CN205809504U - Focus camera module and focussing mechanism thereof - Google Patents
Focus camera module and focussing mechanism thereof Download PDFInfo
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- CN205809504U CN205809504U CN201620638177.9U CN201620638177U CN205809504U CN 205809504 U CN205809504 U CN 205809504U CN 201620638177 U CN201620638177 U CN 201620638177U CN 205809504 U CN205809504 U CN 205809504U
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Abstract
本实用新型提供一定焦摄像模组和调焦装置,其中所述调焦装置包括一计算设备和连接于所述计算设备的一调焦机构,其中所述调焦机构进一步包括一第一固定件和一第二固定件,所述第一固定件在所述定焦摄像模组的光学镜头的外部固定所述光学镜头,所述第二固定件固定所述定焦摄像模组的感光芯片,其中所述计算设备通过分析所述定焦摄像模组拍摄的图像生成一调焦信号,所述调焦机构基于所述调焦信号通过所述第一固定件和所述第二固定件调整所述光学镜头和所述感光芯片的相对位置,以执行对所述定焦摄像模组的调焦操作。
The utility model provides a fixed-focus camera module and a focusing device, wherein the focusing device includes a computing device and a focusing mechanism connected to the computing device, wherein the focusing mechanism further includes a first fixing member and a second fixing member, the first fixing member fixes the optical lens outside the optical lens of the fixed-focus camera module, and the second holder fixes the photosensitive chip of the fixed-focus camera module, Wherein the computing device generates a focusing signal by analyzing the image captured by the fixed-focus camera module, and the focusing mechanism adjusts the focusing signal through the first fixing member and the second fixing member based on the focusing signal. The relative position of the optical lens and the photosensitive chip is used to perform the focusing operation on the fixed-focus camera module.
Description
技术领域technical field
本实用新型涉及光学成像领域,特别涉及一定焦摄像模组及其调焦装置。The utility model relates to the field of optical imaging, in particular to a fixed-focus camera module and a focusing device thereof.
背景技术Background technique
随着科学技术的突飞猛进式的发展和人们经济水平的不断提高,智能手机、平板电脑灯便携式电子设备及其相关技术得到了快速的发展,其中用于帮助使用者拍摄影像的摄像模组已经成为了便携式电子设备的标准配置之一。通常情况下,为了便于使用者通过便携式电子设备自拍或者视频通话,便携式电子设备被配置一个前置摄像模组。由于定焦摄像模组一旦被配置于便携式电子设备后就不需要预留供其调焦的空间,从而为了控制便携式电子设备的尺寸,定焦摄像模组成为了便携式电子设备的前置摄像模组的首选。With the rapid development of science and technology and the continuous improvement of people's economic level, smart phones, tablet computers, lamps, portable electronic devices and related technologies have been developed rapidly. Among them, the camera module used to help users take images has become a One of the standard configurations of portable electronic devices. Usually, in order to facilitate the user to take a selfie or make a video call through the portable electronic device, the portable electronic device is configured with a front-facing camera module. Since the fixed-focus camera module does not need to reserve space for its focusing once it is configured in a portable electronic device, in order to control the size of the portable electronic device, the fixed-focus camera module becomes the front camera module of the portable electronic device. Group's first choice.
近年来,便携式电子设备越来越呈现出智能化、轻薄化的发展趋势,便携式电子设备的这种发展趋势,一方面要求通过增加智能部件来使便携式电子设备拥有更多更强大的功能,另一发那个面要求降低便携式电子设备的各个部件的尺寸来控制便携式电子设备的尺寸,便携式电子设备的这种发展趋势尤其对定焦摄像模组的尺寸提出了苛刻的要求。尽管定焦摄像模组在被配置于便携式电子设备后不需要预留供气调焦的空间,但是在封装定焦摄像模组的过程中仍然需要对其进行调焦以保证定焦摄像模组的成像品质。In recent years, portable electronic devices are becoming more and more intelligent and thinner. This development trend of portable electronic devices requires adding smart components to make portable electronic devices have more and more powerful functions. On the one hand, it is required to reduce the size of each component of the portable electronic device to control the size of the portable electronic device. This development trend of the portable electronic device especially imposes strict requirements on the size of the fixed-focus camera module. Although the fixed-focus camera module does not need to reserve space for air supply and focus adjustment after it is configured in a portable electronic device, it still needs to be focused during the packaging process of the fixed-focus camera module to ensure that the fixed-focus camera module image quality.
参考图1是现有技术的定焦摄像模组,其包括一感光芯片10P、一光学镜头20P以及一基座30P,其中所述基座30P包括一镜座31P以及一镜筒32P,所述镜筒32P一体地延伸于所述镜座31P,其中所述感光芯片10P设置于所述镜座31P,所述光学镜头20P设置于所述镜筒32P,以使所述光学镜头20P位于所述感光芯片10P的感光路径。在现有技术的定焦摄像模组中,通过所述镜筒32P固定所述光学镜头20P和使所述光学镜头20P被保持在调焦后的位置。所述镜筒32P的设置限制了定焦摄像模组的尺寸,甚至成为了限制定焦摄像模组发展的技术瓶颈。另外,由于所述光学镜头20P被安装于所述镜筒32P的内部,从而在安装所述光学镜头20P和所述镜筒32P或者在调整所述光学镜头相对于所述镜筒32P的位置以实现对定焦摄像模组的调焦的过程中,所述光学镜头20P的外表面和所述镜筒32P的内表面会因为相互摩擦而导致所述光学镜头20P的外表面和所述镜筒32P的内表面产生一些颗粒等污染物,这些颗粒等污染物会被保留在定焦摄像模组的内部,即便是在定焦摄像模组被封装完成后,也不能够将这些颗粒等污染物取出来,随着时间的推挤和定焦摄像模组受到的外界的冲击,一部分颗粒等污染物会进入所述光学镜头20P的光路中,并可以在所述感光芯片10P上成像,以至于造成污坏点的情况的出行,导致定焦摄像模组的成像品质降低。1 is a prior art fixed-focus camera module, which includes a photosensitive chip 10P, an optical lens 20P and a base 30P, wherein the base 30P includes a lens holder 31P and a lens barrel 32P, the The lens barrel 32P integrally extends from the lens base 31P, wherein the photosensitive chip 10P is set on the lens base 31P, and the optical lens 20P is set on the lens barrel 32P, so that the optical lens 20P is located on the The photosensitive path of the photosensitive chip 10P. In the prior art fixed-focus camera module, the optical lens 20P is fixed by the lens barrel 32P and the optical lens 20P is kept at a position after focusing. The arrangement of the lens barrel 32P limits the size of the fixed-focus camera module, and even becomes a technical bottleneck restricting the development of the fixed-focus camera module. In addition, since the optical lens 20P is installed inside the lens barrel 32P, when installing the optical lens 20P and the lens barrel 32P or adjusting the position of the optical lens relative to the lens barrel 32P to In the process of realizing the focusing of the fixed-focus camera module, the outer surface of the optical lens 20P and the inner surface of the lens barrel 32P will cause friction between the outer surface of the optical lens 20P and the inner surface of the lens barrel 32P. The inner surface of the 32P produces some particles and other pollutants, which will be retained inside the fixed-focus camera module. Even after the fixed-focus camera module is packaged, these particles and other pollutants cannot be removed. Take it out, with the passage of time and the impact of the outside world on the fixed-focus camera module, some particles and other pollutants will enter the optical path of the optical lens 20P, and can be imaged on the photosensitive chip 10P, so that Traveling in a situation that causes dirty spots leads to a reduction in the imaging quality of the fixed-focus camera module.
实用新型内容Utility model content
本实用新型的一个目的在于提供一定焦摄像模组及其调焦装置,其中所述定焦摄像模组的尺寸能够被有效地降低,以使所述定焦摄像模组特别适于被应用于追求轻薄化的电子设备。An object of the present utility model is to provide a fixed-focus camera module and its focusing device, wherein the size of the fixed-focus camera module can be effectively reduced, so that the fixed-focus camera module is particularly suitable for being used in The pursuit of thinner and lighter electronic equipment.
本实用新型的一个目的在于提供一定焦摄像模组及其调焦装置,其中所述定焦摄像模组的光学镜头被直接封装于镜座,从而所述定焦摄像模组不需要提供镜筒来固定所述光学镜头和所述镜座,即所述光学镜头的周围不需要设置镜筒,从而能够减少所述定焦摄像模组的头部尺寸。One purpose of the present utility model is to provide a fixed-focus camera module and its focusing device, wherein the optical lens of the fixed-focus camera module is directly packaged in the lens holder, so that the fixed-focus camera module does not need to provide a lens barrel To fix the optical lens and the mirror holder, that is, there is no need to arrange a lens barrel around the optical lens, so that the head size of the fixed-focus camera module can be reduced.
本实用新型的一个目的在于提供一定焦摄像模组及其调焦装置,其中所述光学镜头被直接封装于所述镜座,以能够有效地降低所述摄像模组的高度尺寸。An object of the present invention is to provide a fixed-focus camera module and its focusing device, wherein the optical lens is directly packaged in the lens holder, so as to effectively reduce the height of the camera module.
本实用新型的一个目的在于提供一定焦摄像模组及其调焦装置,其中所述调焦装置包括一调焦机构,所述调焦机构通过固定所述光学镜头的外部的方式调整所述光学镜头相对于所述定焦摄像模组的感光芯片的位置,从而防止所述调焦机构固定所述光学镜头时产生的固体颗粒污染物自所述定焦摄像模组的外部进入内部,以确保所述定焦摄像模组的成像品质。An object of the present utility model is to provide a fixed-focus camera module and its focusing device, wherein the focusing device includes a focusing mechanism, and the focusing mechanism adjusts the optical lens by fixing the outside of the optical lens. The position of the lens relative to the photosensitive chip of the fixed-focus camera module, thereby preventing the solid particle pollutants generated when the focusing mechanism fixes the optical lens from entering the interior from the outside of the fixed-focus camera module, to ensure The imaging quality of the fixed-focus camera module.
本实用新型的一个目的在于提供一定焦摄像模组及其调焦装置,其中在所述光学镜头和所述镜座之间形成一胶合层,以用于将所述光学镜头封装于所述镜座。One object of the present utility model is to provide a fixed-focus camera module and its focusing device, wherein a glued layer is formed between the optical lens and the mirror base for packaging the optical lens on the mirror seat.
本实用新型的一个目的在于提供一定焦摄像模组及其调焦装置,其中所述胶合层用于封闭所述光学镜头和所述镜座的连接处,以防止在藉由所述调焦装置对所述定焦摄像模组执行调焦的过程中,产生于所述光学镜头外表面的固体颗粒污染物通过所述光学镜头和所述镜座的连接处,自所述定焦摄像模组的外部进入内部。An object of the present utility model is to provide a fixed-focus camera module and its focusing device, wherein the glued layer is used to seal the joint between the optical lens and the mirror holder to prevent During the process of performing focusing on the fixed-focus camera module, the solid particle pollutants generated on the outer surface of the optical lens pass through the connection between the optical lens and the mirror base, and are released from the fixed-focus camera module. The outside goes inside.
本实用新型的一个目的在于提供一定焦摄像模组及其调焦装置,其中所述胶合层用于封闭所述光学镜头和所述镜座的连接处,以防止外部污染物或者光线通过所述光学镜头和所述镜座的连接处,自所述定焦摄像模组的外部进入内部。One object of the present utility model is to provide a fixed-focus camera module and its focusing device, wherein the glued layer is used to seal the connection between the optical lens and the mirror base to prevent external pollutants or light from passing through the The joint between the optical lens and the mirror base enters the inside from the outside of the fixed-focus camera module.
本实用新型的一个目的在于提供一定焦摄像模组及其调焦装置,其中所述胶合层用于改善所述光学镜头和所述镜座的平整度,以使所述光学镜头的中心轴线和所述镜座的中心轴线重合,以保证所述定焦摄像模组的成像质量。An object of the present utility model is to provide a fixed-focus camera module and its focusing device, wherein the glued layer is used to improve the flatness of the optical lens and the mirror holder, so that the central axis of the optical lens and the The central axes of the mirror bases coincide to ensure the imaging quality of the fixed-focus camera module.
本实用新型的一个目的在于提供一定焦摄像模组及其调焦装置,其中所述定焦摄像模组被封装后,能够通过清洗所述定焦摄像模组的方式使附着在所述定焦摄像模组的外部的固体颗粒污染物去除。An object of the present invention is to provide a fixed-focus camera module and its focusing device, wherein after the fixed-focus camera module is packaged, the fixed-focus camera module can be cleaned by cleaning the fixed-focus camera module. Removal of solid particle pollutants on the outside of the camera module.
本实用新型的一个目的在于提供一定焦摄像模组及其调焦装置,其中所述定焦摄像模组不需要提供镜筒,通过这样的方式,能够降低所述定焦摄像模组的产品原料成本和技术难度,以提高所述定焦摄像模组的产品竞争力。An object of the present utility model is to provide a fixed-focus camera module and its focusing device, wherein the fixed-focus camera module does not need to provide a lens barrel. In this way, the product raw materials of the fixed-focus camera module can be reduced. cost and technical difficulty, so as to improve the product competitiveness of the fixed-focus camera module.
本实用新型的一个目的在于提供一定焦摄像模组及其调焦装置,其中所述镜座提供一第一封装槽,以供容纳一滤光元件,从而降低所述定焦摄像模组的高度。An object of the present invention is to provide a fixed-focus camera module and its focusing device, wherein the mirror base provides a first packaging groove for accommodating a filter element, thereby reducing the height of the fixed-focus camera module .
本实用新型的一个目的在于提供一定焦摄像模组及其调焦装置,其中所述镜座提供一第二封装槽,以供被封装所述光学镜头,从而降低所述定焦摄像模组的高度。An object of the present utility model is to provide a fixed-focus camera module and its focusing device, wherein the mirror base provides a second packaging groove for the optical lens to be packaged, thereby reducing the cost of the fixed-focus camera module. high.
本实用新型的一个目的在于提供一定焦摄像模组及其调焦装置,其中所述调焦装置提供一计算设备,由所述计算设备通过分析所述定焦摄像模组的获取的图像能够对所述定焦摄像模组执行调焦操作。An object of the present utility model is to provide a fixed-focus camera module and its focusing device, wherein the focus device provides a computing device, and the computing device can analyze the images obtained by the fixed-focus camera module. The fixed-focus camera module performs a focusing operation.
本实用新型的一个目的在于提供一定焦摄像模组及其调焦装置,其中所述计算设备在分析所述定焦摄像模组获取的图像后能够产生一调焦信号,由所述调焦机构执行所述调焦信号以通过改变所述光学镜头和所述感光芯片的相对位置来执行对所述定焦摄像模组的调焦操作。An object of the present invention is to provide a fixed-focus camera module and its focusing device, wherein the computing device can generate a focus signal after analyzing the images obtained by the fixed-focus camera module, and the focus mechanism The focusing signal is executed to perform a focusing operation on the fixed-focus camera module by changing the relative position of the optical lens and the photosensitive chip.
本实用新型的一个目的在于提供一定焦摄像模组及其调焦装置,其中在所述调焦装置对所述定焦摄像模组执行调焦操作后,将所述胶合层或者胶水固化,以使所述光学镜头被保持在调焦后的位置,从而制成所述定焦摄像模组。An object of the present utility model is to provide a fixed-focus camera module and its focusing device, wherein after the focusing device performs a focusing operation on the fixed-focus camera module, the glued layer or glue is cured to achieve The optical lens is kept at the position after focusing, so as to make the fixed-focus camera module.
本实用新型的所述定焦摄像模组包括一感光芯片、一光学镜头以及一镜座,所述感光芯片被直接或者间接地设置于所述镜座的一侧,所述光学镜头被直接封装于所述镜座的另一侧,并且所述光学镜头被保持在所述感光芯片的感光路径。被物体反射的光线能够自所述光学镜头进入所述定焦摄像模组的内部,以被所述感光芯片接收和在进行光电转化后生成与物体相关联的影像(例如图像或者视频)。也就是说,在本实用新型的所述定焦摄像模组的所述光学镜头的周围不需要设置任何的构件,从而能够通过减少所述定焦摄像模组的头部尺寸的方式减少所述定焦摄像模组的尺寸,当所述定焦摄像模组被应用于电子设备时,由于所述定焦摄像模组尺寸的减少能够给所述电子设备的其他元器件留出更多的空间,从而使所述电子设备能够符合智能化、轻薄化的发展趋势。The fixed-focus camera module of the present utility model includes a photosensitive chip, an optical lens and a mirror base, the photosensitive chip is directly or indirectly arranged on one side of the mirror base, and the optical lens is directly packaged on the other side of the mirror seat, and the optical lens is held in the photosensitive path of the photosensitive chip. The light reflected by the object can enter the interior of the fixed-focus camera module from the optical lens to be received by the photosensitive chip and undergo photoelectric conversion to generate an image (such as an image or video) associated with the object. That is to say, there is no need to arrange any components around the optical lens of the fixed-focus camera module of the present invention, thereby reducing the size of the head of the fixed-focus camera module. The size of the fixed-focus camera module, when the fixed-focus camera module is applied to electronic equipment, due to the reduction in the size of the fixed-focus camera module, more space can be reserved for other components of the electronic device , so that the electronic device can conform to the development trend of intelligence and lightness.
本实用新型的所述调焦装置用于在所述定焦摄像模组被封装的过程中对所述定焦摄像模组执行调焦操作,以保证所述定焦摄像模组的成像质量。所述调焦装置包括一计算设备和被连接于所述计算设备的一调焦机构,所述调焦机构进一步包括一第一固定件和一第二固定件,所述第一固定件用于在所述定焦摄像模组的光学镜头的外部固定所述光学镜头,所述第二固定件用于固定所述定焦摄像模组的镜座。在封装所述定焦摄像模组的过程中,先使所述光学镜头和被封装于所述镜座的感光芯片保持在大致位置,以通过所述定焦摄像模组拍摄图像,例如可以通过所述定焦摄像模组拍摄一测试标版的图像,其次,所述计算设备通过分析所述图像以产生一调焦信号,所述调焦机构基于所述调焦信号通过所述第一固定件和所述第二固定件改变所述光学镜头和所述感光芯片的相对位置,以完成对所述定焦摄像模组的调焦操作。值得一提的是,所述调焦信号包含了所述光学镜头和所述感光芯片的偏差角度和位移,例如所述调焦信号包含了所述光学镜头和所述感光芯片的平整度和距离应该被调整的幅度等。The focusing device of the present utility model is used for performing a focusing operation on the fixed-focus camera module during the process of the fixed-focus camera module being packaged, so as to ensure the imaging quality of the fixed-focus camera module. The focusing device includes a computing device and a focusing mechanism connected to the computing device, the focusing mechanism further includes a first fixing part and a second fixing part, and the first fixing part is used for The optical lens is fixed outside the optical lens of the fixed-focus camera module, and the second fixing member is used to fix the lens holder of the fixed-focus camera module. In the process of packaging the fixed-focus camera module, the optical lens and the photosensitive chip packaged in the mirror seat are kept in a general position, so as to take images through the fixed-focus camera module, for example, by The fixed-focus camera module captures an image of a test target plate, and secondly, the computing device analyzes the image to generate a focus signal, and the focus mechanism passes through the first fixed signal based on the focus signal. The relative position of the optical lens and the photosensitive chip is changed by the part and the second fixing part, so as to complete the focusing operation of the fixed-focus camera module. It is worth mentioning that the focusing signal includes the deviation angle and displacement of the optical lens and the photosensitive chip, for example, the focusing signal includes the flatness and distance between the optical lens and the photosensitive chip The magnitude by which it should be adjusted, etc.
所述调焦机构在所述光学镜头的外部固定所述光学镜头,能够防止在通过所述第一固定件固定所述光学镜头时产生于所述光学镜头外表面的固体颗粒污染物进入到所述定焦摄像模组的内部,以有利于提高所述定焦摄像模组的成像品质。另外,所述调焦机构在所述光学镜头的外部固定所述光学镜头,有利于降低对所述定焦摄像模组执行调焦操作时的技术难度和成本。进一步地,被设置于或者形成于所述光学镜头和所述镜座之间的所述胶合层用于封闭所述光学镜头和所述镜座的连接处,以防止固体颗粒污染物通过所述光学镜头和所述镜座的连接处自所述定焦摄像模组的外部进入内部,从而有利于提高所述定焦摄像模组的成像品质。The focusing mechanism fixes the optical lens on the outside of the optical lens, which can prevent the solid particle contamination generated on the outer surface of the optical lens from entering the optical lens when the optical lens is fixed by the first fixing member. The inside of the fixed-focus camera module is used to improve the imaging quality of the fixed-focus camera module. In addition, the focusing mechanism fixes the optical lens on the outside of the optical lens, which is beneficial to reduce the technical difficulty and cost when performing the focusing operation on the fixed-focus camera module. Further, the adhesive layer arranged or formed between the optical lens and the mirror base is used to seal the connection between the optical lens and the mirror base, so as to prevent solid particle pollutants from passing through the The connection between the optical lens and the mirror base enters from the outside of the fixed-focus camera module, thereby improving the imaging quality of the fixed-focus camera module.
依本实用新型,能够实现前述目的和其他目的以及优势的定焦摄像模组包括:According to the utility model, the fixed-focus camera module capable of achieving the foregoing and other purposes and advantages includes:
一线路板;a circuit board;
一光学镜头;an optical lens;
一感光芯片,其中所述感光芯片被贴装于所述线路板;以及a photosensitive chip, wherein the photosensitive chip is mounted on the circuit board; and
一镜座,其中所述线路板被封装于所述镜座的下侧面,所述光学镜头的下端面被封装于所述镜座的上侧面,并且所述光学镜头被保持在所述感光芯片的感光路径。A mirror base, wherein the circuit board is packaged on the lower side of the mirror base, the lower end surface of the optical lens is packaged on the upper side of the mirror base, and the optical lens is held on the photosensitive chip photosensitive path.
根据本发明的一个实施例,所述定焦摄像模组进一步包括一胶合层,其中所述胶合层被设置于或者形成于所述镜座和所述光学镜头之间,以藉由所述胶合层封闭所述光学镜头和所述镜座的连接处。According to an embodiment of the present invention, the fixed-focus camera module further includes a glue layer, wherein the glue layer is arranged or formed between the mirror holder and the optical lens, so that by the glue A layer seals the junction of the optical lens and the mirror mount.
根据本发明的一个实施例,所述镜座具有一第二封装槽,所述光学镜头的下端面被封装于所述镜座的所述第二封装槽。According to an embodiment of the present invention, the mirror base has a second packaging groove, and the lower end surface of the optical lens is packaged in the second packaging groove of the mirror base.
根据本发明的一个实施例,所述镜座具有一第二封装槽,所述胶合层用于将所述光学镜头的下端面封装于所述镜座的所述第二封装槽。According to an embodiment of the present invention, the mirror base has a second packaging groove, and the adhesive layer is used to seal the lower end surface of the optical lens in the second packaging groove of the mirror base.
根据本发明的一个实施例,所述定焦摄像模组进一步包括一滤光元件,其中所述滤光元件被贴装于所述线路板,并且所述滤光元件位于所述光学镜头和所述感光芯片之间。According to an embodiment of the present invention, the fixed-focus camera module further includes a filter element, wherein the filter element is mounted on the circuit board, and the filter element is located between the optical lens and the between the photosensitive chips.
根据本发明的一个实施例,所述定焦摄像模组进一步包括一滤光元件,其中所述滤光元件被贴装于镜座,并且所述滤光元件位于所述光学镜头和所述感光芯片之间。According to an embodiment of the present invention, the fixed-focus camera module further includes a filter element, wherein the filter element is attached to the lens holder, and the filter element is located between the optical lens and the photosensitive between chips.
根据本发明的一个实施例,所述镜座具有一第一封装槽,所述滤光元件被贴装于所述镜座的所述第一封装槽。According to an embodiment of the present invention, the mirror base has a first packaging groove, and the filter element is attached to the first packaging groove of the mirror base.
根据本实用新型的另一个方面,本实用新型提供一调焦装置,其用于对被封装的一定焦摄像模组执行调焦操作,其中所述调焦装置包括:According to another aspect of the present utility model, the present utility model provides a focusing device, which is used for performing a focusing operation on a packaged fixed-focus camera module, wherein the focusing device includes:
一计算设备;和a computing device; and
一调焦机构,其中所述调焦机构被连接于所述计算设备,其中所述调焦机构进一步包括一第一固定件和一第二固定件,所述第一固定件在所述定焦摄像模组的光学镜头的外部固定所述光学镜头,所述第二固定件固定所述定焦摄像模组的感光芯片,其中所述计算设备通过分析所述定焦摄像模组拍摄的图像生成一调焦信号,所述调焦机构基于所述调焦信号通过所述第一固定件和所述第二固定件调整所述光学镜头和所述感光芯片的相对位置,以执行对所述定焦摄像模组的调焦操作。A focus adjustment mechanism, wherein the focus adjustment mechanism is connected to the computing device, wherein the focus adjustment mechanism further includes a first fixing member and a second fixing member, the first fixing member is on the fixed focus The outside of the optical lens of the camera module fixes the optical lens, and the second fixing member fixes the photosensitive chip of the fixed-focus camera module, wherein the computing device generates an image by analyzing images captured by the fixed-focus camera module A focusing signal, the focusing mechanism adjusts the relative position of the optical lens and the photosensitive chip through the first fixing part and the second fixing part based on the focusing signal, so as to perform the positioning The focus operation of the focus camera module.
根据本发明的一个实施例,所述计算设备包括可通信连接的一接收模块、一分析模块以及一数据生成模块,所述接收模块接收所述定焦摄像模组拍摄的所述图像,所述分析模块分析所述图像,所述数据生成模块基于所述分析模块的分析结果生成所述调焦信号,以供后续所述调焦机构基于所述调焦信号执行对所述定焦摄像模组的调焦操作。According to an embodiment of the present invention, the computing device includes a receiving module, an analyzing module, and a data generating module that are communicably connected, the receiving module receives the image captured by the fixed-focus camera module, the The analysis module analyzes the image, and the data generation module generates the focusing signal based on the analysis result of the analysis module, so that the focus adjustment mechanism can execute the fixed-focus camera module based on the focus signal focus operation.
根据本发明的一个实施例,所述第一固定件和所述光学镜头的固定方式选自螺纹、限位、卡扣、UV解离胶和热熔中的一种。According to an embodiment of the present invention, the fixing method of the first fixing member and the optical lens is selected from one of thread, limit, buckle, UV release glue and hot melt.
附图说明Description of drawings
图1是现有技术的分解示意图。Fig. 1 is an exploded schematic view of the prior art.
图2是根据本实用新型的一较佳实施例的定焦摄像模组的立体示意图。Fig. 2 is a schematic perspective view of a fixed-focus camera module according to a preferred embodiment of the present invention.
图3是根据本实用新型的上述较佳实施例的定焦摄像模组的剖视示意图。FIG. 3 is a schematic cross-sectional view of the fixed-focus camera module according to the above-mentioned preferred embodiment of the present invention.
图4是根据本实用新型的上述较佳实施例的定焦摄像模组的一个变形实施方式的剖视示意图。FIG. 4 is a schematic cross-sectional view of a variant implementation of the fixed-focus camera module according to the above-mentioned preferred embodiment of the present invention.
图5是根据本实用新型的上述较佳实施例的定焦摄像模组的另一个变形实施方式的剖视示意图。FIG. 5 is a schematic cross-sectional view of another modified implementation of the fixed-focus camera module according to the above-mentioned preferred embodiment of the present invention.
图6是根据本实用新型的上述较佳实施例的定焦摄像模组的一个制造方法流程框图示意图。FIG. 6 is a schematic block diagram of a manufacturing method of the fixed-focus camera module according to the above-mentioned preferred embodiment of the present invention.
图7是根据本实用新型的上述较佳实施例的定焦摄像模组的另一个制造方法流程框图示意图。FIG. 7 is a schematic block diagram of another manufacturing method of the fixed-focus camera module according to the above-mentioned preferred embodiment of the present invention.
图8是根据本实用新型的上述较佳实施例的调焦装置的框图示意图。Fig. 8 is a schematic block diagram of a focusing device according to the above preferred embodiment of the present invention.
图9是根据本实用新型的上述较佳实施例的调焦装置对定焦摄像模组的调焦过程的一个概念示意图。FIG. 9 is a conceptual schematic diagram of the focusing process of the fixed-focus camera module by the focusing device according to the above-mentioned preferred embodiment of the present invention.
图10是根据本实用新型的上述较佳实施例的调焦装置对定焦摄像模组的调焦过程的另一个概念示意图。FIG. 10 is another conceptual schematic diagram of the focusing process of the fixed-focus camera module by the focusing device according to the above-mentioned preferred embodiment of the present invention.
图11是根据本实用新型的上述较佳实施例的定焦摄像模组的调焦方法流程框图示意图。FIG. 11 is a block diagram of a flow chart of the focusing method of the fixed-focus camera module according to the above-mentioned preferred embodiment of the present invention.
具体实施方式detailed description
以下描述用于揭露本实用新型以使本领域技术人员能够实现本实用新型。以下描述中的优选实施例只作为举例,本领域技术人员可以想到其他显而易见的变型。在以下描述中界定的本实用新型的基本原理可以应用于其他实施方案、变形方案、改进方案、等同方案以及没有背离本实用新型的精神和范围的其他技术方案。The following description is used to disclose the utility model so that those skilled in the art can realize the utility model. The preferred embodiments described below are only examples, and those skilled in the art can devise other obvious variations. The basic principles of the present invention defined in the following description can be applied to other embodiments, variants, improvements, equivalents and other technical solutions without departing from the spirit and scope of the present invention.
参考本实用新型的说明书附图之图2和图3,依本实用新型的一较佳实施例的定焦摄像模组被阐明,其中所述定焦摄像模组包括一感光芯片10、一光学镜头20以及一镜座30,其中所述光学镜头20被直接封装于所述镜座30,并且所述光学镜头20被保持在所述感光芯片10的感光路径20。被物体反射的光线能够自所述光学镜头20进入所述定焦摄像模组的内部,并且被所述感光芯片10接收和进行光电转化,以生成与物体相关联的影像(例如图像或者视频)。Referring to Fig. 2 and Fig. 3 of the accompanying drawings of the utility model, a fixed-focus camera module according to a preferred embodiment of the utility model is illustrated, wherein the fixed-focus camera module includes a photosensitive chip 10, an optical The lens 20 and a mirror holder 30 , wherein the optical lens 20 is directly packaged in the mirror holder 30 , and the optical lens 20 is held in the photosensitive path 20 of the photosensitive chip 10 . The light reflected by the object can enter the interior of the fixed-focus camera module from the optical lens 20, and be received by the photosensitive chip 10 and undergo photoelectric conversion to generate an image (such as an image or video) associated with the object. .
值得一提的是,在本实用新型的所述定焦摄像模组中,所述感光芯片10的类型和所述光学镜头20的类型均不受限制。例如在一个示例性的说明中,所述感光芯片10可以是电荷耦合元件(Charge Coupled Device,CCD),或者所述感光芯片10可以是金属氧化物半导体元件(Complementary Metal-Oxide Semiconductor,CMOS),或者所述感光芯片10可以是硅光子学芯片。也就是说,在本实用新型的所述定焦摄像模组中,所述感光芯片10是指任何能够在接收被物体反射的光线后实现光电转化的光学元件。相应地,所述光学镜头20是指任何能够允许被物体反射的光线自所述定焦摄像模组的外部进入内部并改善该光线质量的光学元件。It is worth mentioning that, in the fixed-focus camera module of the present invention, the type of the photosensitive chip 10 and the type of the optical lens 20 are not limited. For example, in an exemplary illustration, the photosensitive chip 10 may be a charge coupled device (Charge Coupled Device, CCD), or the photosensitive chip 10 may be a metal oxide semiconductor element (Complementary Metal-Oxide Semiconductor, CMOS), Or the photosensitive chip 10 can be a silicon photonics chip. That is to say, in the fixed-focus camera module of the present invention, the photosensitive chip 10 refers to any optical element capable of realizing photoelectric conversion after receiving light reflected by an object. Correspondingly, the optical lens 20 refers to any optical element that can allow the light reflected by the object to enter the inside from the outside of the fixed-focus camera module and improve the quality of the light.
在本实用新型的所述定焦摄像模组中,所述光学镜头20被直接封装于所述镜座30。也就是说,本实用新型的所述定焦摄像模组不需要提供现有技术的镜筒结构,通过这样的方式,能够减少所述定焦摄像模组在所述光学镜头20的周围的体积,以在所述定焦摄像模组被安装于一电子设备时,所述定焦摄像模组能够尽可能少地占用所述电子设备的空间,从而使所述电子设备能够留出更多的空间以供安装其他的元器件。在一个具体的示例中,在所述光学镜头20的周围的任何一个方向都能够节省至少0.2mm的空间,也就是说,所述定焦摄像模组的头部(即所述光学镜头20及其周围)能够节省至少0.4mm的空间,这对于所述定焦摄像模组能够被应用于智能化、轻薄化的所述电子设备具有重要意义。In the fixed-focus camera module of the present invention, the optical lens 20 is directly packaged in the lens holder 30 . That is to say, the fixed-focus camera module of the present utility model does not need to provide the lens barrel structure of the prior art. In this way, the volume of the fixed-focus camera module around the optical lens 20 can be reduced. , so that when the fixed-focus camera module is installed in an electronic device, the fixed-focus camera module can occupy as little space as possible in the electronic device, so that the electronic device can reserve more space for other components to be installed. In a specific example, a space of at least 0.2mm can be saved in any direction around the optical lens 20, that is to say, the head of the fixed-focus camera module (that is, the optical lens 20 and the around it) can save a space of at least 0.4mm, which is of great significance for the fixed-focus camera module to be applied to intelligent, thinner and lighter electronic devices.
另外,本实用新型的所述定焦摄像模组不需要提供现有技术的镜筒结构,而是将所述光学镜头20直接封装于所述镜座30,通过这样的方式,能够减少原材料的使用以降低所述定焦摄像模组的成本,从而提高所述定焦摄像模组的产品竞争力。In addition, the fixed-focus camera module of the present invention does not need to provide the lens barrel structure of the prior art, but the optical lens 20 is directly packaged in the lens holder 30. In this way, the cost of raw materials can be reduced. It is used to reduce the cost of the fixed-focus camera module, thereby improving the product competitiveness of the fixed-focus camera module.
在封装本实用新型的所述定焦摄像模组的过程中,通过一调焦机构在所述光学镜头20的外部固定所述光学镜头20的方式,调整所述光学镜头20相对于所述感光芯片10的位置,以改善所述定焦摄像模组的成像品质。因此,在这一过程中,即便是所述调焦机构导致所述光学镜头20产生固体颗粒等污染物,该固体颗粒等污染物也不会进入到所述定焦摄像模组的内部,以防止该固体颗粒等污染物造成污坏点,从而确保所述定焦摄像模组的成像品质。在该固体颗粒等污染物产生之后,该固体颗粒等污染物至多会附着在所述定焦摄像模组的外表面,在所述定焦摄像模组被封装完成后,能够通过清洗的方式去除附着在所述定焦摄像模组的外表面的固体颗粒等污染物,以有利于保证所述定焦摄像模组在被配置于所述电子设备的使用过程中的成像品质。In the process of packaging the fixed-focus camera module of the present utility model, the optical lens 20 is adjusted relative to the photosensitive The position of the chip 10 is used to improve the imaging quality of the fixed-focus camera module. Therefore, in this process, even if the focusing mechanism causes the optical lens 20 to produce pollutants such as solid particles, the solid particles and other pollutants will not enter the interior of the fixed-focus camera module, so as to The solid particles and other pollutants are prevented from causing dirty spots, so as to ensure the imaging quality of the fixed-focus camera module. After the solid particles and other pollutants are generated, the solid particles and other pollutants will at most adhere to the outer surface of the fixed-focus camera module, and after the fixed-focus camera module is packaged, it can be removed by cleaning Pollutants such as solid particles attached to the outer surface of the fixed-focus camera module are beneficial to ensure the imaging quality of the fixed-focus camera module during use when it is configured in the electronic device.
进一步地,如图3,所述定焦摄像模组包括一胶合层40,其中所述胶合层40位于所述光学镜头20和所述镜座30之间,以用于将所述光学镜头20直接封装于所述镜座30。值得一提的是,所述胶合层40不仅能够连接所述光学镜头20和所述镜座30,而且所述胶合层40还能够用于密封产生于所述光学镜头20和所述镜座30的连接处,从而阻止该固体颗粒等污染物或者外界污染物或者外部光线通过所述光学镜头20和所述镜座30的连接处自所述定焦摄像模组的外部进入所述定焦摄像模组的内部,以有利于保证所述定焦摄像模组的成像品质。Further, as shown in FIG. 3 , the fixed-focus camera module includes a glued layer 40, wherein the glued layer 40 is located between the optical lens 20 and the mirror holder 30, for placing the optical lens 20 directly encapsulated in the mirror base 30 . It is worth mentioning that the adhesive layer 40 can not only connect the optical lens 20 and the mirror holder 30, but also can be used to seal the optical lens 20 and the mirror holder 30. The joint, thereby preventing pollutants such as solid particles or external pollutants or external light from entering the fixed-focus camera from the outside of the fixed-focus camera module through the joint between the optical lens 20 and the mirror base 30 The interior of the module is beneficial to ensure the imaging quality of the fixed-focus camera module.
在所述定焦摄像模组的一个实施方式中,所述胶合层40可以被单独地形成,以在后续将所述胶合层40设置在所述光学镜头20和所述镜座30之间。优选地,所述胶合层40可以呈半凝固状,以使所述胶合层40具有粘性并且所述胶合层40在任何一个位置的厚度能够被调整,并且在所述胶合层40被设置在所述光学镜头20和所述镜座30之间且完成对所述定焦摄像模组的调焦后,所述胶合层40能够被固化,以藉由所述胶合层40保证所述光学镜头20被保持在被调焦后的位置。In an embodiment of the fixed-focus camera module, the adhesive layer 40 can be formed separately, so that the adhesive layer 40 can be disposed between the optical lens 20 and the mirror holder 30 later. Preferably, the adhesive layer 40 can be semi-solidified, so that the adhesive layer 40 has viscosity and the thickness of the adhesive layer 40 at any position can be adjusted, and when the adhesive layer 40 is arranged at the Between the optical lens 20 and the mirror holder 30 and after the focusing of the fixed-focus camera module is completed, the adhesive layer 40 can be cured, so that the optical lens 20 can be guaranteed by the adhesive layer 40 is held in the focused position.
在所述定焦摄像模组的另一个实施方式中,所述胶合层40形成在所述光学镜头20和所述镜座30的连接处。具体地说,选择性地在所述光学镜头20和所述镜座30的至少一个的相应位置进行点胶,在点胶操作完成后,将所述光学镜头20的下端面安装于所述镜座30,以使胶水处于所述光学镜头20和所述镜座30之间,并对所述定焦摄像模组进行调焦,调焦时可以通过在所述光学镜头20的外部固定所述光学镜20的方式进行,在调焦完成后,使胶水固化以形成位于所述光学镜头20和所述镜座30之间的所述胶合层40。优选地,可以仅在所述镜座30的相应位置进行点胶,以防止胶水污染所述光学镜头20。更优选地,可以通过紫外光线(Ultraviolet Rays,UV光线)照射胶水的方式使胶水固化。In another embodiment of the fixed-focus camera module, the glue layer 40 is formed at the junction of the optical lens 20 and the mirror holder 30 . Specifically, selectively dispensing at least one corresponding position of the optical lens 20 and the mirror holder 30, after the dispensing operation is completed, the lower end surface of the optical lens 20 is installed on the mirror seat 30, so that the glue is between the optical lens 20 and the mirror seat 30, and the fixed-focus camera module is focused, and the focus can be fixed on the outside of the optical lens 20 After the focusing is completed, the glue is cured to form the glued layer 40 between the optical lens 20 and the mirror holder 30 . Preferably, glue can be dispensed only at the corresponding position of the lens holder 30 to prevent the glue from polluting the optical lens 20 . More preferably, the glue can be cured by irradiating the glue with ultraviolet light (Ultraviolet Rays, UV light).
值得一提的是,在所述镜座30的相应位置完成点胶操作后,可以先使胶水半固化,以防止在将所述光学镜头20封装于所述镜座30的过程中胶水对所述光学镜头20造成污染。换句话说,胶水在通过点胶的方式被涂布于所述镜座30后,可以先使胶水呈半固化状态,以使半固化的胶水具有粘性和可塑性,在所述光学镜头20的下端面安装于所述镜座30并且完成对所述定焦摄像模组的调焦后,再使胶水完成固化,以形成位于所述光学镜头20和所述镜座30之间的所述胶合层40,从而一方面所述胶合层40使所述光学镜头20被保持在调焦后的位置,另一方面所述胶合层40封闭所述光学镜头20和所述镜座30的连接处。It is worth mentioning that after the glue dispensing operation is completed at the corresponding position of the mirror base 30, the glue can be semi-cured first, so as to prevent the glue from affecting the optical lens 20 in the process of packaging the optical lens 20 on the mirror base 30. The above optical lens 20 causes pollution. In other words, after the glue is applied to the lens base 30 by dispensing, the glue can be made into a semi-cured state first, so that the semi-cured glue has viscous and plasticity, and under the optical lens 20 After the end surface is installed on the mirror base 30 and the focus adjustment of the fixed-focus camera module is completed, the glue is cured to form the glued layer between the optical lens 20 and the mirror base 30 40 , so that on the one hand, the adhesive layer 40 keeps the optical lens 20 at the position after focusing, and on the other hand, the adhesive layer 40 seals the joint between the optical lens 20 and the mirror holder 30 .
在封装本实用新型的所述定焦摄像模组的过程中,所述胶合层40能够改善所述光学镜头20和所述镜座30的平整度,以使所述光学镜头20的中心轴线能够与所述感光芯片10的中心轴线重合,以改善所述定焦摄像模组的成像品质。也就是说,所述胶合层40能够弥补所述光学镜头20的产品误差和所述镜座30的产品误差以及所述光学镜头20和所述镜座30的贴装误差,从而改善所述定焦摄像模组的成像品质。In the process of packaging the fixed-focus camera module of the present invention, the adhesive layer 40 can improve the flatness of the optical lens 20 and the mirror holder 30, so that the central axis of the optical lens 20 can It coincides with the central axis of the photosensitive chip 10 to improve the imaging quality of the fixed-focus camera module. That is to say, the glued layer 40 can make up for the product error of the optical lens 20 and the product error of the mirror base 30 and the mounting error of the optical lens 20 and the mirror base 30, thereby improving the positioning. The imaging quality of the focal camera module.
参考图2和图3,所述定焦摄像模组进一步包括一线路板50,其中所述感光芯片10被贴装于所述线路板50,所述线路板50被封装于所述镜座30,以使所述光学镜头20和所述感光芯片10相互对应。优选地,所述线路板50可以是PCB线路板(Printed Circuit Board,印刷线路板),以在所述感光芯片10被贴装于所述线路板50后,所述线路板50能够保持所述感光芯片10的平整度。尽管如此,本领域的技术人员可以理解的是,所述线路板50也可以任何能够连接所述感光芯片10和所述电子设备的其他元件的结构,例如所述线路板50可以是FPC线路板(Flexible Printed Circuit,柔性线路板),具体地说,可以将被实施为FPC线路板的所述线路板50贴附在一个加强件(例如金属材质的加强件)上,然后将所述感光芯片10贴附在所述加强件,并且将所述感光芯片10连接于所述线路板50,以藉由所述加强件保证所述感光芯片10的平整度。2 and 3, the fixed-focus camera module further includes a circuit board 50, wherein the photosensitive chip 10 is mounted on the circuit board 50, and the circuit board 50 is packaged in the mirror holder 30 , so that the optical lens 20 and the photosensitive chip 10 correspond to each other. Preferably, the circuit board 50 may be a PCB circuit board (Printed Circuit Board, printed circuit board), so that after the photosensitive chip 10 is mounted on the circuit board 50, the circuit board 50 can hold the The flatness of the photosensitive chip 10. However, those skilled in the art can understand that the circuit board 50 can also be any structure that can connect the photosensitive chip 10 and other components of the electronic device, for example, the circuit board 50 can be an FPC circuit board (Flexible Printed Circuit, flexible circuit board), specifically, the circuit board 50 that is implemented as an FPC circuit board can be attached to a reinforcement (such as a metal reinforcement), and then the photosensitive chip 10 is attached to the reinforcing member, and the photosensitive chip 10 is connected to the circuit board 50, so that the photosensitive chip 10 can be flattened by the reinforcing member.
在本实用新型的所述定焦摄像模组中,可以首先将所述感光芯片10固定于所述线路板50,然后通过打金线的工艺使所述感光芯片10与所述线路板50连接在一起,以将所述感光芯片10贴装于所述线路板50。可以理解的是,通过打金线的方式连接所述感光芯片10和所述线路板50仅为一个举例性的描述,在其他的示例中,所述感光芯片10可以提供一个或者多个芯片焊盘,所述线路板50可以提供一个或者多个线路板焊盘,通过将所述感光芯片10的芯片焊盘和所述线路板50的线路板焊盘焊接在一起的方式,也能够实现所述感光芯片10和所述线路板50的贴装。In the fixed-focus camera module of the present utility model, the photosensitive chip 10 can be fixed on the circuit board 50 at first, and then the photosensitive chip 10 can be connected to the circuit board 50 through a gold wire process. together to mount the photosensitive chip 10 on the circuit board 50 . It can be understood that the connection between the photosensitive chip 10 and the circuit board 50 by way of gold wire is only an exemplary description, in other examples, the photosensitive chip 10 can provide one or more chip soldering The circuit board 50 can provide one or more circuit board pads, and by welding the chip pads of the photosensitive chip 10 and the circuit board pads of the circuit board 50 together, the Mounting of the photosensitive chip 10 and the circuit board 50.
另外,所述定焦摄像模组进一步包括一滤光元件60,其中所述滤光元件60被设置于所述感光芯片10和所述光学镜头20之间,以用于改善所述定焦摄像模组的成像品质。被物体反射的光线自所述光学镜头20进入所述定焦摄像模组的内部,并在被所述滤光元件60过滤后进一步被所述感光芯片10接收和进行光电转化,以生成与物体相关联的影像。也就是说,所述滤光元件60能够过滤自所述光学镜头20进入所述定焦摄像模组的内部的被物体反射的光线中的杂光,以改善所述定焦摄像模组的成像品质。In addition, the fixed-focus camera module further includes a filter element 60, wherein the filter element 60 is arranged between the photosensitive chip 10 and the optical lens 20 to improve the fixed-focus camera The imaging quality of the module. The light reflected by the object enters the interior of the fixed-focus camera module from the optical lens 20, and is further received and photoelectrically converted by the photosensitive chip 10 after being filtered by the filter element 60 to generate associated images. That is to say, the filter element 60 can filter the stray light in the light reflected by the object entering the interior of the fixed-focus camera module from the optical lens 20, so as to improve the imaging of the fixed-focus camera module quality.
值得一提的是,所述滤光元件60的类型不受限制,例如在本实用新型的一个示例中,所述滤光元件60可以是红外截止滤光片,以过滤进入所述定焦摄像模组的内部的被物体反射的光线中的红外光线。在本实用新型的另一个示例中,所述滤光元件60也可以是全透光谱滤光片。另外,所述滤光元件60也可以被调整,例如所述滤光元件60可以被可移动地设置于所述镜座30,以通过改变所述滤光元件60的位置来使所述定焦摄像模组被应用于不同的使用环境。It is worth mentioning that the type of the filter element 60 is not limited, for example, in an example of the present invention, the filter element 60 can be an infrared cut filter to filter the Infrared light in the light reflected by the object inside the module. In another example of the present invention, the filter element 60 may also be a fully transparent filter. In addition, the filter element 60 can also be adjusted, for example, the filter element 60 can be movably arranged on the mirror base 30, so that the fixed focus can be achieved by changing the position of the filter element 60 Camera modules are used in different usage environments.
参考图3,所述滤光元件60被封装于所述镜座30的内部,以使所述滤光元件60被保持在所述光学镜头20和所述感光芯片10之间。例如可以先将所述滤光元件60封装于所述镜座30的内部,然后再将所述线路板50封装于所述镜座30。Referring to FIG. 3 , the filter element 60 is packaged inside the mirror holder 30 so that the filter element 60 is held between the optical lens 20 and the photosensitive chip 10 . For example, the filter element 60 can be packaged inside the mirror base 30 first, and then the circuit board 50 can be packaged in the mirror base 30 .
参考图3,所述镜座30的内部设有一第一封装槽31,其中所述滤光元件60被封装于所述镜座30的所述第一封装槽31,通过这样的方式,能够有效地降低所述定焦摄像模组的高度,以使所述定焦摄像模组特别适于被应用于追求轻薄化的所述电子设备。另外,所述镜座30的外部设有一第二封装槽32,其中在一个示例中,所述光学镜头20被通过所述胶合层40直接封装于所述镜座30的所述第二封装槽32,在另一个示例中,可以仅所述胶合层40位于所述镜座30的所述第二封装槽32,通过这样的方式,能够进一步有效地降低所述定焦摄像模组的高度,以使所述定焦摄像模组特别适于被应用于追求轻薄化的所述电子设备。Referring to FIG. 3 , the inside of the mirror base 30 is provided with a first packaging groove 31, wherein the filter element 60 is packaged in the first packaging groove 31 of the mirror base 30. In this way, it can effectively The height of the fixed-focus camera module is reduced as much as possible, so that the fixed-focus camera module is especially suitable for being applied to the electronic equipment that pursues thinner and lighter. In addition, the outside of the mirror base 30 is provided with a second package groove 32, wherein in one example, the optical lens 20 is directly packaged in the second package groove of the mirror base 30 through the adhesive layer 40 32. In another example, only the adhesive layer 40 may be located in the second packaging groove 32 of the mirror base 30. In this way, the height of the fixed-focus camera module can be further effectively reduced. Therefore, the fixed-focus camera module is particularly suitable for being applied to the electronic equipment that pursues lightness and thinness.
参考图4是所述定焦摄像模组的一个变形实施方式,其中本实用新型的这个实施例的所述定焦摄像模组与上述较佳实施例的所述定焦摄像模组的结构的区别在于所述滤光元件60被封装的位置。具体地说,在本实用新型的这个实施例的所述定焦摄像模组中,所述滤光元件60被设置于所述线路板50,并且所述滤光元件60覆盖于所述感光芯片10。优选地,所述滤光元件60与所述感光芯片10被直接贴附在一起。当所述线路板50被封装于所述镜座30后,所述滤光元件60被保持在所述光学镜头20和所述感光芯片10之间。Referring to FIG. 4 is a modified implementation of the fixed-focus camera module, wherein the structure of the fixed-focus camera module in this embodiment of the present invention is different from the structure of the fixed-focus camera module in the above-mentioned preferred embodiment. The difference is where the filter element 60 is packaged. Specifically, in the fixed-focus camera module of this embodiment of the present invention, the filter element 60 is arranged on the circuit board 50, and the filter element 60 covers the photosensitive chip 10. Preferably, the filter element 60 and the photosensitive chip 10 are directly attached together. After the circuit board 50 is packaged in the mirror holder 30 , the filter element 60 is held between the optical lens 20 and the photosensitive chip 10 .
参考图5是所述定焦摄像模组的另一个变形实施方式,其中本实用新型的这个实施例的所述定焦摄像模组与上述较佳实施例的所述定焦摄像模组的结构的区别在于所述滤光元件60被封装的位置。具体地说,在本实用新型的这个实施例的所述定焦摄像模组中,所述滤光元件60被封装于镜座30的外部,以使所述滤光元件60更靠近所述光学镜头20,并且被封装于镜座30的外部的所述滤光元件60能够被保持在所述光学镜头20和所述感光芯片10之间。Referring to FIG. 5 is another modified implementation of the fixed-focus camera module, wherein the structure of the fixed-focus camera module of this embodiment of the present invention is the same as that of the above-mentioned preferred embodiment. The difference lies in the location where the filter element 60 is packaged. Specifically, in the fixed-focus camera module of this embodiment of the present invention, the filter element 60 is packaged outside the mirror holder 30, so that the filter element 60 is closer to the optical The lens 20 , and the filter element 60 packaged outside the lens holder 30 can be held between the optical lens 20 and the photosensitive chip 10 .
在封装本实用新型的所述定焦摄像模组的过程中,步骤一,可以先将所述线路板50和所述感光芯片10固定在一起,并且通过打金线的工艺导通所述线路板50和所述感光芯片10,以将所述感光芯片10贴装于所述线路板50。In the process of packaging the fixed-focus camera module of the present utility model, in step 1, the circuit board 50 and the photosensitive chip 10 can be fixed together first, and the circuit is connected through a gold wire process board 50 and the photosensitive chip 10 , so as to mount the photosensitive chip 10 on the circuit board 50 .
步骤二,将所述滤光元件60封装于所述镜座30,例如在本实用新型的附图3示出的这个示例中,所述滤光元件60可以被封装于所述镜座30的所述第一封装槽31内。本领域的技术人员可以理解的是,在封装本实用新型的所述定焦摄像模组的过程中,所述步骤一和所述步骤二可以不分先后顺序,或者所述步骤一和所述步骤二可以同时进行。Step 2, the filter element 60 is packaged in the mirror base 30, for example, in the example shown in Figure 3 of the present utility model, the filter element 60 can be packaged in the mirror base 30 Inside the first package groove 31 . Those skilled in the art can understand that, in the process of packaging the fixed-focus camera module of the present invention, the step 1 and the step 2 may be in no particular order, or the step 1 and the Step 2 can be performed simultaneously.
步骤三,将所述线路板50封装于所述镜座30,以使所述滤光元件60对应于被贴装于所述线路板50的所述感光芯片10。Step 3, packaging the circuit board 50 on the mirror base 30 so that the filter element 60 corresponds to the photosensitive chip 10 mounted on the circuit board 50 .
步骤四,在所述镜座30的相应位置进行点胶。值得一提的是,胶水的量可以根据需要提供,例如胶水的量需要保证能够接触到所述光学镜头20的下端面。值得一提的是,胶水的量取决于胶水性能和涂布面积。Step 4, dispensing glue at the corresponding position of the mirror base 30 . It is worth mentioning that the amount of glue can be provided as required, for example, the amount of glue needs to ensure that it can contact the lower end surface of the optical lens 20 . It is worth mentioning that the amount of glue depends on the glue performance and the coating area.
步骤五,将所述光学镜头20安装于所述镜座30,以使胶水位于所述光学镜头20和所述镜座30之间,并保证所述光学镜头20处于所述感光芯片10的感光路径。Step 5, installing the optical lens 20 on the mirror holder 30, so that the glue is located between the optical lens 20 and the mirror holder 30, and ensuring that the optical lens 20 is in the photosensitive area of the photosensitive chip 10 path.
步骤六,调整所述光学镜头20相对于所述感光芯片10的位置,以对所述定焦摄像模组进行调焦。具体地说,通过所述线路板50给所述感光芯片10通电,以使所述感光芯片10能够输出图像,根据图像的清晰度对所述定焦摄像模组进行调焦。对所述定焦摄像模组进行调焦的方式可以是所述调焦机构通过夹持所述光学镜头20的外表面的方式调整所述光学镜头20相对于所述感光芯片10的位置,由于本实用新型的所述定焦摄像模组是在所述定焦摄像模组的外部实现对所述定焦摄像模组的调焦,从而即便是所述调焦机构导致所述光学镜头20的外表面产生了该固体颗粒污染物,该固体颗粒污染物也不会进入所述定焦摄像模组的内部,以改善所述定焦摄像模组的成像品质。值得一提的是,在对本实用新型的所述定焦摄像模组进行调焦操作的过程中,尽管通过调整所述光学镜头20相对于所述感光芯片10的位置能够调整所述变焦摄像模组的焦距,在其他示例中,也可以通过移动所述镜座30的方式调整所述感光芯片10相对于所述光学镜头20的位置。Step 6, adjusting the position of the optical lens 20 relative to the photosensitive chip 10 to adjust the focus of the fixed-focus camera module. Specifically, the photosensitive chip 10 is energized through the circuit board 50 so that the photosensitive chip 10 can output an image, and the focus of the fixed-focus camera module is adjusted according to the definition of the image. The way of focusing the fixed-focus camera module can be that the focusing mechanism adjusts the position of the optical lens 20 relative to the photosensitive chip 10 by clamping the outer surface of the optical lens 20, because The fixed-focus camera module of the present utility model realizes the focusing of the fixed-focus camera module outside the fixed-focus camera module, so that even if the focusing mechanism causes the optical lens 20 The solid particle pollutants are generated on the outer surface, and the solid particle pollutants will not enter the interior of the fixed-focus camera module, so as to improve the imaging quality of the fixed-focus camera module. It is worth mentioning that, in the process of performing the focusing operation on the fixed-focus camera module of the present invention, although the zoom camera module can be adjusted by adjusting the position of the optical lens 20 relative to the photosensitive chip 10 In other examples, the position of the photosensitive chip 10 relative to the optical lens 20 can also be adjusted by moving the mirror holder 30 .
步骤七,使胶水固化以形成位于所述光学镜头20和所述镜座30之间的所述胶合层40。可以理解的是,一方面所述胶合层40能够用于连接所述光学镜头20和所述镜座30,以使所述光学镜头20被保持在所述感光芯片10的感光路径,另一方面所述胶合层40能够阻止外界污染物通过所述光学镜头20和所述镜座30的连接处自所述变焦摄像模组的外部进入内部,再一方面所述胶合层40能够阻止外部光线自通过所述光学镜头20和所述镜座30的连接处自所述变焦摄像模组的外部进入内部。另外所述胶合层40还能够弥补所述光学镜头20的产品误差和所述镜座30的产品误差以及所述光学镜头20和所述镜座30的贴装误差,以防止所述光学镜头20和所述感光芯片10出现相对倾斜的情况,从而有利于保证所述定焦摄像模组的成像品质。Step seven, curing the glue to form the glued layer 40 between the optical lens 20 and the mirror holder 30 . It can be understood that, on the one hand, the adhesive layer 40 can be used to connect the optical lens 20 and the mirror holder 30, so that the optical lens 20 is kept in the photosensitive path of the photosensitive chip 10; The glued layer 40 can prevent external pollutants from entering the inside from the outside of the zoom camera module through the junction of the optical lens 20 and the mirror holder 30, and on the other hand, the glued layer 40 can prevent external light from coming into the interior. Through the connection between the optical lens 20 and the mirror base 30 , the zoom camera module enters from the outside to the inside. In addition, the glue layer 40 can also make up for the product error of the optical lens 20 and the product error of the mirror base 30 and the mounting error of the optical lens 20 and the mirror base 30, so as to prevent the optical lens 20 from There is a relative inclination with the photosensitive chip 10, which is beneficial to ensure the imaging quality of the fixed-focus camera module.
参考图6,根据本实用新型的一个方面,本实用新型还提供一定焦摄像模组的制造方法600,其中所述制造方法600包括如下步骤:Referring to FIG. 6 , according to one aspect of the present invention, the present invention also provides a manufacturing method 600 of a fixed-focus camera module, wherein the manufacturing method 600 includes the following steps:
步骤610,(a)贴装一感光芯片10于一线路板50;Step 610, (a) mounting a photosensitive chip 10 on a circuit board 50;
步骤620,(b)封装所述线路板50于一镜座30;以及Step 620, (b) package the circuit board 50 in a mirror holder 30; and
步骤630,(c)将一光学镜头20直接封装于所述镜座30,以使所述光学镜头20被保持在所述感光芯片10的感光路径,从而制成所述定焦摄像模组。Step 630, (c) directly package an optical lens 20 on the mirror holder 30, so that the optical lens 20 is kept in the photosensitive path of the photosensitive chip 10, thereby making the fixed-focus camera module.
进一步地,在所述步骤(a)中进一步包括步骤:Further, in the step (a), further include steps:
(a.1)将所述感光芯片10固定于所述线路板50;和(a.1) fixing the photosensitive chip 10 to the circuit board 50; and
(a.2)通过打金线的方式导通所述感光芯片10和所述线路板50,以将所述感光芯片10贴装于所述线路板50。(a.2) Connecting the photosensitive chip 10 and the circuit board 50 by means of gold wires, so as to mount the photosensitive chip 10 on the circuit board 50 .
在一个实施例中,在所述步骤(b)之前进一步包括步骤:将一滤光元件60封装于所述镜座30,并且在所述步骤(b)中,使所述滤光元件60和被贴装于所述线路板50的所述感光芯片10相对应。优选地,所述镜座30具有一第一封装槽31,所述滤光元件60被封装于所述镜座30的所述第一封装槽31,以降低所述定焦摄像模组的高度。In one embodiment, before the step (b), it further includes the step of: encapsulating a filter element 60 in the mirror holder 30, and in the step (b), making the filter element 60 and The photosensitive chip 10 mounted on the circuit board 50 corresponds to that. Preferably, the mirror base 30 has a first packaging groove 31, and the filter element 60 is packaged in the first packaging groove 31 of the mirror base 30, so as to reduce the height of the fixed-focus camera module .
在另一个实施例中,在所述步骤(b)之前进一步包括步骤:将所述滤光元件60封装于所述线路板50,其中所述滤光元件60覆盖于所述感光芯片10的感光面。In another embodiment, before the step (b), a step is further included: packaging the filter element 60 on the circuit board 50 , wherein the filter element 60 covers the photosensitive element of the photosensitive chip 10 noodle.
进一步地,在上述方法中,在所述光学镜头20和所述镜座30之间设置一胶合层40,以在对所述定焦摄像模组执行调焦操作后,使所述胶合层40固化。Further, in the above method, an adhesive layer 40 is provided between the optical lens 20 and the mirror holder 30, so that after the focusing operation is performed on the fixed-focus camera module, the adhesive layer 40 solidified.
进一步地,在上述方法中,在所述光学镜头20和所述镜座30中的至少一个进行点胶,以在对所述定焦摄像模组执行调焦操作后,使胶水固化以在所述光学镜头20和所述镜座30之间形成所述胶合层40。优选地,所述镜座30具有一第二封装槽32,所述胶合层40将所述光学镜头20直接封装于所述镜座30的所述第二封装槽32,以降低所述定焦摄像模组的高度。Further, in the above method, at least one of the optical lens 20 and the mirror holder 30 is dispensing glue, so that after the focusing operation is performed on the fixed-focus camera module, the glue is cured to The glue layer 40 is formed between the optical lens 20 and the mirror holder 30 . Preferably, the mirror base 30 has a second packaging groove 32, and the adhesive layer 40 directly encapsulates the optical lens 20 in the second packaging groove 32 of the mirror base 30, so as to reduce the fixed focus The height of the camera module.
根据本实用新型的另一个方面,本实用新型还提供一定焦摄像模组的制造方法,其中所述制造方法包括如下步骤:According to another aspect of the utility model, the utility model also provides a manufacturing method of a fixed-focus camera module, wherein the manufacturing method includes the following steps:
(A)在一镜座30和一光学镜头20之间点胶,以使得胶水封闭所述镜座30和所述光学镜头20的连接处;和(A) dispensing glue between a mirror base 30 and an optical lens 20, so that the glue closes the junction of the mirror base 30 and the optical lens 20; and
(B)由一调焦机构在所述光学镜头20的外部固定所述光学镜头20,以调整所述光学镜头20相对于所述镜座30的位置,其中所述调焦机构导致所述光学镜头20的外表面产生的固体颗粒污染物被胶水阻止,以防止固体颗粒污染物通过所述镜座30和所述光学镜头20的连接处自所述定焦摄像模组的外部进入内部,以制成所述定焦摄像模组。(B) Fix the optical lens 20 on the outside of the optical lens 20 by a focusing mechanism to adjust the position of the optical lens 20 relative to the mirror holder 30, wherein the focusing mechanism causes the optical lens to The solid particle pollutants produced on the outer surface of the lens 20 are stopped by the glue, so as to prevent the solid particle pollutants from entering the interior from the outside of the fixed-focus camera module through the junction of the mirror holder 30 and the optical lens 20, so as to The fixed-focus camera module is made.
进一步地,在上述方法中,在对所述定焦摄像模组执行调焦操作后,使胶水固化以在所述光学镜头20和所述镜座30之间形成一胶合层40。Further, in the above method, after performing the focusing operation on the fixed-focus camera module, the glue is cured to form a glued layer 40 between the optical lens 20 and the mirror holder 30 .
根据本实用新型的另一个方面,本实用新型还提供一定焦摄像模组的制造方法,其中所述制造方法包括如下步骤:According to another aspect of the utility model, the utility model also provides a manufacturing method of a fixed-focus camera module, wherein the manufacturing method includes the following steps:
(i)在一镜座30和一光学镜头20之间设置一胶合层40,以使得所述胶合层40封闭所述镜座30和所述光学镜头20的连接处;和(i) a glued layer 40 is set between a mirror base 30 and an optical lens 20, so that the glued layer 40 seals the junction of the mirror base 30 and the optical lens 20; and
(ii)由一调焦机构在所述光学镜头20的外部固定所述光学镜头20,以调整所述光学镜头20相对于所述镜座30的位置,其中所述调焦机构导致所述光学镜头20的外表面产生的固体颗粒污染物被所述胶合层阻止,以防止固体颗粒污染物通过所述镜座30和所述光学镜头20的连接处自所述定焦摄像模组的外部进入内部,以制成所述定焦摄像模组。(ii) Fix the optical lens 20 outside the optical lens 20 by a focusing mechanism to adjust the position of the optical lens 20 relative to the mirror holder 30, wherein the focusing mechanism causes the optical lens to The solid particle pollutants produced on the outer surface of the lens 20 are stopped by the glue layer, so as to prevent the solid particle pollutants from entering from the outside of the fixed-focus camera module through the junction of the mirror holder 30 and the optical lens 20 Inside, to make the fixed-focus camera module.
参考图7,本实用新型还提供一定焦摄像模组的制造方法700,其中所述制造方法700包括如下步骤:Referring to FIG. 7 , the present invention also provides a manufacturing method 700 of a fixed-focus camera module, wherein the manufacturing method 700 includes the following steps:
步骤710,(α)将被贴装有一感光芯片10的一线路板50封装于一镜座30;Step 710, (α) packaging a circuit board 50 mounted with a photosensitive chip 10 in a mirror holder 30;
步骤720,(β)形成或者设置一胶合层40于所述镜座30和一光学镜头20之间,以使所述胶合层40封闭所述镜座30和所述光学镜头20的连接处;以及Step 720, (β) forming or disposing a glued layer 40 between the mirror base 30 and an optical lens 20, so that the glued layer 40 closes the joint between the mirror base 30 and the optical lens 20; as well as
步骤730,(γ)在所述光学镜头20的外部固定所述光学镜头20,以调整所述光学镜头20和所述感光芯片10的相对位置,以制成所述定焦摄像模组。Step 730, (γ) fixing the optical lens 20 on the outside of the optical lens 20 to adjust the relative position of the optical lens 20 and the photosensitive chip 10 to make the fixed-focus camera module.
参考图8至图10是在所述定焦摄像模组被封装的过程中,通过所述调焦装置对所述定焦摄像模组执行调焦操作的过程的示意图,其中所述调焦装置包括一计算设备70和一调焦机构80,其中所述调焦机构80被连接于所述计算设备70。优选地,在一个示例中,所述计算设备70和所述调焦机构80可以通过有线连接的方式被可通信地连接,在另一个示例中,所述计算设备70和所述调焦机构80可以通过无线连接的方式被可通信地连接,例如所述计算设备70和所述调焦机构80可以基于蓝牙技术、Wi-Fi技术、网络技术等实现无线连接。Referring to FIG. 8 to FIG. 10 are schematic diagrams of the process of performing a focusing operation on the fixed-focus camera module through the focusing device during the process of the fixed-focus camera module being packaged, wherein the focus device It includes a computing device 70 and a focusing mechanism 80 , wherein the focusing mechanism 80 is connected to the computing device 70 . Preferably, in one example, the computing device 70 and the focusing mechanism 80 may be communicatively connected through a wired connection, and in another example, the computing device 70 and the focusing mechanism 80 It can be communicatively connected in a wireless connection, for example, the computing device 70 and the focusing mechanism 80 can be wirelessly connected based on Bluetooth technology, Wi-Fi technology, network technology and the like.
所述调焦机构80包括一第一固定件81和一第二固定件82,其中所述第一固定件81能够在所述光学镜头20的外部固定所述光学镜头20,所述第二固定件82固定所述镜座30。值得一提的是,所述第一固定件81用于固定所述光学镜头20的固定方式不受限制,例如所述第一固定件81和所述光学镜头20可以通过螺纹、限位、卡扣、UV解离胶或者热熔材料等方式进行固定。本领域的技术人员可以理解的是,上述列举的所述第一固定件81和所述光学镜头20的固定方式仅为举例性的说明以阐述本实用新型的所述调焦装置的优势和特点,而并不构成对本实用新型的所述调焦装置的内容和范围的限制。The focusing mechanism 80 includes a first fixing part 81 and a second fixing part 82, wherein the first fixing part 81 can fix the optical lens 20 outside the optical lens 20, and the second fixing part The member 82 fixes the mirror base 30 . It is worth mentioning that the fixing method of the first fixing member 81 for fixing the optical lens 20 is not limited. Buckle, UV release glue or hot melt material and other ways to fix. Those skilled in the art can understand that, the fixing methods of the first fixing member 81 and the optical lens 20 listed above are only for illustration to illustrate the advantages and characteristics of the focusing device of the present invention. , but does not constitute a limitation on the content and scope of the focusing device of the present utility model.
在本实用新型的一个具体示例提供的所述定焦摄像模组被封装的过程中,将所述感光芯片10固定于所述线路板50,通过打金线的工艺将所述感光芯片10和所述线路板50导通,以实现将所述感光芯片10贴装于所述线路板50。优选地,所述线路板50是PCB线路板,其能够保证所述感光芯片10的平整度。在将所述滤光元件60封装于所述镜座30后,再将所述线路板50封装于所述镜座30,以使所述滤光元件60位于所述感光芯片10的感光路径。在所述镜座30的相应位置点胶,以使胶水被涂布在所述镜座30。优选地,胶水的量取决于胶水性能和涂布面积,因此,胶水的量均不构成对本实用新型的所述定焦摄像模组和所述调焦装置的限制。将所述光学镜头20设置于所述镜座30,以使所述光学镜头20的下端面与胶水接触,此时,所述光学镜头20和所述感光芯片10处于大致匹配的位置。In the process of packaging the fixed-focus camera module provided in a specific example of the present invention, the photosensitive chip 10 is fixed on the circuit board 50, and the photosensitive chip 10 and the The circuit board 50 is turned on so as to mount the photosensitive chip 10 on the circuit board 50 . Preferably, the circuit board 50 is a PCB circuit board, which can ensure the flatness of the photosensitive chip 10 . After the optical filter element 60 is packaged in the mirror base 30 , the circuit board 50 is packaged in the mirror base 30 so that the optical filter element 60 is located in the photosensitive path of the photosensitive chip 10 . Glue is dispensed at corresponding positions of the mirror base 30 so that the glue is coated on the mirror base 30 . Preferably, the amount of glue depends on the properties of the glue and the coating area. Therefore, the amount of glue does not constitute a limitation on the fixed-focus camera module and the focusing device of the present invention. The optical lens 20 is placed on the mirror base 30 so that the lower end surface of the optical lens 20 is in contact with the glue, and at this moment, the optical lens 20 and the photosensitive chip 10 are in a substantially matching position.
通过所述第一固定件81在所述光学镜头20的外部固定所述光学镜头20,通过所述第二固定件82固定所述镜座30,以使所述光学镜头20被保持在所述感光芯片10的感光路径。优选地,在一个实施例中,可以半固化胶水,以防止呈流体状的胶水在所述定焦摄像模组被调焦时污染所述感光芯片10的感光路径,例如防止呈流体状的胶水在所述定焦摄像模组被调焦时污染所述光学镜头20或者所述滤光元件60或者遮挡所述感光芯片10的感光路径。The optical lens 20 is fixed on the outside of the optical lens 20 by the first fixing member 81, and the mirror holder 30 is fixed by the second fixing member 82, so that the optical lens 20 is held on the The photosensitive path of the photosensitive chip 10 . Preferably, in one embodiment, the glue can be semi-cured to prevent the fluid glue from contaminating the photosensitive path of the photosensitive chip 10 when the fixed-focus camera module is focused, for example, to prevent the fluid glue from When the fixed-focus camera module is focused, the optical lens 20 or the filter element 60 is polluted or the photosensitive path of the photosensitive chip 10 is blocked.
将一测试标版设置在所述光学镜头20的前部,通过所述线路板50给所述感光芯片10供电,以使被所述测试标版反射的光线能够自所述光学镜头20进入所述定焦摄像模组的内部,以在光线被所述滤光元件60过滤后被所述感光芯片10接收和进行光电转化,以生成与物体相关的图像。后续,所述图像被所述计算设备70接收,所述计算设备70通过分析所述图像能够生成一调焦信号,其中所述调焦信号包含了所述光学镜头20和所述感光芯片10的偏差角度和位移,例如所述调焦信号包含了所述光学镜头20和所述感光芯片10的平整度和距离应该被调整的幅度等。A test standard plate is arranged on the front portion of the optical lens 20, and the photosensitive chip 10 is powered by the circuit board 50, so that the light reflected by the test standard plate can enter the optical lens 20 from the optical lens 20. The inside of the fixed-focus camera module is used to receive and photoelectrically convert the light by the photosensitive chip 10 after being filtered by the filter element 60 to generate an image related to the object. Subsequently, the image is received by the computing device 70, and the computing device 70 can generate a focusing signal by analyzing the image, wherein the focusing signal includes the optical lens 20 and the photosensitive chip 10 Deviation angle and displacement, for example, the focusing signal includes the flatness of the optical lens 20 and the photosensitive chip 10 , the magnitude of the distance that should be adjusted, and the like.
所述调焦机构80接收所述调焦信号并基于所述调焦信号通过所述第一固定件81和所述第二固定件82调整所述光学镜头20和被封装于所述镜座30的所述感光芯片10的位置,以完成对所述定焦摄像模组的调焦操作。在一个实施例中,所述第二固定件82可以使所述镜座30保持在初始位置,所述第一固定件81使所述光学镜头20的位置被调整。在另一个实施例中,所述第一固定件81可以使所述光学镜头20保持在初始位置,所述第二固定件82使所述镜座30的位置被调整。尽管如此,在另一个实施例中,所述第一固定件81和所述第二固定件82能够同步地调整所述光学镜头20和所述镜座30的位置。The focusing mechanism 80 receives the focusing signal and adjusts the optical lens 20 and is packaged in the lens holder 30 through the first fixing member 81 and the second fixing member 82 based on the focusing signal. The position of the photosensitive chip 10 in order to complete the focusing operation of the fixed-focus camera module. In one embodiment, the second fixing part 82 can keep the mirror base 30 at an initial position, and the first fixing part 81 can make the position of the optical lens 20 be adjusted. In another embodiment, the first fixing member 81 can keep the optical lens 20 at an initial position, and the second fixing member 82 can adjust the position of the mirror holder 30 . Nevertheless, in another embodiment, the first fixing member 81 and the second fixing member 82 can adjust the positions of the optical lens 20 and the mirror holder 30 synchronously.
在对所述定焦摄像模组执行调焦操作后,使胶水固化以形成位于所述光学镜头20和所述镜座30之间的所述胶合层40,其中所述胶合层40用于封闭所述光学镜头20和所述镜座30的连接处,以避免所述第一固定件81在固定所述光学镜头20时导致所述光学镜头20的外表面产生的固体颗粒污染物通过所述光学镜头20和所述镜座30的连接处自所述定焦摄像模组的外部进入内部,从而有利于提高所述定焦摄像模组的成像品质。After performing the focusing operation on the fixed-focus camera module, the glue is cured to form the glued layer 40 between the optical lens 20 and the mirror holder 30, wherein the glued layer 40 is used to seal The junction of the optical lens 20 and the mirror holder 30 is to prevent the solid particle pollutants produced on the outer surface of the optical lens 20 from passing through the optical lens 20 when the first fixing member 81 fixes the optical lens 20 The connection between the optical lens 20 and the mirror base 30 enters from the outside of the fixed-focus camera module, which is beneficial to improve the imaging quality of the fixed-focus camera module.
值得一提的是,所述计算设备70可以是任何能够通过分析所述图像以生成所述调焦信号的设备,例如所述计算设备70可以是台式电脑、笔记本电脑、服务器、数字助理等智能设备或者两个以及两个以上的上述提及的智能设备的组合或者任何包含了上述提及的智能设备的装置。It is worth mentioning that the computing device 70 can be any device capable of generating the focusing signal by analyzing the image, for example, the computing device 70 can be a desktop computer, a notebook computer, a server, a digital assistant, etc. A device or a combination of two or more of the above-mentioned smart devices or any device that includes the above-mentioned smart devices.
优选地,所述计算设备70包括可通信连接的一接收模块71、一分析模块72以及一数据生成模块73,所述接收模块71能够接收所述定焦摄像模组拍摄的所述图像,所述分析模块72分析所述图像,所述数据生成模块73基于所述分析模块72的分析结果生成所述调焦信号,其中被可通信地连接于所述数据生成模块73的所述调焦机构80能够基于所述调焦信号通过所述第一固定件81和所述第二固定件82调整所述光学镜头20和被封装于所述镜座30的所述感光芯片10的位置,以完成对所述定焦摄像模组的调焦操作。Preferably, the computing device 70 includes a receiving module 71, an analyzing module 72, and a data generating module 73 that are communicably connected, and the receiving module 71 can receive the image captured by the fixed-focus camera module, so The analyzing module 72 analyzes the image, and the data generating module 73 generates the focusing signal based on the analysis result of the analyzing module 72, wherein the focusing mechanism communicably connected to the data generating module 73 80 can adjust the position of the optical lens 20 and the photosensitive chip 10 packaged in the mirror holder 30 through the first fixing member 81 and the second fixing member 82 based on the focusing signal, so as to complete The focusing operation of the fixed-focus camera module.
在本实用新型的另一个具体示例提供的所述定焦摄像模组被封装的过程中,将所述感光芯片10固定于所述线路板50,通过打金线的工艺将所述感光线路10和所述线路板50导通,以实现将所述感光芯片10贴装于所述线路板50。将所述滤光元件60封装于所述镜座30。在所述镜座30的相应位置点胶,以使胶水被涂布在所述镜座30。将所述光学镜头20设置在所述镜座30,以使所述光学镜头20的下端面与胶水接触。使胶水固定以形成位于所述光学镜头20和所述镜座30之间的所述胶合层40,其中所述胶合层40用于封闭所述光学镜头20和所述镜座30的连接处。在所述镜座30的相应位置点胶,以使胶水被涂布在所述镜座30,将所述线路板50设置于所述镜座30,此时,所述光学镜头20和所述感光芯片10处于大致匹配的位置。In the process of packaging the fixed-focus camera module provided in another specific example of the present invention, the photosensitive chip 10 is fixed on the circuit board 50, and the photosensitive circuit 10 is fixed to the Conducting with the circuit board 50 to realize mounting the photosensitive chip 10 on the circuit board 50 . The filter element 60 is packaged in the mirror holder 30 . Glue is dispensed at corresponding positions of the mirror base 30 so that the glue is coated on the mirror base 30 . The optical lens 20 is arranged on the mirror base 30 so that the lower end surface of the optical lens 20 is in contact with the glue. The glue is fixed to form the glue layer 40 between the optical lens 20 and the mirror base 30 , wherein the glue layer 40 is used to seal the joint between the optical lens 20 and the mirror base 30 . Glue is dispensed at the corresponding position of the mirror base 30, so that the glue is coated on the mirror base 30, and the circuit board 50 is arranged on the mirror base 30. At this time, the optical lens 20 and the The photosensitive chip 10 is in approximately matching position.
通过所述第一固定件81在所述光学镜头20的外部固定所述光学镜头20,通过所述第二固定件82固定所述线路板50,以使所述光学镜头20被保持在所述感光芯片10的感光路径。The optical lens 20 is fixed on the outside of the optical lens 20 by the first fixing member 81, and the circuit board 50 is fixed by the second fixing member 82, so that the optical lens 20 is held on the The photosensitive path of the photosensitive chip 10 .
将所述测试标版设置在所述光学镜头20的前部,通过所述线路板50给所述感光芯片10供电,以使被所述测试标版反射的光线能够自所述光学镜头20进入所述定焦摄像模组的内部,以在光线被所述滤光元件60过滤后被所述感光芯片10接收和进行光电转化,以生成与物体相关的图像。后续,所述图像被所述计算设备70接收,所述计算设备70通过分析所述图像能够生成一调焦信号,其中所述调焦信号包含了所述光学镜头20和所述感光芯片10的偏差角度和位移,例如所述调焦信号包含了所述光学镜头20和所述感光芯片10的平整度和距离应该被调整的幅度等。The test standard plate is arranged on the front portion of the optical lens 20, and the photosensitive chip 10 is powered by the circuit board 50, so that the light reflected by the test standard plate can enter from the optical lens 20 Inside the fixed-focus camera module, the light is received by the photosensitive chip 10 after being filtered by the filter element 60 and photoelectrically converted to generate an image related to the object. Subsequently, the image is received by the computing device 70, and the computing device 70 can generate a focusing signal by analyzing the image, wherein the focusing signal includes the optical lens 20 and the photosensitive chip 10 Deviation angle and displacement, for example, the focusing signal includes the flatness of the optical lens 20 and the photosensitive chip 10 , the magnitude of the distance that should be adjusted, and the like.
所述调焦机构80接收所述调焦信号并基于所述调焦信号通过所述第一固定件81和所述第二固定件82调整所述光学镜头20和所述感光芯片10的位置,以完成对所述定焦摄像模组的调焦操作。在一个实施例中,所述第二固定件82可以使所述感光芯片10保持在初始位置,所述第一固定件81使所述光学镜头20的位置被调整。在另一个实施例中,所述第一固定件81可以使所述光学镜头20保持在初始位置,所述第二固定件82使所述感光芯片10的位置被调整。尽管如此,在另一个实施例中,所述第一固定件81和所述第二固定件82能够同步地调整所述光学镜头20和所述感光芯片10的位置。在对所述定焦摄像模组执行调焦操作后,使胶水固化以封装所述线路板50和所述镜座30。The focusing mechanism 80 receives the focusing signal and adjusts the positions of the optical lens 20 and the photosensitive chip 10 through the first fixing member 81 and the second fixing member 82 based on the focusing signal, to complete the focusing operation on the fixed-focus camera module. In one embodiment, the second fixing member 82 can keep the photosensitive chip 10 at an initial position, and the first fixing member 81 can adjust the position of the optical lens 20 . In another embodiment, the first fixing member 81 can keep the optical lens 20 at an initial position, and the second fixing member 82 can adjust the position of the photosensitive chip 10 . Nevertheless, in another embodiment, the first fixing member 81 and the second fixing member 82 can adjust the positions of the optical lens 20 and the photosensitive chip 10 synchronously. After the focusing operation is performed on the fixed-focus camera module, the glue is cured to encapsulate the circuit board 50 and the mirror base 30 .
参考图11,本实用新型还提供一定焦摄像模组的调焦方法1100,其中所述调焦方法1100包括如下步骤:Referring to FIG. 11 , the present invention also provides a focusing method 1100 for a fixed-focus camera module, wherein the focusing method 1100 includes the following steps:
步骤1110,(I)由一计算设备70通过分析所述定焦摄像模组拍摄的图像生成一调焦信号;和Step 1110, (1) generate a focusing signal by a computing device 70 by analyzing the image captured by the fixed-focus camera module; and
步骤1120,(II)由一调焦机构80基于所述调焦信号,通过所述调焦机构80的一第一固定件81在所述定焦摄像模组的光学镜头20的外部固定所述光学镜头20和一第二固定件82固定所述定焦摄像模组的感光芯片10的方式,调焦所述光学镜头20和所述感光芯片10的相对位置,以对所述定焦摄像模组执行调焦操作。Step 1120, (II) by a focus adjustment mechanism 80 based on the focus adjustment signal, through a first fixing member 81 of the focus adjustment mechanism 80 to fix the outside of the optical lens 20 of the fixed focus camera module Optical lens 20 and a second fixing member 82 fix the mode of photosensitive chip 10 of described fixed-focus camera module, adjust the relative position of described optical lens 20 and described photosensitive chip 10, with described fixed-focus camera module The group performs the focusing operation.
进一步地,在所述步骤(I)之前进一步包括步骤:Further, further comprising steps before said step (1):
使所述光学镜头20被保持在所述感光芯片10的感光路径;和making the optical lens 20 held in the photosensitive path of the photosensitive chip 10; and
在所述感光芯片10被供电后拍摄位于所述光学镜头20的光路的一测试标版以获得与所述测试标版相关联的所述图像。After the photosensitive chip 10 is powered, a test target plate located in the optical path of the optical lens 20 is photographed to obtain the image associated with the test target plate.
更进一步地,在所述步骤(I)中进一步包括步骤:Further, in described step (1), further comprise steps:
由一接收模块71接收所述定焦摄像模组拍摄的所述图像;The image captured by the fixed-focus camera module is received by a receiving module 71;
由一分析模块72分析所述图像;以及analyzing the image by an analysis module 72; and
由一数据生成模块73基于所述分析模块72的分析结果生成所述调焦信号,以供后续所述调焦机构80基于所述调焦信号执行对所述定焦摄像模组的调焦操作。A data generation module 73 generates the focus signal based on the analysis result of the analysis module 72, so that the focus mechanism 80 can perform a focus operation on the fixed-focus camera module based on the focus signal. .
更进一步地,在上述方法中,将所述感光芯片10贴装于被封装在一镜座30的一线路板50上,所述第二固定件82通过固定所述镜座30的方式固定所述感光芯片10。Further, in the above method, the photosensitive chip 10 is mounted on a circuit board 50 packaged in a mirror base 30, and the second fixing member 82 fixes the mirror base 30 by fixing the Described photosensitive chip 10.
本领域技术人员应理解,上述描述及附图中所示的本实用新型的实施例只作为举例而并不限制本实用新型。Those skilled in the art should understand that the above description and the embodiments of the present invention shown in the drawings are only examples and do not limit the present invention.
本实用新型的目的已经完整并有效地实现。本实用新型的功能及结构原理已在实施例中展示和说明,在没有背离所述原理下,本实用新型的实施方式可以有任何变形或修改。The purpose of this utility model has been fully and effectively achieved. The functions and structural principles of the present utility model have been shown and explained in the embodiments, and the implementation of the present utility model can have any deformation or modification without departing from the principle.
Claims (10)
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CN201620638177.9U CN205809504U (en) | 2016-06-23 | 2016-06-23 | Focus camera module and focussing mechanism thereof |
US16/311,896 US10897611B2 (en) | 2016-06-23 | 2017-06-23 | Fixed-focus photographing module and focusing device and method thereof |
TW106209215U TWM559423U (en) | 2016-06-23 | 2017-06-23 | Fixed focus camera module |
JP2018567068A JP6727350B2 (en) | 2016-06-23 | 2017-06-23 | Fixed focus camera module, focus adjusting device and focus adjusting method thereof |
KR1020197002083A KR102248437B1 (en) | 2016-06-23 | 2017-06-23 | Fixed focus camera module and its focusing device and focusing method |
KR1020197002084A KR102264461B1 (en) | 2016-06-23 | 2017-06-23 | Fixed focus camera module and manufacturing method thereof |
KR1020217017507A KR102376930B1 (en) | 2016-06-23 | 2017-06-23 | Fixed-focus camera module and manufacturing method therefor |
PCT/CN2017/089749 WO2017220015A1 (en) | 2016-06-23 | 2017-06-23 | Fixed-focus camera module and manufacturing method therefor |
PCT/CN2017/089751 WO2017220016A1 (en) | 2016-06-23 | 2017-06-23 | Fixed-focus photographing module and focusing device and method thereof |
JP2018567073A JP6953454B2 (en) | 2016-06-23 | 2017-06-23 | Fixed focus camera module and its focus adjustment device and focus adjustment method |
TW106121170A TWI708972B (en) | 2016-06-23 | 2017-06-23 | Fixed focus camera module and manufacturing method thereof |
US16/311,894 US10827103B2 (en) | 2016-06-23 | 2017-06-23 | Fixed-focus camera module and manufacturing method therefor |
EP17814754.2A EP3477935B1 (en) | 2016-06-23 | 2017-06-23 | Fixed-focus photographing module and focusing device and method thereof |
EP17814753.4A EP3477352B1 (en) | 2016-06-23 | 2017-06-23 | Fixed-focus camera module |
US17/087,189 US11509887B2 (en) | 2016-06-23 | 2020-11-02 | Fixed-focus photographing module and focusing device and method thereof |
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