CN106383549B - Electronic product - Google Patents
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- CN106383549B CN106383549B CN201510474482.9A CN201510474482A CN106383549B CN 106383549 B CN106383549 B CN 106383549B CN 201510474482 A CN201510474482 A CN 201510474482A CN 106383549 B CN106383549 B CN 106383549B
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- outer cover
- cover plate
- substrate
- circuit board
- printed circuit
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Abstract
A kind of electronic product, comprising: optical fingerprint sensor, the optical fingerprint sensor include pixel substrate, light guide plate and flexible printed circuit board, and the pixel substrate has pixel array；Outer cover plate, the outer cover plate have outer surface and inner surface, have the first blind hole on the outer surface, the first blind hole is opposite with pixel array upper surface；Pixel substrate includes flexible plate, and the pixel substrate includes fixed part and bending part；The fixed part is located at the light guide plate upper surface, and the bending part is located at outside the light guide plate side；The binding of the first part of the bending part and the flexible printed circuit board, the bending part are bent downward, until the first part of the flexible printed circuit board is separated from each other with the inner surface of the outer cover plate or zero active force contacts.The package assembly of optical fingerprint sensor is improved in the electronic product, and assembling difficulty reduces, and cost reduces.
Description
Technical field
The present invention relates to optical finger print identification field more particularly to a kind of electronic products.
Background technique
Fingerprint imaging identification technology is the fingerprint image that human body is collected by fingerprint sensor, then and in system
Existing fingerprint imaging information is compared, and whether carrying out correct judgment, and then realizes the technology of identification.The side used due to it
Just property and the uniqueness of somatic fingerprint, fingerprint identification technology have been widely used in every field.Such as public security bureau and customs
Etc. field of safety check, the access control system of building and the consumer product areas such as PC and mobile phone etc..The reality of fingerprint imaging technique
Existing mode has the multiple technologies such as optical imagery, capacitance imaging, ultrasonic imaging.Comparatively, optical image technology imaging effect phase
To preferable, equipment cost is relatively low.
Existing optical fingerprint sensor is usually by backlight, pixel substrate, the structure compositions such as cover sheet and shell.When adopting
When collecting fingerprint image, human body finger is placed on outermost protective layer cover board, and the emergent light of backlight can penetrate picture
In the contact interface of human body finger and cover sheet reflection and transmission occur for plain substrate and cover sheet, and the light of reflection is through guarantor
It on protecting cover plate, and is irradiated on the pixel array of pixel substrate, to carry out photoelectric conversion and signal processing, realizes fingerprint image
Acquisition.
However, existing electronic product is when assembling optical fingerprint sensor, in package assembly, there are still more deficiencies to need
It improves.
Summary of the invention
Problems solved by the invention is to provide a kind of electronic product, to improve optical fingerprint sensor in electronic product
Package assembly.
To solve the above problems, the present invention provides a kind of electronic product, comprising:
Optical fingerprint sensor, the optical fingerprint sensor include pixel substrate, light guide plate and flexible printed circuit board,
The pixel substrate has pixel array；
Outer cover plate, the outer cover plate have outer surface and inner surface, have the first blind hole on the outer surface, and described first
Blind hole is opposite with the pixel array upper surface；
The pixel substrate includes flexible plate, and the pixel substrate includes fixed part and bending part；
The fixed part is located at the light guide plate upper surface, and the bending part is located at outside the light guide plate side；
The binding of the first part of the bending part and the flexible printed circuit board, and the bending part is bent downward, until
The first part of the flexible printed circuit board is separated from each other with the inner surface of the outer cover plate or zero active force contacts.
Optionally, the thickness range of the pixel substrate is 20 μm~300 μm.
Optionally, the bending part and the light guide plate side and the flexible printed circuit board surround annular regions,
There is glue-line in the annular regions.
Optionally, the optical fingerprint sensor further includes that signal reads chip, and the signal reads chip and is fixed on institute
Bending part is stated, and signal reading chip is separated from each other with the inner surface of the outer cover plate or zero active force contacts.
Optionally, the second part of the flexible printed circuit board, which has been bent to, is at least partly attached to the light guide plate bottom
Portion, the signal read the second part that chip is fixed on the flexible printed circuit board.
Optionally, the outer cover plate includes the first substrate being pasted together and the second substrate, and the first substrate has
First through hole, first blind hole is by the first through hole and the second substrate surface composition.
Optionally, there is glue-line, by the glue-line by described first between the first substrate and the second substrate
Substrate and the second substrate bond together.
Optionally, there is glue-line, the pixel base between the pixel substrate upper surface and the inner surface of the outer cover plate
It is fit together between plate and the outer cover plate by the glue-line.
Optionally, the pixel substrate top layer is protective layer, and the pixel array is covered by the protective layer, the guarantor
Sheath is directly fitted with the glue-line.
Optionally, there are also filter layer between the pixel substrate and the outer cover plate, the filter layer is located at the pixel
Upper surface of base plate is located at the outer cover plate inner surface.
Compared with prior art, technical solution of the present invention has the advantage that
In technical solution of the present invention, there is the first blind hole, first blind hole and optics on the outer surface of outer cover plate
The pixel array upper surface of fingerprint sensor is opposite；There is the second blind hole in the inner surface of outer cover plate, second blind hole accommodates
In the optical fingerprint sensor at the top of the first part of flexible printed circuit board.At this point, optical fingerprint sensor does not need to protect
Protecting cover plate has saved the cost of the optical fingerprint sensor.
Meanwhile outer cover plate does not need setting through-hole, and corresponding first blind hole is only needed, so that the entire optics
It is isolated between fingerprint sensor and the external world by outer cover plate.First blind hole makes mobile terminal that there is better appearance to feel and use hand
Sense.
Simultaneously as the setting of the first blind hole, makes outer cover plate not need setting through-hole, so as to make the optical finger print
Sensor preferably avoids the influence by electrostatic, steam and air, improves the reliability of the optical fingerprint sensor.
Meanwhile first blind hole setting, make outer cover plate do not need setting through-hole so that the optical fingerprint sensor
It need not directly be contacted and press by finger, therefore, the hardness requirement of the optical fingerprint sensor outmost surface and scratch resistant
Wiping requires lower, further reduced the cost of the optical fingerprint sensor.
Meanwhile the first part of flexible printed circuit board is fixed on bending part upper surface, is turned under by bending part
Folding, so that the first part of flexible printed circuit board and the inner surface of outer cover plate are separated from each other, therefore, outer cover plate inner surface will not
Press by flexible printed circuit board first part acts on, i.e. the first part of flexible printed circuit board will not influence the picture
Plain substrate securing part divides being bonded for upper surface and outer cover plate inner surface, at this time pixel substrate fixed part upper surface and outer cover
Plate inner surface can fit closely not only simplifies the assembling mode of optical fingerprint sensor in the terminal together, mentions
The high reliability of optical fingerprint sensor, and keep the finger contact surface of outer cover plate small as far as possible to the distance of pixel array, with
Just guarantee good fingerprint imaging effect.
In summary, the package assembly of the electronic product is improved, and assembling difficulty reduces, and cost reduces.
Further, signal reads chip and is fixed on bending part upper surface, and signal reads the interior of chip and outer cover plate
Surface is separated from each other, at this point, the fixed part of the pixel substrate is not read core by signal with being bonded for the inner surface of outer cover plate
Any influence of piece, therefore can be further ensured that the thickness of entire electronic product is smaller.
Detailed description of the invention
Fig. 1 is a kind of existing mobile terminal front view；
Fig. 2 is the schematic diagram of the section structure that mobile terminal shown in Fig. 1 is obtained along A-A chain-dotted line cutting；
Fig. 3 is mobile terminal front view provided by first embodiment of the invention；
Fig. 4 is the schematic diagram of the section structure that mobile terminal shown in Fig. 3 is obtained along B-B chain-dotted line cutting；
Fig. 5 is the pixel array region and peripheral circuit region in Fig. 4 on pixel substrate；
Fig. 6 is the part-structure of pixel array region in Fig. 5；
Fig. 7 is mobile terminal front view provided by second embodiment of the invention；
Fig. 8 is the schematic diagram of the section structure that mobile terminal shown in Fig. 7 is obtained along C-C chain-dotted line cutting；
Fig. 9 is mobile terminal front view provided by third embodiment of the invention；
Figure 10 is the schematic diagram of the section structure that mobile terminal shown in Fig. 9 is obtained along D-D chain-dotted line cutting.
Specific embodiment
Fig. 1 and Fig. 2 are please referred to, Fig. 1 shows a kind of existing mobile terminal front view, and Fig. 2 shows mobile whole shown in Fig. 1
Hold the schematic diagram of the section structure obtained along A-A chain-dotted line cutting.The mobile terminal includes outer cover plate 10 and screen 11, and institute
Stating mobile terminal further includes optical fingerprint sensor 12.Wherein optical fingerprint sensor 12 fits snugly in 10 surface of outer cover plate
In one through-hole (through-hole is not shown individually, please refers to Fig. 2).It is shown in mobile terminal in Fig. 2, the optical fingerprint sensor packet
Cover sheet 13, pixel substrate 14 and light guide plate 15 from top to bottom is included, the optical fingerprint sensor further includes being located at pixel
The signal of 14 upper surface of substrate reads chip 16, light source 17 and flexible printed circuit board 18 in light guide plate 15.Wherein
Light source 17 is generally LED light, and is welded on flexible printed circuit board 18.Flexible printed circuit board 18 has one before bending
Divide and be bundled in 14 upper surface of pixel substrate, some is attached to 15 bottom of light guide plate after passing through bending, while light source 17 is embedding
Enter into light guide plate 15.Cover sheet 13 is embedded in above-mentioned through-hole, to guarantee that 13 upper surface of cover sheet can directly receive
The contact (usually also referred to as pressing) of finger.
However, cover sheet 13 needs to be fixed on the upper surface of pixel substrate 14 by glue due in existing mobile terminal,
Therefore it will lead to entire 12 complex process of optical fingerprint sensor, it is at high cost.
Optical fingerprint sensor 12 needs to assemble in the terminal by the through-hole on 10 surface of outer cover plate, 10 table of outer cover plate
The through-hole in face will lead to extraneous steam, electrostatic or air and adversely affect to optical fingerprint sensor 12, reduce optics
The reliability of fingerprint sensor.
13 upper surface of cover sheet directly receives the pressing of finger, when finger directly presses cover sheet 13, entire optics
The depressed power of fingerprint sensor, therefore, region of the optical fingerprint sensor in addition to cover sheet 13 be also required to through glue or
Person steps up structure, to be fixedly secured the inner surface in outer cover plate 10.Meanwhile cover sheet 13 is before guaranteeing fingerprint image effect
It puts, needs preferable surface hardness, to prevent surface to be scratched damage.
The above problem can greatly increase corresponding cost and assembling difficulty, and reduce the reliable of optical fingerprint sensor
Property.
To solve the above problems, the electronic product is in the outer of outer cover plate the present invention provides a kind of new electronic product
There is the first blind hole, first blind hole is opposite with the pixel array upper surface of optical fingerprint sensor on surface.First blind hole
Not only make mobile terminal that there is better appearance to feel and use feel, while the optical fingerprint sensor can be made preferably
The influence by electrostatic, steam and air is avoided, the reliability of the optical fingerprint sensor is improved.
In addition, the first part of flexible printed circuit board is fixed on bending part upper surface, it is turned under by bending part
Folding, so that the first part of flexible printed circuit board and the inner surface of outer cover plate are separated from each other, therefore, outer cover plate inner surface will not
Press by flexible printed circuit board first part acts on, i.e. the first part of flexible printed circuit board will not influence the picture
Plain substrate securing part divides being bonded for upper surface and outer cover plate inner surface, at this time pixel substrate fixed part upper surface and outer cover
Plate inner surface can fit closely makes the finger contact surface of outer cover plate small as far as possible to the distance of pixel array together, to protect
Demonstrate,prove good imaging effect.
To make the above purposes, features and advantages of the invention more obvious and understandable, with reference to the accompanying drawing to the present invention
Specific embodiment be described in detail.
First embodiment of the invention provides a kind of electronic product, and the electronic product is specially a kind of mobile terminal.It needs
Illustrate, in other embodiments, the electronic product can also be tablet computer, e-book or personal digital assistant etc..
Incorporated by reference to reference Fig. 3 and Fig. 4, Fig. 3 shows mobile terminal front view provided by the present embodiment, and Fig. 4 is shown
The schematic diagram of the section structure that mobile terminal shown in Fig. 3 is obtained along B-B chain-dotted line cutting.
It can be seen in figure 3 that mobile terminal 100 includes outer cover plate 110 and screen 101, there is blind hole on outer cover plate 110
111.With reference to Fig. 4 it is found that blind hole 111 is located at the outer surface (not marking) of outer cover plate 110.It may further see from Fig. 4, move
Dynamic terminal 100 further includes optical fingerprint sensor, and the optical fingerprint sensor includes pixel substrate (not marking), light guide plate
122, signal reads chip 123, light source 124 and flexible printed circuit board (not marking).Pixel substrate includes that flexible plate (is not marked
Note, incorporated by reference to reference to figure), since the pixel substrate includes the flexible plate, the entire pixel substrate is entirely in
Existing flexibility.The pixel substrate includes fixed part 1211 and bending part 1212, it is seen then that fixed part 1211 and bending part
1212 using the flexible plate as support construction.Fixed part 1211 is located at 122 upper surface of light guide plate, and bending part 1212 is located at
Outside 122 side of light guide plate, specific bending part 1212 is suspended on outside 122 side of light guide plate.Bending part 1212 and flexibility
The first part 1251 of printed circuit board binds, i.e., the first part 1251 of the described pixel substrate and the flexible printed circuit board
Binding.The binding can be realized by anisotropic conductive film (Anisotropic Conductive Film, ACF) and is electrically connected
It connects and is mechanically fixed.Also, bending part 1212 is bent downward, until the first part 1251 of flexible printed circuit board and outer cover
The inner surface of plate 110 is separated from each other.
It is therefore, described using the pixel substrate with flexible plate in mobile terminal 100 provided in this embodiment
Pixel substrate can be bent.The bending part 1212 of the pixel substrate is bent downward, until being bundled on bending part 1212
The flexible printed circuit board first part 1251 on surface and the inner surface of outer cover plate 110 are separated from each other.And work as flexible print circuit
When the first part 1251 of plate and the inner surface of outer cover plate 110 are separated from each other, the upper surface of the pixel substrate can be with outer cover
The inner surface of plate 110 fits closely makes the finger contact surface of outer cover plate 110 small as far as possible to the distance of pixel array together, with
Just guarantee good imaging effect.
With continued reference to FIG. 4, signal reads fixed (this is fixed also as the binding) table on the pixel substrate of chip 123
Face.Specifically, signal, which reads chip 123, is fixed on 1212 upper surface of bending part, and signal reads chip 123 and outer cover plate
110 inner surface is separated from each other, i.e., signal, which is read, has gap between chip 123 and the inner surface of outer cover plate 110.When signal is read
When the inner surface of chip 123 and outer cover plate 110 is separated from each other out, the fixed part 1211 and outer cover plate 110 of the pixel substrate
The fitting of inner surface any influence of chip 123 is not read by signal, therefore the finger contact surface of outer cover plate 110 can be made to arrive
The distance of pixel array is small as far as possible, to guarantee good imaging effect.
In the present embodiment, the pixel substrate has pixel array, and the pixel array is located at consolidating for the pixel substrate
Determine on part 1211.The outer surface of outer cover plate 110 is the one side of outer cover plate 110 upward in Fig. 4, and the inner surface of outer cover plate 110 is
The one side opposite with the optical fingerprint sensor of outer cover plate 110 in Fig. 4.Blind hole 111 is located at the outer surface, and blind hole
111 is opposite with the pixel array upper surface.Blind hole 111 is opposite with the pixel array upper surface, ensure that the optics refers to
Line sensor can be acquired finger print by blind hole 111, i.e., subsequent finger directly contacts 111 bottom surface of blind hole, i.e.,
111 bottom surface of blind hole is the finger contact surface of outer cover plate 110.
It should be noted that blind hole 111 is opposite with the pixel array upper surface, it can refer to the overwhelming majority pixel battle array
Pixel in column and 111 face of blind hole, but have least a portion of pixel not with 111 face of blind hole, these not faces
Pixel can be the pixel positioned at the pixel array periphery or corner location.Certainly, in blind hole 111 and the pixel array
Surface is opposite, may also mean that pixel and 111 face of blind hole in all pixel arrays.
It should be noted that in other embodiments, after bending part 1212 is bent downward, the first of flexible printed circuit board
The inner surface of part and outer cover plate can also be not separated, but zero active force contacts, although contacting between the two, does not have
Active force, in this case, the first part of flexible printed circuit board equally will not influence the fitting of outer cover plate and pixel substrate,
To keep the finger contact surface of outer cover plate 110 small as far as possible to the distance of pixel array, to guarantee good imaging effect.
It should be noted that in other embodiments, after signal, which reads chip, is fixed on the pixel substrate upper surface, letter
Number reading chip is also possible to zero active force with the inner surface of outer cover plate and contacts, and reason is the same reason as above.
It should be noted that the angle of the bending of the pixel substrate bending part 1212 may not necessarily be too big, as long as energy
The first part 1251 of signal reading chip 123 and flexible printed circuit board is enough set not contact the inner surface of outer cover plate, Huo Zhexin
The inner surface of 1,251 0 active force of the first part contact outer cover plate of chip 123 and flexible printed circuit board number is read, or
Person says that signal reads the first part of chip and flexible printed circuit board and will not push up outer cover plate and (can push up and represent the two
Between have active force), specific bending angle can be such as 30 °.But in other embodiments, the bending of the pixel substrate
Part 1212 can also be bent with 90 °, to be placed directly against the side wall of light guide plate.
With continued reference to FIG. 4, in the present embodiment, since 1212 bending angle of bending part of the pixel substrate is smaller
(such as 30 °), therefore, bending part 1212 and 122 side of light guide plate and flexible printed circuit board of the pixel substrate surround
Annular regions 120.In order to fix the bending effect of bending part 1212, glue can be filled in annular regions 120, to be formed
Glue-line (not shown), the glue-line can be such that the bending state of bending part 1212 is reinforced at this time.
It should be noted that fixed part 1211 and bending part 1212 are a kind of artificial defined division modes, such as
In the present embodiment, they are distinguish with short dash line section in Fig. 4, but pixel substrate each section is in fact connected as one
's.In other embodiments, other model splits also be can specify that.
It should be noted that mobile terminal 100 can be other patterns, such as the size of screen 101 in other embodiments
It can be adjusted with shape, the size and shape of outer cover plate 110 can also be adjusted.It should be noted that blind hole refers to
The hole of not break-through, it is also assumed that being groove.
With continued reference to FIG. 4, the first part 1251 of flexible printed circuit board is bundled in the pixel base in the present embodiment
Plate upper surface is specially bundled in the bending part 1212 of the pixel substrate.The second part 1252 of flexible printed circuit board
It has been bent to and has at least partly been attached to 122 bottom of light guide plate, the second part 1252 of flexible printed circuit board and light guide plate 122
It can be with glue or adhered by double sided plaster together, to prevent the second part 1252 of flexible printed circuit board and lead between bottom
Tabula rasa 122 mutually diverges to.Second part 1252 has part for surrounding above-mentioned annular regions 120, and there are also portions for second part 1252
Divide and be neither bonded with 122 bottom of light guide plate, is not also located at annular regions 120, and it is left to be an exposure to light guide plate 122 shown in Fig. 4
Side-lower.
It should be noted that the first part 1251 of flexible printed circuit board and second part 1252 are a kind of artificial regulations
Division mode, they are distinguish with short dash line section in the corresponding Fig. 4 of the present embodiment.But first part 1251 and second
Dividing 1252 is to be connected as one.It should be noted that in other embodiments, in addition to the first part 1251 of flexible printed circuit board
It is bundled in the pixel substrate upper surface, the position of the other parts of flexible printed circuit board can be reset.
In the present embodiment, the material of the flexible plate can be organic material, such as be specifically as follows plastics, the modeling
Material can be polyimides (Polyimide, PI) or polyethylene terephthalate (polyethylene
Terephthalate, PET).
In other embodiments, the material of the flexible plate can be thin glass, very thin or relatively thin glass (such as it is thick
Degree other glass in the micron-scale) certain flexibility is also had, certain bending may be implemented, after bending, if it is desired, can be with
The bending state of thin glass is fixed using glue or other way, with guarantee the first part of flexible printed circuit board with
The inner surface of outer cover plate is separated from each other or the contact of zero active force, and can guarantee that signal reads chip and is fixed on the picture simultaneously
After plain upper surface of base plate, signal reading chip is separated with the inner surface of outer cover plate or zero active force contacts.
In the present embodiment, the thickness range of the pixel substrate can be 20 μm~300 μm.If the pixel substrate
Thickness is less than 20 μm, and the mechanical strength of the pixel substrate is poor at this time, and integral telescopic is too big, is easy to cause the pixel base
Thin-film device circuit fracture on plate.If the thickness of the pixel substrate is greater than 300 μm, entirely the pixel substrate is soft
Property is poor, is unfavorable for bending accordingly.
In the present embodiment, the material of outer cover plate 110 need to only meet can be through visible light and close in 111 corresponding position of blind hole
Infrared light, therefore, the material of outer cover plate 110 can be strengthened glass (tempered glass), sapphire or plastics etc..
In the present embodiment, corresponding cover sheet is omitted in the optical fingerprint sensor.At this point, 111 bottom pair of blind hole
The residual thickness for answering outer cover plate 110 can be 0.1mm~0.5mm.That is, to make optical fingerprint sensor closer to for fingerprint
111 bottom of blind hole of contact, to improve the picture quality of optical fingerprint sensor acquisition, outer cover plate 110 corresponds to blind hole
The thickness of 111 bottoms can take into account the fingerprint of the optical fingerprint sensor in this thickness range for 0.1mm~0.5mm
The mechanical strength of imaging effect and outer cover plate 110.
In the present embodiment, blind hole 111 faces shape as circle.In other embodiments, blind hole 111 face shape in addition to
It can also be other shapes, such as rectangle, ellipse or chamfering rectangle etc. for circle as shown in Figure 3.
With continued reference to FIG. 4, having glue-line 131, institute between the pixel substrate upper surface and the inner surface of outer cover plate 110
It states and is fit together between pixel substrate and outer cover plate 110 by glue-line 131.
The present embodiment is fitted closely the pixel substrate upper surface and the inner surface of outer cover plate 110 by glue-line 131, glue
Layer 131, which can be, any non-fully inhales visible and near infrared light light-sensitive emulsion, pressure sensitive adhesive or hot-setting adhesive.
With continued reference to FIG. 4, there are also filter layer 132 between the pixel substrate and outer cover plate 110, filter layer 132 is located at
The pixel substrate upper surface.In the present embodiment, filter layer 132 can be used for improving the light seen outside mobile terminal
Fingerprint sensor appearance color is learned, and filter layer 132 can also play corresponding filter action.
In the present embodiment, filter layer 132 and the blind hole 111 are opposite.Filter layer 132 can be interference reflecting layer either
Ink layer.In order to ensure optical fingerprint sensor institute is at fingerprint image effect, in the present embodiment, glue-line 131 and filter are controlled
The overall thickness of photosphere 132 is within 0.2mm.
In the present embodiment, when filter layer 132 is ink layer, it can be made of screen printing method.The purpose of ink layer is
Meet corresponding appearance color demand, therefore ink layer can be white, black or gold etc..But ink layer needs simultaneously
There is certain translucency, for example ink layer needs the transmitance to white light or near infrared light to reach between 1%~50%, and
And the thickness of ink layer can not be too thick, to prevent the influence to bonding structure, the thickness of specific ink layer can be 2 μm~20
Between μm.
It should be noted that the position of filter layer and glue-line can be exchanged, it may be assumed that glue-line is produced on institute in other embodiments
The upper surface of pixel substrate is stated, and filter layer is produced on 110 inner surface of outer cover plate (position of corresponding blind hole 111).
With continued reference to FIG. 4, light source 124 can be LED light in the present embodiment.Also, LED light can be pasted by surface
Dress technology (Surface Mount Technology, SMT) is welded on the second part 1252 of flexible printed circuit board, and
And it is open texture that light guide plate 122, which can be set, in the region for corresponding to light source 124, so that light source 124 be blocked in assembling
In the vacancy for entering light guide plate 122,124 structure of light source shown in Fig. 3 is formed.The light that light source 124 issues is by light guide plate 122
After leaded light effect, the light for forming area source enters the back side of the pixel substrate, also, before having due to the pixel substrate
Transparent region described in face, therefore, the light of area source can pass through the pixel substrate and further to tables in blind hole 111
Face, at this point, corresponding fingerprint reflection light can reversely reach institute if 111 upper surface of blind hole is touched by the finger or presses
The front of pixel substrate is stated, and is received by the pixel array on the pixel substrate, and realizes that corresponding finger print information is collected.
Although not shown in the drawing in the present embodiment, it can be by adhesive tape, adhesive tape, adhesive plaster or rubber etc., it will the entire optics
Fingerprint sensor (mould group) is sealed on 110 inside (inner surface) of outer cover plate, to play to the optical fingerprint sensor
Fixed and interception, interception are to prevent other light from described in the optical fingerprint sensor side or back side entrance
Optical fingerprint sensor.The adhesive tape, adhesive tape, adhesive plaster or rubber glue material part can be light-sensitive emulsion, pressure sensitive adhesive or thermosetting
Glue.
In mobile terminal provided by the present embodiment, optical fingerprint sensor does not need cover sheet, i.e. the present embodiment institute
In the mobile terminal of offer, cover sheet is omitted in the optical fingerprint sensor.Therefore, the optical finger print has not only been saved
The cost of sensor, and reduce the thickness of the optical fingerprint sensor.
Although not shown in the drawing the pixel substrate can have multilayered structure in the present embodiment, in addition to the flexible bottom
Plate can also include the structures such as pixel array region (not shown) and protective layer (not shown).
Referring to FIG. 5, showing pixel array region 1210 and the peripheral circuit region on pixel substrate described in Fig. 4.Periphery
Circuit region includes driving circuit 126, and signal reads the first part 1251 of chip 123 and flexible printed circuit board.The pixel
Substrate can play reception to optical signalling, conversion and temporary.The peripheral circuit region further includes the flexible print circuit
Plate binds area 1250, and pixel array region 1210, signal are read between chip 123 and the first part 1251 of flexible printed circuit board
Connecting line (each connecting line is not drawn into Fig. 3, each connecting line include pixel array region 1210 arrive driving circuit 126 connection
Line, pixel array region 1210 to signal read the connecting line that chip 123 binds area, and signal reads chip 123 and binds area to flexibility
Printed circuit board binds the connecting line in area 1250 and driving circuit 126 arrives the connecting line that flexible printed circuit board binds area).
In the optical fingerprint sensor, signal reads chip 123 and the flexible printed circuit board binding setting of area 1250 exists
The same side of pixel array region 1210, the right side of pixel array region 1210 is arranged in they.It should be noted that other embodiments
In, signal, which reads chip 123 and flexible printed circuit board binding area 1250, can also be located at the not ipsilateral of pixel array region 1210.
Fig. 6 shows the part-structure of pixel array region 1210 in Fig. 5.It include above-mentioned pixel battle array in pixel array region 1210
Column, the pixel array may include multiple pixels (not marking) in ranks shape array arrangement, row where the pixel and
Column are limited by the driving line 1213 and a plurality of second axial data line 1214 of a plurality of first axis.Each pixel includes
Signal-controlled switch 1215 and photoelectric conversion unit 1216, and the pixel further includes transparent region (not marking), it is described
Area pellucida domain can pass through light, and the light that light source 124 issues can pass through the optical fingerprint sensor via the transparent region.
That is, in entire pixel array region 1210, in addition to driving line 1213, data line 1214, Signal-controlled switch 1215 and light
Other than electrotransformation unit 1216, other regions are transparent region (or transmission region), and the transparent region is for making light source 124
Emergent light can penetrate the optical fingerprint sensor.
In the present embodiment, the pixel array can use amorphous silicon film transistor (amorphous Silicon
Thin Film Transistor, a-Si TFT) technique, low-temperature polysilicon film transistor (Low Temperature Poly
Silicon Thin Film Transistor, LTPS TFT) technique or oxide semiconductor thin-film transistor (Oxide
Semiconductor Thin Film Transistor, OS TFT) the semiconductor process techniques production such as technique.
In the present embodiment, Signal-controlled switch 1213 is used to control the reading line by line of optical signalling, photoelectric conversion unit
1216 are used for the receiving of optical signalling, convert and keep in.Driving line 1213 is connected to driving circuit 126, is controlled by driving circuit 126
The unlatching line by line of pixel in pixel array region 1210 processed.Data line 1214 is connected to the binding area that signal reads chip 123, will
Each column picture element signal is input to signal and reads chip 123, and reads the amplification and analog-to-digital conversion that chip 123 completes signal by signal
(Analog Digital Converter, ADC).The input signal and output signal and signal of signal reading chip 123 are read
The power supply of chip 123 is connected to flexible printed circuit board by the corresponding connecting line of the optical fingerprint sensor and binds area out
1250, flexible printed circuit board, which is used to read chip 123 for signal, provides corresponding input information and output signal, and is supplied
Electricity, flexible printed circuit board are also used to the input signal of driving circuit 126 and for being electrically connected in respective external circuit system.
Though the pixel substrate top layer can be above-mentioned protective layer, described at this time it should be noted that being not shown in figure
Pixel array can be covered by the protective layer, and the protective layer is directly fitted with above-mentioned glue-line 131 at this time, thus by institute
Pixel substrate is stated to fit together with outer cover plate 110.The material of the protective layer can be amorphous silicon nitride film, can also
To be amorphous silicon oxide film, and they can using plasma enhancing chemical vapour deposition technique (Plasma
Enhanced Chemical Vapor Deposition, PECVD) growth, the thickness of the protective layer can be 0.1 μm~2 μ
m.Due to protecting with the protective layer to the pixel array, the pixel substrate upper surface can directly make optical filtering
Layer or the inner surface directly with outer cover plate 110 are pasted.
In mobile terminal provided by the present embodiment, optical fingerprint sensor does not need cover sheet, i.e. the present embodiment institute
In the mobile terminal of offer, cover sheet is omitted in the optical fingerprint sensor.Therefore, the optical finger print sensing has been saved
The cost of device.
In mobile terminal 100 provided by the present embodiment, outer cover plate 110 does not need setting through-hole, and only needs corresponding
Blind hole 111, so that being isolated between the entire optical fingerprint sensor (mould group) and the external world by outer cover plate 110.Blind hole 111
Not only make mobile terminal that there is better appearance to feel and use feel.
Meanwhile the setting of blind hole 111, outer cover plate 110 do not need setting through-hole, can make the optical fingerprint sensor more
The influence by electrostatic, steam and air is avoided well, improves the reliability of the optical fingerprint sensor.
Meanwhile the setting of blind hole 111, outer cover plate 110 does not need setting through-hole, so that the optical fingerprint sensor need not
It is directly contacted and presses by finger, therefore, the hardness requirement and Anti-scratching of the optical fingerprint sensor outmost surface are wanted
It asks lower, reduces the cost of the optical fingerprint sensor.
Meanwhile the first part 1251 of flexible printed circuit board is fixed on 1212 upper surface of bending part, passes through bending part
1212 are divided to bend downward, so that the first part 1251 of flexible printed circuit board and the inner surface of outer cover plate 110 are separated from each other, because
This, 110 inner surface of outer cover plate not will receive the press effect of flexible printed circuit board first part 1251, i.e. flexible print circuit
The first part 1251 of plate will not influence the patch of 1211 upper surface of pixel substrate fixed part and 110 inner surface of outer cover plate
It closes, 1211 upper surface of pixel substrate fixed part and 110 inner surface of outer cover plate can fit closely together at this time, make outer
The distance of finger contact surface to the pixel array of cover board 110 is small as far as possible, to guarantee good fingerprint imaging effect.
Further, signal reads chip 123 and is fixed on 1212 upper surface of bending part, and signal read chip 123 with
The inner surface of outer cover plate 110 is separated from each other, at this point, the line that pixel array reads chip 123 to signal is short as far as possible, so that signal
It is good, fingerprint image quality is improved, while making total more compact, guarantees that the thickness of the structure of entire product is smaller, have
Conducive to the lightening design of mobile terminal.
As known from the above, in mobile terminal provided by the present embodiment, entire package assembly is improved, and thickness reduces,
Assembling difficulty reduces, and cost reduces.
Second embodiment of the invention provides another electronic product, and the electronic product is specially a kind of mobile terminal.It needs
It is noted that the electronic product can also be tablet computer, e-book or personal digital assistant in other embodiments
Deng.
Mobile terminal front view provided by second embodiment of the invention is shown incorporated by reference to reference Fig. 7 and Fig. 8, Fig. 7, is schemed
8 show the schematic diagram of the section structure that mobile terminal shown in Fig. 7 is obtained along C-C chain-dotted line cutting.
As can see from Figure 7, mobile terminal 200 includes outer cover plate 210 and screen 201, has first on outer cover plate 210
Blind hole 211.With reference to Fig. 8 it is found that the first blind hole 211 is located at the outer surface (not marking) of outer cover plate 210.
It may further see from Fig. 8, mobile terminal 200 further includes optical fingerprint sensor, and the optical finger print passes
Sensor includes that pixel substrate (not marking), light guide plate 222, signal read chip 223, light source 224 and flexible printed circuit board (not
Mark).The pixel substrate includes flexible plate (not marking), and the pixel substrate includes fixed part 2211 and bending part
2212, fixed part 2211 and 2212 lower layer of bending part are the flexible plate.Fixed part 2211 is located at light guide plate 222
Upper surface, bending part 2212 are suspended on outside 222 side of light guide plate.The first of bending part 2212 and flexible printed circuit board
Part 2251 is bound, i.e., the first part 2251 of the described pixel substrate and the flexible printed circuit board binds.And bending part
2212 are divided to bend downward, until the first part 2251 of flexible printed circuit board and the inner surface of outer cover plate 210 are separated from each other.
With continued reference to FIG. 8, between 2211 upper surface of fixed part of the pixel substrate and the inner surface of outer cover plate 210
With glue-line 231, fit together between the fixed part 2211 and outer cover plate 210 of the pixel substrate by glue-line 231.
With continued reference to FIG. 8, there are also filter layer 232 between the pixel substrate and outer cover plate 210, filter layer 232 is located at
The pixel substrate upper surface.In the present embodiment, filter layer 232 can be used for improving the light seen outside mobile terminal
Fingerprint sensor appearance color is learned, and filter layer 232 can also play corresponding filter action.In other embodiments, glue-line
231 and filter layer 232 can be with transposition.
With continued reference to FIG. 8, the first part 2251 of flexible printed circuit board is bundled in the pixel base in the present embodiment
The upper surface of plate bending part 2212, and the second part 2252 of flexible printed circuit board is bent to and is attached to 222 bottom of light guide plate
Portion.In Fig. 8, each section of flexible printed circuit board is distinguish with short dash line section.The second part of flexible printed circuit board
It can be with glue or adhered by double sided plaster together, to prevent flexible printed circuit board between 2252 and the bottom of light guide plate 222
The the lower part 2252 mutually diverged to light guide plate 222.
With continued reference to FIG. 8, light source 224 can be LED light in the present embodiment.
With continued reference to FIG. 8, in the present embodiment, since 2212 bending angle of bending part of the pixel substrate is smaller
(such as 30 °), therefore, bending part 2212 and 222 side of light guide plate and flexible printed circuit board of the pixel substrate surround
Annular regions 220.Glue can be filled in annular regions 220, to form glue-line (not shown), the glue-line can make at this time
The bending state of bending part 2212 is reinforced, and further avoids bending part 2212 and corresponding flexible printed circuit board first
The influence outer cover plate 210 of part 2251 is bonded with the pixel substrate.
Although not shown in the drawing in the present embodiment, it can be by adhesive tape, adhesive tape, adhesive plaster or rubber etc., it will the entire optics
Fingerprint sensor (mould group) is sealed on 210 inside (inner surface) of outer cover plate, to play to the optical fingerprint sensor
Fixed and interception, interception are to prevent other light from described in the optical fingerprint sensor side or back side entrance
Optical fingerprint sensor.The adhesive tape, adhesive tape, adhesive plaster or rubber glue material part can be light-sensitive emulsion, pressure sensitive adhesive or thermosetting
Glue.
More the structure in relation to mobile terminal provided by the present embodiment and property can be accordingly interior with reference to previous embodiment
Hold.
It is different from previous embodiment, with continued reference to FIG. 8, the sidewall sections of the first blind hole 211 are in oblique in the present embodiment
Ramp shaped structure.This first blind hole 211 can make the first blind hole 211 in the contact or pressing for receiving finger, and feeling is better, and
It prevents finger uncomfortable or scratches, simultaneously, additionally it is possible to improve fingerprint recognition effect.
It should be noted that the side wall of the first blind hole 211 may be other shapes of graded junction in other embodiments
Structure, such as the grading structures such as chamfering shape or arc-shaped.
Different from previous embodiment, in the present embodiment, signal reads chip 223 fixed (this is fixed also as binding) in institute
State 2212 lower surface of pixel substrate bending part, and the bending part 2212 of the pixel substrate and 222 side of light guide plate and soft
Property printed circuit board surround annular regions 220, therefore, signal read chip 223 be fixed in annular regions 220.Due to signal
It reads chip 223 to be fixed in annular regions 220, therefore, signal reads chip 223 and the inner surface of outer cover plate 210 affirms phase
It mutually separates, therefore, the fixed part 2211 of the pixel substrate is not read core by signal with being bonded for the inner surface of outer cover plate 210
Any influence of piece 223 guarantees that the thickness of entire electronic product is smaller.Also, if filling glue in annular regions 220 at this time
Layer, glue-line is in addition to that can reinforce the bending state of the pixel substrate bending part 2212, moreover, can reinforce reading signal
The protective effect and fixed function of chip 223.
It should be noted that being fixed on the pixel substrate bending part when signal reads chip 223 in the present embodiment
When 2212 lower surface, in general, the thin-film device and circuit and signal on the pixel substrate fixed part 2211 read chip 223
Positioned at same surface, i.e., usual thin-film device and circuit also are located at the lower surface of fixed part 2211, at this point, fixed part 2211
Pixel can be back-illuminated type pixel, also, can suitably reduce the thickness of the pixel substrate at this time, such as control is in 200 μ
M or less.
Third embodiment of the invention provides another electronic product, and the electronic product is specially a kind of mobile terminal.It needs
It is noted that the electronic product can also be tablet computer, e-book or personal digital assistant in other embodiments
Deng.
Incorporated by reference to reference Fig. 9 and Figure 10, Fig. 9 shows mobile terminal front view provided by third embodiment of the invention,
Figure 10 shows the schematic diagram of the section structure that mobile terminal shown in Fig. 9 is obtained along D-D chain-dotted line cutting.
As it can be seen in figure 9 that mobile terminal 300 includes outer cover plate 310 and screen 301, and shifting is also shown in Fig. 9
There is the first blind hole 311 on dynamic 300 outer cover plate 310 of terminal.With reference to Figure 10 it is found that the first blind hole 311 is located at the outer of outer cover plate 310
Surface (does not mark).It may further see from Figure 10, mobile terminal 300 further includes optical fingerprint sensor, the optics
Fingerprint sensor includes pixel substrate (not marking), light guide plate 322, signal reading chip 323, light source 324 and flexible printing electricity
Road plate (does not mark).The pixel substrate includes flexible plate (not marking), and the pixel substrate includes 3211 He of fixed part
Bending part 3212.Fixed part 3211 is located at 322 upper surface of light guide plate, and bending part 3212 is suspended on 322 side of light guide plate
It is external.The binding of the first part 3251 of bending part 3212 and flexible printed circuit board, i.e., the described pixel substrate and the flexibility
The first part 3251 of printed circuit board binds.And bending part 3212 is bent downward, until the of flexible printed circuit board
A part 3251 and the inner surface of outer cover plate 310 are separated from each other.
With continued reference to FIG. 10, the inner surface of 3211 upper surface of fixed part of the pixel substrate and outer cover plate 310 it
Between there is glue-line 331, fit together between the fixed part 3211 and outer cover plate 310 of the pixel substrate by glue-line 331.
With continued reference to FIG. 10, there are also filter layer 332 between the pixel substrate and outer cover plate 310, filter layer 332 is located at
The pixel substrate upper surface.In the present embodiment, filter layer 332 can be used for improving the light seen outside mobile terminal
Fingerprint sensor appearance color is learned, and filter layer 332 can also play corresponding filter action.In other embodiments, glue-line
331 and filter layer 332 can be with transposition.
With continued reference to FIG. 10, the first part 3251 of flexible printed circuit board is bundled in the pixel in the present embodiment
Upper surface of base plate, the second part 3252 of flexible printed circuit board, which is bent to, is attached to 322 bottom of light guide plate.It is flexible in Figure 10
Each section of printed circuit board is distinguish with short dash line section.The second part 3252 and light guide plate 322 of flexible printed circuit board
Bottom between can with glue or adhered by double sided plaster together, with prevent the second part 3252 of flexible printed circuit board with
Light guide plate 322 mutually diverges to.
With continued reference to FIG. 10, light source 324 can be LED light in the present embodiment.
With continued reference to FIG. 10, in the present embodiment, since 3212 bending angle of bending part of the pixel substrate is smaller
(such as 30 °), therefore, bending part 3212 and 322 side of light guide plate and flexible printed circuit board of the pixel substrate surround
Annular regions 320.Glue can be filled in annular regions 320, to form glue-line (not shown), the glue-line can make at this time
The bending state of bending part 3212 is reinforced, and further avoids bending part 3212 and corresponding flexible printed circuit board first
The influence outer cover plate 310 of part 3251 is bonded with the pixel substrate.
Although not shown in the drawing in the present embodiment, it can be by adhesive tape, adhesive tape, adhesive plaster or rubber etc., it will the entire optics
Fingerprint sensor (mould group) is sealed on 310 inside (inner surface) of outer cover plate, to play to the optical fingerprint sensor
Fixed and interception, interception are to prevent other light from described in the optical fingerprint sensor side or back side entrance
Optical fingerprint sensor.The adhesive tape, adhesive tape, adhesive plaster or rubber glue material part can be light-sensitive emulsion, pressure sensitive adhesive or thermosetting
Glue.
More the structure in relation to mobile terminal provided by the present embodiment and property can be accordingly interior with reference to previous embodiment
Hold.
Different from previous embodiment, signal reads the second part 3252 that chip 323 is fixed on flexible printed circuit board.
Signal wire on the pixel substrate can be connected on flexible printed circuit board, and by the first of flexible printed circuit board
Then signal reading chip 323 is fixed on the second part of flexible printed circuit board by part 3251 and second part 3252
When 3252, guarantee that signal reads chip 323 and keeps being electrically connected with corresponding signal wire.
In the present embodiment, signal reading chip 323 can be welded on by second part 3252 by surface mounting technology.Tool
Body can be welded on the lower surface of second part 3252 shown in Figure 10 and 322 fitting part of light guide plate, thus anti-stop signal
It reads chip 323 and 322 mutual extrusion of light guide plate is repelled.
In the present embodiment, for second part 3252 other than being bonded with 322 bottom of light guide plate, second part 3252 has part
For surrounding above-mentioned annular regions 320；There are also parts to be neither bonded with 322 bottom of light guide plate for second part 3252, is not also located at
Annular regions 320, and it is an exposure to 322 left side lower section of light guide plate shown in Fig. 10.Therefore, in other embodiments, signal is read
Chip 323 can also be fixed on 3252 position of second part for surrounding above-mentioned annular regions 320, at this point, signal is read
Chip 323 can both be located in annular regions 320 out, can also be located at outside annular regions 320.When positioned at the annular regions
When in 320, chip 323 can also be read to signal using aforementioned glue-line and play reinforcement effect.In other embodiments, signal is read
3252 position of second part that chip 323 can also be exposed with 322 left side lower section of lightguide plate fixing, at this point, signal is read
Chip 323 can both be located at 3252 upper surface of second part, can also be located at 3252 lower surface of second part.
In other embodiments, the mode of film (Film On Glass, FOG) technology on glass can also be used, is used
Signal reading chip 323 is pressed together on 3252 lower surface of second part by anisotropic conductive film.
Different from previous embodiment, in the present embodiment, outer cover plate 310 includes 3101 He of first substrate being pasted together
The second substrate 3102, first substrate 3101 have first through hole (individually mark), the first blind hole 311 by the first through hole with
3102 surface composition of the second substrate.Since outer cover plate 310 is by the first substrate 3101 being pasted together and 3102 groups of the second substrate
At corresponding first blind hole 311, i.e., at this time: on first substrate 3101 only need to dig one it is corresponding with optical sensor pixel array
The first through hole, then the first through hole and 3102 surface engagement of the second substrate form the first blind hole 311.Due to through-hole compared with
It is easy production, with reference to previous embodiment it is found that this implementation can simplify the manufacture difficulty of outer cover plate 310, and improves outer cover plate
310 reliability.
With continued reference to FIG. 10, in the present embodiment there is glue-line 3103 between first substrate 3101 and the second substrate 3102,
First substrate 3101 and the second substrate 3102 are bonded together by glue-line 3103.In the present embodiment, glue-line 3103 can be
Light-sensitive emulsion, heat-sensitive glue or hot-setting adhesive.
It, can also be as needed on first substrate 3101 and opposite two surfaces of the second substrate 3102 in the present embodiment
It prints ink (i.e. glue-line 3103 may include ink layer).The ink, the ink can be printed using method for printing screen
It can be the non-fully ink of suction visible light or near infrared light.
In the present embodiment, the thickness of first substrate 3101 and the second substrate 3102 is according to the requirement of required mechanical strength come really
It is fixed.For example, the thickness of first substrate 3101 can be 0.2mm~0.7mm hereinafter, to guarantee the first blind hole 311 in the design
Depth.The thickness of the second substrate 3102 is determined that the thickness of the second substrate 3102 can be by fingerprint effect imaging effect
0.1mm~0.3mm, to guarantee corresponding mechanical strength and fingerprint imaging effect.
Although present disclosure is as above, present invention is not limited to this.Anyone skilled in the art are not departing from this
It in the spirit and scope of invention, can make various changes or modifications, therefore protection scope of the present invention should be with claim institute
Subject to the range of restriction.
Claims (9)
1. a kind of electronic product characterized by comprising
Optical fingerprint sensor, the optical fingerprint sensor include pixel substrate, light guide plate and flexible printed circuit board, described
Pixel substrate has pixel array；
Outer cover plate, the outer cover plate have outer surface and inner surface, have the first blind hole, first blind hole on the outer surface
It is opposite with the pixel array upper surface；
The pixel substrate includes flexible plate, and the pixel substrate includes fixed part and bending part；
The fixed part is located at the light guide plate upper surface, and the bending part is located at outside the light guide plate side；It is described
The binding of the first part of bending part and the flexible printed circuit board, and the bending part is bent downward, until described
The first part of flexible printed circuit board is separated from each other with the inner surface of the outer cover plate or zero active force contacts；
Signal reads chip, and the signal reads chip and is fixed on the bending part or the flexible printed circuit board, institute
It states signal and reads chip and be separated from each other with the inner surface of the outer cover plate or zero active force contacts.
2. electronic product as described in claim 1, which is characterized in that the thickness range of the pixel substrate is 20 μm~300 μ
m。
3. electronic product as described in claim 1, which is characterized in that the bending part and the light guide plate side and described
Flexible printed circuit board surrounds annular regions, has glue-line in the annular regions.
4. electronic product as described in claim 1, which is characterized in that the second part of the flexible printed circuit board is bent to
Have and be at least partly attached to the light guide plate bottom, the signal reads chip and is fixed on the second of the flexible printed circuit board
Part.
5. electronic product as described in claim 1, which is characterized in that the outer cover plate includes the first substrate being pasted together
And the second substrate, the first substrate have first through hole, first blind hole is by the first through hole and the second substrate
Surface composition.
6. electronic product as claimed in claim 5, which is characterized in that have between the first substrate and the second substrate
Glue-line is bonded together the first substrate and the second substrate by the glue-line.
7. electronic product as described in claim 1, which is characterized in that the pixel substrate upper surface is interior with the outer cover plate
There is glue-line between surface, fit together between the pixel substrate and the outer cover plate by the glue-line.
8. electronic product as claimed in claim 7, which is characterized in that the pixel substrate top layer is protective layer, the picture
Pixel array is covered by the protective layer, and the protective layer is directly fitted with the glue-line.
9. electronic product as claimed in claim 1 or 7, which is characterized in that between the pixel substrate and the outer cover plate also
There is filter layer, the filter layer is located at the pixel substrate upper surface or is located at the outer cover plate inner surface.
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Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107122649B (en) * | 2017-04-28 | 2020-07-03 | Oppo广东移动通信有限公司 | Unlocking control method, mobile terminal and computer-readable storage medium |
| CN107180599B (en) * | 2017-05-12 | 2019-08-09 | Oppo广东移动通信有限公司 | Display screens, display devices and mobile terminals |
| CN109143394B (en) * | 2017-06-19 | 2020-10-16 | 北京小米移动软件有限公司 | Electronic device |
| CN109255281B (en) * | 2017-07-14 | 2022-04-29 | 敦泰电子有限公司 | High-screen-ratio display equipment with fingerprint identification function |
| CN109460696B (en) * | 2017-09-06 | 2024-06-25 | 蓝思科技（长沙）有限公司 | Optical fingerprint sensing device and electronic equipment |
| CN109460692B (en) * | 2017-09-06 | 2024-04-02 | 蓝思科技（长沙）有限公司 | Optical fingerprint sensor, terminal equipment and optical fingerprint sensor processing technology |
| CN109460693A (en) * | 2017-09-06 | 2019-03-12 | 蓝思科技（长沙）有限公司 | Optical fingerprint sensor and terminal device |
| KR102528525B1 (en) * | 2018-01-10 | 2023-05-03 | 삼성디스플레이 주식회사 | Display device |
| CN108491833B (en) * | 2018-05-22 | 2024-03-29 | 昆山丘钛生物识别科技有限公司 | Optical fingerprint module and mobile terminal |
| US11557230B2 (en) | 2020-02-14 | 2023-01-17 | Samsung Display Co., Ltd. | Electronic device |
| TWI764649B (en) * | 2021-03-26 | 2022-05-11 | 義隆電子股份有限公司 | Button module with vibration feedback and fingerprint sensing, fingerprint sensing module for the same, and control method for the same |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1816814A (en) * | 2003-01-22 | 2006-08-09 | 诺基亚公司 | Sensing arrangement |
| CN102073860A (en) * | 2010-12-06 | 2011-05-25 | 清华大学 | Optical fingerprint acquisition device, optical fingerprint identification system and method |
| CN104077573A (en) * | 2014-07-02 | 2014-10-01 | 南昌欧菲生物识别技术有限公司 | Fingerprint recognition sensor, fingerprint recognition detection assembly and terminal device |
| CN104700081A (en) * | 2015-03-06 | 2015-06-10 | 南昌欧菲生物识别技术有限公司 | Fingerprint recognition device, touch screen with same and terminal device |
| CN104866814A (en) * | 2015-04-17 | 2015-08-26 | 麦克思股份有限公司 | Fingerprint identification device and manufacturing method thereof |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9218522B2 (en) * | 2013-09-17 | 2015-12-22 | Gingy Technology Inc. | Method for determining fingerprint authenticity and device for the same |
-
2015
- 2015-08-05 CN CN201510474482.9A patent/CN106383549B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1816814A (en) * | 2003-01-22 | 2006-08-09 | 诺基亚公司 | Sensing arrangement |
| CN102073860A (en) * | 2010-12-06 | 2011-05-25 | 清华大学 | Optical fingerprint acquisition device, optical fingerprint identification system and method |
| CN104077573A (en) * | 2014-07-02 | 2014-10-01 | 南昌欧菲生物识别技术有限公司 | Fingerprint recognition sensor, fingerprint recognition detection assembly and terminal device |
| CN104700081A (en) * | 2015-03-06 | 2015-06-10 | 南昌欧菲生物识别技术有限公司 | Fingerprint recognition device, touch screen with same and terminal device |
| CN104866814A (en) * | 2015-04-17 | 2015-08-26 | 麦克思股份有限公司 | Fingerprint identification device and manufacturing method thereof |
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|---|---|
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