CN109688721A - A kind of heavy silver surface treatment process of copper base - Google Patents
A kind of heavy silver surface treatment process of copper base Download PDFInfo
- Publication number
- CN109688721A CN109688721A CN201910007488.3A CN201910007488A CN109688721A CN 109688721 A CN109688721 A CN 109688721A CN 201910007488 A CN201910007488 A CN 201910007488A CN 109688721 A CN109688721 A CN 109688721A
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- Prior art keywords
- copper base
- carried out
- processing
- treatment process
- surface treatment
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 117
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 117
- 239000010949 copper Substances 0.000 title claims abstract description 117
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 title claims abstract description 72
- 229910052709 silver Inorganic materials 0.000 title claims abstract description 72
- 239000004332 silver Substances 0.000 title claims abstract description 72
- 238000000034 method Methods 0.000 title claims abstract description 40
- 238000004381 surface treatment Methods 0.000 title claims abstract description 27
- 238000012545 processing Methods 0.000 claims abstract description 53
- 238000005553 drilling Methods 0.000 claims abstract description 23
- 239000003292 glue Substances 0.000 claims description 20
- 238000005406 washing Methods 0.000 claims description 18
- 238000003466 welding Methods 0.000 claims description 15
- 238000003801 milling Methods 0.000 claims description 9
- 238000002203 pretreatment Methods 0.000 claims description 9
- 238000005530 etching Methods 0.000 claims description 7
- 239000002253 acid Substances 0.000 claims description 6
- 238000001514 detection method Methods 0.000 claims description 6
- 230000001681 protective effect Effects 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 abstract description 18
- 238000007689 inspection Methods 0.000 description 7
- 230000018109 developmental process Effects 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 241001074085 Scophthalmus aquosus Species 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 239000012467 final product Substances 0.000 description 4
- 238000003908 quality control method Methods 0.000 description 4
- 239000003814 drug Substances 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 241000196324 Embryophyta Species 0.000 description 2
- 230000003139 buffering effect Effects 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 230000003628 erosive effect Effects 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 238000000275 quality assurance Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 241001062009 Indigofera Species 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010924 continuous production Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000002242 deionisation method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 230000011218 segmentation Effects 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/052—Magnetographic patterning
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
The invention discloses a kind of heavy silver surface treatment process of copper base, heavy silver-colored process is arranged before drilling operating, and encapsulated processing is carried out to the edges of boards of copper base when carrying out heavy silver, extra silver can be prevented to be attached on edges of boards, will not occur the situation that silver is attached in the hole of copper base simultaneously, guarantee the quality of production of wiring board.
Description
Technical field
The present invention relates to circuit board making technical field, especially a kind of copper base sinks silver surface treatment process.
Background technique
In PCB manufacture craft, generally all there can be metal base accessory as supporting member, and require metal base accessory that there is high thermal conductivity
Property, current production technology is using copper sheet mostly as metal base accessory, and during making PCB, it needs to copper base
The surface treatments such as heavy silver are carried out, existing manufacture craft is usually that heavy silver is carried out after first drilling to copper base, is caused in hole
And edges of boards are attached with extra silver, not only influence the final product quality of PCB, can also extend the production duration of PCB.
Summary of the invention
To solve the above problems, the purpose of the present invention is to provide a kind of heavy silver surface treatment process of copper base, first to copper
Substrate carries out aperture processing after carrying out heavy silver processing again, prevents the silver attachment for having extra in hole, while to copper base before heavy silver
Edges of boards carry out encapsulated processing, prevent edges of boards to be attached with extra silver.
Technical solution used by the present invention solves the problems, such as it is:
In a first aspect, the invention proposes a kind of heavy silver surface treatment process of copper base, comprising the following steps:
Welding resistance is carried out to the circuit surface of copper base；
Heavy silver processing is carried out to its circuit surface after encapsulated to the edges of boards progress of copper base；
Drilling processing is carried out to copper base.
Further, the specific steps of welding resistance are carried out to the circuit surface of copper base are as follows: the circuit surface of copper base is kept up,
Nog plate pre-treatment is carried out to circuit surface, silk-screen, pre-baked is carried out after the completion of nog plate, aligned, exposed, developed after the completion of pre-baked,
It is baked after being carried out after the completion of development.
Further, before the circuit surface to copper base carries out welding resistance, the processing of LP route, acid erosion are successively carried out to copper base
It carves, AOI detection and brill location hole are handled.
Further, the specific steps of the LP route processing are as follows: nog plate pre-treatment first is carried out to copper base, is then pasted
Dry film process is finally exposed.
Further, before carrying out acid etching to copper base, encapsulated processing first is carried out to the edges of boards of copper base.
Further, after the circuit surface to copper base carries out heavy silver processing, blue glue protective film is attached on circuit surface, and will
The extra blue glue of edges of boards is cut away.
Further, before carrying out drilling processing to copper base, the first partiting pad above and below copper base.
Further, after carrying out drilling processing to copper base, milling plate, washing, DI washing process are carried out to copper base.
The one or more technical solutions provided in the embodiment of the present invention, at least have the following beneficial effects: to copper-based
Before plate is drilled, heavy silver processing is first carried out to it, the edges of boards of copper base are first subjected to encapsulated place when carrying out heavy silver processing
Reason, can solve in copper-based plate hole and edges of boards are attached with the problem of extra silver, improve the final product quality of copper base.
Detailed description of the invention
The invention will be further described with example with reference to the accompanying drawing.
Fig. 1 is a kind of flow diagram of one embodiment of the heavy silver surface treatment process of copper base of the invention；
Fig. 2 is a kind of overall flow figure of one embodiment of the heavy silver surface treatment process of copper base of the invention.
Specific embodiment
In the manufacture craft of PCB, it usually needs select metal base accessory as supporting member, it is desirable that metal base accessory has height
Thermal conductivity, currently used metal base accessory are copper bases, and thermal conductivity is good, and pliability is moderate, is suitable for drilling, punching machine, milling machine
Equal conventional mechanicals processing, existing PCB processing technology: sawing sheet → LP route → AOI (automatic optics inspection) → brill location hole →
Drilling → single side welding resistance → milling plate → electrical measurement → FQC1 (final quality control) → heavy silver → washing → single side FQC2 (final quality
Control) → single side FQA (Plant quality assurance) → DI washing (deionization washing) → packaging → finished bin.
By above-mentioned existing PCB processing technology it is found that heavy silver processing is to carry out after drilling, so will have part
Silver is attached in hole, and is also had part silver and be attached on the edges of boards of copper base, so that the total quality of wiring board is influenced,
The process for also needing to add the extra silver of a selective trace muting simultaneously, so that increased production cost.
Based on this, the present invention provides a kind of heavy silver surface treatment process of copper base, after heavy silver processing is moved to welding resistance
Before face, drilling, and copper base is handled in heavy silver, heavy Yin Shiyin is prevented to be attached on edges of boards, due to heavy silver processing
Setting after drilling, so will not there is a problem of that silver is attached in hole, guarantees the quality of wiring board production.
With reference to the accompanying drawing, the embodiment of the present invention is further elaborated.
Referring to Fig.1, An embodiment provides a kind of heavy silver surface treatment process of copper base, including following step
It is rapid:
Welding resistance is carried out to the circuit surface of copper base；
Heavy silver processing is carried out to its circuit surface after encapsulated to the edges of boards progress of copper base；
Drilling processing is carried out to copper base.
In the present embodiment, before drilling by heavy silver processing setting, that is to say, that when carrying out heavy silver processing, copper base
There is no holes on surface, so would not also be attached to the generation of the phenomenon in hole there are silver, ensure that wiring board was producing
Quality in journey, while before carrying out heavy silver to copper base, encapsulated processing is carried out to the edges of boards of copper base, heavy silver-colored mistake can be prevented
Extra silver is attached on edges of boards in journey, is further ensured that the quality of production of wiring board.
Entire copper base does not have extra silver attachment during heavy silver, therefore manufacturer rejects without adding
The process of extra silver, can prevent the raising of production cost.
Further, another embodiment of the invention additionally provides a kind of heavy silver surface treatment process of copper base, to copper
The circuit surface of substrate carries out the specific steps of welding resistance are as follows: the circuit surface of copper base keeps up, before carrying out nog plate to circuit surface
Processing carries out silk-screen, pre-baked after the completion of nog plate, is aligned, exposed, developed after the completion of pre-baked, after carrying out after the completion of development
It is roasting.
In the present embodiment, welding resistance mainly include pre-treatment, silk-screen, it is pre-baked, contraposition, exposure, development and after bake it is several
Step, wherein pre-treatment needs to carry out nog plate processing to copper base, and is only the circuit surface progress nog plate for copper base, mill
The speed of plate can be set according to actual production situation, preferably 2.5-3m/min, after the completion of the nog plate of pre-treatment, be needed
After adequately cleaning to the front and back sides of copper base, silk-screen step is just entered, every silk-screen 30PNL will under normal circumstances
An ink pad face is cleaned, guarantees cleaning.
Silk-screen completion need to stand 15-60min, then just carry out it is pre-baked, using baking sheet to copper base carry out low-temperature bake,
Temperature is selected as 72 DEG C, and the time of baking is 45min, after the completion of pre-baked, is aligned, exposed and is developed, and when development guarantees
The route of copper base is face-up, and the speed control of development is baked after needing to carry out after the completion of 3m/min, development, bakes dry for segmentation afterwards
Roasting mode is to toast to toast 60min at 30min and 150 DEG C at 120 DEG C respectively.
Further, another embodiment of the invention additionally provides a kind of heavy silver surface treatment process of copper base, right
Before the circuit surface of copper base carries out welding resistance, it is fixed that the processing of LP route, acid etching, AOI detection and brill are successively carried out to copper base
The processing of position hole.
In the present embodiment, before the circuit surface to copper base carries out welding resistance, need to carry out certain preamble processing, including
The processing, etching and detection of route on circuit surface, further include laying location hole on copper base for subsequent bore process.
The full name of AOI is automatic optics inspection (AutomaticOpticInspection), be based on optical principle come pair
The equipment that the common deficiency encountered in welding production is detected carries out AOI inspection by using detection device in the present embodiment
It surveys, guarantees the quality of production of wiring board.
AOI detection needs to lay location hole on copper base, subsequent bore process directly chooses location hole after there is no problem
Place drills, general to carry out this technique using target drone is bored.
Further, another embodiment of the invention additionally provides a kind of heavy silver surface treatment process of copper base, described
The specific steps of LP route processing are as follows: nog plate pre-treatment first is carried out to copper base, patch dry film process is then carried out, is finally exposed
Light.
In the present embodiment, the main purpose of nog plate pre-treatment is the surfacing in order to guarantee copper base, after facilitating
Continuous production technology, and nog plate also only needs to handle copper face, does not need to carry out nog plate to protection film surface, so in this reality
It during applying example, needs to keep copper face that protective film is face-down upward, after the completion of processing before nog plate, will be done using laminator
Film pastes on copper face, is finally being exposed, and the energy hole of exposure is in 9-12 lattice.
Further, another embodiment of the invention additionally provides a kind of heavy silver surface treatment process of copper base, right
Before copper base carries out acid etching, encapsulated processing first is carried out to the edges of boards of copper base.
In the present embodiment, encapsulated processing first is carried out to the edges of boards of copper base, the liquid medicine of etching can be prevented to edges of boards
Erosion is stung, guarantees the quality of production of copper base.
Further, another embodiment of the invention additionally provides a kind of heavy silver surface treatment process of copper base, right
After the circuit surface of copper base carries out heavy silver processing, blue glue protective film is attached on circuit surface, and the extra blue glue of edges of boards is cut
Fall.
In the present embodiment, blue glue protective film is attached on circuit surface using the blue glue machine of patch, pad pasting speed control is in 0.5-
1.0m/min, preferably 0.8m/min, the size of blue glue be not it is completely the same with copper base, generally in production process
In, it can all use the blue glue slightly larger than copper base to prevent so needing to cut away in the extra blue glue of edges of boards after having pasted blue glue
Only extra blue glue influences the final product quality of wiring board, and blue glue is not intended to be attached to always on copper base, is generally pressing
It needs to tear in blue glue after 72 hours of blue glue, and 72 hours durations are enough completely to be produced for copper base.
The techniques such as subsequent drilling are carried out again after sticking blue glue on the circuit surface of copper base, since the protection of blue glue is made
With can prevent silver-colored face on circuit surface from being wiped flower, oxidation or pollution, guarantee the final product quality of wiring board.
Further, another embodiment of the invention additionally provides a kind of heavy silver surface treatment process of copper base, right
Before copper base carries out drilling processing, the first partiting pad above and below copper base.
In the present embodiment, the purpose of partiting pad is to provide buffering to copper base, prevents the dynamics of drilling machine is excessive from making
At the damage of copper base, while in order to further provide buffering, aluminium flake can also increased up and down, guarantee the matter of drilling
Amount.
Further, another embodiment of the invention additionally provides a kind of heavy silver surface treatment process of copper base, right
After copper base carries out drilling processing, milling plate, washing, DI washing process are carried out to copper base.
In the present embodiment, it needs to carry out subsequent processing to the copper base after drilling, specifically includes milling plate, washing and DI
Washing, when carrying out milling plate, it is also desirable to which backing plate setting up and down guarantees quality when milling plate, and the difference that washing and DI are washed is
911 liquid medicine are not added when washing in DI, only open DI washing, and when washing process, not only to open DI washing, it is also necessary to add 911 liquid medicine.
After being washed, needs to tear the blue glue protective film on copper base, can just carry out DI washing.
Further, another embodiment of the invention additionally provides a kind of heavy silver surface treatment process of copper base, such as Fig. 2
It is shown, specifically step are as follows: sawing sheet → LP route → AOI → brill location hole → welding resistance → FQC1 → heavy silver → patch indigo plant glue → drilling
→ milling plate → washing → FQC2 → FQA → DI washing → packaging, in above-mentioned processing step, before carrying out heavy silver, first to copper-based
The edges of boards of plate carry out encapsulated processing, then carry out heavy silver processing again, and FQC1, FQC2 and FQA refer in entire production process
In visual inspection that copper base is carried out, i.e. whether inspection copper base appearance, size etc. errorless, and FQC1 is to carry out first time final quality
Control inspection, FQC2 are to carry out second of final quality control inspection, and FQA is to carry out Plant quality assurance inspection.
In the present embodiment, heavy silver process is arranged before drilling, so when carrying out heavy silver processing, nothing on copper base
Hole, therefore will not there is a problem of that extra silver can be attached in hole, while before carrying out heavy silver, it can be first to the plate of copper base
Side carries out encapsulated processing, and during can preventing heavy silver, extra silver is attached on edges of boards, guarantees wiring board in process of production
Quality, without the process for rejecting extra silver is added, preventing producer, increased production cost, guarantees the profit of producer for producer.
It is to be illustrated to preferable implementation of the invention, but the invention is not limited to above-mentioned embodiment party above
Formula, those skilled in the art can also make various equivalent variations on the premise of without prejudice to spirit of the invention or replace
It changes, these equivalent deformations or replacement are all included in the scope defined by the claims of the present application.
Claims (8)
1. a kind of copper base sinks silver surface treatment process, it is characterised in that: the following steps are included:
Welding resistance is carried out to the circuit surface of copper base；
Heavy silver processing is carried out to its circuit surface after encapsulated to the edges of boards progress of copper base；
Drilling processing is carried out to copper base.
2. a kind of copper base according to claim 1 sinks silver surface treatment process, it is characterised in that: to the route of copper base
The specific steps of face progress welding resistance are as follows: the circuit surface of copper base keeps up, nog plate pre-treatment is carried out to circuit surface, nog plate is complete
It at rear progress silk-screen, pre-baked, aligned, exposed, being developed after the completion of pre-baked, being baked after being carried out after the completion of development.
3. a kind of copper base according to claim 1 sinks silver surface treatment process, it is characterised in that: in the line to copper base
Before road surface carries out welding resistance, the processing of LP route, acid etching, AOI detection are successively carried out to copper base and bores location hole processing.
4. a kind of copper base according to claim 3 sinks silver surface treatment process, it is characterised in that: the LP route processing
Specific steps are as follows: first to copper base carry out nog plate pre-treatment, then carry out patch dry film process, be finally exposed.
5. a kind of copper base according to claim 3 sinks silver surface treatment process, it is characterised in that: carried out to copper base
Before acid etching, encapsulated processing first is carried out to the edges of boards of copper base.
6. a kind of copper base according to claim 1 sinks silver surface treatment process, it is characterised in that: in the line to copper base
After road surface carries out heavy silver processing, blue glue protective film is attached on circuit surface, and the extra blue glue of edges of boards is cut away.
7. a kind of copper base according to claim 1 sinks silver surface treatment process, it is characterised in that: carried out to copper base
Before drilling processing, the first partiting pad above and below copper base.
8. a kind of copper base according to claim 1 sinks silver surface treatment process, it is characterised in that: carried out to copper base
After drilling processing, milling plate, washing, DI washing process are carried out to copper base.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910007488.3A CN109688721A (en) | 2019-01-02 | 2019-01-02 | A kind of heavy silver surface treatment process of copper base |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910007488.3A CN109688721A (en) | 2019-01-02 | 2019-01-02 | A kind of heavy silver surface treatment process of copper base |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109688721A true CN109688721A (en) | 2019-04-26 |
Family
ID=66192065
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910007488.3A Pending CN109688721A (en) | 2019-01-02 | 2019-01-02 | A kind of heavy silver surface treatment process of copper base |
Country Status (1)
| Country | Link |
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| CN (1) | CN109688721A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110687642A (en) * | 2019-09-26 | 2020-01-14 | 胜宏科技（惠州）股份有限公司 | Surface treatment method of high-speed optical module board |
| CN111050485A (en) * | 2019-12-30 | 2020-04-21 | 惠州市永隆电路有限公司 | Method for preventing PCB from being silvery and yellowing |
| CN112437540A (en) * | 2020-10-30 | 2021-03-02 | 惠州市成泰自动化科技有限公司 | Soft board PCB rubber coating machine |
| CN113316326A (en) * | 2021-04-26 | 2021-08-27 | 厦门理工学院 | Roll-to-roll copper foil plasma processing method and device and computer equipment |
| CN113316321A (en) * | 2021-04-23 | 2021-08-27 | 厦门理工学院 | Method and device for etching copper foil in roll-to-roll mode and computer equipment |
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| CN102917545A (en) * | 2012-10-21 | 2013-02-06 | 蔡新民 | Method for manufacturing high-frequency silver immersion circuit board |
| CN104869757A (en) * | 2015-06-02 | 2015-08-26 | 遂宁市广天电子有限公司 | COB thermoelectric separation copper substrate production process |
| CN107889369A (en) * | 2017-10-31 | 2018-04-06 | 东莞联桥电子有限公司 | A kind of copper base process of surface treatment |
| CN108668459A (en) * | 2018-05-22 | 2018-10-16 | 深圳崇达多层线路板有限公司 | A kind of printed board Novel electric platinum surface treatment method |
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2019
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| CN102917545A (en) * | 2012-10-21 | 2013-02-06 | 蔡新民 | Method for manufacturing high-frequency silver immersion circuit board |
| CN104869757A (en) * | 2015-06-02 | 2015-08-26 | 遂宁市广天电子有限公司 | COB thermoelectric separation copper substrate production process |
| CN107889369A (en) * | 2017-10-31 | 2018-04-06 | 东莞联桥电子有限公司 | A kind of copper base process of surface treatment |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110687642A (en) * | 2019-09-26 | 2020-01-14 | 胜宏科技（惠州）股份有限公司 | Surface treatment method of high-speed optical module board |
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| CN111050485A (en) * | 2019-12-30 | 2020-04-21 | 惠州市永隆电路有限公司 | Method for preventing PCB from being silvery and yellowing |
| CN112437540A (en) * | 2020-10-30 | 2021-03-02 | 惠州市成泰自动化科技有限公司 | Soft board PCB rubber coating machine |
| CN113316321A (en) * | 2021-04-23 | 2021-08-27 | 厦门理工学院 | Method and device for etching copper foil in roll-to-roll mode and computer equipment |
| CN113316326A (en) * | 2021-04-26 | 2021-08-27 | 厦门理工学院 | Roll-to-roll copper foil plasma processing method and device and computer equipment |
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Application publication date: 20190426 |