CN109686701B - Particle-separable ceramic substrate and separation method thereof - Google Patents
Particle-separable ceramic substrate and separation method thereof Download PDFInfo
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- CN109686701B CN109686701B CN201811610565.6A CN201811610565A CN109686701B CN 109686701 B CN109686701 B CN 109686701B CN 201811610565 A CN201811610565 A CN 201811610565A CN 109686701 B CN109686701 B CN 109686701B
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- Prior art keywords
- cutting groove
- ceramic substrate
- substrate body
- circuit unit
- substrate
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- 239000000758 substrate Substances 0.000 title claims abstract description 103
- 239000000919 ceramic Substances 0.000 title claims abstract description 57
- 238000000926 separation method Methods 0.000 title claims abstract description 17
- 238000001816 cooling Methods 0.000 claims description 11
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 6
- 239000007769 metal material Substances 0.000 claims description 4
- 238000005553 drilling Methods 0.000 claims description 3
- 238000000034 method Methods 0.000 claims description 3
- 229910052757 nitrogen Inorganic materials 0.000 claims description 3
- 238000005245 sintering Methods 0.000 claims description 3
- 239000002002 slurry Substances 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 11
- 239000004020 conductor Substances 0.000 abstract description 4
- 229910052751 metal Inorganic materials 0.000 abstract description 3
- 239000002184 metal Substances 0.000 abstract description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 229910010293 ceramic material Inorganic materials 0.000 description 2
- 230000008602 contraction Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 241001391944 Commicarpus scandens Species 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000013467 fragmentation Methods 0.000 description 1
- 238000006062 fragmentation reaction Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
- H01L21/3043—Making grooves, e.g. cutting
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Structure Of Printed Boards (AREA)
- Devices For Post-Treatments, Processing, Supply, Discharge, And Other Processes (AREA)
Abstract
The invention discloses a particle-type separable ceramic substrate, which comprises a substrate body, wherein a circuit unit is arranged on the substrate body, upper cutting grooves which are communicated with each other are formed in the substrate body around the circuit unit, filling circuits made of metal conductive materials are arranged in the upper cutting grooves, and external electrodes used for connecting power supply equipment are arranged on the substrate body and communicated with the filling circuits; the circuit unit is arranged on one side face of the substrate body, and the lower cutting groove is arranged on the other side face of the substrate body corresponding to the upper cutting groove. And a separation method based on the ceramic substrate. The invention can effectively ensure the plate body strength of the ceramic substrate in the production process, is easy to separate the ceramic substrate, and can ensure the quality of the ceramic substrate during grain separation.
Description
Technical Field
The invention belongs to the technical field of semiconductor packaging, and particularly relates to a particle-type separable ceramic substrate and a separation method thereof.
Background
At present, in the packaging industry of semiconductors, a ceramic substrate is usually cut by a water knife or laser in a separation mode, and corresponding cutting equipment is complex and expensive, so that the production cost of a packaged product is high.
In actual production, pre-cutting is usually carried out during the production of the ceramic substrate, but the existence of the cutting lines can reduce the strength of the plate body of the ceramic substrate, so that the ceramic substrate is easy to break in the production process; moreover, when the ceramic substrate is separated into single pieces, no matter the single pieces are broken by hands or machines, the phenomena of fragmentation and burrs of a certain number of single pieces of products are caused, and the production yield of the products is low.
Disclosure of Invention
In order to solve the problems, the invention aims to provide a particle-type separable ceramic substrate and a separation method thereof, which can effectively ensure the strength of the ceramic substrate in the production process, facilitate the separation of the ceramic substrate and ensure the quality of the ceramic substrate during particle-type separation.
In order to achieve the above purpose, the invention is realized according to the following technical scheme:
The particle-type separable ceramic substrate comprises a substrate body, wherein a plurality of circuit units are arranged on the substrate body, and printed circuits capable of realizing self electrical functions are arranged on the circuit units; the circuit unit is arranged on the substrate body, the circuit unit is arranged on the circuit unit, and the circuit unit is connected with the circuit unit; the circuit unit is arranged on one side face of the substrate body, and the lower cutting groove is arranged on the other side face of the substrate body corresponding to the upper cutting groove.
Preferably, the filling lines are disposed in the lower cutting groove, and the filling lines disposed on both sides of the substrate body are electrically connected or communicated with each other.
Preferably, the cutting depth of the upper cutting groove and the lower cutting groove is 10% -45% of the thickness of the substrate body.
Preferably, the depth of the upper cutting groove is greater than the depth of the lower cutting groove.
Preferably, the substrate body is provided with a central area and an edge area, the circuit units are all arranged in the central area, and the external electrode is oppositely arranged on the edge area.
Preferably, the substrate body is rectangular, and the circuit units are arranged on the substrate body in an array.
Preferably, one upper cutting groove is shared between adjacent circuit units.
The ceramic substrate separating process includes the following steps:
S1, setting an upper cutting groove corresponding to the appearance of a circuit unit to be installed on a ceramic substrate or the appearance of the circuit unit installed on the ceramic substrate, and setting a lower cutting groove corresponding to the upper cutting groove on the lower end surface of the ceramic substrate;
S2, printing with metal material slurry with conductivity in the upper cutting groove, sintering and solidifying the printed ceramic substrate to form a filling circuit, and arranging an external electrode communicated with the filling circuit on the edge area of the ceramic substrate;
S3, connecting the external electrode with power supply equipment, and introducing current to the filling line through the power supply equipment to heat and raise the temperature of the filling line;
s4, setting a cooling device, and rapidly cooling the ceramic substrate in the step S3 to realize grain separation of the ceramic substrate along the upper cutting groove.
Further, in step S1, the upper cutting groove and the lower cutting groove are made by means of laser drilling.
Further, the cooling device used in step S4 is a nitrogen cooling device.
Compared with the prior art, the invention has the beneficial effects that:
1. In the scheme, the upper cutting line is arranged on the upper surface of the ceramic substrate corresponding to the circuit unit, and the filling circuit made of the slurry of the conductive material is filled in the upper cutting line, so that the mechanical strength of the ceramic substrate is effectively enhanced, and the ceramic substrate is ensured not to crack in the production process.
2. A lower cutting line is arranged on the lower surface of the ceramic substrate corresponding to the upper cutting line, and the lower cutting line can provide an impetus for grain separation of the ceramic substrate; at this moment, the filling circuit is electrified to heat the filling circuit, then the ceramic substrate is rapidly cooled, and the internal stress generated by thermal expansion and cold contraction can separate the ceramic substrate into single products along the direction of the cutting groove.
3. The characteristics of high brittleness and insufficient toughness of the ceramic substrate are skillfully utilized, and the application of the principle of thermal expansion and cold contraction is realized, so that the ceramic substrate can be quickly separated into single products by only electrifying and heating the ceramic substrate and then cooling the ceramic substrate, and the plate separation operation is not needed to be performed manually or by a machine, so that the production efficiency and the economic benefit are effectively improved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for the description of the embodiments will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic top view of a ceramic substrate according to the present invention.
FIG. 2 is a schematic diagram showing a semi-sectional structure of a ceramic substrate according to the present invention.
Fig. 3 is a schematic cross-sectional view of the present invention along a fill line.
Wherein: 100-ceramic substrate, 1-substrate body, 11-upper cutting groove, 12-lower cutting groove, 13-filling circuit, 14-external electrode and 2-circuit unit.
Detailed Description
In order that the above-recited objects, features and advantages of the present application will be more clearly understood, a more particular description of the application will be rendered by reference to the appended drawings and appended detailed description. The embodiments of the present application and the features in the embodiments may be combined with each other without collision. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application, and the described embodiments are merely some, rather than all, embodiments of the present application. All other embodiments, which can be made by those skilled in the art based on the embodiments of the present application without making any inventive effort, are intended to fall within the scope of the present application.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.
Example 1
As shown in fig. 1 to 3, a grain-separable ceramic substrate 100 is provided in this embodiment, and includes a substrate body 1 and a circuit unit 2 disposed on the substrate body 1.
The cross-sectional area of the substrate body 1 in a top view is rectangular, the cross-sectional area of the circuit unit 2 arranged on the substrate body 1 in a top view is also rectangular, and the circuit units are arranged on the upper end surface of the substrate body 1 in an array manner so as to facilitate subsequent processing and manufacturing. The substrate material in this embodiment is a common ceramic material such as alumina, zirconia, aluminum nitride, etc., and the ceramic material contains conventional doping components. The circuit units 2 can be arranged in a plurality according to actual production conditions, and each circuit unit 2 is provided with a printed circuit capable of realizing self electrical functions; so that the circuit unit 2 can be used alone after the grain separation with the ceramic substrate 100.
Further, the substrate body 1 is provided with mutually communicated upper cutting grooves 11 around the circuit units 2, and one upper cutting groove 11 is shared between adjacent circuit units 2; the circuit unit 2 is disposed on one side of the substrate body 1, and the lower cutting groove 12 is disposed on the other side of the substrate body 1 corresponding to the upper cutting groove 11. The cutting depth of the upper cutting groove 11 and the lower cutting groove 12 is 10% -45% of the thickness of the substrate body 1, and the preferable interval value is 20% -30%; and the depth of the upper cutting groove 11 is greater than the depth of the lower cutting groove 12.
The upper cutting groove 11 is provided with a filling circuit 13 made of a metal conductive material, wherein the metal conductive material can be silver, copper or other metal materials with similar conductive properties; the substrate body 1 is provided with an external electrode 14 which is communicated with the filling circuit 13 and is used for connecting power supply equipment. As a preferable mode, the filling lines 13 may be disposed in the lower cutting groove 12, and the filling lines 13 disposed on both sides of the substrate body 1 may be disposed by means of electrical connection or direct communication connection.
In this embodiment, the area division is performed on the substrate body 1, including a central area and an edge area disposed on the substrate body 1, the circuit units 2 are arranged in an array manner and disposed in the central area, and the external electrodes 14 are disposed on the edge area in an opposite manner, so that the resistance of the filling circuit 13 between the external electrodes 14 can be relatively close under the condition of current access; in addition, the ceramic substrate 100 can be conveniently connected and used in the whole state, and the external electrode 14 can be removed or recovered after the particle separation of the substrate body 1.
To facilitate the further understanding of the present embodiment, a method for separating the ceramic substrate 100 is provided herein, which specifically includes the following steps:
S1, an upper cutting groove 11 is formed in the upper end surface of the substrate body 1 corresponding to the appearance of a circuit unit 2 which needs to be mounted on the substrate body 1 or the appearance of the circuit unit 2 which is mounted on the substrate body 1, and a lower cutting groove 12 is formed in the lower end surface of the substrate body 1 corresponding to the position of the upper cutting groove 11; wherein, the upper cutting groove 11 and the lower cutting groove 12 are both manufactured by adopting a laser drilling mode. When the upper dicing groove 11 is provided in accordance with the outline of the circuit unit 2 to be mounted on the substrate body 1, the circuit unit 2 should be provided after the upper dicing groove 11 is provided.
S2, printing with a paste of a metal material with conductive performance, such as silver paste, in the upper cutting groove 11, sintering and solidifying the printed ceramic substrate 100 to form a filling line 13, and arranging an external electrode 14 communicated with the filling line 13 on the edge area of the ceramic substrate 100.
S3, connecting the external electrode 14 to power supply equipment, and introducing current to the filling line 13 through the power supply equipment so that the filling line 13 heats up; the size of the current output by the power supply device can be adjusted, and the thickness degree of the filling line 13 is adapted to the output current of the power supply device, so that the filling line 13 is ensured not to be fused due to the fact that the local section is too small in the state of being fed with preset current intensity.
S4, setting a cooling device, which may be a nitrogen cooling device preferably, to rapidly cool the ceramic substrate 100 in the step S3, so that the set filling line 13 generates severe internal stress change, and the ceramic substrate is separated along the direction of the upper cutting groove 11 by taking the lower cutting groove 12 as an acting point, thereby obtaining a single product with the circuit unit 2.
The present invention is not limited to the preferred embodiments, and any modifications, equivalent variations and modifications made to the above embodiments according to the technical principles of the present invention are within the scope of the technical proposal of the present invention.
Claims (2)
1. The ceramic substrate separation method is characterized by comprising a substrate body, wherein a plurality of circuit units are arranged on the substrate body, and printed circuits capable of realizing the self electrical functions are arranged on the circuit units; the circuit unit is arranged on the substrate body, the circuit unit is arranged on the circuit unit, and the circuit unit is connected with the circuit unit;
The circuit unit is arranged on one side surface of the substrate body, and a lower cutting groove is arranged on the other side surface of the substrate body corresponding to the upper cutting groove; the filling lines are arranged in the lower cutting groove and are electrically connected or communicated with each other; the cutting depth of the upper cutting groove and the lower cutting groove is 10% -45% of the thickness of the substrate body; the depth of the upper cutting groove is greater than that of the lower cutting groove; the substrate body is provided with a central area and an edge area, the circuit units are arranged in the central area, and the external electrode is oppositely arranged on the edge area; the substrate body is rectangular, and the circuit units are arranged on the substrate body in an array manner; the adjacent circuit units share one upper cutting groove;
the separation method of the ceramic substrate comprises the following steps:
S1, setting an upper cutting groove corresponding to the appearance of a circuit unit to be installed on a ceramic substrate or the appearance of the circuit unit installed on the ceramic substrate, and setting a lower cutting groove corresponding to the upper cutting groove on the lower end surface of the ceramic substrate;
S2, printing with metal material slurry with conductivity in the upper cutting groove, sintering and solidifying the printed ceramic substrate to form a filling circuit, and arranging an external electrode communicated with the filling circuit on the edge area of the ceramic substrate;
S3, connecting the external electrode with power supply equipment, and introducing current to the filling line through the power supply equipment to heat and raise the temperature of the filling line;
S4, setting a cooling device, and rapidly cooling the ceramic substrate in the step S3 to realize grain separation of the ceramic substrate along the upper cutting groove, wherein the cooling device is a nitrogen cooling device.
2. The method according to claim 1, wherein in step S1, the upper and lower grooves are formed by laser drilling.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811610565.6A CN109686701B (en) | 2018-12-27 | 2018-12-27 | Particle-separable ceramic substrate and separation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811610565.6A CN109686701B (en) | 2018-12-27 | 2018-12-27 | Particle-separable ceramic substrate and separation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109686701A CN109686701A (en) | 2019-04-26 |
| CN109686701B true CN109686701B (en) | 2024-05-10 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201811610565.6A Active CN109686701B (en) | 2018-12-27 | 2018-12-27 | Particle-separable ceramic substrate and separation method thereof |
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| Country | Link |
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| CN (1) | CN109686701B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111975220A (en) * | 2020-08-14 | 2020-11-24 | 乐健科技（珠海）有限公司 | Heat-conducting metal block splicing plate and processing method of heat-conducting metal block |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6476415B1 (en) * | 2000-07-20 | 2002-11-05 | Three-Five Systems, Inc. | Wafer scale processing |
| EP1359612A2 (en) * | 2002-04-24 | 2003-11-05 | Sanyo Electric Co., Ltd. | Methods of manufacturing a hybrid integrated circuit device |
| JP2011054653A (en) * | 2009-08-31 | 2011-03-17 | Elpida Memory Inc | Manufacturing method of semiconductor device |
| KR20110139954A (en) * | 2010-06-24 | 2011-12-30 | 삼성엘이디 주식회사 | Cutting device and method for cutting metal substrate |
| JP2012069698A (en) * | 2010-09-22 | 2012-04-05 | Alps Electric Co Ltd | Electronic circuit module and method for manufacturing the same |
| CN102437254A (en) * | 2010-09-29 | 2012-05-02 | 展晶科技(深圳)有限公司 | Method for forming light-emitting diode chip by cutting and separating light-emitting diode wafer |
| KR20120138283A (en) * | 2011-06-14 | 2012-12-26 | (주) 아모엘이디 | Method for manufacturing ceramic substrate |
| CN209389018U (en) * | 2018-12-27 | 2019-09-13 | 广东晶科电子股份有限公司 | It is a kind of can grain formula separation ceramic substrate |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002026270A (en) * | 2000-07-10 | 2002-01-25 | Nec Corp | Method for manufacturing semiconductor device |
| US20050062135A1 (en) * | 2001-12-25 | 2005-03-24 | Takashi Tase | Semiconductor device and method for fabricating the same |
| JP2006086516A (en) * | 2004-08-20 | 2006-03-30 | Showa Denko Kk | Manufacturing method of semiconductor light emitting device |
| JP2015177061A (en) * | 2014-03-14 | 2015-10-05 | 株式会社東芝 | Semiconductor device manufacturing method and semiconductor device |
-
2018
- 2018-12-27 CN CN201811610565.6A patent/CN109686701B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6476415B1 (en) * | 2000-07-20 | 2002-11-05 | Three-Five Systems, Inc. | Wafer scale processing |
| EP1359612A2 (en) * | 2002-04-24 | 2003-11-05 | Sanyo Electric Co., Ltd. | Methods of manufacturing a hybrid integrated circuit device |
| JP2011054653A (en) * | 2009-08-31 | 2011-03-17 | Elpida Memory Inc | Manufacturing method of semiconductor device |
| KR20110139954A (en) * | 2010-06-24 | 2011-12-30 | 삼성엘이디 주식회사 | Cutting device and method for cutting metal substrate |
| JP2012069698A (en) * | 2010-09-22 | 2012-04-05 | Alps Electric Co Ltd | Electronic circuit module and method for manufacturing the same |
| CN102437254A (en) * | 2010-09-29 | 2012-05-02 | 展晶科技(深圳)有限公司 | Method for forming light-emitting diode chip by cutting and separating light-emitting diode wafer |
| KR20120138283A (en) * | 2011-06-14 | 2012-12-26 | (주) 아모엘이디 | Method for manufacturing ceramic substrate |
| CN209389018U (en) * | 2018-12-27 | 2019-09-13 | 广东晶科电子股份有限公司 | It is a kind of can grain formula separation ceramic substrate |
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| CN109686701A (en) | 2019-04-26 |
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