CN109716503B

CN109716503B - Holding device, inspection method, resin packaging device, resin packaging method, and method for manufacturing resin packaged product

Info

Publication number: CN109716503B
Application number: CN201780055053.5A
Authority: CN
Inventors: 尾张弘树; 高田直毅; 白泽贤典; 中尾聪; 高田准子
Original assignee: Towa Corp
Current assignee: Towa Corp
Priority date: 2016-11-04
Filing date: 2017-09-27
Publication date: 2023-04-14
Anticipated expiration: 2037-09-27
Also published as: TW201818497A; WO2018083918A1; JP6284996B1; KR20190073353A; KR102299836B1; CN109716503A; JP2018074093A; TWI635560B

Abstract

In order to stably hold a deformed object on a table by correcting the deformation of the object even for the object, a holding device includes: a table on which an object is placed; a plurality of suction holes provided on the table and for sucking the object; a sealing member disposed on the table and surrounding the plurality of suction holes; a pressing member for pressing the periphery of the object onto the table at a position where the seal is disposed; and a pressure reducing mechanism connected to the plurality of suction holes.

Description

Holding device, inspection method, resin packaging device, resin packaging method, and method for manufacturing resin packaged product

Technical Field

The invention relates to a holding device, an inspection method, a resin packaging device, a resin packaging method, and a method for manufacturing a resin package.

Background

In recent years, the precision (dimensional precision and the like) required for a resin-encapsulated post-package substrate (including a resin-encapsulated post-package wafer) and the like has been increasing. Therefore, methods of performing measurement and the like by holding a substrate (including a wafer) and the like before or after resin packaging (or before and after resin packaging) are increasing.

Patent document 1 describes a holding device that sucks a substrate through a plurality of suction holes.

Patent document 1: japanese patent laid-open publication No. 2007-201275

However, for example, when electronic components and the like are mounted on a substrate before resin encapsulation, the substrate may be bent (warped or warped) due to the mounting.

After resin encapsulation, when the substrate is cooled and contracted after being taken out from the mold after resin encapsulation, the substrate may be bent due to a difference in thermal expansion coefficient (linear expansion coefficient) between the substrate and the encapsulation resin.

The holding device described in patent document 1 has the following problems: when the substrate is bent, the substrate cannot be stably held. Hereinafter, in the present invention, the terms "substrate warp", "substrate skew", substrate warp ", and the like may be used to cover the cases and be expressed as" substrate deformation ".

Disclosure of Invention

In order to solve the above problems, a holding device according to the present invention includes: a table on which an object is placed; a plurality of suction holes provided on the table and for sucking the object; a sealing member disposed on the table and surrounding the plurality of suction holes; a pressing member that presses the periphery of the object against the table at a position where the seal is disposed; and a pressure reducing mechanism connected to the plurality of suction holes.

In order to solve the above problem, an inspection apparatus according to the present invention includes: a table on which an object is placed; a plurality of suction holes provided on the table and for sucking the object; a sealing member disposed on the table and surrounding the plurality of suction holes; a pressing member that presses the periphery of the object against the table at a position where the seal is disposed; a pressure reducing mechanism connected to the plurality of suction holes; and an inspection mechanism that inspects the object in a state where the object is sucked through the plurality of suction holes by the decompression mechanism after the periphery of the object is pressed by the pressing member.

In order to solve the above problems, an inspection method according to the present invention includes the steps of: placing an object on a table provided with a plurality of suction holes and a seal surrounding the periphery of the plurality of suction holes; pressing the periphery of the object against the table by a pressing member at a position where the seal is disposed; forming a space between the table and the object by pressing a periphery of the object; drawing and clinging the object to the table by sucking air of the space through the plurality of suction holes; and inspecting the object by using an inspection mechanism in a state where the object is closely attached to the table.

According to the present invention, even an object that has been deformed (bent, skewed, or warped), the object can be stably held on the table by correcting the deformation of the object.

Drawings

Fig. 1 isbase:Sub>A schematic view showingbase:Sub>A holding device according to embodiment 1, wherein (base:Sub>A) isbase:Sub>A plan view and (b) isbase:Sub>A sectional view taken along linebase:Sub>A-base:Sub>A.

Fig. 2 (a) to (c) are schematic cross-sectional views showing a process of sucking and adhering the post-package substrate to the stage in embodiment 1.

Fig. 3 is a schematic view showing a holding device according to embodiment 2, wherein (a) is a plan view, and (B) is a sectional view taken along line B-B.

Fig. 4 (a) to (b) are schematic cross-sectional views showing a process of measuring the thickness of a substrate included in the packaged substrate in embodiment 3.

Fig. 5 (a) to (b) are schematic cross-sectional views showing a process of measuring the thickness of the encapsulating resin of the encapsulated substrate in embodiment 4.

Fig. 6 (a) to (c) are schematic cross-sectional views showing the process of measuring the thickness of each of the substrate and the encapsulating resin included in the encapsulated substrate in embodiment 5.

Fig. 7 is a plan view showing a schematic configuration of a resin molding apparatus including an inspection apparatus according to embodiment 6.

Fig. 8 (a) to (d) are schematic cross-sectional views showing a process of resin encapsulation using the resin molding apparatus of embodiment 6.

Detailed Description

Embodiments according to the present invention will be described below with reference to the drawings. Any drawings of the present invention are appropriately omitted or exaggerated for ease of understanding to be drawn schematically. The same reference numerals are used for the same components, and the description thereof is omitted as appropriate. In the present invention, the "object" includes a substrate and a composite body in which an insulator, a conductor, or the like is formed on the substrate. The term "substrate" includes general substrates such as glass epoxy laminates, printed circuit boards, glass substrates and metal substrates, semiconductor wafers, and the like. The "resin package" is an object to be sealed with a resin, and includes a sealed substrate described later.

[ embodiment 1]

(Structure of holding device)

The structure of the holding device according to the present invention will be described with reference to fig. 1. The holding device is a holding device for holding the object on the table by vacuum suction. The object to be held is a substrate or a composite body in which an insulator, a metal, or the like is formed on the substrate. Embodiment 1 shows an example in which a substrate having a rectangular shape is held in close contact with a table. As the substrate, for example, a glass epoxy laminate, a printed circuit board, a ceramic substrate, a lead frame, or the like can be used. Alternatively, a post-package substrate or the like in which a package resin is molded on these substrates may be used.

As shown in fig. 1 (a), the holding device 1 includes a table 2 on which a substrate is placed and a plurality of suction holes 3 provided in the table 2. A plurality of suction holes 3 are formed in a lattice shape on the table 2. In fig. 1, ten suction holes 3 are formed in the long side direction, and five suction holes 3 are formed in the short side direction. Therefore, a total of 50 suction holes 3 are formed on the table 2. As shown in fig. 1 (b), each suction hole 3 penetrates from the front surface to the back surface of the table 2. The number of the suction holes 3 may be arbitrarily set in correspondence with the size of the substrate 4 to be held (a portion indicated by a two-dot chain line in the drawing), the deformed state of the substrate 4 (for example, the skewed or warped state of the substrate), and the like. The plurality of suction holes 3 are connected to a pressure reducing mechanism 6 via pipes 5 connected to the respective suction holes 3. As the pressure reducing mechanism 6, for example, a vacuum pump or the like can be used.

In the holding apparatus 1, a pressing member 7 for pressing the periphery of the substrate 4 against the table 2 is provided in accordance with the shape and size of the substrate 4. The pressing member 7 is configured by, for example, a frame-shaped member having an opening 8 in the vertical direction. The pressing member 7 is a pressing member that presses only the periphery of the substrate 4 and does not press the central portion of the substrate 4 or the like. The pressing member 7 is moved up and down by a driving mechanism (not shown) provided in the holding device 1. As the pressing member 7, a material that suppresses mechanical damage applied to the substrate 4 is preferably used. For example, polyetheretherketone (PEEK: poly Ether Ketone) and the like can be used. A buffer member, an elastic member, or the like may be provided on the bottom surface of the pressing member 7.

As shown in fig. 1 (b), the table 2 is provided with a sealing groove 9 surrounding the periphery of the plurality of suction holes 3. A seal 10 such as an O-ring is disposed in the sealing groove 9. The seal 10 is disposed such that an upper portion of the seal 10 protrudes from the surface of the table 2. The sealing material 10 is preferably made of silicone rubber, fluororubber, or the like. The seal 10 is preferably made of a material having a suitable hardness and being easily stretchable.

A frame-shaped pressing member 7 is disposed above the position where the seal 10 is disposed. The seal 10 is enclosed inside the frame-shaped pressing member 7 in a plan view. As shown in fig. 1 (a), when a state in which the pressing member 7 and the seal 10 are overlapped is drawn as a plan view, the seal 10 is completely enclosed in the pressing member 7. Therefore, although described later, as shown in fig. 2 (b), the periphery of the substrate 4 (in fig. 2, the substrate 11 after sealing) is pressed against the stage 2 while the periphery of the substrate 4 is held between the seal 10 and the pressing member 7 disposed on the stage 2.

(operation of holding device)

With reference to fig. 1 to 2, an operation of holding an object on the table 2 while the object is in close contact with the holding device 1 will be described. Fig. 2 illustrates an example in which a post-package substrate, for example, having a package resin molded on a substrate, is held in close contact with a table 2.

First, as shown in fig. 2 (a), the post-package substrate 11 is placed at a predetermined position on the table 2. The rear substrate 11 includes: a substrate 12 made of, for example, a printed circuit board or a lead frame; and a plurality of chip-like components (not shown) mounted in a plurality of regions of the substrate 12; and an encapsulating resin 13 molded to collectively cover the plurality of regions. If the difference between the thermal expansion coefficient of the substrate 12 and the thermal expansion coefficient of the encapsulating resin 13 is large, the substrate 11 may be deformed when the substrate 11 is taken out from the molding die and the substrate 11 is placed in a normal temperature state lower than the molding temperature. Fig. 2 shows an example in which, as a modification of the package rear substrate 11, for example, a warp such as a projection toward the front surface side (the side on which the package resin 13 is molded) of the package rear substrate 11 occurs.

As shown in fig. 2 (a), if the package rear substrate 11 having a warp such as a protrusion toward the front surface side is placed on the table 2, the package rear substrate 11 and the table 2 do not come into close contact with each other, but a gap 14 is formed between the package rear substrate 11 and the table 2. If the gap 14 is large, the suction force is weak even if the post-package substrate 11 is sucked by the decompression mechanism 6, and there is a possibility that the post-package substrate 11 cannot be sucked to the table 2. Even if the post-package substrate 11 is sucked by the decompression mechanism 6, if air leakage occurs between the post-package substrate 11 and the table 2, the post-package substrate 11 may not be sufficiently sucked to the table 2. This phenomenon is particularly noticeable in the package rear substrate 11 having a large area. The phrase "the packaged substrate 11 cannot be sucked onto the table 2" means that the packaged substrate 11 cannot be brought into close contact with the table 2 by correcting the warpage of the packaged substrate 11 to be flat.

Next, as shown in fig. 2 (b), the pressing member 7 is lowered from the predetermined position by using a driving mechanism (not shown) provided in the holding device 1. The bottom surface of the pressing member 7 is brought into contact with the periphery of the package substrate 11, and the periphery of the package substrate 11 is brought into close contact with the sealing material 10 by the pressing member 7. The periphery of the post-package substrate 11 is pressed against the sealing material 10, and the post-package substrate 11 is further pressed. Thereby, a hermetically sealed space 15 can be formed between the substrate 11 and the table 2 after the sealing by the sealing material 10. Therefore, air can be prevented from leaking to the outside from the sealed space 15 formed between the package rear substrate 11 and the table 2. In this state, it is important to form a hermetically sealed space 15 between the post-package substrate 11 and the table 2 via the sealing material 10, and the periphery of the post-package substrate 11 does not necessarily need to be in close contact with the table 2.

Next, as shown in fig. 2 (c), in a state where the periphery of the post-package substrate 11 is pressed against the table 2 by the pressing member 7 via the seal 10, air present in the sealed space 15 formed between the post-package substrate 11 and the table 2 is sucked by the decompression mechanism 6. By sucking the air existing in the closed space 15, the pressure in the closed space 15 is changed from atmospheric pressure to negative pressure (vacuum). Since the pressure in the sealed space 15 becomes lower than the atmospheric pressure, a force for pressing the packaged substrate 11 against the table 2 is generated by the atmospheric pressure. In other words, the post-package substrate 11 is sucked by the decompression mechanism 6, and the post-package substrate 11 is pulled close to the table 2. This can correct the warpage of the packaged substrate 11 to be flat, and can bring the packaged substrate 11 into close contact with the table 2. By sucking the post-package substrate 11 through the plurality of suction holes 3, the post-package substrate 11 can be held in close contact with the table 2.

As shown in fig. 2 (b), the area occupied by the sealed space 15 formed between the substrate 11 and the stage 2 after the sealing corresponds to a vacuum suction area (pressure receiving area). Specifically, the area of the space region in the region a shown in fig. 2 (b), that is, the surface area of the substrate 12 side of the post-package substrate 11 not in contact with the stage 2 corresponds to the pressure receiving area. The larger the pressure-receiving area is, the larger the force received by the atmospheric pressure is, and the larger the suction force to suck the packaged substrate 11 onto the table 2 is. Therefore, even when the area of the post-package substrate 11 is large or the warpage of the post-package substrate 11 is large, the warpage of the post-package substrate 11 can be corrected to be flat and the post-package substrate 11 can be held in close contact with the table 2.

(Effect)

In the present embodiment, the holding device 1 is a structure including: a stage 2 on which a target package substrate 11 is placed; a plurality of suction holes 3 provided on the table 2 and for sucking the packaged rear substrate 11; a seal 10 provided on the table 2 and surrounding the plurality of suction holes 3; a pressing member 7 for pressing the periphery of the substrate 11 to the table 2 at a position where the sealing member 10 is disposed; and a pressure reducing mechanism 6 connected to the plurality of suction holes 3.

According to this configuration, the sealed space 15 is formed between the post-package substrate 11 and the table 2, and air present in the sealed space 15 is sucked to draw the post-package substrate 11 close to and closely adhere to the table 2. Therefore, the warpage of the post-package substrate 11 can be corrected to be flat, and the post-package substrate 11 can be held in a state of being in close contact with the stage 2.

According to the present embodiment, the table 2 in the holding device 1 is provided with: a plurality of suction holes 3 for sucking the package rear substrate 11 as an object; and a sealing member 10 for surrounding the circumference of the suction hole 3. A pressing member 7 is provided at a position where the sealing material 10 is disposed, and the pressing member 7 presses the periphery of the post-package substrate 11 against the table 2. Even when the packaged substrate 11 is warped, the periphery of the packaged substrate 11 is pressed by the pressing member 7, whereby a hermetically sealed space 15 is formed between the packaged substrate 11 and the table 2 via the sealing material 10.

In this state, the air present in the closed space 15 is sucked using the pressure reducing mechanism 6. Thereby, the pressure in the sealed space 15 becomes lower than the atmospheric pressure, and a force for pressing the packaged substrate 11 against the table 2 is generated by the atmospheric pressure. The substrate 11 is drawn by the decompression mechanism 6 and brought into close contact with the table 2. Therefore, the warpage of the packaged substrate 11 can be corrected to be flat, and the packaged substrate 11 can be held in close contact with the table 2.

According to the present embodiment, the sealed substrate 11 is brought into close contact with the table 2 by sucking air existing in the sealed space 15 formed between the sealed substrate 11 and the table 2. Since the area occupied by the sealed space 15 corresponds to the vacuum pressure receiving area, the larger the area occupied by the sealed space 15 is, the larger the suction force for sucking the packaged substrate 11 to the table 2 becomes. Therefore, even when the area of the post-package substrate 11 is large or when the warpage of the post-package substrate 11 is large, the warpage of the post-package substrate 11 is corrected to be flat, and thus the post-package substrate 11 can be kept in a state of being in close contact with the table 2.

In the present embodiment, the force pressing the post-package substrate 11 against the table 2 is generated by atmospheric pressure. Thus, the warpage of the post-package substrate 11 is corrected to be flat, and the post-package substrate 11 is brought into close contact with the table 2. In this case, the sealed substrate 11 may be slid on the sealing material 10 by relaxing the pressing force of the pressing member 7, by using a material that is easily slippery for the sealing material 10, or the like. This can prevent breakage of the rear package substrate 11 caused when the warpage of the rear package substrate 11 is corrected.

[ embodiment 2]

(Structure of holding device)

The holding device according to embodiment 2 will be described with reference to fig. 3. As shown in fig. 3, the holding device 16 is a holding device for holding a substrate (object) having a circular shape in close contact with a table. As the substrate, a wafer level package in which a package resin is molded on a wafer, or the like can be used.

As shown in fig. 3 (a), the holding device 16 includes a table 17 on which a circular substrate is placed, and a plurality of suction holes 3 provided in the table 17. A plurality of suction holes 3 are formed in the table 17 in a circumferential shape, for example. The number of the suction holes 3 may be arbitrarily set in correspondence with the size of the substrate 18 to be held (a portion indicated by a two-dot chain line in the drawing), the deformed state of the substrate 18 (the state of the substrate being warped or warped, or the like), and the like. The plurality of suction holes 3 are connected to a pressure reducing mechanism 6 via pipes 5 connected to the respective suction holes 3. As the pressure reducing mechanism 6, a vacuum pump or the like can be used.

As in embodiment 1, the holding device 16 is provided with a pressing member 19 for pressing the periphery of the substrate 18 against the table 17 in accordance with the size of the substrate 18. The pressing member 19 is configured by an annular member having an opening 20 in the vertical direction. As the pressing member 19, polyether Ether Ketone (PEEK) or the like can be used. A buffer member, an elastic member, or the like may be provided on the bottom surface of the pressing member 19. The pressing member 19 is moved up and down by a driving mechanism (not shown) provided in the holding device 16.

As shown in fig. 3 (b), the table 17 is provided with a sealing groove 21 surrounding the periphery of the plurality of suction holes 3. A seal 22 is disposed in the seal groove 21. Therefore, the periphery of the substrate 18 is pressed against the table 17 with the periphery of the substrate 18 sandwiched between the seal 22 and the pressing member 19 disposed on the table 17.

A wafer such as a silicon wafer or a compound semiconductor wafer, or a wafer-level package in which a wafer state is resin-encapsulated may be held on the table 17 as the substrate 18. In these cases, for example, an annular pressing member that presses the periphery of the wafer according to the diameter of the wafer may be provided in the holding device 16.

In the present embodiment, a plurality of suction holes 3 are formed in a circumferential shape on the table 17. Without being limited thereto, the positions of the plurality of suction holes 3 may be arbitrarily set. For example, after the manufacturing process in the semiconductor pre-process is completed, the suction holes 3 may be formed so as to correspond to the respective chip regions into which the wafer is divided and singulated.

Since the operation of the holding device 16 is the same as that of the holding device 1 shown in embodiment 1, the description is omitted. The holding device 16 achieves the same effects as the holding device 1 shown in embodiment 1.

Embodiment 3

(Structure of inspection apparatus)

An inspection apparatus used in embodiment 3 will be described with reference to fig. 4. The inspection apparatus is an apparatus in which an inspection mechanism is added to the holding apparatus 1 shown in embodiment 1 or the holding apparatus 16 shown in embodiment 2. By adding the inspection mechanism to the holding device, the holding device can be used as an inspection device. As the inspection mechanism, for example, a mechanism for measuring the thickness of the substrate, a structure for inspecting the surface state of the substrate, and the like are added. The configuration and operation other than the inspection mechanism are the same as those of the holding apparatus 1 according to embodiment 1 or the holding apparatus 16 according to embodiment 2, and therefore, the description thereof is omitted.

The inspection device 23 is configured by further adding an inspection mechanism such as a contact displacement sensor, an optical displacement sensor, or an image processing system to the holding device 1. By providing a contact displacement sensor or an optical displacement sensor as an inspection means, the thickness of the substrate in a state of being closely attached to and held on the table 2 can be accurately measured. By providing an image processing system, as an inspection mechanism, on which a CMOS (Complementary Metal Oxide Semiconductor) image sensor, a CCD (Charge Coupled Device) image sensor, or the like is mounted, surface inspection, defect inspection, pattern inspection, and the like of a substrate can be performed. Since the substrate is held in close contact with the table 2, it is possible to perform an accurate inspection while eliminating the influence of deformation such as warpage or skew. Furthermore, an image recognition system may also be applied to measure the thickness of the substrate held on the table 2. As the image processing, conventional image processing for performing edge detection or the like by binarizing an image captured by a camera may be used.

In fig. 4, a case where a contact displacement sensor is provided as an inspection means will be described. As shown in fig. 4, the inspection device 23 includes a contact displacement sensor 24 above the table 2. The contact displacement sensor 24 is movable in the X direction, the Y direction, and the Z direction by a moving mechanism (not shown) provided in the inspection apparatus 23. By using the contact displacement sensor 24, the thickness of the substrate can be measured at an arbitrary position.

In the inspection apparatus 23, the pressing member 7 presses only the periphery of the substrate, and does not press the central portion of the substrate. That is, the inspection device 23 is configured to be able to inspect the entire region of the package resin of the post-package substrate or the entire region of the semiconductor chip mounted region of the pre-package substrate, which is important for inspection. Therefore, the contact displacement sensor 24 moves in the X direction, the Y direction, and the Z direction in the opening 8 of the pressing member 7. This enables the substrate thickness to be measured at an arbitrary position in the substrate.

In the present embodiment, the inspection device 23 is configured not to press the center portion of the substrate or the like by the pressing member. Thus, even if the rigidity of the table is weak, the central portion of the substrate is prevented from being bent on each table by pressing the central portion of the substrate. In addition, the substrate before packaging prevents the semiconductor chip and the like from being damaged by the pressing member.

(operation of inspection apparatus)

Referring to fig. 4, a case where the packaged substrate 11 having warpage shown in fig. 2 is used as a substrate (target) for inspection is shown. In the present embodiment, an operation of measuring the thickness of the substrate 12 included in the packaged substrate 11 using the inspection device 23, for example, will be described. In the following embodiments, the case where the packaged substrate 11 having warpage is used as a substrate for inspection will be described.

First, as shown in fig. 4 (a), in the inspection apparatus 23, the contact displacement sensor 24 is lowered to be brought into contact with the predetermined position P1 of the stage 2 in a state where the post-package substrate 11 is not mounted on the stage 2. The predetermined position P1 of the table 2 corresponds to a position P2 (see fig. 4 (b)) for measuring the thickness of the substrate 12 included in the packaged substrate 11. At a predetermined position P1 of the table 2, a height position h1 of the table top is measured by the contact displacement sensor 24. The measured height position h1 of the table top is stored in a memory or the like as a reference height of the table 2. The contact displacement sensor 24 is lifted and stands by above the predetermined position P1.

Next, as shown in fig. 4 (b), the packaged substrate 11 having warpage is placed at a predetermined position on the table 2. Next, the pressing member 7 is lowered to press the periphery of the packaged substrate 11 against the table 2. Thereby, a sealed space 15 (see fig. 2) is formed between the substrate 11 and the stage 2 after the sealing by the sealing material. Next, the post-sealing substrate 11 is sucked by the decompression mechanism 6, and the warpage of the post-sealing substrate 11 is corrected to be flat, so that the post-sealing substrate 11 is closely adhered to and held on the table 2. In this state, the warpage of the packaged substrate 11 is corrected and flatly attached to the table 2.

Next, the contact displacement sensor 24 is lowered to come into contact with a predetermined position P2 of the substrate 12 of the post-package substrate 11. At the predetermined position P2 of the substrate 12, the height position h2 of the substrate 12 is measured by the contact displacement sensor 24. Since the substrate 11 is held in flat contact with the table 2 after the encapsulation, the height position h2 of the substrate 12 can be accurately measured. The difference (h 2-h 1) between the measured height position h2 of the substrate 12 and the height position h1 of the table top stored in advance is obtained. The difference (h 2-h 1) corresponds to the thickness of the substrate 12 of the rear package substrate 11 at the predetermined position P2 of the rear package substrate 11. The predetermined position P2 of the substrate 12 and the predetermined position P1 of the table 2 are the same measurement position in plan view. Therefore, the thickness of the substrate 2 at the predetermined position P2 can be accurately determined by determining the difference (h 2-h 1) between the height positions of the two points measured by the contact displacement sensor 24. In this way, the thickness of the substrate 12 included in the post-package substrate 11 can be accurately measured using the inspection device 23 in a state where the post-package substrate 11 is flatly in close contact with the table 2.

(Effect)

In the present embodiment, the inspection device 23 is configured to include: a table 2 on which a target post-package substrate 11 is placed; a plurality of suction holes 3 provided on the table 2 and for sucking the package rear substrate 11; a seal 10 provided on the table 2 and surrounding the plurality of suction holes 3; a pressing member 7 for pressing the periphery of the substrate 11 to the table 2 at a position where the sealing material 10 is disposed; a pressure reducing mechanism 6 connected to the plurality of suction holes 3; and a contact displacement sensor 24 that is an inspection mechanism that inspects the post-package substrate 11 in a state where the periphery of the post-package substrate 11 is pressed by the pressing member 7 and the post-package substrate 11 is sucked by the decompression mechanism 6 through the plurality of suction holes 3.

According to this structure, the sealed space 15 is formed between the packaged substrate 11 having warpage and the table 2 via the sealing member 10. The substrate 11 after the package is pulled close to and brought into close contact with the table 2 by sucking air present in the sealed space 15. The warpage of the packaged substrate 11 can be corrected to be flat, and the packaged substrate 11 can be held in close contact with the table 2. Therefore, the thickness of the substrate 12 of the substrate 11 after packaging can be accurately measured using the contact displacement sensor 24 while eliminating the influence of deformation such as warpage or distortion.

According to the present embodiment, the inspection device 23 is provided with: a pressing member 7 which corresponds to the packaged substrate 11 and presses the periphery of the packaged substrate 11 onto the table 2; and a contact displacement sensor 24 for measuring the thickness of the substrate 11 after packaging. Even when deformation such as warpage or distortion occurs in the packaged substrate 11, the periphery of the packaged substrate 11 is pressed by the pressing member 7, and a hermetically sealed space 15 is formed between the packaged substrate 11 and the table 2 via the sealing member 10.

In this state, the air present in the closed space 15 is sucked using the pressure reducing mechanism 6. This can correct the deformation of the post-package substrate 11 and bring the post-package substrate 11 into close contact with the table 2. In a state where the packaged substrate 11 is in close contact with the table 2, the thickness of the substrate 12 included in the packaged substrate 11 is measured using the contact displacement sensor 24. Therefore, the thickness of the substrate 12 included in the substrate 11 after packaging can be accurately measured while eliminating the influence of deformation such as warpage or distortion.

According to the present embodiment, in the inspection apparatus 23, first, the height position h1 of the table surface at the predetermined position P1 is measured using the contact displacement sensor 24 in a state where the post-package substrate 11 is not mounted on the table 2. Next, the post-package substrate 11 is placed on the table 2, and the warpage of the post-package substrate 11 is corrected to be flat, so that the post-package substrate 11 is brought into close contact with the table 2. In this state, the height position h2 of the substrate 12 at the predetermined position P2 of the packaged substrate 11 is measured using the contact displacement sensor 24. By comparing the measured height position h2 of the substrate 12 with the height position h1 of the table top measured in advance, the thickness of the substrate 12 of the substrate 11 after packaging can be accurately determined. Therefore, the thickness of the substrate 12 included in the substrate 11 after packaging can be accurately measured while eliminating the influence of deformation such as warpage or distortion.

According to the present embodiment, the sealed space 15 formed between the sealed substrate 11 and the table 2 is sucked to bring the sealed substrate 11 into close contact with the table 2. Since the area occupied by the sealed space 15 corresponds to the vacuum pressure receiving area, even when the area of the post-package substrate 11 is large or when the warpage of the post-package substrate 11 is large, the warpage of the post-package substrate 11 can be corrected to be flat, and the post-package substrate 11 can be brought into close contact with the table 2. Therefore, even in the packaged substrate 11 having a large area or the packaged substrate 11 having a large warpage, the thickness of the substrate 12 included in the packaged substrate 11 can be accurately measured in a state where the packaged substrate 11 is in close contact with the table 2.

In this embodiment, for convenience of explanation, a case where only one thickness of the substrate 12 included in the substrate 11 after the package is measured is shown. Without being limited thereto, the thickness of the substrate 12 may be measured in the same manner at a plurality of positions using the contact displacement sensor 24. In this case, the average thickness and the variation of the substrate 12 included in the substrate 11 after packaging can be obtained.

[ embodiment 4]

With reference to fig. 5, an operation of measuring the relative thickness of the encapsulating resin 13 which the substrate 11 has after encapsulation using the inspection device 23 will be described.

First, as shown in fig. 5 (a), the packaged substrate 11 having warpage is placed at a predetermined position on the table 2. Next, the periphery of the substrate 11 after the package is pressed against the table 2 by lowering the pressing member 7. Next, by sucking the post-package substrate 11 by using the decompression mechanism 6, the warpage of the post-package substrate 11 is corrected to be flat, and the post-package substrate 11 is brought into close contact with the table 2. In this state, the post-package substrate 11 is held flat on the table 2.

Next, the contact displacement sensor 24 is lowered to come into contact with the predetermined position P2 of the post-package substrate 11. At the predetermined position P2 of the post-package substrate 11, the height position h2 of the substrate 12 included in the post-package substrate 11 is measured by the contact displacement sensor 24. The measured height position h2 of the substrate 12 is stored in a memory or the like as the relative height of the substrate 12 included in the substrate 11 after packaging.

Next, the contact displacement sensor 24 is raised, and the contact displacement sensor 24 is moved to a predetermined position above the sealing resin 13 of the post-sealing substrate 11. The contact displacement sensor 24 is lowered to contact with a predetermined position P3 of the substrate 11 after packaging. At the predetermined position P3 of the post-package substrate 11, the height position h3 of the post-package substrate 11 is measured by the contact displacement sensor 24. The difference (h 3-h 2) between the measured height position h3 of the packaged substrate 11 and the relative height position h2 of the substrate 12 stored in advance is obtained. The difference (h 3-h 2) corresponds to the relative thickness of the encapsulating resin 13 of the substrate 11 after encapsulation. In a state where the post-package substrate 11 is held flat on the table 2, the relative thickness of the package resin 13 included in the post-package substrate 11 can be determined by measuring the height position h2 of the substrate 12 included in the post-package substrate 11 and the height position h3 of the post-package substrate 11.

According to the present embodiment, the packaged substrate 11 is held in close contact with the table 2 in a state where the warpage thereof is corrected to be flat. Therefore, the contact displacement sensor 24 can be used to measure two height positions, i.e., the height position h2 of the substrate 12 and the height position h3 of the substrate 11, which are provided on the substrate 11 after packaging, while eliminating the influence of deformation such as warpage or skew. Therefore, the thickness of the encapsulating resin 13, which has been difficult to measure in the past, can be easily determined by determining the difference (h 3-h 2) between the measured height positions.

According to the present embodiment, the sealed space 15 formed between the sealed substrate 11 and the table 2 is sucked to bring the sealed substrate 11 into close contact with the table 2. Since the area occupied by the sealed space 15 corresponds to the vacuum pressure receiving area, even when the area of the post-package substrate 11 is large or when the warpage of the post-package substrate 11 is large, the warpage of the post-package substrate 11 can be corrected to be flat and the post-package substrate 11 can be held in close contact with the table 2. Therefore, even in the post-package substrate 11 having a large area or the post-package substrate 11 having a large warpage, the relative thickness of the package resin 13 included in the post-package substrate 11 can be determined in a state where the post-package substrate 11 is in close contact with the table 2.

According to the present embodiment, the relative thickness of the sealing resin 13 included in the post-sealing substrate 11 sealed with resin in the resin molding apparatus can be determined. Therefore, it is possible to easily manage the film thickness of the encapsulating resin 13, which has been difficult to achieve in the related art, in other words, to easily manage the thickness of the package as a final product. This makes it possible to stably and easily manage the molding process in the resin molding apparatus.

In the present embodiment, for convenience of explanation, a case where only one thickness of the sealing resin 13 included in the post-sealing substrate 11 is measured is shown. Without being limited thereto, the thicknesses of the substrate 12 and the substrate 11 after packaging at a plurality of positions may be measured in the same manner using the contact displacement sensor 24. In this case, the average value and the variation of the relative thickness of the encapsulating resin 13 included in the encapsulated substrate 11 can be obtained.

[ embodiment 5]

With reference to fig. 6, an operation of measuring the thickness of the substrate 12 and the thickness of the encapsulating resin 13 at the same position on the encapsulated substrate 11 using the inspection apparatus 23 will be described.

First, as shown in fig. 6 (a), the contact displacement sensor 24 is moved upward from the measurement position in a state where no product is placed on the table 2 in the inspection device 23. Next, the contact displacement sensor 24 is lowered to contact the predetermined position P4 of the table 2. The predetermined position P4 of the table 2 corresponds to a position P5 (see fig. 6 (b)) for measuring the thickness of the substrate 12 included in the pre-package substrate 26 and a position P6 (see fig. 6 (c)) for measuring the thickness of the post-package substrate 11. At a predetermined position P4 of the table 2, a height position h4 of the table top is measured by the contact displacement sensor 24. The measured height position P4 of the table top is stored in a memory or the like as a reference height. The contact displacement sensor 24 is lifted and stands by above the predetermined position P4.

Next, as shown in fig. 6 (b), the pre-package substrate 26 on which the plurality of semiconductor chips 25 are mounted is placed at a predetermined position on the table 2. Next, the periphery of the pre-package substrate 26 is pressed against the table 2 by lowering the pressing member 7. Next, the pre-sealing substrate 26 is sucked by the decompression mechanism 6, and the deformation of the pre-sealing substrate 26 is corrected to bring the pre-sealing substrate 26 into close contact with the table 2. In this state, the deformation of the pre-package substrate 26 is corrected and is flatly brought into close contact with the table 2.

Next, the contact displacement sensor 24 is lowered to come into contact with a predetermined position P5 of the pre-package substrate 26. The predetermined position P5 of the pre-package substrate 26 is a region where the semiconductor chip 25 is not mounted and the upper surface of the substrate 12 is exposed. At the predetermined position P5 of the pre-package substrate 26, the height position h5 of the pre-package substrate 26 is measured by the contact displacement sensor 24. The difference (h 5-h 4) between the measured height position h5 of the pre-package substrate 26 and the reference height position h4 of the table top stored in advance is obtained. The difference (h 5 to h 4) corresponds to the thickness of the substrate 12 of the pre-package substrate 26 at the predetermined position P5 of the pre-package substrate 26. The height position h5 of the substrate 26 before packaging is stored in a memory or the like.

Next, the contact displacement sensor 24 is lifted and stands by above the predetermined position P5. The pressing member 7 is raised and stopped at the original position. The pre-package substrate 26 is taken out from the table 2. In this state, the inspection device 23 returns to the initial standby state.

Next, as shown in fig. 6 (c), the post-package substrate 11 is placed at a predetermined position on the table 2. The rear substrate 11 is a resin-sealed rear substrate in which a front substrate 26 is sealed at a height position h5 measured at the predetermined position P5. Therefore, the pre-package substrate 26 and the post-package substrate 11 are placed at the same position on the table 2 of the inspection apparatus 23. Next, the periphery of the substrate 11 after the package is pressed against the table 2 by lowering the pressing member 7. Next, the post-package substrate 11 is sucked by the decompression mechanism 6, and the deformation of the post-package substrate 11 is corrected to bring the post-package substrate 11 into close contact with the table 2. In this state, the post-package substrate 11 is held flat on the table 2.

Next, the contact displacement sensor 24 is lowered to come into contact with the predetermined position P6 of the post-package substrate 11. At the predetermined position P6 of the post-package substrate 11, the height position h6 of the post-package substrate 11 is measured by the contact displacement sensor 24. The difference (h 6-h 5) between the measured height position h6 of the post-package substrate 11 and the height position h5 of the pre-package substrate 26 stored in advance is obtained. The difference (h 6-h 5) corresponds to the thickness of the sealing resin 13 of the rear substrate 11 at the predetermined position P6 of the rear substrate 11. In this way, the thickness of the substrate 12 and the thickness of the sealing resin 13 included in the post-sealing substrate 11 can be accurately measured at the same position of the post-sealing substrate 11 in a state where the pre-sealing substrate 26 and the post-sealing substrate 11 are held flat by correcting the deformation thereof on the table 2.

According to the present embodiment, in the inspection apparatus 23, the pre-package substrate 26 and the post-package substrate 11 are held in close contact with the table 2 in a state where the distortion is corrected. Therefore, the height position h5 of the substrate 12 and the height position h6 of the substrate 11 can be accurately measured using the contact displacement sensor 24 while eliminating the influence of deformation such as warpage or distortion on the substrate 11 at the same position. Therefore, the thickness of the substrate 12 and the thickness of the sealing resin 13 of the substrate 11 after sealing can be accurately measured from these height positions h6 and h5 and the reference height position h4 of the table at the same position.

According to the present embodiment, even when the area of the substrate is large or when the warp of the substrate is large, the deformation of the pre-package substrate 26 and the post-package substrate 11 can be corrected and held in close contact with the table 2. Therefore, even in the substrate 11 having a large area or the substrate 11 having a large warpage, the thickness of the substrate 12 and the thickness of the encapsulating resin 13 included in the substrate 11 can be accurately measured.

In this embodiment, for convenience of description, a case where only the thickness of one portion of the substrate 12 and the thickness of one portion of the encapsulating resin 13 of the substrate 11 after encapsulation are measured is shown. Without being limited thereto, the thickness of the substrate 12 and the thickness of the encapsulating resin 13 which the substrate 11 has after encapsulation can be measured at a plurality of positions using the contact displacement sensor 24. In this case, the average value and the variation of the thickness of the substrate 12 and the thickness of the sealing resin 13 of the substrate 11 after sealing can be obtained.

In the present embodiment, the reference height position h4 of the table surface, the height position h5 of the substrate 12 of the post-package substrate 11, and the height position h6 of the post-package substrate 11 at the same position are measured using the contact displacement sensor 24, and the thickness of the substrate 12 of the post-package substrate 11 and the thickness of the package resin 13 are determined. Without being limited to this, the measurement of the reference height position h4 of the work top may be performed and the value thereof may be shared, for example, at the start of production. The measurement of the reference height position h4 of the table top is performed, and the value thereof is shared in accordance with the number of times of resin encapsulation. This can reduce the number of measurements of the reference height position h4.

In the present embodiment, the thickness of the substrate 12 and the thickness of the sealing resin 13 are determined for the sealed substrate 11 having a two-layer structure of the substrate 12 and the sealing resin 13, respectively. Without being limited thereto, even a substrate (object) having a structure of three or more layers can measure the height position in each layer. By obtaining the difference between the measured height positions, the thickness of each layer can be accurately obtained.

In the present embodiment, the height position of the pre-package substrate 26 is measured by the contact displacement sensor 24 in a state where the pre-package substrate 26 is in close contact with the table 2. The inspection of the defective state of the semiconductor chip 25, for example, is not limited to the measurement of the height position of the pre-package substrate 26, and may be performed in a state where the pre-package substrate 26 is in close contact with the table 2. In this case, whether the semiconductor chip 25 is normally arranged on the substrate 12 or whether the semiconductor chip 25 is defective or not can be checked using a contact displacement sensor, an optical displacement sensor, an image recognition system, a linear sensor, or the like. When the semiconductor chip 25 is defective, the amount of resin supplied at the time of resin molding can be adjusted. Thus, even when the semiconductor chip is broken in the substrate before packaging, resin molding can be performed with a predetermined package thickness.

[ embodiment 6]

(Structure of resin Molding apparatus)

A resin molding apparatus according to embodiment 6 will be described with reference to fig. 7. The resin molding apparatus shown in fig. 7 is a resin molding apparatus including the inspection apparatus 23 described so far. Fig. 7 shows a resin molding apparatus using, for example, a compression molding method.

The resin molding apparatus 27 includes a substrate supply and storage module 28, an inspection module 29, three molding modules 30A, 30B, and 30C, and a resin supply module 31 as constituent elements. The substrate supply and storage module 28, the inspection module 29, the three molding modules 30A, 30B, and 30C, and the resin supply module 31, which are components, are detachable from and replaceable with respect to other components.

The substrate supply and storage module 28 is provided with: a package front substrate supply unit 32 for supplying the package front substrate 26; a rear substrate storage 33 for storing the rear substrate 11; a substrate mounting unit 34 for transferring the front substrate 26 and the rear substrate 11; and a substrate carrying mechanism 35 for carrying the front substrate 26 and the rear substrate 11. The substrate mounting portion 34 moves in the Y direction in the substrate supply and storage module 28. The substrate transport mechanism 35 moves in the X direction, the Y direction, and the Z direction in the substrate supply and storage module 28, the inspection module 29, and the molding modules 30A, 30B, and 30C. The predetermined position S1 is a position at which the substrate transport mechanism 35 is on standby in an inoperative state.

The inspection module 29 is provided with the inspection device 23 shown in embodiments 3 to 5. The inspection device 23 includes a table 2, a decompression mechanism 6, a pressing member 7, and a contact displacement sensor 24. The inspection device 23 is used to inspect the reference height position of the table 2, the height position of the substrate 12 of the pre-package substrate 26, the height position of the substrate 12 and the height position of the post-package substrate 11, the arrangement state of the semiconductor chips on the pre-package substrate 26, and the like, as necessary.

Each of the molding blocks 30A, 30B, and 30C is provided with a lower mold 36 that can be lifted and lowered, and an upper mold that is disposed to face the lower mold 36 (see fig. 8). A cavity 37 to which a resin material is supplied is provided in the lower die 36. A release film supply mechanism 38 (a rectangular portion indicated by a two-dot chain line in fig. 7) for supplying a long release film is provided in the lower mold 36. Each of the molding modules 30A, 30B, and 30C includes a mold clamping mechanism 39 (a circular portion indicated by a two-dot chain line in fig. 7) for opening and clamping the upper mold and the lower mold 36.

The resin supply module 31 is provided with: an X-Y table 40; a resin storage 41 mounted on the X-Y table 40; a resin material feeding mechanism 42 for feeding a resin material into the resin storage portion 41; and a resin conveying mechanism 43 for conveying the resin storage portion 41. The X-Y table 40 moves in the X direction and the Y direction in the resin supply module 31. The resin conveying mechanism 43 moves in the X direction, the Y direction, and the Z direction in the resin supply module 31 and the respective molding modules 30A, 30B, and 30C. The predetermined position R1 is a position at which the resin conveying mechanism 43 is on standby in an inoperative state.

The substrate supply and storage module 28 is provided with a control unit CTL. The control unit CTL is used to control conveyance of the pre-package substrate 26 and the post-package substrate 11, conveyance of the resin material, mold closing and mold opening of the molding die, thickness measurement of the pre-package substrate 26 and the post-package substrate 11, and the like. The control section CTL may be provided in the inspection module 29, each of the molding modules 30A, 30B, 30C, or the resin supply module 31.

(operation of resin Molding apparatus)

With reference to fig. 7 to 8, an operation of resin encapsulation using the resin molding apparatus 27 will be described. First, in the substrate supply and storage module 28, the pre-package substrate 26 is sent from the pre-package substrate supply unit 32 to the substrate placement unit 34. The substrate transport mechanism 35 moves in the-Y direction from the predetermined position S1, and the substrate transport mechanism 35 receives the pre-package substrate 26 from the substrate placement portion 34. The substrate transport mechanism 35 returns to the predetermined position S1.

Next, for example, the substrate transport mechanism 35 moves in the + X direction to a predetermined position M1 of the molding module 30B. In the molding module 30B, the substrate conveying mechanism 35 moves in the-Y direction and stops at a predetermined position C1 above the lower mold 36. The release film 44 is supplied to the lower die 36 by the release film supply mechanism 38 (see fig. 8 (a)). The substrate transport mechanism 35 ascends to supply the pre-package substrate 26 to the upper mold 45 (see fig. 8 (a)). The substrate transport mechanism 35 returns to the predetermined position S1 of the substrate supply and storage module 28.

Next, in the resin supply module 31, the X-Y table 40 is moved in the-Y direction, and the resin storage 41 is stopped at a predetermined position below the resin material feeding mechanism 42. By moving the X-Y table 40 in the X direction and the Y direction, a predetermined amount of resin material is supplied from the resin material feeding mechanism 42 to the resin storage portion 41. After the resin material is supplied to the resin housing portion 41, the X-Y table 40 is returned to the original position.

Subsequently, the resin conveying mechanism 43 is moved in the-Y direction from the predetermined position R1. The resin conveying mechanism 43 receives the resin accommodating portion 41 placed on the X-Y table 40. The resin conveying mechanism 43 returns to the predetermined position R1. The resin conveying mechanism 43 moves in the-X direction to a predetermined position M1 of the molding module 30B.

Next, in the molding module 30B, the resin conveying mechanism 43 moves in the-Y direction and stops at a predetermined position C1 above the lower mold 36. By lowering the resin conveying mechanism 43, the resin material 46 is supplied from the resin accommodating portion 41 to the cavity 37 (see fig. 8 (a)). The resin conveying mechanism 43 returns to the predetermined position R1. Fig. 8 (a) shows a case where a granular resin is supplied as the resin material 46.

Next, as shown in fig. 8 (b), the resin material 46 is melted to produce a flowable resin 47. The lower mold 36 is raised by a mold clamping mechanism 39 (see fig. 7) to clamp the upper mold 45 and the lower mold 36. By clamping the mold, the semiconductor chip 25 mounted on the pre-package substrate 26 is immersed in the flowable resin 47 melted in the cavity 37.

Next, as shown in fig. 8 (c), the fluid resin 47 is heated for a time period necessary for curing the fluid resin 47. The hardening resin 48 is formed by hardening the flowable resin 47. Thus, the semiconductor chip 25 mounted on the pre-package substrate 26 is resin-packaged with the cured resin 48 molded in accordance with the shape of the cavity 37.

Next, as shown in fig. 8 (d), after a predetermined time has elapsed, the upper mold 45 and the lower mold 36 are opened. A resin-sealed rear substrate 11 is fixed to the mold surface of the upper mold 45.

Subsequently, the substrate transport mechanism 35 moves from the predetermined position S1 of the substrate supply and storage module 28 to the predetermined position M1 of the molding module 30B. Further, the substrate transport mechanism 35 moves to a predetermined position C1 above the lower mold 36, and the packaged substrate 11 is received by the substrate transport mechanism 35.

Subsequently, the substrate transport mechanism 35 moves from the molding module 30B to the inspection module 29, and stops at a predetermined position E1 above the table 2 of the inspection device 23. The packaged substrate 11 is transferred from the substrate transfer mechanism 35 to the inspection device 23. The substrate transport mechanism 35 returns to the predetermined position S1.

Next, the height position h2 of the substrate 12 of the resin-encapsulated post-encapsulation substrate 11 and the height position h3 of the post-encapsulation substrate 11 are measured by the inspection device 23 (see fig. 5). The controller CTL obtains the relative thickness of the sealing resin 13 of the substrate 11 after sealing by comparing these height positions.

Next, the substrate transport mechanism 35 is moved to a predetermined position E1 above the table 2 of the inspection device 23, and the packaged substrate 11 is received from the inspection device 23. By moving the substrate transfer mechanism 35, the packaged substrate 11 is transferred to the substrate placement unit 34. The post-package substrate 11 is accommodated in the post-package substrate accommodating portion 33 from the substrate mounting portion 34. Through the steps up to now, the resin encapsulation is completed.

According to the present embodiment, the inspection module 29 of the resin molding apparatus 27 is provided with the inspection device 23. By using the inspection device 23, the height position of the substrate 12 of the pre-package substrate 26, the height position of the substrate 12 of the post-package substrate 11, the height position of the post-package substrate 11, and the like can be measured in a state where the deformation of the pre-package substrate 26 or the post-package substrate 11 is corrected and the pre-package substrate 26 or the post-package substrate 11 is in close contact with the table 2. This enables the thickness of the sealing resin 13 included in the substrate 11 to be accurately determined after sealing. Therefore, the resin molding process can be normally managed in the resin molding device 27. This enables the resin molding device 27 to operate stably.

In the present embodiment, a case is shown in which the inspection device 23 is provided in the resin molding device 27 using the compression molding method. The inspection device 23 of the present invention may be provided in a resin molding device using a transfer molding method or an injection molding method, without being limited thereto.

In the present embodiment, the inspection module 29 of the resin molding apparatus 27 is integrally provided with the inspection apparatus 23. The inspection device 23 may be provided separately from the resin molding device 27. In this case, the thickness of the encapsulating resin molded in the plurality of resin molding apparatuses can be measured by one inspection apparatus 23.

In each embodiment, the height position of the table 2, the height position of the substrate 12 of the pre-package substrate 26, the height position of the substrate 12 of the post-package substrate 11, the height position of the post-package substrate 11, and the like are measured using the contact displacement sensor 24 of the inspection device 23. Without being limited thereto, the same measurement may be performed using an optical displacement sensor or an image recognition system.

In each embodiment, a case is shown in which a contact displacement sensor 24 as an inspection means is provided in the inspection device 23. Without being limited thereto, two inspection mechanisms of the contact displacement sensor 24 and the image processing system may be provided in the inspection device 23. In this case, the inspection device 23 may be used to measure the thickness of the substrate 12 included in the post-package substrate 11, the thickness of the package resin 13 included in the post-package substrate 11, and to inspect the surface and defects of the post-package substrate 11. The pre-package substrate 26 may be inspected for a defective state of the semiconductor chip.

As described above, the holding device of the above embodiment is configured to include: a table on which an object is placed; a plurality of suction holes provided on the table and for sucking the object; a sealing member disposed on the table and surrounding the plurality of suction holes; a pressing member for pressing the periphery of the object onto the table at a position where the seal is disposed; and a pressure reducing mechanism connected to the plurality of suction holes.

With this configuration, the deformation of the object can be corrected and held in close contact with the table.

The inspection apparatus of the above embodiment is configured to include: a table on which an object is placed; a plurality of suction holes provided on the table and for sucking the object; a sealing member disposed on the table and surrounding the plurality of suction holes; a pressing member for pressing the periphery of the object onto the table at a position where the seal is disposed; a pressure reducing mechanism connected to the plurality of suction holes; and an inspection mechanism that inspects the object while pressing the periphery of the object with the pressing member and sucking the object via the plurality of suction holes with the decompression mechanism.

According to this configuration, the object can be accurately inspected by the inspection means while the object is brought into close contact with the table and the influence of deformation such as warping or skewing is removed.

In the inspection apparatus according to the above-described embodiment, the inspection means includes any one of a contact displacement sensor, an optical displacement sensor, and an image processing system.

According to this configuration, the thickness of the object, the surface inspection of the object, and the like can be accurately performed.

The resin molding apparatus is provided with the inspection apparatus according to the above embodiment.

With this configuration, the resin molding process can be normally managed in the resin molding apparatus. Therefore, the resin molding apparatus can be stably operated.

The inspection method of the above embodiment includes the steps of: placing an object on a table provided with a plurality of suction holes and a seal surrounding the plurality of suction holes; pressing the periphery of the object onto the table by a pressing member at a position where the seal is disposed; forming a space between the table and the object by pressing the periphery of the object; drawing and clinging the object to the worktable by sucking the air of the space through the plurality of suction holes; and inspecting the object by using an inspection mechanism in a state where the object is closely attached to the table.

According to this method, the object can be accurately inspected by the inspection means while the object is brought into close contact with the table and the influence of deformation such as warpage or external shape is removed.

In the inspection method according to the above embodiment, the object is a pre-package substrate or a post-package substrate, and the object is inspected by using the inspection mechanism.

According to this method, the pre-package substrate or the post-package substrate can be accurately inspected while the pre-package substrate or the post-package substrate is brought into close contact with the stage.

Further, in the inspection method of the above embodiment, the inspecting step includes the steps of: measuring reference height information of the table using an inspection mechanism in a state where the object is not placed on the table; and measuring height information of the object using an inspection means in a state where the object is closely attached to the table, wherein the inspection method obtains a thickness of the object by comparing the height information of the object with reference height information of the table.

According to this method, the reference height information of the table and the height information of the object measured in a state where the object is in close contact with the table are compared at the same position, and the thickness of the object can be more accurately obtained.

Further, in the inspection method of the above embodiment, the object has a substrate and an insulator formed on the substrate, and the inspecting step includes the steps of: in the inspection method, the height information of the substrate and the height information of the insulator are measured by using an inspection mechanism in a state where an object is closely attached to the table, and the thickness of the insulator is obtained by comparing the height information of the insulator and the height information of the substrate.

According to this method, the relative thickness of the insulator can be easily determined by comparing the height information of the substrate and the height information of the insulator in a state where the object having the substrate and the insulator is brought into close contact with the table.

Further, in the inspection method of the above-described embodiment, the inspection means is any one of a contact displacement sensor, an optical displacement sensor, and an image recognition system, and the thickness of the object is measured by using the inspection means.

According to this method, the thickness of the object can be accurately obtained by using any one of the contact displacement sensor, the optical displacement sensor, and the image recognition system in a state where the object is brought into close contact with the table.

Further, the resin encapsulation method performs an inspection after resin encapsulation by the inspection method of the above-described embodiment.

According to this method, the thickness of the substrate or the thickness of the encapsulating resin can be accurately determined after resin encapsulation.

Further, the resin encapsulation method performs inspection using the inspection method of the above embodiment before resin encapsulation, and also performs inspection using the inspection method of the above embodiment after resin encapsulation.

According to this method, the thickness of the substrate can be accurately determined before the resin encapsulation, and the thickness of the resin encapsulation can be accurately determined after the resin encapsulation.

In addition, the method for manufacturing a resin package uses the resin package method of the above embodiment to manufacture a resin package.

According to this manufacturing method, the resin package can be manufactured by performing inspection before or after the resin package.

The present invention is not limited to the above-described embodiments, and can be modified and selectively employed in arbitrary and appropriate combinations as necessary within a scope not departing from the gist of the present invention.

Description of the symbols

1. 16 holding device

2. 17 working table

3. Suction hole

4. 18 base plate (object)

5. Pipeline

6. Pressure reducing mechanism

7. 19 pressing member

8. 20 opening part

9. 21 groove for sealing

10. 22 seal

11. Packaging rear base plate (object)

12. Base plate (object)

13. Encapsulating resin (insulator)

14. Gap

15. Enclosed space (space)

23. Inspection apparatus

24. Contact displacement sensor (inspection mechanism)

25. Semiconductor chip

26. Packaging front base plate (object)

27. Resin molding apparatus (resin packaging apparatus)

28. Substrate supply storage module

29. Inspection module

30A, 30B, 30C forming module

31. Resin supply module

32. Substrate supply part before packaging

33. Substrate receiving part after packaging

34. Substrate mounting part

35. Substrate conveying mechanism

36. Lower die

37. Die cavity

38. From type membrane feeding mechanism

39. Mould clamping mechanism

40 X-Y workbench

41. Resin container

42. Resin material feeding mechanism

43. Resin conveying mechanism

44. Release film

45. Upper die

46. Resin material

47. Flowable resin

48. Hardening resin

Area occupied by A closed space

P1, P2, P3, P4, P5, P6 define positions

h1, h2, h3, h4, h5, h6 height position

CTL control part

S1, R1, M1, C1, E1 define positions

Claims

1. An inspection apparatus, comprising:

a table on which an object is placed;

a plurality of suction holes provided on the table and used to suck the object;

a sealing member disposed on the table and surrounding the plurality of suction holes;

a pressing member that presses the periphery of the object against the table at a position where the seal is disposed;

a pressure reducing mechanism connected to the plurality of suction holes; and

an inspection mechanism that inspects the object in a state where the periphery of the object is pressed by the pressing member and the object is sucked by the decompression mechanism via the plurality of suction holes,

the inspection apparatus measures reference height information of the table by using the inspection means in a state where the object is not placed on the table, measures height information of the object by using the inspection means in a state where the object is in close contact with the table, and compares the height information of the object with the reference height information of the table to obtain a thickness of the object.

2. The inspection apparatus of claim 1, wherein the inspection mechanism comprises any one of a contact displacement sensor, an optical displacement sensor, and an image processing system.

3. A resin packaging device comprising the inspection device according to claim 1 or 2.

4. An inspection method, comprising the steps of:

placing an object on a table provided with a plurality of suction holes and a seal surrounding the periphery of the plurality of suction holes;

pressing the periphery of the object against the table by a pressing member at a position where the seal is disposed;

forming a space between the table and the object by pressing a periphery of the object;

drawing and clinging the object to the table by sucking air of the space through the plurality of suction holes; and

inspecting the object by using an inspection means in a state where the object is closely attached to the table,

the step of checking comprises the steps of:

measuring reference height information of the table using the inspection mechanism in a state where the object is not placed on the table; and

measuring height information of the object using the inspection means in a state where the object is closely attached to the table,

the inspection method obtains the thickness of the object by comparing the height information of the object with reference height information of the table.

5. The inspection method according to claim 4, wherein the object is a pre-package substrate or a post-package substrate, and the inspection method inspects the object by using the inspection mechanism.

6. The inspection method according to claim 4,

the object has a substrate and an insulator formed on the substrate,

the step of checking comprises the steps of:

measuring height information of the substrate and height information of the insulator by using the inspection mechanism in a state where the object is closely attached to the table,

the inspection method obtains the thickness of the insulator by comparing the height information of the insulator with the height information of the substrate.

7. The inspection method according to claim 4 or 6,

the inspection mechanism is any one of a contact displacement sensor, an optical displacement sensor and an image recognition system,

the inspection method measures the thickness of the object by using the inspection mechanism.

8. A resin encapsulation method which performs an inspection after resin encapsulation using the inspection method according to any one of claims 4 to 7.

9. A resin packaging method which performs inspection using the inspection method according to claim 4 before resin packaging and performs inspection using the inspection method according to any one of claims 4 to 7 after resin packaging.

10. A method of manufacturing a resin package using the resin packaging method according to claim 8 or 9.