CN109508609A - Optical finger print recognizer component and electronic device - Google Patents
Optical finger print recognizer component and electronic device Download PDFInfo
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- CN109508609A CN109508609A CN201710853742.2A CN201710853742A CN109508609A CN 109508609 A CN109508609 A CN 109508609A CN 201710853742 A CN201710853742 A CN 201710853742A CN 109508609 A CN109508609 A CN 109508609A
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- finger print
- light
- optical finger
- fingerprint sensor
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- 230000003287 optical effect Effects 0.000 title claims abstract description 149
- 230000005611 electricity Effects 0.000 claims description 3
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- 238000001514 detection method Methods 0.000 description 4
- 230000006870 function Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 3
- 239000003292 glue Substances 0.000 description 3
- 230000008054 signal transmission Effects 0.000 description 3
- 230000032258 transport Effects 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 239000004568 cement Substances 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 230000035807 sensation Effects 0.000 description 2
- 241000208340 Araliaceae Species 0.000 description 1
- 235000005035 Panax pseudoginseng ssp. pseudoginseng Nutrition 0.000 description 1
- 235000003140 Panax quinquefolius Nutrition 0.000 description 1
- 238000012512 characterization method Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 235000008434 ginseng Nutrition 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
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Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1318—Sensors therefor using electro-optical elements or layers, e.g. electroluminescent sensing
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- Engineering & Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Multimedia (AREA)
- Theoretical Computer Science (AREA)
- Image Input (AREA)
- Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)
Abstract
The present invention discloses a kind of optical finger print recognizer component and electronic device.Optical finger print recognizer component includes cover board and the optical finger print being arranged in below cover board identification mould group.The lower surface of cover board is formed with ink layer, and ink layer includes fingerprint identification area, and fingerprint identification area includes vacancy section.Optical finger print identifies that mould group includes optical fingerprint sensor and light source, the lower section of vacancy section is arranged in optical fingerprint sensor, light source is configured to emit light into optical fingerprint sensor, optical fingerprint sensor is configured to for the light of light source transmitting being transmitted to the top of cover board through vacancy section, and receives through the reflected light in vacancy section.The optical finger print recognizer component and electronic device of above embodiment, since the light that light source is issued can be transmitted to above cover board by vacancy section, the light of more multiple light courcess is enabled to be transmitted to above cover board in this way, optical fingerprint sensor is set to receive from the reflected more light in vacancy section, so, the transmitance of light source light is high, and the effect of fingerprint recognition is good, and accuracy is high.
Description
Technical field
The present invention relates to technical field of biometric identification, more particularly, to a kind of optical finger print recognizer component and electronic device.
Background technique
In the related art, the function that optical finger print identification mould group realizes fingerprint recognition can be used in electronic device.Optics
The lower section of the cover board of electronic device is arranged in fingerprint recognition mould group.Therefore, it is hidden in below cover board in optical finger print identification mould group
When, cover board can stop the transmission of the light source light in optical finger print identification mould group, in this way, being easy to influence optical finger print identification mould in this way
The recognition imaging of group, the effect so as to cause optical finger print identification mould group fingerprint recognition are poor.
Summary of the invention
Embodiments of the present invention provide a kind of optical finger print recognizer component and electronic device.
A kind of optical finger print recognizer component of embodiment of the present invention includes:
Cover board, the lower surface of the cover board are formed with ink layer, and the ink layer includes fingerprint identification area, and the fingerprint is known
Other area includes vacancy section；
Optical finger print identification mould group below the cover board is set, and the optical finger print identification mould group includes optical finger print
The lower section of the vacancy section is arranged in sensor and light source, the optical fingerprint sensor, and the light source is configured to emit light
To the optical fingerprint sensor, the light that the optical fingerprint sensor is configured to emit the light source is through the vacancy section
It is transmitted to the top of the cover board, and is received through the reflected light in the vacancy section.
The optical finger print recognizer component of above embodiment, since the light that light source is issued can be transmitted to cover board by vacancy section
Top, so that the light of more multiple light courcess can be transmitted to above cover board, and optical fingerprint sensor is enable to receive from vacancy section
Reflected more light, in this way, the transmitance of light source light is high, the effect of fingerprint recognition is good, and accuracy is high.
In some embodiments, the ink layer is white ink layer.
In this way, white ink layer can cover the structure inside electronic device to achieve the effect that beautify electronic device.
In some embodiments, the lower section of the optical fingerprint sensor is arranged in the light source.
In this way, the light that light source can be enabled to emit in this way is transferred on optical fingerprint sensor.
In some embodiments, the optical finger print identification mould group includes lens, and the lens are configured to assist institute
The optical transport of light source transmitting is stated to the optical fingerprint sensor.
In this way, lens mirror can assemble the light of light source sending, then optical fingerprint sensor is transmitted light to, to enhance light
It learns the intensity for the electric signal that fingerprint sensor is obtained by photoelectric conversion and improves the signal-to-noise ratio of the electric signal obtained.
In some embodiments, the optical fingerprint sensor includes optical layer and is arranged in the optical layer lower surface
Photosensitive layer, the optical layer is formed with microlens array, and the optical layer is between vacancy section and the photosensitive layer.
In this way, optical layer can be gathered light in photosensitive layer by microlens array, to increase the intensity of light.
In some embodiments, the optical finger print identification mould group includes circuit board, and the circuit board connects the light
Feel the upper surface of layer.
In this way, after photosensitive layer detection obtains the corresponding electric signal of fingerprint, it can be by electric signal transmission to circuit board, circuit board
Processing electric signal is to establish the model of fingerprint.
In some embodiments, the photosensitive layer includes multiple light-sensitive elements and connection line, and the connection line connects
Connect the multiple light-sensitive element and the circuit board.
In this way, light-sensitive element can incude the light converged from optical layer and be converted to electric signal to collect finger print information.
In some embodiments, the circuit board includes processing chip, and the connection line connects the processing chip
With the light-sensitive element.
In this way, processing chip can handle the electric signal of optical fingerprint sensor to establish the model of user fingerprints.
In some embodiments, the optical finger print identification mould group includes frame, and the frame connects the optics and refers to
Line sensor and the circuit board, the light source are located in the frame.
In this way, more light that light source can in this way emitted pass through optical fingerprint sensor, while frame can stop
The interference of extraneous other light sources.
Embodiments of the present invention also provide a kind of electronic device, including the fingerprint recognition component.
The additional aspect and advantage of embodiments of the present invention will be set forth in part in the description, partially will be from following
Description in become obvious, or the practice of embodiment through the invention is recognized.
Detailed description of the invention
The above-mentioned and/or additional aspect and advantage of embodiments of the present invention are from combination following accompanying drawings to embodiment
It will be apparent and be readily appreciated that in description, in which:
Fig. 1 is the structural schematic diagram of the optical finger print recognizer component of embodiment of the present invention；
Fig. 2 is the floor map of the electronic device of embodiment of the present invention.
Main element symbol description:
Optical finger print recognizer component 100, cover board 10, ink layer 12, fingerprint identification area 122, vacancy section 1221, optical finger print
Identify mould group 20, optical fingerprint sensor 22, optical layer 221, photosensitive layer 223, light sensation area 2231, substrate 2233, light source 24, thoroughly
Mirror 26, circuit board 28, processing chip 282, frame 29, optical cement 21, display screen 30, electronic device 200.
Specific embodiment
Embodiments of the present invention are described below in detail, the example of the embodiment is shown in the accompanying drawings, wherein from beginning
Same or similar element or element with the same or similar functions are indicated to same or similar label eventually.Below by ginseng
The embodiment for examining attached drawing description is exemplary, and for explaining only the invention, and is not considered as limiting the invention.
In the description of the present invention, it is to be understood that, term " center ", " longitudinal direction ", " transverse direction ", " length ", " width ",
" thickness ", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outside", " up time
Needle ", instruction " counterclockwise " orientation or positional relationship be based on the orientation or positional relationship shown in the drawings, be merely for convenience of retouching
It states the present invention and simplifies description, rather than the device or element of indication or suggestion meaning must have a particular orientation, with specific
Orientation construction and operation, therefore be not considered as limiting the invention.In addition, term " first ", " second " are only used for retouching
Purpose is stated, relative importance is not understood to indicate or imply or implicitly indicates the quantity of indicated technical characteristic.By
This defines " first ", the feature of " second " can explicitly or implicitly include one or more feature.At this
In the description of invention, the meaning of " plurality " is two or more, unless otherwise specifically defined.
In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, term " installation ", " phase
Even ", " connection " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or be integrally connected；It can
To be mechanical connection, it is also possible to be electrically connected or can mutually communicate；It can be directly connected, it can also be by between intermediary
It connects connected, can be the connection inside two elements or the interaction relationship of two elements.For the ordinary skill of this field
For personnel, the specific meanings of the above terms in the present invention can be understood according to specific conditions.
In the present invention unless specifically defined or limited otherwise, fisrt feature second feature "upper" or "lower"
It may include that the first and second features directly contact, also may include that the first and second features are not direct contacts but pass through it
Between other characterisation contact.Moreover, fisrt feature includes the first spy above the second feature " above ", " above " and " above "
Sign is right above second feature and oblique upper, or is merely representative of first feature horizontal height higher than second feature.Fisrt feature exists
Second feature " under ", " lower section " and " following " include that fisrt feature is directly below and diagonally below the second feature, or is merely representative of
First feature horizontal height is less than second feature.
Following disclosure provides many different embodiments or example is used to realize different structure of the invention.In order to
Simplify disclosure of the invention, hereinafter the component of specific examples and setting are described.Certainly, they are merely examples, and
And it is not intended to limit the present invention.In addition, the present invention can in different examples repeat reference numerals and/or reference letter,
This repetition is for purposes of simplicity and clarity, itself not indicate between discussed various embodiments and/or setting
Relationship.In addition, the present invention provides various specific techniques and material example, but those of ordinary skill in the art can be with
Recognize the application of other techniques and/or the use of other materials.
Embodiment of the present invention provides a kind of optical finger print recognizer component 100 referring to FIG. 1-2,.Optical finger print identification group
Part 100 includes that cover board 10 and optical finger print identify mould group 20.The lower surface of cover board 10 is formed with ink layer 12.Ink layer 12 includes
Fingerprint identification area 122.Fingerprint identification area 122 includes vacancy section 1221.Optical finger print identification mould group 20 is arranged under cover board 10
Side.Optical finger print identifies that mould group 20 includes optical fingerprint sensor 22 and light source 24.Optical fingerprint sensor 22 is arranged in hollow out
The lower section in area 1221.Light source 24 is configured to emit light into optical fingerprint sensor 22.Optical fingerprint sensor 22 is configured to
Light that light source 24 emits is transmitted to the top of cover board 10 through vacancy section 1221, and is received reflected through vacancy section 1221
Light.
The fingerprint recognition component 100 of embodiment of the present invention can be applied to the electronic device 200 of embodiment of the present invention,
In other words, the electronic device 200 of embodiment of the present invention includes the optical identification fingerprint recognition component of embodiment of the present invention
100。
The optical finger print recognizer component 100 and electronic device 200 of above embodiment, since the light that light source 24 is issued can
The top of cover board 10 is transmitted to by vacancy section 1221, so that more the light of multiple light courcess 24 can be transmitted to the top of cover board 10,
22 device of optical sensing is set to receive from the reflected more light in vacancy section 1221, in this way, the transmitance of the light of light source 24 is high,
The effect of fingerprint recognition is good, and accuracy is high.
Specifically, the upper surface that finger is placed on cover board 10 is corresponding with fingerprint identification area 122 when carrying out fingerprint recognition
Position, the light that light source 24 emits is emitted on finger through vacancy section 1221, since the crestal line of finger print is contacted with cover board 10,
And valley line is separated with cover board 10, the light that the light of finger ridge line reflection and cover board 10 reflect forms intensity difference, in this way, by receive from
The reflected light in vacancy section 1221 can obtain fingerprint image signal.
More specifically, light is transmitted to lid from vacancy section 1221 after the light that light source 24 emits passes through optical fingerprint sensor 22
The upper surface of plate 10.When user's finger is fitted in fingerprint identification area 122, finger print reflection is emitted from 1221 side of vacancy section
Light forms reflected light, reflected light pass to optical fingerprint sensor 22, so that optical fingerprint sensor 22 can be according to detecting
Reflected light light intensity to acquire the finger print information of user.
It should be noted that when light passes through optical fingerprint sensor 22 for the first time, (light that light source 24 emits passes through optics
Fingerprint sensor 22), this time, which has not arrived, touches user's finger, does not have finger print information, therefore optical finger print passes at this time
The electric signal that 22 detection light of sensor obtains can pass through the algorithm removal transmission of optical fingerprint sensor 22 at this time without saving
Electric signal, for example, by judge optical fingerprint sensor 22 whether light source 24 shine after predetermined time in obtain electric signal,
If so, judging that light passes through optical fingerprint sensor 22 for the first time；If it is not, then judging that light passes through optical fingerprint sensor for the second time
22.When light passes through optical fingerprint sensor 22 for the second time (when light returns optical fingerprint sensor 22 from 10 lateral reflection of cover board), this
Time has finger print information, therefore it is subsequent to be used for retain the electric signal that 22 detection light of optical fingerprint sensor obtains at this time
Processing obtains the model of user fingerprints.
It is of course also possible to which the collected electric signal of optical fingerprint sensor 22 is carried out subtraction when subsequent processing electric signal
Processing removes the electric signal when light that light source 24 emits passes through optical fingerprint sensor 22 and retains the telecommunications with finger print information
Number.
It is appreciated that cmos sensor can be used in optical fingerprint sensor 22.
Cover board 10 can be glass cover-plate, and normally, cover board is transparent.The lower surface of cover board 10 is formed with ink layer 12 can
Be interpreted as cover board 10 lower surface spray ink layer 12, ink layer 12 can cover the structure inside electronic device 200 with
Achieve the effect that beautify electronic device 200.Preferably optical finger print identification mould group 20 can be arranged in electronic device 200 for cover board 10
In, help to keep electronic device 200 lightening.Optical finger print identification mould group 20 can be fitted in ink layer 12 by optical cement 21
Lower surface.
In some embodiments, vacancy section 1221 may include that circle, triangle, rectangle and the shapes such as rectangular are engraved certainly
Dead zone 1221 is not limited to above-mentioned embodiment, and can be designed as different shapes according to the actual needs.Light source 24
Light can pass through the outside that vacancy section 1221 reaches cover board 10.
In some embodiments, electronic device includes mobile phone, tablet computer, access control system etc..For example, electronic device
200 be mobile phone when, optical finger print recognizer component 100 can be used for the application scenarios such as mobile phone unlock, file encryption, payment verification.
In some embodiments, ink layer 12 is white ink layer.
In this way, white ink layer can cover the structure inside electronic device 200 to achieve the effect that beautify electronic device.
In some embodiments, the lower section of optical fingerprint sensor 22 is arranged in light source 24.
In this way, the light that light source 24 can be enabled to emit so is relatively easily transferred on optical fingerprint sensor 22.
Specifically, light source 24 can be point source of light, such as LED light source.
It is appreciated that light source 24 can be set in the underface of optical fingerprint sensor 22 or lower section side to the left or lower section
Side to the right.Certainly, the setting of the position of light source 24 is not limited in above-mentioned embodiment, and can be adjusted according to the actual needs
The position of whole light source 24.The light transmission path that light source 24 emits is joined shown in the straight arrows of Fig. 1.
Alternatively, it is also possible to the lower section of optical fingerprint sensor 22, light guide plate is set, and the side of light guide plate is arranged in light source 24
Face.The light that light source 24 emits can be equably incident to optical fingerprint sensor 22 by light guide plate.
In some embodiments, optical finger print identification mould group 20 includes lens 26.Lens 26 are configured to secondary light source
The optical transports of 24 transmittings are to optical fingerprint sensor 22.
In this way, lens 26 can assemble the light of the sending of light source 24, then optical fingerprint sensor 22 is transmitted light to, to increase
The intensity for the electric signal that strong optical fingerprint sensor 22 is obtained by photoelectric conversion and the signal-to-noise ratio for improving the electric signal obtained.
In some embodiments, optical finger print identification mould group 20 can also omit lens 26, and the light that light source 24 issues is direct
It is transmitted to optical fingerprint sensor 22.
In some embodiments, optical fingerprint sensor 22 includes optical layer 221 and is arranged in 221 lower surface of optical layer
Photosensitive layer 223.Optical layer 221 is formed with microlens array (not shown).Optical layer 221 is located at vacancy section 1221 and photosensitive layer
Between 223.
In this way, optical layer 242 can be gathered light in photosensitive layer 223 by microlens array, to increase the strong of light
Degree.
It is appreciated that optical layer 221 is mainly used for that photosensitive layer will be gathered from the reflected reflected light in vacancy section 1221
In 223.In some embodiments, optical finger print identification mould group 20 can also omit optical layer 221.
In some embodiments, it includes circuit board 28 that optical finger print, which identifies 20 groups of mould,.Circuit board 28 connects photosensitive layer 223
Upper surface.
In this way, after the detection of photosensitive layer 223 obtains the corresponding electric signal of fingerprint, can by electric signal transmission to circuit board 28,
Circuit board 28 handles electric signal to establish the model of fingerprint.
In some embodiments, circuit board 28 is flexible circuit board, and optical finger print identifies that mould group 20 includes flip chip,
Optical fingerprint sensor 22 can be connected by flip chip with flexible circuit board.
In this way, optical fingerprint sensor 22 can be attached by flip chip and flexible circuit board, to facilitate light
Learning fingerprint sensor 22 will test the electric signal transmission of acquisition to flexible circuit board.
It is appreciated that due to flexible circuit board flexible nature so that optical fingerprint sensor 22 be not easily accomplished with it is soft
Property circuit board connection, therefore can be using flip chip technology (chip on film, COF) by 22 He of optical fingerprint sensor
Flexible circuit board is attached.
In some embodiments, optical finger print identification mould group 20 includes connector, and flexible circuit board one end connects flip
Film, the other end connect connector, and flexible circuit board is connect by connector with outer member.
In this way, flexible circuit board can be attached by connector and outer member (such as mainboard of electronic device 200).
Specifically, connector includes the component that solder joint, connecting line, plug, socket etc. play connection function, and flexible circuit board is logical
Crossing connector may be implemented connection with outer member, such as flexible circuit board can pass through connector and realize and electronic device
Mainboard is attached.
In some embodiments, photosensitive layer 223 includes multiple light-sensitive element (not shown) and connection line (not shown).
Connection line connects multiple light-sensitive elements and circuit board 28.
In this way, light-sensitive element can incude the light converged from optical layer 126 and be converted to electric signal to collect fingerprint letter
Breath.
Specifically, multiple light-sensitive elements can convert optical signals into electric signal, when finger acts on fingerprint identification area 122
Upper surface when, optical layer 221 by the light reflected from vacancy section 1221 convergence be projected to photosensitive layer 223, multiple light-sensitive element senses
The light of finger print information should be had and be converted into electric signal, the finger print information that connection line will acquire is transferred to circuit board 28.Electricity
Other circuit connections of road plate 28 and electronic device 200, to make the function of the realization fingerprint recognition of electronic device 200.
Photosensitive layer 223 further includes substrate 2233, and light-sensitive element and connection line are located in substrate 2233.In some examples
In, substrate 2233 can be semiconductor base.Light-sensitive element and connection line can be formed in substrate 2233 by photoetching process.
Multiple light-sensitive elements can form the light sensation area 2231 (area active area, AA) of array, other regions are formed in substrate 2233
Non-inductive area (the non-area AA), non-inductive area is provided with connection line.Light-sensitive element is, for example, photodiode.
In some embodiments, circuit board 28 is formed with processing chip 282.Connection line connection processing 282 He of chip
Light-sensitive element.
In this way, processing chip 282 handles the electric signal of optical fingerprint sensor 22 to establish the model of user fingerprints.
Specifically, processing chip 282 may include reading circuit (Readout Integrated Circuit, ROIC) and place
It manages circuit (Central Processing Unit, CPU).ROIC can be by the electricity of the light-sensitive element of optical fingerprint sensor 22
Signal is read, meanwhile, CPU can control ROIC and read the electric signal of light-sensitive element, and electric signal is storable in CPU or circuit board
In the memory of setting.
In other examples, light shield layer, light source be may be provided between the substrate 2233 and each light-sensitive element of photosensitive layer 223
The incident rays of 24 transmittings are emitted to the outer of optical layer 26 and optical finger print recognizer component 100 through the gap between multiple light shield layers
Portion.In this way, processing chip 282 can handle the electric signal of light-sensitive element output directly to obtain the finger print information of finger.
In some embodiments, optical finger print identification mould group 20 includes frame 29.Frame 29 connects optical finger print sensing
Device 22 and circuit board 28.Light source 24 is located in frame 29.
In this way, more light that light source 24 can be made to be emitted pass through optical fingerprint sensor 22, while frame 29 can hinder
Keep off the interference of extraneous other light sources.
Specifically, the outer surface of frame 29 can coat one layer of black glue, and the settable reflecting layer of inner surface, in this way, frame
29 can preferably stop the transmitting optical transport for interfering while can increasing light source 24 of extraneous other light sources to optical finger print to sense
Device 22.In one example, frame 29 can be glue frame.In this way, glue frame can stop the interference of extraneous other light sources.
In some embodiments, electronic device 100 includes display screen 30, and display screen 30 is fitted in the following table of cover board 10
Face.It is appreciated that since user need to watch display screen 30 through cover board 10, so the region that cover board 10 is bonded with display screen 30 is not set
Set ink layer 12, that is to say, that ink layer 12 can form the ink layer of frame-shaped, and intermediate space fits to cover board for display screen 30
10 lower surface.
In one embodiment, display screen 30 can be touch display screen.
In the description of this specification, reference term " certain embodiments ", " embodiment ", " some embodiment party
The description of formula ", " exemplary embodiment ", " example ", " specific example " or " some examples " means to combine embodiment or show
Example particular features, structures, materials, or characteristics described are contained at least one embodiment or example of the invention.At this
In specification, schematic expression of the above terms are not necessarily referring to identical embodiment or example.Moreover, the tool of description
Body characteristics, structure, material or feature can be tied in an appropriate manner in any one or more embodiments or example
It closes.
In addition, term " first ", " second " are used for descriptive purposes only and cannot be understood as indicating or suggesting relative importance
Or implicitly indicate the quantity of indicated technical characteristic.Define " first " as a result, the feature of " second " can be expressed or
Implicitly include at least one feature.In the description of the present invention, the meaning of " plurality " is at least two, such as two, three,
Unless otherwise specifically defined.
Although the embodiments of the present invention has been shown and described above, it is to be understood that above-described embodiment is example
Property, it is not considered as limiting the invention, those skilled in the art within the scope of the invention can be to above-mentioned
Embodiment is changed, modifies, replacement and variant, and the scope of the present invention is defined by the claims and their equivalents.
Claims (10)
1. a kind of optical finger print recognizer component characterized by comprising
Cover board, the lower surface of the cover board are formed with ink layer, and the ink layer includes fingerprint identification area, the fingerprint identification area
Including vacancy section；
Optical finger print identification mould group below the cover board is set, and the optical finger print identification mould group includes optical finger print sensing
The lower section of the vacancy section is arranged in device and light source, the optical fingerprint sensor, and the light source is configured to emit light into institute
Optical fingerprint sensor is stated, the optical fingerprint sensor is configured to transmit the light that the light source emits through the vacancy section
The extremely top of the cover board, and receive through the reflected light in the vacancy section.
2. optical finger print recognizer component as described in claim 1, which is characterized in that the ink layer is white ink layer.
3. optical finger print recognizer component as described in claim 1, which is characterized in that the light source is arranged in the optical finger print
The lower section of sensor.
4. optical finger print recognizer component as described in claim 1, which is characterized in that the optical finger print identification mould group includes saturating
Mirror, the lens are configured to assist the optical transport of the light source transmitting to the optical fingerprint sensor.
5. optical finger print recognizer component as described in claim 1, which is characterized in that the optical fingerprint sensor includes optics
Layer and the photosensitive layer that the optical layer lower surface is arranged in, the optical layer are formed with microlens array, and the optical layer is located at
Between vacancy section and the photosensitive layer.
6. optical finger print recognizer component as claimed in claim 5, which is characterized in that the optical finger print identification mould group includes electricity
Road plate, the circuit board connect the upper surface of the photosensitive layer.
7. optical finger print recognizer component as claimed in claim 6, which is characterized in that the photosensitive layer includes multiple light-sensitive elements
And connection line, the connection line connect the multiple light-sensitive element and the circuit board.
8. optical finger print recognizer component as claimed in claim 7, which is characterized in that the circuit board includes processing chip, institute
It states connection line and connects the processing chip and the light-sensitive element.
9. optical finger print recognizer component as claimed in claim 6, which is characterized in that the optical finger print identification mould group includes frame
Frame, the frame connects the optical fingerprint sensor and the circuit board, the light source are located in the frame.
10. a kind of electronic device, which is characterized in that including optical finger print recognizer component described in any one of claim 1-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710853742.2A CN109508609A (en) | 2017-09-15 | 2017-09-15 | Optical finger print recognizer component and electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710853742.2A CN109508609A (en) | 2017-09-15 | 2017-09-15 | Optical finger print recognizer component and electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109508609A true CN109508609A (en) | 2019-03-22 |
Family
ID=65745232
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710853742.2A Withdrawn CN109508609A (en) | 2017-09-15 | 2017-09-15 | Optical finger print recognizer component and electronic device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109508609A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110210353A (en) * | 2019-05-23 | 2019-09-06 | 上海思立微电子科技有限公司 | Optical fingerprint identification device, electronic equipment, light compensation method and storage medium |
-
2017
- 2017-09-15 CN CN201710853742.2A patent/CN109508609A/en not_active Withdrawn
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110210353A (en) * | 2019-05-23 | 2019-09-06 | 上海思立微电子科技有限公司 | Optical fingerprint identification device, electronic equipment, light compensation method and storage medium |
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