CN109508598A - The manufacturing method and electronic device of optical finger print recognizer component - Google Patents
The manufacturing method and electronic device of optical finger print recognizer component Download PDFInfo
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- CN109508598A CN109508598A CN201710845669.4A CN201710845669A CN109508598A CN 109508598 A CN109508598 A CN 109508598A CN 201710845669 A CN201710845669 A CN 201710845669A CN 109508598 A CN109508598 A CN 109508598A
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- Prior art keywords
- optical
- finger print
- recognizer component
- manufacturing
- optical finger
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1318—Sensors therefor using electro-optical elements or layers, e.g. electroluminescent sensing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Human Computer Interaction (AREA)
- General Physics & Mathematics (AREA)
- Multimedia (AREA)
- Theoretical Computer Science (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Image Input (AREA)
- Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)
Abstract
The present invention discloses a kind of manufacturing method of optical finger print recognizer component.The manufacturing method of optical finger print recognizer component identifies mould group comprising steps of providing display module, optical cement and optical finger print, and display module includes substrate and the photomask that is formed on substrate, and optical finger print identifies that mould group includes optical fingerprint sensor；The predetermined patterns for the photomask being formed on substrate using laser ablation are to form no shading diaphragm area；Optical fingerprint sensor is conformed to by optical cement to form optical finger print recognizer component on substrate, optical cement wears no shading diaphragm area.In addition, electronic device has optical finger print recognizer component the invention also discloses a kind of electronic device.The manufacturing method of the optical finger print recognizer component of embodiments of the present invention, using the predetermined patterns of laser ablation photomask to form the efficiency without shading diaphragm area, the dimensional accuracy height of no shading diaphragm area and the manufacturing method for improving optical finger print recognizer component in the region that substrate is bonded with optical fingerprint sensor.
Description
Technical field
The present invention relates to technical field of biometric identification, a kind of manufacturing method more particularly, to optical finger print recognizer component and
Electronic device.
Background technique
In the related art, optical finger print identification mould group is bonded on the substrate of display module to form optical finger print identification
Component.Film layer is formed on the substrate of display module, it usually needs removal substrate and optical finger print identify mould group fit area
Film layer.It is at present usually to remove film layer by hand using solvent, but removal film layer is unable to reach dimension precision requirement and effect by hand
Rate is low.
Summary of the invention
Embodiments of the present invention provide the manufacturing method and electronic device of a kind of optical finger print recognizer component.
A kind of manufacturing method of optical finger print recognizer component of embodiment of the present invention, comprising steps of
Display module, optical cement and optical finger print are provided and identify that mould group, the display module include substrate and be formed in institute
The photomask on substrate is stated, the optical finger print identification mould group includes optical fingerprint sensor；
The predetermined patterns of the photomask on the substrate are formed in using laser ablation to form no shading diaphragm area；
The optical fingerprint sensor is conformed into the substrate by the optical cement to form optical finger print identification group
Part, the optical cement wear the no shading diaphragm area.
The manufacturing method of the optical finger print recognizer component of embodiments of the present invention utilizes the default of laser ablation photomask
Position in the region that substrate is bonded with optical fingerprint sensor to form without shading diaphragm area, the dimensional accuracy of no shading diaphragm area
It is high and improve efficiency.
In some embodiments, the manufacturing method includes: to carry out deaeration baking to the optical finger print recognizer component
Processing.
In this way, deaeration baking, which is handled, can remove bubble caused by optical cement when optical fingerprint sensor is bonded with substrate,
Aeration optical finger print identification mould group is avoided to obtain fingerprint image.
In some embodiments, the manufacturing method includes: to carrying out deaeration baking treated the optical finger print
Recognizer component carries out the processing of dispensing baking-curing, and the dispensing includes sensing in the side of the optical cement and the optical finger print
The side of device forms adhesive layer so that the adhesive layer limits the displacement range of the optical cement and the optical fingerprint sensor.
In this way, the dispensing and adhesive layer after solidifying can fix optical fingerprint sensor and optical cement, effectively avoids optics
Shaking of the fingerprint sensor in use or test.
In some embodiments, the predetermined patterns that the photomask on the substrate is formed in using laser ablation
It is completed without shading diaphragm area using laser machine with being formed.
In this way, the laser beam after the focusing of laser machine can will be formed in the predetermined patterns removal of the photomask on substrate
And it will not damaged substrate.
In some embodiments, it is 50%-60% that the running parameter of the laser machine, which is power, and frequency is
140000-160000Hz, space rate 900-1100bit/ms, circular arc speed are 900-1100bit/ms.
In this way, suitable running parameter is conducive to the predetermined patterns removal that laser machine will be formed in the photomask on substrate
It completely and will not damaged substrate.
In some embodiments, the shape size phase of the shape size and the optical cement of the no shading diaphragm area
Match, the thickness of the optical cement is greater than the thickness of the photomask.
In this way, all being filled by optical cement without shading diaphragm area, optical fingerprint sensor can be flattened on substrate, thus
Facilitate the identification of fingerprint.
In some embodiments, the dimensional accuracy of the no shading diaphragm area is ± 0.03mm.
In this way, the dimensional accuracy without shading diaphragm area reaches ± 0.03mm, the effect of photomask shield lights is preferable, thus
It avoids influencing optical finger print identification mould group identification fingerprint.
In some embodiments, the offer optical finger print identifies mould group, comprising:
Flexible circuit board is provided and stiffening plate, the flexible circuit board include opposite the first face and the second face；
The stiffening plate is arranged in first face；
The flexible circuit board with the stiffening plate is connected by second face and the optical fingerprint sensor
It connects, the flexible circuit board includes the circuit board position between the optical fingerprint sensor and the stiffening plate.
In this way, using the flexible nature of flexible circuit board, flexible circuit plate benging can be arranged in one it is lesser
The position for being suitble to connect with outer member is adjusted in space or by flexible circuit board；Meanwhile stiffening plate can enhance flexible circuit
The intensity of plate.
In some embodiments, the optical fingerprint sensor includes:
Photosensitive layer, the photosensitive layer are formed with induction zone；With
Optical layer on the photosensitive layer is set, and the optical layer covers the induction zone, the area of the optical layer
Greater than the area of the induction zone, the optical layer is formed with microlens array or mesh-structured；
The optical cement is between the substrate and the photosensitive layer.
In this way, optical layer can by microlens array or it is mesh-structured by light-ray condensing into photosensitive layer, to increase
The intensity of light enables optical finger print identification mould group to collect more optical signals, more accurately to realize fingerprint recognition.
A kind of electronic device of embodiment of the present invention, including optical finger print identification group described in any of the above-described embodiment
Optical finger print recognizer component obtained by the manufacturing method of part.
In the electronic device of embodiment of the present invention, optical finger print recognizer component utilizes the default portion of laser ablation photomask
To be formed in the region that substrate is bonded with optical fingerprint sensor without shading diaphragm area, the dimensional accuracy of no shading diaphragm area is high for position
And improve the efficiency of the manufacturing method of optical finger print recognizer component.
The additional aspect and advantage of embodiments of the present invention will be set forth in part in the description, partially will be from following
Description in become obvious, or the practice of embodiment through the invention is recognized.
Detailed description of the invention
The above-mentioned and/or additional aspect and advantage of embodiments of the present invention are from combination following accompanying drawings to embodiment
It will be apparent and be readily appreciated that in description, in which:
Fig. 1 is the flow diagram of the manufacturing method for the optical finger print recognizer component that embodiment of the present invention provides；
Fig. 2 is the structural schematic diagram for the optical finger print recognizer component that embodiment of the present invention provides.
Main element symbol description:
Optical finger print recognizer component 100, display module 102, optical cement 104, optical finger print identify mould group 106, substrate
108, photomask 110, optical fingerprint sensor 112, no shading diaphragm area 114, adhesive layer 116, flexible circuit board 118, reinforcement
Plate 120, the first face 122, the second face 124, connector 126, photosensitive layer 128, induction zone 130, non-inductive area 132, optical layer
134。
Specific embodiment
Embodiments of the present invention are described below in detail, the example of the embodiment is shown in the accompanying drawings, wherein from beginning
Same or similar element or element with the same or similar functions are indicated to same or similar label eventually.Below by ginseng
The embodiment for examining attached drawing description is exemplary, and for explaining only the invention, and is not considered as limiting the invention.
In the description of the present invention, it is to be understood that, term " center ", " longitudinal direction ", " transverse direction ", " length ", " width ",
" thickness ", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outside", " up time
Needle ", instruction " counterclockwise " orientation or positional relationship be based on the orientation or positional relationship shown in the drawings, be merely for convenience of retouching
It states the present invention and simplifies description, rather than the device or element of indication or suggestion meaning must have a particular orientation, with specific
Orientation construction and operation, therefore be not considered as limiting the invention.In addition, term " first ", " second " are only used for retouching
Purpose is stated, relative importance is not understood to indicate or imply or implicitly indicates the quantity of indicated technical characteristic.By
This defines " first ", the feature of " second " can explicitly or implicitly include one or more feature.At this
In the description of invention, the meaning of " plurality " is two or more, unless otherwise specifically defined.
In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, term " installation ", " phase
Even ", " connection " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or be integrally connected；It can
To be mechanical connection, it is also possible to be electrically connected or can mutually communicate；It can be directly connected, it can also be by between intermediary
It connects connected, can be the connection inside two elements or the interaction relationship of two elements.For the ordinary skill of this field
For personnel, the specific meanings of the above terms in the present invention can be understood according to specific conditions.
In the present invention unless specifically defined or limited otherwise, fisrt feature second feature "upper" or "lower"
It may include that the first and second features directly contact, also may include that the first and second features are not direct contacts but pass through it
Between other characterisation contact.Moreover, fisrt feature includes the first spy above the second feature " above ", " above " and " above "
Sign is right above second feature and oblique upper, or is merely representative of first feature horizontal height higher than second feature.Fisrt feature exists
Second feature " under ", " lower section " and " following " include that fisrt feature is directly below and diagonally below the second feature, or is merely representative of
First feature horizontal height is less than second feature.
Following disclosure provides many different embodiments or example is used to realize different structure of the invention.In order to
Simplify disclosure of the invention, hereinafter the component of specific examples and setting are described.Certainly, they are merely examples, and
And it is not intended to limit the present invention.In addition, the present invention can in different examples repeat reference numerals and/or reference letter,
This repetition is for purposes of simplicity and clarity, itself not indicate between discussed various embodiments and/or setting
Relationship.In addition, the present invention provides various specific techniques and material example, but those of ordinary skill in the art can be with
Recognize the application of other techniques and/or the use of other materials.
Fig. 1 and Fig. 2 are please referred to, embodiments of the present invention provide a kind of manufacturing method of optical finger print recognizer component 100.
The manufacturing method of optical finger print recognizer component 100 comprising steps of
Display module 102, optical cement 104 and optical finger print are provided and identify that mould group 106, display module 102 include substrate 108
With the photomask 110 being formed on substrate 108, optical finger print identifies that mould group 106 includes optical fingerprint sensor 112；
The predetermined patterns for the photomask 110 being formed on substrate 108 using laser ablation are to form no shading diaphragm area
114；
Optical fingerprint sensor 112 is conformed into substrate 108 by optical cement 104 to form optical finger print recognizer component
100, optical cement 104 wears no shading diaphragm area 114.
The manufacturing method of the optical finger print recognizer component 100 of embodiments of the present invention, utilizes laser ablation photomask 110
Predetermined patterns with the region that substrate 108 is bonded with optical fingerprint sensor 112 formed without shading diaphragm area 114, no shading
The dimensional accuracy of diaphragm area 114 is high and improves the efficiency of the manufacturing method of optical finger print recognizer component 100.
Specifically, in the manufacturing method of the optical finger print recognizer component 100 of embodiments of the present invention, in display module
102 substrate 108 is formed with photomask 110.The area being bonded therefore, it is necessary to remove substrate 108 with optical finger print identification mould group 106
The photomask in domain.In embodiments of the present invention, using the predetermined patterns of laser ablation photomask 110 with substrate 108 with
The region that optical fingerprint sensor 112 is bonded is formed without shading diaphragm area 114, and optical fingerprint sensor 112 is enable to receive
The optical signal handed down from 102 side of display module.On the one hand, small-sized after laser focuses, heat-affected zone is small, processing essence
Carefully.Therefore, it is formed using laser in the predetermined patterns of photomask 110 high without 114 dimensional accuracy of shading diaphragm area.On the other hand,
It can be automatically controlled by a computer using the process of the predetermined patterns of laser ablation photomask 110, process velocity is fast, to improve
The efficiency of the manufacturing method of optical finger print recognizer component 100.It is appreciated that including of various shapes logical without shading diaphragm area 114
Hole.Cmos sensor can be used in optical fingerprint sensor 112.Display module 102 can be touch-control display module.
It is appreciated that optical finger print recognizer component 100 obtained by the manufacturing method of embodiments of the present invention can be applied
But it is not limited to the application scenarios such as unlock, file encryption, payment verification, authentication.
In some embodiments, the manufacturing method of optical finger print recognizer component 100 includes: to optical finger print recognizer component
100 carry out deaeration baking processing.
It is produced in this way, deaeration baking handles optical cement 104 when removable optical fingerprint sensor 112 is bonded with substrate 108
Raw bubble avoids aeration optical finger print identification mould group 106 from obtaining fingerprint image.
Specifically, after optical cement 104 fits together optical fingerprint sensor 112 and substrate 108, remain in optical cement
Air quality in 104 will form aeration binding yield, it is therefore necessary to remove bubble removing by deaeration baking.
In some embodiments, the manufacturing method of optical finger print recognizer component 100 includes: to progress deaeration baking processing
Optical finger print recognizer component 100 afterwards carries out the processing of dispensing baking-curing, and dispensing includes referring in the side of optical cement 104 and optics
The side of line sensor 112 forms adhesive layer 116 so that adhesive layer 116 limits optical cement 104 and optical fingerprint sensor 112
Displacement range.
In this way, the dispensing and adhesive layer 116 after solidifying can fix optical fingerprint sensor 112 and optical cement 104, effectively
Avoid shaking of the optical fingerprint sensor 112 in use or test.
Specifically, optical cement 104 is after deaeration is toasted, and the quality of optical cement 104 belongs to semi-solid preparation still than relatively soft
State causes the optical fingerprint sensor 112 for conforming to the substrate 108 of display module 102 by optical cement 104 to be easy to shake in this way
It is dynamic.Therefore optical finger print can be sensed using the side of the side of glue dispensing and packaging optical fingerprint sensor 112 and optical cement 104
Device 112 is fixed and limits the displacement range of optical cement 104.In addition, glue for dispensing glue be it is coloured and lighttight, can rise
To interception, prevent ambient light from entering optical finger print identification mould group 106 and optical fingerprint sensor 112 is interfered to identify fingerprint.
Glue for dispensing glue includes the glue such as low temperature hot-setting adhesive, moisture-curable glue, is not specifically limited herein.Glue shape after baking-curing
At adhesive layer 116.
In addition, adhesive layer 116 can seal when the flat shape of optical cement 104 and optical fingerprint sensor 112 is rectangular
Fill three sides of optical cement 104 or three sides or four sides of four sides and optical fingerprint sensor 112.Adhesive layer
116 are also connected with the surface of substrate 108, fix in this way, essentially forming comprehensive sealing.
In some embodiments, the predetermined patterns of the photomask 110 on substrate 108 are formed in using laser ablation with shape
It at no shading diaphragm area 114 is completed using laser machine.
In this way, the laser beam after the focusing of laser machine can will be formed in the default portion of the photomask 110 on substrate 108
Position removes and will not damaged substrate 108.
It is appreciated that the light beam after laser focusing can will be formed in the pre- of the photomask 110 on substrate 108 such as cutter
If position removes.This process is untouchable processing, does not generate mechanical presses or mechanical stress, therefore will not damaged substrate
108。
In some embodiments, it is 50%-60%, frequency 140000- that the running parameter of laser machine, which is power,
160000Hz, space rate 900-1100bit/ms, circular arc speed are 900-1100bit/ms.
In this way, suitable running parameter is conducive to the default portion that laser machine will be formed in the photomask 110 on substrate 108
Position removal is clean and will not damaged substrate 108.
Specifically, power can any number between 50%, 60% or 50%-60%, preferably, power is 55%.
Frequency can any number between 140000,160000 or 140000-160000, preferably, frequency is 150000Hz.Straight line
Speed can any number between 900,1100 or 900-1100, preferably, space rate is 1000bit/ms.Circular arc speed
Can any number between 900,1100 or 900-1100, preferably, circular arc speed is 1000bit/ms.
In embodiments of the present invention, laser machine beat twice laser to ensure to be formed in the shading on substrate 108
The predetermined patterns of film 110 are removed clean.
In some embodiments, the shape size phase of the shape size of no shading diaphragm area 114 and optical cement 104
Match.The thickness of optical cement 104 is greater than the thickness of photomask 110.
In this way, all being filled by optical cement 104 without shading diaphragm area 114, optical fingerprint sensor 112 can be flattened on base
On plate 108, to facilitate the identification of fingerprint.The shape size phase of shape size and optical cement 104 without shading diaphragm area 114
Matching can reduce the bore size of no shading diaphragm area 114, and display module 102 is watched above display module 102 to reduce
When color difference.
In the embodiment shown in figure 2, due to being provided with adhesive layer 116, adhesive layer 116 can connect photomask 110 simultaneously
Limit the displacement range of optical cement 104 jointly with photomask 110.In other embodiment, no shading diaphragm area 114 can be opened
If more greatly so that optical cement 104 and being filled without the interval between 114 inner wall of shading diaphragm area by adhesive layer 116, at this point, envelope
Glue-line 116 can connecting substrate 108 lower surface.
In some embodiments, the dimensional accuracy of no shading diaphragm area 114 is ± 0.03mm.
In this way, the dimensional accuracy without shading diaphragm area 114 reaches ± 0.03mm, the effects of 110 shield lights of photomask compared with
It is good, to avoid influencing the optical finger print identification identification fingerprint of mould group 106.
In some embodiments, optical finger print identification mould group 106 is provided, comprising:
Flexible circuit board 118 and stiffening plate 120 are provided, flexible circuit board 118 includes opposite the first face 122 and the second face
124；
Stiffening plate 120 is arranged in the first face 122；
Flexible circuit board 118 with stiffening plate 120 is connect by the second face 124 with optical fingerprint sensor 112, it is soft
Property circuit board 118 includes the circuit board position between optical fingerprint sensor 112 and stiffening plate 120.
In this way, flexible circuit board 118 can be bent using the flexible nature of flexible circuit board 118 to be arranged in one
The position for being suitble to connect with outer member is adjusted in lesser space or by flexible circuit board 118；Meanwhile stiffening plate 120 can
Enhance the intensity of flexible circuit board 118.
It is appreciated that causing 118 stress of flexible circuit board to be easy to produce due to the flexible nature of flexible circuit board 118 and splitting
Seam, that is, be difficult to connect optical fingerprint sensor 112 and flexible circuit board 118 or the installation elements on flexible circuit board 118, because
The first face 122 of flexible circuit board 118 can be arranged in stiffening plate 120 by this, so that flexible circuit board 118 is located at optics
The intensity at the circuit board position between fingerprint sensor 112 and stiffening plate 120 is enough, and then facilitates connection optical fingerprint sensor
112 and flexible circuit board 118 or the operation such as installation elements is carried out on the circuit board position of flexible circuit board 118.
In addition, optical fingerprint sensor 112 and flexible circuit board 118 are to pass through welded connecting.By flexible circuit board 118
When being soldered to optical fingerprint sensor 112, stiffening plate 120 can be first arranged in the lower surface of flexible circuit board 118, can be made in this way
Flexible circuit board 118 is not easy to deform in the welding process, and flexible circuit board 118 is avoided to form rosin joint in the welding process, from
And it ensure that connection effect.
Stiffening plate 120 can be made of metal material, such as stainless steel.
In some embodiments, flexible circuit board 118 is provided with connector 126.
Part circuit structure (such as connector 126) is arranged on flexible circuit board 118 in this way, can use, flexible electrical
Road plate 118 can be attached by connector 126 with outer member.In some embodiments, connector 126 includes weldering
Point, conducting wire, plug, socket etc. play the component of connection function, are not specifically limited herein.
In some embodiments, processor (not shown) is provided on flexible circuit board 118, processor can be used for locating
Manage the electric signal that optical fingerprint sensor 112 exports.
Specifically, processor and interlock circuit structure has can be set in flexible circuit board 118, and processor processing includes fingerprint
The electric signal of information is to establish the model of fingerprint.
In some embodiments, optical fingerprint sensor 112 includes photosensitive layer 128 and optical layer 134.Photosensitive layer 128
It is formed with induction zone 130.Optical layer 134 is arranged on photosensitive layer 128, and optical layer 134 covers induction zone 130.Optical layer 134
Area is greater than the area of induction zone 130.Optical layer 134 is formed with microlens array or mesh-structured.Optical cement 104 is located at substrate
Between 108 and photosensitive layer 128.
In this way, optical layer 134 can by microlens array or it is mesh-structured by light-ray condensing into photosensitive layer 128, from
And increase the intensity of light, so that optical finger print identification mould group 106 is collected more optical signals, more accurately to realize fingerprint
Identification.
Specifically, when optical finger print recognizer component 100 acquires fingerprint, finger acts on the media table of 134 top of optical layer
On face, the light that finger reflects is converged to induction zone 130 by the microlens array of optical layer 134, and induction zone 130 is obtained
Take more light to form finger print data.The area of optical layer 134 is greater than the area of induction zone 130 conducive to the reflection of more fingers
Light be projected to induction zone 130, increase the data volume of collected finger print information.Photosensitive layer 128 is configured to will be from optics
The light of 134 convergence of layer is converted to electric signal and exports electric signal, and the electric signal of output forms finger print information after processing.
Mesh-structured formation pinhole imaging system area.Pinhole imaging system area is formed with multiple apertures, each aperture can with aperture at
As light is projected photosensitive layer 128 by principle.Aperture can be blind hole or through-hole.Through-hole is through the upper surface of optical layer 134 under
Surface.Blind hole runs through the upper surface or lower surface of optical layer 134.In one example, aperture is blind hole, and blind hole runs through optics
The lower surface of layer 134.
When optical finger print recognizer component 100 acquires fingerprint, finger is placed in the dielectric surface of 134 top of optical layer, from finger
The light of reflection is projected to photosensitive layer 128 behind pinhole imaging system area, enables photosensitive layer 128 to obtain more light and is referred to being formed
Line data improve the data volume of collected finger print information, help to improve the accuracy of optical finger print recognizer component 100.
In some embodiments, optical layer 134 is formed with microlens array or mesh-structured, it is understood that is light
It learns layer 134 and is formed with microlens array and mesh-structured.
In some embodiments, photosensitive layer 128 includes multiple light-sensitive element (not shown) and connection line (not shown).
Multiple light-sensitive elements form induction zone 130, and connection line connects multiple light-sensitive elements.
In this way, light-sensitive element can incude the light converged from optical layer 134 and optical signal is converted to electric signal to adopt
Collect finger print information.
Specifically, multiple light-sensitive elements can convert optical signals into electric signal, when finger acts on optical finger print identification
When on the surface of component 100, the light reflected from finger convergence is projected to photosensitive layer 128, multiple light-sensitive elements by optical layer 134
Light of the induction with finger print information simultaneously converts optical signal into electric signal.
Further, photosensitive layer 128 includes substrate, and multiple light-sensitive elements and connection line are formed in substrate.Some
In example, substrate can be semiconductor base.Light-sensitive element and connection line can be formed in substrate by photoetching process.Multiple light
Quick element forms induction zone 130 (area active area, AA), other regions form non-inductive area 132 (the non-area AA) in substrate,
Non-inductive area 132 is provided with connection line.In embodiments of the present invention, connection line can connect flexible circuit board 118.It is photosensitive
Element is, for example, photodiode.
A kind of electronic device of embodiment of the present invention, including optical finger print identification group described in any of the above-described embodiment
Optical finger print recognizer component 100 obtained by the manufacturing method of part 100.
In the electronic device of embodiment of the present invention, optical finger print recognizer component 100 utilizes laser ablation photomask 110
Predetermined patterns in the region that substrate 108 is bonded with optical fingerprint sensor 112 to form without shading diaphragm area 114, no photomask
The dimensional accuracy in region 114 is high and improves the efficiency of the manufacturing method of optical finger print recognizer component 100.
Electronic device can be the terminals such as mobile phone, tablet computer, ATM machine, vehicular touch screen, fingerprint gate lock.
In the description of this specification, reference term " certain embodiments ", " embodiment ", " some embodiment party
The description of formula ", " exemplary embodiment ", " example ", " specific example " or " some examples " means to combine embodiment or show
Example particular features, structures, materials, or characteristics described are contained at least one embodiment or example of the invention.At this
In specification, schematic expression of the above terms are not necessarily referring to identical embodiment or example.Moreover, the tool of description
Body characteristics, structure, material or feature can be tied in an appropriate manner in any one or more embodiments or example
It closes.
In addition, term " first ", " second " are used for descriptive purposes only and cannot be understood as indicating or suggesting relative importance
Or implicitly indicate the quantity of indicated technical characteristic.Define " first " as a result, the feature of " second " can be expressed or
Implicitly include at least one feature.In the description of the present invention, the meaning of " plurality " is at least two, such as two, three,
Unless otherwise specifically defined.
Although the embodiments of the present invention has been shown and described above, it is to be understood that above-described embodiment is example
Property, it is not considered as limiting the invention, those skilled in the art within the scope of the invention can be to above-mentioned
Embodiment is changed, modifies, replacement and variant, and the scope of the present invention is defined by the claims and their equivalents.
Claims (10)
1. a kind of manufacturing method of optical finger print recognizer component, which is characterized in that comprising steps of
Display module, optical cement and optical finger print are provided and identify that mould group, the display module include substrate and be formed in the base
Photomask on plate, the optical finger print identification mould group includes optical fingerprint sensor；
The predetermined patterns of the photomask on the substrate are formed in using laser ablation to form no shading diaphragm area；
The optical fingerprint sensor is conformed into the substrate by the optical cement to form optical finger print recognizer component, institute
It states optical cement and wears the no shading diaphragm area.
2. the manufacturing method of optical finger print recognizer component as described in claim 1, which is characterized in that the manufacturing method packet
It includes: deaeration baking processing is carried out to the optical finger print recognizer component.
3. the manufacturing method of optical finger print recognizer component as claimed in claim 2, which is characterized in that the manufacturing method packet
Include: to carrying out deaeration baking treated, the optical finger print recognizer component carries out the processing of dispensing baking-curing, the dispensing packet
It includes in the side of the optical cement and the side of the optical fingerprint sensor forms adhesive layer so that the adhesive layer limits institute
State the displacement range of optical cement and the optical fingerprint sensor.
4. the manufacturing method of optical finger print recognizer component as described in claim 1, which is characterized in that described to utilize laser ablation
The predetermined patterns of the photomask on the substrate are formed in form no shading diaphragm area using laser machine and complete.
5. the manufacturing method of optical finger print recognizer component as claimed in claim 4, which is characterized in that the laser machine
Running parameter is that power is 50%-60%, frequency 140000-160000Hz, space rate 900-1100bit/ms, circular arc
Speed is 900-1100bit/ms.
6. the manufacturing method of optical finger print recognizer component as described in claim 1, which is characterized in that the no shading diaphragm area
The shape size of shape size and the optical cement match, the thickness of the optical cement is greater than the thickness of the photomask.
7. the manufacturing method of optical finger print recognizer component as described in claim 1, which is characterized in that the no shading diaphragm area
Dimensional accuracy be ± 0.03mm.
8. the manufacturing method of optical finger print recognizer component as described in claim 1, which is characterized in that the offer optical finger print
Identify mould group, comprising:
Flexible circuit board is provided and stiffening plate, the flexible circuit board include opposite the first face and the second face；
The stiffening plate is arranged in first face；
The flexible circuit board with the stiffening plate is connect by second face with the optical fingerprint sensor, institute
Stating flexible circuit board includes the circuit board position between the optical fingerprint sensor and the stiffening plate.
9. the manufacturing method of optical finger print recognizer component as described in claim 1, which is characterized in that the optical finger print sensing
Device includes:
Photosensitive layer, the photosensitive layer are formed with induction zone；With
Optical layer on the photosensitive layer is set, and the optical layer covers the induction zone, and the area of the optical layer is greater than
The area of the induction zone, the optical layer are formed with microlens array or mesh-structured；
The optical cement is between the substrate and the photosensitive layer.
10. a kind of electronic device, which is characterized in that including the described in any item optical finger print recognizer components of claim 1-9
Optical finger print recognizer component manufactured by manufacturing method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710845669.4A CN109508598A (en) | 2017-09-15 | 2017-09-15 | The manufacturing method and electronic device of optical finger print recognizer component |
Applications Claiming Priority (1)
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