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CN1094350A - Make the atomizing resinoid bond method and system of particieboard - Google Patents

Make the atomizing resinoid bond method and system of particieboard Download PDF

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Publication number
CN1094350A
CN1094350A CN93104988A CN93104988A CN1094350A CN 1094350 A CN1094350 A CN 1094350A CN 93104988 A CN93104988 A CN 93104988A CN 93104988 A CN93104988 A CN 93104988A CN 1094350 A CN1094350 A CN 1094350A
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CN
China
Prior art keywords
resinoid bond
steam
particieboard
wood shavings
make
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN93104988A
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Chinese (zh)
Inventor
罗伯特·伯托拉
吉多·戈格利诺
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
S I A S R L
S I A 公司
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S I A S R L
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to ITMI920712A priority Critical patent/IT1254557B/en
Priority to ES92830551T priority patent/ES2077387T3/en
Priority to AT92830551T priority patent/ATE124314T1/en
Priority to EP92830551A priority patent/EP0562219B1/en
Priority to DE69203225T priority patent/DE69203225T2/en
Priority to CN93104988A priority patent/CN1094350A/en
Application filed by S I A S R L filed Critical S I A S R L
Priority to CA002094940A priority patent/CA2094940C/en
Priority to ZA934905A priority patent/ZA934905B/en
Priority to AU41905/93A priority patent/AU4190593A/en
Priority to BR9302541A priority patent/BR9302541A/en
Priority to JP5186512A priority patent/JPH0752111A/en
Publication of CN1094350A publication Critical patent/CN1094350A/en
Pending legal-status Critical Current

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B27WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
    • B27NMANUFACTURE BY DRY PROCESSES OF ARTICLES, WITH OR WITHOUT ORGANIC BINDING AGENTS, MADE FROM PARTICLES OR FIBRES CONSISTING OF WOOD OR OTHER LIGNOCELLULOSIC OR LIKE ORGANIC MATERIAL
    • B27N1/00Pretreatment of moulding material
    • B27N1/02Mixing the material with binding agent
    • B27N1/0209Methods, e.g. characterised by the composition of the agent
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B27WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
    • B27NMANUFACTURE BY DRY PROCESSES OF ARTICLES, WITH OR WITHOUT ORGANIC BINDING AGENTS, MADE FROM PARTICLES OR FIBRES CONSISTING OF WOOD OR OTHER LIGNOCELLULOSIC OR LIKE ORGANIC MATERIAL
    • B27N1/00Pretreatment of moulding material
    • B27N1/02Mixing the material with binding agent
    • B27N1/0227Mixing the material with binding agent using rotating stirrers, e.g. the agent being fed through the shaft of the stirrer
    • B27N1/0236Mixing the material with binding agent using rotating stirrers, e.g. the agent being fed through the shaft of the stirrer with the stirrers rotating about an horizontal axis, e.g. in consecutive casings
    • B27N1/0245Mixing the material with binding agent using rotating stirrers, e.g. the agent being fed through the shaft of the stirrer with the stirrers rotating about an horizontal axis, e.g. in consecutive casings with a single stirrer shaft

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  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Wood Science & Technology (AREA)
  • Forests & Forestry (AREA)
  • Dry Formation Of Fiberboard And The Like (AREA)
  • Chemical And Physical Treatments For Wood And The Like (AREA)
  • Polyesters Or Polycarbonates (AREA)
  • Reinforced Plastic Materials (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)

Abstract

The present invention relates to be used to make the atomizing resinoid bond method and system of particieboard.Described method comprises simultaneously to wood shavings, glue and chemical compound mixture heat and use overheated steam to apply the step of dynamic pulse, mixture also is subjected to perturbation action in the resinoid bond device, have even physical characteristic and atomizing particle stream thereby produce.

Description

Make the atomizing resinoid bond method and system of particieboard
The present invention relates to be used to make the atomizing resinoid bond method and system of particieboard.
The at present known method that has many resinoid bonds to make particieboard, the system that implements these methods mainly comprises the weigh-hatching plant that is used for measuring the wood shavings that obtain from desiccated wood, this hopper claims to provide in a continuous manner wood shavings stream to a belt, and belt claims to be suspended on one and adds in the feed bin.
Belt claims the data relevant with the wood shavings weight that is supplied to the resinoid bond system are input in the electronic processors continuously, this processor is controlled the revolution of a pump according to the weight ratio of dried glue of having been set by the operator and dried wood shavings, this pump with epoxy glue be input in the resinoid bond device, epoxy glue comprises water, glue and slaking paraffin emulsion.
Every traditional Flakeboard Product Line is used two systems at least, and a system is used for the tiny wood shavings of resinoid bond, and to form the outer surface of plate, another system is used for the larger-size wood shavings of resinoid bond to form the inner core of plate.
Downstream in these systems also is provided with a formation system.It preferably includes four building mortions that are in line.
First building mortion is used for the tiny wood shavings of spreading ground floor resinoid bond on the shaping belt, and the second and the 3rd building mortion forms the wood shavings of the large-size of two layers of resin gummed, and the 4th building mortion forms the tiny wood shavings of last one deck resinoid bond.
" mattress " of Xing Chenging is by being sent in the forcing press by the belt of Continuous Drive or strip in building mortion thus, this forcing press comprises two steel bands that slide on two heating plates, the temperature of heating plate changes between 180 ℃ to 240 ℃, and the speed of steel band is identical with the speed of aforementioned belt.
Under the pressure and temperature acting in conjunction, the wood shaving of resinoid bond comes under the maturation process of resin and forms particieboard.
Yet this known method is subjected to the puzzlement of following several defectives.
In the time of in the winter time, the temperature of mattress descends about 20 ℃ relative summer, correspondingly causes the increase of plate stoving time, is 18 millimeters particieboard for original thickness, and the operating time of system needs be increased to 5.9 seconds/millimeter from 48 seconds/millimeter.
Another shortcoming is that system needs regular shut-down operation, so that eliminate glue and the wood chip that remains in the resinoid bond device.
Also having a shortcoming is that the resinoid bond performance is lower, need serviceability temperature to be approximately 5 ℃ cooling water so that the water jacket of cooling resinoid bond system, because because that friction produces is overheated, some material slags are condensed or be deposited on the inwall of these water jackets, thus tamponade device.
In addition, in above-mentioned building mortion,, make building mortion tie dirt easily because bonding resin can not spread in wood shavings best.
Another shortcoming is for reducing the water absorption of finished product particieboard, needing to use expensive paraffin emulsion.
The objective of the invention is to propose a kind of system and method to overcome above-mentioned shortcoming, this system and method can reduce stoving time, thereby enhances productivity greatly, and need not interrupt operation and clean resinoid bond and building mortion.
Another main purpose of the present invention is to propose a kind of like this resinoid bond method and system, and this method and system has extraordinary operating characteristics, thereby improves the mechanical property of finished product particieboard.
The 3rd purpose of the present invention is to propose a kind of like this resinoid bond method and system, and this system and method spreads out mattress fully in building mortion, thereby reduces the thickness error of forcing press exit blanket.
The 4th purpose of the present invention is to propose a kind of like this resinoid bond method and system, wherein need not to use any paraffin emulsion.
The 5th purpose of the present invention is to propose a kind of like this resinoid bond method and system, wherein need not to use cooling device that the recirculated water in the resinoid bond device water jacket is cooled off.
According to one aspect of the present invention, above-mentioned purpose, and other other purpose that from following explanation, can recognize.Reach by a kind of so improved particieboard manufacturing system, the feature of this system is to use the high-temp liquid that preferably includes steam, described liquid is sent in the resinoid bond device so that increase wood shavings, the temperature of glue and chemical adjuvant, and these materials are mixed to be used to produce particieboard.
The present invention will be described in more detail to a most preferred embodiment of the unrestricted meaning of the present invention with reference to the accompanying drawings, and consulting following explanation can have further other features and advantages of the present invention and understand.Wherein
Fig. 1 and 1a one are used for the schematic diagram of the existed system of continuous extrusion chipboard;
Fig. 2 one is used to make the schematic diagram of the existing resinoid bond system of particieboard;
Fig. 3 one is used for making continuously the schematic diagram of other parts of the system of particieboard;
Fig. 4 one is used to implement the schematic diagram of the resinoid bond system of the inventive method;
Fig. 5 is a schematic side cutaway view that is used for the container of steam treatment wood shavings of the present invention;
Fig. 6 is the top cutaway view of container shown in Figure 5, and wherein this container links to each other with a steam condensate separator.
Referring to accompanying drawing, Fig. 2 particularly, the existing resinoid bond system that is used for making continuously particieboard comprises a dried chip metering hopper 1, and this hopper 1 claims 2 to supply dried wood shavings continuously to a belt, and belt claims 2 to be suspended on one and to add in the feed bin 3.
Belt claims 2 the data relevant with the wood shavings weight that is supplied to the resinoid bond system are input in the electronic processors continuously, this processor is input into epoxy glue in the resinoid bond device 4 according to revolution, the pump 5 of proportion control one pump 5 of dried glue of having been set by the operator and dried wood shavings, and epoxy glue mainly comprises water, glue and slaking paraffin emulsion.
Every formation one deck wood shavings on Flakeboard Product Line just use one or more above-mentioned known resinoid bond systems continuously.
Some resinoid bond device is used to glue together the outer surface of tiny wood shavings with the formation particieboard, and glues together larger-size wood shavings to form mattress or multilayer mattress with one or more such devices, and these mattresses constitute the inner core of particieboards.
Be provided with a formation system 6 in the downstream of said apparatus, it mainly comprises four building mortions that are in line 7,8,9,10.
First building mortion 7 is used for the tiny wood shavings of spreading ground floor resinoid bond on shaping belt 11, and second and three building mortions 8 and 9 form the particieboard of the large-size of two layers of resin gummed, and last building mortion 10 forms the tiny wood shavings of last one deck resinoid bond.
The mattress 12 of Xing Chenging is sent in the forcing press 13 continuously by the shaping belt 11 of Continuous Drive thus, and this forcing press comprises two steel bar or the steel bands 14 that slide on heating plate 15, and the speed of steel bar or steel band 14 is identical with the speed of shaping belt 11.
Under the acting in conjunction of pressure and temperature, the wood shavings mattress 12 of resinoid bond forms the particieboard finished product under the maturation process of resin.
Yet cross just as discussed, above-mentioned known manufacture method has several shortcomings.
In the time of in the winter time, the temperature of mattress 12 descends about 20 ℃ relative summer, correspondingly causes the increase of plate stoving time, and the operating time of system needs be increased to 5.9 seconds/millimeter from 4.8 seconds/millimeter for original thickness is 18 millimeters particieboard finished product.
Referring to Fig. 3,4,5 and 6, resin spraying glue system of the present invention and method make wood shavings, glue and chemical adjuvant intermixture be subjected to all even sufficient heating and extra dynamic pulse effect simultaneously.Said mixture also is subjected to the disturbance of agitator 16 in resinoid bond device 4.
Particularly in a preferred embodiment, heat by injection pressure steam (setting pressure is the 0.1-13 crust), the operator can preestablish Steam Heating is arrived up to 120-200 ℃, can carry out preliminary treatment to steam in addition.
Heating is preferably undertaken by the steam injector 17 that is set in the resinoid bond device, and steam injector 17 is arranged to perpendicular to the flow direction, and has the nozzle that internal diameter is the 8-10 millimeter, and the steam injector is apart from input hopper 18 about 300 millimeters.The relative direction of advance of the thing grain under agitator 16 extruding, steam injector are positioned at the upstream side near the injector that is used to inject epoxy glue.
Above-mentioned preliminary treatment is carried out in a steel cylindrical vessel or turbomixer 19, and one preferred but do not have and there is no among the circumscribed embodiment, the internal diameter of this container is 350 millimeters, and high about 600 millimeters, about 10 millimeters of wall thickness.
This vane type mixer 19 comprises the nozzle 20 and 21 tangent with vessel surface, and nozzle has deflection film 22 and 23 at internal tank.
In addition, be connected with a lime set separator 24, the water droplet that may condense in the system pipeline is condensed in this separator at container 19 upstream sides.
Nozzle 20 is sent into superheated steam in the container, and nozzle 21 is used for several chemical compounds or assistant are sent into container.
Because above-mentioned deflection film 22 and 23 effect, superheated steam and chemical assistant mix at the container middle section, and deflection film 22 and 23 has just entered in the container so that when steam handled at these assistants, and chemical assistant agent and flow of superheated steam are separated.
The chemistry assistant agent comprises surfactant 25, preferably ethene and methylene glycol.
These assistant agents are used to change the surface condition of water in press process, so that suitably regulate the thermal balance of water in different seasons.
In addition, also use catalyst, also use cleaning agent 27 simultaneously so that quicken the slaking of epoxy glue.Cleaning agent is used in particular for cleaning the device that is arranged on the downstream.
Also can use waterproofing agent 28, so that improve the fire resistance characteristic of particieboard.
Except in resinoid bond device 4, sending into the uniform aerosolized mixture of physical characteristic by injector 17, also in dried wood shavings, send into heat build-up and apply certain momentum by impact, in slip-stream, impact and occur under the acting in conjunction of the disturbance between several materials of sending in the resinoid bond device 4 the mixed gradually glue dipping of dried wood shavings.
Principal character of the present invention mainly comprises the injection superheated steam, can obtain following several advantage thus.
At first, along with steam is injected in the resinoid bond device, steam expansion diffusion, thus epoxy glue is heated and makes it have more " exhibition toughness ".
Steam also makes the pore expansion of timber in addition, thereby glue and other chemical compound are entered in these pores.
Above-mentioned measure has improved glue performance, thereby makes the finished product particieboard have extraordinary mechanical property, has improved moisture resistance and anti ageing property simultaneously greatly.
Steam helps the abundant diffusion of chemical compound in backing plate in addition, and does not influence the catalysis of bonding resin.
In the resinoid bond device, send into superheated steam and also make wooden partition more lubricated, not variable dirt, and this measure need not cooling water, because in the cold water jacket of resinoid bond device, injected 30 ℃ special-purpose cooling water.
Steam also produces continuous layer passage in wood shavings, flow to lubrication to flowing to outlet 29 wood shavings that are sent to shaping platform 6, simultaneously steam the cold water jacket 4 of resinoid bond device 4 ' inwall on condense gradually.
One of them main feature of the present invention is the time that steam has shortened baking greatly.
In fact, with regard to the product of particieboard, superheated steam rises the temperature of mattress in very favorable mode, particularly in winter, makes the mattress temperature improve about 20 ℃, and it is about 20% that operating efficiency is correspondingly increased,
Another important aspect of the present invention is the content that this method has reduced formaldehyde in the finished product particieboard greatly.
Can be clear that as mentioned above the present invention has reached purpose and the target that is proposed fully.
In the scope that does not exceed the present invention's design, also can make some changes and variation to the present invention.And some detail sections of the above-mentioned device of mentioning also can be substituted by some equivalents.
When enforcement is of the present invention, can determine the size and dimension of product according to any requirement, selected material can not use as long as there is rejection each other.

Claims (18)

1, a kind of improvement system that makes particieboard, it is characterized in that in this system, sending into the high temperature fluid that comprises steam to the resinoid bond device, so that increase the temperature of wood shavings, glueing material and other chemical assistant, these materials that heated are mixed for making particieboard mutually.
2, the system as claimed in claim 1 is characterized in that being provided with in this system the high-temperature water vapor injector, and described injector is arranged to vertical with the direction of motion of the wood shavings material that mixes in described resinoid bond device.
3, system as claimed in claim 2, it is characterized in that also being provided with in the described device epoxy glue injector, relative wood shavings and the direction of advance of epoxy glue in described device, described steam injector is arranged on the upstream side of epoxy glue injector, described mixture is with the tooth stirrer-driven and is advanced, and the tooth on this agitator is arranged by a helix.
4, the system as claimed in claim 1, wood shavings and glueing material in this device of steam flow that it is characterized in that spreading in described resinoid bond device apply dynamic pulse.
5, the system as claimed in claim 1 is characterized in that described steam mixes with chemical assistant, and this mixing is to be arranged on a blender that injects the nozzle upstream one to carry out, and mixer is connected with a lime set separator.
6, the system as claimed in claim 1, it is characterized in that being provided with on the wall of described mixer one and import described steam so that handle the steam nozzle or the pipeline of operation with tangent being used to of wall, this steam is sent to the front that is arranged on same and second pipeline that container is tangent, and second pipeline is sent into described chemical assistant so that mix in this container with steam in container.
7, system as claimed in claim 5 is characterized in that being provided with deflection film in described steam treatment container, deflection film make steam when just entering container and chemical assistant separate, thereby steam is fully mixed with chemical assistant.
8, the improvement system that is used to make particieboard as claimed in claim 1 is characterized in that this system comprises that further being used for injection pressure is 0.1 to 13 crust and the overheated injector that is heated to 120 ℃ to 200 ℃ of steam.
9, the improvement system that is used to make particieboard as claimed in claim 1, it is characterized in that system comprises a container, this container is used for splendid attire surfactant, catalyst, cleaning agent and waterproofing agent, and these materials are configured for the aerosolized mixture sent into continuously to described resinoid bond device.
10, the improvement system that is used to make particieboard as claimed in claim 9, it is characterized in that described aerosolized mixture sends into heat build-up and apply certain momentum by impact in dried wood shavings, under the acting in conjunction of disturbance in slip-stream and described resinoid bond device and impact mutually, dried wood shavings are flooded gradually by described epoxy glue gradually, and described atomizing particle stream has uniform physical characteristic.
11, the improvement system that is used to make particieboard as claimed in claim 1, it is characterized in that in this system, forming continuous layer passage, thereby the resinoid bond wood shavings that are sent to the shaping platform to flowing to outlet flow lubricate by steam condensing gradually on the cylindrical shape cold water jacket inwall of bonding device.
12, the improvement system that is used to make particieboard as claimed in claim 1 is characterized in that described system further comprises the cooling device that described resinoid bond device is carried out water-cooled.
13, be used to make the atomizing resinoid bond method of particieboard, it is characterized in that this method comprises the following steps:
Simultaneously input heat and even dynamic pulse fully in wood shavings, glue and chemical adjuvant intermixture, and make mixture stand the effect of the disturbance that produces by the agitator in the resinoid bond device,
Provide described heat and dynamic pulse by injection pressure water vapour in described resinoid bond device, described steam is by overheated heating, and pretreated at the upstream side of epoxy glue injection zone, described upstream side is that relative composite material is stirred that device drives and the direction of advancing.
14, the atomizing resinoid bond method that is used to make particieboard as claimed in claim 13, it is characterized in that described method is included in a suitable cylindrical vessel, preferably in the steel vessel described superheated steam is carried out pretreated step, surfactant, catalyst, cleaning agent and waterproofing agent are housed in this steel vessel, the aerosolized mixture that provides to described resinoid bond device is provided thus.
15, the atomizing resinoid bond method that is used to make particieboard as claimed in claim 13, it is characterized in that described superheated vapour sends in the described container by a nozzle, comprise that also one is suitable for sending into second nozzle of described surface-active, catalyst, cleaning agent and waterproofing agent in container.
16, the atomizing resinoid bond method that is used to make particieboard as claimed in claim 13, it is characterized in that also comprising the step of in dried wood shavings, sending into heat build-up and applying certain momentum by impact, under the acting in conjunction of disturbance in slip-stream and described resinoid bond device and impact mutually, dried wood shavings are flooded gradually by described epoxy glue, make described atomizing particle stream have uniform physical characteristic.
17, the atomizing resinoid bond method that is used to make particieboard as claimed in claim 13, it is characterized in that described method also comprises the step that forms continuous layer passage by steam condensing gradually on the cylindrical shape cold water jacket inwall of described resinoid bond device, thereby be sent to the resinoid bond wood shavings stream lubricate of shaping platform to flowing to outlet.
18, the atomizing resinoid bond method that is used to make particieboard as claimed in claim 13, it is characterized in that comprising and inject overheated step through pretreated water vapour by one or more injectors, described injector has nozzle, nozzle is arranged to the flow direction perpendicular to material, the relative flow direction of nozzle is positioned at the upstream side near the epoxy glue feed entrance point, and is preset in the step of operating under a certain temperature in the scope of whole technique parameter.
CN93104988A 1992-03-25 1993-04-24 Make the atomizing resinoid bond method and system of particieboard Pending CN1094350A (en)

Priority Applications (11)

Application Number Priority Date Filing Date Title
ITMI920712A IT1254557B (en) 1992-03-25 1992-03-25 PROCESS AND PLANT FOR NEBULIZED RESINING FOR THE PRODUCTION OF CHIPBOARD PANELS
AT92830551T ATE124314T1 (en) 1992-03-25 1992-10-01 ON THE AUTOMIZED RESIN METHOD AND SYSTEM FOR PRODUCING PANEL PARTS.
EP92830551A EP0562219B1 (en) 1992-03-25 1992-10-01 Atomized resin binding method and system for making wood-shaving panels
DE69203225T DE69203225T2 (en) 1992-03-25 1992-10-01 For the process with atomized resin and system for the production of wood shavings.
ES92830551T ES2077387T3 (en) 1992-03-25 1992-10-01 PROCEDURE FOR BONDING THROUGH ATOMIZED RESIN AND SYSTEM FOR THE MANUFACTURE OF WOODEN FIBER PANELS.
CN93104988A CN1094350A (en) 1992-03-25 1993-04-24 Make the atomizing resinoid bond method and system of particieboard
CA002094940A CA2094940C (en) 1992-03-25 1993-04-27 Atomized resin binding method and system for making wood-shaving panels
ZA934905A ZA934905B (en) 1992-03-25 1993-07-08 Atomized resin binding method and system for making wood-shaving panels
AU41905/93A AU4190593A (en) 1992-03-25 1993-07-13 Atomized resin binding method amd system for making wood-shaving panels
BR9302541A BR9302541A (en) 1992-03-25 1993-07-27 System for the manufacture of wood chip panels and atomized resin agglutination method
JP5186512A JPH0752111A (en) 1992-03-25 1993-07-29 Resin joining system for producing wood-shaving panel and method therefor

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
ITMI920712A IT1254557B (en) 1992-03-25 1992-03-25 PROCESS AND PLANT FOR NEBULIZED RESINING FOR THE PRODUCTION OF CHIPBOARD PANELS
CN93104988A CN1094350A (en) 1992-03-25 1993-04-24 Make the atomizing resinoid bond method and system of particieboard
CA002094940A CA2094940C (en) 1992-03-25 1993-04-27 Atomized resin binding method and system for making wood-shaving panels
ZA934905A ZA934905B (en) 1992-03-25 1993-07-08 Atomized resin binding method and system for making wood-shaving panels
AU41905/93A AU4190593A (en) 1992-03-25 1993-07-13 Atomized resin binding method amd system for making wood-shaving panels
BR9302541A BR9302541A (en) 1992-03-25 1993-07-27 System for the manufacture of wood chip panels and atomized resin agglutination method
JP5186512A JPH0752111A (en) 1992-03-25 1993-07-29 Resin joining system for producing wood-shaving panel and method therefor

Publications (1)

Publication Number Publication Date
CN1094350A true CN1094350A (en) 1994-11-02

Family

ID=27560581

Family Applications (1)

Application Number Title Priority Date Filing Date
CN93104988A Pending CN1094350A (en) 1992-03-25 1993-04-24 Make the atomizing resinoid bond method and system of particieboard

Country Status (11)

Country Link
EP (1) EP0562219B1 (en)
JP (1) JPH0752111A (en)
CN (1) CN1094350A (en)
AT (1) ATE124314T1 (en)
AU (1) AU4190593A (en)
BR (1) BR9302541A (en)
CA (1) CA2094940C (en)
DE (1) DE69203225T2 (en)
ES (1) ES2077387T3 (en)
IT (1) IT1254557B (en)
ZA (1) ZA934905B (en)

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CN102947065A (en) * 2010-04-30 2013-02-27 Imal有限责任公司 Apparatus for injecting chemical components into a flow of loose wooden material
CN103459107A (en) * 2011-04-13 2013-12-18 迪芬巴赫机械工程有限公司 Method for operating a plant and apparatus for resinating chips, fibres or fibre-like material as part of the manufacture of materials boards
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CN102947065A (en) * 2010-04-30 2013-02-27 Imal有限责任公司 Apparatus for injecting chemical components into a flow of loose wooden material
CN102947065B (en) * 2010-04-30 2016-02-24 Imal有限责任公司 For chemical composition being injected the equipment of flow of loose wooden material
CN103459107A (en) * 2011-04-13 2013-12-18 迪芬巴赫机械工程有限公司 Method for operating a plant and apparatus for resinating chips, fibres or fibre-like material as part of the manufacture of materials boards
CN103459107B (en) * 2011-04-13 2016-02-03 迪芬巴赫机械工程有限公司 The equipment of chip and/or fiber and the method for operational outfit is glued together in plate of material manufacture
CN102528885A (en) * 2011-12-16 2012-07-04 湖州南浔振建机电成套设备有限公司 A stirring device of wood chip stirring machine
CN102528885B (en) * 2011-12-16 2015-03-25 申清章 A stirring device of wood chip stirring machine
CN104162922A (en) * 2013-05-20 2014-11-26 北京泛欧瑞得科技有限公司 Shaving board high-pressure quantitative sizing system
CN107322746A (en) * 2017-08-25 2017-11-07 江苏露水河人造板有限公司 A kind of sizing equipment and method

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ATE124314T1 (en) 1995-07-15
ITMI920712A1 (en) 1993-09-25
BR9302541A (en) 1995-03-01
ES2077387T3 (en) 1995-11-16
CA2094940A1 (en) 1994-10-28
ITMI920712A0 (en) 1992-03-25
DE69203225T2 (en) 1995-11-02
AU4190593A (en) 1995-01-27
CA2094940C (en) 2003-09-09
ZA934905B (en) 1994-02-09
DE69203225D1 (en) 1995-08-03
EP0562219A1 (en) 1993-09-29
EP0562219B1 (en) 1995-06-28
IT1254557B (en) 1995-09-25
JPH0752111A (en) 1995-02-28

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