CN109671750A - The preparation method and Preparation equipment of a kind of display panel, display panel - Google Patents
The preparation method and Preparation equipment of a kind of display panel, display panel Download PDFInfo
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- CN109671750A CN109671750A CN201811525782.5A CN201811525782A CN109671750A CN 109671750 A CN109671750 A CN 109671750A CN 201811525782 A CN201811525782 A CN 201811525782A CN 109671750 A CN109671750 A CN 109671750A
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- 238000002360 preparation method Methods 0.000 title claims abstract description 42
- 229910010272 inorganic material Inorganic materials 0.000 claims abstract description 70
- 239000011147 inorganic material Substances 0.000 claims abstract description 70
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims abstract description 24
- 239000001301 oxygen Substances 0.000 claims abstract description 24
- 229910052760 oxygen Inorganic materials 0.000 claims abstract description 24
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 15
- 230000004888 barrier function Effects 0.000 claims abstract description 12
- 239000010410 layer Substances 0.000 claims description 131
- 239000000758 substrate Substances 0.000 claims description 40
- 239000012071 phase Substances 0.000 claims description 15
- 238000006243 chemical reaction Methods 0.000 claims description 14
- 239000007789 gas Substances 0.000 claims description 13
- 239000012044 organic layer Substances 0.000 claims description 11
- 238000001556 precipitation Methods 0.000 claims description 11
- 239000007790 solid phase Substances 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 8
- 239000000284 extract Substances 0.000 claims description 5
- 238000005538 encapsulation Methods 0.000 abstract description 7
- 238000000034 method Methods 0.000 abstract description 5
- 230000008569 process Effects 0.000 abstract description 4
- 238000005452 bending Methods 0.000 abstract description 3
- 238000010586 diagram Methods 0.000 description 14
- 238000009826 distribution Methods 0.000 description 7
- 230000000694 effects Effects 0.000 description 7
- 239000010408 film Substances 0.000 description 6
- 239000011368 organic material Substances 0.000 description 6
- 238000004806 packaging method and process Methods 0.000 description 6
- 230000008859 change Effects 0.000 description 5
- 238000000151 deposition Methods 0.000 description 4
- 230000008021 deposition Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 235000013399 edible fruits Nutrition 0.000 description 2
- 230000007704 transition Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 238000013268 sustained release Methods 0.000 description 1
- 239000012730 sustained-release form Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/126—Shielding, e.g. light-blocking means over the TFTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The embodiment of the invention provides a kind of display panel, the preparation method of display panel and Preparation equipments, solve flexible display apparatus encapsulation density of film it is excessively high be easy to lead to encapsulate inorganic fault rupture in the process of bending, the problem of service life of flexible display panels is reduced in the too low inside that oxygen and steam can be made to penetrate into flexible OLED display panel of encapsulation density of film.It include: the water oxygen barrier layer in encapsulating structure and the encapsulating structure, wherein the water oxygen barrier layer includes at least one layer of inorganic material layer；Wherein the inorganic material layer includes at least one high density area and at least one low density area, and the high density area and the low density area are distributed in distance.
Description
Technical field
The present invention relates to field of display technology, and in particular to the preparation method and preparation of a kind of display panel, display panel
Equipment.
Background technique
With the continuous development of display technology, flexible OLED (Organic Light-Emitting Diode, organic light emission
Diode) manufacturing technology of display panel also tends to be mature.PECVD (the Plasma of traditional flexible OLED display panel
Enhanced Chemical Vapor Deposition, chemical vapor deposition) generate Plasma (plasma) integrally arrive
Up to substrate, uniform film layer is generated.But in the TFE of flexible display panels (Thin-Film Encapsulation, film envelope
Dress) in, due to there is Stress match, it is easy in the process of bending, to cause TFE inorganic if encapsulation density of film is excessively high
The fracture of layer, so that packaging effect declines.But since flexible OLED display panel is very sensitive to oxygen and steam, such as
Fruit encapsulates that density of film is too low, and oxygen and steam can be made to penetrate into the inside of flexible OLED display panel, so as to cause such as stain,
The generation of a problem that pin hole, organic material chemical reaction, reduces the service life of flexible OLED display panel.
Summary of the invention
In view of this, the embodiment of the invention provides a kind of display panel, the preparation method of display panel and Preparation equipment,
Solve flexible display apparatus encapsulation density of film it is excessively high be easy cause to encapsulate inorganic fault rupture, encapsulating film in the process of bending
Reduce the service life of flexible display panels in the too low inside that oxygen and steam can be made to penetrate into flexible OLED display panel of layer density
The problem of.
A kind of display panel that one embodiment of the invention provides, including the water oxygen in encapsulating structure and the encapsulating structure
Barrier layer, wherein the water oxygen barrier layer includes at least one layer of inorganic material layer, wherein the inorganic material layer includes at least one
A high density area and at least one low density area, and the high density area and the low density area are distributed in distance.
In one embodiment, the inorganic material layer includes the multiple high density arranged in parallel along first direction
Area and multiple low density areas；
Wherein, on the direction perpendicular to the inorganic material layer, the first party of the adjacent inorganic material layer
Between mutually be in predetermined angular, and the predetermined angular be greater than zero and be less than etc. 90 degree.
In one embodiment, the predetermined angular is 90 degree or 60 degree or 45 degree or 30 degree.
In one embodiment, on the direction perpendicular to the inorganic material layer, the inorganic material of adjacent two
The high density area of an inorganic material layer in the bed of material corresponds to the low-density of another inorganic material layer
Area's setting.
In one embodiment, including at least one organic layer, wherein the organic layer is arranged two neighboring described
Between inorganic material layer.
In one embodiment, the density of the high density area and the density of the low density area are to be uniformly distributed；
Or
The density of the inorganic material layer is consecutive variations, wherein high two sides are low among the density of the high density area, institute
It is high for intermediate low two sides to state the density of low density area.
A kind of preparation method of flexibility organic display panel, the preparation including encapsulating structure characterized by comprising to
Substrate surface deposits gas phase inorganic material；And the substrate is divided into different regions, and corresponding extract is located at the base
The vapor inorganic material to be deposited above plate partial region, so that being formed by the inorganic material layer includes at least
One high density area and at least one low density area, and the high density area and the low density area are distributed in distance.
In one embodiment, the vapor inorganic material after chemical reaction of the substrate surface is formed by solid phase
The variable density region that inorganic material is constituted, wherein the preparation method further comprises:
The mobile substrate, wherein the moving distance of the substrate is the width in the variable density region.
A kind of Preparation equipment of flexibility organic display panel characterized by comprising bogey is configured to carrying base
Plate；Precipitation equipment is configured to deposit gas phase inorganic material to the substrate surface；And air extractor, it is set to the deposition
At least side of device is configured to extract the vapor inorganic material of the partial region of the substrate surface.
In one embodiment, the equipment further comprises driving device, and the driving device is configured to mobile institute
Bogey is stated, wherein the moving distance of the bogey is the width in the variable density region.
The preparation method and Preparation equipment of a kind of display panel provided in an embodiment of the present invention, display panel, including encapsulation
Water oxygen barrier layer in structure and the encapsulating structure, wherein the water oxygen barrier layer includes at least one layer of inorganic material layer,
Wherein the inorganic material layer includes at least one high density area and at least one low density area, and the high density area and described
Low density area is distributed in distance.During preparing inorganic layer, the density of inorganic layer, which is prepared into height, low, high density
Area can reduce oxygen and steam penetrates into, and effectively prevent display panel from stain, pin hole, organic material chemical reaction etc. occur no
Good situation improves the service life of display panel；Low density area has better flexibility, is not easily broken, improve inorganic layer intensity and
Packaging effect.
Detailed description of the invention
Fig. 1 show a kind of structural schematic diagram of inorganic layer of one embodiment of the invention offer.
Fig. 2 show a kind of structural schematic diagram of density transition zone of one embodiment of the invention offer.
Fig. 3 show the structural schematic diagram that a kind of multiple inorganic layers of one embodiment of the invention offer stack.
Fig. 4 show the structural schematic diagram that a kind of multiple inorganic layers of one embodiment of the invention offer stack.
Fig. 5 show a kind of schematic diagram of encapsulating structure of one embodiment of the invention offer.
Fig. 6 show a kind of flow chart of encapsulating structure preparation method of one embodiment of the invention offer.
Fig. 7 show a kind of flow chart of encapsulating structure preparation method of one embodiment of the invention offer.
Fig. 8 show a kind of structural schematic diagram of encapsulating structure Preparation equipment of one embodiment of the invention offer.
Fig. 9 show a kind of structural schematic diagram of encapsulating structure Preparation equipment of one embodiment of the invention offer.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that the described embodiment is only a part of the embodiment of the present invention, instead of all the embodiments.Based on this
Embodiment in invention, every other reality obtained by those of ordinary skill in the art without making creative efforts
Example is applied, shall fall within the protection scope of the present invention.
Fig. 1 show a kind of structural schematic diagram of inorganic layer of one embodiment of the invention offer.
As shown in Figure 1, display panel includes encapsulating structure, which includes inorganic layer, and wherein inorganic layer includes extremely
A few high density area 1 and at least one low density area 2.High density area 1 is the higher region of density in inorganic layer, low density area
2 be the lower region of density in inorganic layer, and wherein the density of high density area 1 is higher than the density of low density area 2.Preparing inorganic layer
During, by the density of inorganic layer be prepared into it is high have low, high density area 1 can reduce oxygen and steam penetrates into, effectively
Prevent display panel occur stain, pin hole, organic material chemical reaction a problem that, improve the service life of display panel；It is low
Density region 2 is not pliable, improves the intensity and packaging effect of inorganic layer.
It is appreciated that at least one of the embodiment can be one or more situations, according to specific package requirements
And design, the present invention to the particular number of high density area 1 and low density area 2 without limitation.It is further appreciated that high in the present invention
Density region and low density area are relative concepts, rather than concrete concept, and the specific value of high density area 1 and low density area 2 can basis
The demand of actual product and user and change, the present invention is not construed as limiting the specific density of high density area 1 and low density area 2.
In one embodiment of the invention, inorganic layer may include multiple high density areas 1 and multiple low density areas 2, multiple high density
Area 1 and multiple low density areas 2 are distributed in distance.High density area 1 and low density area 2 are alternatively arranged, can guarantee that inorganic layer exists
Existing high density area 1 has low density area 2 again on certain unit area, so that the high density area 1 and low density area 2 of inorganic layer divide
Cloth more uniformly, the case where part for preventing inorganic layer is high density area 1 entirely, and another part is low density area 2 entirely, will
High density area 1 and low density area 2 are alternatively arranged, and preferably improve the intensity and water resistant oxygen characteristic of inorganic layer.
It is appreciated that the width in the present embodiment middle-high density area 1 and the width of low density area 2 can carry out according to actual needs
Adjustment, the present invention are not construed as limiting the width of high density area 1 and low density area 2.
Fig. 2 show a kind of structural schematic diagram of density transition zone of one embodiment of the invention offer.
As shown in Fig. 2, inorganic layer includes at least one variable density region 3.When inorganic layer only includes a variable density
When region 3, the variable density of the inorganic layer and the variable density situation in variable density region 3 are identical；When inorganic layer includes multiple
When variable density region 3, wherein the variable density situation in each variable density region 3 is identical, therefore the inorganic layer is close
Degree variation is to repeat the variable density situation in variable density region 3, that is to say, that variable density region 3 is that a density becomes
Change unit, multiple variable density regions 3 collectively constitute inorganic layer, therefore the variable density of inorganic layer be it is regular, wherein each
The variable density in a variable density region 3 is a variable density period.
The variable density region 3 includes a high density area 1 and two low density areas 2 for being distributed in 1 two sides of high density area.
When inorganic layer only includes a variable density region 3, the centre of the inorganic layer is high density area 1, and two sides are low density area 2；
When inorganic layer includes multiple variable density regions 3, it be 1 two sides of high density area is low density area 2 which, which is multiple centres,
Variable density region 3 rearrange.The variable density region 3 can be made by a preparation process, repeat the preparation work
Skill can prepare multiple variable density regions 3, simplify preparation process, improve preparation efficiency.
It is appreciated that the multiple variable density region 3 can be put down when inorganic layer includes multiple variable density regions 3
Row arrangement, can also be staggered, the present invention is not construed as limiting the arrangement mode in variable density region 3.
It is further appreciated that variable density region 3 can be located at 1 two sides of high density area for a high density area 1 and distribution
Two low density areas 2, variable density region 3 can also be laid out in parallel a high density area 1 and a low density area 2, it is close
The specific variable density form of degree region of variation 3 can be adjusted according to specific product and customer demand, and the present invention is to density
The concrete form of the variable density of region of variation 3 is not construed as limiting.
In one embodiment of the invention, the density of high density area 1 and the density of low density area 2 can be various, such as: it is highly dense
Spend area 1 density can be equally distributed, the density of low density area 2 can be it is equally distributed, the density in high density area 1 can be
Identical, the density in low density area 2 can be identical.Alternatively, the density of the inorganic layer is consecutive variations, the period of change
Density for the variable density in a variable density region 3, high density area 1 can be consecutive variations, and the density of high density area 1 becomes
Changing situation can be lower again for density by low get higher；The density of low density area 2 can be consecutive variations, and the density of low density area 2 becomes
Change situation can be lower by height for density and be got higher again.The Density Distribution form of different high density areas 1 and different low density areas 2
Density Distribution form can satisfy different demands, so that product diversification.
It is appreciated that the Density Distribution form in the present embodiment middle-high density area 1 and the Density Distribution form of low density area 2 can
Changed with the demand according to actual product and user, is not only merely the density and low density area 2 for being confined to high density area 1
Density is to be uniformly distributed or the density of high density area 1 is low for intermediate high two sides, and the density of low density area 2 is centre low two
The high distribution mode in side, the present invention are not construed as limiting the specific distribution form of the density of high density area 1 and low density area 2.
Fig. 3 show the structural schematic diagram that a kind of multiple inorganic layers of one embodiment of the invention offer stack.
As shown in figure 3, the encapsulating structure includes multiple inorganic layers, plurality of inorganic layer stacks setting, each inorganic layer
It include multiple high density areas 1 and multiple low density areas 2.On the direction perpendicular to inorganic layer, in adjacent inorganic layer one
The low density area 2 of another corresponding inorganic layer of the high density area 1 of a inorganic layer.Perpendicular to the side of inorganic layer in the present embodiment
Upwards, the inorganic layer having in multiple inorganic layers is that the inorganic layer that high density area 1 has is low density area 2, ensure that existing high density
There is low density area 2 in area 1 again, so that the encapsulating structure can improve water oxygen obstructing capacity, bend resistance characteristic can be improved by having.
It is appreciated that when inorganic layer only there are two when, on the direction perpendicular to inorganic layer, the high density of an inorganic layer
The low density area 2 of another the corresponding inorganic layer of area 1.It is adjacent on the direction perpendicular to inorganic layer when inorganic layer is multiple
Two inorganic layers can also be with all high density areas 1 or low density area 2, but needs to guarantee in the direction perpendicular to inorganic layer
On, the part in multiple inorganic layers is that 1 part of high density area is low density area 2, and the present invention is to specifically perpendicular to inorganic layer
How the high density area 1 and low density area 2 of multiple inorganic layers on direction, which arrange, is not construed as limiting.
Fig. 4 show the structural schematic diagram that a kind of multiple inorganic layers of one embodiment of the invention offer stack.
As shown in figure 4, the encapsulating structure includes multiple inorganic layers, plurality of inorganic layer stacks setting, each inorganic layer
It include the multiple high density areas 1 and multiple low density area 2 arranged in parallel along first direction, wherein high density area 1 and low-density
Area 2 is in intermittent fashion, the extending direction that first direction can arrange for multiple high density areas 1 and multiple low density areas 2.It is adjacent
Inorganic layer in an inorganic layer first direction and another inorganic layer first direction be in predetermined angular.The structure makes
The height of projection and one of inorganic layer of the high density area 1 and low density area 2 of multiple inorganic layers on a wherein inorganic layer
Density region 1 and low density area 2 are distributed in grid type, and are evenly distributed, therefore the encapsulating structure is on perpendicular to inorganic layer direction
Not only it had contained high density area 1 but also had contained low density area 2, since high density area 1 can be improved encapsulating structure barrier water oxygen
Ability, low density area 2 can be improved the bend resistance characteristic of the encapsulating structure, therefore effectively raise encapsulating structure barrier water
The performance of oxygen and bend resistance.
It is appreciated that the angle of the fixation can be 90 degree.When predetermined angular is 90 degree, two adjacent inorganic layers
In an inorganic layer the projection and another inorganic layer on another inorganic layer of high density area 1 and low density area 2 height
Density region 1 and low density area 2 are distributed in rectangular mesh, so that multiple inorganic layers of the encapsulating structure are in the side perpendicular to inorganic layer
Upwards not only comprising high density area 1 but also comprising low density area 2, since high density area 1 can be improved encapsulating structure barrier water oxygen
Ability, low density area 2 can be improved the bend resistance characteristic of the encapsulating structure, therefore when predetermined angular is 90 degree, perpendicular to
Not only the ability of barrier water oxygen had been improved on the direction of inorganic layer but also improved bend resistance characteristic.But the predetermined angular can be according to reality
Product and user demand be adjusted, the present invention is not construed as limiting the specific value of predetermined angular.
Fig. 5 show a kind of schematic diagram of encapsulating structure of one embodiment of the invention offer.
As shown in figure 5, the encapsulating structure includes multiple inorganic layers, plurality of inorganic layer stacks setting, the encapsulating structure
It further include at least one organic layer 4, wherein the organic layer 4 is arranged between two adjacent inorganic layers.In the encapsulating structure
Middle setting organic layer 4, can be improved the buffer capacity of the encapsulating structure, plays the role of stress sustained release, improves display panel
Impact resistance.
It is appreciated that an organic layer 4 can be set between two adjacent inorganic layers, multiple organic layers also can be set
4, the quantity of the organic layer 4 between two adjacent inorganic layers can be adjusted according to the actual situation, and the present invention is to two phases
The particular number of organic layer 4 between adjacent inorganic layer is not construed as limiting.
Fig. 6 show a kind of flow chart of encapsulating structure preparation method of one embodiment of the invention offer.
As shown in fig. 6, the preparation method of the encapsulating structure includes:
Step 01: depositing gas phase inorganic material to substrate surface；
Step 02: the substrate being divided into different regions, and corresponding extract is located at the substrate portion overlying regions
The vapor inorganic material to be deposited so that be formed by the inorganic material layer include at least one high density area and
At least one low density area, and the high density area and the low density area are distributed in distance.
It is extracted the density in region since the density that vapor inorganic material is not extracted region is greater than, so that vapor inorganic
For material after substrate surface deposition, the settled density for not being extracted region is greater than the settled density for being extracted region, therefore gas
Phase inorganic material had not only included high density area 1 in the inorganic layer that substrate surface is formed but also had included low density area 2.High density area 1 can
It reduces oxygen and steam penetrates into, effectively prevent display panel from the bad feelings such as stain, pin hole, organic material chemical reaction occur
Condition improves the service life of display panel；Low density area 2 is not pliable, improves the intensity and packaging effect of inorganic layer.
This encapsulating structure preparation method provided by the present invention is extracted to be deposited to substrate by the way that air extractor is arranged
Vapor inorganic material on partial region, so that the unit bodies accumulated amount of substrate surface gas phase inorganic materials to be deposited becomes
Change, not only to be formed by inorganic layer in this way on substrate in the thickness difference of different zones, and can be formed by
Inorganic layer is different in the density of different zones；Especially by the pumping of the flow and air extractor of control gas phase inorganic materials
Amount can be adjusted preferably and be formed by inorganic layer on substrate in the changing value of different area thickness and density, to realize this
The effect of invention complex optimum inorganic layer consistency and toughness.
Fig. 7 show a kind of flow chart of encapsulating structure preparation method of one embodiment of the invention offer.
As shown in fig. 7, chemical reaction, which can occur, after vapor inorganic material arrival substrate forms solid phase inorganic materials, due to gas
The density that phase inorganic material is not extracted region is greater than the density for being extracted region, therefore is formed by solid phase inorganic materials phase
The settled density for not being extracted region answered, which is greater than, has been extracted the settled density in region, thus substrate surface include by solid phase without
The variable density region 3 that machine material is constituted.The preparation method of the encapsulating structure further includes step 03: moving substrate, the substrate
Moving distance is the width in variable density region 3.The after chemical reaction on substrate of vapor inorganic material is formed by solid phase inorganic
Behind the variable density region 3 that material is constituted, moving substrate carries out the preparation in next variable density region 3, repeats above-mentioned
Process completes all variable density regions 3 until preparation, and all variable density regions 3 form an inorganic layer, this is inorganic
The variable density of layer is that even variation is repeated as unit of a variable density region 3.Since vapor inorganic material is not taken out
The density in region is taken to be greater than the density for being extracted region, the variable density region 3 of formation being made of solid phase inorganic materials is wrapped
Include high density area 1 and low density area 2, therefore inorganic layer also includes at least one high density area 1 and at least one low density area 2,
High density area 1 can reduce oxygen and steam penetrates into, and effectively prevent display panel from stain, pin hole, organic material chemistry occur
A problem that reaction, improves the service life of display panel；Low density area 2 is not pliable, improves the intensity and encapsulation effect of inorganic layer
Fruit.
It is appreciated that the specific width in the variable density region 3 can be changed adjustment according to actual needs, the present invention
The specific width in variable density region 3 is not construed as limiting.
Fig. 8 show a kind of structural schematic diagram of encapsulating structure Preparation equipment of one embodiment of the invention offer.
As shown in figure 8, the packaging mechanism Preparation equipment includes bogey 003, precipitation equipment 002 and air extractor 001.
Bogey 003 is for carrying substrate to be packaged；The side of bogey 003 is arranged in precipitation equipment 002, is used for substrate table
Face deposits gas phase inorganic material.The two sides of precipitation equipment 002 are arranged in air extractor 001, to be deposited to substrate table for extracting
The vapor inorganic material of the partial region in face, so that the density for not being extracted the vapor inorganic material in region, which is greater than, has been extracted area
The density of the vapor inorganic material in domain.After air extractor 001 has extracted partial gas phase inorganic material, vapor inorganic material it is close
Degree becomes different, therefore the density that inorganic layer is formed by after being deposited on substrate is not also identical, so that inorganic layer both includes height
Density region 1 includes again low density area 2, so that encapsulating structure can obstruct water oxygen but also have good bend resistance characteristic.
It is appreciated that air extractor 001 can be one, while being extracted in the different zones of vapor inorganic material；It takes out
Device of air 001 or multiple, the different zones for being distributed in vapor inorganic material are extracted.The present invention is to air extractor
001 quantity is not construed as limiting.It is further appreciated that the amount and gas phase inorganic material of the vapor inorganic material that air extractor 001 extracts
The region for needing to extract can be modified according to actual needs, the vapor inorganic material that the present invention extracts air extractor 001
Amount and gas phase inorganic material need the region extracted to be not construed as limiting.
Fig. 9 show a kind of structural schematic diagram of encapsulating structure Preparation equipment of one embodiment of the invention offer.
As shown in figure 9, vapor inorganic material reach substrate surface after, substrate surface occur chemical reaction generate solid phase without
Machine material is not extracted the density in region since the density of vapor inorganic material extracting region is less than, the solid phase formed without
The density of machine material is different, and solid phase inorganic materials constitute a variable density region 3.The encapsulating structure Preparation equipment further includes driving
Dynamic device 004, is configured to moving bearing device 003, after completing primary chemical reaction, needs bogey 003 mobile one
Set a distance, which is the width in variable density region 3, so that precipitation equipment 002 is directed at substrate again and chemistry does not occur
The region of reaction, deposition prepares next variable density region 3 again, repeatedly until all variable densities are completed in preparation
Region 3, all variable density region 3 form an inorganic layer, therefore the inorganic layer includes at least one high density area 1 and at least
One low density area 2, high density area 1 can reduce oxygen and steam penetrates into, and effectively prevent display panel from stain, needle occur
A problem that hole, organic material chemical reaction, improve the service life of display panel；Low density area 2 is not pliable, improves inorganic layer
Intensity and packaging effect.
It is appreciated that driving device 004 drives the movement that can drive bogey 003, precipitation equipment can also be driven
002 movement, or drive bogey 003 and precipitation equipment 002 jointly mobile simultaneously, as long as guaranteeing bogey 003 and sinking
Accumulate the width that the mobile relative position of device 002 is variable density region 3, and the vapor inorganic material that precipitation equipment 002 issues
Chemical reaction region does not occur in substrate surface and is deposited for material, and to driving device 004, specifically driving carries dress to the present invention
Setting 003 movement still drives the movement of precipitation equipment 002 to be not construed as limiting.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all in essence of the invention
Within mind and principle, made any modification, equivalent replacement etc. be should all be included in the protection scope of the present invention.
Claims (10)
1. a kind of flexibility organic display panel, including the water oxygen barrier layer in encapsulating structure and the encapsulating structure, feature
It is, the water oxygen barrier layer includes at least one layer of inorganic material layer, wherein the inorganic material layer includes that at least one is highly dense
Area and at least one low density area are spent, and the high density area and the low density area are distributed in distance.
2. display panel according to claim 1, which is characterized in that the inorganic material layer includes parallel along first direction
The multiple high density areas and multiple low density areas of arrangement；
Wherein, on the direction perpendicular to the inorganic material layer, the first direction of the adjacent inorganic material layer it
Between mutually be in predetermined angular, and the predetermined angular be greater than zero and be less than etc. 90 degree.
3. display panel according to claim 2, which is characterized in that the predetermined angular be 90 degree or 60 degree or 45 degree or
30 degree.
4. display panel according to claim 1, which is characterized in that on the direction perpendicular to the inorganic material layer,
The high density area of an inorganic material layer in two adjacent inorganic material layers corresponds to another nothing
The low density area of machine material layer is arranged.
5. display panel according to claim 1 or 4, which is characterized in that including at least one organic layer, wherein described
Organic layer is arranged between the two neighboring inorganic material layer.
6. display panel according to claim 1 or 4, which is characterized in that the density of the high density area and described low close
The density for spending area is to be uniformly distributed；Or
The density of the inorganic material layer is consecutive variations, wherein high two sides are low among the density of the high density area, it is described low
The density of density region is that intermediate low two sides are high.
7. a kind of preparation method of flexibility organic display panel, the preparation including encapsulating structure characterized by comprising
Gas phase inorganic material is deposited to substrate surface；And
The substrate is divided into different regions, and corresponding extract is located to be deposited described of the substrate portion overlying regions
Vapor inorganic material, so that being formed by the inorganic material layer includes that at least one high density area is low at least one close
Area is spent, and the high density area and the low density area are distributed in distance.
8. preparation method according to claim 7, which is characterized in that the vapor inorganic material of the substrate surface passes through
It crosses chemical reaction and forms the variable density region being made of solid phase inorganic materials, wherein the preparation method further comprises:
The mobile substrate, wherein the moving distance of the substrate is the width in the variable density region.
9. a kind of Preparation equipment of flexibility organic display panel characterized by comprising
Bogey is configured to bearing substrate；
Precipitation equipment is configured to deposit gas phase inorganic material to the substrate surface；And
Air extractor is set at least side of the precipitation equipment, is configured to extract the portion of the substrate surface
The subregional vapor inorganic material.
10. equipment according to claim 9, which is characterized in that the equipment further comprises driving device, the driving
Device is configured to move the bogey, wherein the moving distance of the bogey is the width in the variable density region
Degree.
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