CN109713020A - Display base plate and preparation method thereof, display device - Google Patents
Display base plate and preparation method thereof, display device Download PDFInfo
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- CN109713020A CN109713020A CN201910048494.3A CN201910048494A CN109713020A CN 109713020 A CN109713020 A CN 109713020A CN 201910048494 A CN201910048494 A CN 201910048494A CN 109713020 A CN109713020 A CN 109713020A
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- base plate
- conductive pattern
- display base
- underlay substrate
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Abstract
The present invention provides a kind of display base plates and preparation method thereof, display device, belong to field of display technology.Wherein, display base plate, comprising: underlay substrate；Conductive pattern on the underlay substrate；With the insulation patterns of conductive pattern same layer setting, the insulation patterns fill the gap between adjacent conductive figure, and upper surface of the insulation patterns far from the underlay substrate is flushed with the conductive pattern far from the upper surface of the underlay substrate.Technical solution of the present invention can improve the display effect of display base plate.
Description
Technical field
The present invention relates to field of display technology, a kind of display base plate and preparation method thereof, display device are particularly related to.
Background technique
In existing oled display substrate, since the thickness of Source and drain metal level figure is larger, cause to be located at Source and drain metal level
The surface of flatness layer on figure is out-of-flatness, and then the surface for resulting in the anode on flatness layer is also out-of-flatness
, the problem of will appear color shift (gamut) when watching OLED display screen in this way under big visual angle.The pixel of sub-pix
Width is smaller, and the influence of color shift is bigger, affects the display effect of oled display substrate.
Summary of the invention
The technical problem to be solved in the present invention is to provide a kind of display base plate and preparation method thereof, display device, Neng Gougai
The display effect of kind display base plate.
In order to solve the above technical problems, the embodiment of the present invention offer technical solution is as follows:
On the one hand, a kind of display base plate is provided, comprising:
Underlay substrate；
Conductive pattern on the underlay substrate；
The insulation patterns being arranged with the conductive pattern same layer, between the insulation patterns are filled between adjacent conductive figure
Gap, and upper surface of the insulation patterns far from the underlay substrate and upper table of the conductive pattern far from the underlay substrate
Face flushes.
Further, the conductive pattern is Source and drain metal level figure.
Further, the display base plate further include:
The flatness layer of the insulation patterns and the conductive pattern is covered, the flatness layer is upper far from the underlay substrate
Surface is smooth.
Further, the display base plate is oled display substrate, the display base plate further include:
Anode on the flatness layer, upper surface of the anode far from the underlay substrate is smooth.
The embodiment of the invention also provides a kind of display devices, including display base plate as described above.
The embodiment of the invention also provides a kind of production methods of display base plate, comprising:
After forming conductive pattern on underlay substrate, the insulation patterns with the conductive pattern same layer, the insulation are formed
Gap between filling graph adjacent conductive figure, and the insulation patterns far from the underlay substrate upper surface with it is described
Conductive pattern is flushed far from the upper surface of the underlay substrate.
Further, the formation and the insulation patterns of the conductive pattern same layer include:
Insulating layer is formed on the underlay substrate for being formed with the conductive pattern, the thickness of the insulating layer is not less than described
The thickness of conductive pattern；
Part of the insulating layer beyond horizontal plane where the upper surface of the conductive pattern is etched away, the insulation is formed
Figure.
Further, the thickness of the insulating layer is equal with the thickness of the conductive pattern.
Further, the conductive pattern is Source and drain metal level figure, the production method of the display base plate further include:
The flatness layer for covering the insulation patterns and the conductive pattern is formed, the flatness layer is far from the underlay substrate
Upper surface be it is smooth.
Further, the display base plate is oled display substrate, the production method of the display base plate further include:
Anode is formed on the flat laye, and upper surface of the anode far from the underlay substrate is smooth.
The embodiment of the present invention has the advantages that
In above scheme, after forming conductive pattern on underlay substrate, the insulation patterns with conductive pattern same layer are formed, absolutely
Gap between edge filling graph adjacent conductive figure, and the upper surface of the separate underlay substrate of insulation patterns is remote with conductive pattern
Upper surface from underlay substrate flushes, and can provide even curface in this way to be subsequently formed flatness layer so that flatness layer and
The surface of anode on flatness layer is also smooth, to avoid the occurrence of color shift, improves the display of display base plate
Effect；In addition, insulation patterns can also protect the side surface of conductive pattern, subsequent technique is avoided to cause conductive pattern
Damage.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of existing display base plate；
Fig. 2 is that the embodiment of the present invention forms the schematic diagram after insulating layer；
Fig. 3 is that the embodiment of the present invention forms the schematic diagram after insulation patterns；
Fig. 4 is that the embodiment of the present invention forms the schematic diagram after anode.
Appended drawing reference
1 display base plate
2 Source and drain metal level figures
3 flatness layers
4 anodes
5 insulating layers
6 insulation patterns
Specific embodiment
To keep the embodiment of the present invention technical problems to be solved, technical solution and advantage clearer, below in conjunction with
Drawings and the specific embodiments are described in detail.
As shown in Figure 1, since the thickness of Source and drain metal level figure 2 is larger, causing to be located in existing oled display substrate
The surface of flatness layer 3 on Source and drain metal level figure 2 is out-of-flatness, and then results in the table of the anode 4 on flatness layer 3
The problem of face is also out-of-flatness, will appear color shift (gamut) when watching OLED display screen in this way under big visual angle.
The pixel wide of sub-pix is smaller, and the influence of color shift is bigger, affects the display effect of oled display substrate.
The embodiment of the present invention, can in view of the above-mentioned problems, provide a kind of display base plate and preparation method thereof, display device
Improve the display effect of display base plate.
The embodiment of the present invention provides a kind of display base plate, comprising:
Underlay substrate；
Conductive pattern on the underlay substrate；
The insulation patterns being arranged with the conductive pattern same layer, between the insulation patterns are filled between adjacent conductive figure
Gap, and upper surface of the insulation patterns far from the underlay substrate and upper table of the conductive pattern far from the underlay substrate
Face flushes.
In the present embodiment, after forming conductive pattern on underlay substrate, the insulation patterns with conductive pattern same layer are formed, absolutely
Gap between edge filling graph adjacent conductive figure, and the upper surface of the separate underlay substrate of insulation patterns is remote with conductive pattern
Upper surface from underlay substrate flushes, and can provide even curface in this way to be subsequently formed flatness layer so that flatness layer and
The surface of anode on flatness layer is also smooth, to avoid the occurrence of color shift, improves the display of display base plate
Effect；In addition, insulation patterns can also protect the side surface of conductive pattern, subsequent technique is avoided to cause conductive pattern
Damage.
In one specific embodiment, the conductive pattern can be Source and drain metal level figure, be subsequently formed covering source in this way
When leaking the flatness layer of metal layer image, it is also smooth for can making the surface for the flatness layer to be formed.Certainly, conductive pattern is not
It is limited as Source and drain metal level figure, can also be barrier metal layer figure, in this way in the grid for being subsequently formed cover grid metal layer image
When insulating layer, it is also smooth for can making the surface for the gate insulation layer to be formed.
Further, the display base plate further include:
The flatness layer of the insulation patterns and the conductive pattern is covered, the flatness layer is upper far from the underlay substrate
Surface be it is smooth, in this way in the anode or other function figure being subsequently formed on flatness layer, it is ensured that anode or other
Upper surface of the functional graphic far from the underlay substrate is also smooth.
In one specific embodiment, the display base plate is oled display substrate, the display base plate further include:
Anode on the flatness layer, the anode far from the underlay substrate upper surface be it is smooth, in this way
Color shift can be avoided the occurrence of, the display effect of oled display substrate is improved.
In addition, the display base plate of the present embodiment is not limited to oled display substrate, it can also be other kinds of display
Substrate, such as the display base plate of liquid crystal display panel.
The embodiment of the invention also provides a kind of display devices, including display base plate as described above.The display device
It can be with are as follows: any products or components having a display function such as TV, display, Digital Frame, mobile phone, tablet computer, wherein
The display device further includes flexible circuit board, printed circuit board and backboard.
The embodiment of the invention also provides a kind of production methods of display base plate, comprising:
After forming conductive pattern on underlay substrate, the insulation patterns with the conductive pattern same layer, the insulation are formed
Gap between filling graph adjacent conductive figure, and the insulation patterns far from the underlay substrate upper surface with it is described
Conductive pattern is flushed far from the upper surface of the underlay substrate.
In the present embodiment, after forming conductive pattern on underlay substrate, the insulation patterns with conductive pattern same layer are formed, absolutely
Gap between edge filling graph adjacent conductive figure, and the upper surface of the separate underlay substrate of insulation patterns is remote with conductive pattern
Upper surface from underlay substrate flushes, and can provide even curface in this way to be subsequently formed flatness layer so that flatness layer and
The surface of anode on flatness layer is also smooth, to avoid the occurrence of color shift, improves the display of display base plate
Effect；In addition, insulation patterns can also protect the side surface of conductive pattern, subsequent technique is avoided to cause conductive pattern
Damage.
In one specific embodiment, the formation and the insulation patterns of the conductive pattern same layer include:
Insulating layer is formed on the underlay substrate for being formed with the conductive pattern, the thickness of the insulating layer is not less than described
The thickness of conductive pattern；
Part of the insulating layer beyond horizontal plane where the upper surface of the conductive pattern is etched away, the insulation is formed
Figure.
Since insulating layer requires to be removed beyond the part of horizontal plane where the upper surface of the conductive pattern, preferably
Ground, the thickness of the insulating layer is equal with the thickness of the conductive pattern, can save the material of insulating layer in this way, be not necessarily to simultaneously
Corresponding insulating layer part is spaced between removal adjacent conductive figure.
Further, the conductive pattern is Source and drain metal level figure, the production method of the display base plate further include:
The flatness layer for covering the insulation patterns and the conductive pattern is formed, the flatness layer is far from the underlay substrate
Upper surface be it is smooth, in this way in the anode or other function figure being subsequently formed on flatness layer, it is ensured that anode or
Upper surface of the other function figure far from the underlay substrate is also smooth.
Certainly, conductive pattern is not limited to Source and drain metal level figure, can also be barrier metal layer figure, in this way subsequent
When forming the gate insulation layer of cover grid metal layer image, it is also smooth for can making the surface for the gate insulation layer to be formed.
Further, the display base plate is oled display substrate, the production method of the display base plate further include:
Form anode on the flat laye, upper surface of the anode far from the underlay substrate be it is smooth, in this way
Color shift can be avoided the occurrence of, the display effect of oled display substrate is improved.
In addition, the display base plate of the present embodiment is not limited to oled display substrate, it can also be other kinds of display
Substrate, such as the display base plate of liquid crystal display panel.
Below by taking display base plate is oled display substrate as an example, of the invention is shown in conjunction with attached drawing and specific embodiment
Show that the production method of substrate is described further, the production method of the display base plate of the present embodiment the following steps are included:
Step 1 provides a underlay substrate 1；
Underlay substrate 1 can be flexible substrates or hard substrate, and flexible substrates can use polyimides, and hard substrate can
Think quartz base plate or glass substrate.
Wherein, when the conductive pattern of the present embodiment is Source and drain metal level figure, grid gold is already formed on underlay substrate 1
Belong to the functional film layers such as layer pattern, gate insulation layer, active layer.
Step 2 forms Source and drain metal level figure 2 on underlay substrate 1；
Specifically, a layer thickness can be deposited using magnetron sputtering, thermal evaporation or other film build methods on underlay substrate 1
AboutSource and drain metal level, Source and drain metal level can be Cu, Al, Ag, Mo, Cr, Nd, Ni, Mn, Ti,
The alloy of the metals such as Ta, W and these metals.Source and drain metal level can be single layer structure or multilayered structure, multilayered structure ratio
As Cu Mo, Ti Cu Ti, Mo Al Mo etc..Coat a layer photoresist on the source-drain metal layer, using mask plate to photoresist into
Row exposure makes photoresist form photoresist and does not retain region and photoresist retention area, wherein photoresist retention area corresponds to
2 region of Source and drain metal level figure, photoresist do not retain region corresponding to the region other than above-mentioned figure；It carries out at development
Reason, the photoresist that photoresist does not retain region are completely removed, and the photoresist thickness of photoresist retention area remains unchanged；Pass through
Etching technics etches away the Source and drain metal level that photoresist does not retain region completely, removes remaining photoresist, forms source and drain metal
Layer pattern 2, Source and drain metal level figure 2 may include source electrode, drain electrode and the data line of thin film transistor (TFT).
Step 3, as shown in Fig. 2, on the underlay substrate 1 for be formed with Source and drain metal level figure 2 formed insulating layer 5；
Specifically, chemical vapor deposition (PECVD) method can be enhanced with using plasma in the substrate base for completing step 2
Deposition thickness is on plate 1Insulating layer 5, insulating layer 5 can select oxide, nitride or oxynitriding
Object is closed, corresponding reaction gas is SiH4、NH3、N2Or SiH2Cl2、NH3、N2。
Step 4, as shown in figure 3, using upper surface of the etching technics removal insulating layer 5 beyond Source and drain metal level figure 2
Part forms insulation patterns 51；
Insulation patterns 51 fill the gap between adjacent source and drain metal layer image 2, can provide to be subsequently formed flatness layer
Even curface, insulation patterns 51 can also protect the side surface of Source and drain metal level figure 2, prevent subsequent technique to source
It causes to damage in the side surface of leakage metal layer image 2.
Step 5, as shown in figure 4, formed flatness layer 3；
Specifically, can coat a layer thickness in the upper surface of Source and drain metal level figure 2 and insulation patterns 51 is aboutOrganic resin as flatness layer 3, organic resin can be benzocyclobutene (BCB), be also possible to it
His organic photosensitive material, the surface of flatness layer 3 are smooth.
Step 6, as shown in figure 4, formed anode 4.
Specifically, can be about by the method deposition thickness of sputtering or thermal evaporation on the underlay substrate 1 for completing step 5Transparency conducting layer, transparency conducting layer can be ITO, IZO or other transparent metal oxide,
A layer photoresist is coated on transparency conducting layer, photoresist is exposed using mask plate, so that photoresist is formed photoresist and is not protected
Stay region and photoresist retention area, wherein photoresist retention area corresponds to the figure region of anode 4, and photoresist is not
Retain region and corresponds to the region other than above-mentioned figure；Development treatment is carried out, the photoresist that photoresist does not retain region is complete
Removal, the photoresist thickness of photoresist retention area remain unchanged；Etch away the non-reserved area of photoresist completely by etching technics
The electrically conducting transparent layer film in domain, removes remaining photoresist, forms anode 4, due to the surface of flatness layer 3 be it is smooth,
The surface of anode 4 is also smooth.
Forming organic luminous layer, cathode and thinner package film layer later can be obtained oled display substrate.The present embodiment system
In the oled display substrate of work, the surface of anode 4 be it is smooth, can be avoided and color shift occur, improve OLED show base
The display effect of plate.
In each method embodiment of the present invention, the serial number of each step can not be used to limit the successive suitable of each step
Sequence, for those of ordinary skill in the art, without creative efforts, the successive variation to each step
Within protection scope of the present invention.
Unless otherwise defined, the technical term or scientific term that the disclosure uses should be tool in fields of the present invention
The ordinary meaning for thering is the personage of general technical ability to be understood." first ", " second " used in the disclosure and similar word are simultaneously
Any sequence, quantity or importance are not indicated, and are used only to distinguish different component parts." comprising " or "comprising" etc.
Similar word means that the element or object before the word occur covers the element or object for appearing in the word presented hereinafter
And its it is equivalent, and it is not excluded for other elements or object.The similar word such as " connection " or " connected " is not limited to physics
Or mechanical connection, but may include electrical connection, it is either direct or indirectly."upper", "lower",
"left", "right" etc. is only used for indicating relative positional relationship, and after the absolute position for being described object changes, then the relative position is closed
System may also correspondingly change.
It is appreciated that ought such as layer, film, region or substrate etc element be referred to as be located at another element "above" or "below"
When, which " direct " can be located at "above" or "below" another element, or may exist intermediary element.
The above is a preferred embodiment of the present invention, it is noted that for those skilled in the art
For, without departing from the principles of the present invention, it can also make several improvements and retouch, these improvements and modifications
It should be regarded as protection scope of the present invention.
Claims (10)
1. a kind of display base plate characterized by comprising
Underlay substrate；
Conductive pattern on the underlay substrate；
With the insulation patterns of conductive pattern same layer setting, the insulation patterns fill the gap between adjacent conductive figure,
And upper surface of the insulation patterns far from the underlay substrate and upper surface of the conductive pattern far from the underlay substrate
It flushes.
2. display base plate according to claim 1, which is characterized in that the conductive pattern is Source and drain metal level figure.
3. display base plate according to claim 2, which is characterized in that the display base plate further include:
Cover the flatness layer of the insulation patterns and the conductive pattern, upper surface of the flatness layer far from the underlay substrate
It is smooth.
4. display base plate according to claim 3, which is characterized in that the display base plate is oled display substrate, described
Display base plate further include:
Anode on the flatness layer, upper surface of the anode far from the underlay substrate is smooth.
5. a kind of display device, which is characterized in that including display base plate such as of any of claims 1-4.
6. a kind of production method of display base plate characterized by comprising
After forming conductive pattern on underlay substrate, the insulation patterns with the conductive pattern same layer, the insulation patterns are formed
Fill the gap between adjacent conductive figure, and the upper surface of the separate underlay substrate of the insulation patterns and the conduction
Figure is flushed far from the upper surface of the underlay substrate.
7. the production method of display base plate according to claim 6, which is characterized in that the formation and the conductive pattern
The insulation patterns of same layer include:
Insulating layer is formed on the underlay substrate for being formed with the conductive pattern, the thickness of the insulating layer is not less than the conduction
The thickness of figure；
Part of the insulating layer beyond horizontal plane where the upper surface of the conductive pattern is etched away, the insulation figure is formed
Shape.
8. the production method of display base plate according to claim 7, which is characterized in that the thickness of the insulating layer with it is described
The thickness of conductive pattern is equal.
9. the production method of display base plate according to claim 6, which is characterized in that the conductive pattern is source and drain metal
Layer pattern, the production method of the display base plate further include:
The flatness layer for covering the insulation patterns and the conductive pattern is formed, the flatness layer is upper far from the underlay substrate
Surface is smooth.
10. the production method of display base plate according to claim 9, which is characterized in that the display base plate is aobvious for OLED
Show substrate, the production method of the display base plate further include:
Anode is formed on the flat laye, and upper surface of the anode far from the underlay substrate is smooth.
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| CN201910048494.3A CN109713020A (en) | 2019-01-18 | 2019-01-18 | Display base plate and preparation method thereof, display device |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110718572A (en) * | 2019-10-17 | 2020-01-21 | 京东方科技集团股份有限公司 | Organic electroluminescent display substrate, preparation method thereof and display device |
| WO2022088534A1 (en) * | 2020-10-30 | 2022-05-05 | 京东方科技集团股份有限公司 | Drive backplane and manufacturing method therefor, and display panel |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN107272958A (en) * | 2017-06-28 | 2017-10-20 | 武汉华星光电半导体显示技术有限公司 | A kind of embedded touch OLED display and preparation method thereof |
| CN108183121A (en) * | 2017-12-15 | 2018-06-19 | 武汉华星光电半导体显示技术有限公司 | Flexible display panels and preparation method thereof |
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2019
- 2019-01-18 CN CN201910048494.3A patent/CN109713020A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107272958A (en) * | 2017-06-28 | 2017-10-20 | 武汉华星光电半导体显示技术有限公司 | A kind of embedded touch OLED display and preparation method thereof |
| CN108183121A (en) * | 2017-12-15 | 2018-06-19 | 武汉华星光电半导体显示技术有限公司 | Flexible display panels and preparation method thereof |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110718572A (en) * | 2019-10-17 | 2020-01-21 | 京东方科技集团股份有限公司 | Organic electroluminescent display substrate, preparation method thereof and display device |
| WO2022088534A1 (en) * | 2020-10-30 | 2022-05-05 | 京东方科技集团股份有限公司 | Drive backplane and manufacturing method therefor, and display panel |
| CN114442353A (en) * | 2020-10-30 | 2022-05-06 | 京东方科技集团股份有限公司 | Driving backboard, manufacturing method thereof and display panel |
| US12265296B2 (en) | 2020-10-30 | 2025-04-01 | Hefei Xinsheng Optoelectronics Technology Co., Ltd. | Driving backplane, manufacturing method thereof and display panel |
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Application publication date: 20190503 |