CN109683434B

CN109683434B - Camera module array

Info

Publication number: CN109683434B
Application number: CN201711060630.8A
Authority: CN
Inventors: 梅哲文; 方银丽; 赵波杰; 田中武彦; 苏小娟; 郭楠
Original assignee: Ningbo Sunny Opotech Co Ltd
Current assignee: Ningbo Sunny Opotech Co Ltd
Priority date: 2017-10-18
Filing date: 2017-11-02
Publication date: 2024-05-28
Anticipated expiration: 2037-11-02
Also published as: CN109688303B; CN109683434A; CN109688302A; CN109688298A; CN109688299B; CN207663195U; CN207978027U; CN109688299A; CN109688298B; CN109688301A; CN109688303A; CN207766338U; CN207691907U; CN208369686U; CN207665056U; CN109688302B

Abstract

The invention provides a camera module array, which comprises: first and second lens components; first and second photosensitive elements; a first color filter; an integrated substrate. The integrated substrate includes: a circuit board and a molding part. The circuit board is provided with a first area and a second area which are suitable for mounting the first lens assembly and the second lens assembly. The molding part is integrally formed on the second surface of the circuit board and covers the first area and the second area; the integrated substrate is provided with a first flat surface and a second flat surface which are positioned at different heights, and the first photosensitive element and the second photosensitive element are respectively arranged on the first flat surface and the second flat surface. The first lens support bottom is supported against the first surface, and the first color filter support is separated from the first lens support. The invention can enhance the structural strength of the base plate of the double-camera module, provide two photosensitive element mounting surfaces with different heights, reduce the radial size of the camera module array and the shoulder height and the total height of the camera module array, and avoid the interference between the rear end of the lens and the color filter support body.

Description

Camera module array

Technical Field

The invention relates to the technical field of optics, in particular to a solution of an image pickup module array.

Background

Along with the continuous development of intelligent devices, the requirements on the camera module are higher and higher. For example, in recent two years, the camera of the smart phone is changed from a single camera to a double camera, and the development of a double camera module is also an important trend of the development of the camera module of the mobile phone. In short, the double cameras can acquire images through the cooperation of the two cameras, so that a richer image acquisition function is realized. The existing double cameras can be mainly divided into two types according to functions: the method is characterized in that stereoscopic vision is generated by using two cameras, the depth of field of an image is obtained, background blurring, scanning, auxiliary focusing, action recognition and other applications are performed by using depth of field information, or fusion is performed by using information of two pictures; the other is to fuse the left and right different pictures to obtain better resolution, better color, dynamic range and other better image quality or realize the function of optical zooming.

In any case, the dual cameras need hardware support, and one of the most basic problems is to consider the assembly and fixation between two cameras. How to stably and compactly assemble two cameras together to form an integral module is a basic problem considered by a double-camera module. On the other hand, two cameras constituting a dual camera are typically two different types of cameras, such as one for imaging and one for recording depth of field. The requirement of different functions generally makes the two cameras different in size, such as different in height, and how to combine the two cameras with different heights stably to make the two cameras into a whole is another important problem encountered in the development of the dual-camera module.

In the prior art, a metal bracket is generally manufactured, the bracket is provided with two accommodating holes, and after two cameras are respectively manufactured, the two camera modules are respectively arranged in the two accommodating holes of the metal bracket, so that a stable and reliable double camera module is formed. However, the above solution also has the problems of increased module size and increased cost.

Thus, solutions are currently urgent to overcome the above drawbacks.

Disclosure of Invention

The present invention aims to provide a solution that overcomes at least one of the above-mentioned drawbacks of the prior art.

According to an aspect of the present invention, there is provided an image pickup module array including: a first lens assembly including a first lens and a first lens support; a second lens assembly; a first photosensitive element; a second photosensitive element; a first color filter; an integrated substrate. The integrated substrate includes: a circuit board having a first region adapted to mount a first lens assembly and a second region adapted to mount a second lens assembly, the circuit board further having a first surface proximate to the first lens and the second lens and a second surface opposite to the first surface; and a molding part integrally formed on a second surface of the circuit board by a molding process, and covering at least a portion of the second surface corresponding to the first region and at least a portion of the second surface corresponding to the second region; the integrated substrate is provided with a first flat surface and a second flat surface which are positioned at different heights, the first photosensitive element is installed on the first flat surface, and the second photosensitive element is installed on the second flat surface.

The first lens support is mounted on the first area of the circuit board, the bottom of the first lens support is supported against the first surface, the first color filter is mounted on the integrated substrate through the first color filter support, and the first color filter support is separated from the first lens support.

The first region of the circuit board is provided with a first through hole, and the first flat surface is positioned in the first through hole.

The first area of the circuit board is provided with a first groove, and the first flat surface is located in the first groove.

The integrated substrate further comprises a first metal sheet, the molding part is provided with a second through hole corresponding to the first through hole and suitable for accommodating the first photosensitive element, the first metal sheet covers the first through hole and the second through hole, and the first flat surface is located on the first metal sheet.

Wherein at least one capacitor or resistor element is mounted on the second surface, and the molding part covers the at least one capacitor or resistor element.

Wherein the bottom of the first color filter support is mounted on the first photosensitive element, and the first color filter is mounted on the top of the first color filter support.

Wherein the first color filter support is in a shape of a loop.

The first color filter support body comprises a side wall (namely a support body side wall) and a top cover (namely a support body extension part) with a light transmission hole, and the bottom of the side wall is arranged on the circuit board.

Wherein the integrated substrate further includes a first metal line electrically connecting the first photosensitive element with the wiring board, and the first metal line serves as the first color filter support, and the first color filter is mounted on the first metal line.

Wherein the first color filter is adhered to the first metal wire through a glue material.

Wherein, the glue material covers the first metal wire.

The adhesive fills the gap between the first photosensitive element and the circuit board.

The molding part is provided with a contact surface contacted with the second surface and a non-contact surface formed by extending the contact surface and covering the first through hole, and the first flat surface is formed on the non-contact surface.

Wherein the non-contact surface and the contact surface are in the same plane.

Wherein, the non-contact surface forms a boss or a groove, and the first flat surface is positioned on the boss or the groove of the non-contact surface.

The first metal sheet is provided with a boss, and the first flat surface is positioned on the boss of the first metal sheet.

Wherein the first color filter is mounted on the lower surface of the top cover (and the support extension).

The first lens support body is a first motor.

The second lens assembly comprises a second lens and a second lens supporting body.

The first lens component is a zoom lens component, and the second lens component is a fixed focus lens component.

Compared with the prior art, the invention has at least one of the following technical effects:

1. The invention can enhance the structural strength of the substrate with the two double-camera modules with different optical designs.

2. The invention can provide the mounting surfaces of two photosensitive elements with different heights, thereby better adapting to the double-camera module with two different optical designs.

3. The invention can cancel the metal bracket with two containing holes in the traditional scheme for the double-camera module with two different optical designs, thereby saving the cost and reducing the production procedures.

4. The invention is beneficial to reducing the radial size of the camera module array and simultaneously avoiding interference between the rear end of the lens and the color filter support body.

5. The shoulder height and the total height of the camera module are reduced.

Drawings

Exemplary embodiments are illustrated in referenced figures. The embodiments and figures disclosed herein are to be regarded as illustrative rather than restrictive.

FIG. 1 illustrates an array of camera modules in accordance with one embodiment of the present invention;

FIG. 2 illustrates the shape of mold 500 in several other embodiments;

FIG. 3 illustrates an array of camera modules according to another embodiment of the present invention;

FIG. 4 illustrates an array of camera modules in accordance with yet another embodiment of the present invention;

FIG. 5 illustrates an array of camera modules in accordance with yet another embodiment of the present invention;

FIG. 6 illustrates an array of camera modules in accordance with yet another embodiment of the present invention;

FIG. 7 illustrates an array of camera modules in accordance with yet another embodiment of the present invention;

FIG. 8 illustrates an array of camera modules in accordance with yet another embodiment of the present invention;

FIG. 9 illustrates an array of camera modules in accordance with yet another embodiment of the present invention;

FIG. 10 illustrates an array of camera modules in accordance with yet another embodiment of the present invention;

FIG. 11 illustrates an array of camera modules in accordance with yet another embodiment of the present invention;

FIG. 12 illustrates an array of camera modules in accordance with yet another embodiment of the present invention;

FIG. 13 illustrates an array of camera modules in accordance with yet another embodiment of the present invention;

FIG. 14 illustrates an array of camera modules in accordance with yet another embodiment of the present invention;

FIG. 15 illustrates an array of camera modules in accordance with yet another embodiment of the present invention;

FIG. 16 illustrates an array of camera modules in accordance with yet another embodiment of the present invention;

FIG. 17 illustrates an array of camera modules in accordance with yet another embodiment of the present invention;

fig. 18 shows an array of camera modules according to yet another embodiment of the present invention.

Detailed Description

For a better understanding of the application, various aspects of the application will be described in more detail with reference to the accompanying drawings. It should be understood that the detailed description is merely illustrative of exemplary embodiments of the application and is not intended to limit the scope of the application in any way. Like reference numerals refer to like elements throughout the specification. The expression "and/or" includes any and all combinations of one or more of the associated listed items.

It should be noted that in this specification, the expressions first, second, etc. are only used to distinguish one feature from another feature, and do not represent any limitation of the feature. Accordingly, a first body discussed below may also be referred to as a second body without departing from the teachings of the present application.

In the drawings, the thickness, size and shape of the object have been slightly exaggerated for convenience of explanation. The figures are merely examples and are not drawn to scale.

It will be further understood that the terms "comprises," "comprising," "includes," "including," "having," "containing," and/or "including," when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. Furthermore, when a statement such as "at least one of the following" appears after a list of features that are listed, the entire listed feature is modified instead of modifying a separate element in the list. Furthermore, when describing embodiments of the present application, the use of "may" means "one or more embodiments of the present application. Also, the term "exemplary" is intended to refer to an example or illustration.

As used herein, the terms "substantially," "about," and the like are used as terms of a table approximation, not as terms of a table level, and are intended to illustrate inherent deviations in measured or calculated values that would be recognized by one of ordinary skill in the art.

Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

It should be noted that, without conflict, the embodiments of the present application and features of the embodiments may be combined with each other. The application will be described in detail below with reference to the drawings in connection with embodiments.

Fig. 1 shows an array of camera modules according to an embodiment of the invention. Referring to fig. 1, the camera module array includes a first camera module and a second camera module with different optical designs, and the first camera module and the second camera module share a unitary substrate 600. Wherein the integrated substrate 600 includes an integrated circuit board 400 and a molding part 500 formed at the integrated circuit board 400 through a molding process.

In the present embodiment, the integrated circuit board 400 has a first surface 410 located on an upper side of the integrated circuit board 400 and a second surface 420 opposite to the first surface, wherein the first surface 410 is used for mounting the first lens assembly 100 and the second lens assembly 200. For convenience of description, the area of the circuit board 400 for mounting the first lens assembly 100 will be referred to herein as a first area, and the area of the circuit board 400 for mounting the second lens assembly 200 will be referred to herein as a second area. The lens assembly includes a lens and sometimes a motor or a lens support. In this embodiment, the first lens assembly 100 includes a first lens 101 and a first motor 102, and the second lens assembly 200 includes a second lens 201, a lens support 202, and a second color filter 206 mounted on the lens support 202 and located at a rear end of the second lens 201. It should be noted that in other embodiments, the second lens assembly 200 may not include the second color filter 206, in which case the second color filter 206 may be mounted on a lens holder of the integrated circuit board 400.

In this embodiment, the molding part 500 is formed on the second surface 420 of the integrated circuit board 400 by a molding process, and covers the first area and the second area. The molding part 500 forms a plate shape and plays a role in reinforcing the integrated circuit board 400, so that the integrated circuit board 400 combined with the molding part 500 has better structural strength and stability, and the overall reliability of the module is improved.

Further, the first region of the circuit board 400 has a first through hole adapted to accommodate the first photosensitive element 104. The molding part 500 covers the first through hole, and an upper surface of the molding part 500 forms a first flat surface suitable for mounting the first photosensitive element 104. Here, the upper surface, i.e., the surface of the portion of the molding part 500 covering the first through hole. Specifically, the molding part 500 has a contact surface 510 contacting the second surface 420 of the circuit board 400, and a non-contact surface 520 extending from the contact surface 510 to cover the first through hole, and the first flat surface is formed on the non-contact surface 520. In the present embodiment, the non-contact surface 520 covering the first through hole is on the same plane with the contact surface 510 between the circuit board 400 and the molding part 500, but it should be noted that the present invention is not limited thereto. In other embodiments of the present invention, the contact surface 510 between the circuit board 400 and the molding 500 may not be in the same plane.

In one embodiment, a second planar surface suitable for mounting the second photosensitive element 204 is formed at a second region of the wiring board 400. The first planar surface and the second planar surface are at different heights in order to accommodate two camera modules of different optical designs (e.g., different back focus). The height refers to the dimension of the integrated substrate 600 in the thickness direction (the thickness direction of the integrated substrate 600 may be understood as being along the optical axis direction of the camera module, and thus may be referred to as the "axial direction"). Further, in one embodiment, a dielectric sheet 207 may be added to the second area of the circuit board 400, and a second flat surface is provided by the dielectric sheet 207. In this way, the difference in height between the first photosensitive element 104 and the second photosensitive element 204 can be more flexibly adjusted.

Further, since the rear focal lengths of the first camera module 100 and the second camera module 200 are different, the thickness direction dimensions of the first camera module 100 and the second camera module 200 are different, so in the conventional integrated dual camera module, the heights of the first camera module 100 and the second camera module 200 are generally one high and one low (in this embodiment, the first camera module 100 is higher than the second camera module 200). However, the dual-camera module required in the current market often needs to make the front end surface (or the light incident surface) of the lens be leveled so as to meet the requirements of beauty or image processing algorithm. In order to meet the above requirements, two camera modules are usually manufactured separately in the prior art, and then the two camera modules are combined together by a metal bracket with two accommodating holes.

In this embodiment, the first photosensitive element 104 may be sunk relative to the second photosensitive element 204 through the first through hole of the circuit board 400 (the sinking refers to that the height of the first photosensitive element 104 is lower than that of the second photosensitive element 204), and the molding part 500 forms a support for the first photosensitive element 104 under the circuit board 400, so that a height difference exists between the first photosensitive element 104 and the second photosensitive element 204, and the upper end surfaces of the first camera module 100 and the second camera module 200 are leveled by adjusting the height difference, so as to meet the imaging requirement of the integral dual camera module.

In the embodiment of fig. 1, the molding part 500 entirely covers the first region and the second region, but it should be noted that the present invention is not limited thereto. In other embodiments, the molding 500 may partially cover the first region and the second region. Fig. 2 shows the shape of the molding 500 in several other embodiments. As shown in fig. 2, the molding part 500 may cover only a partial area of the second surface 420 of the integrated circuit board 400, that is, the bottom of the opening area of the first area is covered entirely, and only a partial area of the bottom of the second area is covered. In this way, a height difference can be formed at the bottom of the second area, and a certain avoidance space is provided to adapt to the design requirements of different terminals (such as smart phones) (for example, other components of the smart phones can be accommodated in the avoidance space). The lens supporting portion 202 of the second lens assembly 200 is generally annular, so that the combined area of the second lens assembly 200 and the integrated circuit board 400 is an annular area of the second area. In a preferred embodiment, the molding 500 covers the annular region to strengthen the circuit board 400. Also, in the molding part 500, a portion covering the annular region and a portion covering the first region are integrally connected to each other, thereby enhancing the connection strength between the first region and the second region.

It should be noted that, the molding part 500 is used to cover the bottom of the integrated circuit board 400, so that not only the structural strength of the dual-camera module can be improved, but also the molding with different sizes and different thicknesses can be formed according to the actual design requirement of the dual-camera module through the molding process, thereby adapting to the requirements of different accommodating spaces in the design of the mobile phone and having higher production flexibility.

Since the first area of the integrated circuit board 400 has a through hole for accommodating the first photosensitive element 104 of the first camera module 100, the routable or mounting area of the first area is relatively tense, and by means of the arrangement of the capacitor or resistor element 108, part or all of the capacitor or resistor element 108 of the first camera module may be mounted on the second surface 420 of the integrated circuit board 400, so that the part of the first surface 410 corresponding to the first area is not mounted or is less mounted with the capacitor or resistor element 108. In addition, since the space occupied by the capacitor or resistor element 108 on the first surface 410 is reduced, a larger installation space can be provided for installing a lens, a motor and a chip, so that the installation of normal routing arrangement and other elements is satisfied without enlarging the area of the integrated circuit board 400, and the overall size of the dual-camera module is not increased.

Because of the special nature of the molding material, when the molding part 500 covers the capacitor or resistor element 108, the thickness of the molding part 500 is only slightly higher than the maximum height of the capacitor or resistor element 108, and the capacitor or resistor element 108 can be covered therein, so that the avoidance space required when devices such as a lens seat or other protective shell cover the capacitor or resistor element 108 is not required, and therefore, the axial dimension (i.e., the thickness direction of the circuit board 400) of the molding part 500 is small.

Further, since the first photosensitive chip 104 sinks relative to the integrated circuit board 400, the axial distance between the first lens assembly 100 and the integrated circuit board 400 should be reduced, so as to ensure that the back focus of the first camera module is unchanged, so as to meet the design requirement.

However, when the space between the first lens assembly 100 and the integrated circuit board 400 is reduced to meet the design requirement of the first camera module 100, the installation space between the first lens assembly and the integrated circuit board 400 reaches the limit, and it is difficult to install other components, so that the first lens assembly is directly installed on the integrated circuit board.

In the embodiment of fig. 1, the first lens assembly 100 includes a first lens 101 and a first lens support 102. The first lens assembly 100 is mounted on the first area of the integrated circuit board 400 through the first lens support 102. In this embodiment, the bottom surface of the first lens support 102 directly rests on the first surface 410 of the circuit board 400, so that the back focus of the first camera module 100 can be ensured to meet the design requirement under the condition of the sinking design of the first photosensitive element 104.

In this embodiment, the first camera module further includes a first color filter support 109 and a first color filter 106. The first color filter support 109 is a loop-shaped support for carrying the first color filter 106. In this embodiment, the first color filter support 109 is mounted on the non-photosensitive area of the first photosensitive element 104, so that the first color filter support 109 does not affect the imaging of the first photosensitive element 104, and the first lens base support 102 does not occupy the mounting position of the first surface 410 of the integrated circuit board 400, so as to avoid the increase in the radial dimension of the dual-camera module (in this text, the direction perpendicular to the optical axis of the camera module). In this embodiment, the first lens support 102 is directly supported by the integrated circuit board 400, and the axial dimension between the first color filter support 109 and the integrated circuit board 400 can be reduced.

It should be noted that the first color filter support 109 may be made of plastic, metal, or cured plastic. It should be noted that the optional materials of the first color filter support 109 are not limited to the above three materials, which are only specifically described in the present embodiment, but not limited to the present embodiment.

Further, in one embodiment, when the first color filter support 109 is mounted to the non-photosensitive region of the first photosensitive element 104, the first metal wire 103 is located at the periphery of the first color filter support 109.

Still referring to fig. 1, the first photosensitive element 104 and the second photosensitive element 204 are electrically connected to the integrated circuit board 400 through a first metal wire 103 (e.g. gold wire) and a second metal wire 203 (e.g. gold wire), respectively, and the metal wires have a certain wire arc height, so that in a subsequent assembly process, care needs to be taken to avoid the wire arc height so as to prevent damage to the metal wires from affecting the functions of the dual-camera module.

When the first color filter support 109 shown in fig. 1 is employed, it is not necessary to consider that the first metal wire 103 is avoided in the optical axis direction due to the height of the wire arc, as long as it is considered that the first color filter support 109 and the first color filter 106 do not interfere with the first metal wire 103 in the radial direction, which allows the height of the first color filter support 109 to be further reduced. Further, since some or all of the capacitor or resistor 108 is disposed on the second surface 420 of the first area of the integrated circuit board 400, the capacitor or resistor 108 to be avoided is reduced or none of the capacitor or resistor 108 to be avoided is required to be avoided on the first surface 410 of the first area, and thus, there is enough mounting space on the first color filter support 109 of the integrated circuit board 400 for mounting the first lens support 102.

Further, since the contact area between the first lens support 102 and the integrated circuit board 400 is significantly larger than that between the side wall of the lens base and the circuit board in the conventional process, the first lens support 102 is directly mounted on the integrated circuit board 400, so that the dual-camera module has better flatness and structural stability, and the space utilization rate of the dual-camera module is also improved.

In addition, since the first lens support 102 directly rests on the integrated circuit board 400, which is equivalent to the overall height of the module, and is less than the thickness of the first color filter support 109, the overall thickness (axial dimension) of the dual-camera module can be reduced by directly mounting the first color filter support 109 on the non-photosensitive region of the first photosensitive element 104 in the present embodiment, which is beneficial to the miniaturization development of the dual-camera module.

Further, when ensuring that the avoiding space between the first lens 101 and the first color filter 106 is sufficient, the first color filter 106 should be kept away from the first photosensitive element 104 as far as possible, i.e. the thickness of the first color filter support 109 is increased, so as to reduce the probability of generating a dirty black spot when the dual-camera module forms images, thereby improving the production yield of the dual-camera module.

In one embodiment, the second camera module 200 includes a second photosensitive element 204, the second photosensitive element 204 is mounted on the first surface 410 of the second area of the integrated circuit board 400, and the second photosensitive element 204 and the first photosensitive element 104 are in different planes, so as to meet different optical design requirements of the first camera module 100 and the second camera module 200, so that the dual camera module can better image.

In this embodiment, the first camera module adopts a zoom module, and the second camera module adopts a fixed focus module, so that the first lens support 102 is a first motor, the second camera module does not need to use a motor, and the second lens support 202 is used to support the second lens 201 of the second camera module 200. The second lens support 202 is mounted on the second area of the integrated circuit board 400, and an accommodating space exists between the second lens support 202 and the integrated circuit board 400, and the second photosensitive element 204 is mounted on the integrated circuit board 400 in the accommodating space. The second camera module further includes a second color filter 206, where the second color filter 206 is mounted on the bottom side of the second lens support 202 and has a certain distance from the second photosensitive element 204.

Further, the first camera module and the second camera module may both use a zoom module, and the first lens support and the second lens support may be a first motor and a second motor, respectively. The second lens 201 is mounted on the second motor, the second color filter 206 is mounted under the second lens 201 or under the second motor, and a sufficient space is provided between the second color filter 106 and the second camera module 200 for zooming the second camera module, so as to avoid interference between the second lens 201 and the second color filter 206 during zooming.

Fig. 3 shows an array of camera modules according to another embodiment of the invention. In this embodiment, the second camera module may further include a second metal sheet 207 disposed between the second photosensitive element 204 and the first surface 410, so as to more conveniently adjust the height difference between the second photosensitive element 204 and the first photosensitive element 104. The second metal sheet 207 may also function to assist in heat dissipation when heat is generated during imaging of the second photosensitive element 204.

Further, in one embodiment, the camera module array further includes a spacer 300, where the spacer 300 is located between the first camera module 100 and the second camera module 200, and is used for performing auxiliary reinforcement and demagnetization on the first camera module 100 and the second camera module 200, so as to prevent the relative position between the first camera module 100 and the second camera module 200 from changing to affect the imaging effect of the camera module array.

In one embodiment, for a dual-camera module with two different optical designs, the firmness and stability of the module structure can be improved by molding, so that the metal bracket with two accommodating holes in the traditional dual-camera manufacturing process is eliminated, the process flow can be reduced, and the cost can be reduced.

In general, the through hole design of the integrated circuit board 400 makes the first photosensitive element 104 and the second photosensitive element 204 in different planes, and there is a height difference, so that the lens end surfaces of the first lens 101 and the second lens 201 are leveled after the installation is completed, so as to meet the design requirement of most double-shot modules; secondly, due to the through hole design of the circuit board, part or all of the capacitor or resistor element 108 is mounted at the bottom of the integrated circuit board 400 and is covered by the molding part 500, so that the top of the integrated circuit board 400 has more flat space, and the overall space utilization rate of the dual-camera module is improved; again, the first lens support 102 is directly mounted on the integrated circuit board 400, so that the first color filter support 109 can be mounted on the non-photosensitive area of the first photosensitive element 104, so that not only the shoulder height of the first lens support 102 can be reduced, but also the structural stability of the dual-camera module can be increased; and again, the molding part 500 has the characteristics of high strength and high hardness, so that the overall structural strength of the double-shot module can be effectively improved, the stability of the module structure is improved, the metal bracket with two accommodating holes in the traditional double-shot module can be canceled, and the production cost is effectively reduced.

Fig. 4 shows an array of camera modules in accordance with yet another embodiment of the present invention. In this embodiment, the non-contact surface 520 of the molding part 500 may further have a groove, where the groove corresponds to the through hole of the integrated circuit board 400, and the first photosensitive element 104 is mounted on the groove. The surface of the groove is smooth, so that the installation flatness of the first photosensitive element 104 is effectively ensured, the second photosensitive element 204 is still installed on the contact surface 510, and the groove can increase the height difference between the first photosensitive element 104 and the second photosensitive element 204, so that the height difference between the first photosensitive element 104 and the second photosensitive element 204 can be conveniently adjusted, and the design requirement and the imaging requirement of the double-camera module can be better adapted.

Further, in one embodiment, the non-contact surface 520 of the molding part 500 may further have a boss, and when the first photosensitive element 104 is mounted on the boss, the second metal sheet 207 mounted between the second photosensitive element 204 and the integrated circuit board 400 needs to be correspondingly adjusted in thickness, so as to ensure a required height difference between the first photosensitive element 104 and the second photosensitive element 204, and meet the imaging requirement of the dual camera module.

Fig. 5 shows an array of camera modules in a further embodiment of the invention. In this embodiment, the first surface 410 of the integrated circuit board 400 may further have a main body portion 411 and a transition portion 412, where the main body portion 411 is used to mount the first lens support 102, the transition portion 412 is located on the same plane as the first surface 410, and the transition portion 412 is located where the first surface 410 abuts against the through hole. The transition section 412 is not in the same plane as the main body portion 411 and the transition section 412 is lower than the main body portion 411, so that a step structure is formed with the main body portion 411, and the step structure can reduce the wire arc height of the first metal wire 103, so that the interference risk between the first color filter element support 109 and the first metal wire 103 is reduced.

In this embodiment, the height of the wire loop of the first metal wire 103 is reduced, so that the accommodating space between the first motor 102 and the first metal wire 103 of the first color filter element support 109 is increased, and the longitudinal dimension of the first lens support 102 is further reduced on the premise of meeting the design requirements of the first motor 102 and the dual-camera module, thereby reducing the shoulder height of the first lens support 102.

Fig. 6 shows an array of camera modules in a further embodiment of the invention. In this embodiment, the molding part 500 may also have a through hole, and the position and shape of the through hole of the molding part 500 are the same as those of the through hole of the integrated circuit board 400 and correspond to those of the through hole of the integrated circuit board 400, at this time, a first metal sheet 107 may be added to the bottom of the molding part 500, where the first metal sheet 107 may provide a flat surface for mounting the first photosensitive element 104, and the first metal sheet 107 may have a boss for mounting the first photosensitive element, or may be a flat surface without a boss, and the specific shape of the first metal sheet 107 may be designed according to the required height difference between the first photosensitive element 104 and the second photosensitive element 204. The first metal sheet 107 has a function of helping the first photosensitive element 104 to dissipate heat.

Further, the first metal sheet 107 may cover only the bottom of the through hole of the molding part 500, or may cover all areas of the molding part 500 integrally. The step structure of the integrated circuit board 400 and the second metal sheet 207 at the bottom of the second photosensitive element 204 can be adjusted according to the design requirement of the dual-camera module.

Fig. 7 shows an array of camera modules in yet another embodiment of the invention. This embodiment is substantially the same as the embodiment shown in fig. 1. The difference is the shape and mounting of the first color filter support 109. Referring to fig. 7, in this embodiment, the first lens assembly includes a first lens 101 and a first lens support 102 for supporting the first lens 101, where the first lens support 102 is directly mounted on a first area of the integrated circuit board 400, so that the first photosensitive element 104 can also ensure that the back focus of the first image capturing module 100 meets the design requirement under the condition of a submerged design.

The first camera module further includes a first color filter support 109, where the first color filter support 109 is a loop-shaped support, and is mounted on the first surface of the integrated circuit board 400 and surrounds the first through hole. The first color filter support 109 is spaced apart from the first lens support 102. Referring to fig. 7, the first color filter element support 109 includes a support sidewall and a support extension. The side walls of the support body are mounted on the circuit board 400, and the bottom surfaces of the side walls of the support body bear against the circuit board 400. The top ends of the support sidewalls extend inward (i.e., toward the center of the first photosensitive element 104) to form support extensions. The support body extension is annular, forms a logical unthreaded hole in the centre. The support extension is used to mount the first color filter element 106. The light-passing hole corresponds to a photosensitive area of the first photosensitive element 104, and light can enter the photosensitive area of the first photosensitive element 104 (i.e., an area where the first photosensitive element can image) through the first color filter element 106. The support body extension does not contact the surface of the circuit board 400, in other words, there is a gap between the support body extension and the circuit board.

In one embodiment, when the first color filter support 109 is disposed on the integrated circuit board 400 separately from the first lens support 102, the capacitive or resistive element 108 is disposed on the second surface 420 of the integrated circuit board 400 as much as possible, thereby enabling the first surface 410 to have a sufficiently flat surface for mounting the first lens support 102 and the first color filter support 109.

When the space for mounting the first lens support 102 and the first color filter support 109 is removed from the first surface 410, and there is a remaining mounting space, a part of the capacitor or resistor element may be optionally disposed on the first surface 410.

It should be noted that the first color filter support 109 may be made of plastic, metal, or cured plastic. It should be noted that the optional materials of the first color filter support 109 are not limited to the above three materials, which are only used as a distance illustration in the present embodiment, but not as a limitation in the present embodiment.

The first camera module 100 further includes a first lens 101 and a first lens support 102 for mounting the first lens 101, where the first lens support 102 is mounted on the integrated circuit board 400.

In one embodiment, there is enough accommodation space between the first lens support 102 and the first color filter support 109, so that when the first camera module 100 is a zoom module, the first lens 101 does not interfere with the first color filter 106 or the first color filter support 109 when moving in the first lens support 102 to zoom, thereby ensuring normal imaging of the first camera module 100.

Since in this embodiment, the first color filter support 109 and the first lens support 102 are both seated on the integrated circuit board 400, in order to provide a sufficient installation space for the first lens support 102, the first color filter support 109 reduces the thickness of the sidewall and installs the first color filter support 109 at the edge of the first through hole near the first area of the integrated circuit board 400.

Further, the first color filter 106 may be mounted on the top surface or the bottom surface of the first color filter support 109, but when the accommodating space between the first lens 101 and the first lens holder support 102 and the first color filter 106 is sufficient, the first color filter 106 may be kept away from the first photosensitive element 104 as far as possible, so as to reduce the probability of forming a dirty black spot when the dual-camera module forms an image, and further improve the production yield of the dual-camera module.

Further, since some or all of the capacitive or resistive elements 108 are disposed on the second surface 420 of the integrated circuit board 400, the first color filter element support 109 need not or need only be free of a small amount of the capacitive or resistive elements 108. However, in the design process of the first color filter element support 109, it may be noted that the wire arc height of the first metal wire 103 is avoided, that is, the sidewall of the first color filter element support 109 or the height of the first color filter element needs to be higher than the wire arc highest point of the first metal wire 103, so as to avoid interference between the first color filter element support 109 and the first metal wire 103 and damage to the first metal wire 103, which affects the dual-camera module imaging.

Further, since the contact area between the first lens support 102 and the integrated circuit board 400 is significantly larger than that between the side wall of the lens base and the circuit board in the conventional process, the first motor 102 is directly mounted on the integrated circuit board 400, so that the dual-camera module has better flatness and structural stability, and the space utilization rate of the dual-camera module is also improved.

In addition, since the first lens support 102 is directly mounted on the integrated circuit board 400, the overall height of the module is equal to that of the first color filter support 109, and the shoulder height of the first lens support 102 (the shoulder height refers to the height from the first lens support 102 to the first surface 410 of the integrated circuit board 400) is further reduced, which is beneficial for the miniaturization development of the dual-camera module.

Further, fig. 8 shows an image capturing module array according to still another embodiment of the present invention. In this embodiment, the second camera module may further include a second metal sheet 207 mounted between the second photosensitive element 204 and the first surface 410, so as to more conveniently adjust the height difference between the second photosensitive element 204 and the first photosensitive element 104.

Fig. 9 shows an array of camera modules according to yet another embodiment of the present invention. In this embodiment, the non-contact surface 520 of the molding part 500 may further have a groove, where the groove corresponds to the through hole of the integrated circuit board 400, and the first photosensitive element 104 is mounted on the groove. The surface of the groove is smooth, so that the installation flatness of the first photosensitive element 104 is effectively ensured, the second photosensitive element 204 is still installed on the contact surface 510, and the groove can increase the height difference between the first photosensitive element 104 and the second photosensitive element 204, so that the height difference between the first photosensitive element 104 and the second photosensitive element 204 can be conveniently adjusted, and the design requirement and the imaging requirement of the double-camera module can be better adapted.

Further, the non-contact surface 520 of the molding part 500 may further have a boss (not shown in the drawings), where the boss is the same as the recess, and when the first photosensitive element 104 is mounted on the boss, the second metal sheet 207 mounted between the second photosensitive element 204 and the integrated circuit board 400 needs to be correspondingly adjusted in thickness, so as to ensure a required height difference between the first photosensitive element 104 and the second photosensitive element 204, and meet the imaging requirement of the dual-camera module.

Fig. 10 shows an array of camera modules according to yet another embodiment of the present invention. In this embodiment, the first surface 410 of the integrated circuit board 400 may further have a main body portion 411 and a transition section 412, where the main body portion 411 is used to mount the first color filter element support 109, the transition section 412 is located on the same plane as the first surface 410, and the transition section 412 is located where the first surface 410 abuts against the through hole. The transition section 412 is not in the same plane as the main body 411 and the transition section 412 is lower than the main body 411, so that a step structure is formed with the main body 411, and the step structure can reduce the height of the wire arc of the first metal wire 103, so that the risk of interference between the first color filter element support 109 and the first metal wire 103 is reduced.

Further, the wire arc height of the first metal wire 103 is reduced, so that the accommodating space between the first color filter element support 109 and the first metal wire 103 is increased, and the longitudinal dimensions of the first color filter element support 109 and the first motor 102 can be further reduced on the premise of meeting the design requirements of the first motor 102 and the dual camera module, thereby reducing the shoulder height of the first motor 102.

Fig. 11 shows an array of camera modules according to yet another embodiment of the present invention. In this embodiment, the through hole area of the integrated circuit board 400 may be changed to a sunken groove design instead of a through hole design, and the first photosensitive element 104 is mounted on the groove surface of the integrated circuit board 400.

The surface of the groove is smooth, so as to ensure the mounting flatness of the first photosensitive element 104, the second photosensitive element 204 is still mounted on the first surface 410 of the first area of the integrated circuit board 400, so that a height difference still exists between the first photosensitive element 104 and the second photosensitive element 204, and the height difference between the first photosensitive element 104 and the second photosensitive element 204 is adjusted, so that the upper end surfaces of the first camera module 100 and the second camera module 200 can be leveled, thereby meeting the design requirement of the dual camera module.

Further, when the first area of the integrated circuit board 400 is a groove design, rather than a through hole design, the coverage area and the coverage shape of the molding part 500 on the second surface 420 of the integrated circuit board 400 can be properly adjusted according to the mounting positions of the first camera module 100 and the second camera module 200 and the integrated circuit board 400, but the molding part 500 is preferably covered on the second surface 420 in an integrally connected manner, so that the structural strength and the structural stability of the dual camera module are better enhanced.

Fig. 12 shows an array of camera modules according to yet another embodiment of the present invention. In this embodiment, the first area of the integrated circuit board 400 is a groove design, instead of a through hole design, a second metal sheet 207 may be added between the second photosensitive element 204 and the integrated circuit board 400, and the height difference between the first photosensitive element 104 and the second photosensitive element 204 is better adjusted by the second metal sheet 207, so as to meet the design requirement of the dual-camera module.

Fig. 13 shows an array of camera modules according to yet another embodiment of the present invention. In this embodiment, the molding part 500 may also have a through hole, and the position and shape of the through hole of the molding part 500 are the same as those of the through hole of the integrated circuit board 400 and correspond to those of the through hole of the integrated circuit board 400, and at this time, a first metal sheet 107 needs to be added to the bottom of the molding part 500 for mounting the first photosensitive element 104, and the metal sheet may only cover the bottom of the through hole of the molding part 500, or may cover all areas of the molding part 500 integrally.

The step structure of the integrated circuit board 400 and the second metal sheet 207 at the bottom of the second photosensitive element 204 can be adjusted according to the design requirement of the dual-camera module.

Fig. 14 shows an array of camera modules according to yet another embodiment of the present invention. In this embodiment, the first camera module may further eliminate the color filter support body as shown in fig. 1 or fig. 7, and mount the first color filter 106 directly on the first metal wire 103, so that the mounting of the first color filter 106 does not occupy the mounting position of the first surface 410 of the first area, further reducing the mounting space occupied by mounting the first color filter 106, and leaving a more sufficient mounting space for the first lens support body 102. The first color filter element 106 is preferably mounted on the first metal wire 103 by bonding with glue, but is not limited to bonding with glue.

Further, the design of the lens base is canceled, so that the production cost of the dual-camera module can be further saved, meanwhile, the first motor 102 is directly located on the integrated circuit board 400, the shoulder height of the first motor 102 can be effectively reduced, the first motor 102 is directly installed on the integrated circuit board 400, and the structural strength and the structural stability of the dual-camera module can be effectively enhanced.

Fig. 14 shows that the integrated circuit board 400 has a groove instead of a through hole, but the present embodiment is not limited to the illustrated embodiment, and the through hole may be designed in the first area of the integrated circuit board 400 according to the actual design requirement, the through hole or the groove adapted to the integrated circuit board 400 is designed in the molding part 500, and the second camera module 200 may also add a second metal sheet 207 between the second photosensitive element 204 and the second area of the integrated circuit board 400 according to the actual design requirement, so as to adjust the height difference between the first photosensitive element 104 and the second photosensitive element 204, thereby better meeting the design requirement of the dual camera module.

Further, fig. 15 to 18 show an embodiment in which a spacer is added to the through hole of the integrated circuit board 400. In these embodiments, the second surface 420 of the circuit board 400 is further provided with a first spacer 800, the through hole is covered by the first spacer 800, and the upper surface of the first spacer 800 is flat, so as to provide a flat surface for mounting the first photosensitive element 104. The molding part 500 is integrally formed on the second surface 420 of the integrated circuit board 400 and the lower surface of the first gasket 800. First spacer 800 may be flat or "U" shaped.

Fig. 15-16 show schematic views of embodiments of the first gasket 800 having a "U" shape. Wherein the upper surface of the first gasket 800 of the "U" shape is flat.

Fig. 17 to 18 are schematic diagrams showing embodiments of a first gasket 800 in a flat plate shape. The first spacer 800 is added at the position of the through hole of the integrated circuit board 400, so that the molding process difficulty can be reduced, and the quality of the dual shot product can be improved. Note that the first spacer 800 may be concave downward or convex upward, so that the difference between the heights of the first photosensitive element 104 and the second photosensitive element 204 may be set according to the actual situation. The first gasket 800 may also be formed in the shape of the first metal sheet 107 in the embodiment of fig. 6, i.e. having a raised solid plate-like structure. The first photosensitive element 104 can be mounted using the upper surface of the raised structure.

Further, in the embodiment shown in fig. 14, the first color filter element 106 is directly mounted on the first metal wire 103, or the first spacer 800 may be added between the integrated circuit board 400 and the molding part 500, so as to reinforce the dual-camera module, and enhance the structural strength and stability of the dual-camera module.

The above description is only illustrative of the preferred embodiments of the present application and of the principles of the technology employed. It will be appreciated by persons skilled in the art that the scope of the application referred to in the present application is not limited to the specific combinations of the technical features described above, but also covers other technical features formed by any combination of the technical features described above or their equivalents without departing from the inventive concept. Such as the above-mentioned features and the technical features disclosed in the present application (but not limited to) having similar functions are replaced with each other.

Claims

1. A camera module array, comprising:

a first lens assembly including a first lens and a first lens support;

A second lens assembly;

A first photosensitive element;

A second photosensitive element;

A first color filter; and

An integrated substrate, comprising:

a circuit board having a first region adapted to mount a first lens assembly and a second region adapted to mount a second lens assembly, the circuit board further having a first surface proximate to the first lens and the second lens and a second surface opposite to the first surface; and

A molding part integrally formed on a second surface of the circuit board by a molding process, and covering at least a portion of the second surface corresponding to the first region and at least a portion of the second surface corresponding to the second region; the integrated substrate is provided with a first flat surface and a second flat surface which are positioned at different heights, the first photosensitive element is arranged on the first flat surface, and the second photosensitive element is arranged on the second flat surface;

Wherein the first region has a first through hole adapted to accommodate the first photosensitive element, the molding portion covers the first through hole, the molding portion forms the first flat surface, the second region forms the second flat surface, wherein the molding portion has a contact surface in contact with the second surface, and a non-contact surface formed by extending the contact surface to cover the first through hole, the first flat surface is formed on the non-contact surface; and

The first lens support is mounted on the first region of the circuit board and the bottom of the first lens support is supported against the first surface, the first color filter is mounted on the integrated substrate through the first color filter support, and the first color filter support is separated from the first lens support.

2. The camera module array of claim 1, wherein the molding has a recess or a boss corresponding to the through hole,

Wherein, first sensitization component is installed in recess or boss.

3. The camera module array according to any one of claims 1-2, wherein at least one capacitor or resistor element is mounted on the second surface, and the molding portion covers the at least one capacitor or resistor element.

4. The camera module array of any of claims 1-2, wherein a bottom portion of the first color filter support is mounted on the first photosensitive element and the first color filter is mounted on a top portion of the first color filter support.

5. The camera module array of claim 4, wherein the first color filter support is in a loop shape.

6. The camera module array according to any one of claims 1 to 2, wherein the first color filter support body includes a side wall and a top cover having a light-passing hole, and a bottom of the side wall is mounted on the wiring board.

7. The image capturing module array according to any one of claims 1 to 2, wherein the integrated substrate further includes a first metal wire electrically connecting the first photosensitive element and the wiring board, and the first metal wire serves as the first color filter support, and the first color filter is mounted on the first metal wire.

8. The camera module array of claim 7, wherein the first color filter is bonded to the first metal line by a glue.