1-2h, obtains jelly；
2) diaminodiphenylsulfone, microencapsulated powder oil, tricresyl phosphate (2- ethyl hexyl is added in the jelly obtained to step 1)
Base) ester, 2- ethylhexyl diphenyl phosphate, O-phthalic alkanol amides, three isooctyl acrylate of phosphorous acid, polyoxyethylene nonyl phenyl second
Alkene ether, 2,4- dichlorobenzoperoxide stir 20-30min with 300-500r/min, are dried under the conditions of 60-80 DEG C,
Obtain mixture；
3) mixture that step 2) obtains is smashed it through into 200-300 mesh, obtains pulverulent mixture；
4) heating melting after mixing epoxy resin, phenolic resin, heats while stirring, and step 3) is added after melting and obtains
Pulverulent mixture, with 600-800r/min stir 5-10min, add Fypro, with 200-300r/min stir 5-
10min is dispersed by the ultrasonic wave of 30-50KHz in whipping process, is sent into mold after the completion, is carried out cold moudling, is obtained
Obtain prepreg.
Above-mentioned insulating substrate is preparing the application in computer circuit board.
Compared with prior art, the beneficial effects of the present invention are:
For insulating substrate prepared by the present invention under the common mating reaction of various raw materials, intensity is higher, and anti-bending strength is good, no
Easily-deformable or fracture；Insulating substrate insulation performance is strong, even if drain conditions occur, will not be punctured easily；And insulation base
Plate has good flame retardant property, will not be ignited under hot environment, hardware security can be effectively protected, can also protect use
The property of person and personal safety.
Specific embodiment
Below in conjunction with the embodiment of the present invention, technical scheme in the embodiment of the invention is clearly and completely described,
Obviously, described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.Based in the present invention
Embodiment, every other embodiment obtained by those of ordinary skill in the art without making creative efforts, all
Belong to the scope of protection of the invention.
Embodiment 1
A kind of computer circuit board insulating substrate, including below according to the raw material of parts by weight: 60 parts of epoxy resin, phenolic aldehyde tree
20 parts of rouge, 4 parts of silicon carbide, 6 parts of zirconium dioxide, 2 parts of calcium stearate, 3 parts of titanium dioxide, 4 parts of Fypro, gathers 6 parts of calcium carbonate
10 parts of ethylene glycol, 2 parts of diaminodiphenylsulfone, 2 parts of microencapsulated powder oil, 1 part of tri-2-ethylhexyl phosphate, 2- ethylhexyl
1 part of diphenyl phosphoester, 2 parts of O-phthalic alkanol amides, 1 part of three isooctyl acrylate of phosphorous acid, nonylphenol polyoxyethylene ether 4
Part, 4 parts of 2,4- dichlorobenzoperoxide, 4 parts of inorganic fire retardants.
Wherein, the Fypro diameter is 2 μm, length 3mm.
Wherein, the inorganic fire retardants is mixed by aluminium hydroxide and magnesium hydroxide by weight 3:1.
In the present embodiment, the preparation method of the computer circuit board insulating substrate, steps are as follows:
1) after calcium carbonate, silicon carbide, zirconium dioxide, calcium stearate, titanium dioxide, polyethylene glycol, inorganic fire retardants being mixed
It is put into mechanical ball grinding machine, ball milling 1h, obtains jelly；
2) diaminodiphenylsulfone, microencapsulated powder oil, tricresyl phosphate (2- ethyl hexyl is added in the jelly obtained to step 1)
Base) ester, 2- ethylhexyl diphenyl phosphate, O-phthalic alkanol amides, three isooctyl acrylate of phosphorous acid, polyoxyethylene nonyl phenyl second
Alkene ether, 2,4- dichlorobenzoperoxide stir 20min with 300r/min, are dried, mixed under the conditions of 60 DEG C
Object；
3) mixture that step 2) obtains is smashed it through into 200 meshes, obtains pulverulent mixture；
4) heating melting after mixing epoxy resin, phenolic resin, heats while stirring, and step 3) is added after melting and obtains
Pulverulent mixture, with 600r/min stir 5min, add Fypro, with 200r/min stir 5min, whipping process
In dispersed by the ultrasonic wave of 30KHz, after the completion be sent into mold in, carry out cold moudling, obtain prepreg.
Embodiment 2
A kind of computer circuit board insulating substrate, including below according to the raw material of parts by weight: 65 parts of epoxy resin, phenolic aldehyde tree
22 parts of rouge, 5 parts of silicon carbide, 7 parts of zirconium dioxide, 3 parts of calcium stearate, 4 parts of titanium dioxide, 5 parts of Fypro, gathers 8 parts of calcium carbonate
12 parts of ethylene glycol, 5 parts of diaminodiphenylsulfone, 3.5 parts of microencapsulated powder oil, 1.8 parts of tricresyl phosphate (ethylhexyl) ester, ethylhexyl
2.5 parts of diphenyl phosphoester, 4 parts of O-phthalic alkanol amides, 1.8 parts of three isooctyl acrylate of phosphorous acid, Nonyl pheno
7 parts of ether, 2,7 parts of dichlorobenzoperoxide, 7 parts of inorganic fire retardants.
Wherein, the Fypro diameter is 3 μm, length 4mm.
Wherein, the inorganic fire retardants is mixed by aluminium hydroxide and magnesium hydroxide by weight 3:1.
In the present embodiment, the preparation method of the computer circuit board insulating substrate, steps are as follows:
1) after calcium carbonate, silicon carbide, zirconium dioxide, calcium stearate, titanium dioxide, polyethylene glycol, inorganic fire retardants being mixed
It is put into mechanical ball grinding machine, ball milling 1.5h, obtains jelly；
2) diaminodiphenylsulfone, microencapsulated powder oil, tricresyl phosphate (2- ethyl hexyl is added in the jelly obtained to step 1)
Base) ester, 2- ethylhexyl diphenyl phosphate, O-phthalic alkanol amides, three isooctyl acrylate of phosphorous acid, polyoxyethylene nonyl phenyl second
Alkene ether, 2,4- dichlorobenzoperoxide stir 25min with 400r/min, are dried, mixed under the conditions of 70 DEG C
Object；
3) mixture that step 2) obtains is smashed it through into 260 meshes, obtains pulverulent mixture；
4) heating melting after mixing epoxy resin, phenolic resin, heats while stirring, and step 3) is added after melting and obtains
Pulverulent mixture, with 700r/min stir 8min, add Fypro, with 250r/min stir 7min, whipping process
In dispersed by the ultrasonic wave of 40KHz, after the completion be sent into mold in, carry out cold moudling, obtain prepreg.
Embodiment 3
A kind of computer circuit board insulating substrate, including below according to the raw material of parts by weight: 70 parts of epoxy resin, phenolic aldehyde tree
25 parts of rouge, 9 parts of calcium carbonate, 6 parts of silicon carbide, 8 parts of zirconium dioxide, 3.5 parts of calcium stearate, 5 parts of titanium dioxide, 6 parts of Fypro,
15 parts of polyethylene glycol, 4 parts of diaminodiphenylsulfone, 3 parts of microencapsulated powder oil, 1.5 parts of tri-2-ethylhexyl phosphate, 2- ethyl
2 parts of hexyl diphenyl phosphoester, 3.5 parts of O-phthalic alkanol amides, 1.5 parts of three isooctyl acrylate of phosphorous acid, polyoxyethylene nonyl phenyl
6 parts of vinethene, 6 parts of 2,4- dichlorobenzoperoxide, 6 parts of inorganic fire retardants.
Wherein, the Fypro diameter is 3 μm, length 4mm.
Wherein, the inorganic fire retardants is mixed by aluminium hydroxide and magnesium hydroxide by weight 3:1.
In the present embodiment, the preparation method of the computer circuit board insulating substrate, steps are as follows:
1) after calcium carbonate, silicon carbide, zirconium dioxide, calcium stearate, titanium dioxide, polyethylene glycol, inorganic fire retardants being mixed
It is put into mechanical ball grinding machine, ball milling 1.5h, obtains jelly；
2) diaminodiphenylsulfone, microencapsulated powder oil, tricresyl phosphate (2- ethyl hexyl is added in the jelly obtained to step 1)
Base) ester, 2- ethylhexyl diphenyl phosphate, O-phthalic alkanol amides, three isooctyl acrylate of phosphorous acid, polyoxyethylene nonyl phenyl second
Alkene ether, 2,4- dichlorobenzoperoxide stir 25min with 400r/min, are dried, mixed under the conditions of 70 DEG C
Object；
3) mixture that step 2) obtains is smashed it through into 260 meshes, obtains pulverulent mixture；
4) heating melting after mixing epoxy resin, phenolic resin, heats while stirring, and step 3) is added after melting and obtains
Pulverulent mixture, with 700r/min stir 8min, add Fypro, with 250r/min stir 7min, whipping process
In dispersed by the ultrasonic wave of 40KHz, after the completion be sent into mold in, carry out cold moudling, obtain prepreg.
Embodiment 4
A kind of computer circuit board insulating substrate, including below according to the raw material of parts by weight: 75 parts of epoxy resin, phenolic aldehyde tree
28 parts of rouge, 10 parts of calcium carbonate, 7 parts of silicon carbide, 9 parts of zirconium dioxide, 4 parts of calcium stearate, 6 parts of titanium dioxide, 7 parts of Fypro,
18 parts of polyethylene glycol, 3 parts of diaminodiphenylsulfone, 2.5 parts of microencapsulated powder oil, 1.2 parts of tri-2-ethylhexyl phosphate, 2- second
1.5 parts of base hexyl diphenyl phosphoester, 3 parts of O-phthalic alkanol amides, 1.2 parts of three isooctyl acrylate of phosphorous acid, nonyl phenol are poly-
5 parts of ethylene oxide ether, 5 parts of 2,4- dichlorobenzoperoxide, 5 parts of inorganic fire retardants.
Wherein, the Fypro diameter is 3 μm, length 4mm.
Wherein, the inorganic fire retardants is mixed by aluminium hydroxide and magnesium hydroxide by weight 3:1.
In the present embodiment, the preparation method of the computer circuit board insulating substrate, steps are as follows:
1) after calcium carbonate, silicon carbide, zirconium dioxide, calcium stearate, titanium dioxide, polyethylene glycol, inorganic fire retardants being mixed
It is put into mechanical ball grinding machine, ball milling 1.5h, obtains jelly；
2) diaminodiphenylsulfone, microencapsulated powder oil, tricresyl phosphate (2- ethyl hexyl is added in the jelly obtained to step 1)
Base) ester, 2- ethylhexyl diphenyl phosphate, O-phthalic alkanol amides, three isooctyl acrylate of phosphorous acid, polyoxyethylene nonyl phenyl second
Alkene ether, 2,4- dichlorobenzoperoxide stir 25min with 400r/min, are dried, mixed under the conditions of 70 DEG C
Object；
3) mixture that step 2) obtains is smashed it through into 260 meshes, obtains pulverulent mixture；
4) heating melting after mixing epoxy resin, phenolic resin, heats while stirring, and step 3) is added after melting and obtains
Pulverulent mixture, with 700r/min stir 8min, add Fypro, with 250r/min stir 7min, whipping process
In dispersed by the ultrasonic wave of 40KHz, after the completion be sent into mold in, carry out cold moudling, obtain prepreg.
Embodiment 5
A kind of computer circuit board insulating substrate, including below according to the raw material of parts by weight: 80 parts of epoxy resin, phenolic aldehyde tree
30 parts of rouge, 12 parts of calcium carbonate, 8 parts of silicon carbide, 10 parts of zirconium dioxide, 5 parts of calcium stearate, 7 parts of titanium dioxide, 8 parts of Fypro,
20 parts of polyethylene glycol, 6 parts of diaminodiphenylsulfone, 4 parts of microencapsulated powder oil, 2 parts of tri-2-ethylhexyl phosphate, 2- ethyl hexyl
3 parts of base diphenyl phosphoester, 5 parts of O-phthalic alkanol amides, 2 parts of three isooctyl acrylate of phosphorous acid, nonylphenol polyoxyethylene ether 8
Part, 8 parts of 2,4- dichlorobenzoperoxide, 8 parts of inorganic fire retardants.
Wherein, the Fypro diameter is 4 μm, length 5mm.
Wherein, the inorganic fire retardants is mixed by aluminium hydroxide and magnesium hydroxide by weight 3:1.
In the present embodiment, the preparation method of the computer circuit board insulating substrate, steps are as follows:
1) after calcium carbonate, silicon carbide, zirconium dioxide, calcium stearate, titanium dioxide, polyethylene glycol, inorganic fire retardants being mixed
It is put into mechanical ball grinding machine, ball milling 2h, obtains jelly；
2) diaminodiphenylsulfone, microencapsulated powder oil, tricresyl phosphate (2- ethyl hexyl is added in the jelly obtained to step 1)
Base) ester, 2- ethylhexyl diphenyl phosphate, O-phthalic alkanol amides, three isooctyl acrylate of phosphorous acid, polyoxyethylene nonyl phenyl second
Alkene ether, 2,4- dichlorobenzoperoxide stir 30min with 500r/min, are dried, mixed under the conditions of 80 DEG C
Object；
3) mixture that step 2) obtains is smashed it through into 300 meshes, obtains pulverulent mixture；
4) heating melting after mixing epoxy resin, phenolic resin, heats while stirring, and step 3) is added after melting and obtains
Pulverulent mixture, with 800r/min stir 10min, add Fypro, with 300r/min stir 10min, it is stirred
Dispersed in journey by the ultrasonic wave of 50KHz, be sent into mold after the completion, carry out cold moudling, obtains prepreg, i.e.,
It can.
Comparative example 1
Compared with Example 3, zirconium dioxide and 2- ethylhexyl diphenyl phosphate are free of, other are same as Example 3.
Comparative example 2
Compared with Example 3, three isooctyl acrylate of phosphorous acid and 2,4- dichlorobenzoperoxide, other and embodiment are free of
3 is identical.
Comparative example 3
Compared with Example 3, without zirconium dioxide, 2- ethylhexyl diphenyl phosphate, three isooctyl acrylate of phosphorous acid and
2,4- dichlorobenzoperoxides, other are same as Example 3.
Insulating substrate prepared by embodiment 1-5 and comparative example 1-3 is tested for the property, test result is as shown in table 1.
Table 1
From in result above as can be seen that insulating substrate prepared by the present invention under the common mating reaction of various raw materials,
Intensity is higher, and anti-bending strength is good, is unlikely to deform or is broken；Insulating substrate insulation performance is strong, will not even if drain conditions occur
Punctured easily；And insulating substrate has good flame retardant property, will not be ignited, can be effectively protected under hot environment
Hardware security can also protect property and the personal safety of user.
It is obvious to a person skilled in the art that invention is not limited to the details of the above exemplary embodiments, Er Qie
In the case where without departing substantially from spirit or essential attributes of the invention, the present invention can be realized in other specific forms.Therefore, no matter
From the point of view of which point, the present embodiments are to be considered as illustrative and not restrictive, and the scope of the present invention is by appended power
Benefit requires rather than above description limits, it is intended that all by what is fallen within the meaning and scope of the equivalent elements of the claims
Variation is included within the present invention.
In addition, it should be understood that although this specification is described in terms of embodiments, but not each embodiment is only wrapped
Containing an independent technical solution, this description of the specification is merely for the sake of clarity, and those skilled in the art should
It considers the specification as a whole, the technical solutions in the various embodiments may also be suitably combined, forms those skilled in the art
The other embodiments being understood that.
Claims (7)
1. a kind of computer circuit board insulating substrate, which is characterized in that including below according to the raw material of parts by weight: epoxy resin
60-80 parts, 20-30 parts of phenolic resin, 6-12 parts of calcium carbonate, 4-8 parts of silicon carbide, 6-10 parts of zirconium dioxide, calcium stearate 2-5
Part, 3-7 parts of titanium dioxide, 4-8 parts of Fypro, 10-20 parts of polyethylene glycol, 2-6 parts of diaminodiphenylsulfone, microencapsulated powder oil
2-4 parts, 1-2 parts of tri-2-ethylhexyl phosphate, 1-3 parts of 2- ethylhexyl diphenyl phosphate, O-phthalic dialkylaminobenzoic acid acyl
2-5 parts of amine, 1-2 parts of three isooctyl acrylate of phosphorous acid, 4-8 parts of nonylphenol polyoxyethylene ether, 2,4- dichlorobenzoperoxide 4-8
Part, 4-8 parts of inorganic fire retardants.
2. computer circuit board insulating substrate according to claim 1, which is characterized in that including below according to parts by weight
Raw material: 65-75 parts of epoxy resin, 22-28 parts of phenolic resin, 8-10 parts of calcium carbonate, 5-7 parts of silicon carbide, 7-9 parts of zirconium dioxide,
3-4 parts of calcium stearate, 4-6 parts of titanium dioxide, 5-7 parts of Fypro, 12-18 parts of polyethylene glycol, 3-5 parts of diaminodiphenylsulfone,
2.5-3.5 parts of microencapsulated powder oil, 1.2-1.8 parts of tri-2-ethylhexyl phosphate, 2- ethylhexyl diphenyl phosphate
1.5-2.5 parts, 3-4 parts of O-phthalic alkanol amides, 1.2-1.8 parts of three isooctyl acrylate of phosphorous acid, nonylphenol polyoxyethylene ether
5-7 parts, 5-7 parts of 2,4- dichlorobenzoperoxide, 5-7 parts of inorganic fire retardants.
3. computer circuit board insulating substrate according to claim 2, which is characterized in that including below according to parts by weight
Raw material: 70 parts of epoxy resin, 25 parts of phenolic resin, 9 parts of calcium carbonate, 6 parts of silicon carbide, 8 parts of zirconium dioxide, 3.5 parts of calcium stearate,
5 parts of titanium dioxide, 6 parts of Fypro, 15 parts of polyethylene glycol, 4 parts of diaminodiphenylsulfone, 3 parts of microencapsulated powder oil, tricresyl phosphate
1.5 parts of (2- ethylhexyl) ester, 2 parts of 2- ethylhexyl diphenyl phosphate, 3.5 parts of O-phthalic alkanol amides, phosphorous acid
Three 1.5 parts of isooctyl acrylates, 6 parts of nonylphenol polyoxyethylene ether, 6 parts of 2,4- dichlorobenzoperoxide, 6 parts of inorganic fire retardants.
4. computer circuit board insulating substrate according to claim 1, which is characterized in that the Fypro diameter is
2-4 μm, length 3-5mm.
5. computer circuit board insulating substrate according to claim 1, which is characterized in that the inorganic fire retardants is by hydrogen-oxygen
Change aluminium and magnesium hydroxide is mixed by weight 3:1.
6. a kind of preparation method of computer circuit board insulating substrate a method as claimed in any one of claims 1 to 5, which is characterized in that packet
Include following steps:
1) it is put into after mixing calcium carbonate, silicon carbide, zirconium dioxide, calcium stearate, titanium dioxide, polyethylene glycol, inorganic fire retardants
In mechanical ball grinding machine, ball milling 1-2h obtains jelly；
2) diaminodiphenylsulfone, microencapsulated powder oil, tricresyl phosphate (2- ethylhexyl) is added in the jelly obtained to step 1)
Ester, 2- ethylhexyl diphenyl phosphate, O-phthalic alkanol amides, three isooctyl acrylate of phosphorous acid, Nonyl pheno
Ether, 2,4- dichlorobenzoperoxide stir 20-30min with 300-500r/min, are dried, obtained under the conditions of 60-80 DEG C
Obtain mixture；
3) mixture that step 2 obtains is smashed it through into 200-300 mesh, obtains pulverulent mixture；
4) heating melting after mixing epoxy resin, phenolic resin, heats while stirring, and the powder that step 3) obtains is added after melting
Shape mixture, stirs 5-10min with 600-800r/min, adds Fypro, stirs 5- with 200-300r/min
10min is dispersed by the ultrasonic wave of 30-50KHz in whipping process, is sent into mold after the completion, is carried out cold moudling, is obtained
Obtain prepreg.
7. a kind of insulating substrate a method as claimed in any one of claims 1 to 5 is preparing the application in computer circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910059843.1A CN109735058A (en) | 2019-01-22 | 2019-01-22 | A kind of computer circuit board insulating substrate and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910059843.1A CN109735058A (en) | 2019-01-22 | 2019-01-22 | A kind of computer circuit board insulating substrate and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109735058A true CN109735058A (en) | 2019-05-10 |
Family
ID=66365650
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910059843.1A Pending CN109735058A (en) | 2019-01-22 | 2019-01-22 | A kind of computer circuit board insulating substrate and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109735058A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110872430A (en) * | 2019-11-29 | 2020-03-10 | 陕西生益科技有限公司 | High CTI resin composition, prepreg, laminated board and metal foil-clad laminated board |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20140023839A1 (en) * | 2012-07-17 | 2014-01-23 | Elite Electronic Material (Kunshan) Co., Ltd | Halogen-free resin composition, copper clad laminate using the same, and printed circuit board using the same |
| CN104119639A (en) * | 2013-04-24 | 2014-10-29 | 台光电子材料(昆山)有限公司 | Halogen-free resin composition, and copper foil substrate and printed circuit board applying it |
| CN104194271A (en) * | 2014-08-29 | 2014-12-10 | 天津德高化成新材料股份有限公司 | Dielectric composite material for fingerprint sensor induction layer and preparation method thereof |
-
2019
- 2019-01-22 CN CN201910059843.1A patent/CN109735058A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20140023839A1 (en) * | 2012-07-17 | 2014-01-23 | Elite Electronic Material (Kunshan) Co., Ltd | Halogen-free resin composition, copper clad laminate using the same, and printed circuit board using the same |
| CN104119639A (en) * | 2013-04-24 | 2014-10-29 | 台光电子材料(昆山)有限公司 | Halogen-free resin composition, and copper foil substrate and printed circuit board applying it |
| CN104194271A (en) * | 2014-08-29 | 2014-12-10 | 天津德高化成新材料股份有限公司 | Dielectric composite material for fingerprint sensor induction layer and preparation method thereof |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110872430A (en) * | 2019-11-29 | 2020-03-10 | 陕西生益科技有限公司 | High CTI resin composition, prepreg, laminated board and metal foil-clad laminated board |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102660210B (en) | Halogen-free high heat-resistant and heat-conducting resin film and manufacturing method thereof | |
| CN102311612B (en) | Resin composition and resin coated copper foil made of same | |
| CN103160229B (en) | Glue liquor for environment-friendly light laminated board, laminated board and preparation method of glue liquor | |
| CN102732096A (en) | Halogen-free flame-retardant solvent-free double-curing ink composition and preparation method thereof | |
| CN103897346B (en) | A kind of compositions of thermosetting resin | |
| CN109735058A (en) | A kind of computer circuit board insulating substrate and preparation method thereof | |
| CN104497495A (en) | Halogen-free flame-retardant epoxy resin containing mesoporous silicon and preparation method thereof | |
| CN106519601B (en) | A kind of capacitor modified plastics shell | |
| JP2009107165A (en) | Manufacturing method of fire retardant particle board | |
| CN104073132A (en) | Three-proofing (water-proof, moisture-proof and dust-proof) paint for scratch-resistant printed circuit board | |
| CN102304343A (en) | Glue solution for copper-clad substrate, and preparation method thereof | |
| CN101955678B (en) | Flame-retardant thermosetting resin composition and copper-clad plate | |
| CN105744810A (en) | Housing of terminal and mobile terminal | |
| CN106366586B (en) | A kind of capacitor flame retardant plastics shell | |
| CN109535651A (en) | A kind of resin combination and preparation method thereof | |
| CN103963386A (en) | Metal-based CCL (copper clad laminate) and preparation method thereof | |
| CN102675600A (en) | Epoxy resin fire retardant and preparation method thereof | |
| CN104725821A (en) | Phosphorus-nitrogen halogen-free flame-retardant polycarbonate and preparation method thereof | |
| CN109851991A (en) | A kind of halogen-free epoxy resin composition and preparation method thereof and application thereof | |
| CN100546445C (en) | The method of a kind of printed substrate and housing injection moulding thereof and device | |
| CN104152030A (en) | Hot steam corrosion resisting tri-proof paint for printed circuit boards | |
| CN105111764A (en) | Environment-friendly flame-retardant type wood-plastic composite and preparation method thereof | |
| CN103865260B (en) | Improve the composition of plastics glow wire ignition temperature and its preparation method and application | |
| CN104228309A (en) | Preparation method of halogen-free Tg150 copper clad laminate | |
| CN101519562B (en) | Flame-retardant protective coating for bromocarbon acrylic acid printed circuit and preparation method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20190510 |
|
| RJ01 | Rejection of invention patent application after publication |