CN109673141A - High thermal conductivity mould group and high thermal conductivity radiator structure including it - Google Patents
High thermal conductivity mould group and high thermal conductivity radiator structure including it Download PDFInfo
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- CN109673141A CN109673141A CN201910110241.4A CN201910110241A CN109673141A CN 109673141 A CN109673141 A CN 109673141A CN 201910110241 A CN201910110241 A CN 201910110241A CN 109673141 A CN109673141 A CN 109673141A
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- Prior art keywords
- thermal conductivity
- high thermal
- fin
- mould group
- elastic slice
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
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- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a kind of high thermal conductivity mould group and including its high thermal conductivity radiator structure, high thermal conductivity mould group includes at least two side elastic slices, upper module, lower module, and upper module includes top base and upper fin；Lower module includes bottom base and lower fin；Upper fin intersects with lower fin to be worn；Side elastic slice is set between top base and bottom base by pressure, applies outside thrust after the elastic slice compressive deformation of side towards top base and bottom base in the up-down direction respectively, and fin and lower fin apply inward pressure to side elastic slice upward in the lateral direction.Utilization through the invention, so that radiator structure has thermal resistance small, thermal coefficient is big, conducive to optical module to the heat radiating metal shell efficient heat transfer of big cooling fin or product；Allow directly to contact with optical module in structure simultaneously, eliminate the gap reserved between optical module and peripheral frame, conducive to optical module to the heat radiating metal shell efficient heat transfer of big cooling fin or product；It is easy for installation, durable, high reliablity.
Description
Technical field
The present invention relates to a kind of high thermal conductivity mould group and including its high thermal conductivity radiator structure.
Background technique
Component in existing circuit needs to radiate.As shown in Figure 1, existing heat dissipation connection structure include cooling fin 1,
Heat conductive pad 2, to heat radiation elements 3, circuit board 4, bottom case 5.It may include for example optical module and being coated on light to heat radiation elements 3
Peripheral frame on the outside of module.
In the prior art, heat is conducted to cooling fin 1 by heat conductive pad 2 to heat radiation elements 3.However, 2 thermal resistance of heat conductive pad
Greatly, thermal coefficient is low, is not easy to conduct heat to heat radiation elements 3 to the heat radiating metal shell of cooling fin 1 or product；Simultaneously also without
Method eliminates the gap reserved between optical module and peripheral frame, and the thermal resistance between optical module and peripheral frame is big, and heat transfer efficiency is low.
Summary of the invention
The technical problem to be solved by the present invention is in order to overcome in the prior art heat conductive pad thermal resistance it is big, thermal coefficient is low, no
Be easy to the defect conducted heat to heat radiation elements to the heat radiating metal shell of cooling fin or product, provide a kind of high thermal conductivity mould group and
Including its high thermal conductivity radiator structure.
The present invention is to solve above-mentioned technical problem by following technical proposals:
A kind of high thermal conductivity mould group, it is characterized in that, the high thermal conductivity mould group includes at least two side elastic slices, setting up and down
Upper module and lower module, wherein
The upper module includes top base and the upper fin towards lower module extension；
The lower module includes bottom base and the lower fin towards upper module extension；
The upper fin intersects with the lower fin to be worn；
The side elastic slice is set between the top base and the bottom base by pressure, is divided after the side elastic slice compressive deformation
Do not apply outside thrust towards the top base and bottom base in the up-down direction, and side elastic slice court in the lateral direction
The upper fin and the lower fin apply inward pressure.
By the arranged in a crossed manner of upper fin and lower fin in this programme, it ensure that the heat between upper module and lower module passes
It leads.
Wherein, side elastic slice provides the outward thrust in up and down direction when being pressurized, and high thermal conductivity mould group is made integrally to have elasticity,
The pressure that side elastic slice applies inwardly in the lateral direction simultaneously promotes upper fin and lower fin to clamp, and can reduce the heat between fin
Resistance is conducive to improve heat transfer efficiency.
The heat conducting module of this programme itself has elasticity as a result, can be held against with to heat radiation module, itself again can be with
Using the high material of thermal coefficient, heat transfer efficiency ensure that.
Preferably, the side elastic slice is bending shape, and the side elastic slice has bending part, and each side elastic slice is at least
One bending part contacts at the adjacent upper fin or the lower fin.Due to bending shape, shape occurs after compression for side elastic slice
Become, wherein bending part both ends occur up and down direction on folded deformation, so as to cause bending part in the lateral direction on thrust.
Preferably, the side elastic slice has three bending parts, wherein two bending parts contact at adjacent described
Upper fin or the lower fin.Pressure more uniformly can be applied to upper fin and lower fin by two bending parts.
Preferably, the top base is provided with blocking, the bottom base is provided with lower blocking, wherein the side elastic slice
Upper and lower ends be restricted to the upper blocking and the lower blocking respectively, and the upper blocking and described stop the side bullet
Piece is detached from from up and down direction and left and right directions.
The disengaging that thus it can be prevented that side elastic slice guarantees the stability of structure.
Preferably, the upper upper perpendicular gear stopped including extending downward and the upper strut rail for being connected to the upper perpendicular gear, institute
Strut rail is stated to extend inwardly in the lateral direction；
The lower lower perpendicular gear stopped including extending upward and the lower strut rail for being connected to the lower perpendicular gear, the lower strut rail
Extend inwardly in the lateral direction.
Preferably, the upper end of the side elastic slice includes the upper buckle portion to extend outwardly in the lateral direction, the side elastic slice
Lower end includes the lower buckle portion to extend outwardly in the lateral direction, wherein
The upper buckle portion is limited in the upper perpendicular gear, upper strut rail and the space of top base formation；
The lower buckle portion is limited in the lower perpendicular gear, lower strut rail and the space of bottom base formation.
Thus side elastic slice is limited between upper module and lower module by stable, while high thermal conductivity mould group itself is utilized
Structure does not need other connection structures, facilitates installation.
Preferably, the upper and lower ends of the side elastic slice are respectively arranged with upper stop piece and lower stop piece, wherein
The upper stop piece is fastened on the rear and front end of the top base in the longitudinal direction respectively；
The lower stop piece is fastened on the rear and front end of the bottom base in the longitudinal direction respectively.
Upper stop piece and the perfect limit in the longitudinal direction of lower gear plate, thus thermally conductive group of module has stable structure,
The structure of side elastic slice itself is utilized simultaneously, does not need other connection structures, facilitates installation.
Preferably, the material of the upper module and the lower module is aluminum profile.Aluminum profile has the better capacity of heat transmission,
Also it is conducive to simultaneously through the large-scale production of the techniques such as extrusion forming.
A kind of high thermal conductivity radiator structure, including circuit board, radiator and be mounted on the circuit board wait radiate
Mould group, it is characterized in that, the high thermal conductivity radiator structure includes the high thermal conductivity mould group, wherein the high thermal conductivity mould group quilt
It is located in described between heat radiation module and the radiator.
Preferably, the peripheral frame for including optical module to heat radiation module and being arranged on the outside of the optical module.
Preferably, being provided with opening in the peripheral frame, the opening exposes the optical module, the bottom tool of the bottom base
Planar portions and the protrusion for protruding from the planar portions, wherein the protrusion passes through the opening and is pressed on the optical module
On.
Thus be arranged after, high thermal conductivity mould group is directly contacted with optical module, eliminate between optical module and peripheral frame reserve
Gap, conducive to optical module to the heat radiating metal shell efficient heat transfer of big cooling fin or product.
Preferably, the protrusion two sides are provided with bevelling.Smooth in order to insert with peripheral frame, what is contacted with optical module is convex
Bevelling is arranged in portion；In order to facilitate the installation of, it is provided with bevelling in protrusion two sides, thus high thermal conductivity mould group does not have to regulation peace then
Fill direction.
Preferably, the radiator is cooling fin or heat-dissipating casing.
Preferably, the upper surface of the top base is fixedly connected on the radiator.
Preferably, the high thermal conductivity radiator structure further includes the bottom case below the circuit board.
The positive effect of the present invention is that: utilization through the invention, so that radiator structure has thermal resistance small, it is thermally conductive
Coefficient is big, conducive to optical module to the heat radiating metal shell efficient heat transfer of big cooling fin or product；Allow in structure simultaneously direct
It is contacted with optical module, eliminates the gap reserved between optical module and peripheral frame, conducive to optical module to big cooling fin or product
Heat radiating metal shell efficient heat transfer；It is easy for installation, durable, high reliablity.
Detailed description of the invention
Fig. 1 is the heat dissipation connection structure perspective view of the explosion of the prior art.
Fig. 2 is the high thermal conductivity radiator structure perspective view of the explosion of present pre-ferred embodiments.
Fig. 3 is the high thermal conductivity mould group positive structure schematic of present pre-ferred embodiments.
Fig. 4 is the high thermal conductivity mould group side structure schematic diagram of present pre-ferred embodiments.
Fig. 5 is the high thermal conductivity mould group schematic perspective view of present pre-ferred embodiments.
Fig. 6 is the high thermal conductivity mould group and peripheral frame connection schematic diagram of present pre-ferred embodiments.
Specific embodiment
The present invention is further illustrated below by the mode of embodiment, but does not therefore limit the present invention to the reality
It applies among a range.
As shown in Fig. 2-Fig. 6, the invention discloses a kind of high thermal conductivity radiator structure, including circuit board 4, radiator 1 with
And installation on the circuit board 4 to heat radiation module 3, high thermal conductivity mould group 2 that high thermal conductivity radiator structure includes, wherein high thermal conductivity mould
Group 2 is located between heat radiation module 3 and radiator 1.
As shown in Fig. 2, including optical module 31 and the peripheral frame 32 that 31 outside of optical module is arranged in heat radiation module 3.
As shown in Figure 3 and Figure 6, opening 321 is provided in peripheral frame 32, opening 321 exposes optical module 31, bottom base 221
Bottom tool planar portions 226 and the protrusion 225 for protruding from planar portions 226, wherein protrusion 225 passes through opening 321 and is pressed on light
In module 31.
As shown in figure 4,225 two sides of protrusion are further provided with bevelling 227, it is smooth in order to be inserted with peripheral frame 32, with
Bevelling is arranged in the protrusion 225 that optical module 31 contacts；In order to facilitate the installation of, it is provided with bevelling 227 in 225 two sides of protrusion,
Thus high thermal conductivity mould group does not have to regulation installation direction then.
It is illustrated in figure 6 the structure before light film block 31 is not inserted into, after optical module 31 is inserted into, the lower module of high thermal conductivity mould group 2
22 are jacked up, and side elastic slice 23, which is pressurized, generates elastic force, and high thermal conductivity mould group 2 is compressed with optical module 31.
Thus after being arranged, high thermal conductivity mould group 2 is directly contacted with optical module 31, is eliminated between optical module 31 and peripheral frame 32
Reserved gap, conducive to optical module 31 to the heat radiating metal shell efficient heat transfer of big cooling fin or product.
In the present embodiment, radiator 1 is cooling fin or heat-dissipating casing.
In the present embodiment, the upper surface of top base 211 is fixedly connected on radiator 1.Specifically can with silicone adhesive or
The various ways such as bond plies or screw are affixed directly on cooling fin or metal shell.
In the present embodiment, high thermal conductivity radiator structure further includes the bottom case 5 positioned at 4 lower section of circuit board.
As shown in Fig. 3, Fig. 4 and Fig. 5, the invention also discloses a kind of high thermal conductivity mould group 2, high thermal conductivity mould group 2 includes at least
Two side elastic slices 23, upper module 21 and lower module 22 setting up and down, wherein
Upper module 21 includes top base 211 and the upper fin 212 towards the extension of lower module 22；
Lower module 22 includes bottom base 221 and the lower fin 222 towards the extension of upper module 21；
Upper fin 212 intersects with lower fin 222 to be worn；
Side elastic slice 23 is set between top base 211 and bottom base 221 by pressure, respectively upper after 23 compressive deformation of side elastic slice
Apply outside thrust to top base 211 and bottom base 221 on lower direction Y, and side elastic slice 23 is in left and right directions on X to upper fin
Piece 212 and lower fin 222 apply inward pressure.
By the arranged in a crossed manner of upper fin 212 and lower fin 222 in this programme, ensure that upper module 21 and lower module 22 it
Between heat transfer.
Wherein, side elastic slice 23 provides the outward thrust on up and down direction Y when being pressurized, and high thermal conductivity mould group is made integrally to have bullet
Property, while the pressure that side elastic slice 23 inwardly applies on X in left and right directions promotes upper fin 212 to clamp with lower fin 222, can reduce
Thermal resistance between fin is conducive to improve heat transfer efficiency.
The heat conducting module of this programme itself has elasticity as a result, can be held against with to heat radiation module 3, itself again may be used
With the material high using thermal coefficient, heat transfer efficiency ensure that.
As shown in Figure 3 and Figure 5, side elastic slice 23 is bending shape, and side elastic slice 23 has bending part 231, each side elastic slice 23
An at least bending part 231 contact at adjacent upper fin 212 or lower fin 222.Due to bending shape, side elastic slice 23 is being pressurized
Deformation occurs afterwards, and wherein the folded deformation on up and down direction Y occurs for 231 both ends of bending part, to the left and right so as to cause bending part 231
Thrust on the X of direction.
As shown in figure 3, side elastic slice 23 has three bending parts 231, wherein two bending parts 231 contact at adjacent upper fin
Piece 212 or lower fin 222.More uniformly upper fin 212 and lower fin 222 can be applied by two bending parts 231
Pressure.
In the present embodiment, top base 211 is provided with blocking, and bottom base 221 is provided with lower blocking, wherein side elastic slice 23
Upper and lower ends be restricted to stop respectively and lower blocking, and upper blocking and blocking side elastic slice 23 from up and down direction Y and
Left and right directions X is detached from.
The disengaging that side elastic slice 23 can be prevented by upper blocking and lower blocking, guarantees the stability of structure.
As shown in Figure 3 and Figure 5, upper to stop to include the upper perpendicular gear 213 extended downward and the upper cross for being connected to perpendicular gear 213
Gear 214, upper strut rail 214 extend internally on X in left and right directions；
It is lower to stop to include the lower perpendicular gear 223 extended upward and the lower strut rail 224 for being connected to lower perpendicular gear 223, lower strut rail 224
It extends internally on X in left and right directions.
As shown in Figure 3 and Figure 5, the upper end of side elastic slice 23 includes outwardly extending upper buckle portion 232 on X in left and right directions, side
The lower end of elastic slice 23 includes outwardly extending lower buckle portion 233 on X in left and right directions.
As shown in figure 3, upper buckle portion 232 is limited in the space that perpendicular gear 213, upper strut rail 214 and top base 211 are formed
It is interior；
As shown in figure 3, the space that lower buckle portion 233 is limited in lower perpendicular gear 223, lower strut rail 224 and bottom base 221 are formed
It is interior.
Thus side elastic slice 23 is limited between upper module 21 and lower module 22 by stable, while high thermal conductivity mould group is utilized
2 itself structures, do not need other connection structures, facilitate installation.
As shown in Figure 4 and Figure 5, the upper and lower ends of side elastic slice 23 are respectively arranged with upper stop piece 234 and lower stop piece 235,
In,
Wherein, as shown in figure 4, upper stop piece 234 is fastened on the rear and front end of top base 211 on front-rear direction Z respectively；
Wherein, as shown in figure 4, lower stop piece 235 is fastened on the rear and front end of bottom base 221 on front-rear direction Z respectively.
Upper stop piece 234 and the perfect limit on front-rear direction Z of lower gear plate, thus thermally conductive group of module has stable knot
Structure, while the structure of side elastic slice 23 itself is utilized, other connection structures are not needed, installation is facilitated.
In the present embodiment, the material of upper module 21 and lower module 22 is preferably aluminum profile.Aluminum profile has preferably thermally conductive
Ability, while being also conducive to through the large-scale production of the techniques such as extrusion forming.
The positive effect of the present invention is that: utilization through the invention, so that radiator structure has thermal resistance small, it is thermally conductive
Coefficient is big, conducive to optical module to the heat radiating metal shell efficient heat transfer of big cooling fin or product；Allow in structure simultaneously direct
It is contacted with optical module, eliminates the gap reserved between optical module and peripheral frame, conducive to optical module to big cooling fin or product
Heat radiating metal shell efficient heat transfer；It is easy for installation, durable, high reliablity.
Although specific embodiments of the present invention have been described above, it will be appreciated by those of skill in the art that this is only
For example, protection scope of the present invention is to be defined by the appended claims.Those skilled in the art without departing substantially from
Under the premise of the principle and substance of the present invention, many changes and modifications may be made, but these change and
Modification each falls within protection scope of the present invention.
Claims (10)
1. a kind of high thermal conductivity mould group, which is characterized in that the high thermal conductivity mould group includes at least two side elastic slices, setting up and down upper
Module and lower module, wherein
The upper module includes top base and the upper fin towards lower module extension；
The lower module includes bottom base and the lower fin towards upper module extension；
The upper fin intersects with the lower fin to be worn；
The side elastic slice is set between the top base and the bottom base by pressure, is existed respectively after the side elastic slice compressive deformation
Upper and lower applies outside thrust up towards the top base and bottom base, and the side elastic slice is in the lateral direction towards described
Upper fin and the lower fin apply inward pressure.
2. high thermal conductivity mould group as described in claim 1, which is characterized in that the side elastic slice is bending shape, and the side bullet
Piece has bending part, and an at least bending part for each side elastic slice contacts at the adjacent upper fin or the lower fin.
3. high thermal conductivity mould group as claimed in claim 2, which is characterized in that the side elastic slice has three bending parts, wherein
Two bending parts contact at the adjacent upper fin or the lower fin.
4. high thermal conductivity mould group as described in claim 1, which is characterized in that the top base is provided with blocking, the lower base
Seat is provided with lower blocking, wherein and the upper and lower ends of the side elastic slice are restricted to the upper blocking and the lower blocking respectively,
And the upper blocking and the blocking side elastic slice are detached from from up and down direction and left and right directions.
5. high thermal conductivity mould group as claimed in claim 4, which is characterized in that
The upper upper perpendicular gear stopped including extending downward and the upper strut rail for being connected to the upper perpendicular gear, the upper strut rail is on a left side
Extend inwardly in right direction；
The lower lower perpendicular gear stopped including extending upward and the lower strut rail for being connected to the lower perpendicular gear, the lower strut rail is on a left side
Extend inwardly in right direction.
6. high thermal conductivity mould group as claimed in claim 5, which is characterized in that the upper end of the side elastic slice includes in the lateral direction
The upper buckle portion to extend outwardly, the lower end of the side elastic slice include the lower buckle portion to extend outwardly in the lateral direction, wherein
The upper buckle portion is limited in the upper perpendicular gear, upper strut rail and the space of top base formation；
The lower buckle portion is limited in the lower perpendicular gear, lower strut rail and the space of bottom base formation.
7. high thermal conductivity mould group as described in claim 1, which is characterized in that the upper and lower ends of the side elastic slice are respectively arranged with
Baffle and lower stop piece, wherein
The upper stop piece is fastened on the rear and front end of the top base in the longitudinal direction respectively；
The lower stop piece is fastened on the rear and front end of the bottom base in the longitudinal direction respectively.
8. a kind of high thermal conductivity radiator structure, including circuit board, radiator and be mounted on the circuit board to radiating mould
Group, which is characterized in that the high thermal conductivity radiator structure includes the high thermal conductivity mould group as described in claim 1-7 any one,
In, the high thermal conductivity mould group is located in described between heat radiation module and the radiator.
9. high thermal conductivity radiator structure as claimed in claim 8, which is characterized in that it is described to heat radiation module include optical module and
Peripheral frame on the outside of the optical module is set, opening is provided in the peripheral frame, the opening exposes the optical module, under described
The bottom tool planar portions of pedestal and the protrusion for protruding from the planar portions, wherein the protrusion passes through the opening and presses and sets
On the optical module.
10. high thermal conductivity radiator structure as claimed in claim 9, which is characterized in that the protrusion two sides are provided with bevelling.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910110241.4A CN109673141A (en) | 2019-02-11 | 2019-02-11 | High thermal conductivity mould group and high thermal conductivity radiator structure including it |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910110241.4A CN109673141A (en) | 2019-02-11 | 2019-02-11 | High thermal conductivity mould group and high thermal conductivity radiator structure including it |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109673141A true CN109673141A (en) | 2019-04-23 |
Family
ID=66151975
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910110241.4A Pending CN109673141A (en) | 2019-02-11 | 2019-02-11 | High thermal conductivity mould group and high thermal conductivity radiator structure including it |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109673141A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112243335A (en) * | 2019-07-19 | 2021-01-19 | 泰连公司 | Dual heat transfer assembly for a receptacle assembly |
| CN119255574A (en) * | 2024-11-28 | 2025-01-03 | 苏州元脑智能科技有限公司 | Radiator, optical module device, switch, and server |
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| CN209930781U (en) * | 2019-02-11 | 2020-01-10 | 上海剑桥科技股份有限公司 | High heat conduction module and high heat conduction heat dissipation structure comprising same |
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| CN200994252Y (en) * | 2006-12-21 | 2007-12-19 | 东莞莫仕连接器有限公司 | heat sink |
| CN101547584A (en) * | 2008-03-28 | 2009-09-30 | 富准精密工业(深圳)有限公司 | Heat sink, heat sink combination and fixing device thereof |
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| CN112243335A (en) * | 2019-07-19 | 2021-01-19 | 泰连公司 | Dual heat transfer assembly for a receptacle assembly |
| CN119255574A (en) * | 2024-11-28 | 2025-01-03 | 苏州元脑智能科技有限公司 | Radiator, optical module device, switch, and server |
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| TA01 | Transfer of patent application right |
Effective date of registration: 20191210 Address after: 201114 room 8, building 2388, 501 Chen Cheng Road, Shanghai, Minhang District Applicant after: CIG SHANGHAI Co.,Ltd. Address before: 201114 room 8, building 2388, 501 Chen Cheng Road, Shanghai, Minhang District Applicant before: CIG SHANGHAI Co.,Ltd. Applicant before: CIG ZHEJIANG Co.,Ltd. |
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Application publication date: 20190423 |
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