CN216721689U

CN216721689U - Mixed-spliced type PCB structure for preparing various types of PCBs

Info

Publication number: CN216721689U
Application number: CN202123448064.2U
Authority: CN
Inventors: 李海
Original assignee: Shenzhen Ubtech Technology Co ltd
Current assignee: Shenzhen Ubtech Technology Co ltd
Priority date: 2021-12-31
Filing date: 2021-12-31
Publication date: 2022-06-10
Anticipated expiration: 2031-12-31

Abstract

The utility model belongs to the technical field of electronic engineering, and particularly relates to a mixed-spliced PCB structure for preparing various types, which comprises a PCB substrate, wherein a plurality of preparation areas with different outline shapes and used for preparing the PCB are cut on the surface of the PCB substrate, the surface of the PCB substrate is basically paved with the plurality of preparation areas, and each preparation area is connected with a blank area of the PCB substrate through a plurality of easy-to-break connecting points. By the technical scheme, the problems that in the prior art, the cost for splicing and processing the single-type PCB after the PCB of each type is distinguished is high, and the market competitiveness of products is unfavorable are solved.

Description

Mixed-spliced type PCB structure for preparing various types of PCBs

Technical Field

The utility model belongs to the technical field of electronic engineering, and particularly relates to a mixed-spliced PCB structure for preparing various types.

Background

At present, in the PCB processing technology, a common manufacturer splices the same type of PCB on a larger PCB substrate, that is, splices the single type of PCB on a whole larger PCB substrate for processing. However, for a piece of machine equipment, the types of the required PCBs are many, and the cost of performing the single-type PCB splicing process after separating the PCBs of the respective types is high, which is not favorable for the market competitiveness of the product.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a mixed-spliced PCB structure for preparing various types of PCBs, and aims to solve the problems that in the prior art, the cost for splicing and processing single type PCBs after various types of PCBs are distinguished is high, and the market competitiveness of products is not good.

In order to achieve the purpose, the utility model adopts the technical scheme that: the mixed and spliced type PCB structure for preparing various types comprises a PCB substrate, wherein a plurality of preparation areas with different outline shapes and used for preparing the PCB are cut on the surface of the PCB substrate, the surface of the PCB substrate is basically paved with the preparation areas, and each preparation area is connected with a blank area of the PCB substrate through a plurality of easily-broken connection points.

Optionally, the thickness of each of the frangible connection points is less than the thickness of the PCB substrate.

Optionally, the edge lengths of the prepared areas between two adjacent frangible connection points on the same prepared area are equal.

Optionally, the PCB substrate includes a first blending and assembling surface and a second blending and assembling surface, the preparation area with a circular outline and tending towards the circular outline is blended and assembled on the first blending and assembling surface, and the preparation area with a rectangular outline, tending towards the rectangular outline and having a special-shaped outline is blended and assembled on the second blending and assembling surface.

Optionally, a conductive circuit is formed on the board surface of the preparation area in a preparation mode, and the board surface of the preparation area and the conductive circuit are covered by coating insulating oil.

Optionally, the insulating oil is a green oil.

Optionally, the PCB substrate is a ceramic substrate or a resin plate.

The utility model has at least the following beneficial effects:

the mixed-spliced type PCB structure provided by the embodiment of the utility model is applied to the preparation of various types of PCBs, the mixed-spliced combination of various types of PCBs is carried out on a large PCB substrate, the board surface of the PCB substrate is utilized to the maximum extent to plan and arrange the preparation areas of various types of PCBs, the PCB substrate is fully utilized, the material waste of the PCB substrate is greatly reduced, the preparation cost of the PCB is reduced, and the product competitiveness is enhanced.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without inventive exercise.

FIG. 1 is a first flow chart of a manufacturing process for manufacturing various types of PCB structures by a hybrid combination method according to an embodiment of the present invention;

FIG. 2 is a second flow chart of the manufacturing process for manufacturing various types of PCB structures by the hybrid combination method according to the embodiment of the present invention;

FIG. 3 is a schematic diagram of a hybrid-splicing assembly for manufacturing various types of PCB structures according to an embodiment of the present invention.

Wherein, in the figures, the respective reference numerals:

10. a PCB substrate;

11. positioning the pin holes;

12. a frangible connection point.

Detailed Description

Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are illustrative and intended to be illustrative of the utility model and are not to be construed as limiting the utility model.

In the description of the present invention, it is to be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships illustrated in the drawings, and are used merely for convenience in describing the present invention and for simplicity in description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed in a particular orientation, and be operated, and thus, are not to be construed as limiting the present invention.

Furthermore, the terms "first", "second", etc. are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first," "second," etc. may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.

In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.

Technical term interpretation:

PCB board: PCB, abbreviated as Printed Circuit Board, is a Printed Circuit Board, also called Printed Circuit Board, which is an important electronic component, is a support for electronic components, and is a carrier for electrical interconnection of electronic components.

Green oil: i.e., a liquid photosolder resist, is an acrylic oligomer. As a protective layer, it is coated on the circuit and substrate of printed circuit board without soldering, or used as solder resist. The purpose is to protect the formed circuit pattern for a long period of time.

As shown in fig. 1, the process for manufacturing various types of PCB board structures by hybrid combination according to the embodiment of the present invention includes the following steps:

step S10: and (4) surveying and mapping different types of PCB boards to obtain the outline shape of each PCB board. Specifically, the outline shape is represented according to the design drawing of the PCB for mapping (not the actual mapping of the PCB), so that the length of each edge line of the PCB, the angle between two adjacent edge lines, the transition fillet between two adjacent edge lines and other outline dimensions are obtained.

Step S20: preparing areas matched with the outline shapes of the corresponding PCBs are planned on the PCB substrate 10, and each preparing area is basically paved on the PCB substrate 10. That is to say, the outline shape of the PCB (that is, each preparation area to be planned) is drawn on the board surface of the PCB substrate 10, and different types of PCBs are adjacently laid according to the principle of similar side lengths, so as to reduce the margin area of the PCB substrate 10 as much as possible, and maximize the board surface of the PCB substrate 10 (that is, each preparation area is substantially fully paved with the PCB substrate 10).

Step 30: the edges of each prepared area are cut and a plurality of frangible connection points 12 are reserved at intervals. Referring to fig. 3 in combination, a positioning pin hole 11 is formed in the PCB substrate 10, the positioning pin hole 11 is matched with a pin of a mounting table of a cutting machine, so that the PCB substrate 10 is accurately positioned and fixedly mounted on the mounting table of the cutting machine, and then a cutting tool of the cutting machine is started to cut along the edge of the preparation area. When a preset distance is cut, the cutting tool is controlled to be too long, so that the breakable connecting point 12 is reserved, and the cutting is continued by analogy until the winding preparation area is cut for one circle.

Step S40: and laying lines on the PCB substrate 10 in each planned preparation area, so as to prepare and mold various PCB boards of different types.

By applying the mixed-spliced combined preparation process for preparing various types of PCB structures, provided by the embodiment of the utility model, various types of PCBs of different types are mixed-spliced and combined on a larger PCB substrate 10, the board surface of the PCB substrate 10 is maximally utilized to plan and layout preparation areas of the various types of PCBs, the PCB substrate 10 is fully utilized, the material waste of the PCB substrate 10 is greatly reduced, compared with the single-type PCB splicing processing in the prior art, the preparation cost of the PCB is reduced, and the product competitiveness is enhanced.

Referring to fig. 1 and 3 in combination, in step S20, preparation areas corresponding to the PCB panel having a circular contour and tending to have a circular contour are collectively planned on one side of the PCB substrate 10. The outline shapes tending to the circular outline include an ellipse, a regular polygon (the number of sides of the regular polygon is more than or equal to 5, namely, a regular hexagon, a regular heptagon, a regular octagon, a regular nonagon, a regular decagon and the like), a kidney, or an outline shape formed by compounding a rectangle and a semicircle and the like, so that the board surface of the PCB substrate 10 of the part is used to the maximum, and the blank area is reduced (namely, the waste amount is reduced).

And, in step S20, preparation areas corresponding to the PCB panel having the rectangular outline, the trend rectangular outline, and the special-shaped outline are planned on the other side of the PCB substrate 10. Profile shapes that tend to be rectangular in profile include trapezoids, rhomboids, and trapezoids. The contour shape of the irregular contour includes irregular polygons, a contour shape formed by combining rectangles and irregular polygons, and the like, so that the board surface of the PCB substrate 10 is maximally used, and the blank area is reduced (i.e., the amount of waste material is reduced).

In the mixed-spliced manufacturing process for manufacturing various types of PCB panel structures according to the embodiment of the present invention, in step S30, the edge lengths of the manufacturing areas between two adjacent breakable connection points 12 are equal. Therefore, when the numerical control machining programming is carried out on the cutting machine tool, the feed parameters can be simplified, the numerical control machining programming efficiency can be accelerated, and the programming errors can be reduced. In addition, the edge lengths of the preparation areas between two adjacent easy-breaking connection points 12 are equal, that is, the distance of each feed in the cutting process is consistent, so that the heat generated by each feed is the same, and then the cutter is cooled by heat dissipation in the time interval process of cutter lifting, so that the cutter is prevented from generating thermal stress fatigue.

In step S30, the frangible connection points 12 are cut so that the thickness of the frangible connection points 12 is smaller than the thickness of the PCB substrate 10. In the cutting process on the cutting machine, when the cutting reaches the reserved position of the easy-to-break connecting point 12, the cutter lifts, at the moment, the cutter does not completely lift the cutter beyond the board surface of the PCB substrate 10, and the cutting edge of the cutter is located between the upper board surface and the lower board surface of the PCB substrate 10. Therefore, the preparation area can be still kept stable and complete with the blank area of the PCB substrate 10 through the easy-breaking connection points 12, and the preparation area for preparing and molding the PCB can be directly and manually separated through the easy-breaking connection points 12, so that the separation operation is simple and rapid.

Referring to fig. 1 and 2 in combination, step S40 includes the following sub-steps:

step S41: and preparing conductive circuits for each preparation area. Specifically, the conductive line may be formed on the surface of the preparation area by a printed circuit process or formed on the surface of the preparation area by a photolithography process.

Step S42: and carrying out a surface mounting process on the preparation area for preparing the conducting circuit. The SMT (Surface mount Technology) is a short name for a series of process flows processed on the basis of PCB. Various electronic components such as capacitors, resistors and the like are additionally arranged on the PCB. In the embodiment of the utility model, a plurality of PCBs of different types are mixed and assembled on a larger PCB substrate 10, and then concentrated patch processing is carried out, compared with the prior art that the PCBs are spliced and subjected to patch processing according to single type, the patch processing cost can be reduced, so that the overall manufacturing cost of the PCBs is reduced, and the product competitiveness is enhanced.

Step S43: and (5) performing oil brushing treatment on the prepared board surface of the conducting circuit. Preferably, the prepared conductive circuit is brushed with green oil to cover and protect the prepared conductive circuit, so that the prepared PCB is not easy to generate short circuit fault when being transported, moved or assembled and welded.

In the mixed-spliced preparation process for preparing various types of PCB structures, the PCB substrate 10 can be kept still to solidify the brushed insulating oil after the oil brushing treatment is finished, so that a long-term effective protective layer is formed to protect the conductive circuit on the PCB; the insulating oil can be solidified by heating and baking the PCB so as to form a long-term effective protective layer for protecting the conductive circuit on the PCB. In order to ensure that the PCB is not deformed by the heat baking, it is necessary to control the temperature of the heat baking for the PCB.

Referring to fig. 1 and 2 in combination, the process for manufacturing multiple types of PCB panel structures by using the hybrid combination method further includes step S50: and executing a quality detection procedure on the PCB formed on each preparation area to judge whether the PCB is qualified. Packaging the PCB boards judged to be qualified in quality in a centralized manner, and then transporting the PCB boards to a customer or a warehouse for storage; the PCB which is judged to be unqualified in quality is collected in a centralized way, and the unqualified PCB which can be reworked is processed after being concentrated, so that the rejection rate is reduced, the cost is saved, and the unqualified PCB which cannot be reworked is processed after being concentrated and subjected to waste treatment.

According to another aspect of the present invention, there is provided a mixed-spliced type multi-type PCB panel structure, as shown in fig. 3, the mixed-spliced type multi-type PCB panel structure includes a PCB substrate 10, a plurality of preparation areas for preparing a PCB panel are cut on a panel surface of the PCB substrate 10 to form different outline shapes, the plurality of preparation areas substantially fill the panel surface of the PCB substrate 10, and each preparation area is connected to a blank area of the PCB substrate 10 through a plurality of breakable connection points 12.

By applying the mixed-spliced type PCB structure for preparing various types, various PCBs of different types are mixed-spliced and combined on a large PCB substrate 10, the board surface of the PCB substrate 10 is utilized to the maximum extent to plan and arrange preparation areas of various PCBs, the PCB substrate 10 is fully utilized, the material waste of the PCB substrate 10 is greatly reduced, the preparation cost of the PCB is reduced, and the product competitiveness is enhanced.

In one embodiment, the thickness of each of the frangible connection points 12 is less than the thickness of the PCB substrate 10.

In one embodiment, the lengths of the edges of the preparation areas between two adjacent breakable connecting points 12 on the same preparation area of the multi-type PCB structure are equal. Therefore, when the numerical control machining programming is carried out on the cutting machine tool, the feed parameters can be simplified, the numerical control machining programming efficiency can be accelerated, and the programming errors can be reduced. In addition, the edge lengths of the preparation areas between two adjacent easy-breaking connection points 12 are equal, that is, the distance of each feed in the cutting process is consistent, so that the heat generated by each feed is the same, and then the cutter is cooled by heat dissipation in the time interval process of cutter lifting, so that the cutter is prevented from generating thermal stress fatigue.

In one embodiment, the PCB substrate 10 includes a first side and a second side, as shown in fig. 3, two sides of the PCB substrate 10 (i.e. the first side and the second side) are shown in the left and right of the atmosphere. The preparation areas with the circular outline and the trend of the circular outline are blended and spliced on the first blending and splicing combined surface, and the preparation areas with the rectangular outline, the trend of the rectangular outline and the special-shaped outline are blended and spliced on the second blending and splicing combined surface.

In one embodiment, the conductive circuit is formed on the plate surface of the preparation area in a preparation mode, and the plate surface of the preparation area and the conductive circuit are covered by coating insulating oil. Specifically, the conductive line may be formed on the surface of the preparation area by a printed circuit process or formed on the surface of the preparation area by a photolithography process. Preferably, the insulating oil is a green oil. Therefore, short circuit faults are not easy to occur when the prepared PCB is transported, moved or assembled and welded.

In one embodiment, the PCB substrate is a ceramic substrate or a resin plate, so that the material is convenient to purchase and take, and the cost is low. The resin generally means a resin which has a softening or melting range after being heated, tends to flow by an external force when softened, and is solid or semi-solid at normal temperature.

The above description is intended to be illustrative of the preferred embodiment of the present invention and should not be taken as limiting the utility model, but rather, the intention is to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the utility model.

Claims

1. The mixed-spliced PCB structure for preparing various types is characterized by comprising a PCB substrate, wherein a plurality of preparation areas which are different in outline shape and used for preparing the PCB are formed on the board surface of the PCB substrate in a cutting mode, the board surface of the PCB substrate is basically paved with the plurality of preparation areas, and each preparation area is connected with a blank area of the PCB substrate through a plurality of easy-to-break connection points.

2. The hybrid-splicing type multi-type PCB board structure as recited in claim 1, wherein the thickness of each of the breakable connecting points is smaller than the thickness of the PCB substrate.

3. The jigsaw type PCB structure of claim 1 or 2, wherein the lengths of the edges of the prepared areas between two adjacent breakable connecting points on the same prepared area are equal.

4. The jigsaw assembly of claim 3, wherein the PCB substrate includes a first jigsaw assembly surface and a second jigsaw assembly surface, the preparation area with a circular contour and a contour tending to the circular contour is jigsaw on the first jigsaw assembly surface, and the preparation area with a rectangular contour, a contour tending to the rectangular contour and a contour tending to the special contour is jigsaw on the second jigsaw assembly surface.

5. The blending and assembling type multi-type PCB structure as claimed in claim 4, wherein a conductive circuit is formed on the board surface of the preparation area, and the board surface of the preparation area and the conductive circuit are covered by coating insulating oil.

6. The hybrid combination type multi-type PCB board structure as claimed in claim 5, wherein the insulating oil is green oil.

7. The hybrid-splicing type multi-type PCB structure as claimed in claim 1, wherein the PCB substrate is a ceramic substrate or a resin plate.