CN109192687B - Mechanical device for transmitting silicon wafers - Google Patents
Mechanical device for transmitting silicon wafers Download PDFInfo
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- CN109192687B CN109192687B CN201810932465.9A CN201810932465A CN109192687B CN 109192687 B CN109192687 B CN 109192687B CN 201810932465 A CN201810932465 A CN 201810932465A CN 109192687 B CN109192687 B CN 109192687B
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 54
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 54
- 239000010703 silicon Substances 0.000 title claims abstract description 54
- 235000012431 wafers Nutrition 0.000 title claims abstract description 52
- 230000007246 mechanism Effects 0.000 claims abstract description 80
- 238000000034 method Methods 0.000 claims abstract description 10
- 230000008569 process Effects 0.000 claims abstract description 10
- 230000005540 biological transmission Effects 0.000 claims description 11
- 230000033001 locomotion Effects 0.000 claims description 11
- 238000004519 manufacturing process Methods 0.000 claims description 5
- 230000001360 synchronised effect Effects 0.000 claims description 5
- 230000005012 migration Effects 0.000 claims description 2
- 238000013508 migration Methods 0.000 claims description 2
- 230000010354 integration Effects 0.000 abstract description 3
- 238000012546 transfer Methods 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 210000000078 claw Anatomy 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 210000004247 hand Anatomy 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 210000000707 wrist Anatomy 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67715—Changing the direction of the conveying path
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Manipulator (AREA)
Abstract
The invention relates to a mechanical device for transmitting silicon wafers, which comprises an X-axis driving mechanism, a Z-axis rotation driving mechanism, two sets of independent Y-axis driving mechanisms, a first hand fork, a second hand fork and a correcting device, wherein the X-axis driving mechanism is provided with the Z-axis driving mechanism, the Z-axis driving mechanism is provided with the Z-axis rotation driving mechanism, the Z-axis rotation driving mechanism is provided with the two sets of independent Y-axis driving mechanisms, the two sets of independent Y-axis driving mechanisms are respectively used for driving the first hand fork and the second hand fork to horizontally extend and retract, and the correcting device is arranged on a shell of the Z-axis driving mechanism. The mechanical device has high working efficiency, stable and reliable working process and high degree of freedom, and the taking and conveying mechanism and the correcting device are integrated together, so that the equipment integration level is improved, and the yield is improved.
Description
Technical Field
The invention relates to a transmission device, in particular to a mechanical device for transmitting silicon wafers.
Background
In the semiconductor industry, silicon wafers are expensive and have high requirements on mechanical particles on the surfaces of the silicon wafers in process manufacturing, so that the silicon wafers are required to be taken and delivered not only by a taking and delivering device with high stability but also with high cleanliness. In production, since the silicon wafer is required to be repeatedly transferred between the respective process equipments at a high speed, precisely, cleanly and absolutely safely, a transfer apparatus having a high transfer efficiency and a high stability is required.
The most used mechanical arm is a three-folding arm type mechanical arm, the mechanical arm adopts a main arm, an auxiliary arm and a wrist three-joint structure connecting fork claw, the structure is complex and the size is large, mechanical particles are easy to generate in the movement process to cause secondary pollution to a silicon wafer, the three-folding arm mechanical arm has the problems of terminal droop and shaking due to multiple joints, and the transmission control is relatively complex. There is also a manipulator of the single-arm and single-fork type which is newly developed at present, and although this manipulator can avoid the complexity of joints, it has the same defects as the manipulator of the triple-folding arm type: when the main arm is connected with a piece fork, only one piece fork works when the piece fork is used for taking and delivering the silicon chip, and a time interval is generated in the taking or placing process, so that the working efficiency is greatly reduced, and the invalid time in the silicon chip manufacturing process is prolonged. In order to improve the efficiency, the double-fork mechanical arm which is adopted internationally at present is a double-triple-folding-arm structure type to realize double-piece forks, and the relative complexity is increased.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provide a mechanical device for conveying silicon wafers, which has high working efficiency, stable and reliable working process and high degree of freedom, and improves the equipment integration level and the yield by integrating a taking and conveying mechanism and a correcting device.
The technical scheme of the invention is as follows: a mechanical device for conveying silicon wafers is used for stably and efficiently taking and delivering the silicon wafers during process manufacturing and comprises the following structures: the X-axis driving mechanism is provided with a Z-axis driving mechanism, and the X-axis driving mechanism can drive the Z-axis driving mechanism to do horizontal linear motion along the X axis; the Z-axis driving mechanism is provided with a Z-axis rotation driving mechanism, and can drive the Z-axis rotation driving mechanism to vertically move up and down along the Z axis; the Z-axis rotary driving mechanism is provided with two independent Y-axis driving mechanisms, and the Z-axis rotary driving mechanism can drive the Y-axis driving mechanism to rotate in a horizontal plane; the two sets of independent Y-axis driving mechanisms are respectively used for driving the first hand fork and the second hand fork to do horizontal telescopic motion; and the correcting device is arranged on the shell of the Z-axis driving mechanism and used for correcting the silicon wafer.
Furthermore, the X-axis driving mechanism comprises an X-axis driving motor and an X-axis linear guide rail, an X-axis sliding block is installed on the X-axis linear guide rail and connected with an X-axis load platform, and a Z-axis driving mechanism is installed on the X-axis load platform.
Furthermore, the Z-axis driving mechanism comprises a vertical driving motor, a vertical support, a lead screw, a vertical guide rail and a lifting support; the vertical driving motor is fixed at the bottom of the vertical support, the lifting support is driven by the lead screw to move up and down along the two vertical guide rails, and the lifting support is provided with a Z-axis rotation driving mechanism.
Furthermore, the Z-axis rotation driving mechanism comprises a rotation driving motor, a rotation transmission device and a rotating support, the rotation driving motor drives the rotating support to rotate through the rotation transmission device, and two sets of independent Y-axis driving mechanisms are mounted on the rotating support.
Furthermore, the two sets of independent Y-axis driving mechanisms respectively comprise a Y-axis horizontal driving motor, a Y-axis sliding block, a Y-axis linear guide rail and a synchronous belt; y axle horizontal drive motor passes through hold-in range drive Y axle slider along Y axle linear guide horizontal migration, and first hand fork are fixed connection respectively on two Y axle sliders.
The invention has the following advantages and prominent technical effects: 1. the invention mainly improves the compatibility of the device for the rear-end equipment with different sizes and types, improves the flexibility of the device and expands the application range and application scenes by setting five freedom degrees of motion. 2. The two hand forks perform independent telescopic motion, so that the efficiency of reciprocating taking and delivering the silicon wafers is improved, and the travel time is saved. 3. The invention integrates the taking and delivering mechanism and the correcting device, thereby improving the equipment integration level and the yield. 4. The device has a simple and compact integral mechanism, and has better stability and higher positioning precision compared with the problems of end droop and easy jitter of a three-folding-arm manipulator.
Drawings
Fig. 1 is a schematic view of the overall structure.
Fig. 2 is a schematic view of the internal structure.
Wherein the figures include the following reference numerals: 1. an X-axis drive mechanism; 2. a Z-axis drive mechanism; 3. a Z-axis rotation drive mechanism; 4. a Y-axis drive mechanism; 5. a first hand fork; 6. a second hand fork; 7. a correction device; 7-1, rotating a sucker; 8. a Y-axis slider; 9. a synchronous belt; 10. a Y-axis linear guide rail; 11. a rotation transmission device; 12. a rotary drive motor; 13. a lifting support; 14. a lead screw; 15. a vertical support; 16. a vertical drive motor; 17. a vertical guide rail; 18. an X-axis slider; 19. an X-axis linear guide rail; 20. an X-axis drive motor; 21. rotating the bracket; 22. a Y-axis horizontal drive motor; 23. a friction contact; 24. an X-axis load platform.
Detailed Description
The technical solutions of the present invention will be described clearly and completely with reference to the accompanying drawings, and it should be understood that the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
A mechanical device for transmitting silicon wafers comprises an X-axis driving mechanism 1, a Z-axis driving mechanism 2, a Z-axis rotary driving mechanism 3, two sets of independent Y-axis driving mechanisms 4, a first hand fork 5, a second hand fork 6 and a correcting device 7, wherein the Z-axis driving mechanism 2 is installed on the X-axis driving mechanism 1, the Z-axis rotary driving mechanism 3 is installed on the Z-axis driving mechanism 2, the two sets of independent Y-axis driving mechanisms 4 and the two sets of independent Y-axis driving mechanisms 4 are installed on the Z-axis rotary driving mechanism 3 and are respectively used for driving the first hand fork 5 and the second hand fork 6 to horizontally extend and retract, and the correcting device 7 is installed on a shell of the Z-axis driving mechanism 2.
The X-axis driving mechanism 1 comprises an X-axis driving motor 20 and an X-axis linear guide rail 19, an X-axis sliding block 18 is installed on the guide rail 19, the sliding block 18 is connected with an X-axis load platform 24, and a Z-axis driving mechanism is installed on the X-axis load platform 24.
The Z-axis driving mechanism comprises a vertical driving motor 16, a vertical support 15, a screw 14, two smooth cylindrical guide rails 17 and a lifting support 13; the vertical driving motor 16 is fixed at the bottom of the vertical bracket 15, the lifting bracket 13 is driven by the lead screw 14 to move up and down along the two smooth cylindrical guide rails 17, and the lifting bracket 13 is provided with a Z-axis rotation driving mechanism.
The Z-axis rotation driving mechanism comprises a rotation driving motor 12, a rotation transmission device 11 and a rotating support 21, the rotation driving motor 12 drives the rotating support 21 to rotate through the rotation transmission device 11, and a Y-axis driving mechanism is installed on the rotating support 21.
The two independent Y-axis driving mechanisms respectively comprise a Y-axis horizontal driving motor 22, a Y-axis sliding block 8, a Y-axis linear guide rail 10 and a synchronous belt 9; the horizontal driving motor 22 drives the Y-axis sliding block 8 to horizontally move along the Y-axis linear guide rail 10 through the synchronous belt 9, and the first hand fork 5 and the second hand fork 6 are fixedly connected to the two Y-axis sliding blocks respectively.
When the silicon wafer taking device is used, the X-axis driving motor 20 drives the X-axis load platform 24 to move to a position corresponding to a silicon wafer box, the vertical driving motor 16 drives the lifting support 13 to move to a position slightly lower than the height of a silicon wafer to be taken, the Y-axis horizontal driving motor 22 drives the first hand fork 5 to extend forwards to the position below the silicon wafer, the second hand fork 6 is in a completely contracted state, then the vertical driving motor 16 drives the lifting support 13 to move upwards slightly, the silicon wafer is jacked up through the friction contact 23 on the first hand fork 5, the Y-axis horizontal driving motor 22 drives the first hand fork 5 to retract backwards, so that the operation of taking out the silicon wafer is realized, then the rotary driving motor 12 drives the rotary support 21 to rotate, the silicon wafer is moved to the position above the correcting device, the Y-axis horizontal driving motor 22 drives the first hand fork 5 to move forwards and the vertical driving motor 16 drives the lifting support 13 to descend, so that the silicon wafer is placed on the rotary sucker 7-1, then the correcting device 7 starts to search the center, after the center is searched, the rotary sucker 7-1 automatically adjusts the horizontal position according to the position information of the center of the silicon wafer, the center of the silicon wafer is aligned to the center of the hand fork, and then the first hand fork 5 adjusts the extending distance according to the fed back position information of the center of the circle, so that the center of the first hand fork 5 is aligned to the center of the silicon wafer in the vertical direction; the silicon wafer is sent back to the silicon wafer box by the first hand fork 5 according to a motion flow opposite to the motion flow of taking the silicon wafer, when the silicon wafer is sent back, the first hand fork 5 supports the silicon wafer to extend out of the silicon wafer box, when the silicon wafer reaches the upper part of an accurate position, the vertical driving motor 16 drives the lifting support 13 to slightly move downwards, the friction contact 23 on the first hand fork 5 is separated from the silicon wafer, then the first hand fork 5 retracts backwards, when the first hand fork 5 retracts backwards, the second hand fork 6 extends forwards, the second hand fork 6 is just below the silicon wafer to be taken, then the second hand fork 6 finishes the same taking and sending actions as the first hand fork 5 takes the silicon wafer for the first time, and the process that the two hand forks simultaneously extend and retract to finish alternate taking of the silicon wafer is a key point for improving the efficiency. Because the correcting device 7 is fixedly connected with the whole transmission device for horizontal transfer, when a plurality of silicon wafer boxes are horizontally arranged, the transmission device does not need to convey the silicon wafers to the correcting device fixed at a certain point through redundant horizontal movement, and therefore the efficiency can be effectively improved.
In another application, the silicon wafers in one box are corrected and then placed in another empty box, and at the moment, the efficiency is improved by adopting a mode of simultaneously taking and delivering the silicon wafers by two hands.
The above embodiments are preferred embodiments of the present invention, but the present invention is not limited to the above embodiments, and any other changes, modifications, substitutions, combinations, and simplifications which do not depart from the spirit and principle of the present invention should be construed as equivalents thereof, and all such changes, modifications, substitutions, combinations, and simplifications are intended to be included in the scope of the present invention.
Claims (5)
1. A mechanical device for conveying silicon wafers is used for stably and efficiently taking and delivering the silicon wafers during process manufacturing, and is characterized by comprising the following structures:
the X-axis driving mechanism (1) is provided with a Z-axis driving mechanism (2), and the X-axis driving mechanism (1) can drive the Z-axis driving mechanism (2) to do horizontal linear motion along an X axis;
the Z-axis driving mechanism (2), the Z-axis rotating driving mechanism (3) is installed on the Z-axis driving mechanism (2), and the Z-axis driving mechanism (2) can drive the Z-axis rotating driving mechanism (3) to vertically move up and down along the Z axis;
the Z-axis rotary driving mechanism (3) is provided with two sets of independent Y-axis driving mechanisms (4), and the Z-axis rotary driving mechanism (3) can drive the Y-axis driving mechanisms (4) to rotate in the horizontal plane;
two sets of independent Y-axis driving mechanisms (4) are respectively used for driving the first hand fork (5) and the second hand fork (6) to do horizontal telescopic motion;
the correcting device (7) is arranged on the shell of the Z-axis driving mechanism (2) and is used for correcting the silicon wafer; the correcting device (7) further comprises a rotary sucker (7-1), and the rotary sucker (7-1) can perform positioning motion in the horizontal direction; in the using process, after a silicon wafer is placed on the rotary sucker (7-1), the correcting device (7) starts to search the center, after the center searching is finished, the rotary sucker (7-1) automatically adjusts the horizontal position according to the position information of the center of the silicon wafer, the center of the silicon wafer is aligned to the center of the hand fork, and then the first hand fork (5) adjusts the extending distance according to the fed back position information of the center of the circle, so that the center of the first hand fork (5) is aligned to the center of the silicon wafer in the vertical direction; so as to have better stability and higher positioning precision.
2. The silicon wafer conveying mechanical device according to claim 1, wherein the X-axis driving mechanism (1) comprises an X-axis driving motor (20) and an X-axis linear guide rail (19), an X-axis sliding block (18) is installed on the X-axis linear guide rail (19), the X-axis sliding block (18) is connected with an X-axis load platform (24), and a Z-axis driving mechanism (2) is installed on the X-axis load platform (24).
3. The silicon wafer conveying mechanical device according to claim 1, wherein the Z-axis driving mechanism (2) comprises a vertical driving motor (16), a vertical bracket (15), a lead screw (14), a vertical guide rail (17) and a lifting bracket (13); the vertical driving motor (16) is fixed at the bottom of the vertical support (15), the lifting support (13) is driven by the screw rod (14) to move up and down along the two vertical guide rails (17), and the lifting support (13) is provided with a Z-axis rotary driving mechanism (3).
4. The silicon wafer conveying mechanical device according to claim 1, wherein the Z-axis rotary driving mechanism (3) comprises a rotary driving motor (12), a rotary transmission device (11) and a rotary support (21), the rotary driving motor (12) drives the rotary support (21) to rotate through the rotary transmission device (11), and two sets of independent Y-axis driving mechanisms (4) are mounted on the rotary support (21).
5. The silicon wafer conveying mechanical device according to claim 1, wherein the two independent sets of Y-axis driving mechanisms (4) respectively comprise a Y-axis horizontal driving motor (22), a Y-axis sliding block (8), a Y-axis linear guide rail (10) and a synchronous belt (9); y axle horizontal drive motor (22) pass through hold-in range (9) drive Y axle slider (8) are followed Y axle linear guide (10) horizontal migration, first hand fork (5) with second hand fork (6) fixed connection respectively is two on Y axle slider (8).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810932465.9A CN109192687B (en) | 2018-08-16 | 2018-08-16 | Mechanical device for transmitting silicon wafers |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810932465.9A CN109192687B (en) | 2018-08-16 | 2018-08-16 | Mechanical device for transmitting silicon wafers |
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| CN109192687A CN109192687A (en) | 2019-01-11 |
| CN109192687B true CN109192687B (en) | 2022-05-27 |
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| CN201810932465.9A Active CN109192687B (en) | 2018-08-16 | 2018-08-16 | Mechanical device for transmitting silicon wafers |
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Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110127356B (en) * | 2019-05-09 | 2024-08-13 | 深圳九州光电子技术有限公司 | Chip base's loading attachment |
| CN110364466B (en) * | 2019-06-13 | 2021-09-07 | 上海提牛机电设备有限公司 | Empty wafer box sending device and wafer feeding system |
| CN111137665B (en) * | 2019-12-31 | 2024-10-18 | 浙江芯晖装备技术有限公司 | Device for unloading and conveying silicon wafers |
| CN113145368A (en) * | 2021-04-13 | 2021-07-23 | 安徽圭目机器人有限公司 | Aero-engine blade spraying production line and control method |
| CN113145369A (en) * | 2021-04-13 | 2021-07-23 | 安徽圭目机器人有限公司 | Aircraft engine blade drying production line and control method |
| CN113145370B (en) * | 2021-04-13 | 2023-12-08 | 安徽圭目机器人有限公司 | Spraying and drying production line for aero-engine blades and control method |
| CN114639625A (en) * | 2022-03-14 | 2022-06-17 | 苏州迈为科技股份有限公司 | Transmission correction mechanism and silicon wafer production line |
| CN115632023B (en) * | 2022-12-22 | 2023-08-04 | 河北博特半导体设备科技有限公司 | Double-arm wafer transmission device |
| CN118099054A (en) * | 2024-03-21 | 2024-05-28 | 合肥开悦半导体科技有限公司 | A robot arm compatible with two wafer sizes |
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|---|---|---|---|---|
| JP2004196438A (en) * | 2002-12-16 | 2004-07-15 | Mitsubishi Electric Corp | Carrier robot |
| CN1996552A (en) * | 2001-08-31 | 2007-07-11 | 阿赛斯特技术公司 | Wafer engine |
| JP2008137133A (en) * | 2006-12-05 | 2008-06-19 | Toshiba Mach Co Ltd | Multi axis transfer robot with pivot shaft |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003031638A (en) * | 2001-07-17 | 2003-01-31 | Yokogawa Electric Corp | Device carrier |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1996552A (en) * | 2001-08-31 | 2007-07-11 | 阿赛斯特技术公司 | Wafer engine |
| JP2004196438A (en) * | 2002-12-16 | 2004-07-15 | Mitsubishi Electric Corp | Carrier robot |
| JP2008137133A (en) * | 2006-12-05 | 2008-06-19 | Toshiba Mach Co Ltd | Multi axis transfer robot with pivot shaft |
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